CN215374236U - Whole radiating infrared thermal imager - Google Patents
Whole radiating infrared thermal imager Download PDFInfo
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- CN215374236U CN215374236U CN202121933312.XU CN202121933312U CN215374236U CN 215374236 U CN215374236 U CN 215374236U CN 202121933312 U CN202121933312 U CN 202121933312U CN 215374236 U CN215374236 U CN 215374236U
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- heat dissipation
- infrared thermal
- circuit board
- shell
- heat
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Abstract
The utility model is suitable for the technical field of infrared thermal imaging, and provides an infrared thermal imager capable of radiating integrally, which comprises a radiating shell, wherein one side of the radiating shell is provided with an infrared thermal imaging detector, a first heat-conducting fin is arranged between the radiating shell and the infrared thermal imaging detector, the infrared thermal imaging detector is covered by a front cover, the other side of the radiating shell is provided with a circuit board, a second heat-conducting fin is arranged between the circuit board and the radiating shell, and the circuit board is covered by a rear shell; the heat dissipation shell can be used as a heat dissipation device and also used as a fixing device for the infrared thermal imaging detector and the circuit board, and the heat dissipation shell is also a part of the whole thermal imager shell, so that the structure is simple, and multiple functions can be realized; the heat that infrared thermal imaging detector work was gived off can transmit to the heat dissipation shell through first conducting strip on, the heat that the circuit board gived off at the during operation can transmit to the heat dissipation shell through the second conducting strip on to reduce the heat and pile up the influence in inside.
Description
Technical Field
The utility model belongs to the technical field of infrared thermal imaging, and particularly relates to an infrared thermal imager capable of dissipating heat integrally.
Background
The infrared thermal imager is a device for detecting the infrared radiation of a target object by utilizing an infrared thermal imaging technology and converting a temperature distribution image of the target object into a video image by means of photoelectric conversion, signal processing and the like, the internal detector and a main processing chip on a circuit board can generate a large amount of heat energy in the working process of the infrared thermal imager, the heat dissipation mode of the infrared thermal imager in the current market is that the chip is directly bonded and dissipated together by heat dissipation silica gel and a specially-built-in aluminum heat dissipation block, so that the heat is only dissipated into the interior of the thermal imager, the shell and the interior of the infrared thermal imager are air without convection, the heat cannot be rapidly dissipated into the external environment, the structure of the infrared thermal imager is complex, the heat can be greatly accumulated in the interior after a long time, and the circuit board and the chip in the infrared thermal imager can still be very hot, the ideal uniform heat dissipation effect cannot be achieved.
SUMMERY OF THE UTILITY MODEL
The utility model aims to overcome the defects of the prior art and provides an infrared thermal imager with integral heat dissipation.
The utility model is realized by the following steps: the utility model provides an infrared thermal imager of whole heat dissipation, includes the heat dissipation casing, one side of heat dissipation casing is equipped with infrared thermal imaging detector, the heat dissipation casing with be equipped with first conducting strip between the infrared thermal imaging detector, infrared thermal imaging detector coats and is stamped the protecgulum, the opposite side of heat dissipation casing is equipped with the circuit board, the circuit board with be equipped with the second conducting strip between the heat dissipation casing, the circuit board coats and is stamped the backshell, infrared thermal imaging detector with circuit board electric connection.
Further, the heat dissipation shell is made of aluminum alloy.
Furthermore, the first heat conducting fin and the second heat conducting fin are both made of insulating silica gel materials.
Further, the protecgulum is located the front end of heat dissipation casing, seted up first installation cavity on the protecgulum, infrared thermal imaging detector is located in the first installation cavity and support by in on the first heat conduction piece.
Furthermore, a second mounting cavity is formed in the rear end of the heat dissipation shell, the second heat conducting fins are arranged on the bottom surface of the second mounting cavity, the circuit board is fixed in the second mounting cavity and abuts against the second heat conducting fins, and the rear shell is arranged at the rear end of the heat dissipation shell.
