CN109860371A - Supporting structure, support array and LED component - Google Patents
Supporting structure, support array and LED component Download PDFInfo
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- CN109860371A CN109860371A CN201910064157.3A CN201910064157A CN109860371A CN 109860371 A CN109860371 A CN 109860371A CN 201910064157 A CN201910064157 A CN 201910064157A CN 109860371 A CN109860371 A CN 109860371A
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- 239000000758 substrate Substances 0.000 claims abstract description 37
- 230000000694 effects Effects 0.000 claims abstract description 5
- 238000009434 installation Methods 0.000 claims description 7
- 238000005538 encapsulation Methods 0.000 claims description 6
- 239000004744 fabric Substances 0.000 claims 1
- IHQKEDIOMGYHEB-UHFFFAOYSA-M sodium dimethylarsinate Chemical class [Na+].C[As](C)([O-])=O IHQKEDIOMGYHEB-UHFFFAOYSA-M 0.000 claims 1
- 238000000034 method Methods 0.000 description 5
- 238000010276 construction Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 241000255925 Diptera Species 0.000 description 1
- 210000002421 cell wall Anatomy 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000001954 sterilising effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Abstract
The present invention provides a kind of supporting structure, support array and LED components, wherein supporting structure includes supporting substrate, and assembling groove is offered on the side ring circumferential surface of supporting substrate, and assembling groove is used to cooperate with external component, to play the effect fixed to supporting structure.The present invention solves the assembling module unreasonable structure in the prior art for being used to carry LED component, or too tight to LED component clamping, is not easy to remove, or too loose to LED component clamping, causes LED component to be easy to fall off, there is a problem of that practicability is very poor.
Description
Technical field
The present invention relates to technical field of LED light illumination, in particular to a kind of supporting structure, support array and LED device
Part.
Background technique
As Minamata pact gradually comes into force, ultraviolet LED or deep ultraviolet LED using more and more extensive, be related to for example luring mosquito,
Manicure, the every field such as industry solidification and sterilizing.
Correspondingly, ultraviolet LED product or deep ultraviolet LED product can be more and more, and LED component is as production ultraviolet LED
The base components of product or deep ultraviolet LED product, usage amount is larger, but since the volume of LED component is small, is not easy to take
Band or transport, therefore, it is necessary to multiple LED components are assembled into modular form；It is ultraviolet when needing to make using LED component
When LED product or deep ultraviolet LED product, installed after by LED component, disassembly is lower one by one from LED component module.But it is existing
Some is used to carry the assembling module unreasonable structure of LED component, or too tight to LED component clamping, is not easy to remove, or
It is too loose to LED component clamping, cause LED component to be easy to fall off, practicability is very poor.
Summary of the invention
The main purpose of the present invention is to provide a kind of supporting structure, support array and LED components, to solve the prior art
In for carrying the assembling module unreasonable structure of LED component, or LED component is clamped too tight, is not easy to remove, or
It is too loose to LED component clamping, cause LED component to be easy to fall off, there is a problem of that practicability is very poor.
To achieve the goals above, according to an aspect of the invention, there is provided a kind of supporting structure, including branch support group
Plate offers assembling groove on the side ring circumferential surface of supporting substrate, and assembling groove is used to cooperate with external component, to play to bracket
The fixed effect of structure.
Further, assembling groove is multiple, and multiple assembling grooves are provided at circumferentially spaced around side ring circumferential surface.
Further, supporting substrate is in rectangular plate-like, and the side ring circumferential surface of supporting substrate includes two long sides being disposed opposite to each other
Surface and two broadside surfaces being disposed opposite to each other, supporting structure further include stent electrode, and stent electrode is embedded in supporting substrate, and
The part of the surface of stent electrode is exposed at broadside surfaces, wherein assembling groove is formed on two long side surfaces, and each long side
The number of assembling groove on surface is equal.
Further, at least part of orthographic projection of the assembling groove on the length direction of the broadside surfaces of supporting substrate
It falls into the surface of stent electrode.
Further, the depth of assembling groove is more than or equal to 40um and is less than or equal to 60um, and assembling groove is along supporting substrate
Long side surface length direction on length be more than or equal to 300um and be less than or equal to 500um.
Further, the slot cross-section product of assembling groove gradually subtracts on its depth direction along the direction far from side ring circumferential surface
It is small.
Further, it is coarse curved surface that the trough wall surface of assembling groove, which is the trough wall surface of smooth curved surface or assembling groove,.
