CN211128733U - Heat sinks and customer premises equipment - Google Patents

Abstract

The present application relates to a heat sink and customer premises equipment. The customer premises equipment includes a housing with an open bottom end, the heat sink comprises a heat conduction structure and a heat sink, the heat sink is installed in the housing and is located at the opening, and the heat conduction structure comprises a fixedly connected bottom plate and a heat sink. The mounting plate, the bottom plate is fixedly connected to the radiator, the mounting plate protrudes into the interior of the casing from the opening, the mounting plate is used for installing the heating element in the user's premises equipment, and is used for conducting the heat energy of the heating element to the bottom plate, the bottom plate Conduct thermal energy to the heat sink. By designing a heat-conducting structure and a heat sink, the present application effectively reduces the heat-conducting thermal resistance in the user-premises equipment, shortens the heat-conducting path, improves the heat exchange efficiency of the heat sink, and can quickly conduct the heat generated by the heating element to the heat sink. for heat dissipation.

Description

Heat sinks and customer premises equipment

technical field

The present application relates to the technical field of heat dissipation, and in particular, to a heat dissipation device for customer premises equipment.

Background technique

Customer premise equipment (CPE) has the characteristics of small size, light weight and good environmental integration, and is widely used.

Among them, the chip is an important component of CPE products. Due to the fast signal processing speed, the chip generates a lot of heat. If the heat dissipation cannot be carried out in time, the performance of the chip will be affected and its service life will be shortened. At present, the heating element chip is usually contacted with the shielding cover through a thermal pad, and the heat is transferred to the shielding cover.

The current heat dissipation device has a long heat conduction path and a small heat dissipation contact area, and the generally used stainless steel/nickel white copper shielding cover has low thermal conductivity. These factors lead to low overall heat dissipation efficiency and unsatisfactory heat dissipation effect of the device.

Utility model content

Embodiments of the present application provide a heat dissipation device and a customer premises equipment. By designing a unique heat conduction structure and a heat sink, the heat conduction resistance in the CPE module is effectively reduced, and the heat exchange efficiency of the heat sink is improved.

In a first aspect, this embodiment provides a heat dissipation device, which is applied to customer premises equipment, the customer premises equipment includes a housing with an open bottom end, the heat dissipation device includes a heat conduction structure and a heat sink, and the heat sink is installed on the inside the casing and located at the opening, the thermally conductive structure includes a fixedly connected bottom plate and a mounting plate, the bottom plate is fixedly connected to the heat sink, the mounting plate extends into the interior of the casing from the opening, The mounting plate is used for installing the heating element in the customer premises equipment, and is used for conducting the heat energy of the heating element to the base plate, and the base plate conducts the heat energy to the heat sink.

In the present application, the heat-conducting structure is designed so that the heat-generating elements are distributed on both sides of the heat-conducting structure mounting plate in a left-right structure. The design of the heat conduction structure shortens the heat conduction path, reduces the heat conduction thermal resistance, and at the same time increases the heat dissipation contact area, which is beneficial to improve the heat dissipation efficiency.

The radiator base plate designed in this application is on the top, the teeth are located on the bottom surface of the base plate and the direction is downward. efficient operation.

In one embodiment, the mounting plate is connected upright to a central area of the top surface of the base plate, and the heat sink is connected to the bottom surface of the base plate. The mounting plate of the heat-conducting structure is located in the central area of the bottom plate, which is beneficial to the balance and stability of the heat-conducting structure. The radiator is located below the bottom plate of the thermally conductive structure. Specifically, the top surface of the radiator substrate is connected to the bottom surface of the bottom surface of the thermally conductive structure. The heat energy generated by the heating element is conducted to the bottom plate through the mounting plate, and the bottom plate conducts the heat energy to the radiator for heat dissipation.

In one embodiment, the mounting plate is provided with auxiliary heat dissipation fins; and/or the heat dissipation device further includes an auxiliary heat sink, the auxiliary heat sink is interconnected with the mounting plate and jointly surrounds the heating element . The auxiliary heat dissipation fins set on the mounting plate can realize auxiliary heat dissipation of the heat conducted to the installation plate during the heat conduction process of the heating element, that is, part of the heat conducted to the installation plate is dissipated through the auxiliary heat dissipation fins. The other part is conducted to the lower radiator for heat dissipation, which improves the heat dissipation efficiency. The auxiliary radiator and the mounting plate are interconnected to form a closed structure that surrounds the heating element together. The heat generated by the heating element can also be conducted to the auxiliary radiator through the thermal conductive material for heat dissipation. At the same time, the enclosed structure formed by the auxiliary radiator and the mounting plate also has a shielding function. , to ensure the performance of the heating element, realize the shielding effect, and avoid the influence of external signals on the internal circuit and the external radiation of internally generated signals.

