CN209897201U - Optical module-based heat exchange assembly for wireless signal amplification device - Google Patents
Optical module-based heat exchange assembly for wireless signal amplification device Download PDFInfo
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- CN209897201U CN209897201U CN201921187590.8U CN201921187590U CN209897201U CN 209897201 U CN209897201 U CN 209897201U CN 201921187590 U CN201921187590 U CN 201921187590U CN 209897201 U CN209897201 U CN 209897201U
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Abstract
The utility model discloses a heat exchange assembly for wireless signal amplification device based on optical module, include: the mounting back shell, the heat dissipation panel, the heat dissipation mounting plate, the heat dissipation fins and the heat conduction pipes are arranged; the mounting back shell comprises a back shell bottom plate and a back shell side plate formed by extending the periphery of the back shell bottom plate forwards; the heat dissipation panel is detachably arranged on the front end surface of the back shell side plate; the heat dissipation mounting plate is detachably connected to the rear side surface of the heat dissipation panel through the support column and is arranged at intervals with the heat dissipation panel in the front-back direction, and the rear side surface of the heat dissipation mounting plate is used for mounting a circuit board; the radiating fins are detachably arranged on the front side surface of the radiating panel; one end of the heat conduction pipe is in thermal conduction connection with the front side face of the heat dissipation mounting plate, and the other end of the heat conduction pipe penetrates out of the heat dissipation panel and then is in thermal conduction connection with the heat dissipation fins. The utility model provides a wireless signal is heat exchange assembly for amplification device has better improved the dustproof performance based on wireless signal amplification device heat radiation structure of optical module based on the optical module.
Description
Technical Field
The utility model relates to a communication equipment field, in particular to wireless signal is heat exchange assembly for amplification device based on optical module.
Background
The optical module-based wireless signal amplifying device is a device commonly used in wireless communication, and its circuit structure is described in the prior art as patent 201720426557.0, and it is mainly used to amplify the signal amplitude, so that the wireless signal can cover a larger range. The existing shell of the wireless signal amplifying device based on the optical module generally adopts a mode of arranging heat dissipation holes on the shell for heat dissipation, dust easily enters the shell after the wireless signal amplifying device is installed and used for a period of time to cause short circuit of a circuit board, and the service life of the wireless signal amplifying device based on the optical module is shortened.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a wireless signal is heat exchange assemblies for amplification device based on optical module aims at improving the dustproof performance based on wireless signal amplification device heat radiation structure of optical module.
In order to achieve the above object, the utility model provides a heat exchange assembly for wireless signal amplification device based on optical module, wireless signal amplification device based on optical module include the circuit board and with external transmitting antenna and external receiving antenna that the corresponding element electricity on the circuit board is connected, heat exchange assembly for wireless signal amplification device based on optical module includes:
the mounting back shell comprises a back shell bottom plate and a back shell side plate formed by extending the periphery of the back shell bottom plate forwards, wherein the back shell side plate is used for mounting the external transmitting antenna and the external receiving antenna;
the heat dissipation panel is detachably arranged on the front end face of the back shell side plate and is in sealing connection with the front end face of the back shell side plate;
the heat dissipation mounting plate is detachably connected to the rear side face of the heat dissipation panel through a support column and is arranged at intervals with the heat dissipation panel in the front-back direction, and the rear side face of the heat dissipation mounting plate is used for mounting the circuit board;
the radiating fin is detachably arranged on the front side surface of the radiating panel;
and one end of the heat conduction pipe is in thermal conduction connection with the front side face of the heat dissipation mounting plate, and the other end of the heat conduction pipe penetrates out of the heat dissipation panel and then is in thermal conduction connection with the heat dissipation fins.
Further, one end of the heat conduction pipe in thermal conduction with the radiating fin is arranged on the upper side of one end of the heat conduction pipe in thermal conduction with the front side of the radiating mounting plate.
Furthermore, a heat-conducting silicone grease accommodating groove is formed in the rear side face of the heat-radiating mounting plate at the position where the circuit board is mounted, and the heat-conducting silicone grease accommodating groove is used for being filled with heat-conducting silicone grease which is in heat conduction connection with the circuit board.
Further, the edge inwards extends around the front end of the back shell side plate to form a sealing skirt board, the heat dissipation panel is provided with an annular sealing groove at a position corresponding to the sealing skirt board, a sealing rubber ring is embedded in the annular sealing groove, and the sealing rubber ring is matched with the sealing skirt board to realize the sealing connection of the heat dissipation panel and the front end face of the back shell side plate.
