CN206116381U - Wainscot rectifier bridge chip structure - Google Patents
Wainscot rectifier bridge chip structure Download PDFInfo
- Publication number
- CN206116381U CN206116381U CN201621209377.9U CN201621209377U CN206116381U CN 206116381 U CN206116381 U CN 206116381U CN 201621209377 U CN201621209377 U CN 201621209377U CN 206116381 U CN206116381 U CN 206116381U
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- frame structure
- rectifier bridge
- packaging body
- frame
- framework
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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Abstract
Wainscot rectifier bridge chip structure. An improve that electron technical field especially relates to the chip rectifier bridge is related to. The utility model provides a heat dispersion well just encapsulates a tight wainscot rectifier bridge chip structure. Frame construction's bottom surface with packaging body bottom surface parallel and level for frame construction's bottom surface is exposed state, the cross section of frame construction's side is the stairstepping. A plurality of U -shaped grooves are seted up at frame construction's edge. The U -shaped groove young, the end is big. Frame construction includes one~frame of frame no. 4, expose in one~the frame of frame of packaging body bottom surface no. 4 approaching distance >= 3mm each other. The utility model has the advantages of heat dispersion is good, the encapsulation is tight.
Description
Technical field
This utility model is related to electronic technology field, more particularly to the improvement to chip rectifier bridge.
Background technology
Existing rectification bridge chip typically adopts full pack arrangement, i.e., in addition to the pin of chip, remaining part is plastic packaging
Body is wrapped up, and is had an advantage in that, can provide metastable working environment for the chip in plastic packaging body when in use, extends core
The working life of piece, and processing technique is simple, low cost.But its exist defect be also it will be apparent that mainly due to
The heat produced during chip operation can not be distributed in time due to the stop of the plastic-sealed body of full pack arrangement, easy using rear chip for a long time
Heating is damaged.
State Intellectual Property Office 2016-1-20 discloses a utility application（Application number：
201510644442, title：Heat radiating fin structure surface mount rectifier bridge device）Specifically disclose including：By epoxy packages body bag
First, second, third, fourth diode chip for backlight unit for covering and negative metal bar, the epoxy packages body bottom and positioned at left and right side
It is respectively fixed with first, second metal substrate and E shape metal substrates；First, second, third, fourth connection sheet is before and after
Direction be arranged in parallel, and the negative metal bar is located at the front end between the first metal substrate and E shape metal substrates and has a bending
Portion, this bending part bottom is positioned at same level and naked with first, second metal substrate and the respective bottom of E shape metal substrates
Expose the epoxy packages body；, used as ac input end, the negative metal bar is used as direct current negative pole for first, second metal substrate
End, the E shapes metal substrate is used as direct-flow positive pole end.And disclose the radiating for serving as chip using metal substrate in the description
The technical scheme of piece, chip is most short with the heat dissipation path of PCB, and fin is metal material, and heat conductivity is superior, takes full advantage of
The heat-sinking capability of pcb board itself, it is to avoid existing product is radiated by the cross-ventilation in cabinet, epoxy capacity of heat transmission difference etc.
Defect.Improve heat-sinking capability.But still existing defects, i.e. epoxy packages body exist only in the front of metal substrate, encapsulation is loosely
Lean on, packaging body is easily shifted so that gap is produced between packaging body and substrate so that dust, steam etc. are entered in substrate so that gold
Category substrate corrosion, affects chip performance.
Utility model content
This utility model is directed to problem above, there is provided a kind of perfect heat-dissipating and a kind of tight veneer rectifier bridge of encapsulation
Chip structure.
The technical solution of the utility model is：Veneer rectifier bridge chip structure, including packaging body, the package interior sets
There is the rectifier circuit being welded in frame structure；
The bottom surface of the frame structure is concordant with the packaging body bottom surface so that the bottom surface of frame structure is in naked state；
The cross section of the side of the frame structure is stairstepping.
The some U-lags of edge of the frame structure.
The mouth of the U-lag is little, bottom is big.
