CN211128733U

CN211128733U - Heat abstractor and customer premises equipment

Info

Publication number: CN211128733U
Application number: CN201921637589.0U
Authority: CN
Inventors: 曾宪顺; 罗森; 胡卫峰
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2019-09-26
Filing date: 2019-09-26
Publication date: 2020-07-28
Anticipated expiration: 2029-09-26

Abstract

The application relates to heat abstractor and customer premises equipment, customer premises equipment include bottom open-ended shell, and heat abstractor includes heat conduction structure and radiator, and the radiator is installed in the shell and is located the opening position, heat conduction structure include fixed connection's bottom plate and mounting panel, bottom plate fixed connection to the radiator, the mounting panel is followed the inside that the shell was stretched into to the opening part, the mounting panel is arranged in installing the piece that generates heat in the customer premises equipment to be used for the heat energy conduction to the bottom plate that will generate heat the piece, the bottom plate with heat energy conduction extremely the radiator. This application has effectively reduced the heat conduction thermal resistance in the customer premises equipment through design heat conduction structure and radiator, has shortened the heat conduction route, has promoted the heat exchange efficiency of radiator, can realize dispelling the heat to the radiator with the heat conduction that the piece that generates heat produced fast.

Description

Heat abstractor and customer premises equipment

Technical Field

The application relates to the technical field of heat dissipation, in particular to a heat dissipation device of customer premises equipment.

Background

Customer Premises Equipment (CPE) has the characteristics of small volume, light weight, good environmental integration and the like, and is widely applied.

The chip is an important component of a CPE product, and due to the high signal processing speed, the chip generates a large amount of heat, and if the heat cannot be dissipated in time, the performance of the chip is affected, and the service life of the chip is shortened. At present, a heating element chip is usually contacted with a shielding cover through a heat conducting pad, heat is transferred to the shielding cover, the shielding cover is connected with a metal radiator below through an insulating film or an insulating heat conducting pad, and the heat is transferred to the radiator through the shielding cover for heat dissipation.

The existing heat dissipation device has the advantages of long heat conduction path and small heat dissipation contact area, and the shielding cover made of a stainless steel/nickel cupronickel material is low in heat conductivity, so that the whole heat dissipation efficiency of the device is low and the heat dissipation effect is not ideal.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a heat abstractor and customer premises equipment, through design unique heat conduction structure and radiator, has effectively reduced the interior heat conduction thermal resistance of CPE module, has promoted the heat exchange efficiency of radiator.

In a first aspect, the present embodiment provides a heat dissipation apparatus, which is applied to customer premises equipment, where the customer premises equipment includes a housing with an opening at a bottom end, the heat dissipation apparatus includes a heat conducting structure and a heat sink, the heat sink is installed in the housing and located at the opening position, the heat conducting structure includes a bottom plate and an installation plate, the bottom plate is fixedly connected to the heat sink, the installation plate extends into the housing from the opening position, the installation plate is used for installing a heating element in the customer premises equipment and conducting heat energy of the heating element to the bottom plate, and the bottom plate conducts the heat energy to the heat sink.

This application is through designing heat conduction structure for the piece that generates heat is left right structure distribution in heat conduction structure mounting panel both sides, and the heating element accessible heat conduction material on the piece that generates heat is connected with heat conduction structure, and the heat is conducted to the below radiator by heat conduction structure. The design of the heat conduction structure shortens a heat conduction path, reduces heat conduction resistance, increases the heat dissipation contact area and is beneficial to improving the heat dissipation efficiency.

The radiator base plate of this application design is last, and the pick is located the bottom surface and the direction of base plate and downwards, and the radiator dispels the heat of heat conduction structure conduction, reduces the piece and the internal environment temperature that generate heat, and the life of the extension piece that generates heat is favorable to the high-efficient operation of equipment.

In one embodiment, the mounting plate is attached upright to a central region of the top surface of the base plate and the heat sink is attached to the bottom surface of the base plate. The mounting plate of the heat conduction structure is positioned in the central area of the bottom plate, so that the balance and stability of the heat conduction structure are facilitated. The radiator is located the below of heat conduction structure bottom plate, specifically, and the top surface of radiator base plate is connected with the bottom surface of heat conduction structure bottom plate, and the heat energy that generates heat the piece and produce conducts to the bottom plate through the mounting panel, and the bottom plate is with heat energy conduction to the radiator and dispel the heat.

