CN213403205U - Industrial grade far infrared thermal imaging camera - Google Patents
Industrial grade far infrared thermal imaging camera Download PDFInfo
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- CN213403205U CN213403205U CN202022828614.2U CN202022828614U CN213403205U CN 213403205 U CN213403205 U CN 213403205U CN 202022828614 U CN202022828614 U CN 202022828614U CN 213403205 U CN213403205 U CN 213403205U
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Abstract
The utility model discloses an industrial grade far infrared thermal imaging camera, which comprises a main shell, wherein the main shell comprises a front cover, a middle frame and a rear cover which are connected with each other; the front cover is provided with a lens hole, the inner side of the front cover is provided with a cover plate, one side of the cover plate close to the front cover is provided with an infrared shutter assembly, one side of the cover plate close to the heat dissipation plate is provided with a first image acquisition plate, and the first image acquisition plate is attached to the heat dissipation plate; a second image acquisition board, a main board, a power board and an IO interface board are sequentially arranged between the heat dissipation plate and the rear cover; the first image acquisition board is connected with the second image acquisition board through a flat cable, and the heat dissipation board is provided with a wire passing hole for the flat cable to pass through; the mainboard is provided with a heat conducting fin which is attached to the middle frame. The utility model discloses technical scheme improves far-infrared thermal imaging camera's structure, improves its radiating efficiency and temperature measurement precision.
Description
Technical Field
The utility model relates to an industry camera technical field, in particular to industrial grade far infrared thermal imaging camera.
Background
Thermal imaging is a detection device that detects infrared energy (heat) through non-contact, converts the infrared energy into an electrical signal, generates a thermal image and a temperature value on a display, and can calculate the temperature value. With the development of thermal imaging technology, far infrared thermal imaging technology has wide application in military, industry, automobile, forest fire prevention, medical field and the like, and the market demands the technology more and more, and the requirement is more and more accurate and functional diversity of temperature measurement precision of the technology. The existing far infrared thermal imaging camera has single function and poor heat dissipation effect and temperature measurement precision.
Accordingly, the prior art is deficient and needs improvement.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing an industrial grade far infrared thermal imaging camera aims at improving the structure of far infrared thermal imaging camera, improves its radiating efficiency and temperature measurement precision.
In order to achieve the above object, the utility model provides an industrial far infrared thermal imaging camera, which comprises a main shell, wherein the main shell comprises a front cover, a middle frame and a rear cover which are connected with each other, a heat dissipation plate is arranged in the main shell, and the heat dissipation plate divides the main shell into a front space and a rear space;
the infrared shutter assembly is characterized in that a lens hole for mounting a lens is formed in the front cover, a cover plate is arranged on the inner side of the front cover, an infrared shutter assembly is mounted on one side, close to the front cover, of the cover plate, a first image acquisition plate for image acquisition is mounted on one side, close to the heat dissipation plate, of the cover plate, and the first image acquisition plate is attached to the heat dissipation plate;
a second image acquisition board for image acquisition, a main board for data processing, a power supply board for power supply and an IO interface board for connecting with external equipment are sequentially arranged between the heat dissipation board and the rear cover; the first image acquisition board is connected with the second image acquisition board through a flat cable, and the heat dissipation board is provided with a wire passing hole for the flat cable to pass through; the mainboard is provided with a heat conducting fin which is attached to the middle frame.
Preferably, a heat-resistant frame is arranged on one side of the heat dissipation plate close to the front cover, and a heat-resistant plate is arranged on one side of the heat dissipation plate close to the rear cover.
Preferably, the side extends all around of heating panel is provided with the heat dissipation frame, the heat dissipation frame with the center laminating, just the heat dissipation frame with a plurality of heat dissipation recesses of evenly having arranged in center surface.
Preferably, a first heat conduction pad is attached between the first image acquisition board and the heat dissipation board, and a second heat conduction pad is attached between the main board and the heat conduction sheet and between the heat conduction sheet and the middle frame.
Preferably, the heat conducting sheet is a heat conducting copper sheet.
Preferably, the second image collecting board is connected with the main board, the main board is connected with the power board, and the power board is connected with the IO interface board through connectors.
