CN219421389U - Liquid cooling heat dissipation power module - Google Patents

Abstract

The utility model relates to a liquid cooling heat dissipation power module, which comprises a heating body and a cooling groove, wherein a plurality of power switch tubes are arranged in the heating body, one surface of the heating body is a heat dissipation surface, and a plurality of protruding heat dissipation columns are arranged on the surface of the heat dissipation surface; the both sides of cooling tank are provided with inlet and liquid outlet, and the heat-generating body is installed in the cooling tank, and the heat dissipation face sets up in order to form the cooling chamber in the opening surface seal of cooling tank, and a plurality of heat dissipation cylinders set up in the cooling intracavity, and the cooling chamber flows the coolant liquid in order to dispel the heat to the heat dissipation cylinder, and it still is provided with the breakwater to be close to the liquid outlet in the cooling tank, and a plurality of through-holes are seted up to the breakwater, and the coolant liquid gets into the cooling intracavity from the inlet, with the heat dissipation cylinder contact in order to dispel the heat to it after, is discharged by the liquid outlet again through the through-hole of breakwater. Through setting up the breakwater for coolant liquid in the cooling chamber is in full state all the time, thereby effectually promoted coolant liquid to the heat transfer efficiency of heat dissipation cylinder, improved whole power module heat dissipation ability.

Description

Liquid cooling heat dissipation power module

Technical Field

The utility model relates to a liquid cooling heat dissipation power module, and belongs to the technical field of semiconductor circuit application.

Background

The current power modules such as SiC (silicon carbide) modules are increasingly widely applied to the fields of new energy automobiles, photovoltaics and the like due to the characteristics of low loss, high junction temperature and high power density. In order to solve the high heat dissipation requirement, some power modules adopt a liquid cooling heat dissipation mode, namely, a radiator of the power module is immersed in a water tank filled with flowing liquid, the radiator is dissipated through the liquid flowing continuously through the water tank, the heat dissipation efficiency of the power module is obviously improved compared with that of the traditional heat dissipation mode of heat exchange with air, but the problem that the liquid in the water tank cannot fill the cavity in the whole water tank is found in the application process of the water tank heat dissipation mode, so that the heat dissipation capacity of the water tank cannot be fully exerted.

Disclosure of Invention

The utility model aims to solve the technical problem that the heat dissipation capacity cannot be utilized to the maximum extent due to the fact that the liquid in the water tank cannot fill the whole cavity in the water tank in the existing liquid cooling type power module.

Specifically, the utility model discloses a power module of liquid cooling heat dissipation, the power module includes:

the heating element is internally provided with a plurality of power switch tubes, one surface of the heating element is a radiating surface, and a plurality of protruding radiating columns are arranged on the surface of the radiating surface;

the cooling tank, the both sides of cooling tank are provided with inlet and liquid outlet, the heat-generating body is installed in the cooling tank, the cooling surface sets up in order to form the cooling chamber in the opening surface seal of cooling tank, a plurality of heat dissipation cylinder sets up in the cooling chamber, the cooling chamber flows the coolant liquid in order to dispel the heat to the heat dissipation cylinder, it still is provided with the breakwater to be close to the liquid outlet in the cooling tank, a plurality of through-holes are seted up to the breakwater, the coolant liquid gets into the cooling intracavity from the inlet, after with the heat dissipation cylinder contact in order to dispel the heat it, through the through-hole of breakwater again by the liquid outlet discharge.

Optionally, the sum of the areas of the plurality of through holes is 70% to 95% of the area of the liquid inlet.

Optionally, the through holes are arranged close to two side edges of the water baffle, and the two side edges are contacted with two side inner wall surfaces of the cooling groove.

Optionally, the water baffle is square, and the plurality of through holes are arranged near four corners of the water baffle.

Optionally, the heat dissipation surface of the heating element is further provided with a boss, the plurality of heat dissipation cylinders are arranged on the boss, and the surface size of the boss is matched with the opening of the cooling groove.

