CN114300563B - Photovoltaic module structure and processing technology - Google Patents
Photovoltaic module structure and processing technology Download PDFInfo
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- CN114300563B CN114300563B CN202111597721.1A CN202111597721A CN114300563B CN 114300563 B CN114300563 B CN 114300563B CN 202111597721 A CN202111597721 A CN 202111597721A CN 114300563 B CN114300563 B CN 114300563B
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- 238000005516 engineering process Methods 0.000 title claims abstract description 6
- 238000004519 manufacturing process Methods 0.000 claims abstract description 8
- 238000004806 packaging method and process Methods 0.000 claims description 46
- 230000017525 heat dissipation Effects 0.000 claims description 26
- 229910000838 Al alloy Inorganic materials 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 20
- 239000000956 alloy Substances 0.000 claims description 16
- 239000003292 glue Substances 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 238000003466 welding Methods 0.000 claims description 8
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 5
- 230000007613 environmental effect Effects 0.000 abstract description 2
- 229910052751 metal Inorganic materials 0.000 abstract description 2
- 239000002184 metal Substances 0.000 abstract description 2
- 229910052755 nonmetal Inorganic materials 0.000 abstract description 2
- 238000010008 shearing Methods 0.000 abstract description 2
- 210000004027 cell Anatomy 0.000 description 9
- 238000010248 power generation Methods 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 210000003850 cellular structure Anatomy 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000003245 working effect Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Photovoltaic Devices (AREA)
Abstract
The invention discloses a photovoltaic module structure and a processing technology, and relates to the field of photovoltaic modules. The process for manufacturing photovoltaic modules comprises six steps. The photovoltaic module can solve the problem that the existing photovoltaic module generates transverse shearing force due to metal and nonmetal caused by environmental changes such as external humidity, temperature and the like when working, and simultaneously solves the problems that the effect is poor, the heat generated by electronic movement in the working process of the chip cannot be fully dissipated, and the photovoltaic module is short in service life, high in cost, easy to package failure and inconvenient to subsequently assemble.
Description
Technical Field
The invention relates to the field of photovoltaic modules, in particular to a photovoltaic module structure and a processing technology.
Background
A photovoltaic bypass diode module is one type of photovoltaic module. The solar cell power generation system comprises a plurality of solar cell modules, and in the power generation process of the solar cell modules, if the solar cell modules meet a hot spot effect, the shaded solar cell modules generate heat to consume electric energy, and the hot spot effect can seriously damage the solar cells. When the hot spot effect occurs, the photovoltaic module is conducted, the current generated by the normally generated solar cell component flows out through the photovoltaic module, the shielded solar cell component is short-circuited, the solar cell power generation system generates power normally, and the condition that a power generation circuit is not conducted due to the fact that one or more solar cell components are in a problem is avoided.
The existing photovoltaic bypass diode module comprises a first frame 1, a second frame 2, a chip 3, a jumper wire 4 and a packaging body 5, wherein the first frame 1 and the second frame 2 are made of copper, the packaging body 5 is used for sealing the chip 3 and the jumper wire 4, the right end of the first frame 1 is provided with a first protrusion 11, the left end of the second frame 2 is correspondingly provided with a second protrusion 21, the chip 3 is arranged on the second protrusion 21, and the chip 3 is electrically connected with the first protrusion 11 through the jumper wire 4. The existing photovoltaic bypass diode module has the following defects:
1. the existing photovoltaic bypass diode module has poor heat dissipation capability, and when the photovoltaic bypass diode module is conducted for a long time or is internally conducted through a large current, heat generated by the photovoltaic bypass diode module cannot be discharged and released in time, so that the working effect and the service life of the photovoltaic bypass diode module are seriously influenced.
2. After production is completed, the photovoltaic bypass diode module is shipped to a customer, and the customer assembles the photovoltaic bypass diode module into the solar cell power generation system. Because the polarity of the photovoltaic bypass diode module is not marked on the existing photovoltaic bypass diode module, customers often install the photovoltaic bypass diode module reversely in subsequent assembly procedures, and the normal use of the solar cell power generation system is seriously influenced.
3. The first frame and the second frame of the existing photovoltaic bypass diode module are both copper sheets, and the manufacturing cost is high, so that the cost of the existing photovoltaic bypass diode module is high.
4. In the production process of the existing photovoltaic bypass diode module, a packaging mold is required to package a chip and a jumper. The packaging worker easily reverses the positions of the first frame and the second frame and also easily places one or both of the first frame and the second frame upside down, resulting in a packaging failure.