In one embodiment, the mounting plate is provided with auxiliary heat dissipation fins; and/or the heat dissipation device further comprises an auxiliary heat radiator which is interconnected with the mounting plate and jointly surrounds the heat generating member. The supplementary heat dissipation pick that sets up on the mounting panel can realize in the heat conduction in-process of the piece that generates heat, carries out supplementary heat dissipation to the heat of conduction to the mounting panel, and the heat that conducts to the mounting panel promptly partly dispels the heat through supplementary heat dissipation pick, and another part conducts and dispels the heat to the radiator below, improves the radiating efficiency. The auxiliary radiator and the mounting panel are interconnected to form a closed structure to surround the heating element together, the heat generated by the heating element can be conducted to the auxiliary radiator through a heat conduction material to dissipate heat, meanwhile, the closed structure formed by the auxiliary radiator and the mounting panel has a shielding function, the performance of the heating element is guaranteed, the shielding effect is achieved, and the influence of external signals on an internal circuit and the outward radiation of signals generated inside are avoided.

In one embodiment, the heat sink comprises a substrate and a tooth plate, the tooth plate is arranged on the bottom surface of the substrate, the top surface of the substrate faces and is connected to the bottom surface of the heat conducting structure, the surface of the tooth plate, which faces away from the substrate, is the bottom surface of the tooth plate, the surface connected between the bottom surface of the tooth plate and the edge of the substrate is the side surface of the tooth plate, the side surface of the tooth plate faces the inner surface of the shell, the heat sink is provided with an air duct, the air duct forms an air opening on the bottom surface of the tooth plate and the side surface of the tooth plate, and the air opening on the side surface of the tooth plate is opposite to the through hole on. The tooth piece is located the base plate bottom surface, and the base plate is last promptly, and the tooth piece is under, is favorable to the heat convection of hot and cold air, and the radiator is equipped with the ventiduct for heat and outside air's exchange ventilates, improves the radiating efficiency.

In one embodiment, the tooth plate comprises a central tooth region and an edge tooth region, the edge tooth region surrounding the central tooth region, and the ventilation duct is disposed in the edge tooth region. The edge tooth area is located at the edge of the substrate, the edge tooth area can be provided with an air duct, and the air duct and the side face of the tooth piece form an air port for heat dissipation.

In one embodiment, the arrangement direction of the plurality of sheets in the middle tooth zone is a first direction, the arrangement direction of the plurality of sheets in the edge tooth zone is a second direction, and the first direction and the second direction are different.

In one embodiment, each of the sheets in the middle tooth region extends in a direction perpendicular to the base plate, and each of the sheets in the edge tooth region extends in a direction from the middle tooth region toward the tooth flank.

In one embodiment, the edge tooth region comprises at least two layers of sheets, wherein at least one layer of the sheets is provided with a channel communicated with the ventilation channel, so that heat can enter the ventilation channel through the channel to be dissipated.

In one embodiment, the fins comprise a plurality of fins, adjacent fins forming channels therebetween, the channels opening towards the sides of the fins at the sides of the fins so that wind around the heat sink can enter the channels.

In one embodiment, the area of the bottom surface of the tooth plate is smaller than that of the substrate, and the side surface of the tooth plate extends in a step shape, so that the whole radiator is in a multilayer structure, and the multilayer structure of the radiator can increase a radiating path and improve radiating efficiency.

In a second aspect, the present application provides a customer premises equipment, including omnidirectional antenna, directional antenna, connector and any preceding embodiment heat abstractor, it includes veneer and heating element to generate heat a piece, the veneer is located heat conduction structure both sides, heating element fixes on the veneer, omnidirectional antenna is located heat conduction structure top, omnidirectional antenna fixed connection be in the shell internal surface, omnidirectional antenna with the veneer is connected, directional antenna is located heat conduction structure both sides, directional antenna fixed connection be in the shell internal surface, directional antenna with veneer fixed connection, the connector is in the shell and be located the opening position, connector fixed connection to the veneer. This application has shortened the conduction route through setting up heat conduction structure and radiator, has increased heat dissipation area of contact, has reduced heat-conduction thermal resistance, is favorable to realizing fast heat dissipation, guarantees the high-efficient operation of equipment.

Drawings

Some drawings to which embodiments of the present application relate will be described below.