Further, the trough wall surface of assembling groove is the part of the surface of spherical surface or ellipsoid.
Further, the slot cross-section of assembling groove is rounded, oval or polygon.
Further, the upper surface of supporting substrate is formed with the cup chamber for chip, and stent electrode, which is embedded, to be supported
The lower surface of substrate, and stent electrode portion of upper surface is exposed in cup chamber.
According to another aspect of the present invention, a kind of support array is provided, comprising: braced frame；Supporting structure, bracket knot
Structure be it is multiple, multiple supporting structures are arranged on the support frame in array fashion, supporting structure be above-mentioned supporting structure；Branch
Support frame frame includes at least one support frame, and support frame, which surrounds, is fixedly mounted region, is being fixedly mounted in region along its length
It is disposed at least one supporting structure, the support frame two sides face contact opposite with supporting structure is with fixing rack structure.
Further, support arm is provided in the inner ring of support frame, support arm is stretched out to region is fixedly mounted, support
One end of the separate support frame of arm forms positioning end, and positioning end protrudes into the assembling groove of supporting structure and the slot with assembling groove
Wall surface abuts, to fix to supporting structure.
Further, multiple assembling grooves are provided on the side ring circumferential surface of supporting structure, support arm is multiple, multiple supports
Arm is provided at circumferentially spaced around inner ring, and the assembling groove of each supporting structure cooperates abutting to have a support arm.
Further, the outer surface of support arm is smooth surface, and the cross-sectional area of support arm is along the side far from support frame
To being gradually reduced, so that positioning end forms smooth positioning tip.
According to another aspect of the present invention, a kind of LED component, including supporting structure, chip and encapsulation part are provided,
In, chip is arranged on supporting structure, and encapsulation part lid is located on supporting structure and covers chip, and supporting structure is above-mentioned bracket
Structure.
It applies the technical scheme of the present invention, it is recessed by opening up assembly on the side ring circumferential surface of the supporting substrate in supporting structure
Slot, in this way, when multiple supporting structures are arranged on the support frame in array fashion to form support array, braced frame
Support frame there is the external component that cooperate with assembling groove so that support frame, which is played, stablizes support work to supporting structure
With, additionally it is possible to efficiently control the assembly pretightening power between supporting structure and support frame, it is ensured that supporting structure is by appropriate outer
It when power, easily falls off from support frame, has greatly improved the subsequent installation of LED component caused by the supporting structure system of utilization
Convenience improves the practicability of LED component lamp group array.
Detailed description of the invention
The accompanying drawings constituting a part of this application is used to provide further understanding of the present invention, and of the invention shows
Examples and descriptions thereof are used to explain the present invention for meaning property, does not constitute improper limitations of the present invention.In the accompanying drawings:
Fig. 1 shows a kind of schematic top plan view of the supporting structure of alternative embodiment according to the present invention；
Fig. 2 shows the elevational schematic views of the supporting structure in Fig. 1；
Fig. 3 shows the bracket battle array for the supporting structure that a kind of alternative embodiment according to the present invention is arranged in multiple Fig. 1
The schematic top plan view of column；
Fig. 4 shows the schematic top plan view of a braced frame of the support array in Fig. 3, is arranged in braced frame more
A supporting structure；
Fig. 5 shows the schematic top plan view of the support array in Fig. 3；
Fig. 6 shows the schematic top plan view of a braced frame of the support array in Fig. 5.
Wherein, the above drawings include the following reference numerals:
100, braced frame；200, supporting structure；101, support frame；102, region is fixedly mounted；103, inner ring；
104, support arm；105, positioning end；10, supporting substrate；11, side ring circumferential surface；111, long side surface；112, broadside surfaces；12, it fills
With groove；13, cup chamber；20, stent electrode.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that the described embodiment is only a part of the embodiment of the present invention, instead of all the embodiments.It is right below
The description only actually of at least one exemplary embodiment be it is illustrative, never as to the present invention and its application or use
Any restrictions.Based on the embodiments of the present invention, those of ordinary skill in the art are without creative efforts
Every other embodiment obtained, shall fall within the protection scope of the present invention.