Compared with the prior art, the beneficial effects of the utility model are that: the structure layout of the existing far infrared thermal imaging camera is improved, the heat dissipation plate is arranged in the main shell to separate the inner space of the main shell into a front part and a rear part, the heat dissipation is respectively carried out, the heat resistance frames are additionally arranged on two sides of the heat dissipation plate, the heat resistance plates are further separated for heat dissipation, and the heat dissipation efficiency is improved. The first image acquisition board close to the lens and the infrared shutter assembly is attached to the heating panel through the first heat conduction pad, the mainboard is attached to the middle frame through the heat conduction piece and the second heat conduction pad, heat transfer is accelerated, the heating panel is attached to the middle frame, the heat dissipation groove is formed in the surface, the heat dissipation contact area is improved, and heat dissipation is further accelerated.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is an exploded view of the whole structure of the far infrared thermal imaging camera of the present invention;
the objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
Referring to fig. 1, the industrial-grade far-infrared thermal imaging camera provided in this embodiment includes a main housing, where the main housing includes a front cover 1, a middle frame 2, and a rear cover 3, which are connected to each other, a heat dissipation plate 4 is installed in the main housing, and the heat dissipation plate 4 divides the main housing into a front space and a rear space;
the front cover 1 is provided with a lens hole 5 for mounting a lens, the inner side of the front cover 1 is provided with a cover plate 6, one side of the cover plate 6 close to the front cover 1 is provided with an infrared shutter assembly 7, one side of the cover plate 6 close to the heat dissipation plate 4 is provided with a first image acquisition plate 8 for image acquisition, and the first image acquisition plate 8 is attached to the heat dissipation plate 4;
a second image acquisition board 9 for image acquisition, a main board 10 for data processing, a power board 11 for power supply and an IO interface board 12 for connecting with external equipment are sequentially arranged between the heat dissipation board 4 and the rear cover 3; the first image acquisition board 8 is connected with the second image acquisition board 9 through a flat cable, and the heat dissipation board 4 is provided with a wire passing hole 13 for the flat cable to pass through; the mainboard 10 is provided with a heat conducting fin 14, and the heat conducting fin 14 is attached to the middle frame 2.
It should be noted that, in this embodiment, the structural layout of the existing far infrared thermal imaging camera is improved, a heat dissipation plate 4 is disposed inside the main housing to divide the internal space thereof into a front portion and a rear portion, which are used for heat dissipation respectively, and a heat blocking frame 15 and a heat blocking plate 16 are added on two sides of the heat dissipation plate 4 to further separate and dissipate heat, so as to improve the heat dissipation efficiency. The first image acquisition board 8 close to the lens and the infrared shutter assembly 7 is attached to the heat dissipation plate 4 through the first heat conduction pad 18, the main board 10 is attached to the middle frame 2 through the heat conduction sheet 14 and the second heat conduction pad 19, heat transfer is accelerated, the heat dissipation plate 4 is attached to the middle frame 2, a heat dissipation groove is formed in the surface, the heat dissipation contact area is increased, and heat dissipation is further accelerated. The far infrared thermal imaging camera in the embodiment can measure the surface temperature of an object and display a real-time thermal image, can set temperature measuring ranges in different ranges, has various color modes, records videos, and provides various function settings such as emissivity setting, black body furnace calibration and the like and three format data. The frame rate is as high as 50HZ, multiple cameras are supported to work simultaneously, the number is not limited, networking can be performed at will, and the device does not drop the line or lose frames after working for a long time. The image processing of the self-contained hardware is accelerated, the CPU occupancy rate of the host end is reduced, the POE power supply is supported, the plug-and-play driving design is adopted, the use is simple and easy, and the stability of network communication and the convenience in use of the USB equipment are realized. And the method is compatible with the SDK of a common camera and is convenient to develop.
Furthermore, a blocking piece is arranged on the infrared shutter assembly 7, and when sunlight irradiates, the blocking piece can be automatically closed, so that the detection surface of the sensor is protected, and the RDAC can be periodically corrected.
Furthermore, a heat-resistant frame 15 is arranged on one side, close to the front cover 1, of the heat-dissipating plate 4, a heat-resistant plate 16 is arranged on one side, close to the rear cover 3, of the heat-dissipating plate 4, and the space of the left area and the space of the right area in the main shell are further separated, so that heat dissipation is carried out in different areas, mutual interference is avoided, and heat dissipation efficiency is accelerated. The heat dissipation plate 4 and the heat resistance plate 16 are both provided with wire passing holes for the flat cables to pass through, so that the flat cables can be far away from the shell, enough space is kept, the sensors are prevented from being damaged by static electricity, and the first image acquisition plate 8 can also dissipate heat through the heat dissipation plate 4.
