WO2024067099A1

WO2024067099A1 - Industrial camera

Info

Publication number: WO2024067099A1
Application number: PCT/CN2023/118608
Authority: WO
Inventors: 马芳宁; 唐钦远; 周斌; 高华
Original assignee: 杭州海康机器人股份有限公司
Priority date: 2022-09-30
Filing date: 2023-09-13
Publication date: 2024-04-04
Also published as: WO2024067099A9

Abstract

An industrial camera, comprising a water-cooling heat dissipation module, a camera module and a processing module. The water-cooling heat dissipation module is detachably connected to the camera module and the processing module. The camera module is located at a first side of the water-cooling heat dissipation module, the processing module is located at a second side of the water-cooling heat dissipation module, and the second side is opposite to the first side. The water-cooling heat dissipation module is used for dissipating heat of the camera module and the processing module. In the embodiments of the present application, the water-cooling heat dissipation module is detachably connected to both the camera module and the processing module. Thus, when switching different heat dissipation modes for heat dissipation according to the demands of users and the requirements of application scenarios, only the water-cooling heat dissipation module for dissipating heat of the camera module and the processing module needs to be replaced as a whole. The present application has simple and convenient operations, improves the structural flexibility of industrial cameras, and expands user groups and application scenarios of industrial cameras.

Description

An industrial camera

This application claims priority to the Chinese patent application filed with the China Patent Office on September 30, 2022, with application number 202222616857.9 and invention name “Industrial Camera”, and the Chinese patent application filed with the China Patent Office on September 30, 2022, with application number 202222615002.4 and invention name “Industrial Camera”, the entire contents of which are incorporated by reference into this application.

Technical Field

The present application relates to the field of imaging technology, and in particular to an industrial camera.

Background technique

With the continuous upgrading of industrial application scenarios, the resolution and performance of industrial cameras are constantly improving, and the power consumption of industrial cameras is also increasing, and the heat dissipation demand is also increasing. At present, most industrial cameras use air cooling technology, and fans are installed in industrial cameras to continuously blow air to dissipate heat. However, the fan will cause vibration during operation, causing the image sensor to vibrate, and the fan dissipates heat slowly and has low heat dissipation efficiency, resulting in poor image quality of industrial cameras.

Moreover, the heat dissipation structure currently used by industrial cameras is relatively simple and cannot be replaced with other heat dissipation structures according to user needs, which limits the audience and application scenarios of industrial cameras.

Summary of the invention

The purpose of the embodiment of the present application is to provide an industrial camera that can realize the replacement of heat dissipation modules with different heat dissipation methods, improve the structural flexibility of the industrial camera, and expand the audience group and application scenarios of the industrial camera. The specific technical solution is as follows:

A first aspect of an embodiment of the present application provides an industrial camera, comprising a water-cooled heat dissipation module, a camera module and a processing module; the water-cooled heat dissipation module is detachably connected to the camera module and the processing module, the camera module is located on a first side of the water-cooled heat dissipation module, the processing module is located on a second side of the water-cooled heat dissipation module, the second side is opposite to the first side, and the water-cooled heat dissipation module is used to dissipate heat for the camera module and the processing module.

In some embodiments of the present application, the water-cooling heat dissipation module includes a first shell, and openings are provided on both side walls of the first shell located on the first side and the second side; the camera module includes a second shell, the second shell is located on the first side, and the edge of the second shell is connected to the first shell through fasteners; the processing module includes a third shell, the third shell is located on the second side, and the edge of the third shell is connected to the first shell through fasteners.

In some embodiments of the present application, the water-cooled heat dissipation module also includes a water-cooled heat sink detachably disposed inside the first shell, the water-cooled heat sink is distributed in parallel between the camera module and the processing module, and the water-cooled heat sink has a heat dissipation channel for cooling liquid to pass through.

In some embodiments of the present application, the water-cooled heat sink also includes a liquid inlet and a liquid outlet, both of which are connected to the heat dissipation channel, and the liquid inlet and the liquid outlet extend from a side wall of the first shell other than the side wall where the opening is provided.

In some embodiments of the present application, the water-cooled heat dissipation module also includes a water-cooled heat sink that is detachably mounted on the outside of the casing, and the water-cooled heat sink is distributed on the second side wall of the industrial camera along a second direction, and the second direction is the direction from the first side to the second side, wherein the casing includes a first shell, a second shell and a third shell.

In some embodiments of the present application, the water-cooled heat sink includes a first substrate and a first cover plate disposed on the first substrate, a heat dissipation groove is formed on the first substrate, and the heat dissipation groove and the first cover plate form the heat dissipation channel.

In some embodiments of the present application, the heat dissipation slot includes a plurality of first slot bodies distributed in parallel along a third direction Z, the third direction Z and a plurality of second slot bodies distributed in parallel along a fourth direction W, each second slot body is connected between the head and tail of two adjacent first slot bodies, and the third direction Z intersects with the fourth direction W.

In some embodiments of the present application, the heat dissipation slots are a plurality of first slot bodies distributed in parallel along a third direction Z, or a plurality of second slot bodies distributed in parallel along a fourth direction W.

In some embodiments of the present application, a plurality of baffles are provided at the bottom of the first trough body and the second trough body, and a microchannel is formed between two adjacent baffles. Parallel distribution or serial distribution.

In some embodiments of the present application, the industrial camera further includes a fin heat dissipation assembly located outside the first shell, and the fin heat dissipation assembly is detachably disposed on a side wall of the first shell other than the side wall where the opening is disposed.

In some embodiments of the present application, the fin heat dissipation assembly includes fins and a heat conducting plate, the heat conducting plate is detachably mounted on a side wall of the first shell except for the side wall where the opening is provided, and a plurality of the fins are arranged in parallel on the heat conducting plate.

In some embodiments of the present application, four connecting blocks are arranged on the side wall inside the first shell, and the four connecting blocks are distributed in a rectangular shape. First mounting holes are arranged on both surfaces of the connecting blocks located on the first side and the second side. Four first through holes are opened at the edge of the second shell, and the four first through holes correspond to the positions of the four connecting blocks. The fastener passes through the first through holes and cooperates with the first mounting hole located on the first side. Four second through holes are opened at the edge of the third shell, and the four second through holes correspond to the positions of the four connecting blocks. The fastener passes through the second through holes and cooperates with the first mounting hole located on the second side.

In some embodiments of the present application, a notch is provided on one side wall of the first shell except for the side wall provided with the opening, and the inner edge of the notch forms a step. A second cover plate is covered at the position of the notch, and the second cover plate rests on the step. The second cover plate is connected to the side wall provided with the notch through fasteners.

In some embodiments of the present application, the industrial camera also includes a heat conductor, which is located between the water-cooled heat sink and the camera module, one end of the heat conductor is connected to the water-cooled heat sink, and the other end of the heat conductor is in contact with the camera module.

In some embodiments of the present application, the industrial camera also includes a heat conductor, a periphery of one end of the heat conductor is fixed to the side wall inside the first shell, one end of the heat conductor is in contact with the processing module, and the other end of the heat conductor is in contact with the camera module.

In some embodiments of the present application, the heat conductive member includes a base and a boss protruding from a central area of the base toward the camera module.

In some embodiments of the present application, second mounting holes are provided on the side walls of the first shell except the side wall provided with the opening and the side walls of the second shell.

