CN217936328U - Shielding case cooling system and electronic equipment - Google Patents
Shielding case cooling system and electronic equipment Download PDFInfo
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- CN217936328U CN217936328U CN202221307928.0U CN202221307928U CN217936328U CN 217936328 U CN217936328 U CN 217936328U CN 202221307928 U CN202221307928 U CN 202221307928U CN 217936328 U CN217936328 U CN 217936328U
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Abstract
The application relates to a shield cover cooling system and electronic equipment, shield cover cooling system includes shield cover and heat conduction samming layer, the shield cover has first depressed part, the heat conduction samming layer has the second depressed part, the heat conduction samming layer sets up on the shield cover surface, and the first depressed part of second depressed part laminating, electronic components is pressed close to first depressed part for promote the radiating effect to electronic components, thereby promote the holistic radiating effect of shielding cooling system.
Description
Technical Field
The application relates to the technical field of electronic equipment, in particular to a shielding case cooling system and electronic equipment.
Background
Along with the development of the technology, the types of electronic components in electronic equipment are more and more, the problem of heat dissipation of the electronic components is an important part in the design of the electronic equipment, in practical situations, a plurality of electronic components often exist on the same circuit board, and the heights of the electronic components are different, so that when the design of a shielding case uses a higher electronic component as a standard, the distance between the electronic component with the lower height and the shielding case is far, the heat dissipation is influenced, and the integral heat dissipation effect of the electronic equipment is influenced.
SUMMERY OF THE UTILITY MODEL
The application provides a shield cover cooling system and electronic equipment for solve the problem of poor cooling of electronic equipment.
The application provides a shield cover cooling system for protect electronic components, shield cover cooling system includes:
the shielding cover is provided with a first sunken part at one side far away from the electronic component, and the first sunken part is used for being attached to the electronic component;
the heat conduction temperature-equalizing layer is arranged on the surface of the shielding case, a second concave part is arranged on one side, away from the electronic component, of the heat conduction temperature-equalizing layer, and the second concave part is attached to the first concave part.
The shielding case is a tool for shielding electronic signals, and is used for shielding the influence of external electromagnetic waves on an internal circuit and the outward radiation of the electromagnetic waves generated inside, and the shielding case can be arranged on a circuit board and covers electronic components to realize the shielding effect. In practical situations, the shielding case generally needs to cover and shield a plurality of electronic components at the same time, but due to the difference in height of the electronic components, the distance between the shielding case and the electronic components with smaller height is finally larger, and thus the heat dissipation effect is affected. At present, a common solution is to fill more heat-conducting media between the shielding case and the electronic component, so as to fill up the gap between the electronic component and the shielding case and achieve the effect of accelerating heat dissipation, but because the distance between the electronic component and the shielding case is far, the filled heat-conducting media are more, so that the heat resistance is larger, and the normal heat dissipation effect is finally influenced. In the shield case cooling system that this application provided, the shield case is provided with first depressed part, and first depressed part is sunken for the other parts of shield case, and first depressed part can set up according to electronic components's concrete position, and the shield case that this application provided can keep suitable distance of predetermineeing with highly different electronic components simultaneously, makes the shield case can enough realize the shielding effect, does not influence the radiating effect simultaneously again. The utility model provides a shield cover cooling system still includes heat conduction samming layer, heat conduction samming layer has the second depressed part, heat conduction samming layer sets up on the shield cover surface, a use for improving heat conduction efficiency, wherein the second depressed part corresponds the setting with first depressed part, the second depressed part can laminate with first depressed part, make first depressed part also have good radiating effect, heat conduction samming layer is whole to laminate each other with the shield cover, shield cover cooling system's heat conduction and heat dispersion have been promoted.
In a possible embodiment, the heat-conducting temperature-uniforming layer further includes a first main body portion and a bent portion, and the bent portion can be bent with respect to the first main body portion, so that a part of the first main body portion forms the second recess.
The bending part is used for connecting the second concave part and other parts of the heat-conducting temperature-equalizing layer, and the second concave part is sunken relative to other parts of the shielding cover through bending by the bending part. The heat conduction samming layer is a complete plane usually when adding man-hour, is convenient for set up out the second depressed part on the heat conduction samming layer through the kink to make second depressed part and the laminating of first depressed part, first main part and the laminating of other parts of shield cover.
In a possible implementation manner, the heat-conducting temperature-uniforming layer further includes a second main body portion, the second main body portion is connected to the second recess portion through the bending portion, and a gap is provided between the second main body portion and the first main body portion.
