CN220290798U - High-power patch diode - Google Patents
High-power patch diode Download PDFInfo
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- CN220290798U CN220290798U CN202320883948.0U CN202320883948U CN220290798U CN 220290798 U CN220290798 U CN 220290798U CN 202320883948 U CN202320883948 U CN 202320883948U CN 220290798 U CN220290798 U CN 220290798U
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- heat
- heat conducting
- heat conduction
- strip
- hole
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- 238000004806 packaging method and process Methods 0.000 claims abstract description 27
- 230000017525 heat dissipation Effects 0.000 claims abstract description 14
- 238000005538 encapsulation Methods 0.000 claims description 5
- 238000009434 installation Methods 0.000 claims description 3
- 210000005056 cell body Anatomy 0.000 claims 3
- 210000004027 cell Anatomy 0.000 claims 1
- 238000009825 accumulation Methods 0.000 abstract description 6
- 238000010586 diagram Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 230000026683 transduction Effects 0.000 description 1
- 238000010361 transduction Methods 0.000 description 1
Abstract
The utility model relates to the technical field of diodes, in particular to a high-power patch diode, which comprises the following components: the packaging structure comprises a packaging body, a heat conducting plate and heat conducting strips, wherein the bottom center of the packaging body is in detachable connection with the heat conducting plate, grooves are formed in two sides of the bottom of the packaging body at equal intervals, and the heat conducting strips can be inserted into the grooves and are detachably connected with two sides of the heat conducting plate. The bottom of the high-power diode is additionally provided with a detachable heat conducting plate, two sides of the heat conducting plate are detachably connected with heat conducting strips, the heat conducting strips are connected to the bottom of the diode in an equidistant manner, and therefore the heat generated by chips inside the diode is conducted out through the heat conducting plates and the heat conducting strips. Meanwhile, the grooves are formed in the bottoms of the diodes, so that air flowing channels are conveniently reserved, heat accumulation is prevented, and heat dissipation is accelerated.
Description
Technical Field
The utility model relates to the technical field of diodes, in particular to a high-power patch diode.
Background
The chip diode is also called a transistor diode, which is an electronic device with unidirectional current conduction, and a PN junction and two lead terminals are arranged in the semiconductor diode, so that the electronic device has unidirectional current transduction according to the direction of externally applied voltage. In general, a chip transistor is a P-N junction interface formed by sintering a P-type semiconductor and an N-type semiconductor, and space charge layers are formed on both sides of the interface to form a self-built electric field.
However, when the existing patch diode is used, high temperature can occur after long-time working, and the prior art can cause difficult heat dissipation, so that the working efficiency of the patch diode is reduced, and the patch diode is easy to damage. Particularly, when the high-power patch diode is installed, the bottom and the circuit board are generally in a close contact state, and heat generated during the operation of the diode in the time of production can be accumulated at the close contact position of the circuit board and the diode, so that the heat is not easy to dissipate, and the normal operation of the diode is affected. For example, in the chinese patent CN217562553U issued in 2022, 10 and 11, when the main body is mounted on the circuit board by the pins, the bottom plate contacts the circuit board, and the concave groove can enable a gap to exist between the main body and the circuit board, so that air can flow in the concave groove, heat on the wall surface is accumulated, and normal operation of the diode is ensured. The scheme solves the air flow problem at the close contact position between the high-power patch diode and the circuit board to a certain extent. But only limited to air flow, the heat dissipation effect is not obvious enough, and no corresponding heat conduction structural support is provided, so that heat accumulation is prevented, and the heat dissipation problem is not solved.
In view of this, it is needed to design a high-power chip diode, wherein a detachable heat conducting plate is additionally arranged at the bottom of the high-power chip diode, heat conducting strips are detachably connected to two sides of the heat conducting plate, and the heat conducting strips are inserted at the bottom of the diode at equal intervals, so that the heat conducting plate and the heat conducting strips conduct out the heat generated by the chip inside the diode. Meanwhile, the grooves are formed in the bottoms of the diodes, so that air flowing channels are conveniently reserved, heat accumulation is prevented, and heat dissipation is accelerated.