In one embodiment, the heat sink includes a base plate and a tooth piece, the tooth piece is arranged on the bottom surface of the base plate, the top surface of the base plate faces and is connected to the bottom surface of the heat conducting structure, the The surface of the toothed piece facing away from the base plate is the toothed piece bottom surface, the surface connected between the toothed piece bottom surface and the edge of the base plate is the toothed piece side surface, the toothed piece side surface faces the inner surface of the housing, the The radiator is provided with a ventilation channel, and the ventilation channel forms a tuyere on the bottom surface of the tooth piece and the side surface of the tooth piece, and the tuyere on the side surface of the tooth piece is opposite to the through hole on the casing. The teeth are located on the bottom surface of the base plate, that is, the base plate is on the top and the teeth are at the bottom, which is conducive to the convection heat exchange of hot and cold air.

In one embodiment, the tooth piece includes a middle tooth area and an edge tooth area, the edge tooth area surrounds the middle tooth area, and the ventilation channel is arranged in the edge tooth area. The edge tooth area is located at the edge of the base plate, and the edge tooth area may be provided with a ventilation channel, and the ventilation channel and the side surface of the tooth piece form a tuyere to dissipate heat.

In one embodiment, the arrangement direction of the plurality of lamellae in the middle tooth region is the first direction, the arrangement direction of the plurality of lamellae in the edge tooth region is the second direction, the first direction and the The second direction is different.

In one embodiment, the extending direction of each of the sheet-like bodies in the intermediate tooth region is a direction perpendicular to the base plate, and the extending direction of each of the sheet-like bodies in the edge tooth region is The direction from the intermediate tooth region to the side surface of the tooth piece.

In one embodiment, the edge tooth region includes at least two layers of sheet-like bodies, wherein at least one layer of the sheet-like bodies is provided with a channel communicating with the ventilation channel, so as to facilitate heat entering the ventilation channel through the channel for heat dissipation.

In one embodiment, the toothed piece includes a plurality of sheet-shaped bodies, a channel is formed between the adjacent sheet-shaped bodies, and on the side of the toothed piece, the opening of the channel faces the side of the toothed piece, so that Allows wind around the radiator to enter the channel.

In one embodiment, the area of the bottom surface of the tooth piece is smaller than the area of the base plate, and the side surface of the tooth piece extends in a stepped shape, so that the heat sink has a multi-layer structure as a whole, and the multi-layer structure of the heat sink can increase heat dissipation. path to improve heat dissipation efficiency.

In a second aspect, the present application provides a customer premises equipment, including an omnidirectional antenna, a directional antenna, a connector, and the heat dissipation device according to any one of the foregoing embodiments, the heating element includes a single board and a heating element, and the single The board is located on both sides of the heat-conducting structure, the heating element is fixed on the single board, the omnidirectional antenna is located above the heat-conducting structure, the omnidirectional antenna is fixedly connected to the inner surface of the casing, the omnidirectional antenna is The directional antenna is connected to the single board, the directional antenna is located on both sides of the heat-conducting structure, the directional antenna is fixedly connected to the inner surface of the casing, the directional antenna is fixedly connected to the single board, and the connector Inside the housing and in the open position, the connector is fixedly connected to the single board. By setting the heat conduction structure and the heat sink, the present application shortens the conduction path, increases the contact area for heat dissipation, and reduces the thermal resistance of heat conduction, which is beneficial to realize rapid heat dissipation and ensure the efficient operation of the equipment.

Description of drawings

Some drawings involved in the embodiments of the present application will be described below.