Furthermore, antenna mounting holes are formed in the left side and the right side of the back shell side plate, and the two antenna mounting holes are used for mounting the external transmitting antenna and the external receiving antenna respectively.
Furthermore, the outer peripheries of the two antenna mounting holes are provided with rain baffles along the upper half parts of the outer peripheries of the two antenna mounting holes in an outward protruding mode.
Further, the radiating fin comprises a radiating substrate and a plurality of radiating fins, the radiating fins are arranged on the front side face of the radiating substrate at intervals in the left-right direction, the rear side face of the radiating substrate is detachably connected with the radiating panel, and the radiating substrate is in thermal conduction with the heat conducting pipe.
Furthermore, the upper end of the back shell bottom plate extends upwards to be provided with an installation hanging plate, and the installation hanging plate is provided with a fixing hole along the front-back direction.
Further, the heat conduction pipes are arranged in the left-right direction at intervals.
The technical scheme of the utility model provides a wireless signal amplification device based on optical module uses heat exchange assembly includes sealed connection's installation dorsal scale and heat dissipation panel, the inboard installation heat dissipation mounting panel of heat dissipation panel, the outside installation fin of heat dissipation panel, heat dissipation mounting panel and fin respectively with the both ends heat conduction of heat pipe connect; the circuit board mounted on the heat dissipation mounting plate can be well separated from external dust by a closed space surrounded by the mounting back shell and the heat dissipation panel, and the heat dissipation of the circuit board is ensured by the arrangement of the heat dissipation fins and the heat conduction pipes; the heat exchange assembly for the wireless signal amplification device based on the optical module not only ensures the heat dissipation performance of the wireless signal amplification device based on the optical module, but also improves the dustproof performance of the wireless signal amplification device based on the optical module.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a perspective view of a heat exchange assembly for a wireless signal amplifying device based on an optical module according to an embodiment of the present invention;
FIG. 2 is an exploded view of FIG. 1;
FIG. 3 is a perspective view of the mounting back shell of FIG. 1;
FIG. 4 is a perspective view of the heat dissipating panel of FIG. 1 mounted with a heat dissipating mounting plate;
FIG. 5 is a perspective view of the heat pipe in FIG. 2;
fig. 6 is a perspective view of the heat sink of fig. 1.
The reference numbers illustrate:
| 1 | mounting |
11 | Back |
| 111 | |
1111 | |
| 12 | Back shell side plate | 121 | Sealed |
| 122 | |
123 | |
| 2 | |
21 | |
| 3 | Heat |
31 | |
| 32 | Heat-conducting silicone |
4 | |
| 41 | |
42 | Radiating |
| 5 | Heat conduction pipe |
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that, if directional indications (such as upper, lower, left, right, front and rear … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout includes three juxtapositions, exemplified by "A and/or B" including either A or B or both A and B. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
In order to improve the dustproof performance based on wireless signal amplification device heat radiation structure of optical module, the embodiment of the utility model provides a wireless signal amplification device uses heat exchange assembly based on optical module, fig. 1 to fig. 6 do the utility model provides a wireless signal amplification device uses heat exchange assembly based on optical module's embodiment, following combine specific figure to explain wireless signal amplification device uses heat exchange assembly based on optical module, the left side direction is x positive direction in the picture, the right side direction is x axle negative direction in the picture, the place ahead is y axle positive direction in the picture, the rear direction is y axle negative direction in the picture, the top direction is z axle positive direction in the picture, the lower direction is z axle negative direction in the picture.