Figure 1 is a schematic view of a customer premises equipment float module;

FIG. 2 is a schematic view of a heat dissipation device;

FIG. 3 is a schematic perspective view of the interior of the heat dissipation device;

FIG. 4 is a schematic view of a heat conducting structure, a shielding structure on two sides, and an auxiliary heat dissipation structure;

FIG. 5 is a schematic view of a heat sink configuration;

FIG. 6 is a schematic view of a first tooth pattern of a heat sink fin;

FIG. 7 is a second tooth pattern schematic of a heat sink tooth plate;

FIG. 8 is a schematic view of a multi-layer design of a tuyere;

FIG. 9 is a schematic diagram of a heat conduction path of a heat generating component on the side close to the heat conducting structure;

fig. 10 is a schematic view of a heat conduction path of a heat generating element on the side of the near shield cover.

Detailed Description

In order to more clearly illustrate the technical solutions in the embodiments or the background art of the present application, the drawings required to be used in the embodiments or the background art of the present application will be described below.

The heat dissipation device of the embodiment of the application can be used for customer premises equipment. As shown in fig. 1, fig. 1 is a schematic diagram of a customer premises equipment floating module. Customer premises equipment 1 includes shell 10, and heat conduction structure (not shown, see fig. 2) and radiator 50 inside shell 10, and shell 10 bottom opening, radiator 50 are located the inside of shell 10 of customer premises equipment 1 for exchange the heat of conducting to the bottom with outside air convection, realize the heat dissipation, effectively reduce the temperature of customer premises equipment 1 internal environment, promote the high-efficient operation of customer premises equipment.

As shown in fig. 2, 3 and 4, a specific customer premises equipment 1 includes a housing 10, a heat-conducting structure 20, a shielding cover 30, an auxiliary heat sink 40, a heat sink 50, an omnidirectional antenna 60, a directional antenna 70, a connector 80, a fixed terminal 601 fixing the omnidirectional antenna 60 to the housing 10, a fixed terminal 701 fixing the directional antenna 70 to the housing 10, and a metal-free region 602 in the middle of the omnidirectional antenna 60. The housing 10 defines a cavity for receiving the internal components such as the antenna and heat sink. The housing 10 may be cylindrical, rectangular parallelepiped or other shape. Due to the radio frequency performance requirements of the antenna, the housing 10 needs to be made of plastic or other non-metallic materials.

In one embodiment, the overlapping portion of the housing 10 and the heat sink 50 is vented and completely exposed, which effectively increases the outflow of hot air and facilitates rapid heat dissipation. The hole shape includes but is not limited to round hole, square hole, arc hole, etc. in order to ensure ventilation and reduce the amount of rain water invading into the shell, a grid-shaped hole in a horizontal strip shape can be adopted.

In one embodiment, a fixed terminal is provided on the housing 10, the omnidirectional antenna 60 is fixed inside the housing 10 by the fixed terminal 601, the directional antenna 70 is fixed on the housing 10 by the fixed terminal 701, the fixed terminal 601 and the fixed terminal 701 may be connected to the antenna by crimping or welding, or the omnidirectional antenna and the directional antenna may be fixed inside the housing 10 by other fixing structures.

In one embodiment, the omnidirectional antenna 60 is connected to the board 2032 through the antenna connection 603, and the omnidirectional antenna 60 may also be connected to the board 2031 through the antenna connection. The directional antenna 70 is connected to the single board 2032 through an antenna connection line 702, and the directional antenna 70 may also be connected to the single board 2031 through an antenna connection line.

In one embodiment, the metal-free region 602 is a clearance area between the two sides of the omnidirectional antenna, and the metal-free region 602 cannot have metal parts but can be configured with a non-metal structure such as plastic as required in order not to affect the antenna to process signals.

In one embodiment, a through hole is formed in the bottom 2011 of the heat conducting structure 20, and the cable at the upper end of the connector 80 sequentially passes through the through hole of the heat sink 50 and the through hole in the bottom 2011 of the heat conducting structure 20 and is connected to the single board 2032 through a plug (not shown). The connector 80 and the single board 2032 may be connected by other structures besides the cable, and the connection method is not limited to the plugging portion, and may also be other fixed connection methods.

