CN201709079U

CN201709079U - Shielding heat dissipation structure

Info

Publication number: CN201709079U
Application number: CN201020206070XU
Authority: CN
Inventors: 安慎华; 陈纪颖; 吴波; 林昌玮
Original assignee: TCL Corp; Shenzhen TCL New Technology Co Ltd
Current assignee: TCL Corp; Shenzhen TCL New Technology Co Ltd
Priority date: 2010-05-26
Filing date: 2010-05-26
Publication date: 2011-01-12
Anticipated expiration: 2020-05-26

Abstract

The utility model provides a shielding heat dissipation structure, which comprises a shielding box arranged outside an electronic device. A heat dissipating system arranged on the shielding box comprises a heat dissipating sheet, a rib sheet is arranged on the heat dissipating sheet, the shielding box comprises a shielding hood, and the heat dissipating sheet is connected together with the shielding hood. Compared with the prior art, the shielding heat dissipation structure can be applied to a device which is higher in EMC radiation and temperature rise and needs to rely on a shielding box for grounding by the aid of the shielding box and the structure of the heat dissipating system, and has the advantages of more effective radiation prevention function, fine heat dissipation assisting performance and high reliability.

Description

The shielding radiator structure

Technical field

The utility model relates to the electronic devices field, especially relates to electronic devices shielding and heat radiation field.

Background technology

Along with development of integrated circuits, the miniaturization of circuit and the demand of slimming have caused the trend that the product heat density increases, the problem that exists electromagnetic radiation to exceed standard simultaneously.When having heat dissipation problem, the device that has the EMC intense radiation again, traditional method is to adopt heat conductive silica gel and shielding box that heat is guided on shielding box and the PCB pad from device surface, but this kind method can reach shield effectiveness be very limited to the effect of heat radiation, often use temperature rise later on still very high, directly have influence on device lifetime and product reliability; If all be changed to fin, the EMC radiation test be difficult to again by, influence product by the authentication.

The utility model content

For solving the problems of the technologies described above, the technical solution of the utility model is: a kind of shielding radiator structure is provided, comprises the shielding box that is arranged at the electronic device outside, wherein: described shielding box is provided with cooling system, this cooling system comprises fin, and this fin is provided with fin; Described shielding box comprises a radome, and described fin and this radome link together.

Compared with prior art, the utility model can make the EMC radiation stronger by shielding box and cooling system structure, and must rely on shielding box ground connection but the higher device of temperature rise, and this structure has stronger radiation proof function, helps thermal diffusivity good, and its reliability is also high.

Description of drawings

Fig. 1 is the heat radiation shielding construction floor map of the utility model first embodiment.

Fig. 2 is the cross section structure schematic diagram of Fig. 1 among the utility model first embodiment.

Fig. 3 is that the fin cross section structure signal of Fig. 1 in the utility model first example example is thought.

Fig. 4 is the heat radiation shielding construction floor map of the utility model second embodiment.

Fig. 5 is that the cross section structure of Fig. 4 of the utility model second enforcement shows schematic diagram.

Embodiment

In order to make the purpose of this utility model, technical scheme and advantage clearer,, the utility model is further elaborated below in conjunction with drawings and Examples.Should be appreciated that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.

See also Fig. 1-shown in Figure 5, the utility model embodiment provides a kind of shielding radiator structure, comprises the shielding box 1 that is arranged at the electronic device outside, and this shielding box 1 is provided with cooling system, this cooling system comprises fin 2, and this fin 2 is provided with fin 21; Described shielding box 1 comprises a radome 11, and described fin 2 links together with this radome 11.Described shielding box 1 is provided with louvre 12, and this louvre 12 is arranged at the both sides or the surface of shielding box 1, and its effect is to cooperate cooling system 2 heat radiations, and simultaneously, this shielding box 1 also can use separately, as the function of shielding EMC radiation.The radome 11 of present embodiment is to fixedly connected by screw with fin 2, also can be undertaken fixedly connectedly by riveted way, can coat heat radiation oil between radome 11 and the fin 2, strengthens the effect of heat conduction.

The described electronic device of the utility model embodiment is to be arranged on the parts such as PCB, described shielding box 1 covers at this electronic device outside, this electronic device produces heat when work, be provided with the heat-conducting medium layer between described electronic device and the shielding box 1, it decides the heat-conducting medium layer according to the distance between electronic device and the shielding box 1, generally the employing thermal conductive silicon glue-line that distance is big is as middle heat transfer medium, but coat heat radiation oil on the little between contact-making surface of distance, or select the material of other high thermal conductivity coefficients for use.