In some embodiments of the present application, the processing module includes a processing module, the camera module includes a sensor module, and thermal conductive materials are filled between the processing module and the sensor module and the third shell and the second shell respectively.

In the industrial camera provided in the embodiment of the present application, the water-cooling heat dissipation module is detachably connected to the camera module and the processing module. In this way, when different heat dissipation methods are changed for heat dissipation according to the requirements of the user and the application scenario, the water-cooling heat dissipation module for heat dissipation of the camera module and the processing module can be replaced as a whole, which is simple and convenient to operate, improves the structural flexibility of the industrial camera, and expands the audience group and application scenarios of the industrial camera.

Of course, any product implementing the present application does not necessarily need to achieve all of the advantages described above at the same time.

BRIEF DESCRIPTION OF THE DRAWINGS

The drawings described herein are used to provide further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute improper limitations on the present application.

FIG1 is a first structural schematic diagram of a first industrial camera provided by some embodiments of the present application;

FIG2 is a front view of the industrial camera shown in FIG1 ;

FIG3 is a top view of the industrial camera shown in FIG1 ;

FIG4 is a cross-sectional view of the industrial camera shown in FIG1 ;

FIG5 is a schematic diagram of a first exploded structure of the industrial camera shown in FIG1 ;

FIG6 is a schematic diagram of a second exploded structure of the industrial camera shown in FIG1 ;

FIG. 7 is a schematic diagram of a third exploded structure of the industrial camera shown in FIG. 1 ;

FIG8 is a schematic diagram of a second structure of the first industrial camera provided in some embodiments of the present application (the heat sink is located inside the housing);

FIG9 is a cross-sectional view of the industrial camera shown in FIG8 ;

FIG10 is a schematic diagram of the exploded structure of the industrial camera shown in FIG8 ;

FIG11 is a simplified top view of a third structure of the first industrial camera provided by some embodiments of the present application (the heat sink is located outside the housing);

FIG12 is a left side view of FIG11;

FIG13 is a cross-sectional view of FIG11;

FIG14 is a schematic diagram of the exploded structure of a water-cooled heat sink (heat sink) in some embodiments of the present application;

FIG15 is a schematic diagram of a first structure of a heat sink of a water-cooled heat sink (heat sink plate) in some embodiments of the present application;

FIG. 16 is a schematic diagram of a second structure of a heat sink of a water-cooled heat sink (heat sink plate) in some embodiments of the present application.

FIG17 is a schematic diagram of the structure of a second industrial camera provided by some embodiments of the present application;

FIG18 is a schematic diagram of the exploded structure of a second industrial camera provided in some embodiments of the present application;

FIG19 is a simplified front view of the structure of a third industrial camera provided in some embodiments of the present application.

Description of reference numerals:
Industrial camera 100; housing 101, first side wall 101a, second side wall 101b;
Water cooling heat dissipation module 10, first side 10a, second side 10b;
First housing 110, opening 111; first frame member 112; second frame member 113;
Water-cooled heat sink 121, first base 121a, first cover plate 121b, heat dissipation groove 121c, heat dissipation channel 122, liquid inlet end 123, liquid outlet end 124, joint 1201, connecting pipe 1202, third side wall 125, liquid inlet 1251; liquid outlet 1252; first tank body 126, second tank body 127, water baffle 128, microchannel 129;
Fin heat dissipation assembly 121d, fin 1211, heat conducting plate 1212;
Heat conducting member 130, first end 130a, second end 130b, base 131, boss 132;
A connecting block 140, a first mounting hole 150, a notch 160, a step 170, and a second cover plate 180;
Camera module 20;
Second housing 210, sensor module 220, control board 221, image sensor 222, opening 223, first through hole
230;
Processing module 30;
A third housing 310 , a processing module 320 , a main control board 321 , a processing chip 322 , an interface adapter board 323 , and a second through hole 330 ;
Lens assembly 40;
The second mounting hole 50 .

Detailed ways

In order to make the purpose, technical solution, and advantages of the present application more clearly understood, the present application is further described in detail with reference to the accompanying drawings and examples. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field belong to the scope of protection of the present application.

In the related art, industrial cameras only use air cooling, which has low heat dissipation efficiency and a single structure. It cannot be replaced with other heat dissipation structures according to user needs, which limits the audience and application scenarios of industrial cameras.

The inventor of the present application has considered the advantages of water cooling, such as high heat dissipation efficiency and no vibration of the image sensor, and proposed an industrial camera in which a water cooling module can be detachably installed.

As shown in Figures 1 to 5, an embodiment of the present application provides an industrial camera 100, including a water-cooling heat dissipation module 10, a camera module 20 and a processing module 30. The water-cooling heat dissipation module 10 is detachably connected to the camera module 20 and the processing module 30. The camera module 20 is located on a first side 10a of the water-cooling heat dissipation module 10, and the processing module 30 is located on a second side 10b of the water-cooling heat dissipation module 10. The second side 10b is opposite to the first side 10a. The water-cooling heat dissipation module 10 is used to dissipate heat from the camera module 20 and the processing module 30.

In the industrial camera 100 provided in the embodiment of the present application, the water-cooling heat dissipation module 10 is detachably connected to the camera module 20 and the processing module 30. In this way, when different heat dissipation methods are changed for heat dissipation according to the requirements of the user and the application scenario, the water-cooling heat dissipation module 10 for heat dissipation of the camera module 20 and the processing module 30 can be replaced as a whole, which is simple and convenient to operate, improves the structural flexibility of the industrial camera 100, and expands the audience group and application scenarios of the industrial camera 100.

Since the water-cooling heat dissipation module 10 can be detachably installed in the industrial camera, the industrial camera can include: a camera module 20, a processing module 30, a detachable water-cooling heat dissipation module 10 and/or other heat dissipation modules according to user needs. Specifically, there can be four product forms: the first one includes a detachable water-cooling heat dissipation module 10, a camera module 20 and a processing module 30; the second one includes detachable other heat dissipation modules, a camera module 20 and a processing module 30; the third one includes a detachable water-cooling heat dissipation module 10, detachable other heat dissipation modules, a camera module 20 and a processing module 30; the fourth one is that the industrial camera does not include a heat dissipation module and dissipates heat directly through the housing 101.

Hereinafter, the first type of industrial camera, namely the industrial camera including a detachable water-cooling heat dissipation module 10 , a camera module 20 and a processing module 30 , will be described in detail.

Specifically, Figures 1 to 7 show the structure of a first specific embodiment of the first industrial camera. Figures 8 to 10 show the structure of a second specific embodiment of the first industrial camera. Figures 11 to 16 show the structure of a third specific embodiment of the first industrial camera.

Referring to FIG. 1 to FIG. 7 , in order to facilitate the detachable connection, the water-cooling heat dissipation module 10 of the first industrial camera, the camera module 20, and the processing module 30 may all include a housing. In some embodiments of the present application, as shown in FIG. 1 to FIG. 5 , the water-cooling heat dissipation module 10 includes a first housing 110, and both side walls of the first housing 110 located on the first side 10a and the second side 10b are provided with openings 111; the camera module 20 includes a second housing 210, the second housing 210 is located on the first side 10a, and the edge of the second housing 210 is connected to the first housing 110 by a fastener; the processing module 30 includes a third housing 310, the third housing 310 is located on the second side 10b, and the edge of the third housing 310 is connected to the first housing 110 by a fastener. Among them, the first housing 110 can be used to detachably install the water-cooling heat sink 121; the second housing 210 can be used to accommodate various components of the camera module 20 such as an image sensor; the third housing 310 can be used to accommodate various components of the processing module 30 such as a processing module.