Disclosure of Invention
In order to solve the defects in the prior art, the utility model aims to provide the high-power patch diode, wherein the bottom of the high-power patch diode is additionally provided with the detachable heat conducting plate, the two sides of the heat conducting plate are detachably connected with the heat conducting strips, and the heat conducting strips are inserted into the bottom of the diode at equal intervals, so that the heat conducting plate and the heat conducting strips conduct out the heat generated by a chip in the diode. Meanwhile, the grooves are formed in the bottoms of the diodes, so that air flowing channels are conveniently reserved, heat accumulation is prevented, and heat dissipation is accelerated.
In order to achieve the above object, the technical scheme of the present utility model is as follows: a high power chip diode comprising: the packaging structure comprises a packaging body, a heat conducting plate and heat conducting strips, wherein the bottom center of the packaging body is in detachable connection with the heat conducting plate, grooves are formed in two sides of the bottom of the packaging body at equal intervals, and the heat conducting strips can be inserted into the grooves and are detachably connected with two sides of the heat conducting plate.
Further, the package includes: the heat conducting device comprises pins, a packaging main body, heat radiating grooves and heat conducting grooves, wherein the pins are fixedly arranged at two side ends of the packaging main body, the heat conducting grooves are formed in the center of the bottom of the packaging main body and matched with the heat conducting plates, the heat radiating grooves are formed in two sides of the heat conducting grooves at equal intervals, and the heat conducting strips can be embedded in the heat radiating grooves.
Further, the heat conduction groove includes: the main groove is matched with the outer diameter surface of the heat conducting plate, the contact heat conducting holes are formed in the groove bottom of the main groove at equal intervals, the contact heat conducting holes are communicated with the inside of the packaging body, and the bolts are fixed Kong Kaishe at two end parts of the groove bottom of the main groove.
Further, the heat conductive plate includes: the heat conduction device comprises a main board body, heat conduction columns, heat conduction strip mounting holes and bolt holes, wherein the heat conduction columns are fixedly arranged on the bottom surface of the main board body and matched with the contact heat conduction holes, the heat conduction strip mounting holes are formed in the two sides of the main board body at equal intervals, the heat conduction strips are detachably connected in the middle of the heat conduction strip mounting holes, the bolt holes are formed in the two ends of the main board body in a penetrating mode, and the bolt holes and the bolt fixing holes are correspondingly formed in the vertical direction.
Further, the heat conduction strip includes: the heat conducting strip comprises a thread head and a heat conducting strip body, wherein the heat conducting strip body is matched with the heat radiating groove, the thread head is fixedly installed at the top end of the heat conducting strip body, and the thread head is in threaded connection with the heat conducting strip installation hole.
The beneficial effects are that:
according to the high-power patch diode provided by the utility model, the detachable heat conducting plate is additionally arranged at the bottom of the high-power diode, the heat conducting strips are detachably connected to the two sides of the heat conducting plate, and the heat conducting strips are inserted at the bottom of the diode at equal intervals, so that the heat generated by chips inside the diode is conducted out by the heat conducting plate and the heat conducting strips. Meanwhile, the grooves are formed in the bottoms of the diodes, so that air flowing channels are conveniently reserved, heat accumulation is prevented, and heat dissipation is accelerated.
Drawings
FIG. 1 is a schematic perspective view of a high power chip diode according to the present utility model;
FIG. 2 is a schematic diagram of the bottom of a high power chip diode according to the present utility model;
FIG. 3 is a schematic diagram of a high power SMD diode heat conducting plate according to the present utility model;
fig. 4 is a schematic diagram of a high-power chip diode heat conducting strip according to the present utility model.
In the figure: 1-packaging body, 2-heat conducting plate, 3-heat conducting strip, 11-pin, 12-packaging body, 13-heat dissipation groove, 14-heat conducting groove, 141-main groove body, 142-contact heat conducting hole, 143-bolt fixing hole, 21-main board body, 22-heat conducting column, 23-heat conducting strip mounting hole, 24-bolt hole, 31-screw thread head, 32-heat conducting strip body.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which are obtained by a person skilled in the art based on the embodiments of the utility model, fall within the scope of protection of the utility model.