Fig. 1 is the schematic diagram of the floating module of customer premises equipment;

Figure 2 is a schematic diagram of a heat sink;

3 is a schematic diagram of the internal three-dimensional structure of the heat sink;

4 is a schematic diagram of a heat conduction structure, a shielding structure on both sides and an auxiliary heat dissipation structure;

Figure 5 is a schematic diagram of the structure of the radiator;

6 is a schematic diagram of a first tooth profile of a radiator tooth piece;

7 is a schematic diagram of the second tooth profile of the radiator tooth piece;

Figure 8 is a schematic diagram of the multi-layer design of the tuyere;

FIG. 9 is a schematic diagram of the heat conduction path of the heating element near the heat conduction structure side;

FIG. 10 is a schematic diagram of the heat conduction path of the heating element near the shield cover side.

Detailed ways

In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background technology, the accompanying drawings required in the embodiments or the background technology of the present application will be described below.

The heat dissipation device of the embodiment of the present application can be used for customer premises equipment. As shown in FIG. 1 , FIG. 1 is a schematic diagram of the floating module of the customer premises equipment. The customer premises equipment 1 includes a housing 10, a heat conducting structure (not shown, see FIG. 2 ) inside the housing 10, and a radiator 50. The bottom end of the housing 10 is open, and the radiator 50 is located inside the housing 10 of the customer premises equipment 1, and is used for The heat conducted to the bottom is convectively exchanged with the external air to realize heat dissipation, effectively reduce the temperature of the internal environment of the user premises equipment 1, and promote the efficient operation of the user premises equipment.

As shown in FIGS. 2 , 3 and 4 , the specific customer premises equipment 1 includes a housing 10 , a heat conducting structure 20 , a shielding cover 30 , an auxiliary radiator 40 , a radiator 50 , an omnidirectional antenna 60 , a directional antenna 70 , and a connector 80. The fixed terminal 601 for fixing the omnidirectional antenna 60 on the casing 10 , the fixed terminal 701 for fixing the directional antenna 70 on the casing 10 , and the metal-free area 602 in the middle of the omnidirectional antenna 60 . The housing 10 forms a cavity for accommodating components such as an antenna and a heat sink inside. The housing 10 may be cylindrical, rectangular or other shapes. Due to the requirements of the radio frequency performance of the antenna, the housing 10 needs to be made of plastic or other non-metallic materials.

In one embodiment, the overlapping part of the casing 10 and the heat sink 50 is ventilated and completely exposed, which can effectively increase the outflow of hot air and facilitate rapid heat dissipation. Hole shapes include but are not limited to round holes, square holes, arc holes, etc. In order to ensure ventilation and reduce the amount of rainwater entering the shell, horizontal strip-shaped grid holes can be used.

In one embodiment, the casing 10 is provided with a fixed terminal, the omnidirectional antenna 60 is fixed inside the casing 10 through the fixed terminal 601 , the directional antenna 70 is fixed on the casing 10 through the fixed terminal 701 , the fixed terminal 601 and the fixed terminal 701 The antenna can be connected by crimping or welding, and other fixing structures can also be used to fix the omnidirectional antenna and the directional antenna inside the casing 10 respectively.

In one embodiment, the omnidirectional antenna 60 is connected to the single board 2032 through the antenna connecting line 603, and the omnidirectional antenna 60 may also be connected to the single board 2031 through the antenna connecting line. The directional antenna 70 is connected to the single board 2032 through the antenna connecting line 702, and the directional antenna 70 can also be connected to the single board 2031 through the antenna connecting line.

In one embodiment, the metal-free area 602 is the clearance area between the omnidirectional antennas on both sides. In order not to affect the signal processing of the antenna, the metal-free area 602 cannot have metal parts but can be provided with non-metallic structures such as plastics as required.

In one embodiment, the bottom plate 2011 of the thermal conductive structure 20 is provided with through holes, and the cables on the upper end of the connector 80 pass through the through holes of the heat sink 50 and the through holes on the bottom plate 2011 of the thermal conductive structure 20 in sequence and pass through the plug-in part. (not shown) is connected to the single board 2032 . The connector 80 and the single board 2032 can also be connected by other structures in addition to cables, and the connection method is not limited to the plug-in portion, and other fixed connection methods can also be used.