Disclosure of Invention
The invention aims to solve the technical problems that the conventional photovoltaic module generates transverse shearing force due to metal and nonmetal caused by environmental changes such as external humidity, temperature and the like when working, and the problems that heat generated by electronic movement of a chip cannot be fully dissipated during working, the service life of the photovoltaic module is short, the cost is high, packaging failure is easy to occur, and subsequent assembly is inconvenient are solved. The problem of current photovoltaic module work effect poor, life is short, the cost is higher, easily encapsulation failure and subsequent equipment of being not convenient for is solved.
The technical scheme adopted by the invention for solving the technical problems is as follows: the utility model provides a photovoltaic module, is first frame and second frame, chip, the wire jumper of copper and is used for sealing the packaging body of chip and wire jumper including the material, the right-hand member of first frame sets up first arch, the left end of second frame corresponds and sets up the second arch, the chip sets up on the second arch, the chip passes through wire jumper and first protruding electric connection, the upper surface and/or the lower surface of packaging body set up heat abstractor, heat abstractor includes the base plate of aluminum alloy material, the base plate passes through the surface bonding of thermal conductive adhesive with the packaging body, set up a plurality of frame through-holes on first frame and the second frame.
Furthermore, the substrate is provided with radiating fins made of aluminum alloy materials or radiating columns made of aluminum alloy materials arranged in an array manner in the surface gap away from the packaging body.
Furthermore, the frame through holes are respectively formed with the first frame and the second frame in an integrated punch forming mode, and the frame through holes of the first frame and the frame through holes of the second frame are arranged in a rectangular array mode.
Furthermore, a notch is arranged at the left end or the right end of the packaging body.
Furthermore, the front part of the upper surface of the first bulge is provided with a positioning through hole, the rear part of the upper surface of the first bulge is provided with two positioning through holes, and the rear part of the upper surface of the second bulge is provided with a positioning through hole.
The invention also provides a processing technology of the photovoltaic module, which comprises the following steps:
s1: stamping a first frame and a second frame, and processing a plurality of frame through holes on the first frame and the second frame;
s2: bonding the chip to a preset position on the upper surface of the second bump through solder paste;
s3: bonding the jumper wire with the chip and the first bump through solder paste;
s4: placing the first frame and the second frame into a vacuum welding furnace for welding;
s5: manufacturing an epoxy resin packaging body for sealing the chip and the jumper through a packaging mold;
s6: the upper surface and/or the lower surface of the packaging body are/is bonded with the heat dissipation device through heat conduction glue, the heat dissipation device comprises a substrate made of an aluminum alloy material, and the substrate is bonded with the surface of the packaging body through the heat conduction glue.
Furthermore, the substrate is provided with radiating fins made of aluminum alloy materials or radiating columns made of aluminum alloy materials arranged in an array manner in the surface gap away from the packaging body.
Further, in the step S1, the frame through holes are respectively formed in an integrated punch manner with the first frame and the second frame, and the frame through holes of the first frame and the second frame are arranged in a rectangular array.
Further, in step S5, a package body with a notch at the left end or the right end is manufactured through a package mold.
Further, in step S1, a positioning through hole is integrally formed in the front portion of the upper surface of the first protrusion, two positioning through holes are integrally formed in the rear portion of the upper surface of the second protrusion, and a positioning through hole is integrally formed in the rear portion of the upper surface of the second protrusion.
The invention has the following beneficial effects:
according to the photovoltaic bypass diode module, the heat dissipation device is arranged on the upper surface and/or the lower surface of the packaging body. The heat dissipation device can greatly improve the discharge and release speed of heat generated by the photovoltaic bypass diode module, ensure the working effect of the photovoltaic bypass diode module and prolong the service life of the photovoltaic bypass diode module.
The left end or the right end of the photovoltaic bypass diode module packaging body is provided with a notch. The polarity of the photovoltaic bypass diode module can be identified through the orientation of the notch in the subsequent assembly process of a customer, and the situation that the photovoltaic bypass diode module is reversely installed is avoided.
The photovoltaic bypass diode module is provided with a plurality of frame through holes on the first frame and the second frame. The frame through holes are arranged, so that the copper material consumption of the first frame and the second frame can be reduced on the basis of ensuring the structural strength of the first frame and the second frame, and the cost of the photovoltaic bypass diode module is reduced.
According to the photovoltaic bypass diode module, the front part of the upper surface of the first protrusion is provided with the positioning through hole, the rear part of the upper surface of the first protrusion is provided with the two positioning through holes, and the rear part of the upper surface of the second protrusion is provided with the positioning through hole. And an operator sets a positioning column in the packaging mold at a position corresponding to the positioning through hole. When the packaging mold is used for packaging the chip and the jumper wire, if the positions of the first frame and the second frame are reversed, or one or all of the first frame and the second frame are placed upside down, some positioning columns cannot be clamped into the corresponding positioning through holes, and the packaging failure condition is avoided.