As shown in fig. 1-4, the present utility model discloses a high-power chip diode, comprising: the packaging body 1, the heat conducting plate 2 and the heat conducting strip 3, the bottom center of the packaging body 1 is in the detachable connection of the heat conducting plate 2, grooves are formed in two sides of the bottom of the packaging body 1 at equal intervals, and the heat conducting strip 3 can be inserted into the grooves and is detachably connected with two sides of the heat conducting plate 2.
In this embodiment, the package 1 includes: the heat conducting strip comprises pins 11, a packaging main body 12, heat radiating grooves 13 and heat conducting grooves 14, wherein the pins 11 are fixedly arranged at two side ends of the packaging main body 12, the heat conducting grooves 14 are formed in the center of the bottom of the packaging main body 12, the heat conducting grooves 14 are matched with the heat conducting plate 2, the heat radiating grooves 13 are formed in two sides of the heat conducting grooves 14 at equal intervals, and the heat conducting strips 3 can be embedded in the heat radiating grooves 13.
In this embodiment, the heat conducting groove 14 includes: the main tank body 141, contact heat conduction hole 142 and bolt fixing hole 143, the main tank with the external diameter face of heat conduction board 2 cooperatees, the tank bottom equidistant of main tank body 141 has seted up contact heat conduction hole 142, contact heat conduction hole 142 is linked together with the encapsulation body 1 is inside, bolt fixing hole 143 is seted up the tank bottom both ends of main tank body 141.
In this embodiment, the heat conducting plate 2 includes: the main board body 21, the heat conduction post 22, the heat conduction strip mounting hole 23 and the bolt hole 24, the bottom surface fixed mounting of the main board body 21 has the heat conduction post 22, the heat conduction post 22 with contact heat conduction hole 142 cooperatees, the equidistant both sides of the main board body 21 are seted up to the heat conduction strip mounting hole 23, heat conduction strip 3 detachably connects in the middle of the heat conduction strip mounting hole 23, the bolt hole 24 is seted up with penetrating the main board body 21 both ends, the bolt hole 24 with the bolt fixing hole 143 corresponds the setting in the vertical direction.
In this embodiment, the heat conducting strip 3 includes: the heat conduction strip body 32 is matched with the heat dissipation groove 13, the thread head 31 is fixedly installed at the top end of the heat conduction strip body 32, and the thread head 31 is in threaded connection with the heat conduction strip installation hole 23.
Working principle:
because the pins 11 are fixedly arranged at the two side ends of the packaging body 1, after the pins 11 are welded with the circuit board, the whole packaging body 1 is attached to the surface of the circuit board. And the bottom of the packaging main body 12 is provided with a heat dissipation groove 13, and a space for air flow is reserved between the heat dissipation groove 13 and the circuit board and is not tightly attached to the surface of the circuit board. And a heat conducting groove 14 is formed at the bottom center of the package main body 12, and the heat conducting groove 14 is used for fixedly connecting the heat conducting plate 2.
Wherein, since the bottom of the main groove 141 of the heat conductive groove 14 is provided with the contact heat conductive holes 142 at equal intervals, the contact heat conductive holes 142 communicate with the inside of the package 1. Correspondingly, the bottom surface of the main board body 21 of the heat conducting plate 2 is fixedly provided with a heat conducting column 22, and the heat conducting column 22 is matched with the contact heat conducting hole 142. When the heat conductive plate 2 is embedded in the main groove 141, the heat conductive posts 22 are inserted in the contact heat conductive holes 142, so as to guide the heat inside the diode package 1 to the main board 21.
Wherein, because the heat conducting strip mounting holes 23 are equally spaced on the two sides of the main board body 21, the corresponding heat conducting strips 3 are arranged as the thread heads 31 and the heat conducting strip bodies 32, the thread heads 31 are matched with the heat conducting strip mounting holes 23 and can be in threaded connection, and the heat conducting strip bodies 32 are fixedly connected with the thread heads 31. Thus, the heat conducting strip body 32 and the screw head 31 are embedded in the heat radiating groove 13 and fixedly connected with the main board body 21. Since the heat conducting strips 3 and the heat conducting plates 2 are both made of heat conducting metal, heat in the package body 1 is conducted to the heat conducting plates 2 and the heat conducting strips 3, so that the heat is uniformly distributed and dissipated through air flow of the heat dissipating grooves 13.
