CN215683049U

CN215683049U - Heat dissipation assembly, frequency converter and vacuum pump

Info

Publication number: CN215683049U
Application number: CN202121738122.2U
Authority: CN
Inventors: 陈金韬; 张俊
Original assignee: Shenzhen Inovance Technology Co Ltd
Current assignee: Shenzhen Inovance Technology Co Ltd
Priority date: 2021-07-28
Filing date: 2021-07-28
Publication date: 2022-01-28
Anticipated expiration: 2031-07-28

Abstract

The utility model discloses a heat dissipation assembly, a frequency converter and a vacuum pump. The heat dissipation assembly comprises a circuit board, a heating device arranged on the circuit board, a heat dissipation shell and a heat conduction pad, wherein the heat dissipation shell comprises a heat dissipation cavity, the circuit board is detachably fixed on the heat dissipation shell, and the heating device is positioned in the heat dissipation cavity; the heat conducting pad is arranged between the heat dissipation shell and the heating device, one side of the heat conducting pad is abutted to the heating device, the other side of the heat conducting pad is abutted to the heat dissipation shell, and the distance between the heat dissipation shell and the heating device is smaller than the thickness of the heat conducting pad, so that heat emitted by the heating device is transmitted out through the heat conducting pad and the heat dissipation shell in sequence. The heat dissipation assembly provided by the technical scheme of the utility model can improve the production efficiency of the frequency converter, reduce the production cost and is convenient to maintain.

Description

Heat dissipation assembly, frequency converter and vacuum pump

Technical Field

The utility model relates to the technical field of heat dissipation of vacuum pump equipment, in particular to a heat dissipation assembly, a frequency converter and a vacuum pump.

Background

In the related art, when a frequency converter of some equipment (such as a vacuum pump) is produced, in order to perform good heat dissipation on a circuit board in the frequency converter, a heat-conducting glue is generally required to be poured between the circuit board of the frequency converter and a heat dissipation shell, so that heat emitted by the circuit board can be dissipated through the heat-conducting glue and the heat dissipation shell. However, in this method, a dedicated glue filling device is required to be used during glue filling, and a long time is required to wait for solidification after the glue filling, so that the production is time-consuming, inefficient, and high in production cost. Moreover, the circuit board and the heat-conducting glue are solidified, so that the subsequent maintenance operation is very inconvenient.

SUMMERY OF THE UTILITY MODEL

The utility model mainly aims to provide a heat dissipation assembly, which aims to improve the production efficiency of a frequency converter, reduce the production cost and facilitate maintenance.

In order to achieve the above object, the heat dissipation assembly provided by the present invention includes a circuit board and a heat generating device mounted on the circuit board, and the heat dissipation assembly further includes:

the circuit board is detachably fixed on the heat dissipation shell, and the heating device is positioned in the heat dissipation cavity; and

the heat conducting pad is arranged between the heat dissipation shell and the heating device, one side of the heat conducting pad is abutted to the heating device, the other side of the heat conducting pad is abutted to the heat dissipation shell, and the distance between the heat dissipation shell and the heating device is smaller than the thickness of the heat conducting pad, so that heat emitted by the heating device is sequentially transmitted out through the heat conducting pad and the heat dissipation shell.

Optionally, a surface area of a side of the heat conduction pad facing the heat generating device is greater than or equal to a surface area of a side of the heat generating device facing the heat conduction pad.

Optionally, the heat conducting pad is fixed on one side of the heat dissipation shell in an adhering manner; or the heat conducting pad is bonded and fixed on one side of the heating device.

Optionally, a distance value between the heat dissipation housing and the heat generating device is defined as L, a thickness of the thermal pad is defined as D, and a relationship is satisfied: l is more than or equal to 0.6D and less than or equal to 0.8D.

Optionally, the heat conducting pad is a silica gel pad, a silicone grease pad or a rubber pad;

optionally, the heat dissipation housing is made of copper, aluminum, or an aluminum alloy.

Optionally, a liquid cooling water channel is embedded in the heat dissipation housing.

Optionally, a plurality of heat dissipation teeth are arranged on the outer side of the heat dissipation shell.

The utility model further provides a frequency converter, which comprises the heat dissipation assembly, a middle shell, a cover plate and a control plate, wherein one surface of the middle shell is matched with the heat dissipation shell to form a first sealing cavity, the other surface of the middle shell is matched with the cover plate to form a second sealing cavity, the circuit board is positioned in the first sealing cavity, the control plate is arranged in the second sealing cavity, a connector is arranged on the circuit board, a connector socket is arranged on the control plate, an opening for the connector to pass through is formed in the position, corresponding to the connector socket, of the middle shell, and the connector passes through the opening and is electrically connected with the connector socket.