The size and the shape of heat conduction temperature equalizing layer can set up according to actual heat dissipation demand, and the area on heat conduction temperature equalizing layer is greater than the area of second depressed part, sets up through directly buckling and can lead to crease or fold to appear in the place except that the second depressed part to influence the roughness and the radiating effect in other regions of heat conduction material. Through set up the clearance on heat conduction temperature-uniforming layer, when the kink is buckled, do not influence the shape in other regions of heat conduction temperature-uniforming layer, specific, the clearance extends to the edge on heat conduction temperature-uniforming layer from the kink, and when the kink took place to buckle, its crease extended to the clearance to the local deformation formation second depressed part that takes place of the heat conduction temperature-uniforming layer of being convenient for reduces the influence to other parts of heat conduction temperature-uniforming layer. The gap may be set by cutting the thermally conductive vapor layer. The width direction that shield cover cooling system can be followed in the clearance extends, extends to the edge on heat conduction temperature-uniforming layer from the kink along the direction of second depressed part to first main part to be convenient for heat conduction temperature-uniforming layer buckle deformation.
In one possible embodiment, the heat dissipation system includes a thermally conductive interface layer disposed between the electronic component and the first recess.
The heat conduction interface layer has high thermal conductivity, for example, the heat conductivity of air is 0.023W/mK, and the heat conductivity of the heat conduction silica gel sheet can reach 10W/mK, the heat conduction efficiency can be greatly improved by filling the gap between the first concave part and the electronic component through the heat conduction interface layer, the heat conduction interface layer can be heat conduction gel, heat conduction silicone grease, a heat conduction silica gel pad, liquid metal, phase-change materials and the like, the heat conduction interface layers generally have certain fluidity, the gap between the electronic component and the shielding case can be better filled, the heat conduction interface layer is more compact in combination, and the efficiency of heat conduction is further improved.
In one possible embodiment, the heat dissipation system of the shield case includes a heat conducting interface layer, and the second recess is provided with the heat conducting interface layer.
The second depressed part sets up the heat conduction boundary layer and can further improve the radiating effect, and makes heat conduction samming layer surface keep leveling, be convenient for with the mutual close contact cooperation of other accessories, also can set up the copper sheet heat conduction in the second depressed part according to actual conditions, the copper sheet can adopt oxygen-free copper to do passivation treatment.
In a possible embodiment, the shield heat dissipation system includes a heat-conducting adhesive layer and a heat dissipation member, the heat dissipation member is disposed on a side of the heat-conducting temperature equalization layer away from the shield, and the heat-conducting adhesive layer is disposed between the heat-conducting interface layer and the heat dissipation member.
The heat dissipation piece is used for diffusing the heat that electronic components gived off to the air fast, and the heat dissipation piece can adopt materials such as brass, bronze, aluminum alloy or pottery, and the heat dissipation piece can set up to platelike or slice increase radiating efficiency, and the heat dissipation piece closely pastes with heat conduction samming layer and covers, pastes the heat dissipation piece through the heat conduction adhesive linkage and fixes at the shield cover. The heat dissipation member can also be fixed by bolts or spring nails and the like.
In a possible embodiment, a side of the heat sink facing away from the shielding case is provided with a plurality of heat dissipation fins.
The side of the radiating piece, which is far away from the shielding case, is provided with radiating fins, the radiating fins can be sequentially arranged along the length direction of the shielding case radiating system, and the radiating fins are used for increasing the surface area of the radiating piece, so that the passive radiating effect is improved.
In one possible embodiment, the heat-conducting temperature-equalizing layer comprises a nano-radiation layer, a copper foil and an adhesive layer, wherein the copper foil is arranged between the nano-radiation layer and the adhesive layer.
The heat-conducting uniform temperature layer can be a nano carbon copper foil which is a carbon-based heat-conducting and heat-dissipating material, has unique crystal grain orientation, conducts heat uniformly along two directions, is convenient to set and mount in a flaky form, and can provide heat isolation in the thickness direction of the heat-conducting and heat-dissipating layer while dissipating heat. The nano carbon copper foil has good flexibility and machinability, and has the characteristics of high thermal conductivity and high heat radiation efficiency. The nano-carbon copper foil is composed of a copper foil, nano-graphene arranged on one side of the copper foil and a heat conduction bonding layer arranged on the other side of the copper foil, the heat conduction bonding layer is used for adhering and fixing the nano-carbon copper foil, a heat source can be changed into a surface shape from a point shape after heat is conducted through the copper foil, and the nano-carbon copper foil realizes a high-efficiency heat dissipation effect based on the extremely high heat conductivity of the nano-graphene along the plane direction and the high heat radiation property with high emissivity, and finally realizes good heat dissipation performance of a shielding and heat dissipation system.