This makes it easy to realize the detachable connection between the water cooling module 10 and the camera module 20 and the processing module 30 .

In other embodiments, the detachably mounted water-cooled heat sink 121 in the first housing 110 can be removed and replaced with other heat sinks, such as fans, to achieve air cooling of industrial cameras. In other embodiments, the first housing 110 and the detachably mounted water-cooled heat sink 121 can be removed as a whole and replaced with other heat dissipation modules including a housing with the same structure as the first housing 110 and heat sinks such as fans.

In some embodiments, as shown in Figures 5, 6 and 7, the first shell 110 may be a rectangular frame shell surrounded by four side walls, or a rectangular shell with six side walls. On the rectangular shell, openings 111 are provided on two oppositely distributed side walls. The second shell 210 may be the front shell of the industrial camera 100, and the edge of the second shell 210 may be connected to the first shell 110 by fasteners such as bolts. The third shell 310 may be the rear shell of the industrial camera 100, and the edge of the third shell 310 may be connected to the first shell 110 by fasteners such as bolts.

In some embodiments, as shown in FIG. 6 , four connecting blocks 140 are disposed on the side wall of the first housing 110. The four connecting blocks 140 are distributed in a rectangular shape. First mounting holes 150 are disposed on both surfaces of the connecting blocks 140 located on the first side 10a and the second side 10b. Four first through holes 230 are disposed on the edge of the second housing 210. The four first through holes 230 are connected to the four connecting blocks 140. The position of the connecting block 140 corresponds to that of the connecting block 140, and the fastener passes through the first through hole 230 to cooperate with the first mounting hole 150 located on the first side 10a. Four second through holes 330 are opened on the edge of the third shell 310, and the four second through holes 330 correspond to the positions of the four connecting blocks 140. The fastener passes through the second through holes 330 to cooperate with the first mounting hole 150 located on the second side 10b, so that the second shell 210 and the third shell 310 can be conveniently and detachably installed on the first shell 110.

In some embodiments, as shown in FIG6 , four connection blocks 140 may be integrally formed with the first housing 110. Specifically, the first housing 110 may be rectangular, and the four connection blocks 140 are formed at the four corners of the first housing 110. For example, the four corners of the first housing 110 are arc transitions, and the four corners of the first housing 110 are thickened, and the thickened portions are the connection blocks 140.

In some embodiments of the present application, as shown in FIGS. 4 to 7 , the water-cooled heat sink module 10 further includes a water-cooled heat sink 121 detachably disposed in the first housing 110, and the water-cooled heat sink 121 is parallelly distributed between the camera module 20 and the processing module 30. As shown in FIG. 4 , the water-cooled heat sink 121 has a heat dissipation channel 122 for the coolant to pass through. The water-cooled heat sink 121 is parallelly distributed between the camera module 20 and the processing module 30, and the coolant passing through the heat dissipation channel 122 can be heat-exchanged synchronously with the camera module 20 and the processing module 30, so as to achieve synchronous heat dissipation of the camera module 20 and the processing module 30, with high heat dissipation efficiency, small vibration of the camera module 20, good stability, and low noise, and the coolant passing through the heat dissipation channel 122 can take away the heat generated by the camera module 20 and the processing module 30 in time, which can further improve the heat dissipation efficiency, and thus improve the imaging quality of the industrial camera 100. In addition, the water-cooled heat sink 121 is disposed inside the first housing 110 , which does not change the overall structure and appearance of the industrial camera 100 , and is beneficial to the miniaturization design requirement of the industrial camera 100 .

In some embodiments, a boss (not shown) is provided on the side walls of the first shell 110 except the side wall provided with the opening 111, and the water-cooling heat sink 121 can be placed on the boss and fixed on the boss by fasteners.

In some embodiments, as shown in FIG6 and FIG7, the water-cooled heat sink 121 may be a plate-like structure, and the heat dissipation channel 122 may be formed inside the plate-like structure. The water-cooled heat sink 121 with a plate-like structure may be referred to as a heat sink. The water-cooled heat sink 121 adopts a plate-like structure, which can reduce the overall volume of the water-cooled heat sink 121, thereby facilitating the miniaturization design of the industrial camera 100, and can increase the area of heat exchange between the water-cooled heat sink 121 and the camera module 20 and the processing module 30, thereby improving the heat dissipation efficiency; in addition, the heat dissipation channel 122 may be a serpentine channel, or may be formed by a plurality of microchannels distributed in series, so that the heat dissipation surface of the coolant can be increased on the water-cooled heat sink 121 with a limited volume, greatly improving the heat dissipation efficiency, and facilitating the miniaturization design of the industrial camera 100.

In some embodiments, the water-cooled heat sink 121 may be a tubular structure, and the heat dissipation channel 122 is the internal channel of the tubular structure. The water-cooled heat sink 121 may also be a structural member combining a plate-like structure and a tubular structure, for example, the tubular structure is arranged on the plate-like structure, so that the structure of the water-cooled heat sink 121 is easier to process, the heat dissipation surface of the water-cooled heat sink 121 is larger, and the heat dissipation efficiency is higher. Of course, the water-cooled heat sink 121 may also adopt other structures, and this application does not limit this.

In some embodiments of the present application, as shown in FIG. 1 , FIG. 2 , and FIG. 5 to FIG. 7 , the water-cooled heat sink 121 further includes a liquid inlet 123 and a liquid outlet 124, both of which are in communication with the heat dissipation channel 122, and the liquid inlet 123 and the liquid outlet 124 extend from a side wall of the first housing 110 other than the side wall provided with the opening 111. Cooling liquid is introduced into the heat dissipation channel 122 through the liquid inlet 123, and the cooling liquid after heat exchange in the heat dissipation channel 122 can be discharged through the liquid outlet 124, so as to facilitate heat exchange between the water-cooled heat sink 121 and the camera module 20 and the processing module 30 for heat dissipation. The liquid inlet end 123 and the liquid outlet end 124 extend from a side wall of the first shell 110 except the side wall with the opening 111. On the one hand, the liquid inlet end 123 and the liquid outlet end 124 can be conveniently arranged downward, thereby facilitating the installation and fixation of the industrial camera 100; on the other hand, the liquid inlet end 123 and the liquid outlet end 124 can be conveniently connected to the external pipeline to facilitate the introduction of coolant into the heat dissipation channel 122 and the timely discharge of the coolant after heat exchange; the liquid inlet end 123 and the liquid outlet end 124 can also be connected to a circulation pipeline with a circulation pump and a cold row to facilitate the circulation of coolant into the heat dissipation channel 122 to improve the heat dissipation efficiency.

In some embodiments, as shown in FIG. 5 and FIG. 7 , the liquid inlet 123 and the liquid outlet 124 both include a joint 1201 that is connected to the heat dissipation channel 122. Specifically, the joint 1201 can be connected to the heat dissipation channel 122 through a connecting pipe 1202, one end of which is disposed on the water-cooled heat sink 121 and connected to the heat dissipation channel 122. On the other end, the connector 1201 can be threadedly matched with the other end of the connecting pipe 1202 and extend out of the first housing 110, which can facilitate the disassembly and assembly of the liquid inlet end 123 and the liquid outlet end 124 with the external pipeline, thereby facilitating the disassembly and assembly of the industrial camera 100.

