CN218182207U - Diode module for junction box - Google Patents
Diode module for junction box Download PDFInfo
- Publication number
- CN218182207U CN218182207U CN202222121624.1U CN202222121624U CN218182207U CN 218182207 U CN218182207 U CN 218182207U CN 202222121624 U CN202222121624 U CN 202222121624U CN 218182207 U CN218182207 U CN 218182207U
- Authority
- CN
- China
- Prior art keywords
- conducting
- diode
- chip
- diode chip
- conducting strips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses a diode module for a junction box, which comprises a diode chip and a pair of conducting strips, wherein the conducting strips are positioned on the same plane, and the diode chip is positioned between the two conducting strips and is vertical to the conducting strips; the end, facing the diode chip, of the conducting strip is provided with a welding surface which is fixedly welded with the diode chip, the welding surface and part of the conducting strip are packaging areas, and the packaging areas are integrally packaged through epoxy resin glue. The diode chip and the conducting strip are vertically arranged, so that heat generated by the chip is radiated to two sides simultaneously; through the conduction of the welding surface, the chip and the conducting strips have good thermal conductivity, so that the chip can quickly and uniformly radiate through the two conducting strips.
Description
Technical Field
The utility model belongs to the technical field of electronic apparatus, especially, relate to a diode module for terminal box.
Background
In the solar cell junction box, a diode module is needed, which is used for rectifying the current generated by the cell panel and then outputting the current to the outside. The existing diode module is generally a patch type diode, a laminar diode chip is attached and fixed on a conducting strip of one pole, and is connected with a conducting strip of the other pole through a jumper wire and then packaged. When the diode module works, the chip part of the diode module can generate heat, and the chip is attached to one conductive sheet and has better heat conduction with the conductive sheet; and for the other conducting strip, the jumper wire is only used as a heat conduction medium with the diode chip. But, on the other hand, the jumper wire should be made as small as possible in cross-sectional area to avoid physical force on the diode chip. Therefore, the other conductive sheet, to which the chip is not attached, plays a very limited role in heat dissipation, and the heat dissipation of the two conductive sheets is greatly unbalanced.
Disclosure of Invention
The utility model aims at providing a can even radiating diode module that is used for terminal box.
The utility model adopts the technical proposal that: a diode module for terminal box, including diode chip and a pair of conducting strip, its characterized in that: the pair of conducting plates are positioned on the same plane, and the diode chip is positioned between the two conducting plates and is vertical to the conducting plates; the end, facing the diode chip, of the conducting strip is provided with a welding surface which is fixedly welded with the diode chip, the welding surface and part of the conducting strip are packaging areas, and the packaging areas are integrally packaged through epoxy resin glue.
The two diode chips are arranged between the two conducting strips in parallel, and one end of each conducting strip, which faces the diode chips, is provided with two welding surfaces which are respectively welded and fixed with the two diode chips.
The welding surface is a circular or semicircular plane, is fixed at one end of the conducting strip and is vertical to the conducting strip.
The diode chip and the conducting strip are vertically arranged, so that heat generated by the chip is radiated to two sides simultaneously; through the conduction of the welding surface, the chip has good heat conductivity with the conducting strips, so that the chip can rapidly and uniformly dissipate heat through the two conducting strips.
Drawings
Fig. 1 is an external view of the present invention.
Fig. 2 is a schematic structural diagram of the present invention.
Fig. 3 is a schematic view of a conductive sheet.
Detailed Description
See the drawings. The LED chip comprises a body 1 and two conducting strips 2, wherein a diode chip 3 is arranged in the body 1 and is perpendicular to the conducting strips; two conducting strips 2 all are equipped with face of weld 21 in the one end that is close to chip 3, and face of weld 21 is semi-circular, fixes two conducting strips and diode chip welding through the face of weld.
After the above components are welded and fixed, the diode chip 3, the soldering surface 21 and a part of the conductive sheet 2 are encapsulated by epoxy resin glue to form the body 1.
Claims (3)
1. A diode module for terminal box, including diode chip and a pair of conducting strip, its characterized in that: the pair of conducting plates are positioned on the same plane, and the diode chip is positioned between the two conducting plates and is vertical to the conducting plates; the end, facing the diode chip, of the conducting strip is provided with a welding surface which is welded and fixed with the diode chip, the welding surface and part of the conducting strip are packaging areas, and the packaging areas are integrally packaged through epoxy resin glue.
2. The diode module for a junction box of claim 1, wherein: the two diode chips are arranged between the two conducting strips in parallel, and one end of each conducting strip, which faces the diode chips, is provided with two welding surfaces which are respectively welded and fixed with the two diode chips.
3. The diode module for a junction box of claim 1 or 2, wherein: the welding surface is a circular or semicircular plane, is fixed at one end of the conducting plate and is vertical to the conducting plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222121624.1U CN218182207U (en) | 2022-08-12 | 2022-08-12 | Diode module for junction box |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222121624.1U CN218182207U (en) | 2022-08-12 | 2022-08-12 | Diode module for junction box |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218182207U true CN218182207U (en) | 2022-12-30 |
Family
ID=84616954
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222121624.1U Active CN218182207U (en) | 2022-08-12 | 2022-08-12 | Diode module for junction box |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218182207U (en) |
-
2022
- 2022-08-12 CN CN202222121624.1U patent/CN218182207U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101890605A (en) | Power semiconductor chip welding device | |
| CN218730911U (en) | Double-sided heat dissipation packaging structure with internal insulation | |
| WO2018161661A1 (en) | Low-pressure chip packaging type junction box and processing method thereof for solar power generation assembly | |
| CN209150091U (en) | A kind of chip diode with radiator structure | |
| CN102054826B (en) | Novel baseplate-free power module | |
| CN218182207U (en) | Diode module for junction box | |
| CN203386761U (en) | Diode | |
| CN112885804A (en) | Surface-mounted photovoltaic bypass module and packaging process thereof | |
| CN203761279U (en) | Assembling structure of a rectifying voltage regulator for motorcycle | |
| CN201985771U (en) | Extra large power rectification electric power electronic device module specially used for ultrasonic bonding machine | |
| CN110620094A (en) | Packaging structure and packaging process of power semiconductor device | |
| CN104241209A (en) | Special power module for outdoor power source | |
| CN206116381U (en) | Wainscot rectifier bridge chip structure | |
| CN202585403U (en) | Full-bridge single-tube IGBT packaging module | |
| CN107425154B (en) | battery module | |
| CN211578743U (en) | Semiconductor packaging structure and electronic product | |
| CN204144239U (en) | The stack distribution structure of the high-power bare chip of a kind of homalographic | |
| CN203398100U (en) | A semiconductor chip with a novel heat dissipating structure | |
| CN114300563B (en) | Photovoltaic module structure and processing technology | |
| CN204792892U (en) | High -power LED packaging structure of back -off formula small -size | |
| CN202712234U (en) | Solar cell module having heat-dissipation packaging structure | |
| CN112259517A (en) | Photovoltaic module bypass element soldering lug, bypass protection element module and junction box | |
| CN202721197U (en) | High-power LED packaging module | |
| CN217933784U (en) | Diode module for solar battery junction box | |
| CN202142525U (en) | Novel power module without base plate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |