CN210519274U - Printed board assembly and infrared machine core structure - Google Patents
Printed board assembly and infrared machine core structure Download PDFInfo
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- CN210519274U CN210519274U CN201920848234.XU CN201920848234U CN210519274U CN 210519274 U CN210519274 U CN 210519274U CN 201920848234 U CN201920848234 U CN 201920848234U CN 210519274 U CN210519274 U CN 210519274U
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- printed board
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Abstract
The utility model provides a printing board subassembly, including first radiating piece and a plurality of printing board, the surface of first radiating piece comprises two cooling surfaces and a plurality of installation face, and is through heat dissipation channel intercommunication, a plurality of between two cooling surfaces the printing board is installed respectively on each installation face of first radiating piece, and install the first radiating piece of the chip laminating that generates heat on a printing board side arranges. Additionally, the utility model also provides an infrared core structure of adopting above-mentioned printed board subassembly. The utility model arranges the printed board around the periphery of the heat radiating piece, effectively increases the heat radiating area of the printed board, and the heat radiating effect is far superior to that of the printed board arranged in a stacked way even if the heat radiation of the fan is not increased; and can fully dispel the heat that the core rear end power consumption is big that generates heat, solved the core heat dissipation badly, the great problem of the front and back end difference in temperature to effectively avoid detector operational environment high temperature and lead to the detector image quality to descend.
Description
Technical Field
The utility model belongs to the technical field of infrared core structure, concretely relates to printing board subassembly and infrared core structure.
Background
The infrared movement is developing towards miniaturization, integration, all-weather, long distance, high definition, high performance, low power consumption, etc., and the miniaturization and integration also cause the heat concentration of the internal components, so that the infrared movement is required to have a better heat dissipation effect, otherwise, once a fault occurs, the internal components are overheated to stop working or even be burnt.
A plurality of printed boards in the existing infrared movement are generally arranged in a printed board stacking mode, the heat dissipation area between the printed boards in the arrangement mode is small, timely heat dissipation is not facilitated, and the overall size of the movement is directly increased if the heat dissipation area is increased. In addition, the radiating fins in the existing infrared movement generally adopt a natural cooling mode, so that heat with large heating power consumption at the rear end of the movement cannot be sufficiently dissipated, the heat can be transmitted to the periphery of the detector after the working time is long, the working environment temperature of the detector is improved, and the imaging quality of the detector is reduced.
SUMMERY OF THE UTILITY MODEL
The utility model aims at overcoming the problem that the printing board range upon range of in the current infrared core arranges heat radiating area little, and the radiating effect is poor.
Therefore, the utility model provides a printing board subassembly, including first radiating piece and a plurality of printing board, the surface of first radiating piece comprises two cooling surfaces and a plurality of installation face, and is through heat dissipation channel intercommunication, a plurality of between two cooling surfaces the printing board is installed respectively on each installation face of first radiating piece, and install the first radiating piece of the chip laminating that generates heat on a printing board side arranges.
Further, first radiating piece includes mounting bracket and sets up a plurality of radiating fin inside the mounting bracket, the printing board is installed on the surface of mounting bracket, and the chip that generates heat on the printing board laminating radiating fin, it is a plurality of radiating fin is equidistant to be distributed, and forms the heat dissipation clearance between two adjacent radiating fin, and these a plurality of heat dissipation clearances constitute heat dissipation channel.
Furthermore, a heat transfer plate for attaching a heating chip on the printed board is arranged on the printed board mounting side of the heat dissipation gap.
Furthermore, the mounting bracket is a cuboid frame, a group of two opposite side surfaces of the mounting bracket are heat dissipation surfaces, the rest four side surfaces are mounting surfaces, and the number of the printed boards is four, and the four printed boards are respectively mounted on the four mounting surfaces of the mounting bracket.
Furthermore, the printed board is connected with the mounting frame in a sealing mode.
Further, one of the two heat radiating surfaces is provided with a fan.
Additionally, the utility model also provides an infrared core structure, including safety cover, detector, the second heat dissipation piece, heat shield and the foretell printed board subassembly that arranges in proper order.
Furthermore, a fan is arranged on one side surface of the second heat dissipation piece adjacent to the detector.
Furthermore, one side of the second radiating piece, which is connected with the detector, is provided with a printed board, and the heating chip arranged on one side surface of the printed board is attached to the second radiating piece.
Furthermore, first radiating piece and second radiating piece all adopt the aluminum alloy material to make, the heat shield adopts low coefficient of thermal conductivity material to make.
Compared with the prior art, the beneficial effects of the utility model are that:
(1) the utility model provides a shape structure is returned in this kind of printing board subassembly adoption, encircles the periphery of arranging at the radiating piece with the printing board, makes the chip laminating radiating piece that generates heat, has effectively increased the heat radiating area of printing board, even does not increase fan cooling, and its radiating effect is also superior to the radiating effect of the printing board of range upon range of arrangement far away.
(2) The utility model provides an infrared core adopts the printed board subassembly of returning the shape structure to and combine the fan to dispel the heat, can fully dispel the heat that the consumption is big with the core rear end generates heat, it is bad to have solved the core heat dissipation, the great problem of front and back end difference in temperature, thereby effectively avoid detector operational environment temperature height and lead to detector imaging quality to descend.
The present invention will be described in further detail with reference to the accompanying drawings.
Drawings
Fig. 1 is an exploded view of the structure of the mid-infrared movement of the present invention;
fig. 2 is a cross-sectional view of the structure of the mid-infrared movement of the present invention.
Description of reference numerals: 1. a protective cover; 2. a detector; 3. a second heat sink; 4. a heat insulating sheet; 5. printing a board; 6. a heat generating chip; 7. a mounting frame; 8. a heat dissipating fin; 9. a heat transfer plate; 10. a fan.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, are not to be construed as limiting the present invention.
The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature; in the description of the present invention, "a plurality" means two or more unless otherwise specified.
As shown in fig. 1 and 2, the present embodiment provides a printed board assembly, including a first heat sink and a plurality of printed boards 5, an outer surface of the first heat sink is composed of two heat dissipation surfaces and a plurality of mounting surfaces, wherein the number of the mounting surfaces is not less than the number of the printed boards 5, the two heat dissipation surfaces are communicated through a heat dissipation channel, the plurality of printed boards 5 are respectively mounted on each mounting surface of the first heat sink, and a heat-generating chip 6 mounted on one side surface of the printed board 5 is attached to the first heat sink; the printed board 5 surrounds the periphery of the first heat dissipation part and is cooled through the heat dissipation channel between the two heat dissipation surfaces, compared with the existing printed board 5 stacking arrangement mode, the arrangement mode effectively increases the heat dissipation area of the printed board, greatly improves the heat dissipation effect of the printed board 5, and is far better than the heat dissipation effect of the stacked printed board even if the heat dissipation of a fan is not increased.
The embodiment that refines, first radiating piece includes mounting bracket 7 and a plurality of radiating fin 8, and this a plurality of radiating fin 8 set up inside mounting bracket 7, and is a plurality of radiating fin 8 equidistant distribution, and form the heat dissipation clearance between two adjacent radiating fin 8, and this a plurality of heat dissipation clearances have constituted the heat dissipation channel promptly, simultaneously printed board 5 encircles and installs on mounting bracket 7's the surface, and the 6 laminating radiating fin 8 of the chip that generates heat on printed board 5, the radiating fin 8 of first radiating piece sets up in the middle of, and printed board 5 sets up around the radiating fin 8, and radiating fin 8 can concentrate the cooling around on the printed board 5 the heat that the chip 6 that generates heat conducted comes, and heat radiating area is big, and the radiating effect is good. Optimally, the fan 10 is arranged on any one radiating surface of the first radiating piece, the fan 10 is over against the radiating fins 8 of the first radiating piece, and the radiating fins 8 are forcedly cooled by the fan 10, so that the heat of the first radiating piece is radiated to the outside of the printed board assembly, and the radiating effect of the printed board assembly is further improved.
Further, because radiating fin 8 is the sheet structure, the area of contact of its side and the chip 6 that generates heat on printed board 5 is little, therefore, this embodiment is in the printed board 5 installation side in heat dissipation clearance is provided with the heat transfer plate 9 that is used for laminating chip 6 that generates heat on printed board 5 to the area of contact of chip 6 that generates heat and radiating fin 8 on the increase printed board 5 has improved the heat transfer effect between chip 6 that generates heat and radiating fin 8.
The mounting frame 7 is a rectangular frame, two opposite side surfaces of the mounting frame 7 are heat dissipation surfaces, namely the upper surface and the lower surface of the mounting frame 7 are heat dissipation surfaces, the remaining four side surfaces are mounting surfaces, the four printed boards 5 are four and are respectively mounted on the four mounting surfaces of the mounting frame 7, the heat dissipation fins 8 are arranged in the middle of the mounting frame 7, so that the heat dissipation area of the four printed boards 5 is greatly increased, and the heat dissipation effect is good. Furthermore, the printed board is hermetically connected with the mounting frame, so that a structure with only the upper end and the lower end communicated and four side surfaces closed is formed after the printed board is mounted on the mounting frame, and heat of the heating chip on the printed board can be dissipated outwards from the heat dissipation surface only through the heat dissipation channel.
In addition, the embodiment further provides an infrared core structure of the printed board assembly adopting the printed board square-square arrangement mode, as shown in fig. 1 and fig. 2, the infrared core structure comprises a protective cover 1, a detector 2, a second heat dissipation member 3, a heat insulation sheet 4 and the printed board assembly which are sequentially arranged from the front end to the rear end of the core, the detector 2 is installed on the second heat dissipation member 3, the detector 2 is dissipated through the second heat dissipation member 3, the structure of the second heat dissipation member 3 is the same as that of the first heat dissipation member, the second heat dissipation member 2 is isolated from the first heat dissipation member of the printed board assembly through the heat insulation sheet 4, so that heat of a high-power printed board 5 of the printed board assembly at the rear end is prevented from being conducted to the detector 2 at the front end, and the working environment temperature; meanwhile, the printed boards 5 are arranged around the first heat dissipation part, so that the heat dissipation area can be effectively increased when the overall dimension of the movement is not increased, and the heat dissipation effect is far better than that of the movement structure in a stacking mode even if the fan 10 is not increased.
Specifically, the infrared movement structure may further include a printed board 5 on one side of the second heat sink 3 connected to the detector 2, and the heat generating chip 6 mounted on one side of the printed board 5 is attached to the second heat sink 3. In order to further improve the heat dissipation effect of the detector 2, a fan is arranged on one side surface of the second heat dissipation member 3 adjacent to the detector 2, namely the fan is arranged at the upper end or the lower end of the second heat dissipation member 3, the heat dissipation fins of the second heat dissipation member 3 are cooled in time through the fan, the heat on the second heat dissipation member 3 is dissipated to the outside of the infrared machine core, the heat conduction between the heat dissipation fins of the detector 2 and the second heat dissipation member 3 is ensured, and the heat dissipation effect of the heat dissipation fins on the detector 2 is improved. And in order to guarantee the radiating effect of first radiating piece and second radiating piece 3 to printed board 5 and detector 2, first radiating piece and second radiating piece 3 all adopt the aluminum alloy material to make, and in order to block the heat conduction of rear end high-power consumption printed board better simultaneously, heat shield 4 adopts the low coefficient of thermal conductivity material to make.