In some embodiments of the present application, as shown in FIG. 6 and FIG. 7 , a notch 160 is provided on one side wall of the first housing 110 except for the side wall provided with the opening 111, and a step 170 is formed on the inner edge of the notch 160. A second cover plate 180 is covered at the position of the notch 160, and the second cover plate 180 is placed on the step 170. The second cover plate 180 is connected to the side wall provided with the notch 160 by fasteners. Specifically, the notch 160 can be provided on the side wall of the first housing 110 where the liquid inlet end 123 and the liquid outlet end 124 extend out, and two through holes for the liquid inlet end 123 and the liquid outlet end 124 to pass through are provided on the second cover plate 180, so as to facilitate the installation of the water-cooled heat sink 121 in the first housing 110.

In some embodiments of the present application, as shown in Figures 1, 2, 4 and 7, the camera module 20 also includes a sensor module 220 and a lens assembly 40, the sensor module 220 is arranged in the second shell 210, and the lens assembly 40 is arranged outside the second shell 210, and the lens assembly 40 corresponds to the sensor module 220; the processing module 30 also includes a processing module 320, the processing module 320 is arranged in the third shell 310, and the processing module 320 is electrically connected to the sensor module 220.

In some embodiments, as shown in FIG. 1 , a receiving hole is disposed on the outer side of the second housing 210 , and the lens assembly 40 is installed in the receiving hole.

In some embodiments, as shown in Figures 4 and 7, the sensor module 220 includes a control board 221 and an image sensor 222 that are electrically connected to each other. The control board 221 is installed on the side wall inside the second shell 210. The control board 221 can be arranged opposite to the lens assembly 40. The image sensor 222 is arranged on a side of the control board 221 close to the lens assembly 40. The image sensor 222 corresponds to the lens assembly 40, and the image sensor 222 can contact the water-cooled heat sink 121.

In some embodiments, as shown in Figures 4 and 7, the processing module 320 includes a main control board 321 and a processing chip 322. The main control board 321 is installed in the third shell 310 and is parallel to the control board 221. The processing chip 322 is arranged on a side of the main control board 321 close to the control board 221. The main control board 321 and the processing chip 322 can be in contact with the water-cooled heat sink 121.

In some embodiments, the image sensor 222 may be a CCD (Charge-coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor), which may be used to convert the optical signal collected by the lens assembly 40 into an analog electrical signal. The processing chip 322 may be an FPGA (Field Programmable Gate Array), which may be used to partially process the image data collected by the image sensor 222. For example, the processing chip 322 may convert the analog electrical signal obtained from the image sensor 222 into a digital signal and then cache it, and further transmit the image data to other components.

In some embodiments of the present application, as shown in Figures 4 and 7, the industrial camera 100 also includes a heat conductor 130, which is disposed in the first shell 110. The heat conductor 130 is used to conduct the heat generated by the camera module 20 and the processing module 30 to the water-cooled heat dissipation module 10, which can increase the heat conduction rate and further improve the heat dissipation efficiency.

In some embodiments of the present application, as shown in FIG. 4 and FIG. 7 , the heat conductive member 130 is located between the water-cooled heat sink 121 and the camera module 20, one end of the heat conductive member 130 is connected to the water-cooled heat sink 121, and the other end of the heat conductive member 130 is in contact with the camera module 20. The water-cooled heat sink 121 is in contact with the camera module 20 through the heat conductive member 130, which improves the heat conduction rate and thus improves the heat dissipation efficiency.

In some embodiments, the heat conductive member 130 may be in direct contact with the camera module 20 or indirect contact, preferably indirect contact. Specifically, as shown in FIG4 , an opening 223 corresponding to the image sensor 222 is provided on the control board 221 of the sensor module 220, the other end of the heat conductive member 130 is located at the opening 223, and a thermal pad is filled in the opening 223.

In some embodiments of the present application, the periphery of one end of the heat conductive member 130 is fixed to the side wall of the first housing 110, one end of the heat conductive member 130 is in contact with the processing module 30, and the other end of the heat conductive member 130 is in contact with the camera module 20. The heat generated by the processing module 30 and the camera module 20 is conducted to the first housing 110 through the heat conductive member 130, and then conducted to the fin heat dissipation assembly 121d disposed on the first housing 110, thereby improving the heat conduction rate and thus improving the heat dissipation efficiency.

In some embodiments, as shown in FIG. 4 and FIG. 7 , the heat conducting member 130 and the processing module 30 and the camera module 20 may be It can be direct contact or indirect contact, preferably indirect contact. Specifically, a thermal pad is filled between one end of the heat conductor 130 and the main control board 321 and the processing chip 322, an opening 223 corresponding to the image sensor 222 is set on the control board 221 of the sensor module 220, and the other end of the heat conductor 130 is located at the opening 223, and a thermal pad is filled in the opening 223. In this way, the heat generated on the main control board 321, the processing chip 322 and the image sensor 222 can be conducted to the first shell 110 through the thermal pad and the heat conductor 130, and then conducted to the first shell 110. In some embodiments, a fin heat dissipation assembly can also be provided on the first shell 110 to increase the heat conduction rate and thereby improve the heat dissipation efficiency.

In some embodiments, as shown in Figures 4 and 7, the heat conductor 130 may include a base 131 and a boss 132 protruding from the central area of the base 131 toward the camera module 20, the boss 132 is located at the opening 223, the base 131 serves as the first end 130a of the heat conductor 130, and the boss 132 serves as the second end 130b of the heat conductor 130, and the boss 132 can pass through the opening 223 to contact the image sensor 222.

In some embodiments, the heat conductive member 130 may be made of a metal material, such as aluminum, or copper, which is not limited in the present application.

In some embodiments of the present application, as shown in FIG. 1 to FIG. 3, second mounting holes 50 are provided on the side walls of the first housing 110 and the side walls of the second housing 210 except the side walls provided with the opening 111. The industrial camera 100 can be applied to the assembly line section to monitor the operation conditions on the assembly line. The second mounting hole 50 can cooperate with the mounting surface on the assembly line. The mounting surface can be a mounting surface set on the mounting table on the assembly line, or a structure on the assembly line that can conveniently install the industrial camera 100. When the industrial camera 100 needs to be fixed on the mounting surface on the assembly line, the second mounting hole 50 on the first housing 110 or the second housing 210 can be selected to cooperate with the mounting surface, which increases the position where the industrial camera 100 can be connected to the mounting surface, and facilitates the fixing of the industrial camera 100. In addition, the shooting direction of the industrial camera 100 on the assembly line can be conveniently adjusted to better monitor the operation conditions on the assembly line.

8 to 10 show the structure of a second specific embodiment of the first industrial camera.

As mentioned above, the water-cooled heat sink 121 may be a plate-like structure. The water-cooled heat sink with a plate-like structure may be called a heat sink. In this embodiment, the water-cooled heat sink is a heat sink with a plate-like structure, and the heat sink is detachably installed in the first shell.

As shown in Fig. 8 to Fig. 10, the first housing 110 may be a split structure, and the first housing 110 includes a detachably connected first frame member 112 and a second frame member 113. The first frame member 112 and the second frame member 113 are butted against each other in the up-down direction, and an opening is provided on the second frame member 113 for the liquid inlet 123 and the liquid outlet 124 to pass through, so that the water-cooled heat sink 121 with the liquid inlet 123 and the liquid outlet 124 can be conveniently installed in the first housing 110, thereby improving assembly efficiency.