Furthermore, the heat dissipation device also comprises an aviation plug, wherein the aviation plug is arranged in the heat dissipation shell and extends out of the rear shell, and the aviation plug is connected with the circuit board to form an output interface.
Furthermore, the front cover, the infrared thermal imaging detector, the heat dissipation shell, the circuit board and the rear shell are fixedly screwed through a plurality of screws.
According to the integrally radiating infrared thermal imager provided by the utility model, the radiating shell can be used as a radiating device and also used as a fixing device for an infrared thermal imaging detector and a circuit board, and the radiating shell is also a part of the whole thermal imager shell, so that the structure is simple, and multiple functions can be realized; the heat that infrared thermal imaging detector work gived off can transmit to the heat dissipation shell through first conducting strip on, simultaneously, the heat that the circuit board gived off at the during operation can transmit to the heat dissipation shell through the second conducting strip on, and all last heats all transmit to external environment through the heat dissipation shell to reduce the heat and pile up the influence in inside, improve the safety in utilization.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
The drawings are only for purposes of illustrating and explaining the present invention and are not to be construed as limiting the scope of the present invention.
FIG. 1 is a schematic diagram of the structure provided by the present invention.
Fig. 2 is an exploded view of the structure provided by the present invention.
The reference numbers illustrate: 1. a heat dissipating housing; 11. a second mounting cavity; 2. an infrared thermal imaging detector; 3. a first thermally conductive sheet; 4. a front cover; 41. a first mounting cavity; 5. a circuit board; 6. a second thermally conductive sheet; 7. a rear housing; 8. an aviation plug.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.
Referring to fig. 1-2, an overall heat dissipation infrared thermal imager is disclosed in the present invention, which includes a heat dissipation casing 1, the heat dissipation casing 1 is made of aluminum alloy, and the aluminum alloy is a good thermal conductor to better dissipate the internal heat. One side of heat dissipation casing 1 is equipped with infrared thermal imaging detector 2, heat dissipation casing 1 with be equipped with first conducting strip 3 between the infrared thermal imaging detector 2, infrared thermal imaging detector 2 coats outward and has a protecgulum 4, and is concrete, protecgulum 4 is located the front end of heat dissipation casing 1, first installation cavity 41 has been seted up on protecgulum 4, infrared thermal imaging detector 2 is located in the first installation cavity 41, generally, the adaptation can be seted up to the front end of protecgulum 4 the mirror hole of infrared thermal imaging detector 2 is convenient for the detection achievement of infrared thermal imaging detector 2. First conducting strip 3 is located on the rear end face of heat dissipation casing 1, infrared thermal imaging detector 2 is located when 41 in the first installation cavity its rear end support lean on in the first conducting strip 3, do benefit to infrared thermal imaging detector 2 conducts the heat fast on the heat dissipation shell.
The opposite side of heat dissipation casing 1 is equipped with circuit board 5, circuit board 5 with be equipped with second conducting strip 6 between the heat dissipation casing 1, circuit board 5 coats outward and has backshell 7, and is concrete, second installation cavity 11 has been seted up to the rear end of heat dissipation casing 1, second conducting strip 6 is located the bottom surface of second installation cavity 11, circuit board 5 is fixed in support and leaning on in the second installation cavity 11 on the second conducting strip 6, and is equitable, does benefit to circuit board 5 conducts the heat fast on the heat dissipation shell, simultaneously backshell 7 is located the rear end of heat dissipation casing 1 is in order to protect circuit board 5. The infrared thermal imaging detector 2 is electrically connected with the circuit board 5. Furthermore, still include aviation plug 8, aviation plug 8 is located the inside of heat dissipation casing and stretch out backshell 7, aviation plug 8 with circuit board 5 is connected in order to form output interface. Preferably, the first heat-conducting fin 3 and the second heat-conducting fin 6 are both made of insulating silica gel materials.