The utility model also provides a vacuum pump which comprises the frequency converter.

According to the heat dissipation assembly in the technical scheme, the heating device is mounted on the circuit board, and the heat dissipation assembly comprises the heat dissipation shell and the heat conduction pad. The circuit board can be dismantled and fix on the heat dissipation casing, and the device that generates heat is located the heat dissipation intracavity, and the heat conduction pad is located the heat dissipation casing and is generated heat between the device, and one side butt in the device that generates heat, opposite side butt in the heat dissipation casing. Thus, when the heating device generates heat, the heat can be transmitted out through the heat conducting pad and the heat dissipation shell. The design of this structure need not to adopt encapsulating equipment to pour into heat-conducting glue and dispels the heat, avoids producing the waiting for the gel time to effectual production efficiency that has improved, manufacturing cost has been reduced. Moreover, the heating device can not be solidified with the heat conducting glue after being fixed, so that the heating device is more convenient to disassemble, assemble and maintain during subsequent maintenance, and the maintenance cost is lower.

In addition, among this application technical scheme, the distance that dispels the heat between the casing and the device that generates heat is less than the thickness of heat conduction pad, when the installation like this, not only make the heat conduction pad can be by firm extrusion between the casing that dispels the heat and the device that generates heat, form interference fit, be favorable to improving the stability of heat conduction pad installation, in addition, when the device that generates heat produces the electric heat, transmission that also can be quick is to the casing that dispels the heat and distribute away to be favorable to improving the radiating efficiency.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

FIG. 1 is an exploded view of a heat sink assembly and a heat generating device according to the present invention; wherein, the directions of the dotted arrows in the figure are the heat transfer direction and the installation direction;

fig. 2 is an exploded view of a partial structure of the frequency converter of the present invention.

The reference numbers illustrate:

reference numerals	Name (R)	Reference numerals	Name (R)
				10	Heat radiation casing	11	Heat dissipation cavity
30	Heat conducting pad	50	Heat dissipation tooth
				100	Heat radiation assembly	20	Heating device
40	Circuit board	41	Connector with a locking member
				60	Driving board	300	Middle shell
400	Cover plate	500	Control panel
				1000	Frequency converter

The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.

In the present invention, unless otherwise expressly stated or limited, the terms "connected," "secured," and the like are to be construed broadly, and for example, "secured" may be a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In addition, the descriptions related to "first", "second", etc. in the present invention are only for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout is to include three juxtapositions, exemplified by "A and/or B," including either the A or B arrangement, or both A and B satisfied arrangement. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.

The present invention provides a heat dissipation assembly 100.

Referring to fig. 1, in the embodiment of the present invention, the heat dissipation assembly 100 includes a circuit board 40 and a heat generating device 20 mounted on the circuit board 40, the heat dissipation assembly 100 includes a heat dissipation housing 10 and a thermal pad 30, the heat dissipation housing 10 includes a heat dissipation cavity 11, the circuit board 40 is detachably fixed on the heat dissipation housing 10, and the heat generating device 20 is located in the heat dissipation cavity 11; the heat conducting pad 30 is disposed between the heat dissipating housing 10 and the heat generating device 20, and one side of the heat conducting pad abuts against the heat generating device 20, and the other side of the heat conducting pad abuts against the heat dissipating housing 10, so that heat generated by the heat generating device 20 is sequentially transmitted through the heat conducting pad 30 and the heat dissipating housing 10.

The heat generating device 20 may be an electronic device, such as an inductor, a capacitor, a transformer, etc., disposed on the circuit board 40. Usually, a driving board 60 for driving the circuit board is further disposed in the heat dissipation chamber 11, and the driving board 60 can also conduct heat by using the heat conduction pad 30, so that when electric heat is generated during operation, the electric heat can be conducted to the heat dissipation housing 10 through the heat conduction pad 30, and then dissipated out through the heat dissipation housing 10.

In this embodiment, the heat dissipation housing 10 may form a box structure, and the heat conducting pad 30 and the heat generating device 20 are both located in the heat dissipation cavity 11 of the heat dissipation housing 10. With such an arrangement, the heat dissipation housing 10 can also spontaneously form protection for the heat conduction pad 30 and the heat generating device 20, so that the heat dissipation housing is not easily damaged and is beneficial to saving of installation space. The thermal pad 30 should be an insulating pad to ensure that the heat generating device 20 does not leak electricity to cause a safety hazard.