Optionally, the heating element includes:

the circuit substrate assembly is provided with a power switch tube and a radiating surface;

and a sealing body which covers the circuit substrate except the heat radiating surface.

Optionally, the circuit substrate assembly includes:

the metal substrate comprises a mounting surface and a radiating surface;

the insulating layers are connected to the mounting surface;

and the circuit wiring layer is connected with the insulating layer and is provided with a plurality of chip bonding pads for installing the power switch tube.

Optionally, the heating element further includes:

an outer frame in which the sealing body is accommodated;

and the upper cover plate is arranged at the opening of the outer frame, and a gap is reserved between the upper cover plate and the sealing body.

The utility model relates to a liquid cooling heat dissipation power module, which comprises a heating body and a cooling groove, wherein a plurality of power switch tubes are arranged in the heating body, one surface of the heating body is a heat dissipation surface, and a plurality of protruding heat dissipation columns are arranged on the surface of the heat dissipation surface; the both sides of cooling tank are provided with inlet and liquid outlet, and the heat-generating body is installed in the cooling tank, and the heat dissipation face sets up in order to form the cooling chamber in the opening surface seal of cooling tank, and a plurality of heat dissipation cylinders set up in the cooling intracavity, and the cooling chamber flows the coolant liquid in order to dispel the heat to the heat dissipation cylinder, and it still is provided with the breakwater to be close to the liquid outlet in the cooling tank, and a plurality of through-holes are seted up to the breakwater, and the coolant liquid gets into the cooling intracavity from the inlet, with the heat dissipation cylinder contact in order to dispel the heat to it after, is discharged by the liquid outlet again through the through-hole of breakwater. Through setting up the breakwater for coolant liquid in the cooling chamber is in full state all the time, thereby makes the heat dissipation cylinder infiltrate in coolant liquid completely, thereby effectually promoted coolant liquid to the heat transfer efficiency of heat dissipation cylinder, improved whole power module heat dissipation ability.

Drawings

FIG. 1 is a schematic diagram of an internal circuit of a power module according to an embodiment of the utility model;

FIG. 2 is a schematic diagram of a power module according to an embodiment of the utility model;

FIG. 3 is a cross-sectional view taken along the X-X' direction in FIG. 2;

FIG. 4 is a partially exploded view of a power module according to an embodiment of the utility model;

FIG. 5 is a schematic diagram showing a structure of a power module according to an embodiment of the present utility model with a heating element with an upper cover removed;

FIG. 6 is a schematic diagram of a power module with a heat-dissipating column of a heat-generating body facing upwards;

FIG. 7 is a schematic diagram of a water tank of a power module according to an embodiment of the utility model;

fig. 8 is a schematic structural diagram of another view direction of a water tank of a power module according to an embodiment of the present utility model.

Reference numerals:

the heat-generating body 10, the sealing body 11, the power switch tube 12, the chip bonding pad 13, the insulating layer 14, the metal substrate 15, the heat dissipation column 16, the flywheel diode 17, the upper cover plate 20, the outer frame 30, the cooling tank 40, the liquid inlet 41, the liquid outlet 42, the water baffle 50 and the through hole 51.

Detailed Description

In order to make the present application solution better understood by those skilled in the art, the following description will be made in detail and with reference to the accompanying drawings in the embodiments of the present application, it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, shall fall within the scope of the present application.

In addition, in the case where the structure or the function is not conflicting, the embodiments of the present utility model and the features in the embodiments may be combined with each other. The utility model will be described in detail below with reference to the drawings in connection with embodiments.