It is in the prior art for carrying the assembling module unreasonable structure of LED component in order to solve, or to LED component
Clamping is too tight, is not easy to remove, or too loose to LED component clamping, causes LED component to be easy to fall off, it is very poor that there are practicabilities
The problem of, the present invention provides a kind of supporting structure, support array and LED components, wherein LED component is basic element, LED
Device is made of above-mentioned and following supporting structure 200, specifically, LED component includes supporting structure 200, chip and encapsulation
Portion, wherein chip is arranged on supporting structure 200, and encapsulation part lid is located on supporting structure 200 and covers chip；And such as Fig. 3 and
Shown in Fig. 4, support array includes braced frame 100 and multiple supporting structures 200, and multiple supporting structures 200 are in array fashion
It is arranged in braced frame 100, a LED component is capable of forming to the following process of each supporting structure 200, therefore, carrying
There is the braced frame 100 of multiple LED components to constitute LED component lamp group array, when supporting structure 200 is from braced frame 100
It when disengaging, is also equivalent to LED component and is detached from from braced frame 100, in order to which operator carries out subsequent peace to LED component
Dress.
As shown in Figures 3 to 6, in order to which lifting bracket array is to the bearing capacity of supporting structure 200 and to supporting structure
200 stability of strutting system, the practicability of lifting bracket array, braced frame 100 include at least one support frame 101, support frame
101 surround fixed installation region 102, are disposed at least one bracket along its length being fixedly mounted in region 102
Structure 200, the two sides face contact opposite with supporting structure 200 of support frame 101 is with fixing rack structure 200.
As depicted in figs. 1 and 2, supporting structure 200 includes supporting substrate 10, is opened up on the side ring circumferential surface 11 of supporting substrate 10
There is assembling groove 12, assembling groove 12 is used to cooperate with external component, to play the effect fixed to supporting structure 200.
By opening up assembling groove 12 on the side ring circumferential surface 11 of the supporting substrate 10 of supporting structure 200, in this way, when will be more
When a supporting structure 200 is arranged in braced frame 100 in array fashion to form support array, the branch of braced frame 100
Support frame 101 has the external component cooperated with assembling groove 12, so that support frame 101 is played to the steady of supporting structure 200
Determine supporting role, additionally it is possible to efficiently control the assembly pretightening power between supporting structure 200 and support frame 101, it is ensured that bracket knot
Structure 200 easily falls off from support frame 101 when by appropriate external force, has greatly improved and has been manufactured using supporting structure 200
At LED component subsequent installation convenience, improve the practicability of LED component lamp group array.
Specifically, in the illustrated embodiment of the application, as shown in Figures 3 to 6, the inner ring 103 of support frame 101
On be provided with support arm 104, support arm 104 is stretched out to region 102 is fixedly mounted, the one of the separate support frame 101 of support arm 104
End forms positioning end 105, and positioning end 105 protrudes into the assembling groove 12 of supporting structure 200 and the trough wall surface with assembling groove 12
It abuts, with fixed to supporting structure 200.That is, support arm 104 is abutted as external component with 12 trough wall surface of assembling groove
Cooperation, the two on-fixed connection, that is, ensure when supporting structure 200 is not when by larger external force, can be in support arm 104
It is stably connected with, and can ensure when supporting structure 200 is by appropriate external force with support frame 101 under supporting role, it can be with branch
Brace 104 is detached from and falls off from support frame 101；It should be noted that when supporting structure 200 is by sufficiently large external force,
Supporting structure 200 can be moved relative to support frame 101, until cell wall of the positioning end 105 of support arm 104 along assembling groove 12
When face is slid into except the trough wall surface of assembling groove 12, supporting structure 200 falls off from support frame 101.
As shown in Figure 3 and Figure 4, in order to improve support frame 101 to the stability of supporting structure 200, support array is avoided to exist
It is shaken and is fallen off from support frame 101 in transport or moving process, cause the waste of LED component；The side ring of supporting structure 200
Multiple assembling grooves 12 are provided on circumferential surface 11, support arm 104 is multiple, circumferential direction of multiple support arms 104 around inner ring 103
Interval setting, and the assembling groove 12 of each supporting structure 200 cooperates abutting to have a support arm 104.
Specifically, as depicted in figs. 1 and 2, multiple being provided at circumferentially spaced around side ring circumferential surface 11 of assembling groove 12.This
Sample effectively improves support frame 101 to the circumferential stability of strutting system of supporting structure 200.