Wherein, since the bolt hole 24 is formed on the heat-conducting plate 2, the bolt fixing hole 143 is formed at the bottom of the heat-conducting groove 14, and the bolt fixing hole 143 and the bolt hole 24 are correspondingly arranged in the vertical direction. Thereby, the heat conductive plate 2 can be detachably mounted to the bottom of the package body 1 by bolts.
According to the high-power patch diode provided by the utility model, the detachable heat conducting plate 2 is additionally arranged at the bottom of the high-power diode, the heat conducting strips 3 are detachably connected to the two sides of the heat conducting plate 2, and the heat conducting strips 3 are inserted at the bottom of the diode at equal intervals, so that the heat generated by chips inside the diode is conducted out by the heat conducting plate 2 and the heat conducting strips 3. Meanwhile, the grooves are formed in the bottoms of the diodes, so that air flowing channels are conveniently reserved, heat accumulation is prevented, and heat dissipation is accelerated.
The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the utility model.
Claims (5)
1. A high power chip diode comprising: the packaging structure is characterized in that the bottom center of the packaging body (1) is located at the bottom center of the packaging body (1) and is detachably connected with the heat conducting plate (2), grooves are formed in two sides of the bottom of the packaging body (1) at equal intervals, and the heat conducting strip (3) can be inserted into the grooves and is detachably connected with two sides of the heat conducting plate (2).
2. A high power chip diode according to claim 1, wherein the package (1) comprises: pin (11), encapsulation main part (12), heat dissipation recess (13) and heat conduction recess (14), pin (11) fixed mounting is in the both sides end of encapsulation main part (12), the bottom center department of encapsulation main part (12) has seted up heat conduction recess (14), heat conduction recess (14) with heat conduction board (2) cooperate, heat dissipation recess (13) have been seted up equidistant in the both sides of heat conduction recess (14), heat conduction strip (3) can gomphosis in the middle of heat dissipation recess (13).
3. A high power chip diode according to claim 2, wherein the thermally conductive recess (14) comprises: main cell body (141), contact heat conduction hole (142) and bolt fixed orifices (143), the main cell with the external diameter face of heat conduction board (2) cooperatees, contact heat conduction hole (142) have been seted up to the tank bottom equidistant of main cell body (141), contact heat conduction hole (142) are linked together with the inside of encapsulation body (1), bolt fixed orifices (143) are seted up the tank bottom both ends of main cell body (141).
4. A high power chip diode according to claim 3, wherein the thermally conductive plate (2) comprises: mainboard body (21), heat conduction post (22), heat conduction strip mounting hole (23) and bolt hole (24), the bottom surface fixed mounting of mainboard body (21) has heat conduction post (22), heat conduction post (22) with contact heat conduction hole (142) cooperate, heat conduction strip mounting hole (23) equidistant set up in the both sides of mainboard body (21), heat conduction strip (3) detachably connect in the middle of heat conduction strip mounting hole (23), bolt hole (24) are offered throughout mainboard body (21) both ends, bolt hole (24) with bolt fixed orifices (143) correspond the setting along vertical direction.
5. A high power chip diode according to claim 4, wherein said thermally conductive strip (3) comprises: the heat conducting strip comprises a thread head (31) and a heat conducting strip body (32), wherein the heat conducting strip body (32) is matched with the heat radiating groove (13), the thread head (31) is fixedly installed at the top end of the heat conducting strip body (32), and the thread head (31) is in threaded connection with the heat conducting strip installation hole (23).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320883948.0U CN220290798U (en) | 2023-04-19 | 2023-04-19 | High-power patch diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320883948.0U CN220290798U (en) | 2023-04-19 | 2023-04-19 | High-power patch diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220290798U true CN220290798U (en) | 2024-01-02 |
Family
ID=89340828
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320883948.0U Active CN220290798U (en) | 2023-04-19 | 2023-04-19 | High-power patch diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220290798U (en) |
-
2023
- 2023-04-19 CN CN202320883948.0U patent/CN220290798U/en active Active
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