In a possible implementation manner, the shielding case heat dissipation system comprises a shielding frame, the shielding frame surrounds the electronic component, and the shielding case is connected with the shielding frame in a clamping manner.
The shielding frame can welded fastening install at the circuit board, and the shielding frame is provided with the knot point, and the shield cover is installed in fixed frame through the knot point, makes dismantlement and installation shield cover convenient and fast more through shielding frame installation shield cover, compares in the mode of being connected the direct and circuit board of shield cover through welding or bonding, and the test and the maintenance of the electronic product of being convenient for of the shield cover that this application provided also can realize good shielding property simultaneously.
The application provides an electronic device, electronic device includes shield cover cooling system, just shield cover cooling system be above-mentioned any embodiment shield cover cooling system.
The application provides a shield cover cooling system and electronic equipment, shield cover cooling system includes shield cover and heat conduction samming layer, the shield cover has first depressed part, the heat conduction samming layer has the second depressed part, the heat conduction samming layer sets up on the shield cover surface, and the first depressed part of second depressed part laminating, electronic components is pressed close to first depressed part for promote the radiating effect to electronic components, thereby promote the holistic radiating effect of shielding cooling system.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.
Drawings
FIG. 1 is an exploded view of a heat sink shield system provided herein;
FIG. 2 is a schematic structural diagram of a shielding cage provided herein;
fig. 3 is a schematic structural diagram of a thermal conductive temperature equalization layer provided in the present application;
FIG. 4 is a schematic structural diagram of another embodiment of a thermally conductive vapor layer provided herein;
fig. 5 is a partial cross-sectional view of a heat sink shield system provided herein.
Reference numerals:
1-a shielding case;
11-a first recess;
12-a guide;
2-heat conducting temperature-equalizing layer;
21-a second recess;
22-a bending part;
23-gap;
24-a first body portion;
25-a second body portion;
3-a heat conducting interface layer;
4-heat conducting adhesive layer;
5-a heat sink;
51-heat dissipation fins;
6-shielding frame.
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and together with the description, serve to explain the principles of the application.
Detailed Description
For better understanding of the technical solutions of the present application, the following detailed descriptions of the embodiments of the present application are provided with reference to the accompanying drawings.
It should be understood that the embodiments described are only a few embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terminology used in the embodiments of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the examples of this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be understood that the term "and/or" as used herein is merely one type of association that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter associated objects are in an "or" relationship.
It should be noted that the terms "upper", "lower", "left", "right", and the like used in the embodiments of the present application are described in terms of the angles shown in the drawings, and should not be construed as limiting the embodiments of the present application. In addition, in this context, it will also be understood that when an element is referred to as being "on" or "under" another element, it can be directly on "or" under "the other element or be indirectly on" or "under" the other element via an intermediate element.
As shown in fig. 1 to fig. 3, an embodiment of the present application provides a shield case cooling system, which is used for protecting an electronic component, the shield case cooling system includes a shield case 1 and a heat-conducting temperature-uniforming layer 2, one side of the shield case 1, which is far away from the electronic component, is provided with a first concave portion 11, the first concave portion is convex relative to one side of the shield case 1, which is close to the electronic component, one side of the shield case, which is far away from the electronic component, is concave, one side of the heat-conducting temperature-uniforming layer 2, which is far away from the electronic component, is provided with a second concave portion 21, the second concave portion 21 is convex relative to one side of the heat-conducting temperature-uniforming layer 2, which is close to the electronic component, one side of the shield case, wherein the heat-conducting temperature-uniforming layer 2 is arranged on the surface of the shield case 1, the second concave portion 21 is attached to the first concave portion 11, and the first concave portion 11 is used for attaching the electronic component.