The heat conducting structure 20 includes a bottom plate 2011 and a mounting plate 2012 which are fixedly connected, in a specific application environment, the bottom plate 2011 can be horizontally placed, the mounting plate 2012 is vertically connected above the bottom plate 2011, and the mounting plate 2012 and the bottom plate 2011 can be mutually perpendicular to each other to form an inverted "T" shaped structure, or can be obliquely arranged at a certain angle. The heat conducting structure 20 is provided with heat generating components 203 on two sides, the left heat generating component 203 includes a single board 2031 and heat generating components 202 on the single board 2031, and the right heat generating component 203 includes a single board 2032 and heat generating components 202 fixed on the single board 2032. The single board 2031 and the single board 2032 are based on the heat conducting structure 20 and are distributed on the left and right sides of the heat conducting structure 20 in a left-right structure, and each of the single board 2031 and the single board 2032 has a side surface contacting the mounting plate 2012 of the heat conducting structure 20, thereby increasing the heat dissipation contact area. The heat generated by the heating elements 202 on the

single plates

2031 and 2032 is directly conducted to the lower heat sink 50 by the heat conducting structure 20, so as to perform convection heat exchange of the cold air and the hot air. The design of the heat conducting structure 20 simplifies the structure of the heat dissipating device, saves the internal space of the equipment, and because the heat can be directly conducted to the inverted radiator 50 below by the heat conducting structure 20 to dissipate heat, the heat conducting path is shortened, the heat conducting thermal resistance is reduced, and meanwhile, because the single plate 2031 and the single plate 2032 both have a side surface in contact with the heat conducting structure 20, the heat dissipating contact area is increased, and the heat dissipating device is favorable for rapid and efficient heat dissipation.

In one embodiment, the mounting plate 2012 stands upright on the central region of the bottom plate 2011 to facilitate the balance and stability of the heat conducting structure 20.

In one embodiment, the heat generating component 202 may be a chip or other electronic component that generates heat. The heat generated by the heating element 202 during operation is conducted to the heat sink 50 through the heat conducting structure 20, and the heat sink 50 exchanges the heat conducted by the heat conducting structure 20 with the outside air efficiently through heat convection with the outside air, so that the temperature of the heating element 202 and the internal environment of the device is reduced, and the heating element 202 can be allowed to operate under higher specification and higher power.

In one embodiment, the heat generating element 202 may be located only on the side of the

single boards

2031 and 2032 near the heat conducting structure or the heat generating element 202 may be located only on the side of the

single boards

2031 and 2032 near the shielding cover.

In one embodiment, the board 2031 mainly processes data signals and has no rf function, the board 2032 mainly processes analog signals and has an rf function, or only one board may be provided according to actual situations, and processes data signals and analog signals at the same time, and is located on any side of the heat conducting structure 20.

In one embodiment, the

boards

2031 and 2032 may be PCB (Printed circuit board) boards, which are substrates for fixing heat generating elements such as chips.

In one embodiment, the heat conducting structure 20 is mainly used for conducting the heat generated by the heat generating element 202 to the heat sink 50, and therefore, the heat conducting structure 20 needs to have excellent heat conductivity, and a metal material with good heat conductivity, such as a die-cast aluminum material or other heat conducting materials, can be used.

As shown in fig. 4, fig. 4 is a schematic diagram of the shielding structure and the auxiliary heat dissipation structure on two sides of the heat conducting structure 20, and mainly includes the heat conducting structure 20, the shielding covers 30 on two sides, and the auxiliary heat sink 40. The heat generating components 203 are distributed on two sides of the heat conducting structure 20, the right heat generating component 203 includes a single board 2032 and a heat generating element 202 fixed to the single board 2032, the left heat generating component 203 includes a single board 2031 and a heat generating element 202 fixed to the single board 2031, and the heat generating elements 202 are fixed on the left and right sides (near the heat conducting structure 20 side and near the shielding cover 30 side) of the single board 2031 and the single board 2032.

The shielding cover 30 covers the heating element 202 to achieve shielding effect, and the shielding cover 30 can ensure the radio frequency performance of the heating element 202. The shielding cover 30 includes a first substrate 301, a second substrate 302 and a third substrate 303, which are horizontally and oppositely disposed, wherein one end of the first substrate 301 and one end of the second substrate 302 are fixedly connected to the mounting plate 2012 of the heat conducting structure 20, and the other end of the first substrate 301 and the other end of the second substrate 302 and the third substrate 303 form a closed structure, so as to wrap the heat generating element 202 in the closed structure. The shielding covers 30 are respectively disposed on the left and right sides of the mounting plate 2012 of the heat conducting structure 20 for shielding the heating elements 202 on the two sides.