Drawings
Fig. 1 is a top view of a photovoltaic module of example 1 of the present invention;
fig. 2 is a top view of a photovoltaic module of example 1 of the present invention with the heat sink removed;
fig. 3 is a top view of the photovoltaic module of example 1 of the present invention with the heat sink and encapsulant removed;
fig. 4 is a schematic structural view of a heat dissipation device in embodiment 1 of the present invention;
fig. 5 is a top view of a photovoltaic module of example 2 of the present invention;
fig. 6 is a schematic structural view of a heat dissipation device in embodiment 2 of the present invention;
fig. 7 is a process flow diagram of a photovoltaic module of the present invention.
Detailed Description
Example 1:
as shown in fig. 1-4 and 7, a photovoltaic module includes a first frame 1 and a second frame 2 made of copper, a chip 3, a jumper wire 4, and a package 5 for sealing the chip 3 and the jumper wire 4, the right end of the first frame 1 is provided with a first protrusion 11, the left end of the second frame 2 is correspondingly provided with a second protrusion 21, the chip 3 is arranged on the second protrusion 21, the chip 3 is electrically connected with the first protrusion 11 through the jumper wire 4, the upper surface and/or the lower surface of the package 5 is provided with a heat dissipation device 6, the heat dissipation device 6 includes a substrate 61 made of an aluminum alloy material, the substrate 61 is bonded with the surface of the package 5 through a heat conducting adhesive, and the first frame 1 and the second frame 2 are provided with a plurality of frame through holes 8.
The substrate 61 is provided with a heat sink 62 made of an aluminum alloy material at a surface gap away from the package 5.
The heat sink 62 can quickly dissipate heat generated from the chip 3.
The frame through holes 8 are respectively formed with the first frame 1 and the second frame 2 in an integrated punching mode, and the frame through holes 8 of the first frame 1 and the second frame 2 are arranged in a rectangular array mode.
The left end or the right end of the packaging body 5 is provided with a notch 51.
The front part of the upper surface of the first bulge 11 is provided with a positioning through hole 7, the rear part is provided with two positioning through holes 7, and the rear part of the upper surface of the second bulge 21 is provided with a positioning through hole 7.
The photovoltaic module is processed as follows:
(1) Stamping a first frame 1 and a second frame 2, and processing a plurality of frame through holes 8 on the first frame 1 and the second frame 2;
(2) Bonding the chip 3 at a preset position on the upper surface of the second bump 21 through solder paste;
(3) Bonding the jumper wire 4 with the chip 3 and the first bump 11 through solder paste;
(4) Placing the first frame 1 and the second frame 2 into a vacuum welding furnace for welding;
(5) Manufacturing a packaging body 5 made of epoxy resin for sealing the chip 3 and the jumper wire 4 through a packaging mold;
(6) The heat dissipation device 6 is bonded on the upper surface and the lower surface of the package body 5 through heat conduction glue, the heat dissipation device 6 comprises a substrate 61 made of an aluminum alloy material, the substrate 61 is bonded with the surface of the package body 5 through the heat conduction glue, and a heat dissipation sheet 62 made of an aluminum alloy material is arranged in a gap on the surface, far away from the package body 5, of the substrate 61.
According to the photovoltaic bypass diode module, the heat dissipation device is arranged on the upper surface and/or the lower surface of the packaging body. The heat dissipation device can greatly improve the discharge and release speed of heat generated by the photovoltaic bypass diode module, ensure the working effect of the photovoltaic bypass diode module and prolong the service life of the photovoltaic bypass diode module.
The left end or the right end of the photovoltaic bypass diode module packaging body is provided with a notch. The polarity of the photovoltaic bypass diode module can be identified through the orientation of the notch in the subsequent assembly process of a customer, and the situation that the photovoltaic bypass diode module is reversely installed is avoided.
According to the photovoltaic bypass diode module, the first frame and the second frame are provided with the plurality of frame through holes. The frame through holes are arranged, so that the copper material consumption of the first frame and the second frame can be reduced on the basis of ensuring the structural strength of the first frame and the second frame, and the cost of the photovoltaic bypass diode module is reduced.