The shielding case 1 is a tool for shielding electronic signals, and is used for shielding the influence of external electromagnetic waves on an internal circuit and the outward radiation of the electromagnetic waves generated inside, and the shielding case 1 can be arranged on a circuit board to cover electronic components to realize a shielding effect. In practical situations, the shielding case 1 generally needs to cover and shield a plurality of electronic components at the same time, but due to the different heights of the electronic components, the distance between the shielding case 1 and the component with the smaller height is finally larger, and thus the heat dissipation effect is affected. At present, a common solution is to fill more heat-conducting media between the shielding case 1 and the electronic component, so as to fill up the gap between the electronic component and the shielding case 1 and accelerate the heat dissipation effect, but because the distance between the electronic component and the shielding case 1 is long, the filled heat-conducting media are more, so that a large thermal resistance exists, and the normal heat dissipation effect is finally influenced. In the cooling system of the shielding case provided by the embodiment of the application, the shielding case 1 is provided with the first depressed part 11, the first depressed part 11 is depressed relative to other parts of the shielding case 1, the first depressed part 11 can be set according to the specific position of the electronic component, the shielding case 1 provided by the embodiment of the application can keep a proper preset distance with the electronic component with different height simultaneously, so that the shielding case 1 can realize the shielding effect, and meanwhile, the cooling effect is not influenced. The shield case cooling system that this application embodiment provided still includes heat conduction samming layer 2, heat conduction samming layer 2 has second depressed part 21, heat conduction samming layer 2 sets up on shield case 1 surface, be used for improving heat conduction efficiency, wherein second depressed part 21 corresponds the setting with first depressed part 11, second depressed part 21 can laminate with first depressed part 11, make first depressed part 11 also have good radiating effect, heat conduction samming layer 2 is whole to laminate each other with shield case 1, shield case cooling system's heat conduction and heat dispersion have been promoted.
As shown in fig. 3 to 5, in one possible embodiment, the thermally conductive isothermal layer 2 further includes a first main body portion 24 and a bent portion 22, and the bent portion 22 can be bent with respect to the first main body portion 24, so that a part of the first main body portion 24 forms the second concave portion 21.
The bending portion 22 is used to connect the second concave portion 21 and other portions of the heat conducting temperature equalizing layer 2, and the bending portion 22 bends and deforms to make the second concave portion 21 concave relative to other portions of the shielding case 1. The heat-conducting temperature-uniforming layer 2 is usually a complete plane during processing, and the second concave portion 21 is conveniently arranged on the heat-conducting temperature-uniforming layer 2 through the bending portion 22, so that the second concave portion 21 is attached to the first concave portion 11, and the first main body portion 24 is attached to other portions of the shielding case 1.
As shown in fig. 3, in a possible embodiment, the heat-conducting temperature-uniforming layer 2 further includes a second main body portion 25, the second main body portion 25 is connected to the bending portion 22, and a gap 23 extending along the direction from the second recess 21 to the second main body portion 25 is disposed between the second main body portion 25 and the first main body portion 24.
The size and the shape of heat conduction samming layer 2 can set up according to actual heat dissipation demand, and heat conduction samming layer 2 sets up through directly buckling and can lead to crease or fold to appear in first main part 24 and second main part 25 to influence the roughness and the radiating effect in other regions of heat conduction material. Through set up clearance 23 on heat conduction uniform temperature layer 2, when kink 22 is buckled, do not influence the shape of first main part 24 and second main part 25, it is specific, clearance 23 extends to the edge on heat conduction uniform temperature layer 2 from kink 22, when kink 22 takes place to buckle, its crease extends to clearance 23 to the local deformation formation second depressed part 21 that takes place of the heat conduction uniform temperature layer 2 of being convenient for reduces the influence to the other parts on heat conduction uniform temperature layer 2. The gap 23 may be provided by cutting the thermally conductive isothermal layer 2. The gap 23 may extend along the width direction of the heat dissipation system of the shielding case, and extends from the bending portion 22 to the edge of the heat-conducting temperature-uniforming layer 2 along the direction from the second recessed portion 21 to the first main body portion 24, so as to facilitate bending deformation of the heat-conducting temperature-uniforming layer 2.
As shown in fig. 4, in a possible embodiment, the heat-conducting temperature-uniforming layer 2 further includes a second main body portion 25, the second main body portion 25 is connected to the bending portion 22, and a gap 23 extending in a direction perpendicular to the second recessed portion 21 to the second main body portion 25 is disposed between the second main body portion 25 and the first main body portion 24.
The clearance 23 can be according to the position and the size setting of second depressed part 21, and the length direction that shield cover cooling system can be followed to clearance 23 extends, extends to the edge of heat conduction temperature-uniforming layer 2 along the direction of perpendicular to second depressed part 21 to first main part 24 from kink 22 to the deformation of buckling of heat conduction temperature-uniforming layer 2 is convenient for.
