CN218888766U

CN218888766U - Hybrid packaging structure of integrated circuit chip

Info

Publication number: CN218888766U
Application number: CN202222745804.7U
Authority: CN
Inventors: 孙海浪; 邓华利
Original assignee: Jiangxi Tianyi Semiconductor Co ltd
Current assignee: Jiangxi Tianyi Semiconductor Co ltd
Priority date: 2022-10-18
Filing date: 2022-10-18
Publication date: 2023-04-18
Anticipated expiration: 2032-10-18

Abstract

The utility model discloses an integrated circuit chip's mixed packaging structure, including first circuit board and second circuit board, first circuit board top is provided with the second circuit board, and first circuit board and second circuit board surface all install integrated circuit chip. Has the advantages that: the utility model discloses a socket, when installing integrated circuit chip, can set up the locating hole on first circuit board and second circuit board surface, fix the socket in locating hole department through the installation screw, then can insert integrated circuit chip's pin between the elasticity holding strip, the elasticity holding strip receives to warp after the extrusion and produces the resilience force and carry the pin, thereby fixed pin, when taking place the installation error, the staff only needs the rebound integrated circuit chip to be extracted the pin, convenient rectification, this device socket is direct through the installation screw fixation, and simple to operate is swift, and need not reequip the pin, the convenience of use has further been improved.

Description

Hybrid packaging structure of integrated circuit chip

Technical Field

The utility model relates to an integrated circuit chip technical field particularly, relates to an integrated circuit chip's mixed packaging structure.

Background

The integrated circuit chip is an electronic element comprising a silicon substrate, at least one circuit, a fixed seal ring, a grounding ring and at least one protective ring, and the integrated circuit chip is generally packaged on a circuit board, and is widely packaged by injection molding at present.

After retrieval, the application discloses a hybrid packaging structure of a micro electro mechanical chip and an integrated circuit chip, which is CN215711764U, and is named as a micro electro mechanical chip and integrated circuit chip, and the application provides a current hybrid packaging module, wherein a plurality of micro electro mechanical chips and a plurality of integrated circuit chips are all installed in a circuit board, so that the area of the whole packaging module is large, the whole packaging module is installed in other equipment and is troublesome, the occupied area is small, the utilization rate of other spaces on a main board of the equipment is low, workers weld pins of the micro electro mechanical chips and the integrated circuit chips on the circuit board, if welding errors occur, the later-period disassembly and installation are troublesome, and a large amount of time is wasted, an upper layer and a lower layer arrangement mode is adopted, the occupied space is reduced, meanwhile, slots are arranged on the surface of the circuit board, and placing grooves are arranged on the inner walls of the slots, the pins are fixed in a mode of sticking the rubber blocks and the fixture blocks in the placing grooves, however, the thickness of the circuit board is small, the slots for inserting the pins are difficult to open, meanwhile, the placing grooves are required to be arranged on the inner walls of the slots, the placing grooves are arranged on the inner walls, the placing grooves are difficult to open in the existing punching machine, even if the placing grooves are arranged, the rubber blocks and the fixture blocks are difficult to install in the placing grooves due to small sizes, so that the operation is difficult to directly weld, meanwhile, the pins are required to be processed, steps and processes are increased, the loss is avoided, the improvement can be further made, in addition, the plastic package glue and the protection glue are adopted to protect the circuit board, but the plastic package glue and the protection glue have poor thermal conductivity, the heat dissipation of the circuit board can be blocked, and the heat dissipation performance is poor, further improvements may also be made.

An effective solution to the problems in the related art has not been proposed yet.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

Not enough to prior art, the utility model provides an integrated circuit chip's hybrid package structure possesses simple to operate, the radiating advantage of being convenient for, and then solves the problem among the above-mentioned background art.

(II) technical scheme

For realizing above-mentioned simple to operate, the radiating advantage of being convenient for, the utility model discloses a concrete technical scheme as follows:

the utility model provides a hybrid packaging structure of integrated circuit chip, includes first circuit board and second circuit board, first circuit board top is provided with the second circuit board, and first circuit board and second circuit board surface all install the integrated circuit chip to first circuit board and second circuit board surface all have the bayonet socket through installation screw fixed mounting, bayonet socket inner wall fixed mounting has the elasticity holding strip, integrated circuit chip surface mounting has the pin, and the pin inserts between the elasticity holding strip, the insulating conducting strip of second and first insulation conducting strip have been laid respectively to first circuit board top and second circuit board top, and the first circuit board and second circuit board outside have moulded plastics the packaging adhesive to the insulating conducting strip of second and first insulation conducting strip run through and extend the packaging adhesive.

Furthermore, the one end of the inserting seat is integrally connected with a mounting plate, and a mounting hole is formed in the surface of the mounting plate.

Furthermore, the plug socket is welded with the elastic clamping strip, and the plug socket and the elastic clamping strip are both made of copper materials.

Furthermore, the outer edge of the first circuit board is integrally connected with an ear plate, and a fixing bolt hole is formed in the surface of the ear plate.