The utility model provides a liquid cooling heat dissipation power module, as shown in fig. 1 to 8, the power module comprises a heating body 10 and a cooling groove 40, wherein a plurality of power switch tubes 12 are arranged in the heating body 10, one surface of the heating body 10 is a heat dissipation surface, and a plurality of convex heat dissipation columns 16 are arranged on the surface of the heat dissipation surface. The circuit formed by the plurality of power switching transistors 12 provided inside the heating element 10 may be a circuit as shown in fig. 1, in which Q1, Q2, Q3, Q4, Q5, Q6 are three-pole transistors of the power switching transistors 12, the three-pole transistors may be IGBT (Insulated Gate Bipolar Transistor ) transistors of SiC material, and D1, D2, D3, D4, D5, D6 are fast recovery diodes connected in parallel to the collector and emitter of each IGBT transistor. Wherein Q1 and Q2 form a bridge arm, form an output end U, Q3 and Q4 form a bridge arm, form an output end V, Q5 and Q6 form a bridge arm, so as to form an inversion unit composed of three bridge arms, wherein a triode transistor Q1 is an upper bridge arm, a triode transistor Q2 is a lower bridge arm, a triode transistor Q3 is an upper bridge arm, a triode transistor Q4 is a lower bridge arm, a triode transistor Q5 is an upper bridge arm, and a triode transistor Q6 is a lower bridge arm. In fig. 1, the three-stage transistor is an IGBT transistor made of SiC, or may be a MOS (Metal Oxide Semiconductor ) transistor made of SiC.

Because the power module internally comprises 6 high-power triodes, in particular to a three-way bridge arm type triode transistor made of SiC material, the power density is high, the heat generation is higher, and the heat dissipation problem is better solved because the three-way bridge arm type triode transistor is miniaturized and the power is larger than that of other triodes made of other materials, a plurality of heat dissipation cylinders 16 are convexly arranged on the heat dissipation surface of the heating body 10 for heat dissipation, the heat dissipation cylinders 16 are cylinders, and can be in the cylinder shape as shown in fig. 3 to 5, and the heat dissipation cylinders 16 are arranged in the cooling groove 40. The two sides of the cooling tank 40 are provided with a liquid inlet 41 and a liquid outlet 42, the heating body 10 is mounted in the cooling tank 40, the heat dissipation surface and the opening surface of the cooling tank 40 are sealed to form a cooling cavity, a plurality of heat dissipation columns 16 are arranged in the cooling cavity, the cooling cavity flows cooling liquid to dissipate heat of the heat dissipation columns 16, a water baffle 50 is further arranged in the cooling tank 40 close to the liquid outlet 42, the water baffle 50 is provided with a plurality of through holes 51, the cooling liquid enters the cooling cavity from the liquid inlet 41 and contacts with the heat dissipation columns 16 to dissipate heat of the cooling liquid, and then is discharged from the liquid outlet 42 through the through holes 51 of the water baffle 50.

When the cooling liquid such as water in the conventional cooling tank 40 flows therein, there is a case where the cooling liquid cannot fill the entire cooling cavity, that is, a part of the heat dissipating cylinder 16 is exposed to the cooling liquid, so that the heat dissipation of the heat dissipating cylinder 16 cannot be achieved with maximum efficiency. In order to solve the problem, a water baffle 50 is disposed at the liquid outlet 42, a plurality of through holes 51 are disposed on the water baffle 50, and four sides of the water baffle 50 are respectively abutted against the inner wall surface and the heat dissipation surface of the cooling tank 40, so that the cooling liquid can only flow out to the liquid outlet 42 via the through holes 51, the water baffle 50 plays a role in blocking the cooling liquid flowing in the cooling cavity, so that the liquid level of the cooling liquid in the cooling cavity is raised to fill the whole cooling cavity, and the heat dissipation cylinder 16 is fully immersed in the cooling liquid, thereby effectively improving the heat transfer efficiency of the cooling liquid to the heat dissipation cylinder 16 and the heat dissipation capacity of the whole power module.