As shown in Figure 1-Figure 3, it is first embodiment of the present utility model, described shielding box 1 is provided with pedestal 13, also be provided with depressed part 14 on this shielding box 1, as shown in Figure 3, this depressed part 14 is one-body molded with shielding box, and described fin 2 is arranged in this depressed part 14, and the shape of fin 2 can be according to the shape die sinking of depressed part 14.The direction of fin 21 is vertical with pedestal 13 on the described fin 2, height increase along with fin 21, the heat of electronic device is easier to diffuse to space on every side by fin 21, to reach the effect of heat radiation, it takes up room can be very not big, can contain the shielding box 1 saving space of depressed part 14 for the centre.The heat radiation shielding construction of present embodiment is that the louvre on both sides and surface dispels the heat on fin 21 and the shielding box 1 that utilizes on the fin 2, and this structure mainly is applicable to the shielding box not high to thickness requirement.

See also Fig. 4-shown in Figure 5, it is second embodiment of the present utility model, repeats no more with the first enforcement same section among this embodiment, and fin 2 radomes 11 direct and on the shielding box 1 of present embodiment are connected, surface both fully contacts, and can reduce the ground impedance and connect to separate thermal resistance.The direction of the fin 21 on the fin 21 is parallel with pedestal 13, and this fin 21 has two at least, and the louvre 12 on the described shielding box just is arranged between two fins 21, strengthens heat exchange and convection current.But 21 4 of described fins, eight etc., get final product according to the size and the demand design of shielding box 1 by six.Present embodiment is to dispel the heat by louvre on the shielding box 1 12 and fin 21, heat is that the longitudinal direction of the fin 21 from the fin 2 is walked, therefore, such heat radiation shielding construction is applicable to vertical installation of movement and the little situation of spatial dimension on the pcb board, be used for ultra-thin type more, and shielding box still can use separately as shielding box after breaking away from fin.Electronic device in the present embodiment, heat-conducting medium needs large tracts of land fully to contact between shielding box 1 and the fin 2, can improve the contact pressure between the interface, thereby can reduce contact heat resistance, helps reducing the impedance of shielding box ground again and is convenient to the radiation rectification.

Among the above embodiment, the thickness of fin 21, spacing, highly, geometric parameter such as shape decides on concrete space structure.

When design, can be according to the thermal resistance formula

Should increase cooling surface area A during design as far as possible, material thermal conductivity K, thus reduce entire thermal resistance R.If for the less environment of spatial dimension, the heat conduction role is bigger, and thermal convection and thermal radiation role therein are less.

The size of the louvre 12 among the utility model embodiment can not be excessive, and louvre 12 diameters require on heat radiation and the radiation source wavelength is decided, diameter can not with the comparable prerequisite of wavelength under get higher value.The radiator performance aspect also will be optimized, and except fully contacting with shielding box 1, also will reach little, the lightweight effect of thermal resistance by optimizing geometric parameter.

In actual the use, the EMC performance of this heat radiation shielding box 1 is equal to the shielding box that does not use fin, and radiating effect be improved significantly.The above only is a preferred embodiments of the present utility model; not in order to restriction the utility model; all within spirit of the present utility model and principle, any modification of being made, be equal to replacement, improvement etc., all should be included within the protection range of the present utility model.For example each component locations of radiator in the utility model, highly, shape, size and the sinking degree of radome pit, selection of Heat Conduction Material etc. can adopt adjustable mode.Fixing and connected mode and louvre position of opening between the thermal component are also decided according to actual conditions.

Claims

1. a shielding radiator structure comprises the shielding box that is arranged at the electronic device outside, and it is characterized in that: described shielding box is provided with cooling system, and this cooling system comprises fin, and this fin is provided with fin; Described shielding box comprises a radome, and described fin and this radome link together.

2. shielding radiator structure according to claim 1 is characterized in that: described shielding box is provided with louvre, and this louvre is arranged at the both sides and the surface of shielding box.

3. shielding radiator structure according to claim 1 and 2 is characterized in that: described cooling system also comprises the heat-conducting medium layer, and this heat-conducting medium layer is arranged between electronic device and the shielding box.

4. shielding radiator structure according to claim 2 is characterized in that: described shielding box comprises a pedestal, and the direction of described fin is parallel with this pedestal.

5. shielding radiator structure according to claim 2 is characterized in that: described shielding box comprises a pedestal, and the direction of described fin is vertical with pedestal.

6. shielding radiator structure according to claim 4 is characterized in that: at least two of described fins, louvre is arranged between the fin.

7. shielding radiator structure according to claim 5 is characterized in that: described shielding box comprises a depressed part, and described fin is arranged in this depressed part.