The embodiment of the utility model provides a heat exchange assembly for wireless signal amplification device based on optical module, including the circuit board and with external transmitting antenna and external receiving antenna that the corresponding element electricity on the circuit board is connected, its circuit structure is prior art, can be as the structure that patent 201720426557.0 describes, heat exchange assembly for wireless signal amplification device based on optical module includes: the heat dissipation structure comprises a mounting back shell 1, a heat dissipation panel 2, a heat dissipation mounting plate 3, a heat dissipation fin 4 and a heat conduction pipe 5; the mounting back shell 1 comprises a back shell bottom plate 11 and a back shell side plate 12 formed by extending the periphery of the back shell bottom plate 11 forwards, wherein the back shell side plate 12 is used for mounting the external transmitting antenna and the external receiving antenna; the heat dissipation panel 2 is detachably mounted on the front end face of the back shell side plate 12, and the heat dissipation panel 2 is connected with the front end face of the back shell side plate 12 in a sealing manner, wherein the sealing connection can be realized through a sealing glue or a sealing ring; the heat dissipation mounting plate 3 is detachably connected to the rear side surface of the heat dissipation panel 2 through a support column 31 and is arranged at a distance from the heat dissipation panel 2 in the front-back direction, and the rear side surface of the heat dissipation mounting plate 3 is used for mounting the circuit board; the radiating fins 4 are detachably arranged on the front side surface of the radiating panel 2; one end of the heat conduction pipe 5 is in heat conduction connection with the front side face of the heat dissipation mounting plate 3, the other end of the heat conduction pipe penetrates out of the heat dissipation panel 2 and is in heat conduction connection with the heat dissipation fins 4, the heat conduction pipe 5 can be a copper pipe filled with heat conduction liquid, the heat conduction connection can be welding, can also be fixedly connected through a connecting piece, and can also be in compression joint.
The technical scheme of the utility model provides a heat exchange assembly for wireless signal amplification device based on optical module includes sealed connection's installation dorsal scale 1 and heat dissipation panel 2, heat dissipation mounting panel 3 is installed to the inboard of heat dissipation panel 2, and heat dissipation fin 4 is installed to the outside of heat dissipation panel 2, heat dissipation mounting panel 3 with heat dissipation fin 4 respectively with the both ends heat conduction of heat pipe 5 connect; the circuit board arranged on the heat dissipation mounting plate 3 can be well separated from external dust by a closed space formed by the mounting back shell 1 and the heat dissipation panel 2, and the heat dissipation of the circuit board is ensured by the arrangement of the heat dissipation fins 4 and the heat conduction pipes 5; the heat exchange assembly for the wireless signal amplification device based on the optical module not only ensures the heat dissipation performance of the wireless signal amplification device based on the optical module, but also improves the dustproof performance of the wireless signal amplification device based on the optical module.
Specifically, as shown in fig. 2 and 5, one end of the heat pipe 5 thermally connected to the heat sink 4 is located above one end of the heat pipe 5 thermally connected to the front side of the heat dissipating mounting plate 3. The heat pipe 5 is located the inboard one end of heat dissipation mounting panel 3 is buckled the setting down, heat pipe 5 is located the one end in the mounting panel outside is buckled the setting up. The heat conduction pipe 5 is low in inside and high in outside, so that heat conduction liquid filled in the heat conduction pipe 5 can flow to the radiating fins 4 quickly after heat exchange of the heat radiating installation plate, and cooled heat conduction liquid can flow to the heat radiating installation plate 3 quickly after heat radiation of the radiating fins 4.
Specifically, as shown in fig. 2 and 4, a heat-conducting silicone grease accommodating groove 32 is formed in the rear side surface of the heat-dissipating mounting plate 3 at a position where the circuit board is mounted, and the heat-conducting silicone grease accommodating groove 32 is used for filling heat-conducting silicone grease thermally connected to the circuit board. The heat conduction silicone grease containing groove 32 is convenient to arrange the heat conduction silicone grease containing groove 32 is filled on the heat dissipation mounting plate 3, so that the heat dissipation mounting plate 3 can be in good heat conduction with the circuit board, and the heat generated by the circuit board can be timely transmitted to the heat dissipation mounting plate 3 and then is dissipated to the heat dissipation fins 4 through the heat conduction pipes 5.
Specifically, referring to fig. 2 to 4, the periphery of the front end of the back shell side plate 12 extends inward to form a sealing skirt plate 121, an annular sealing groove 21 is formed in the position of the heat dissipation panel 2 corresponding to the sealing skirt plate 121, a sealing rubber ring is embedded in the annular sealing groove 21, and the sealing rubber ring is matched with the sealing skirt plate 121 to realize the sealing connection between the heat dissipation panel 2 and the front end surface of the back shell side plate 12. The heat radiation panel 2 and the sealing connection of the back shell side plate 12 adopts the matching of a sealing ring and a sealing skirt plate 121, and is convenient to detach and maintain later.