The auxiliary heat sink 40 may be provided with a plurality of auxiliary heat dissipating fins 401 by providing the auxiliary heat dissipating fins 401 on the third substrate 303 of the shield cover 30. In other words, the third substrate 303 of the shielding cover 30 is also the substrate of the auxiliary heat sink 40, and the auxiliary heat sink 40 can be formed by adding the auxiliary heat dissipation fins 401 to the third substrate 303 of the shielding cover 30. In one embodiment, the auxiliary heat sink 40 may diffuse heat around, so as to effectively optimize heat dissipation of the heating elements 202 on the

single boards

2031 and 2032, improve the overall heat dissipation efficiency of the heat dissipation apparatus, and reduce the temperature of the internal environment. The auxiliary heat sink 40 may be made of die-cast aluminum or other material with good thermal conductivity.

In one embodiment, the upper and lower ends of the third substrate 303 of the left shielding cover 30 are respectively provided with a through hole, the upper and lower ends of the board 2031 are respectively provided with a through hole, the upper screw 901 sequentially passes through the through hole on the upper side of the third substrate 303 of the shielding cover 30 and the through hole on the upper side of the board 2031 and is fixedly connected to the mounting plate 2012 of the heat conducting structure 20, and the lower screw 901 sequentially passes through the through hole on the lower side of the third substrate 303 of the shielding cover 30 and the through hole on the lower side of the board 2031 and is fixedly connected to the mounting plate 2012 of the heat. The shielding cover 30 and the mounting plate 2012 of the heat conducting structure 20 may be tightly fixed by screws, or may be fixedly connected by bolts, snaps, or other fixing methods. The fixing manner of the shield cover 2032 on the board 30 is the same as that of the shield cover 2031 on the board, and details thereof are not repeated here. The shielding cover 30 ensures the radio frequency performance of the heating element, realizes shielding function, and avoids the influence of external signals on internal circuits and the outward radiation of signals generated inside.

In one embodiment, since die-cast aluminum has good thermal conductivity, the shielding cover 30 made of die-cast aluminum material can reduce thermal resistance during heat conduction, improve heat conduction efficiency, and effectively conduct heat while achieving shielding effect. The shielding cover 30 may be made of other materials with good shielding and heat conducting functions besides die-cast aluminum.

In an embodiment, the mounting plate 2012 of the heat conducting structure 20 may further include an auxiliary heat dissipation tooth 206, and when heat is conducted from the heating element 202 to the mounting plate 2012 of the heat conducting structure 20, the auxiliary heat dissipation tooth 206 can perform auxiliary heat dissipation, and the auxiliary heat dissipation tooth 206 can effectively optimize heat dissipation on the heat conducting structure 20 during the heat conduction process, which is beneficial to improving heat dissipation efficiency.

In one embodiment, bosses 2051 are provided on both left and right sides of the mounting plate 2012 of the heat conducting structure 20, and bosses 2052 are also provided on the shielding cover 30 near the heating element 202. The bosses may be of a metallic material such as die cast aluminum or other material having good thermal conductivity.

In one embodiment, a heat conductive material 201 is disposed between the heat generating element 202 and the heat conductive structure 20 and the shielding cover 30. In other words, the heat generating elements 202 on the sides of the

single boards

2031 and 2032 close to the heat conducting structure 20 are in contact with the bosses 2051 on the heat conducting structure 20 through the heat conducting materials 201, and the heat generating elements 202 on the sides of the

single boards

2031 and 2032 close to the shielding cover 30 are in contact with the bosses 2052 on the shielding cover 30 through the heat conducting materials 201, that is, the heat conducting materials 201 are located between the heat generating elements 202 and the bosses. Since the boss is made of metal material, the heating element 202 cannot be in direct contact with the metal boss, so that the non-metal heat conduction material 201 is needed between the heating element 202 and the boss to play a role in buffering. The heat conductive material 201 includes a heat conductive pad, a heat conductive film, gel, a silicone sheet, a plastic sheet, and the like. The heat generated by the heat generating component 202 can be effectively conducted to the heat sink 50 for heat dissipation.