The thermally conductive structure 20 includes a bottom plate 2011 and a mounting plate 2012 that are fixedly connected. In a specific application environment, the bottom plate 2011 can be placed horizontally, the mounting plate 2012 is connected upright above the bottom plate 2011, and the mounting plate 2012 and the bottom plate 2011 can be perpendicular to each other, forming a The inverted "T"-shaped structure can also be inclined at a certain angle. Heat-generating elements 203 are arranged on both sides of the heat-conducting structure 20 . The left-side heating element 203 includes a single board 2031 and the heating element 202 on the single-board 2031 , and the right-side heating element 203 includes a single board 2032 and the heating element 202 fixed on the single board 2032 . The veneer 2031 and the veneer 2032 use the heat conduction structure 20 as the basic structure, and are distributed on the left and right sides of the heat conduction structure 20 in a left and right structure. Thermal contact area. The heat generated by the heating elements 202 on the veneer 2031 and the veneer 2032 is directly conducted by the heat conducting structure 20 to the lower heat sink 50 to perform convection heat exchange of cold and hot air. The design of the heat-conducting structure 20 simplifies the structure of the heat dissipation device and saves the internal space of the equipment. Since the heat can be directly conducted from the heat-conducting structure 20 to the lower inverted heat sink 50 for heat dissipation, the heat conduction path is shortened and the heat conduction thermal resistance is reduced. Both the veneer 2031 and the veneer 2032 have one side surface in contact with the heat conduction structure 20 , which increases the contact area for heat dissipation and facilitates rapid and efficient heat dissipation.

In one embodiment, the mounting plate 2012 is erected in the central area of the bottom plate 2011 , which is beneficial to the balance and stability of the thermally conductive structure 20 .

In one embodiment, the heating element 202 may be a chip or other electronic components that generate heat. The heat generated by the heating element 202 during the operation is conducted to the radiator 50 through the heat conducting structure 20, and the radiator 50 exchanges heat by convection with the external air, thereby efficiently exchanging the heat conducted by the heat conducting structure 20 with the external air, reducing the heating element. 202 and the temperature of the internal environment of the device can allow the heating element 202 to work under higher specifications and higher power.

In one embodiment, the heating element 202 may only be located on the side of the veneer 2031 and the veneer 2032 near the thermally conductive structure or the heating element 202 may only be located on the side of the veneer 2031 and the veneer 2032 near the shielding cover.

In one embodiment, the single board 2031 mainly processes data signals and has no radio frequency function, and the single board 2032 mainly processes analog signals and has radio frequency functions. Either side of the thermally conductive structure 20 .

In one embodiment, the single board 2031 and the single board 2032 may be a PCB (Printed circuit board, printed circuit board) single board, which is a type of substrate that can be used to fix heating elements such as chips.

In one embodiment, the thermally conductive structure 20 is mainly used to conduct the heat generated by the heating element 202 to the heat sink 50. Therefore, the thermally conductive structure 20 needs to have excellent thermal conductivity, and a metal material with good thermal conductivity can be used, such as die-cast aluminum material or Other thermally conductive materials.

As shown in FIG. 4 , FIG. 4 is a schematic diagram of the shielding structure and the auxiliary heat dissipation structure on both sides of the heat conduction structure 20 , mainly including the heat conduction structure 20 , the shielding covers 30 on both sides and the auxiliary heat sink 40 . Heat-generating elements 203 are distributed on both sides of the heat-conducting structure 20 , the right-side heating element 203 includes a single board 2032 and the heating element 202 fixed to the single-board 2032 , and the left-side heating element 203 includes a single board 2031 and a single-board 2031 fixed to the heating element 202 . The heating element 202, wherein the single board 2031 and the left and right sides of the single board 2032 (the side near the heat conducting structure 20 and the side near the shielding cover 30) are fixed with the heating element 202.

The shielding cover 30 wraps the heating element 202 inside to achieve a shielding effect, and the shielding cover 30 can ensure the radio frequency performance of the heating element 202 . The shielding cover 30 includes a first substrate 301, a second substrate 302 and a third substrate 303 arranged vertically opposite to each other. One end of the first substrate 301 and the second substrate 302 is fixedly connected to the mounting plate 2012 of the thermally conductive structure 20. The other ends of the first substrate 301 and the second substrate 302 and the third substrate 303 form a closed structure, and the heating element 202 is wrapped in the closed structure. A shielding cover 30 is respectively provided on the left and right sides of the mounting plate 2012 of the thermally conductive structure 20 for shielding the heating elements 202 on both sides.