Specifically, as shown in fig. 1 to fig. 3, antenna mounting holes 122 are formed in both the left and right sides of the back shell side plate 12, and the two antenna mounting holes 122 are respectively used for mounting the external transmitting antenna and the external receiving antenna. When the antenna is installed, the antenna base of the external transmitting antenna and the external receiving antenna can be screwed to the antenna installation hole 122, and after the electrical connection between the external transmitting antenna and the external receiving antenna and the corresponding electronic element of the circuit board is completed, the antenna base and the back shell side plate 12 are sealed by using a sealant. The antenna mounting hole 122 is disposed to facilitate mounting of the external transmitting antenna and the external receiving antenna.
Specifically, as shown in fig. 1 to 3, the outer peripheries of the two antenna mounting holes 122 are both provided with a rain shield 123 protruding outwards along the upper half portion. The rain shield 123 may be shaped like a U-shaped plate with a downward opening as shown in the figure, or may be shaped like another plate that covers the upper half of the antenna mounting hole 122. The rain shield 123 reduces the possibility that the metal part at the connection between the antenna base and the antenna of the external transmitting antenna and the external receiving antenna mounted in the antenna mounting hole 122 is wet and corroded by falling rain.
Specifically, as shown in fig. 2 and fig. 6, the heat sink 4 includes a heat dissipating substrate 41 and a plurality of heat dissipating fins 42, the plurality of heat dissipating fins 42 are arranged on the front side of the heat dissipating substrate 41 at intervals in the left-right direction, the rear side of the heat dissipating substrate 41 is detachably connected to the heat dissipating panel 2, and the heat dissipating substrate 41 is thermally connected to the heat pipe 5. The radiating fins 42 are arranged on the radiating substrate 41 at intervals in the left-right direction, so that the radiating area of the radiator is increased, the fins are arranged in a vertically extending manner, the possibility that dust falls on the radiating fins 42 is reduced, the radiator is prevented from being covered by excessive dust, and the radiating performance of the radiator is ensured.
Specifically, as shown in fig. 1 to 3, an upper end of the back shell bottom plate 11 extends upward to form a mounting hanging plate 111, and the mounting hanging plate 111 is opened with a fixing hole 1111 along the front-back direction. The installation hanging plate 111 and the fixing hole 1111 are arranged to facilitate the installation of a fixing screw, and the optical module-based wireless signal amplification device formed by the heat exchange assembly for the optical module-based wireless signal amplification device can be easily installed on a fixing surface.
Specifically, as shown in fig. 2, the heat transfer pipes 5 are provided in plurality at intervals in the left-right direction. The plurality of heat conducting pipes 5 are arranged, so that the heat of the heat radiating mounting plate 3 can be transferred to the heat radiating fins 4 to be radiated, and the heat radiating performance of the heat exchange assembly for the wireless signal amplifying device based on the optical module is improved.
The above only be the preferred embodiment of the utility model discloses a not consequently restriction the utility model discloses a patent range, all are in the utility model discloses a conceive, utilize the equivalent structure transform of what the content was done in the description and the attached drawing, or direct/indirect application all is included in other relevant technical field the utility model discloses a patent protection within range.
Claims (9)
1. A heat exchange assembly for a wireless signal amplification device based on an optical module comprises a circuit board, and an external transmitting antenna and an external receiving antenna which are electrically connected with corresponding elements on the circuit board, and is characterized in that the heat exchange assembly for the wireless signal amplification device based on the optical module comprises:
the mounting back shell (1) comprises a back shell bottom plate (11) and a back shell side plate (12) formed by extending the periphery of the back shell bottom plate (11) forwards, wherein the back shell side plate (12) is used for mounting the external transmitting antenna and the external receiving antenna;
the heat dissipation panel (2) is detachably mounted on the front end face of the back shell side plate (12), and the heat dissipation panel (2) is connected with the front end face of the back shell side plate (12) in a sealing mode;
the heat dissipation mounting plate (3) is detachably connected to the rear side face of the heat dissipation panel (2) through a support column (31) and is arranged at intervals with the heat dissipation panel (2) in the front-back direction, and the rear side face of the heat dissipation mounting plate (3) is used for mounting the circuit board;
the radiating fin (4) is detachably arranged on the front side surface of the radiating panel (2);
and one end of the heat conduction pipe (5) is in thermal conduction connection with the front side face of the heat dissipation mounting plate (3), and the other end of the heat conduction pipe is in thermal conduction connection with the heat dissipation fins (4) after the heat dissipation panel (2) penetrates out.