The frame structure includes one ~ framework of framework four, and the one ~ framework of framework four for being exposed to the packaging body bottom surface is mutual
Between closest-approach distance >=3mm.
This utility model increases frame structure 2 with encapsulation using step-like side under the limited area of frame structure 2
The contact area of body 1 so that packaging body 1 is encapsulated half（Part frame structure is exposed external in encapsulation）On the premise of with framework knot
Structure 2 combines even closer, the sealing of lifting veneer rectifier bridge chip structure.
The some U-lags of edge of frame structure, the mouth of U-lag is little, bottom is big, on the one hand increased frame structure 2 with
The contact area of packaging body 1, increased sealing, on the other hand, when packaging body is due to external force effect loosening this can be passed through
The stabilized structure packaging body 1 of sample and the relative position of frame structure 2 so that packaging body 1 encapsulates more firm.
The bottom surface of frame structure is in naked state, is directly contacted with substrate, and using frame structure and substrate heat conduction is carried out, can
To be effectively reduced thermal resistance, the obstruct of packaging body 1 is avoided in radiation processes, improve the heat-sinking capability of diode chip, made
The temperature of diode chip can be maintained at for a long time in rational scope, for diode chip work provide one it is relatively steady
Fixed working environment, improves the work efficiency of diode chip, it is to avoid impact of the high temperature to diode chip for backlight unit, extends two poles
The service life of die 4.
Rectifier circuit is made up of some diode chip for backlight unit and some connection sheets, and being connected using connection sheet needs the two of connection
Individual diode chip for backlight unit 4 so that the two pole piece piece pipes that needs are attached are attached and avoid two poles that need not be attached
Die 4, on the one hand can be prevented effectively from short circuit, on the other hand can Optimization Framework structure, reduce frame structure volume, save material
Material.So that product miniaturization facilitation.In a word this utility model has the advantages that perfect heat-dissipating, encapsulation are tight.
Description of the drawings
Fig. 1 is structural representation of the present utility model,
Fig. 2 is the structural representation of this utility model embodiment one,
Fig. 3 is mplifying structure schematic diagram at A in Fig. 2,
Fig. 4 is the structural representation of this utility model embodiment two,
Fig. 5 is mplifying structure schematic diagram at B in Fig. 4,
Fig. 6 is the structural representation of this utility model embodiment three,
Fig. 7 is mplifying structure schematic diagram at C in Fig. 6；
1 is packaging body in figure,
2 is frame structure, and 21 is framework one, and 22 is framework two, and 23 is framework three, and 24 is framework four,
31 is side, and 32 is U-lag,
4 is diode chip for backlight unit, and 5 is connection sheet.
Specific embodiment
As shown in figs. 1-7, veneer rectifier bridge chip structure, including packaging body, the package interior is provided with and is welded on frame
Rectifier circuit in frame structure.Rectifier circuit is made up of some diode chip for backlight unit and some connection sheets, is connected using connection sheet
Connecing needs two diode chip for backlight unit 4 of connection so that the two pole piece piece pipes that needs are attached are attached and avoid not needing
The diode chip for backlight unit 4 being attached, on the one hand can be prevented effectively from short circuit, on the other hand can Optimization Framework structure, reduce framework
Structural volume, saves material.So that product miniaturization facilitation.
As shown in Figure 2-5, the bottom surface of the frame structure 2 is concordant with the bottom surface of the packaging body 1 so that frame structure 2
Bottom surface is in naked state；The cross section of the side 31 of the frame structure is stairstepping, and Fig. 2-5 gives two kinds of different structures
Step-like side 31.Frame structure 2 is made using the metal for conducting electricity very well, it is preferred to use high-purity copper.Using stairstepping
Side 31 increase the contact area of frame structure 2 and packaging body 1 under the limited area of frame structure 2 so that packaging body 1 exists
Half encapsulates（Part frame structure is exposed external in encapsulation）On the premise of combined with frame structure 2 it is even closer, lifted veneer it is whole
The sealing of stream bridge chip structure.