The heat conducting structure 20 optimizes the relative position of the internal structural components, reduces the heat conducting path, increases the heat dissipation contact area, saves the internal space, can adopt a die-casting aluminum shielding cover due to the allowance of the space, greatly reduces the heat resistance of the heating element 202 in the process of conducting heat to the radiator 50, reduces the temperature of the internal environment of the equipment, and is beneficial to the efficient operation of the heating element 202.

As shown in fig. 2 and 5, the heat sink 50 is located below the heat conductive structure 20 and is fixedly attached to the bottom surface of the bottom plate 2011 of the heat conductive structure 20. The heat sink 50 includes a substrate 501 and a tooth 507, the tooth 507 includes a central tooth region 502 and an edge tooth region 503, and the area of the bottom surface of the tooth 507 is smaller than that of the substrate 501, so that the heat sink 50 is a multi-layer structure as a whole. The central toothed region 502 and the edge toothed region 503 each have a plurality of platelets 508. The substrate 501 is located above and is in contact with the bottom 2011 of the heat conducting structure 20 through the heat conducting insulating material 204. The central toothed region 502 is located on the bottom surface of the substrate 501, and a channel 509 is formed between two adjacent sheets of the central toothed region 502, and cooling air enters through the channel 509. The lamina 508 of the central toothed region 502 may be provided in a plurality as desired and in a spatial configuration. The edge toothed region 503 surrounds the central toothed region 502, the edge toothed region 503 is provided with an air duct 504, the air duct 504 and the toothed plate form an air opening 510, and the air opening 510 is opposite to the through hole on the housing 10 and is used for exchanging hot and cold air. The hot air 903 is discharged through the air opening, and the cold air 904 enters through the air opening, so that the convection heat dissipation of the cold air and the hot air is realized, the heat conducted to the heat sink 50 is discharged, and the internal environment temperature of the equipment is reduced. The main function of the heat sink 50 is to exchange heat with the outside air in a convection manner, and the heat sink 50 and the housing 10 need to satisfy the requirement of safe creepage distance, so that the heat sink 50 cannot be completely exposed. The design of the air opening 510 of the heat sink 50 increases the heat dissipation area, and meanwhile, the channel is arranged between two adjacent sheets 508 of the central tooth area 502, so that the air flow is accelerated, and the heat dissipation efficiency of the heat sink 50 is greatly improved. The heat convection efficiency of the high-efficiency radiator 50 is improved, heat conducted by the heat conduction structure 20 is efficiently exchanged with outside air, the temperature of the internal environment is reduced, and the heating element can be allowed to work under higher specification and higher transmitting power.

In one embodiment, the substrate 501 of the heat sink 50 is connected to the bottom plate 2011 of the heat conducting structure 20 through the heat conducting and insulating material 204, and the main function of the heat conducting and insulating material 204 is to insulate the heat generating element 203 from external structural components, reduce thermal contact resistance, and conduct heat conducted to the heat conducting structure 20 to the heat sink 50 below for heat dissipation. The heat conductive insulating material 204 includes insulating materials such as a heat conductive pad, a heat conductive film, gel, a silicone sheet, and a plastic sheet. Specifically, the thermal pad has good viscosity, flexibility, good compression performance, and good thermal conductivity, and can enhance contact with the bottom plate 2011 of the upper thermal conductive structure 20 and the substrate 501 of the lower heat sink 50 by virtue of its own viscosity. By performing the roughness treatment on the silicone sheet, the surface friction between the silicone sheet and the bottom plate 2011 of the upper heat conducting structure 20 and the substrate 501 of the lower heat sink 50 can be increased, and the contact strength can also be enhanced.

In one embodiment, the air opening formed by the central toothed region 502 of the heat sink 50 is lower than the air opening formed by the edge toothed region 503, specifically, hot air is emitted from the upper air opening, and cold air is introduced from the lower air opening, which facilitates rapid heat convection of the hot air and the cold air.