2. The heat exchange module for a wireless signal amplification device based on an optical module according to claim 1, wherein one end of the heat pipe (5) thermally conductively connected to the heat sink (4) is disposed above one end of the heat pipe (5) thermally conductively connected to the front side of the heat radiation mounting plate (3).
3. The heat exchange module for an optical module-based wireless signal amplifying device as claimed in claim 1, wherein the rear side of the heat-dissipating mounting plate (3) is provided with a heat-conducting silicone grease receiving groove (32) at a position where the circuit board is mounted, and the heat-conducting silicone grease receiving groove (32) is used for filling heat-conducting silicone grease thermally connected with the circuit board.
4. The heat exchange assembly for the wireless signal amplifying device based on the optical module as claimed in claim 1, wherein a sealing skirt plate (121) is formed by extending the periphery of the front end of the back shell side plate (12) inwards, an annular sealing groove (21) is formed in the heat dissipation panel (2) at a position corresponding to the sealing skirt plate (121), a sealing rubber ring is embedded in the annular sealing groove (21), and the sealing rubber ring is matched with the sealing skirt plate (121) to realize the sealing connection between the heat dissipation panel (2) and the front end face of the back shell side plate (12).
5. The heat exchange assembly for the wireless signal amplifying device based on the optical module as claimed in claim 1, wherein the left and right sides of the back shell side plate (12) are respectively opened with an antenna mounting hole (122), and the two antenna mounting holes (122) are respectively used for mounting the external transmitting antenna and the external receiving antenna.
6. The heat exchange module for a wireless signal amplifying device based on a light module as claimed in claim 5, wherein a rain shield (123) is formed at the outer circumference of both of the antenna mounting holes (122) to be protruded outwardly along the upper half portion.
7. The heat exchange module for a wireless signal amplifying device based on an optical module as claimed in claim 1, wherein the heat sink (4) includes a heat dissipating substrate (41) and a plurality of heat dissipating fins (42), the plurality of heat dissipating fins (42) are disposed at intervals in a left-right direction on a front side surface of the heat dissipating substrate (41), a rear side surface of the heat dissipating substrate (41) is detachably connected to the heat dissipating panel (2), and the heat dissipating substrate (41) is thermally connected to the heat pipe (5).
8. The heat exchange module for a wireless signal amplifying device based on an optical module as claimed in claim 1, wherein the upper end of the back case bottom plate (11) extends upward to form a mounting hanging plate (111), and the mounting hanging plate (111) is opened with a fixing hole (1111) along a front-back direction.
9. The heat exchange module for a light module-based wireless signal amplification apparatus as set forth in any one of claims 1 to 8, wherein the heat conductive pipe (5) is provided in plurality at intervals in a left-right direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921187590.8U CN209897201U (en) | 2019-07-26 | 2019-07-26 | Optical module-based heat exchange assembly for wireless signal amplification device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921187590.8U CN209897201U (en) | 2019-07-26 | 2019-07-26 | Optical module-based heat exchange assembly for wireless signal amplification device |
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| Publication Number | Publication Date |
|---|---|
| CN209897201U true CN209897201U (en) | 2020-01-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921187590.8U Active CN209897201U (en) | 2019-07-26 | 2019-07-26 | Optical module-based heat exchange assembly for wireless signal amplification device |
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| Country | Link |
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| CN (1) | CN209897201U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113766678A (en) * | 2021-09-07 | 2021-12-07 | 陕西智引科技有限公司 | UWB base station with intrinsic safety type fusion WIFI6 |
| CN115175537A (en) * | 2022-08-08 | 2022-10-11 | 中车南京浦镇车辆有限公司 | No fan heat pipe heat conduction device of 3U electronic equipment for railway locomotive |
-
2019
- 2019-07-26 CN CN201921187590.8U patent/CN209897201U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113766678A (en) * | 2021-09-07 | 2021-12-07 | 陕西智引科技有限公司 | UWB base station with intrinsic safety type fusion WIFI6 |
| CN113766678B (en) * | 2021-09-07 | 2024-04-26 | 陕西智引科技有限公司 | UWB base station of intrinsic safety type fusion WIFI6 |
| CN115175537A (en) * | 2022-08-08 | 2022-10-11 | 中车南京浦镇车辆有限公司 | No fan heat pipe heat conduction device of 3U electronic equipment for railway locomotive |
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