For ease of understanding, the shell structure of the connected first shell 110, second shell 210 and third shell 310 is defined as the housing 101. As shown in FIG9, the side of the third shell 310 facing the outside and the side of the second shell 210 facing the outside in the housing 101 are both defined as the first side wall 101a; the side of the housing 101 where the liquid inlet 123 and the liquid outlet 124 are installed and the other side opposite thereto are both defined as the second side wall 101b. The direction parallel to the second side wall 101b is the first direction X, and the direction parallel to the first side wall 101a is the second direction Y, and the first direction X and the second direction Y are perpendicular.

As shown in FIGS. 8 to 10 , in the industrial camera of this embodiment, the water-cooled heat sink 121 is installed in the first housing 110 . The processing module 320 is installed in 310 , and the sensor module 220 is installed in 210 . A heat dissipation channel 122 for the coolant to pass through is formed in the water-cooled heat sink 121 . The position of the water-cooled heat sink 121 corresponds to the processing module 320 and the sensor module 220 , so that the processing module 320 and the sensor module 220 can exchange heat with the coolant passing through the heat dissipation channel 122 .

As shown in Figures 8 to 10, the processing module 320 of the industrial camera includes an interface adapter board 323, a main control board 321 and a processing chip 322 that are electrically connected to each other. The processing chip 322 is arranged on a side of the main control board 321 close to the control board 221. The main control board 321 and the processing chip 322 can be in contact with the water-cooled heat sink 121.

The interface adapter board 323 is installed in the first side wall 101a formed by the third shell 310 in the housing 101. The interface adapter board 323 is provided with a power circuit, and the power circuit has heating devices such as a voltage converter. The main control board 321 is installed on the interface adapter board 323, and the main control board 321 is provided with a plurality of power devices. The sensor module 220 includes a control board 221 and an image sensor 222 that are electrically connected to each other. The control board 221 can be installed in another side wall 101a formed by the second shell 210 in the housing 101. On the first side wall 101 a , the image sensor 222 may be mounted on a side of the control board 221 away from the interface adapter board 323 .

In this embodiment, the image sensor 222 can be a general photosensor or a photosensor with high precision and high resolution.

When the industrial camera 100 is working, the processing module 320 and the sensor module 220 generate heat, and coolant continuously flows through the heat dissipation channel 122. Since the water-cooled heat sink 121 corresponds to the position of the processing module 320 and the sensor module 220, the coolant passing through the heat dissipation channel 122 can perform heat exchange with the processing module 320 and the sensor module 220, thereby achieving heat dissipation of the heat generating components in the processing module 320 and the sensor module 220. For example, the voltage converter on the interface adapter board 323, the power device on the main control board 321, and the image sensor 222 are cooled.

In addition, the processing module 320 and the sensor module 220 are respectively arranged on two opposite first side walls 101a, and the heat generated by the processing module 320 and the sensor module 220 corresponds to the water-cooled heat sink 121 of the processing module 320 and the sensor module 220, which can solve the problems of vibration and low heat dissipation efficiency of the image sensor 222 caused by air cooling technology and improve imaging quality.

In some high-demand application scenarios, for example, when the image sensor 222 adopts a high-precision and high-resolution photosensitive sensor, the image quality is closely related to the temperature. The higher the temperature, the more image noise there is and the worse the image quality. By applying this embodiment, the coolant in the water-cooled heat sink 121 can take away the heat generated by the processing module 320 and the sensor module 220 in time, and the housing 101 can dissipate the heat generated by the processing module 320 and the sensor module 220. The heat dissipation efficiency is high, and at the same time, the problem of poor imaging quality caused by high temperature is solved, and the imaging quality is further improved. It can be seen that the application scenarios of this application are very wide.

In this embodiment, as shown in Figures 8 to 10, the water-cooled heat sink 121 is located in the housing 101, and the water-cooled heat sink 121 is distributed in parallel between the processing module 320 and the sensor module 220. The edge of the water-cooled heat sink 121 is fixed on the second side wall 101b of the housing 101 distributed along the second direction Y, and the water-cooled heat sink 121 is in contact with the processing module 320 and the sensor module 220.

Specifically, the interface adapter board 323 is mounted on the first side wall 101a in the housing 101, the main control board 321 is mounted on the interface adapter board 323, and the control board 221 is mounted on the other first side wall 101a in the housing 101. The image sensor 222 is mounted on the side of the control board 221 away from the interface adapter board 323, and the water-cooled heat sink 121 is distributed in parallel between the main control board 321 and the control board 221. The main control board 321 can contact the water-cooled heat sink 121, and the image sensor 222 can contact the water-cooled heat sink 121. In this way, the main path for heat exchange between the processing module 320 and the water-cooled heat sink 121 includes: interface adapter board 323 → first side wall 101a where the interface adapter board 323 is located → second side wall 101b → water-cooled heat sink 121 → coolant is taken away, main control board 321 → water-cooled heat sink 121 → coolant is taken away.

The main ways of heat exchange between the sensor module 220 and the water-cooled heat sink 121 include: image sensor 222 → water-cooled heat sink 121 → coolant takes away. Compared with air-cooled heat dissipation technology, the coolant passing through the heat dissipation channel 122 of the water-cooled heat sink 121 is used to heat the processing module 320 and the sensor module 220 through heat exchange, which can solve the vibration problem of the image sensor 222 caused by air-cooled heat dissipation technology. In addition, the coolant can take away the heat of the processing module 320 and the sensor module 220 in time, and the heat dissipation efficiency is high, thereby improving the imaging quality of the industrial camera 100. In addition, the water-cooled heat sink 121 is set in the housing 101, and the overall structure and appearance of the housing 101 can be maintained without changing, meeting the requirements of the miniaturized design of the industrial camera 100.

In some embodiments, the processing module 320 and the sensor module 220 are filled with heat-conducting materials between the third housing 310 and the second housing 210, respectively. Specifically, the heat-conducting material can be filled in the gap between the interface adapter board 323 of the processing module 320 and the housing 101, and the heat-conducting material can be filled in the gap between the control board 221 of the sensor module 220 and the housing 101. The heat on the processing module 320 and the sensor module 220 can be effectively conducted to the outside of the housing 101, and then taken away by the water-cooled heat sink 121, or directly dissipated to the outside through the housing 10, thereby increasing the heat conduction path, improving the heat transfer efficiency, and thus improving the heat dissipation efficiency.

In some embodiments, a heat conductive material may be filled between the base 131 and the main control board 321 of the processing module 320. The heat-conducting material is filled between the stage 132 and the image sensor 222 of the sensor module 220, and the opening 223 may be provided on the control board 221, and the heat-conducting material is filled in the opening 223. In this way, the heat generated on the main control board 321 can be quickly transferred to the heat-conducting member 130 through the heat-conducting material, and then transferred to the water-cooling heat sink 121 through the heat-conducting member 130 and the second side wall 101b. The heat generated on the image sensor 222 can be quickly transferred to the heat-conducting member 130 through the heat-conducting material, and then transferred to the water-cooling heat sink 121 through the heat-conducting member 130 and the second side wall 101b, thereby improving the heat transfer efficiency and thus improving the heat dissipation efficiency. In addition, the heat-conducting material can avoid hard contact between the heat-conducting member 130 and the image sensor 222, thereby protecting the image sensor 222.