To sum up, the printed board assembly provided by the utility model adopts a zigzag structure, and the printed board is arranged around the periphery of the heat dissipation part, so that the heating chip is attached to the heat dissipation part, the heat dissipation area of the printed board is effectively increased, and the heat dissipation effect is far better than that of the printed boards arranged in a stacked manner even if the heat dissipation of the fan is not increased; and adopt the infrared core of this kind of printed board subassembly, can fully dispel the heat that the core rear end heating power dissipation is big, solved the core heat dissipation badly, the great problem of the front and back end difference in temperature to effectively avoid detector operational environment high temperature and lead to the detector image quality to descend.
The above illustration is merely an illustration of the present invention, and does not limit the scope of the present invention, and all designs identical or similar to the present invention are within the scope of the present invention.
Claims (10)
1. A printed board assembly characterized by: including first radiating piece and a plurality of printing board, the surface of first radiating piece comprises two cooling surfaces and a plurality of installation face, and is through heat dissipation channel intercommunication, a plurality of between two cooling surfaces the printing board is installed respectively on each installation face of first radiating piece, and install the first radiating piece of the chip laminating that generates heat on a printing board side arranges.
2. The printed board assembly of claim 1, wherein: first radiating part includes mounting bracket and sets up a plurality of radiating fin inside the mounting bracket, the printing board is installed on the surface of mounting bracket, and the chip that generates heat on the printing board laminating radiating fin, it is a plurality of radiating fin is equidistant to be distributed, and forms the heat dissipation clearance between two adjacent radiating fin, and these a plurality of heat dissipation clearances constitute heat dissipation channel.
3. The printed board assembly of claim 2, wherein: and a heat transfer plate for attaching a heating chip on the printed board is arranged on the printed board mounting side of the heat dissipation gap.
4. The printed board assembly of claim 2, wherein: the mounting bracket is a cuboid frame, a set of two opposite side surfaces of the mounting bracket are heat dissipation surfaces, the remaining four side surfaces of the mounting bracket are mounting surfaces, and the number of the printed boards is four, and the four printed boards are respectively mounted on the four mounting surfaces of the mounting bracket.
5. The printed board assembly of claim 4, wherein: the printed board is connected with the mounting frame in a sealing mode.
6. The printed board assembly of claim 1, wherein: one of the two heat dissipation surfaces is provided with a fan.
7. An infrared core structure, its characterized in that: comprising a protective cover, a detector, a second heat sink, a heat shield and a printed board assembly according to any one of claims 1 to 6 arranged in sequence.
8. An infrared movement structure according to claim 7, characterized in that: and a fan is arranged on one side surface of the second heat dissipation piece adjacent to the detector.
9. An infrared movement structure according to claim 7, characterized in that: one side of the second radiating piece, which is connected with the detector, is provided with a printed board, and the heating chip arranged on one side face of the printed board is attached to the second radiating piece.
10. An infrared movement structure according to claim 7, characterized in that: the first heat dissipation piece and the second heat dissipation piece are made of aluminum alloy materials, and the heat insulation piece is made of low-heat-conductivity-coefficient materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920848234.XU CN210519274U (en) | 2019-06-06 | 2019-06-06 | Printed board assembly and infrared machine core structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920848234.XU CN210519274U (en) | 2019-06-06 | 2019-06-06 | Printed board assembly and infrared machine core structure |
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| Publication Number | Publication Date |
|---|---|
| CN210519274U true CN210519274U (en) | 2020-05-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920848234.XU Active CN210519274U (en) | 2019-06-06 | 2019-06-06 | Printed board assembly and infrared machine core structure |
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| CN (1) | CN210519274U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112015030A (en) * | 2020-08-28 | 2020-12-01 | 天津津航技术物理研究所 | Refrigeration infrared core assembly heat radiation structure and refrigeration infrared core |
-
2019
- 2019-06-06 CN CN201920848234.XU patent/CN210519274U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112015030A (en) * | 2020-08-28 | 2020-12-01 | 天津津航技术物理研究所 | Refrigeration infrared core assembly heat radiation structure and refrigeration infrared core |
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