The auxiliary heat sink 40 is formed by disposing auxiliary heat dissipation fins 401 on the third substrate 303 of the shielding cover 30 , and there may be multiple auxiliary heat dissipation fins 401 . In other words, the third substrate 303 of the shielding cover 30 is also the substrate of the auxiliary radiator 40 , and the auxiliary radiator 40 can be formed by adding the auxiliary cooling fins 401 on the third substrate 303 of the shielding cover 30 . In one embodiment, the auxiliary radiator 40 can diffuse heat around, effectively optimize the heat dissipation of the single board 2031 and the heating element 202 on the single board 2032, improve the overall heat dissipation efficiency of the heat dissipation device, and reduce the temperature of the internal environment. The auxiliary heat sink 40 can be made of die-cast aluminum or other materials with good thermal conductivity.

In one embodiment, the upper and lower ends of the third substrate 303 of the left shielding cover 30 are provided with a through hole respectively, the upper and lower ends of the single plate 2031 are respectively provided with a through hole, and the upper screw 901 passes through the third substrate of the shielding cover 30 in sequence. The through holes on the upper side of the substrate 303 and the through holes on the upper side of the single board 2031 are fixedly connected to the mounting plate 2012 of the thermally conductive structure 20 , and the lower screws 901 pass through the through holes on the lower side of the third substrate 303 of the shielding cover 30 and The through holes on the lower side of the single board 2031 are fixedly connected to the mounting board 2012 of the thermally conductive structure 20 . The shielding cover 30 and the mounting plate 2012 of the heat conducting structure 20 may be tightly fixed by screws, or may be fixedly connected by bolts, snaps or other fixing methods. The fixing method of the shielding cover 30 on the side of the single board 2032 is the same as that of the shielding cover on the side of the single board 2031, which will not be repeated here. The shielding cover 30 ensures the radio frequency performance of the heating element, realizes the shielding effect, and avoids the influence of external signals on the internal circuit and the external radiation of internally generated signals.

In one embodiment, since die-casting aluminum has good thermal conductivity, a shielding cover 30 made of die-casting aluminum can be used to reduce thermal resistance during heat conduction, improve heat conduction efficiency, and effectively conduct heat conduction while achieving shielding effect. In addition to die-casting aluminum, the shielding cover 30 can also be made of other materials having both good shielding and thermal conductivity.

In one embodiment, auxiliary cooling fins 206 can also be designed on the mounting plate 2012 of the thermally conductive structure 20. When the heat is conducted from the heating element 202 to the mounting plate 2012 of the thermally conductive structure 20, the auxiliary cooling fins 206 can be used for auxiliary cooling. The auxiliary heat dissipation teeth 206 can effectively optimize the heat dissipation on the heat conduction structure 20 during the heat conduction process, which is beneficial to improve the heat dissipation efficiency.

In one embodiment, bosses 2051 are provided on the left and right sides of the mounting plate 2012 of the heat conducting structure 20 , and bosses 2052 are also provided on the side of the shielding cover 30 near the heating element 202 . The bosses can be metal materials, such as die-cast aluminum or other materials with good thermal conductivity.

In one embodiment, a thermally conductive material 201 is disposed between the heating element 202 , the thermally conductive structure 20 and the shielding cover 30 . In other words, the heating element 202 on the side of the veneer 2031 and the veneer 2032 near the thermally conductive structure 20 is in contact with the boss 2051 on the thermally conductive structure 20 through the thermally conductive material 201 , and the heating element 202 on the side of the veneer 2031 and the veneer 2032 near the shielding cover 30 through the heat conduction The material 201 is in contact with the bosses 2052 on the shielding cover 30, that is, the thermally conductive material 201 is located between the heating element 202 and the bosses. Since the boss is a metal material, the heating element 202 cannot be in direct contact with the metal boss, so a non-metallic thermally conductive material 201 is required between the heating element 202 and the boss to play a buffering role. The thermally conductive material 201 includes thermally conductive pads, thermally conductive films, gels, silicone sheets, plastic sheets, and the like. The heat generated by the heating element 202 can be effectively conducted to the heat sink 50 for heat dissipation.

The heat-conducting structure 20 optimizes the relative positions of the internal structural parts, reduces the heat conduction path, increases the heat dissipation contact area, and saves the internal space. Due to the space permitting, a die-cast aluminum shielding cover can be used, which greatly reduces the heat of the heating element 202. The thermal resistance during conduction to the heat sink 50 reduces the temperature of the internal environment of the device, which is beneficial to the efficient operation of the heating element 202 .