In some embodiments, the thermally conductive material may be a thermally conductive interface material, such as thermally conductive silica gel or thermally conductive gel, etc., which is not limited in the present application.

Similar to the above-mentioned embodiment, as shown in FIGS. 8 to 10 , the industrial camera 100 in this embodiment further includes a heat conductive member 130. The heat conductive member 130 is located between the water-cooled heat sink 121 and the sensor module 220, the first end 130a of the heat conductive member 130 is connected to the water-cooled heat sink 121, and the second end 130b of the heat conductive member 130 is in contact with the image sensor 222 on the sensor module 220.

In this way, the main pathways for heat exchange between the sensor module 220 and the water-cooled heat sink 121 include: image sensor 222 → heat conductor 130 → water-cooled heat sink 121 → coolant carries away, which can increase the rate at which heat from the image sensor 222 is transferred to the water-cooled heat sink 121, improve the heat dissipation efficiency of the image sensor 222, reduce noise, and enhance imaging quality.

Specifically, the structure of the heat conducting member 130 can be referred to above and will not be repeated here.

11 to 13 show the structure of a third specific embodiment of the first industrial camera.

Different from the embodiments shown in FIGS. 8 to 10 , the water-cooling heat sink 121 is not limited to being disposed inside the first housing 110 . In the industrial cameras shown in FIGS. 11 to 13 , the water-cooling heat sink 121 may be disposed outside the housing 101 .

When the water cooling heat sink 121 is located outside the housing 101, the water cooling heat sink 121 is attached to and fixed on the side wall of the first frame 112. In the embodiment of the present application, the housing 101 adopts a split structure, which can facilitate the assembly of the industrial camera 100.

Specifically, in some embodiments of the present application, as shown in Figures 11 to 13, the water-cooled heat dissipation module 10 also includes a water-cooled heat sink 121 that is detachably mounted on the outside of the casing 101, and the water-cooled heat sink 121 is distributed on the second side wall 101b of the casing 101 along the second direction Y, and the second direction Y is the direction from the first side 10a to the second side 10b. Specifically, the interface adapter board 323 is installed on the first side wall 101a in the casing 101, the main control board 321 is installed on the interface adapter board 323, the control board 221 is installed on the other first side wall 101a in the casing 101, the image sensor 222 is installed on the side of the control board 221 away from the interface adapter board 323, the interface adapter board 323 has multiple interfaces, and multiple openings are opened on the side wall of the casing 101 on which the interface adapter board 323 is installed, and the interfaces extend out of the casing 101 through the openings. The sensor module 220 is generally coordinated with the lens assembly, and the lens assembly is generally installed on the outside of the first side wall 101a where the sensor module 220 is located. The water-cooled heat sink 121 is fixed to the second side wall 101b of the casing 101 distributed along the second direction Y, and the second direction Y can be perpendicular to the first direction X.

The main paths for heat exchange between the processing module 320 and the water-cooled heat sink 121 include: interface adapter board 323 → first side wall 101a where the interface adapter board 323 is located → second side wall 101b → water-cooled heat sink 121 → coolant is taken away, main control board 321 → second side wall 101b → water-cooled heat sink 121 → coolant is taken away; the main paths for heat exchange between the sensor module 220 and the water-cooled heat sink 121 include: image sensor 222 → first side wall 101a where the control board 221 is located → second side wall 101b → water-cooled heat sink 121 → coolant is taken away, image sensor 222 → control board 221 → second side wall 101b → water-cooled heat sink 121 - coolant is taken away, and the heat exchange paths between the water-cooled heat sink 121 and the processing module 320 and the sensor module 220 are increased as much as possible to solve the vibration problem of the image sensor 222 caused by the air-cooled heat dissipation technology, improve the heat dissipation efficiency, and thus improve the imaging quality of the industrial camera 100. In addition, the water-cooling heat sink 121 is disposed outside the housing 101 , and there is no need to modify the internal structure of the camera, which is convenient for installation.

In some embodiments of the present application, as shown in FIG. 13 , when the water-cooled heat sink 121 is located outside the housing 101 and fixed to the second side wall 101b of the housing 101, the industrial camera 100 may further include a heat conductor 130. The heat conductor 130 is located between the processing module 320 and the sensor module 220, and the outer periphery of the first end 130a of the heat conductor 130 is fixed to the housing. On the second side wall 101b of the device 101, the first end 130a of the heat conductive member 130 can contact the processing module 320, and the second end 130b of the heat conductive member 130 can contact the image sensor 222 on the sensor module 220. Specifically, the structure of the heat conductive member 130 can refer to the above, which will not be repeated here.

In this way, the main paths for heat exchange between the processing module 320 and the water-cooled heat sink 121 include: interface adapter board 323 → first side wall 101a where the interface adapter board 323 is located → second side wall 101b → water-cooled heat sink 121 → coolant is taken away, main control board 321 → heat conductor 130 → second side wall 101b → water-cooled heat sink 121 → coolant is taken away, main control board 321 → second side wall 101b → water-cooled heat sink 121 → coolant is taken away, and the main paths for heat exchange between the sensor module 220 and the water-cooled heat sink 121 are as follows: The method comprises: image sensor 222 → heat conductor 130 → second side wall 101b → water-cooled heat sink 121 - the cooling liquid is carried away; image sensor 222 → first side wall 101a where control board 221 is located → second side wall 101b → water-cooled heat sink 121 → the cooling liquid is carried away; image sensor 222 → control board 221 → second side wall 101b → water-cooled heat sink 121 - the cooling liquid is carried away, thereby increasing the heat exchange path between the water-cooled heat sink 121 and the processing module 320 and the sensor module 220, improving the heat dissipation efficiency and enhancing the imaging quality.

Similar to the aforementioned embodiment, in this embodiment, heat-conducting materials can be filled between the processing module 320 and the sensor module 220 and the third shell 310 and the second shell 210, respectively. Please refer to the aforementioned for details, which will not be repeated here. In this way, the heat generated on the main control board 321 can be quickly conducted to the heat-conducting member 130 through the heat-conducting material, and then transferred to the water-cooled heat sink 121 through the heat-conducting member 130 and the second side wall 101b. The heat generated on the image sensor 222 can be quickly conducted to the heat-conducting member 130 through the heat-conducting material, and then transferred to the water-cooled heat sink 121 through the heat-conducting member 130 and the second side wall 101b, thereby improving the heat transfer efficiency and thus improving the heat dissipation efficiency. In addition, the heat-conducting material can avoid hard contact between the heat-conducting member 130 and the image sensor 222, thereby protecting the image sensor 222.

In some embodiments, the heat conducting member 130 may be made of metal, such as aluminum, or copper. When the heat conducting member 130 is connected to the water cooling member 121, the heat conducting member 130 and the water cooling member 121 may be separately or integrally arranged, and this application does not limit this.

14 to 16 show the structure of a water-cooled heat sink, also called a heat sink, in an embodiment of the present application.

In some embodiments of the present application, as shown in FIGS. 14 to 16 , the water-cooled heat sink 121 includes a first base 121a and a first cover plate 121b disposed on the first base 121a, a heat dissipation groove 121c is formed on the first base 121a, and the heat dissipation groove 121c and the first cover plate 121b form a heat dissipation channel 122. The first cover plate 121b and the first base 121a can be sealed and joined by welding, the coolant can be water, and the first cover plate 121b and the first base 121a are sealed and joined to prevent water leakage from affecting the use of the industrial camera 100.