In one embodiment, the heat sink 50 is fixed to the bottom plate 2011 of the heat conducting structure 20 by an insulating screw, so as to prevent lightning from breaking through the heat sink. Specifically, the left and right sides of the bottom plate 2011 of the heat conducting structure 20 are respectively provided with a through hole, the left and right sides of the heat conducting insulating material 204 are respectively provided with a through hole at corresponding positions, the left insulating screw 506 sequentially passes through the left through hole of the bottom plate 2011 of the heat conducting structure 20 and the left through hole of the heat conducting insulating material 204 and is fixedly connected to the substrate 501 of the heat sink 50, and the right insulating screw 506 sequentially passes through the right through hole of the bottom plate 2011 of the heat conducting structure 20 and the right through hole of the heat conducting insulating material 204 and is fixed to the substrate 501 of the heat sink. The heat sink 50 and the heat conducting structure 20 may also be fixedly connected by bolts or other fixing structures.

In one embodiment, when the diameter of the air duct 504 provided on the heat sink 50 is 10mm and the height of the sheet-like body of the edge tooth area 503 is 10mm, the heat exchange efficiency of the novel heat sink 50 can be improved by more than 30% compared with the original heat sink.

Due to the requirement of the radio frequency performance of the antenna, the heating element 202 needs to be designed with a shielding cover, and in addition, due to the requirement of floating lightning protection, the

single plates

2031 and 2032 and the heat sink 50 need to be designed in an insulating manner, the heat sink 50 and the housing 10 need to meet the requirement of safe creepage distance, and the heat sink 50 cannot be completely exposed, so that the improvement of the heat dissipation capability of the customer premises equipment is greatly limited by the two design requirements. The embodiment of the present application designs a unique heat conducting structure 20 and a high-efficiency heat sink 50, and the heat generated by the heating elements 202 on the single board 2031 and the single board 2032 is transferred to the auxiliary heat sink 40 and the heat sink 50 through different heat conducting paths to dissipate heat, thereby effectively improving the heat dissipation efficiency.

In one embodiment, the central toothed region 502 may have a variety of different tooth types. Fig. 6 and 7 are schematic views of two different tooth types in the central tooth zone 502. The tooth pattern in FIG. 6 has two types of platelet arrays, an upper and lower vertical platelet array 5021 and a horizontally aligned platelet array 5022, which are perpendicular to each other and each comprise a plurality of platelets. The horizontally arranged platelet array 5022 is located in the central region, and the vertically up and down platelet arrays 5021 are located on both sides of the horizontally arranged platelet array 5022. At this time, various hole shapes exist in the opening area, including an arc triangle 5023 and an arc quadrilateral 5024. The tooth form in fig. 7 is designed with a fan-shaped sheet-shaped body array 5025 from the center of the circle, and the angle is formed between two adjacent fan-shaped teeth, so that the scheme only has one sheet-shaped body array, and only one arc-shaped trapezoidal hole pattern 5026 is arranged in the area of the hole.

In one embodiment, the edge toothed region 503 of the heat sink 50 forms an air opening, and in order to increase the heat dissipation area, the air opening can be provided with a multi-layer design 505, see the multi-layer design schematic diagrams of the air opening in fig. 5 and fig. 8, for example, when the air opening is two-layer, the multi-layer design 505 includes a first layer air opening 5051, a second layer air opening 5052 and a partition 5053, wherein a plurality of sheet-shaped bodies can be arranged in the space of the first layer air opening 5051 and the second layer air opening 5052, and the first layer air opening 5051 or the second layer air opening 5052 is provided with a channel communicated with the air duct. N layers of tuyeres can be designed according to space and actual requirements, wherein n is a positive integer, for example, if the space allows, two partition plates can be arranged to form three layers of tuyeres. The multilayer design of wind gap has increased heat radiating area, is favorable to improving the radiating efficiency.

The present application designs a novel heat dissipation device, and the heat generated by the heating element 202 can be dissipated through different heat conduction paths. As shown in fig. 9, in one embodiment, heat generated by the heat generating element 202 during operation is first transferred to the boss 2051 on the heat conducting structure 20 through the heat conducting material 201, and then transferred to the heat conducting structure 20, wherein an auxiliary heat dissipation tooth 206 is disposed on the heat conducting structure 20 as required to perform auxiliary heat dissipation on the heat conducting structure 20, and most of the heat is transferred to the lower heat sink 50 for performing convection heat dissipation through exchange of hot and cold air.