Furthermore, the bottom surface of the second circuit board is embedded with a conductive socket, the top surface of the first circuit board is fixedly connected with a conductive column, and the conductive column is inserted into the conductive socket.

Furthermore, the first insulating heat-conducting fin and the second insulating heat-conducting fin are both provided with a plurality of, and the first insulating heat-conducting fin and the second insulating heat-conducting fin are evenly distributed.

(III) advantageous effects

Compared with the prior art, the utility model provides an integrated circuit chip's hybrid packaging structure possesses following beneficial effect:

(1) The utility model discloses a socket, when installing integrated circuit chip, can set up the locating hole on first circuit board and second circuit board surface, fix the socket in locating hole department through the installation screw, then can insert integrated circuit chip's pin between the elasticity holding strip, the elasticity holding strip receives to warp after the extrusion and produces the resilience force and carry the pin, thereby fixed pin, when taking place the installation error, the staff only needs the rebound integrated circuit chip to be extracted the pin, convenient rectification, this device socket is direct through the installation screw fixed, simple to operate is swift, and need not reequip the pin, the convenience of use has further been improved.

(2) The utility model discloses an insulating conducting strip of first insulation and second, insulating conducting strip of first insulation and second are located the top of second circuit board top and first circuit board respectively, and press close to second circuit board and first circuit board respectively, are convenient for pour out the encapsulation glue with the heat that second circuit board and first circuit board produced to improve the radiating efficiency, be convenient for dispel the heat.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a hybrid package structure of an integrated circuit chip according to the present invention;

fig. 2 is a side view of a hybrid package structure for an integrated circuit chip according to the present invention;

fig. 3 is an enlarged view of a node a of a hybrid package structure of an integrated circuit chip according to the present invention;

fig. 4 is a schematic structural diagram of the conductive socket according to the present invention.

In the figure:

1. a first circuit board; 2. a second circuit board; 3. packaging glue; 4. a first insulating thermally conductive sheet; 5. a second insulating heat-conducting sheet; 6. a conductive post; 7. a conductive socket; 8. an ear plate; 9. fixing bolt holes; 10. an integrated circuit chip; 11. a pin; 12. a socket; 13. an elastic holding strip; 14. mounting a plate; 15. mounting screws; 16. and (7) mounting holes.

Detailed Description

For further explanation of the embodiments, the drawings are provided as part of the disclosure and serve primarily to illustrate the embodiments and, together with the description, to explain the principles of operation of the embodiments, and to provide further explanation of the invention and advantages thereof, it will be understood by those skilled in the art that various other embodiments and advantages of the invention are possible, and that elements in the drawings are not to scale and that like reference numerals are generally used to designate like elements.

According to the utility model discloses an embodiment provides an integrated circuit chip's hybrid packaging structure.

Referring now to the drawings and the detailed description, as shown in fig. 1-4, a hybrid package structure of an ic chip according to an embodiment of the present invention includes a first circuit board 1 and a second circuit board 2, the second circuit board 2 is disposed above the first circuit board 1, the ic chip 10 is mounted on both surfaces of the first circuit board 1 and the second circuit board 2, a socket 12 is fixedly mounted on both surfaces of the first circuit board 1 and the second circuit board 2 via a mounting screw 15, an elastic clamping strip 13 is fixedly mounted on an inner wall of the socket 12, the elastic clamping strips 13 are symmetrically disposed in two numbers, the elastic clamping strips 13 are thin copper sheets, a distance between the elastic clamping strips 13 is smaller than a thickness of the pin 11, the pin 11 is mounted on a surface of the ic chip 10, and the pin 11 is inserted between the elastic clamping strips 13, a second insulating heat-conducting strip 5 and a first insulating heat-conducting strip 4 are respectively laid above the first circuit board 1 and the second circuit board 2, and the outer sides of the first circuit board 1 and the second circuit board 2 are injected with packaging glue 3, and the second insulating heat-conducting strip 5 and the first insulating heat-conducting strip 4 penetrate and extend out of the packaging glue 3, when the integrated circuit chip 10 is installed, positioning holes can be formed on the surfaces of the first circuit board 1 and the second circuit board 2, the inserting seat 12 is fixed at the positioning holes through the mounting screws 15, then the pins 11 of the integrated circuit chip 10 can be inserted between the elastic clamping strips 13, the elastic clamping strips 13 are deformed after being extruded to generate resilience to clamp the pins 11, thereby fixing the pins 11, when installation errors occur, a worker only needs to move the integrated circuit chip 10 upwards to extract the pins 11, and the arrangement and modification are convenient, the inserting seat 12 of the device is directly fixed through the mounting screws 15, simple to operate is swift, and need not reequip pin 11, has further improved the convenience of using, and simultaneously, first insulating conducting strip 4 and second insulating conducting strip 5 are located second circuit board 2 top and first circuit board 1's top respectively, and press close to second circuit board 2 and first circuit board 1 respectively, are convenient for pour out the encapsulation glue 3 with the heat that second circuit board 2 and first circuit board 1 produced to improve the radiating efficiency, be convenient for dispel the heat.