As depicted in figs. 1 and 2, supporting substrate 10 is in rectangular plate-like, and the side ring circumferential surface 11 of supporting substrate 10 includes two phases
The long side surface 111 and two broadside surfaces 112 being disposed opposite to each other, supporting structure 200 for carrying on the back setting further include stent electrode 20, branch
Frame electrode 20 is embedded in supporting substrate 10, and the part of the surface of stent electrode 20 is exposed at broadside surfaces 112, wherein assembly
Groove 12 is formed on two long side surfaces 111, and the number of the assembling groove 12 on each long side surface 111 is equal.In this way, more
Be conducive to control the spacing between two neighboring assembling groove 12, so as to adjust two neighboring support arm 104 to supporting substrate 10
Supporting point position and promote the stability of strutting system to supporting structure 200, and broadside surfaces 112 are as to supporting structure 200
It carries out being punched the surface to be formed when processing and forming.
Optionally, orthographic projection of the assembling groove 12 on the length direction of the broadside surfaces 112 of supporting substrate 10 be at least
A part is fallen into the surface of stent electrode 20.The embodiment be exactly the application Fig. 2 shows preferred embodiment, that is to say, that
Assembling groove 12 can occur at least on the length direction of the broadside surfaces 112 of supporting substrate 10 with the side surface of stent electrode 20
It partly overlaps, the supporting structure 200 of this structure is not only convenient for processing and manufacturing molding, and can ensure that stent electrode 20 is propping up
There is enough length, so that it is guaranteed that stent electrode 20 is with enough on the length direction on the long side surface 111 of support group plate 10
Naked drain surface promotes electrical connection stability of the LED component in subsequent welding installation.
Optionally, the depth of assembling groove 12 is more than or equal to 40um and is less than or equal to 60um, and assembling groove 12 is along branch support group
Length on the length direction on the long side surface 111 of plate 10 is more than or equal to 300um and is less than or equal to 500um.Assembling groove 12
When depth and the length on the length direction on the long side surface 111 of supporting substrate 10 are in above-mentioned numberical range, not only just
In the injection molding of supporting substrate 10, and can control length that support arm 104 protrudes into assembling groove 12 and with assembly
The contact area of the inner wall of groove 12, to accurately control the assembly pretightening power between support arm 104 and supporting substrate 10
Range is improving support frame 101 to the stability of strutting system of supporting structure 200, is also helping supporting structure 200 in certain external force
It falls off from support frame 101 under effect.
As depicted in figs. 1 and 2, the slot cross-section product of assembling groove 12 is on its depth direction along the side far from side ring circumferential surface 11
To being gradually reduced.The assembling groove 12 of this structure is provided on the side ring circumferential surface 11 of supporting structure 200, when supporting structure 200
When by certain external force, along the trough wall surface of assembling groove 12 continuous slide occurs for the positioning end 105 for being conducive to support arm 104
It is dynamic, until support arm 104 is skidded off out of assembling groove 12, under dismantling supporting structure 200 from support frame 101, improve
The practicability of LED component lamp group array.
Optionally, in order to enable the positioning end 105 of support arm 104 occur along the trough wall surface of assembling groove 12 it is continuously slipping
Sliding-frictional resistance is as small as possible, and the trough wall surface of assembling groove 12 is smooth curved surface.
Certainly, it is contemplated that assembling groove 12 is formed when being molded supporting substrate 10, is affected by, assembling groove
12 trough wall surface is coarse curved surface.The trough wall surface of assembling groove 12 is the positioning that coarse curved surface also helps control support arm 104
End 105 and the trough wall surface of assembling groove 12 between stiction, so that it is guaranteed that support frame 101 to supporting structure 200 have can
The stability of strutting system leaned on.
Optionally, supporting structure is controlled for the ease of the molding of assembling groove 12 when injection molding forms supporting substrate 10
200 overall cost, the trough wall surface of assembling groove 12 are the part of the surface of spherical surface or ellipsoid.
Certainly, the slot cross-section of assembling groove 12 can be with rounded, oval or polygon.In this way, same convenient for assembly
The processing and manufacturing of groove 12 forms.
It should be noted that as depicted in figs. 1 and 2, the upper surface of supporting substrate 10 is formed with the cup for chip
Chamber 13, stent electrode 20 is embedded in the lower surface of supporting substrate 10, and 20 portion of upper surface of stent electrode is exposed in cup chamber 13.This
Sample is conducive to the welding installation of chip.
Also you need to add is that, in order to enable support arm 104 can be more advantageously bonded with the trough wall surface of assembling groove 12,
Optionally, the outer surface of support arm 104 is smooth surface, and the cross-sectional area of support arm 104 is along the direction far from support frame 101
It is gradually reduced, so that positioning end 105 forms smooth positioning tip.