In some embodiments of the present utility model, in order to enable the cooling liquid in the cooling cavity to always fill the cooling cavity, the sum of the areas of the plurality of through holes 51 is smaller than the area of the liquid inlet 41, so that the flow rate of the cooling liquid passing through the liquid inlet 41 is larger than the flow rate of the cooling liquid passing through the plurality of through holes 51, because the water baffle 50 is arranged close to the liquid outlet 42, the space between the liquid inlet 41 and the water baffle 50 is always in a state of being full of the cooling liquid, thereby ensuring that all the heat dissipation columns 16 in the space are completely infiltrated. In order to prevent the flow rate of the cooling liquid in the cooling cavity from being too low, so as to affect the heat transfer efficiency, a proper value needs to be removed from the ratio between the sum of the areas of the plurality of through holes 51 and the area of the liquid inlet 41, specifically, the sum of the areas of the plurality of through holes 51 is 70% to 95% of the area of the liquid inlet 41, for example, the sum of the areas of the plurality of through holes 51 can be 90%, so that the sum of the areas of the plurality of through holes 51 is slightly smaller than the area of the liquid inlet 41, and the flow rate of the cooling liquid is not too low when the cooling liquid in the cooling cavity is ensured to be filled in the cooling cavity all the time. The area of the liquid outlet 42 can be the same as that of the liquid inlet 41, for example, when the liquid outlet and the liquid inlet are both circular, the apertures of the liquid outlet and the liquid inlet are the same, so that the cooling tank 40 can be conveniently manufactured.

Further, in some embodiments of the present utility model, as shown in fig. 7 and 8, a plurality of through holes 51 are provided near both side edges of the water deflector 50, both side edges being in contact with both side inner wall surfaces of the cooling tank 40. That is, the through holes 51 are disposed near the left and right sides of the water baffle 50, and the liquid outlet 42 is disposed in the middle area of the water baffle 50, so that the arrangement of the liquid outlet 42 is staggered, and the cooling liquid can be more effectively filled in the cooling cavity. Preferably, the number of the through holes 51 is four, and the through holes are respectively arranged at four corners close to the water baffle 50, as shown in fig. 7 and 8, so that the positions of the four through holes 51 are staggered furthest relative to the position of the liquid outlet 42, and the optimal effect that the cooling liquid fills the cooling cavity is realized.

In some embodiments of the present utility model, as shown in fig. 3 to 6, the heat dissipation surface of the heat generating body 10 is further provided with a boss, and a plurality of heat dissipation columns 16 are disposed on the boss, and the size of the surface of the boss is matched with the opening of the cooling groove 40, so that when the heat generating body 10 is installed on the cooling groove 40, the boss stretches into the opening of the cooling groove 40 to realize the installation and positioning of the heat generating body 10, the heat dissipation surface is abutted against the surface of the cooling groove 40, and the sealing connection of the heat dissipation surface and the cooling groove 40 is realized by coating sealant between the two abutted surfaces. The sum of the length of the heat dissipation cylinder 16 and the height of the boss is not greater than the opening depth of the cooling groove 40, thereby realizing the smooth installation of the heating element 10 on the cooling groove 40. Specifically, the sum of the length of the heat dissipation cylinder 16 and the height of the boss is 90% to 98% of the opening depth of the cooling slot 40, and the sum of the height of the single plate and the height of the boss is equal to the opening depth of the cooling slot 40, so that the maximum utilization of the opening inner space of the cooling slot 40 can be realized, the thickness of the cooling slot 40 is as small as possible, and the miniaturization of the whole power module is facilitated.

In some embodiments of the present utility model, as shown in fig. 3 to 5, the heating body 10 includes a circuit substrate assembly and a sealing body 11, wherein the circuit substrate assembly is provided with a heat radiating surface, and a power switch tube 12 is mounted on the circuit substrate assembly; the sealing body 11 covers a portion of the circuit board other than the heat radiation surface. The sealing body 11 can be encapsulated by adopting a silicone gel material sealing material through a mold encapsulation mode, wherein the silicone gel has stable dielectric insulation property, adhesiveness and self-repairing property, and plays a good role in protecting the switch tube. The sealing body is half-coated on the circuit board, that is, the sealing material mainly coats the part of the circuit board of the power switch tube 12 of the circuit board, and the heat radiation surface is exposed from the sealing body 11.