In some embodiments of the present application, as shown in FIG. 14 , the heat dissipation slot 121c may be a serpentine slot structure. Specifically, the heat dissipation slot 121c includes a plurality of first slot bodies 126 distributed in parallel along the third direction Z, and a plurality of second slot bodies 127 distributed in parallel along the fourth direction W. Each second slot body 127 is connected between the head and tail of two adjacent first slot bodies 126, and the third direction Z intersects with the fourth direction W. The water-cooled heat sink 121 may adopt a rectangular structure, the third direction Z may be the length direction of the water-cooled heat sink 121, and the fourth direction W may be the width direction of the water-cooled heat sink 121. The heat dissipation slot 121c is a serpentine slot structure, which can increase the length and tortuosity of the heat dissipation channel 122, increase the heat dissipation surface, and improve the heat dissipation efficiency.

In some embodiments of the present application, as shown in FIG. 15 and FIG. 16 , the heat dissipation slots 121c may be a plurality of first slot bodies 126 distributed in parallel along the third direction Z and extending along the fourth direction W, or a plurality of second slot bodies 127 distributed in parallel along the fourth direction W and extending along the third direction Z. Specifically, the first slot bodies 126 and the second slot bodies 127 may be linear slot bodies or arc-shaped slot bodies. The third direction Z and the fourth direction W may be understood as the long side direction and the short side direction of the water-cooled heat sink 121.

In some embodiments of the present application, microchannels 129 are formed in the first trough body 126 and the second trough body 127. Specifically, a plurality of baffles 128 are disposed at the bottom of each of the first trough body 126 and the second trough body 127. A microchannel 129 is formed between the first and second grooves 126 and 127, and the microchannels 129 in each first groove 126 or second groove 127 are arranged in parallel or in series. In this way, the heat dissipation surface of the coolant can be increased on the water-cooled heat sink 121 with a limited volume, the heat dissipation efficiency is greatly improved, and the miniaturization design of the industrial camera 100 is facilitated.

In some embodiments of the present application, as shown in FIG8 and FIG11, a liquid inlet 123 and a liquid outlet 124 are provided on the water-cooled heat sink 121, one end of the liquid inlet 123 and the liquid outlet 124 are both connected to the heat dissipation channel 122, and the other ends of the liquid inlet 123 and the liquid outlet 124 are both located outside the housing 101. Specifically, when the water-cooled heat sink 121 is located inside the housing 101, the other ends of the liquid inlet 123 and the liquid outlet 124 can extend outside the housing 101, so that the liquid inlet 123 and the liquid outlet 124 can be conveniently connected to the external pipelines, and the cooling liquid can be conveniently introduced into the heat dissipation channel 122 through the external pipeline, and the cooling liquid after heat exchange can be discharged in time, thereby improving the heat dissipation efficiency.

In some embodiments, the liquid inlet 123 and the liquid outlet 124 can be connected to an external pipeline with a circulation pump and a radiator. The circulation pump drives the coolant to circulate in the heat dissipation channel 122 and the external pipeline. The coolant enters the external pipeline after heat exchange in the heat dissipation channel 122, and then enters the heat dissipation channel 122 after being cooled by the radiator in the external pipeline. In this way, the coolant can be circulated into the heat dissipation channel 122 to improve the heat dissipation efficiency.

In some embodiments of the present application, as shown in Figure 14, a liquid inlet 1251 and a liquid outlet 1252 connected to the heat dissipation channel 122 are opened on the third side wall 125 of the water-cooled heat sink 121, and the liquid inlet 1251 is correspondingly connected to the liquid inlet end 123, and the liquid outlet 1252 is correspondingly connected to the liquid outlet end 124.

In some embodiments of the present application, as shown in Figure 14, the liquid inlet end 123 and the liquid outlet end 124 both include a connecting pipe 1202 arranged on the water-cooled heat sink 121 and connected to the heat dissipation channel 122, and a joint 1201 connected to the connecting pipe 1202. The connecting pipe 1202 can be welded to a position of the third side wall 125 corresponding to the liquid inlet end 123 or the liquid outlet end 124. The joint 1201 can be threadedly fitted or snap-fitted to the connecting pipe 1202. The joint 1201 can be located on the outside of the housing 101. The joint can be a water pipe joint or an air pump joint, and the present application does not impose any restrictions.

Then, the second type of industrial camera, that is, the industrial camera including other detachable heat dissipation modules, the camera module 20 and the processing module 30 is described in detail.

Specifically, FIG. 17 and FIG. 18 show the structure of a second industrial camera, which is specifically an embodiment in which a fin heat sink assembly 121d replaces a water-cooled heat sink 121.

In some embodiments of the present application, as shown in FIG. 17 and FIG. 18 , the industrial camera 100 further includes a fin heat dissipation assembly 121d located outside the first housing 110, and the fin heat dissipation assembly 121d is detachably disposed on a side wall of the first housing 110 other than the side wall provided with the opening 111. In this way, the fin heat dissipation assembly 121d and the water-cooled heat sink 121 can be easily replaced, or the fin heat dissipation assembly 121d and the water-cooled heat sink 121 can be used together, which is simple and convenient to operate, improves the structural flexibility of the industrial camera 100, and expands the audience group and application scenarios of the industrial camera 100. The heat generated by the camera module 20 and the processing module 30 can be conducted to the first housing 110. By arranging the fin heat dissipation assembly 121d on the outer wall of the first housing 110, the heat dissipation surface of the first housing 110 can be increased, the heat dissipation efficiency can be improved, and the imaging quality of the industrial camera 100 can be improved.

In some embodiments of the present application, as shown in FIG. 17 and FIG. 18 , the fin heat dissipation assembly 121d further includes a fin 1211 and a heat conducting plate 1212. The heat conducting plate 1212 is detachably mounted on a side wall of the first housing 110 other than the side wall provided with the opening 111. A plurality of fins 1211 are arranged in parallel on the heat conducting plate 1212. The fins 1211 may be rectangular plates. In this way, the heat generated by the camera module 20 and the processing module 30 may be conducted to the first housing 110. By providing the fins 1211 on the outer wall of the first housing 110, the heat dissipation surface of the first housing 110 may be increased, the heat dissipation efficiency may be improved, and the imaging quality of the industrial camera 100 may be improved.

Specifically, the heat conducting plate 1212 can be fixed to the outer wall of the first housing 110 by bolts, thereby facilitating the disassembly and assembly of the fin heat dissipation assembly 121d, making the structure of the industrial camera 100 more flexible.

Finally, the third type of industrial camera, namely an industrial camera including a detachable water-cooling heat dissipation module 10, a detachable other heat dissipation module, a camera module 20 and a processing module 30, is described.

In a specific embodiment, the other heat dissipation module may be a fin heat dissipation assembly 121d. For example, a fin heat dissipation assembly 121d may be provided on both sides of the industrial camera shown in FIG1 . Referring to FIG19 , FIG19 is a simplified schematic diagram of the structure of a third industrial camera provided in some embodiments of the present application. As shown in FIG19 , the industrial camera includes: a detachable water-cooled heat dissipation module 10, a camera module 20, a processing module (blocked by the camera module 20 in the figure), and a fin heat dissipation assembly 121d. Among them, the detachable water-cooled heat dissipation module 10 is provided between the camera module 20 and the processing module, and the specific connection method may be the same as that in FIG1 . The two fin heat dissipation assemblies 121d may be respectively installed on the side through the second mounting holes 50 on the sides of the second shell 210 and the first shell 110 .