Further, the side extends all around of heating panel 4 is provided with heat dissipation frame 17, heat dissipation frame 17 with the laminating of center 2, just heat dissipation frame 17 with a plurality of heat dissipation recesses of evenly having arranged in the surface of center 2 improve heat dissipation area of contact to can accelerate the heat dissipation.
Furthermore, a first heat conducting pad 18 is attached between the first image acquisition board 8 and the heat dissipation plate 4, and a second heat conducting pad 19 is attached between the main board 10 and the heat conducting fin 14, and between the heat conducting fin 14 and the middle frame 2, so that the heat transfer efficiency is improved, and the heat can be conveniently and rapidly dissipated.
Furthermore, the heat conducting sheet 14 is a heat conducting copper sheet, so that the heat dissipation efficiency is high, the weight is light, and the cost is low.
Furthermore, the second image collecting board 9 and the main board 10, the main board 10 and the power board 11, and the power board 11 and the IO interface board 12 are connected by connectors, so that the installation and the disassembly are convenient, the production efficiency is improved, and the production cost is reduced.
The above is only the preferred embodiment of the present invention, and not the scope of the present invention, all the equivalent structures or equivalent flow changes made by the contents of the specification and the drawings or the direct or indirect application in other related technical fields are included in the patent protection scope of the present invention.
Claims (6)
1. An industrial-grade far infrared thermal imaging camera is characterized by comprising a main shell, wherein the main shell comprises a front cover, a middle frame and a rear cover which are connected with each other;
the infrared shutter assembly is characterized in that a lens hole for mounting a lens is formed in the front cover, a cover plate is arranged on the inner side of the front cover, an infrared shutter assembly is mounted on one side, close to the front cover, of the cover plate, a first image acquisition plate for image acquisition is mounted on one side, close to the heat dissipation plate, of the cover plate, and the first image acquisition plate is attached to the heat dissipation plate;
a second image acquisition board for image acquisition, a main board for data processing, a power supply board for power supply and an IO interface board for connecting with external equipment are sequentially arranged between the heat dissipation board and the rear cover; the first image acquisition board is connected with the second image acquisition board through a flat cable, and the heat dissipation board is provided with a wire passing hole for the flat cable to pass through; the mainboard is provided with a heat conducting fin which is attached to the middle frame.
2. The industrial-grade far-infrared thermal imaging camera as claimed in claim 1, wherein a heat-resistant frame is installed on the side of the heat-dissipating plate close to the front cover, and a heat-resistant plate is installed on the side of the heat-dissipating plate close to the rear cover.
3. The industrial-grade far-infrared thermal imaging camera as claimed in claim 1, wherein a heat dissipation frame is extended from the peripheral side of the heat dissipation plate, the heat dissipation frame is attached to the middle frame, and a plurality of heat dissipation grooves are uniformly distributed on the surfaces of the heat dissipation frame and the middle frame.
4. The industrial-grade far-infrared thermal imaging camera according to claim 1, wherein a first thermal pad is bonded between the first image capturing board and the heat dissipating plate, and a second thermal pad is bonded between the main board and the thermal conductive sheet, and between the thermal conductive sheet and the middle frame.
5. The industrial-grade far-infrared thermal imaging camera of claim 4, wherein the thermally conductive sheet is provided as a thermally conductive copper sheet.
6. The industrial-grade far-infrared thermal imaging camera according to claim 1, wherein the second image capturing board is connected to the main board, the main board is connected to the power board, and the power board is connected to the IO interface board via connectors.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022828614.2U CN213403205U (en) | 2020-11-30 | 2020-11-30 | Industrial grade far infrared thermal imaging camera |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022828614.2U CN213403205U (en) | 2020-11-30 | 2020-11-30 | Industrial grade far infrared thermal imaging camera |
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| Publication Number | Publication Date |
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| CN213403205U true CN213403205U (en) | 2021-06-08 |
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| CN202022828614.2U Active CN213403205U (en) | 2020-11-30 | 2020-11-30 | Industrial grade far infrared thermal imaging camera |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024067099A1 (en) * | 2022-09-30 | 2024-04-04 | 杭州海康机器人股份有限公司 | Industrial camera |
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- 2020-11-30 CN CN202022828614.2U patent/CN213403205U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024067099A1 (en) * | 2022-09-30 | 2024-04-04 | 杭州海康机器人股份有限公司 | Industrial camera |
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