Specifically, as shown in fig. 3 and 5, the circuit substrate assembly includes a metal substrate 15, an insulating layer 14, and a circuit wiring layer connected in this order. The metal substrate 15 may be a rectangular plate made of aluminum 1100, 5052 or the like, and the insulating layer 14 may be made of a Si3N4 ceramic substrate. The metal substrate 15 is disposed at the bottom layer of the circuit substrate assembly, and actually forms the boss in the above embodiment. The circuit wiring layer may be copper foil etched, and the surface of the circuit wiring layer is provided with a plurality of chip pads 13 to form element mounting sites for mounting the power switching transistor 12 and the flywheel diode 17.

Further, as shown in fig. 2 to 4, the heating element 10 further includes an outer frame 30 and an upper cover plate 20, wherein the outer frame 30 is provided with a sealing body 11 accommodated in the outer frame 30, the upper cover plate 20 is mounted on an opening of the outer frame 30, and a gap is left between the upper cover plate 20 and the sealing body 11. Wherein the outer frame 30 and the upper cover plate 20 can be made of PBT engineering plastics. The outer frame 30 and the upper cover plate 20 play a role in protecting the sealing body 11, and the circuit wiring layer and the power switch tube 12 which are internally coated are prevented from being damaged by external force on the sealing body 11. With the addition of the outer frame, the sealing body of the silicone gel material can encapsulate the circuit substrate assembly in a potting mode.

In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present utility model, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

While embodiments of the present utility model have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the utility model, and that variations, modifications, alternatives and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the utility model.

Claims (8)

1. A power module for liquid cooling, the power module comprising:

the heating element is internally provided with a plurality of power switch tubes, one surface of the heating element is a radiating surface, and a plurality of protruding radiating columns are arranged on the surface of the radiating surface;

the cooling tank, the both sides of cooling tank are provided with inlet and liquid outlet, the heat-generating body install in the cooling tank, the cooling surface in the open area seal arrangement of cooling tank is in order to form the cooling chamber, a plurality of the cooling cylinder set up in the cooling intracavity, the cooling chamber flow coolant liquid is in order to right the cooling cylinder dispels the heat the cooling tank is close to the liquid outlet goes out still to be provided with the breakwater, a plurality of through-holes are seted up to the breakwater, the coolant liquid follow the inlet gets into the cooling intracavity, with after the cooling cylinder contacts in order to dispel the heat to it, the process the through-hole of breakwater is again by the liquid outlet discharges.

2. The power module of claim 1, wherein a sum of areas of the plurality of through holes is 70% to 95% of an area of the liquid inlet.

3. The power module of claim 2, wherein the plurality of through holes are disposed adjacent to both side edges of the water deflector, the both side edges being in contact with both side inner wall surfaces of the cooling tank.

4. A power module according to claim 3, wherein the water deflector is square, and the plurality of through holes are provided near four corners of the water deflector.

5. The power module of claim 1, wherein the heat dissipating surface of the heat generating body is further provided with a boss, and a plurality of the heat dissipating cylinders are disposed on the boss, and the surface of the boss is sized to fit the opening of the cooling tank.

6. The power module of claim 1, wherein the heat-generating body comprises:

the circuit substrate assembly is provided with the power switch tube and is provided with the radiating surface;

and a sealing body that covers a portion of the circuit board other than the heat radiation surface.

7. The power module of claim 6, wherein the circuit substrate assembly comprises:

the metal substrate comprises a mounting surface and a radiating surface;

the insulating layers are connected to the mounting surface;

and the circuit wiring layer is connected with the insulating layer and is provided with a plurality of chip bonding pads for installing the power switch tube.

8. The power module of claim 6, wherein the heat generator further comprises:

the outer frame is used for accommodating the sealing body in the outer frame;

the upper cover plate is arranged at the opening of the outer frame, and a gap is reserved between the upper cover plate and the sealing body.