As shown in fig. 10, in one embodiment, heat generated by the heat generating component 202 during operation is first conducted to the boss 2052 on the shield cover through the heat conductive material 201, then conducted to the shield cover 30, and finally conducted to the auxiliary heat sink 40 for heat dissipation. The heat conduction path is simplified through the arranged heat conduction structure, and the arrangement of the auxiliary heat radiator 40 and the auxiliary heat radiation teeth 206 increases the heat radiation path, thereby being beneficial to fast and efficient heat radiation.

Through adopting novel heat abstractor, designed unique heat conduction structure 20 and efficient radiator 50, effectively reduced the interior heat conduction thermal resistance of CPE module, shortened the heat conduction route, promoted radiator 50's heat exchange efficiency, dispel the heat on transferring to the radiator with the heat of heating element 202 on the veneer fast, novel heat abstractor has ensured CPE module antenna radio frequency performance design requirement and the lightning protection design requirement of floating ground simultaneously.

The foregoing is a preferred embodiment of the present application, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present application, and these modifications and decorations are also regarded as the protection scope of the present application.

Claims

1. A heat dissipation device is applied to customer premises equipment which comprises a shell with an opening at the bottom end, and is characterized by comprising a heat conduction structure and a heat radiator, wherein the heat radiator is installed in the shell and positioned at the opening position, the heat conduction structure comprises a bottom plate and an installation plate which are fixedly connected, the bottom plate is fixedly connected to the heat radiator, the installation plate extends into the shell from the opening position, the installation plate is used for installing a heating piece in the customer premises equipment and conducting heat energy of the heating piece to the bottom plate, and the bottom plate conducts the heat energy to the heat radiator.

2. The heat dissipating device of claim 1, wherein said mounting plate is connected upright to a central region of a top surface of said base plate, and said heat sink is connected to a bottom surface of said base plate.

3. The heat dissipating device of claim 2, wherein said mounting plate has auxiliary heat dissipating fins; and/or the heat dissipation device further comprises an auxiliary heat radiator which is interconnected with the mounting plate and jointly surrounds the heat generating member.

4. The heat dissipating device of claim 2, wherein said heat sink comprises a base plate and fins, said fins are disposed on a bottom surface of said base plate, a top surface of said base plate faces and is connected to said bottom surface of said heat conducting structure, a surface of said fins facing away from said base plate is a fin bottom surface, a surface connected between said fin bottom surface and an edge of said base plate is a fin side surface, said fin side surface faces an inner surface of said housing, said heat sink is provided with air ducts forming air openings in said fin bottom surface and said fin side surface, said air openings on said fin side surface being opposite to through holes on said housing.

5. The heat sink of claim 4, wherein said fins include a central toothed region and an edge toothed region, said edge toothed region surrounding said central toothed region, said plenum being disposed in said edge toothed region.

6. The heat dissipating device of claim 5, wherein the plurality of plates in the middle tine zone are arranged in a first direction, the plurality of plates in the edge tine zone are arranged in a second direction, and the first direction is different from the second direction.

7. The heat dissipating device of claim 6, wherein each of said plates in said central toothed region extends in a direction perpendicular to said base plate, and each of said plates in said edge toothed region extends in a direction from said central toothed region toward said blade side.

8. The heat sink of claim 5, wherein said edge tine zone comprises at least two layers of sheets, wherein at least one of said layers of sheets is provided with a channel in communication with said air channel.

9. The heat dissipating device of claim 4, wherein said fins comprise a plurality of plates, adjacent ones of said plates defining a channel therebetween, said channel opening to said fin sides at said fin sides to allow wind around said heat sink to enter said channel.

10. The heat dissipating device of claim 4, wherein the bottom surface of the fins has a smaller area than the substrate, and the side surfaces of the fins extend in a stepped manner, so that the heat sink has a multi-layer structure as a whole.

11. A customer premises equipment, comprising an omnidirectional antenna, a directional antenna, a connector and the heat dissipation device of any one of claims 1 to 10, wherein the heat generating component comprises a single plate and a heat generating element, the single plate is located on two sides of the heat conducting structure, the heat generating element is fixed on the single plate, the omnidirectional antenna is located above the heat conducting structure, the omnidirectional antenna is fixedly connected to the inner surface of the housing, the omnidirectional antenna is connected to the single plate, the directional antenna is located on two sides of the heat conducting structure, the directional antenna is fixedly connected to the inner surface of the housing, the directional antenna is fixedly connected to the single plate, the connector is located in the housing and at the opening position, and the connector is fixedly connected to the single plate.