It should be noted that term used herein above is merely to describe specific embodiment, and be not intended to restricted root
According to the illustrative embodiments of the application.As used herein, unless the context clearly indicates otherwise, otherwise singular
Also it is intended to include plural form, additionally, it should be understood that, when in the present specification using term "comprising" and/or " packet
Include " when, indicate existing characteristics, step, operation, device, component and/or their combination.
Unless specifically stated otherwise, positioned opposite, the digital table of the component and step that otherwise illustrate in these embodiments
It is not limited the scope of the invention up to formula and numerical value.Simultaneously, it should be appreciated that for ease of description, each portion shown in attached drawing
The size divided not is to draw according to actual proportionate relationship.For technology, side known to person of ordinary skill in the relevant
Method and equipment may be not discussed in detail, but in the appropriate case, and the technology, method and apparatus should be considered as authorizing explanation
A part of book.In shown here and discussion all examples, any occurrence should be construed as merely illustratively, and
Not by way of limitation.Therefore, the other examples of exemplary embodiment can have different values.It should also be noted that similar label
Similar terms are indicated in following attached drawing with letter, therefore, once it is defined in a certain Xiang Yi attached drawing, then subsequent attached
It does not need that it is further discussed in figure.
For ease of description, spatially relative term can be used herein, as " ... on ", " ... top ",
" ... upper surface ", " above " etc., for describing such as a device shown in the figure or feature and other devices or spy
The spatial relation of sign.It should be understood that spatially relative term is intended to comprising the orientation in addition to device described in figure
Except different direction in use or operation.For example, being described as if the device in attached drawing is squeezed " in other devices
It will be positioned as " under other devices or construction after part or construction top " or the device of " on other devices or construction "
Side " or " under other devices or construction ".Thus, exemplary term " ... top " may include " ... top " and
" in ... lower section " two kinds of orientation.The device can also be positioned with other different modes and (is rotated by 90 ° or in other orientation), and
And respective explanations are made to the opposite description in space used herein above.
It should be noted that term used herein above is merely to describe specific embodiment, and be not intended to restricted root
According to the illustrative embodiments of the application.As used herein, unless the context clearly indicates otherwise, otherwise singular
Also it is intended to include plural form, additionally, it should be understood that, when in the present specification using term "comprising" and/or " packet
Include " when, indicate existing characteristics, step, work, device, component and/or their combination.
It should be noted that the description and claims of this application and term " first " in above-mentioned attached drawing, "
Two " etc. be to be used to distinguish similar objects, without being used to describe a particular order or precedence order.It should be understood that using in this way
Data be interchangeable under appropriate circumstances, so that presently filed embodiment described herein can be in addition to illustrating herein
Or the sequence other than those of description is implemented.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, made any to repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (15)
1. a kind of supporting structure, which is characterized in that including supporting substrate (10), the side ring circumferential surface (11) of the supporting substrate (10)
On offer assembling groove (12), the assembling groove (12) be used for external component cooperate, to play to the supporting structure
Fixed effect.
2. supporting structure according to claim 1, which is characterized in that the assembling groove (12) be it is multiple, it is the multiple
Assembling groove (12) being provided at circumferentially spaced around side ring circumferential surface (11).
3. supporting structure according to claim 2, which is characterized in that the supporting substrate (10) is in rectangular plate-like, described
The side ring circumferential surface (11) of supporting substrate (10) includes two long side surfaces (111) being disposed opposite to each other and two broadsides being disposed opposite to each other
Surface (112), the supporting structure further include stent electrode (20), and the stent electrode (20) is embedded the supporting substrate (10)
It is interior, and the part of the surface of the stent electrode (20) is exposed at the broadside surfaces (112), wherein the assembling groove
(12) it is formed on described two long side surfaces (111), and the assembling groove (12) on each long side surface (111)
Number is equal.
4. supporting structure according to claim 3, which is characterized in that the assembling groove (12) is along the supporting substrate
(10) at least part of the orthographic projection on the length direction of broadside surfaces (112) falls into the surface of the stent electrode (20)
It is interior.
5. supporting structure according to claim 3, which is characterized in that the depth of the assembling groove (12) is more than or equal to
40um and be less than or equal to 60um, length side of the assembling groove (12) along the long side surface (111) of the supporting substrate (10)
Upward length is more than or equal to 300um and is less than or equal to 500um.
6. supporting structure according to claim 1, which is characterized in that the slot cross-section product of the assembling groove (12) is in its depth
Degree is gradually reduced on direction along the direction far from the side ring circumferential surface (11).