The bottom surface of frame structure 2 is in naked state, is directly contacted with substrate, and using frame structure 2 and substrate heat conduction is carried out,
Thermal resistance can be effectively reduced, the obstruct of packaging body 1 is avoided in radiation processes, improve the heat-sinking capability of diode chip 4,
The temperature for enabling diode chip 4 is maintained at for a long time in rational scope, and for the work of diode chip 4 phase is provided
To stable working environment, the work efficiency of diode chip 4 is improve, it is to avoid impact of the high temperature to diode chip for backlight unit 4, prolong
The service life of long diode chip for backlight unit 4.
As shown in fig. 6-7, in order to further enhance sealing, can be in some U-lags of the edge of frame structure 2
32.The mouth of U-lag is little, bottom is big.When carrying out injection molding packaging, the packaging body 1 in flow-like flows into U-lag 32, solidifies in packaging body 1
Afterwards, packaging body 1 defines the big structure of mouthful handle in U-lag 32, on the one hand increased connecing for frame structure 2 and packaging body 1
Contacting surface is accumulated, and increased sealing, on the other hand, when packaging body is due to external force effect loosening such stabilized structure can be passed through
The relative position of packaging body 1 and frame structure 2 so that packaging body 1 encapsulates more firm.
The frame structure includes one ~ framework of framework four, is exposed to the one 21 ~ framework of framework 4 24 of the packaging body bottom surface
Closest-approach distance >=3mm each other.In rectifier bridge chip operation, have electric current between framework unavoidably and flow through, in order to ensure
Stablizing during rectifier bridge chip operation, it is to avoid be short-circuited, prevents from being influenced each other between the diode without annexation, framework
Between must have certain distance ensure will not short circuit, the distance between framework >=3mm.Diode chip for backlight unit 4 can be ensure that in work
Can accomplish not interfere with each other when making, so as to the service behaviour that ensure that whole rectification bridge chip is stablized.Avoid being short-circuited, and
The volume of frame structure 2 can be reduced, so as to reduce the volume of veneer rectification bridge chip so that veneer rectification bridge chip is small-sized
Change.
Claims (4)
1. veneer rectifier bridge chip structure, including packaging body, the package interior is provided with the rectification being welded in frame structure
Bridge circuit；Characterized in that,
The bottom surface of the frame structure is concordant with the packaging body bottom surface so that the bottom surface of frame structure is in naked state；It is described
The cross section of the side of frame structure is stairstepping.
2. veneer rectifier bridge chip structure according to claim 1, it is characterised in that the edge of the frame structure
Some U-lags.
3. veneer rectifier bridge chip structure according to claim 2, it is characterised in that the mouth of the U-lag is little, bottom is big.
4. veneer rectifier bridge chip structure according to claim 1, it is characterised in that the frame structure includes framework one
~ framework four, is exposed to the one ~ framework of framework four of packaging body bottom surface closest-approach distance >=3mm each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621209377.9U CN206116381U (en) | 2016-11-09 | 2016-11-09 | Wainscot rectifier bridge chip structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621209377.9U CN206116381U (en) | 2016-11-09 | 2016-11-09 | Wainscot rectifier bridge chip structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206116381U true CN206116381U (en) | 2017-04-19 |
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ID=58526331
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621209377.9U Active CN206116381U (en) | 2016-11-09 | 2016-11-09 | Wainscot rectifier bridge chip structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206116381U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109671835A (en) * | 2019-01-23 | 2019-04-23 | 佛山市国星光电股份有限公司 | Supporting structure, LED component and support array |
| CN109860371A (en) * | 2019-01-23 | 2019-06-07 | 佛山市国星光电股份有限公司 | Supporting structure, support array and LED component |
-
2016
- 2016-11-09 CN CN201621209377.9U patent/CN206116381U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109671835A (en) * | 2019-01-23 | 2019-04-23 | 佛山市国星光电股份有限公司 | Supporting structure, LED component and support array |
| CN109860371A (en) * | 2019-01-23 | 2019-06-07 | 佛山市国星光电股份有限公司 | Supporting structure, support array and LED component |
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