According to the photovoltaic bypass diode module, the front part of the upper surface of the first protrusion is provided with the positioning through hole, the rear part of the upper surface of the first protrusion is provided with the two positioning through holes, and the rear part of the upper surface of the second protrusion is provided with the positioning through hole. And an operator sets a positioning column in the packaging mold at a position corresponding to the positioning through hole. When the packaging mold is used for packaging the chip and the jumper wire, if the positions of the first frame and the second frame are reversed, or one or all of the first frame and the second frame are placed upside down, some positioning columns cannot be clamped into the corresponding positioning through holes, and the packaging failure condition is avoided.
Example 2:
as shown in fig. 5-7, a photovoltaic module includes a first frame 1 and a second frame 2 made of copper, a chip 3, a jumper wire 4, and a package 5 for sealing the chip 3 and the jumper wire 4, the right end of the first frame 1 is provided with a first protrusion 11, the left end of the second frame 2 is correspondingly provided with a second protrusion 21, the chip 3 is arranged on the second protrusion 21, the chip 3 is electrically connected with the first protrusion 11 through the jumper wire 4, the upper surface and/or the lower surface of the package 5 is provided with a heat dissipation device 6, the heat dissipation device 6 includes a substrate 61 made of an aluminum alloy material, the substrate 61 is bonded with the surface of the package 5 through a heat conducting adhesive, and the first frame 1 and the second frame 2 are provided with a plurality of frame through holes 8.
The surface of the substrate 61, which is far away from the package body 5, is provided with heat dissipation columns 63 made of aluminum alloy materials arranged in an array.
The heat dissipation pillar 63 dissipates heat better than the heat dissipation plate 62.
The frame through holes 8 are respectively formed with the first frame 1 and the second frame 2 in an integrated punching mode, and the frame through holes 8 of the first frame 1 and the second frame 2 are arranged in a rectangular array mode.
The left end or the right end of the packaging body 5 is provided with a notch 51.
The front part of the upper surface of the first bulge 11 is provided with a positioning through hole 7, the rear part is provided with two positioning through holes 7, and the rear part of the upper surface of the second bulge 21 is provided with a positioning through hole 7.
The photovoltaic module is processed as follows:
(1) Stamping a first frame 1 and a second frame 2, and processing a plurality of frame through holes 8 on the first frame 1 and the second frame 2;
(2) Bonding the chip 3 at a preset position on the upper surface of the second bump 21 through solder paste;
(3) Bonding the jumper wire 4 with the chip 3 and the first bump 11 through solder paste;
(4) Placing the first frame 1 and the second frame 2 into a vacuum welding furnace for welding;
(5) Manufacturing a packaging body 5 made of epoxy resin for sealing the chip 3 and the jumper wire 4 through a packaging mold;
(6) The heat dissipation device 6 is bonded to the upper surface and the lower surface of the package body 5 through heat conduction glue, the heat dissipation device 6 comprises a substrate 61 made of an aluminum alloy material, the substrate 61 is bonded to the surface of the package body 5 through the heat conduction glue, and the surface, far away from the package body 5, of the substrate 61 is provided with heat dissipation columns 63 made of the aluminum alloy material and arranged in an array mode.
The above description is only a preferred embodiment of the present invention, and not intended to limit the present invention in any way, and those skilled in the art can make various changes and modifications to the equivalent embodiments without departing from the scope of the present invention, and all such changes, modifications, equivalents and improvements that can be made to the above embodiments without departing from the technical spirit of the present invention are within the spirit and principle of the present invention.
Claims (2)
1. A photovoltaic module comprises a first frame (1) and a second frame (2) which are made of copper, a chip (3), a jumper wire (4) and a packaging body (5) used for sealing the chip (3) and the jumper wire (4), wherein a first bulge (11) is arranged at the right end of the first frame (1), a second bulge (21) is correspondingly arranged at the left end of the second frame (2), the chip (3) is arranged on the second bulge (21), the chip (3) is electrically connected with the first bulge (11) through the jumper wire (4), the photovoltaic module is characterized in that a heat dissipation device (6) is arranged on the upper surface and/or the lower surface of the packaging body (5), the heat dissipation device (6) comprises a base plate (61) made of an aluminum alloy material, the base plate (61) is bonded with the surface of the packaging body (5) through heat conducting glue, and a plurality of frame through holes (8) are formed in the first frame (1) and the second frame (2);
the surface of the substrate (61) far away from the packaging body (5) is provided with aluminum alloy radiating fins (62) or aluminum alloy radiating columns (63) in array arrangement; the frame through holes (8) are respectively formed with the first frame (1) and the second frame (2) in an integrated punch forming mode, and the frame through holes (8) of the first frame (1) and the second frame (2) are arranged in a rectangular array mode; a notch (51) is arranged at the left end or the right end of the packaging body (5); the front part of the upper surface of the first bulge (11) is provided with a positioning through hole (7), the rear part of the upper surface of the first bulge is provided with two positioning through holes (7), and the rear part of the upper surface of the second bulge (21) is provided with one positioning through hole (7).