As shown in FIG. 2 and FIG. 5 , the heat sink 50 is located under the thermally conductive structure 20 and is fixedly connected to the bottom surface of the bottom plate 2011 of the thermally conductive structure 20 . The heat sink 50 includes a base plate 501 and a toothed piece 507 . The toothed piece 507 includes a central toothed area 502 and an edge toothed area 503 . The area of the bottom surface of the toothed piece 507 is smaller than that of the base plate 501 , so that the heat sink 50 is a multi-layer structure as a whole. Both the central tooth area 502 and the edge tooth area 503 have a plurality of sheet-like bodies 508 . The substrate 501 is located above, and is in contact with the bottom plate 2011 of the thermally conductive structure 20 through a thermally conductive insulating material 204 . The central tooth area 502 is located on the bottom surface of the base plate 501 , a channel 509 is formed between two adjacent sheet bodies of the central tooth area 502 , and cold air enters through the channel 509 . The sheet-like bodies 508 of the central tooth region 502 can be provided in multiples according to requirements and space structures. The edge tooth area 503 surrounds the central tooth area 502, and the edge tooth area 503 is provided with a ventilation channel 504. The ventilation channel 504 and the tooth piece form a tuyere 510, and the tuyere 510 is opposite to the through hole on the casing 10 for the exchange of cold and hot air. The hot air 903 is dissipated through the tuyere, and the cold air 904 enters through the tuyere, thereby realizing convection heat dissipation of the cold and hot air, dissipating the heat conducted to the radiator 50, and reducing the internal ambient temperature of the device. The main function of the radiator 50 is to exchange heat by convection with the external air. The radiator 50 and the housing 10 need to meet the safety creepage distance requirements, so the radiator 50 cannot be completely exposed. The design of the tuyere 510 of the radiator 50 increases the heat dissipation area, and at the same time, channels are arranged between the two adjacent sheet bodies 508 of the central tooth area 502 to accelerate the flow of air and greatly improve the heat dissipation efficiency of the radiator 50 . The convective heat exchange efficiency of the high-efficiency heat sink 50 is improved, and the heat conducted by the heat conduction structure 20 is efficiently exchanged with the external air, which reduces the temperature of the internal environment, and allows the heating element to work under higher specifications and higher transmit power.

In one embodiment, the substrate 501 of the heat sink 50 is connected to the bottom plate 2011 of the thermally conductive structure 20 through the thermally conductive insulating material 204. The main function of the thermally conductive insulating material 204 is to insulate the heating element 203 from the external structural elements while reducing the contact thermal resistance, The heat conducted to the thermally conductive structure 20 is conducted to the lower heat sink 50 for heat dissipation. The thermally conductive insulating material 204 includes thermally conductive pads, thermally conductive films, gels, silica gel sheets, plastic sheets and other insulating materials. Specifically, the thermal pad has good viscosity, flexibility, good compression performance and good thermal conductivity, and can enhance the contact with the bottom plate 2011 of the upper thermally conductive structure 20 and the substrate 501 of the lower heat sink 50 by virtue of its own viscosity. By roughening the silica gel sheet, the surface friction between the silica gel sheet and the bottom plate 2011 of the upper thermally conductive structure 20 and the substrate 501 of the lower heat sink 50 can be increased, and the contact strength can also be enhanced.

In one embodiment, the tuyere formed by the central tooth region 502 of the radiator 50 is lower than the tuyere formed by the edge tooth region 503. Specifically, the hot air is dissipated from the upper tuyere, and the cold air enters from the lower tuyere, which is conducive to cooling and heating. Rapid convective heat transfer of air.

In one embodiment, the heat sink 50 and the bottom plate 2011 of the heat conducting structure 20 are fixed by insulating screws, so as to prevent lightning breakdown through this place. Specifically, one through hole is provided on the left and right sides of the bottom plate 2011 of the thermally conductive structure 20 , one through hole is provided on the left and right sides of the thermally conductive insulating material 204 at corresponding positions, and the left insulating screw 506 passes through the left side of the bottom plate 2011 of the thermally conductive structure 20 in sequence. The side through holes and the left through holes of the thermally conductive insulating material 204 are fixedly connected to the base plate 501 of the heat sink 50 , and the right insulating screws 506 pass through the right through holes of the bottom plate 2011 of the thermally conductive structure 20 and the holes of the thermally conductive insulating material 204 in sequence. The right through hole is fixed to the base plate 501 of the heat sink 50 . The heat sink 50 and the heat conducting structure 20 can also be fixedly connected by bolts or other fixing structures.

