KR20220035301A - Cooling-heating apparatus of semi-conductor liquid - Google Patents

Cooling-heating apparatus of semi-conductor liquid Download PDF

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Publication number
KR20220035301A
KR20220035301A KR1020200117276A KR20200117276A KR20220035301A KR 20220035301 A KR20220035301 A KR 20220035301A KR 1020200117276 A KR1020200117276 A KR 1020200117276A KR 20200117276 A KR20200117276 A KR 20200117276A KR 20220035301 A KR20220035301 A KR 20220035301A
Authority
KR
South Korea
Prior art keywords
processing liquid
semiconductor processing
heat exchange
temperature
maintaining device
Prior art date
Application number
KR1020200117276A
Other languages
Korean (ko)
Other versions
KR102477211B1 (en
Inventor
구본립
윤두원
Original Assignee
글로벌라이트 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 글로벌라이트 주식회사 filed Critical 글로벌라이트 주식회사
Priority to KR1020200117276A priority Critical patent/KR102477211B1/en
Publication of KR20220035301A publication Critical patent/KR20220035301A/en
Application granted granted Critical
Publication of KR102477211B1 publication Critical patent/KR102477211B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
    • F16L53/00—Heating of pipes or pipe systems; Cooling of pipes or pipe systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment

Abstract

The present invention relates to a semiconductor processing liquid temperature maintaining device, which is the semiconductor processing liquid temperature maintaining device capable of relatively increasing heat exchange efficiency while symmetrically disposing heat exchange modules in pairs to maintain a constant temperature of the semiconductor processing liquid. The disclosed semiconductor processing liquid temperature maintaining device includes: a heat exchange body unit in which the introduced semiconductor processing liquid is temperature-controlled, maintained and discharged; and a plurality of heat exchanging module units which are symmetrically disposed in pairs on both sides of the heat exchanging body so that the semiconductor processing liquid introduced into the heat exchange body is temperature-controlled and maintained.
KR1020200117276A 2020-09-13 2020-09-13 Cooling-heating apparatus of semi-conductor liquid KR102477211B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020200117276A KR102477211B1 (en) 2020-09-13 2020-09-13 Cooling-heating apparatus of semi-conductor liquid

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020200117276A KR102477211B1 (en) 2020-09-13 2020-09-13 Cooling-heating apparatus of semi-conductor liquid

Publications (2)

Publication Number Publication Date
KR20220035301A true KR20220035301A (en) 2022-03-22
KR102477211B1 KR102477211B1 (en) 2022-12-13

Family

ID=80988234

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020200117276A KR102477211B1 (en) 2020-09-13 2020-09-13 Cooling-heating apparatus of semi-conductor liquid

Country Status (1)

Country Link
KR (1) KR102477211B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024067099A1 (en) * 2022-09-30 2024-04-04 杭州海康机器人股份有限公司 Industrial camera

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1167717A (en) * 1997-08-19 1999-03-09 Komatsu Electron Kk Cooling/heating apparatus for semiconductor processing solution
JP3724763B2 (en) 1997-08-19 2005-12-07 小松エレクトロニクス株式会社 Cooling and heating equipment for semiconductor processing liquid
JP2007180091A (en) * 2005-12-27 2007-07-12 Sumitomo Light Metal Ind Ltd Liquid cooling heat sink
JP2009115345A (en) * 2007-11-02 2009-05-28 Orion Mach Co Ltd Heat exchanger for chemical solution
KR20130013195A (en) * 2011-07-27 2013-02-06 주식회사 글로벌스탠다드테크놀로지 Heat exchanger for process cooling system
KR101327874B1 (en) 2013-05-27 2013-12-19 주식회사 셀빛 Cooling-heating apparatus of semi-conductor liquid
KR20170110189A (en) * 2016-03-22 2017-10-11 주식회사 스피드터치 An indirect type high efficiency heat exchanger and manufacturing method thereof
KR20180124403A (en) * 2017-05-11 2018-11-21 전남대학교산학협력단 The battery heat sink made of different materials

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1167717A (en) * 1997-08-19 1999-03-09 Komatsu Electron Kk Cooling/heating apparatus for semiconductor processing solution
JP3724763B2 (en) 1997-08-19 2005-12-07 小松エレクトロニクス株式会社 Cooling and heating equipment for semiconductor processing liquid
JP2007180091A (en) * 2005-12-27 2007-07-12 Sumitomo Light Metal Ind Ltd Liquid cooling heat sink
JP2009115345A (en) * 2007-11-02 2009-05-28 Orion Mach Co Ltd Heat exchanger for chemical solution
KR20130013195A (en) * 2011-07-27 2013-02-06 주식회사 글로벌스탠다드테크놀로지 Heat exchanger for process cooling system
KR101327874B1 (en) 2013-05-27 2013-12-19 주식회사 셀빛 Cooling-heating apparatus of semi-conductor liquid
KR20170110189A (en) * 2016-03-22 2017-10-11 주식회사 스피드터치 An indirect type high efficiency heat exchanger and manufacturing method thereof
KR20180124403A (en) * 2017-05-11 2018-11-21 전남대학교산학협력단 The battery heat sink made of different materials

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024067099A1 (en) * 2022-09-30 2024-04-04 杭州海康机器人股份有限公司 Industrial camera

Also Published As

Publication number Publication date
KR102477211B1 (en) 2022-12-13

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