2. The processing technology of the photovoltaic module is characterized by comprising the following steps of:
s1: stamping a first frame (1) and a second frame (2), and processing a plurality of frame through holes (8) on the first frame (1) and the second frame (2);
s2: bonding the chip (3) to a preset position on the upper surface of the second bump (21) through solder paste;
s3: bonding the jumper wire (4) with the chip (3) and the first bump (11) through solder paste;
s4: putting the first frame (1) and the second frame (2) into a vacuum welding furnace for welding;
s5: manufacturing a packaging body (5) made of epoxy resin for sealing the chip (3) and the jumper wire (4) through a packaging mold;
s6: the upper surface and/or the lower surface of the packaging body (5) are/is bonded with a heat dissipation device (6) through heat conduction glue, the heat dissipation device (6) comprises a substrate (61) made of an aluminum alloy material, and the substrate (61) is bonded with the surface of the packaging body (5) through the heat conduction glue;
the surface of the substrate (61) far away from the packaging body (5) is provided with aluminum alloy radiating fins (62) or aluminum alloy radiating columns (63) in array arrangement; in the step S1, the frame through holes (8) are respectively formed with the first frame (1) and the second frame (2) in an integrated punch forming mode, and the frame through holes (8) of the first frame (1) and the second frame (2) are arranged in a rectangular array mode; in the step S5, a packaging body (5) with a notch (51) arranged at the left end or the right end is manufactured through a packaging mold; in the step S1, a positioning through hole (7) is integrally formed in the front part of the upper surface of the first protrusion (11) and two positioning through holes (7) are integrally formed in the rear part of the upper surface of the second protrusion (21) and one positioning through hole (7) is integrally formed in the rear part of the upper surface of the second protrusion.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111597721.1A CN114300563B (en) | 2021-12-24 | 2021-12-24 | Photovoltaic module structure and processing technology |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111597721.1A CN114300563B (en) | 2021-12-24 | 2021-12-24 | Photovoltaic module structure and processing technology |
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| CN114300563B true CN114300563B (en) | 2023-01-31 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019071446A (en) * | 2014-05-27 | 2019-05-09 | サンパワー コーポレイション | Shingled solar cell module |
| CN110289217A (en) * | 2019-06-11 | 2019-09-27 | 扬州扬杰电子科技股份有限公司 | A kind of packaging technology of power module |
| CN111883492A (en) * | 2020-08-11 | 2020-11-03 | 扬州扬杰电子科技股份有限公司 | Photovoltaic bypass diode module unit and processing technology thereof |
| CN112087199A (en) * | 2020-10-10 | 2020-12-15 | 扬州扬杰电子科技股份有限公司 | Converge and take adjustable type photovoltaic module of interval |
| CN213878107U (en) * | 2020-12-22 | 2021-08-03 | 常州星海电子股份有限公司 | Photovoltaic bypass diode frame |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7388269B2 (en) * | 2004-05-19 | 2008-06-17 | Angel Co., Ltd. | Diode with lead terminal for solar cell |
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2021
- 2021-12-24 CN CN202111597721.1A patent/CN114300563B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019071446A (en) * | 2014-05-27 | 2019-05-09 | サンパワー コーポレイション | Shingled solar cell module |
| CN110289217A (en) * | 2019-06-11 | 2019-09-27 | 扬州扬杰电子科技股份有限公司 | A kind of packaging technology of power module |
| CN111883492A (en) * | 2020-08-11 | 2020-11-03 | 扬州扬杰电子科技股份有限公司 | Photovoltaic bypass diode module unit and processing technology thereof |
| CN112087199A (en) * | 2020-10-10 | 2020-12-15 | 扬州扬杰电子科技股份有限公司 | Converge and take adjustable type photovoltaic module of interval |
| CN213878107U (en) * | 2020-12-22 | 2021-08-03 | 常州星海电子股份有限公司 | Photovoltaic bypass diode frame |
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Address after: 247000 No.2 Shuanglong Road, Chizhou economic and Technological Development Zone, Anhui Province Patentee after: Anhui Juxin Semiconductor Technology Co.,Ltd. Country or region after: China Address before: 247000 No.2 Shuanglong Road, Chizhou economic and Technological Development Zone, Anhui Province Patentee before: ANHUI JUXIN SEMICONDUCTOR TECHNOLOGY Co.,Ltd. Country or region before: China |
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| CP03 | Change of name, title or address |