As shown in fig. 2 and 5, in one possible embodiment, the shield case 1 includes a guide portion 12, the guide portion 12 is disposed around an edge of the first recess portion 11, and the guide portion 12 is inclined with respect to the first recess portion 11 in a height direction of the shield case heat dissipation system.
In one possible embodiment, as shown in fig. 1 and 5, the heat dissipation system of the shielding can comprises a heat-conducting interface layer 3, the heat-conducting interface layer 3 being arranged between the electronic component and the first recess 11,
the heat conduction interface layer 3 has high heat conductivity, for example, the heat conductivity of air is 0.023W/mK, and the heat conductivity of the heat conduction silica gel sheet can reach 10W/mK, the heat conduction efficiency can be greatly improved by filling the gap between the first concave part 11 and the electronic component through the heat conduction interface layer 3, the heat conduction interface layer 3 can be heat conduction gel, heat conduction silicone grease, a heat conduction silica gel pad, liquid metal, phase-change material and the like, the heat conduction interface layer 3 generally has certain fluidity, the gap between the electronic component and the shielding case 1 can be better filled, the heat conduction interface layer 3 is more compact, and the heat conduction efficiency is further improved.
In a possible embodiment, the second recess 21 is also provided with a heat-conducting interface layer 3.
The second depressed part 21 sets up heat conduction interface layer 3 and can further improve the radiating effect, and makes the 2 surfaces on heat conduction samming layer keep leveling, be convenient for with the mutual close contact cooperation of other accessories, also can set up the copper sheet heat conduction in second depressed part 21 according to actual conditions, the copper sheet can adopt oxygen-free copper to do passivation treatment.
In one possible embodiment, as shown in fig. 1, the heat dissipation system of the shielding case comprises a heat-conducting adhesive layer 4 and a heat dissipation member 5, wherein the heat dissipation member 5 is arranged on the side of the heat-conducting temperature equalization layer 2 far away from the shielding case 1, and the heat-conducting adhesive layer 4 is arranged between the heat-conducting interface layer 3 and the heat dissipation member 5.
The heat dissipation piece 5 is used for diffusing the heat that electronic components gived off to the air fast, and the heat dissipation piece 5 can adopt materials such as brass, bronze, aluminum alloy or pottery, and the heat dissipation piece 5 can set up to platelike or slice increase radiating efficiency, and the heat dissipation piece 5 closely pastes with heat conduction samming layer 2 and covers, pastes through heat conduction adhesive linkage 4 with the heat dissipation piece 5 and fixes at shield cover 1. The heat sink 5 may also be fixed by bolts or spring nails.
In a possible implementation mode, the shielding case heat dissipation system comprises a shielding frame 6, the shielding frame 6 is arranged around the electronic component, and the shielding case 1 is clamped with the shielding frame 6.
The shield frame 6 can welded fastening install at the circuit board, and the shield frame 6 is provided with the knot point, and shield cover 1 is installed in fixed frame through the knot point, and through shield frame 6 installation shield cover 1 make dismantle with installation shield cover 1 convenient and fast more, compare in through welding or the mode of bonding with shield cover 1 direct and circuit board connection, the test and the maintenance of the electronic product of being convenient for of shield cover 1 that this application embodiment provided also can realize good shielding performance simultaneously.
In one possible embodiment, the side of the heat sink 5 remote from the shielding cage 1 is provided with a plurality of heat sink fins 51.
The side of the heat sink 5 away from the shield case 1 is provided with a plurality of heat dissipation fins 51, the heat dissipation fins 51 may be sequentially arranged along the length direction of the shield case heat dissipation system, and the heat dissipation fins 51 are used for increasing the surface area of the heat sink 5, thereby improving the passive heat dissipation effect.
In one possible embodiment, the thermally conductive and temperature-uniforming layer 2 includes a nano-radiation layer, a copper foil, and an adhesive layer, the copper foil being disposed between the nano-radiation layer and the adhesive layer.