Therefore, the heat dissipation assembly 100 according to the present invention is formed by mounting the heat generating device 20 on the circuit board 40, and the heat dissipation assembly 100 further includes a heat dissipation housing 10 and a thermal pad 30. The circuit board 40 is detachably fixed on the heat dissipation housing 10, the heat generating device 20 is located in the heat dissipation cavity 11, the heat conducting pad 30 is disposed between the heat dissipation housing 10 and the heat generating device 20, and one side of the heat conducting pad abuts against the heat generating device 20 and the other side of the heat conducting pad abuts against the heat dissipation housing 10. Thus, when the heat generating device 20 generates heat, the heat can be transferred out through the thermal pad 30 and the heat dissipation housing 10. The design of this structure need not to adopt encapsulating equipment to pour into heat-conducting glue and dispels the heat, avoids producing the waiting for the gel time to effectual production efficiency that has improved, manufacturing cost has been reduced. Moreover, after the heating device 20 is fixed, the heating device does not solidify with the heat conducting glue, so that the heating device is more convenient to disassemble, assemble and maintain during subsequent maintenance, and the maintenance cost is lower.

In an embodiment of the present application, a distance between the heat dissipation housing 10 and the heat generating device 20 is smaller than a thickness of the thermal pad 30. That is, the gap between the heat dissipation housing 10 and the heat generating device 20 is smaller than the thickness of the heat conduction pad 30, in this embodiment, the heat conduction pad 30 is a flexible pad with a certain elastic deformation capability, when being installed, the heat conduction pad 30 and the heat dissipation housing 10 can be fixed first, and then the heat generating device 20 is installed, so that the heat generating device 20 and the heat dissipation housing 10 form extrusion in the thickness direction of the heat conduction pad 30, and thus, in a natural state, the gap distance between the heat dissipation housing 10 and the heat generating device 20 is smaller than the thickness of the heat conduction pad 30. So, not only make the thermal pad 30 can be by firm extrusion between heat dissipation casing 10 and the device 20 that generates heat, be favorable to improving the stability of thermal pad 30 installation, moreover, when the device 20 that generates heat produced the electric heat, also can quick transmission to heat dissipation casing 10 and distribute away to be favorable to improving the radiating efficiency.

Further, in an embodiment of the present application, when the distance between the heat dissipation housing 10 and the heat generating device 20 is defined as L, and the thickness of the thermal pad 30 is defined as D, the following relationship is satisfied: l is more than or equal to 0.6D and less than or equal to 0.8D.

The ratio of the thickness of the heat conduction pad 30 to the distance between the heat dissipation shell 10 and the heating device 20 is set in the range, so that the heat dissipation shell 10 and the heating device 20 can not cause too large extrusion to the heat conduction pad 30 to cause deformation failure on one hand; on the other hand, the heat dissipation housing 10 and the heat generating device 20 can also be ensured to have enough extrusion force on the heat conducting pad 30, so that the heat conducting pad 30 can be stably installed and has high heat conducting capacity.

Further, in an embodiment, a surface area of a side of the heat-generating device 20 facing the heat-conducting pad 30 is greater than or equal to a surface area of a side of the heat-generating device 20 facing the heat-conducting pad 30. So set up for generate heat device 20 can laminate completely on thermal pad 30, thereby make the heat can carry out the quick conduction via thermal pad 30, and then be favorable to further promoting generate heat device 20's heat dispersion.

Of course, in another embodiment of the present application, when the side of the heat generating device 20 facing the thermal pad 30 is insulated, the surface area of the side of the thermal pad 30 facing the heat generating device 20 may be smaller than the surface area of the side of the heat generating device 20 facing the thermal pad 30. Therefore, the heat of the heat generating device 20 can be transmitted out through the thermal pad 30 under the condition of ensuring that the heat generating device 20 does not leak electricity through the heat dissipation casing 10.

In an embodiment of the present invention, the thermal pad 30 is bonded and fixed to one side of the heat dissipation housing 10, or the thermal pad 30 is bonded and fixed to one side of the heat generating device 20. The heat conducting pad 30 is fixed with the heat dissipation shell 10 or the heating device 20 by gluing, so that on one hand, the mounting stability of the heat conducting pad 30 can be improved, and the heat conducting pad 30 is ensured not to easily fall off in the use process; on the other hand, the mode of pasting and assembling is high in subsequent maintainability and low in maintenance cost.

In the embodiment of the present application, the thermal pad 30 is a silica gel pad, a silicone grease pad, or a rubber pad. The heat-conducting silica gel pad and the heat-conducting silicone grease pad have good viscosity, flexibility, good compression performance and excellent heat conductivity. In the using process, air between the heating device 20 and the heat dissipation shell 10 can be completely exhausted, so that the full contact is achieved, and the heat dissipation effect is obviously improved. The heat-conducting rubber pad can adopt a silicon rubber substrate, and ceramic particles such as boron nitride, aluminum oxide and the like are used as fillers, so that the heat-conducting effect is very good. The thermal impedance is lower than other heat conducting materials under the same condition. In addition, under the condition that the heat-conducting rubber pad is subjected to a certain range of pressure, the thermal resistance of the heat-conducting rubber pad is reduced along with the increase of the compression amount, so that the heat-conducting rubber pad has higher heat-conducting capacity, and has better heat-conducting capacity when being extruded between the heat-radiating shell 10 and the heating device 20.