In one embodiment, when the diameter of the ventilation channel 504 provided on the radiator 50 is 10 mm, and the height of the sheet body of the edge tooth area 503 is 10 mm, the heat exchange efficiency of the new radiator 50 can be improved by more than 30% compared with the original radiator. .

Due to the requirements of the radio frequency performance of the antenna, the heating element 202 needs to be designed with a shielding cover. In addition, due to the requirements of floating lightning protection, the single board 2031 and the single board 2032 and the radiator 50 need to be insulated. Due to the electrical distance requirements, the heat sink 50 cannot be completely exposed. These two design requirements greatly limit the improvement of the heat dissipation capability of the user premises equipment. The embodiment of the present application designs a unique heat-conducting structure 20 and an efficient heat sink 50 to transmit the heat generated by the heating element 202 on the single board 2031 and the single board 2032 to the auxiliary heat sink 40 and the heat sink 50 through different heat conduction paths Heat dissipation can effectively improve the heat dissipation efficiency.

In one embodiment, the central tooth region 502 may have a variety of different tooth profiles. FIG. 6 and FIG. 7 are schematic views of two different tooth types of the central tooth region 502 . The tooth type in FIG. 6 has two types of sheet-like body arrays, an up-down vertical sheet-like body array 5021 and a horizontally-arranged sheet-like body array 5022. The two sheet-like body arrays are perpendicular to each other and include a plurality of sheet-like bodies respectively. The horizontally arranged sheet-like body arrays 5022 are located in the central area, and the upper and lower vertical sheet-like body arrays 5021 are located on both sides of the horizontally arranged sheet-like body arrays 5022 . At this time, there are various hole shapes in the opening area, including an arc-shaped triangle 5023 and an arc-shaped quadrangle 5024 . The tooth profile in Fig. 7 is designed from the center of the center circle, and the fan-shaped sheet body array 5025 is designed. There is an included angle between two adjacent fan-shaped teeth. There is only one sheet body array in this scheme, and at this time, there is only one kind of arc in the opening area. Trapezoidal hole pattern 5026.

In one embodiment, the edge tooth area 503 of the heat sink 50 forms a tuyere. In order to increase the heat dissipation area, a multi-layer design 505 can be arranged at the tuyere. , the multi-layer design 505 includes a first layer of tuyere 5051, a second layer of tuyere 5052 and a partition 5053, wherein a plurality of sheets can be arranged in the space of the first layer of tuyere 5051 and the second layer of tuyere 5052, and the first layer of tuyere 5051 or the second-layer tuyere 5052 is provided with a channel communicating with the ventilation channel. According to the space and actual needs, n layers of air outlets can be designed, and n is a positive integer. For example, if space permits, two partitions can also be set up to form three layers of air outlets. The multi-layer design of the air outlet increases the heat dissipation area, which is beneficial to improve the heat dissipation efficiency.

The present application designs a new type of heat dissipation device, and the heat generated by the heating element 202 can be dissipated through different heat conduction paths. As shown in FIG. 9 , in one embodiment, the heat generated by the heating element 202 during operation is first transmitted to the bosses 2051 on the heat-conducting structure 20 through the heat-conducting material 201 , and then to the heat-conducting structure 20 . Auxiliary heat dissipation teeth 206 are arranged on the heat conduction structure 20 to assist heat dissipation on the heat conduction structure 20, and most of the heat is conducted to the lower heat sink 50 for convection heat dissipation through the exchange of cold and hot air.

As shown in FIG. 10 , in one embodiment, the heat generated by the heating element 202 during operation is first conducted to the bosses 2052 on the shielding cover through the thermally conductive material 201 , then to the shielding cover 30 , and finally to the auxiliary heat dissipation The device 40 dissipates heat. The heat conduction path is simplified by the provided heat conduction structure, and the disposition of the auxiliary heat sink 40 and the auxiliary heat dissipation teeth 206 increases the heat dissipation path, which is conducive to rapid and efficient heat dissipation.