The heat-conducting uniform temperature layer 2 is made of nano carbon copper foil which is a carbon-based heat-conducting and heat-dissipating material, has unique crystal grain orientation, conducts heat uniformly along two directions, is convenient to set and mount in a flaky form, and can provide heat isolation in the thickness direction of the heat-conducting and heat-dissipating layer while dissipating heat. The nano carbon copper foil has good flexibility and machinability, and has the characteristics of high thermal conductivity and high heat radiation efficiency. The nano-carbon copper foil is composed of a copper foil, nano-graphene arranged on one side of the copper foil and an adhesive layer arranged on the other side of the copper foil, the adhesive layer is used for adhering and fixing the nano-carbon copper foil, heat is conducted through the copper foil, a heat source can be changed into a surface shape from a point shape, and based on extremely high heat conductivity of the nano-graphene along a plane direction and high heat radiation with high emissivity, the effect of efficient heat dissipation is achieved, and finally good heat dissipation performance of a shielding and heat dissipation system is achieved.
An embodiment of the present application provides an electronic device, where the electronic device includes a shielding case heat dissipation system, and the shielding case heat dissipation system is the shielding case heat dissipation system described in any of the above embodiments.
The embodiment of the application provides a shield cover cooling system and electronic equipment, shield cover cooling system includes shield cover 1 and heat conduction samming layer 2, shield cover 1 has first depressed part 11, heat conduction samming layer 2 has second depressed part 21, heat conduction samming layer 2 sets up on shield cover 1 surface, and the first depressed part 11 of second depressed part 21 laminating, electronic components on the circuit board is pressed close to first depressed part 11, a radiating effect for promoting electronic components, thereby promote the holistic radiating effect of shielding cooling system.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made to the present application by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (10)
1. The utility model provides a shield cover cooling system for protect electronic components, its characterized in that, shield cover cooling system includes:
the shielding cover (1), wherein a first sunken part (11) is arranged on one side of the shielding cover (1) far away from the electronic component, and the first sunken part (11) is used for being attached to the electronic component;
the heat conduction temperature-uniforming layer (2) is arranged on the surface of the shielding case (1), one side, away from the electronic component, of the heat conduction temperature-uniforming layer (2) is provided with a second concave part (21), and the second concave part (21) is attached to the first concave part (11).
2. The heat dissipation system of claim 1, wherein the heat conducting and temperature equalizing layer (2) further comprises a first main body portion (24) and a bent portion (22), and the bent portion (22) can be bent relative to the first main body portion (24) to form part of the first main body portion (24) into the second recess (21).
3. The heat dissipation system of the shielding case according to claim 2, wherein the heat conducting temperature equalizing layer (2) further comprises a second main body portion (25), the second main body portion (25) is connected to the second recess portion (21) through the bending portion (22), and a gap (23) is provided between the second main body portion (25) and the first main body portion (24).
4. The heat dissipation system according to any one of claims 1 to 3, characterized in that the heat dissipation system comprises a thermally conductive interface layer (3), the thermally conductive interface layer (3) being arranged between the electronic component and the first recess (11).
5. The shield heat dissipation system according to any one of claims 1 to 3, characterized in that the shield heat dissipation system comprises a thermally conductive interface layer (3), the second recess (21) being provided with the thermally conductive interface layer (3).
6. The shield cooling system according to claim 5, comprising a thermally conductive adhesive layer (4) and a heat sink (5), wherein the heat sink (5) is arranged on a side of the thermally conductive temperature equalization layer (2) remote from the shield (1), and wherein the thermally conductive adhesive layer (4) is arranged between the thermally conductive interface layer (3) and the heat sink (5).
7. The shield radiator system according to claim 6, wherein a side of the radiator member (5) remote from the shield (1) is provided with a plurality of radiator fins (51).
8. The shield heat dissipation system according to claim 1, wherein the thermally conductive vapor layer (2) comprises a nano-radiation layer, a copper foil, and an adhesive layer, the copper foil being disposed between the nano-radiation layer and the adhesive layer.
9. The heat dissipation system of the shielding case as claimed in claim 1, wherein the heat dissipation system of the shielding case comprises a shielding frame (6), the shielding frame (6) is disposed around the electronic component, and the shielding case (1) is clamped with the shielding frame (6).
10. An electronic device, characterized in that the electronic device comprises a shield heat dissipation system, and the shield heat dissipation system is the shield heat dissipation system of any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221307928.0U CN217936328U (en) | 2022-05-26 | 2022-05-26 | Shielding case cooling system and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221307928.0U CN217936328U (en) | 2022-05-26 | 2022-05-26 | Shielding case cooling system and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217936328U true CN217936328U (en) | 2022-11-29 |
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ID=84177767
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221307928.0U Active CN217936328U (en) | 2022-05-26 | 2022-05-26 | Shielding case cooling system and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217936328U (en) |
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2022
- 2022-05-26 CN CN202221307928.0U patent/CN217936328U/en active Active
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