CN214125850U - Bus driver with waterproof and heat dissipation functions for valve - Google Patents
Bus driver with waterproof and heat dissipation functions for valve Download PDFInfo
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- CN214125850U CN214125850U CN202120241023.7U CN202120241023U CN214125850U CN 214125850 U CN214125850 U CN 214125850U CN 202120241023 U CN202120241023 U CN 202120241023U CN 214125850 U CN214125850 U CN 214125850U
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- heat dissipation
- mounting groove
- heat
- waterproof
- dissipation plate
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Abstract
The utility model discloses a valve bus driver with waterproof and heat dissipation functions, which comprises a heat dissipation cover used for being connected with an electric box and a control circuit board provided with a plurality of electronic elements, wherein the heat dissipation cover is provided with a connecting screw used for being screwed with the electric box; be provided with the mounting groove on the cooling cap, the mounting groove bottom is provided with first heating panel, first heating panel bottom and the inseparable laminating of mounting groove bottom, control circuit board fixed mounting just is located first heating panel top in the mounting groove, and the mounting groove is located the control circuit board top and is provided with the second heating panel, and first heating panel and second heating panel are inside to have the heat dissipation chamber, and all is provided with a plurality of heat conduction fins on first heating panel and the second heating panel towards control circuit board one side, the inside cavity of heat conduction fin and with the heat dissipation chamber intercommunication. The utility model discloses not only have better sealed, waterproof, grease proofing performance, simultaneously, still have better heat dispersion, life that can effectual extension driver.
Description
Technical Field
The utility model relates to a drive arrangement for valve, concretely relates to bus driver for valve with waterproof and heat dissipation function.
Background
The proportional valve is a novel hydraulic control device. On the common pressure valve, flow valve and direction valve, the proportional electromagnet is used to replace the original control part, and the pressure, flow or direction of oil flow is controlled remotely according to the input electric signal. The proportional valve generally has pressure compensation performance, the output pressure and flow can not be influenced by load change, and the proportional valve is widely applied to the fields of metallurgy, ships and engineering machinery due to higher control precision and frequency response
In actual use, all parts of the valve are driven by the arranged driver, but when the valve is used, the control circuit board is directly arranged on the end cover, and the sealing, waterproof and oil-proof performances of the valve are very poor, so that the service life of the control circuit board is short; later, the control circuit board is encapsulated by adopting an encapsulating mode, although the sealing performance is greatly improved, the heat dissipation performance is very poor, and the electronic components on the control circuit board are in a high-heat environment for a long time, so that the service life of the driver is shortened.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a bus driver for valve with waterproof and heat dissipation function, it not only has better sealed, waterproof, grease proofing performance, simultaneously, still has better heat dispersion, life that can effectual extension driver.
In order to solve the technical problem, the utility model discloses the technical scheme who adopts is:
a valve bus driver with waterproof and heat-dissipating functions comprises a heat-dissipating cover used for being connected with an electrical box and a control circuit board provided with a plurality of electronic elements, wherein the heat-dissipating cover is provided with a connecting screw used for being in threaded connection with the electrical box;
the heat dissipation cover is provided with a mounting groove, the bottom of the mounting groove is provided with a first heat dissipation plate, the bottom of the first heat dissipation plate is tightly attached to the bottom of the mounting groove, the control circuit board is fixedly mounted in the mounting groove and positioned above the first heat dissipation plate, the mounting groove is internally provided with a second heat dissipation plate positioned above the control circuit board, heat dissipation cavities are formed in the first heat dissipation plate and the second heat dissipation plate, a plurality of heat conduction fins are arranged on one sides of the first heat dissipation plate and the second heat dissipation plate, which face the control circuit board, the heat conduction fins are hollow and communicated with the heat dissipation cavities, and the heat conduction fins are different in length and are arranged in gaps between adjacent electronic elements on the control circuit board;
the side edge of the heat dissipation cover is provided with a mounting seat, a micro fan is arranged in the mounting seat, air inlet pipes are arranged on the first heat dissipation plate and the second heat dissipation plate, the side wall of the heat dissipation cover is provided with a clamping groove, and the air inlet pipes are clamped in the clamping groove through rubber clamping cards; the mounting groove is filled with plastic sealant.
Wherein the plastic sealant is an epoxy pouring sealant.
Further optimize, first heating panel, second heating panel and heat conduction fin surface all are provided with the insulating layer.
Further optimize, the mounting groove bottom packing has the heat-conducting glue, and first heating panel is connected bottom the mounting groove through the heat-conducting glue.
Wherein, the bottom of the outer side of the heat dissipation cover is provided with a heat dissipation strip.
Wherein, the mount pad passes through screw fixed mounting on the heat dissipation lid.
Further optimize, the heat dissipation strip has a plurality ofly, and the interval between the adjacent heat dissipation strip is equal.