By adopting a new type of heat sink, a unique heat conduction structure 20 and an efficient heat sink 50 are designed, which effectively reduces the heat conduction thermal resistance in the CPE module, shortens the heat conduction path, improves the heat exchange efficiency of the heat sink 50, and quickly displaces the single The heat of the heating element 202 on the board is transferred to the radiator for heat dissipation, and the new heat dissipation device guarantees the design requirements of the radio frequency performance of the CPE module antenna and the design requirements of floating lightning protection.

The above are the preferred embodiments of the present application. It should be pointed out that for those skilled in the art, without departing from the principles of the present application, several improvements and modifications can also be made, and these improvements and modifications may also be regarded as The protection scope of this application.

Claims (11)

1. A heat dissipation device is applied to customer premises equipment which comprises a shell with an opening at the bottom end, and is characterized by comprising a heat conduction structure and a heat radiator, wherein the heat radiator is installed in the shell and positioned at the opening position, the heat conduction structure comprises a bottom plate and an installation plate which are fixedly connected, the bottom plate is fixedly connected to the heat radiator, the installation plate extends into the shell from the opening position, the installation plate is used for installing a heating piece in the customer premises equipment and conducting heat energy of the heating piece to the bottom plate, and the bottom plate conducts the heat energy to the heat radiator.

2. The heat dissipating device of claim 1, wherein said mounting plate is connected upright to a central region of a top surface of said base plate, and said heat sink is connected to a bottom surface of said base plate.

3. The heat dissipating device of claim 2, wherein said mounting plate has auxiliary heat dissipating fins; and/or the heat dissipation device further comprises an auxiliary heat radiator which is interconnected with the mounting plate and jointly surrounds the heat generating member.

4. The heat dissipating device of claim 2, wherein said heat sink comprises a base plate and fins, said fins are disposed on a bottom surface of said base plate, a top surface of said base plate faces and is connected to said bottom surface of said heat conducting structure, a surface of said fins facing away from said base plate is a fin bottom surface, a surface connected between said fin bottom surface and an edge of said base plate is a fin side surface, said fin side surface faces an inner surface of said housing, said heat sink is provided with air ducts forming air openings in said fin bottom surface and said fin side surface, said air openings on said fin side surface being opposite to through holes on said housing.

5. The heat sink of claim 4, wherein said fins include a central toothed region and an edge toothed region, said edge toothed region surrounding said central toothed region, said plenum being disposed in said edge toothed region.

6. The heat dissipating device of claim 5, wherein the plurality of plates in the middle tine zone are arranged in a first direction, the plurality of plates in the edge tine zone are arranged in a second direction, and the first direction is different from the second direction.

7. The heat dissipating device of claim 6, wherein each of said plates in said central toothed region extends in a direction perpendicular to said base plate, and each of said plates in said edge toothed region extends in a direction from said central toothed region toward said blade side.

8. The heat sink of claim 5, wherein said edge tine zone comprises at least two layers of sheets, wherein at least one of said layers of sheets is provided with a channel in communication with said air channel.

9. The heat dissipating device of claim 4, wherein said fins comprise a plurality of plates, adjacent ones of said plates defining a channel therebetween, said channel opening to said fin sides at said fin sides to allow wind around said heat sink to enter said channel.

10. The heat dissipating device of claim 4, wherein the bottom surface of the fins has a smaller area than the substrate, and the side surfaces of the fins extend in a stepped manner, so that the heat sink has a multi-layer structure as a whole.

11. A customer premises equipment, comprising an omnidirectional antenna, a directional antenna, a connector and the heat dissipation device of any one of claims 1 to 10, wherein the heat generating component comprises a single plate and a heat generating element, the single plate is located on two sides of the heat conducting structure, the heat generating element is fixed on the single plate, the omnidirectional antenna is located above the heat conducting structure, the omnidirectional antenna is fixedly connected to the inner surface of the housing, the omnidirectional antenna is connected to the single plate, the directional antenna is located on two sides of the heat conducting structure, the directional antenna is fixedly connected to the inner surface of the housing, the directional antenna is fixedly connected to the single plate, the connector is located in the housing and at the opening position, and the connector is fixedly connected to the single plate.

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