The heat dissipation shell can be used as a heat dissipation device and can also be used as a fixing device for the infrared thermal imaging detector 2 and the circuit board 5, and the first heat conducting fins 3 and the second heat conducting fins 6 are matched to better quickly dissipate heat, so that heat accumulation is avoided, and the using effect is influenced. As a further improvement in this embodiment, the front cover 4 and the rear housing 7 are also preferably made of aluminum alloy materials, that is, the front cover 4, the heat dissipation housing and the rear housing 7 are combined with each other to form a whole housing of the thermal infrared imager, the front cover 4, the heat dissipation housing and the rear housing 7 can transfer heat simultaneously, the contact area between the whole housing and ambient air formed by combining the front cover 4, the heat dissipation housing and the rear housing is large, which is equivalent to that the whole housing is a heat dissipation device, so that the influence of heat accumulation is reduced, and the use safety is improved.
Furthermore, the front cover 4, the infrared thermal imaging detector 2, the heat dissipation shell 1, the circuit board 5 and the rear shell 7 are fixedly screwed through a plurality of screws, the structure is simple, the production cost is low, the integral heat dissipation of the whole thermal infrared imager can be realized, and a good heat dissipation effect is ensured.
The present invention is not limited to the above preferred embodiments, and any modification, equivalent replacement or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. The utility model provides an infrared thermal imager of whole heat dissipation which characterized in that: including heat dissipation casing (1), one side of heat dissipation casing (1) is equipped with infrared thermal imaging detector (2), heat dissipation casing (1) with be equipped with first conducting strip (3) between infrared thermal imaging detector (2), infrared thermal imaging detector (2) coats and is stamped protecgulum (4), the opposite side of heat dissipation casing (1) is equipped with circuit board (5), circuit board (5) with be equipped with second conducting strip (6) between heat dissipation casing (1), circuit board (5) coats and is stamped backshell (7), infrared thermal imaging detector (2) with circuit board (5) electric connection.
2. An integral heat dissipation infrared thermal imager as claimed in claim 1, wherein: the heat dissipation shell (1) is made of an aluminum alloy material.
3. An integral heat dissipation infrared thermal imager as claimed in claim 1, wherein: the first heat conducting fin (3) and the second heat conducting fin (6) are both made of insulating silica gel materials.
4. An integral heat dissipation infrared thermal imager as claimed in claim 1, wherein: the front cover (4) is arranged at the front end of the heat dissipation shell (1), a first installation cavity (41) is formed in the front cover (4), and the infrared thermal imaging detector (2) is arranged in the first installation cavity (41) and abutted to the first heat conducting sheet (3).
5. An integral heat dissipation infrared thermal imager as claimed in claim 1, wherein: the rear end of the heat dissipation shell (1) is provided with a second mounting cavity (11), the second heat-conducting fins (6) are arranged on the bottom surface of the second mounting cavity (11), the circuit board (5) is fixed in the second mounting cavity (11) and is abutted against the second heat-conducting fins (6), and the rear shell (7) is arranged at the rear end of the heat dissipation shell (1).
6. An integral heat dissipation infrared thermal imager as claimed in claim 1, wherein: still including aviation plug (8), aviation plug (8) are located the inside of heat dissipation casing is stretched out backshell (7), aviation plug (8) with circuit board (5) are connected in order to form output interface.
7. An integral heat dissipation infrared thermal imager as claimed in claim 1, wherein: the front cover (4), the infrared thermal imaging detector (2), the heat dissipation shell (1), the circuit board (5) and the rear shell (7) are fixedly screwed through a plurality of screws.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121933312.XU CN215374236U (en) | 2021-08-17 | 2021-08-17 | Whole radiating infrared thermal imager |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121933312.XU CN215374236U (en) | 2021-08-17 | 2021-08-17 | Whole radiating infrared thermal imager |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215374236U true CN215374236U (en) | 2021-12-31 |
Family
ID=79618879
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121933312.XU Active CN215374236U (en) | 2021-08-17 | 2021-08-17 | Whole radiating infrared thermal imager |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215374236U (en) |
-
2021
- 2021-08-17 CN CN202121933312.XU patent/CN215374236U/en active Active
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