The industrial camera shown in FIG. 19 can dissipate heat through the water-cooling heat dissipation module 10 and can also dissipate heat through the fin heat dissipation component 121d, thereby further improving the heat dissipation performance.

The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

An industrial camera (100), characterized by comprising:

Camera module (20);

Processing module (30);

A water cooling module (10) detachably connected to the camera module (20) and the processing module (30);

The camera module (20) is located on a first side (10a) of the water-cooling heat dissipation module (10), and the processing module (30) is located on a second side (10b) of the water-cooling heat dissipation module (10), wherein the second side (10b) is opposite to the first side (10a), and the water-cooling heat dissipation module (10) is used to dissipate heat for the camera module (20) and the processing module (30).
The industrial camera (100) according to claim 1, characterized in that

The water-cooling heat dissipation module (10) comprises a first shell (110), and openings (111) are provided on both side walls of the first shell (110) located on the first side (10a) and the second side (10b);

The camera module (20) comprises a second shell (210), the second shell (210) is located on the first side (10a), and an edge of the second shell (210) is connected to the first shell (110) via a fastener;

The processing module (30) comprises a third shell (310), wherein the third shell (310) is located on the second side (10b), and an edge of the third shell (310) is connected to the first shell (110) via a fastener.
The industrial camera (100) according to claim 2, characterized in that

The water-cooled heat dissipation module (10) further comprises a water-cooled heat dissipation element (121) detachably mounted inside the first shell (110), the water-cooled heat dissipation element (121) being distributed in parallel between the camera module (20) and the processing module (30), and the water-cooled heat dissipation element (121) having a heat dissipation channel (122) for cooling liquid to pass through.
The industrial camera (100) according to claim 3, characterized in that

The water-cooled heat sink (121) further comprises a liquid inlet end (123) and a liquid outlet end (124), wherein the liquid inlet end (123) and the liquid outlet end (124) are both connected to the heat dissipation channel (122), and the liquid inlet end (123) and the liquid outlet end (124) extend from a side wall of the first shell (110) other than the side wall where the opening (111) is provided.
The industrial camera (100) according to claim 2, characterized in that

The water-cooling heat dissipation module (10) further comprises a water-cooling heat dissipation element (121) detachably mounted on the outside of the housing (101), wherein the water-cooling heat dissipation element (121) is disposed on a second side wall (101b) of the industrial camera (100) along a second direction (Y), wherein the second direction (Y) is a direction from the first side (10a) to the second side (10b), wherein the housing (101) comprises a first shell (110), a second shell (210) and a third shell (310).
The industrial camera (100) according to claim 3 or 5, characterized in that:

The water-cooling heat sink (121) comprises a first base (121a) and a first cover plate (121b) arranged on the first base (121a); a heat dissipation groove (121c) is formed on the first base (121a); the heat dissipation groove (121c) and the first cover plate (121b) form the heat dissipation channel (122).
The industrial camera (100) according to claim 6, characterized in that

The heat dissipation slot (121c) comprises a plurality of first slot bodies (126) distributed in parallel along a third direction (Z), the third direction (Z) and the plurality of second slot bodies (127) distributed in parallel along a fourth direction (W), each second slot body (127) being connected between the head and tail of two adjacent first slot bodies (126), and the third direction (Z) intersects with the fourth direction (W).
The industrial camera (100) according to claim 6, characterized in that

The heat dissipation grooves (121c) are a plurality of first groove bodies (126) distributed in parallel along a third direction (Z), or a plurality of second groove bodies (127) distributed in parallel along a fourth direction (W).
The industrial camera (100) according to claim 7 or 8, characterized in that:

A plurality of water blocking plates (128) are disposed at the bottom of the first tank body (126) and the second tank body (127). A microchannel (129) is formed between two adjacent baffles (128), and the multiple microchannels (129) in each of the first trough body (126) or the second trough body (127) are distributed in parallel or in series.
The industrial camera (100) according to claim 2, characterized in that

The industrial camera (100) further comprises a fin heat dissipation assembly (121a) located outside the first housing (110), wherein the fin heat dissipation assembly (121a) is detachably connected to a side wall of the first housing (110) other than the side wall on which the opening (111) is provided.
The industrial camera (100) according to claim 10, characterized in that

The fin heat dissipation assembly (121a) comprises a fin (1211) and a heat conducting plate (1212); the heat conducting plate (1212) is detachably mounted on a side wall of the first shell (110) other than a side wall provided with the opening (111); a plurality of the fins (1211) are arranged in parallel on the heat conducting plate (1212).
The industrial camera (100) according to any one of claims 2 to 4 and 10 to 11, characterized in that:

Four connecting blocks (140) are arranged on the side wall inside the first shell (110), and the four connecting blocks (140) are distributed in a rectangular shape. First mounting holes (150) are arranged on both surfaces of the connecting blocks (140) located on the first side (10a) and the second side (10b). Four first through holes (230) are provided on the edge of the second shell (210), and the four first through holes (230) correspond to the positions of the four connecting blocks (140). The fastener passes through the first through holes (230) and cooperates with the first mounting holes (150) located on the first side (10a). Four second through holes (330) are provided on the edge of the third shell (310), and the four second through holes (330) correspond to the positions of the four connecting blocks (140). The fastener passes through the second through holes (330) and cooperates with the first mounting holes (150) located on the second side (10b).
The industrial camera (100) according to any one of claims 2 to 4, characterized in that:

A notch (160) is provided on one side wall of the first shell (110) other than the side wall provided with the opening (111); an inner edge of the notch (160) forms a step (170); a second cover plate (180) is covered at the position of the notch (160); the second cover plate (180) rests on the step (170); and the second cover plate (180) is connected to the side wall provided with the notch (160) via a fastener.
The industrial camera (100) according to claim 3, characterized in that

The industrial camera (100) further comprises a heat conductor (130), wherein the heat conductor (130) is located between the water-cooled heat sink (121) and the camera module (20), one end of the heat conductor (130) is connected to the water-cooled heat sink (121), and the other end of the heat conductor (130) is in contact with the camera module (20).
The industrial camera (100) according to claim 10, characterized in that

The industrial camera (100) further comprises a heat conductor (130), wherein the periphery of one end of the heat conductor (130) is fixed to the side wall inside the first shell (110), one end of the heat conductor (130) is in contact with the processing module (30), and the other end of the heat conductor (130) is in contact with the camera module (20).
The industrial camera (100) according to claim 14 or 15, characterized in that

The heat conducting member (130) comprises a base (131) and a boss (132) protruding from a central area of the base (131) toward the camera module (20).
The industrial camera (100) according to any one of claims 2 to 4 and 10 to 11, characterized in that:

Second mounting holes (50) are provided on the side walls of the first shell (110) other than the side wall provided with the opening (111) and the side walls of the second shell (210).
The industrial camera (100) according to claim 2, characterized in that

The processing module (30) includes a processing module (320), and the camera module (20) includes a sensor module (220). Heat-conducting materials are filled between the processing module (320) and the sensor module (220) and the third shell (310) and the second shell (210), respectively.