Compared with the prior art, the utility model discloses following beneficial effect has:
the utility model can effectively improve the sealing performance by encapsulating the control circuit board on the heat dissipation cover, so that the control circuit board has better waterproof and oil-proof performances; meanwhile, the heat dissipation efficiency is improved through the arranged first heat dissipation plate and the second heat dissipation plate, the heat dissipation capacity of heat dissipation in actual use can be directly transmitted to the first heat dissipation plate and the second heat dissipation plate, forced heat dissipation is carried out under the action of the micro fan, and the temperature of the driver can be reduced in a short time; meanwhile, the heat-conducting fins arranged in the gaps between the adjacent electronic elements can further improve the heat-radiating efficiency; in actual use, the number and the length of the heat conducting fins are set according to the distribution of electronic elements on the control circuit board; thus, make the utility model discloses not only have better sealed, waterproof, grease proofing performance, simultaneously, still have better heat dispersion, life that can effectual extension driver.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is a front view of fig. 1 according to the present invention.
Fig. 3 is a sectional view taken along the plane a-a in fig. 2 according to the present invention.
Fig. 4 is a schematic view of the connection relationship between the present invention and the electrical box.
Reference numerals: 1-an electrical box, 2-a heat dissipation cover, 3-an electronic element, 4-a control circuit board, 5-a connecting screw, 6-a mounting groove, 7-a first heat dissipation plate, 8-a second heat dissipation plate, 9-a heat dissipation cavity, 10-a heat conduction fin, 11-a mounting seat, 12-an air inlet pipe, 13-a clamping groove, 14-plastic sealant, 15-a heat dissipation strip and 16-a clamp.
Detailed Description
The present invention will be further described with reference to the following examples, which are only some, but not all, of the examples of the present invention. Based on the embodiments in the present invention, other embodiments used by those skilled in the art without creative work belong to the protection scope of the present invention.
Example one
As shown in the attached fig. 1-4 of the specification, the embodiment discloses a bus driver for a valve with waterproof and heat dissipation functions, which comprises a heat dissipation cover 2 used for being connected with an electrical box 1 and a control circuit board 4 provided with a plurality of electronic elements 3, wherein the heat dissipation cover 2 is provided with a connecting screw 5 used for being screwed with the electrical box 1;
the heat dissipation cover 2 is provided with a mounting groove 6, the bottom of the mounting groove 6 is provided with a first heat dissipation plate 7, the bottom of the first heat dissipation plate 7 is tightly attached to the bottom of the mounting groove 6, the control circuit board 4 is fixedly mounted in the mounting groove 6 and located above the first heat dissipation plate 7, a second heat dissipation plate 8 is arranged in the mounting groove 6 and located above the control circuit board 4, heat dissipation cavities 9 are formed in the first heat dissipation plate 7 and the second heat dissipation plate 8, a plurality of heat conduction fins 10 are arranged on the first heat dissipation plate 7 and the second heat dissipation plate 8 and face one side of the control circuit board 4, the heat conduction fins 10 are hollow and communicated with the heat dissipation cavities 9, the lengths of the heat conduction fins 10 are different, and the heat conduction fins are arranged in gaps between adjacent electronic elements 3 on the control circuit board 4;
a mounting seat 11 is arranged on the side edge of the heat dissipation cover 2, a micro fan is arranged in the mounting seat 11, air inlet pipes 12 are arranged on the first heat dissipation plate 7 and the second heat dissipation plate 8, a clamping groove 13 is arranged on the side wall of the heat dissipation cover 2, and the air inlet pipes 12 are clamped in the clamping groove 13 through rubber clamps 16; the mounting groove 6 is filled with a molding compound 14.
Wherein the air inlet pipe 12 is communicated with the heat dissipation cavity 9.
Wherein the molding compound 14 is an epoxy potting compound.
Preferably, the surfaces of the first heat dissipation plate 7, the second heat dissipation plate 8 and the heat conduction fins 10 are all provided with insulating layers. The insulating purpose can be played through the insulating layer that sets up, prevents that electronic component 3 on control circuit board 4 from taking place the short circuit, guarantees that the driver normally works.
The control circuit board 4 is encapsulated on the heat dissipation cover 2, so that the sealing performance of the control circuit board can be effectively improved, and the control circuit board has better waterproof and oil-proof performances; meanwhile, the heat dissipation efficiency is improved through the first heat dissipation plate 7 and the second heat dissipation plate 8, the heat dissipation amount of heat dissipation in actual use can be directly transmitted to the first heat dissipation plate 7 and the second heat dissipation plate 8, forced heat dissipation is carried out under the action of the micro fan, and the temperature of the driver can be reduced in a short time; meanwhile, the heat-conducting fins 10 arranged in the gaps between the adjacent electronic components 3 can further improve the heat-dissipating efficiency; in actual use, the number and length of the heat-conducting fins 10 are set according to the distribution of the electronic components 3 on the control circuit board 4; thus, make the utility model discloses not only have better sealed, waterproof, grease proofing performance, simultaneously, still have better heat dispersion, life that can effectual extension driver.