In addition, in order to make the heat dissipation housing 10 have good heat conductivity as well, so as to quickly dissipate the heat generated by the heat generating device 20, the heat dissipation housing 10 may be made of copper, aluminum or aluminum alloy.

Further, in an embodiment of the present application, a liquid cooling channel (not shown) is embedded in the heat dissipation housing 10. Through the liquid cooling water channel that sets up in heat dissipation casing 10 for when cold water circulates in the liquid cooling water channel, can take away the heat on the heat dissipation casing 10 fast, further promoted radiating efficiency of radiator unit 100.

Further, a plurality of heat dissipation teeth 50 are disposed on the outer side of the heat dissipation housing 10. It can be understood that, with such an arrangement, the heat dissipation area of the heat dissipation housing 10 can be increased by the heat dissipation teeth 50, so that the heat dissipation effect is better.

Referring to fig. 2, the present invention further provides a frequency converter 1000, where the frequency converter 1000 includes a heat dissipation assembly 100, and further includes a middle housing 300, a cover plate 400, and a control board 500, one surface of the middle housing 300 is matched with the heat dissipation housing 10 to form a first sealed cavity, the first sealed cavity is formed as the heat dissipation cavity 11, the other surface of the middle housing 300 is matched with the cover plate 400 to form a second sealed cavity, the circuit board 40 is located in the first sealed cavity, the control board 500 is located in the second sealed cavity, the circuit board 40 is provided with a connector 41, the control board 500 is provided with a connector socket, an opening through which the connector 41 passes is opened at a position on the middle housing 300 corresponding to the connector socket, and the connector 41 passes through the opening and is electrically connected to the connector socket. The specific structure of the heat dissipation assembly 100 refers to the above embodiments, and since the frequency converter 1000 adopts all technical solutions of all the above embodiments, at least all the beneficial effects brought by the technical solutions of the above embodiments are achieved, and no further description is given here.

The present invention further provides a vacuum pump, which includes a frequency converter 1000, and the specific structure of the frequency converter 1000 refers to the above embodiments, and since the vacuum pump adopts all technical solutions of all the above embodiments, the vacuum pump at least has all beneficial effects brought by the technical solutions of the above embodiments, and details are not repeated herein.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims

1. The utility model provides a heat radiation component, includes the circuit board and installs device that generates heat on the circuit board, its characterized in that, heat radiation component still includes:

2. The heat dissipating assembly of claim 1, wherein a surface area of a side of the thermal pad facing the heat generating device is greater than or equal to a surface area of a side of the heat generating device facing the thermal pad.

3. The heat dissipating assembly of claim 1, wherein said thermal pad is adhesively secured to one side of said heat dissipating housing;

or the heat conducting pad is bonded and fixed on one side of the heating device.

4. The heat dissipation assembly of claim 1, wherein a distance value between the heat dissipation housing and the heat generating device is defined as L, and a thickness of the thermal pad is defined as D, and a relationship is satisfied: l is more than or equal to 0.6D and less than or equal to 0.8D.

5. The heat dissipation assembly of claim 1, wherein the thermal pad is a silicone pad, a silicone grease pad, or a rubber pad.

6. The heat sink assembly of claim 1, wherein the heat sink housing is made of copper, aluminum or aluminum alloy.

7. The heat sink assembly of any of claims 1 to 6, wherein a liquid cooling gallery is embedded in the heat sink housing.

8. The heat dissipating assembly of claim 7, wherein the heat dissipating housing is provided with a plurality of heat dissipating teeth on an outer side thereof.

9. A frequency converter, characterized in that, includes the heat dissipation assembly of any one of claims 1 to 8, and further includes a middle shell, a cover plate and a control panel, one side of the middle shell cooperates with the heat dissipation housing to form a first sealed cavity, the other side of the middle shell cooperates with the cover plate to form a second sealed cavity, the circuit board is located in the first sealed cavity, the control panel is disposed in the second sealed cavity, the circuit board is provided with a connector, the control panel is provided with a connector socket, an opening for the connector to pass is provided at a position on the middle shell corresponding to the connector socket, and the connector passes through the opening and is electrically connected with the connector socket.

10. A vacuum pump, characterized in that it comprises a frequency converter according to claim 9.