In one embodiment, a mounting plate 14 is integrally connected to one end of the socket 12, and a mounting hole 16 is formed on a surface of the mounting plate 14, and a mounting screw 15 penetrates through the mounting hole 16 to be fixedly connected with the positioning hole, which is a conventional fixing manner in the art.

In one embodiment, the socket 12 and the elastic holding strip 13 are welded, and the socket 12 and the elastic holding strip 13 are made of copper, so that the electric conductivity is good.

In one embodiment, the outer edge of the first circuit board 1 is integrally connected with an ear plate 8, and a fixing bolt hole 9 is formed in the surface of the ear plate 8, so that the mounting and fixing are convenient, which is a common fixing structure in the art.

In one embodiment, the bottom surface of the second circuit board 2 is embedded with the conductive socket 7, the top surface of the first circuit board 1 is fixedly connected with the conductive column 6, and the conductive column 6 is plugged into the conductive socket 7, so that the first circuit board 1 and the second circuit board 2 form a power communication structure, and the first circuit board 1 and the second circuit board 2 are arranged in a layered manner, thereby reducing the occupied mounting area.

In one embodiment, the first insulating thermal conduction sheet 4 and the second insulating thermal conduction sheet 5 are provided in plurality, and the first insulating thermal conduction sheet 4 and the second insulating thermal conduction sheet 5 are uniformly distributed, so that uniformity of thermal conduction is improved.

The working principle is as follows:

when installing integrated circuit chip 10, can set up the locating hole on first circuit board 1 and 2 surfaces of second circuit board, fix bayonet socket 12 in locating hole department through installation screw 15, then can insert integrated circuit chip 10's pin 11 between elasticity holding strip 13, elasticity holding strip 13 receives deformation production resilience force after the extrusion and cliies pin 11, thereby fix pin 11, when taking place the installation mistake, the staff only needs upwards to remove integrated circuit chip 10 can extract pin 11, convenient rectification, this device bayonet socket 12 is direct to be fixed through installation screw 15, simple to operate is swift, and need not carry out the packing glue 3 to pin 11, the convenience of use has further been improved, and simultaneously, first insulation conducting strip 4 and the insulating conducting strip 5 of second reequip are located second circuit board 2 top and first circuit board 1's top respectively, and press close to second circuit board 2 and first circuit board 1 respectively, be convenient for pour out the heat that second circuit board 2 and first circuit board 1 produced encapsulation glue 3, thereby the radiating efficiency is improved, be convenient for dispel the heat.

In the present invention, unless otherwise explicitly specified or limited, the terms "mounted", "disposed", "connected", "fixed", "screwed" and the like are to be understood broadly, and may be, for example, a fixed connection, a detachable connection, or an integral body; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate medium, and may be connected through the inside of two elements or in an interaction relationship between two elements, unless otherwise specifically defined, and the specific meaning of the above terms in the present invention will be understood by those skilled in the art according to specific situations.

The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a hybrid packaging structure of integrated circuit chip, its characterized in that, includes first circuit board (1) and second circuit board (2), first circuit board (1) top is provided with second circuit board (2), and first circuit board (1) and second circuit board (2) surface all install integrated circuit chip (10) to first circuit board (1) and second circuit board (2) surface all have bayonet socket (12) through mounting screw (15) fixed mounting, bayonet socket (12) inner wall fixed mounting has elasticity clamping bar (13), integrated circuit chip (10) surface mounting has pin (11), and pin (11) insert between elasticity clamping bar (13), second insulating conducting strip (5) and first insulating conducting strip (4) have been laid respectively to first circuit board (1) top and second circuit board (2) top, and first circuit board (1) and second circuit board (2) outside have moulded plastics packaging adhesive (3) to second insulating strip (5) and first insulating strip (4) extend through packaging adhesive (3).

2. The hybrid packaging structure of the integrated circuit chip as claimed in claim 1, wherein one end of the socket (12) is integrally connected to a mounting plate (14), and the surface of the mounting plate (14) is provided with a mounting hole (16).

3. The hybrid package structure of the ic chip as claimed in claim 1, wherein the socket (12) and the elastic clamping strip (13) are soldered, and the socket (12) and the elastic clamping strip (13) are made of copper.

4. The hybrid package structure of the integrated circuit chip as claimed in claim 1, wherein the first circuit board (1) is integrally connected with an ear plate (8) at an outer edge thereof, and the ear plate (8) has a fixing bolt hole (9) formed in a surface thereof.

5. The hybrid package structure of the ic chip as claimed in claim 1, wherein a conductive socket (7) is embedded in the bottom surface of the second circuit board (2), the conductive pillar (6) is fixedly connected to the top surface of the first circuit board (1), and the conductive pillar (6) is inserted into the conductive socket (7).

6. The hybrid packaging structure of the integrated circuit chip according to claim 1, wherein a plurality of the first insulating thermal conductive sheet (4) and the second insulating thermal conductive sheet (5) are provided, and the first insulating thermal conductive sheet (4) and the second insulating thermal conductive sheet (5) are uniformly distributed.