Further optimization, the bottom of the mounting groove 6 is filled with heat conducting glue, and the first heat dissipation plate 7 is connected with the bottom of the mounting groove 6 through the heat conducting glue; the heat-conducting glue that sets up like this can make first heating panel 7 and radiator cap 2 in close contact with, improves its heat-conduction efficiency, and then the holistic radiating efficiency of effectual improvement driver.
Further optimization, the bottom of the outer side of the heat dissipation cover 2 is provided with a heat dissipation strip 15; the number of the heat dissipation strips 15 is multiple, and the intervals between the adjacent heat dissipation strips 15 are equal; the heat dissipation efficiency can be further improved by the arranged heat dissipation strips 15.
In the present embodiment, the mount 11 is fixedly mounted on the heat dissipation cover 2 by screws.
Example two
The present embodiment is further optimized based on the first embodiment, and in the present embodiment, the surfaces of the first heat dissipation plate 7 and the second heat dissipation plate 8 are continuously bent in a V shape.
Thus, the heat conduction area can be further increased in actual use, and the heat dissipation efficiency can be further improved.
As an optimization option, the surfaces of the first heat dissipation plate 7 and the second heat dissipation plate 8 are in a wave-shaped structure.
While the preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the appended claims be interpreted as including the preferred embodiment and all such alterations and modifications as fall within the scope of the invention. The above description is only exemplary of the present invention and should not be taken as limiting, and all changes, equivalents, and improvements made within the spirit and principles of the present invention should be understood as being included in the scope of the present invention.
Claims (7)
1. The utility model provides a bus driver for valve with waterproof and heat dissipation function which characterized in that: the heat dissipation cover is provided with a connecting screw for being in threaded connection with the electrical box;
the heat dissipation cover is provided with a mounting groove, the bottom of the mounting groove is provided with a first heat dissipation plate, the bottom of the first heat dissipation plate is tightly attached to the bottom of the mounting groove, the control circuit board is fixedly mounted in the mounting groove and positioned above the first heat dissipation plate, the mounting groove is internally provided with a second heat dissipation plate positioned above the control circuit board, heat dissipation cavities are formed in the first heat dissipation plate and the second heat dissipation plate, a plurality of heat conduction fins are arranged on one sides of the first heat dissipation plate and the second heat dissipation plate, which face the control circuit board, the heat conduction fins are hollow and communicated with the heat dissipation cavities, and the heat conduction fins are different in length and are arranged in gaps between adjacent electronic elements on the control circuit board;
the side edge of the heat dissipation cover is provided with a mounting seat, a micro fan is arranged in the mounting seat, air inlet pipes are arranged on the first heat dissipation plate and the second heat dissipation plate, the side wall of the heat dissipation cover is provided with a clamping groove, and the air inlet pipes are clamped in the clamping groove through rubber clamping cards; the mounting groove is filled with plastic sealant.
2. The valve bus driver with waterproof and heat dissipation functions as claimed in claim 1, wherein: the plastic sealant is epoxy pouring sealant.
3. The valve bus driver with waterproof and heat dissipation functions as claimed in claim 1, wherein: insulating layers are arranged on the surfaces of the first heat dissipation plate, the second heat dissipation plate and the heat conduction fins.
4. The valve bus driver with waterproof and heat dissipation functions as claimed in claim 1, wherein: the mounting groove bottom packing has heat-conducting glue, and first heating panel is connected bottom the mounting groove through heat-conducting glue.
5. The valve bus driver with waterproof and heat dissipation functions as claimed in claim 4, wherein: the bottom of the outer side of the heat dissipation cover is provided with a heat dissipation strip.
6. The valve bus driver with waterproof and heat dissipation functions as claimed in any one of claims 1 to 5, wherein: the mounting seat is fixedly mounted on the heat dissipation cover through screws.
7. The valve bus driver with waterproof and heat dissipation functions as claimed in claim 4, wherein: the heat dissipation strip has a plurality ofly, and the interval between the adjacent heat dissipation strip is equal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120241023.7U CN214125850U (en) | 2021-01-28 | 2021-01-28 | Bus driver with waterproof and heat dissipation functions for valve |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120241023.7U CN214125850U (en) | 2021-01-28 | 2021-01-28 | Bus driver with waterproof and heat dissipation functions for valve |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214125850U true CN214125850U (en) | 2021-09-03 |
Family
ID=77496078
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120241023.7U Active CN214125850U (en) | 2021-01-28 | 2021-01-28 | Bus driver with waterproof and heat dissipation functions for valve |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214125850U (en) |
-
2021
- 2021-01-28 CN CN202120241023.7U patent/CN214125850U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230314 Address after: 412000 No. 6, Chadong Road, Hengdian Industrial Park, Liling Economic Development Zone, Zhuzhou City, Hunan Province Patentee after: Hunan Valzhibao Digital Hydraulic Components Co.,Ltd. Address before: 610400 energy conservation and environmental protection industrial park, huaikou Town, Jintang County, Chengdu City, Sichuan Province 215b Patentee before: Chengdu vazhibao digital hydraulic equipment Co.,Ltd. |
|
| TR01 | Transfer of patent right |