7. supporting structure according to claim 6, which is characterized in that the trough wall surface of the assembling groove (12) is smooth
The trough wall surface of curved surface or the assembling groove (12) is coarse curved surface.
8. supporting structure according to claim 7, which is characterized in that the trough wall surface of the assembling groove (12) be spherical surface or
The part of the surface of ellipsoid.
9. supporting structure according to claim 6, which is characterized in that the slot cross-section of the assembling groove (12) is rounded,
Ellipse or polygon.
10. supporting structure according to claim 3, which is characterized in that the upper surface of the supporting substrate (10) is formed with
For the cup chamber (13) of chip, the stent electrode (20) is embedded in the lower surface of the supporting substrate (10), and described
Stent electrode (20) portion of upper surface is exposed in the cup chamber (13).
11. a kind of support array characterized by comprising
Braced frame (100)；
Supporting structure (200), the supporting structure (200) be it is multiple, the multiple supporting structure (200) is arranged in array fashion
For cloth on the braced frame (100), the supporting structure (200) is bracket knot described in any one of claims 1 to 10
Structure；
The braced frame (100) includes at least one support frame (101), and the support frame (101), which surrounds, is fixedly mounted region
(102), it is disposed at least one described supporting structure along its length in the fixed installation region (102)
(200), the support frame (101) the two sides face contact opposite with the supporting structure (200) is with the fixation supporting structure
(200)。
12. support array according to claim 11, which is characterized in that the inner ring (103) of the support frame (101)
On be provided with support arm (104), the support arm (104) is stretched out to the fixed installation region (102), the support arm
(104) one end far from the support frame (101) forms positioning end (105), and the positioning end (105) protrudes into the bracket knot
It is abutted in the assembling groove (12) of structure (200) and with the trough wall surface of the assembling groove (12), to the supporting structure (200)
It is fixed.
13. support array according to claim 12, which is characterized in that the side ring circumferential surface of the supporting structure (200)
(11) be provided on multiple assembling grooves (12), the support arm (104) be it is multiple, the multiple support arm (104) is around described
Inner ring (103) are provided at circumferentially spaced, and the assembling groove (12) of each supporting structure (200) cooperates abutting
There is the support arm (104).
14. support array according to claim 12, which is characterized in that the outer surface of the support arm (104) is smooth
Surface, and the cross-sectional area of the support arm (104) is gradually reduced along the direction far from the support frame (101), so that described
Positioning end (105) forms smooth positioning tip.
15. a kind of LED component, which is characterized in that including supporting structure (200), chip and encapsulation part, wherein the chip is set
It sets on the supporting structure (200), the encapsulation part lid is located on the supporting structure (200) and covers the chip, institute
Stating supporting structure (200) is supporting structure described in any one of claims 1 to 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910064157.3A CN109860371A (en) | 2019-01-23 | 2019-01-23 | Supporting structure, support array and LED component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910064157.3A CN109860371A (en) | 2019-01-23 | 2019-01-23 | Supporting structure, support array and LED component |
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| CN109860371A true CN109860371A (en) | 2019-06-07 |
Family
ID=66895957
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| CN201910064157.3A Pending CN109860371A (en) | 2019-01-23 | 2019-01-23 | Supporting structure, support array and LED component |
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| CN205863213U (en) * | 2016-04-11 | 2017-01-04 | 江西省木林森光电科技有限公司 | A kind of encapsulating structure of LED drive chip |
| CN206116381U (en) * | 2016-11-09 | 2017-04-19 | 扬州扬杰电子科技股份有限公司 | Wainscot rectifier bridge chip structure |
| CN206584961U (en) * | 2017-03-21 | 2017-10-24 | 佛山市国星光电股份有限公司 | A kind of LED support, LED support array, LED component and LED display |
| CN106847800A (en) * | 2017-03-28 | 2017-06-13 | 山东晶泰星光电科技有限公司 | QFN surface-adhered types RGB LED encapsulation modules and its manufacture method |
| CN207504006U (en) * | 2017-12-11 | 2018-06-15 | 江西亚中电子科技股份有限公司 | Close patch support module |
| CN208000933U (en) * | 2018-01-30 | 2018-10-23 | 广东品美电子科技有限公司 | Integrated COB paster support |
| CN209298163U (en) * | 2019-01-23 | 2019-08-23 | 佛山市国星光电股份有限公司 | Supporting structure and LED component |
| CN209298165U (en) * | 2019-01-23 | 2019-08-23 | 佛山市国星光电股份有限公司 | Support array and lamp group array |
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