CN206584961U - A kind of LED support, LED support array, LED component and LED display - Google Patents
A kind of LED support, LED support array, LED component and LED display Download PDFInfo
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- CN206584961U CN206584961U CN201720276852.2U CN201720276852U CN206584961U CN 206584961 U CN206584961 U CN 206584961U CN 201720276852 U CN201720276852 U CN 201720276852U CN 206584961 U CN206584961 U CN 206584961U
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Abstract
The utility model provides a kind of LED support, and the LED support includes PCB circuit base plates and insulating materials, and the PCB circuit base plates include at least two electrode districts being mutually electrically insulated；Each electrode district is linked into an integrated entity top electrodes area and bottom electrode area structure into, the side electrode area by top electrodes area, side electrode area and bottom electrode district's groups, and the side electrode area is from the side of the export-oriented PCB circuit base plates inner recess；The insulating materials is filled in the side electrode area；The insulating materials without departing from the PCB circuit base plates upper and lower surface, and its thickness h be less than the PCB circuit base plates thickness H.LED support of the present utility model solves the problem of LED component bottom electrode easy to fall off and loose contact, improves product qualification rate and production efficiency.The utility model also provides a kind of LED support array, LED component and LED display for including above-mentioned LED support.
Description
Technical field
The utility model is related to LED technology field, more particularly to a kind of LED support, LED support array, LED component and
LED display.
Background technology
The manufacturing process of sheet-shaped LED device (CHIP LED) generally comprise making wiring board, die bond, bonding wire, encapsulation, draw
The processes such as piece, test and braid.
Referring to Fig. 1, it is the side block diagram of the wiring board 1 obtained by existing sheet-shaped LED device fabrication, the circuit
Plate 1 is combined into by top layer copper 10, middle level BT material 11 and bottom copper 12.In wiring board process is made, in order to realize top
The electric connection of layer copper 10 and bottom copper 12 is, it is necessary to get out via hole 13, then in the inwall plating of via hole 13 in assist side 1
Upper hole copper 14, is connected top layer copper 10 and bottom copper 12 using the hole copper 14.In packaging process, generally using molding
Packaging plastic is covered on wiring board 1 by mode, is formed encapsulation glue-line and is sealed protection to mounted chip on wiring board 1.
And because packaging plastic uncured in packaging process can be flowed downward out along via hole 13, it is therefore desirable in making circuit before
Via hole 13 is clogged completely first with resin 15 in plate process, the thickness of plug resin 15 in via hole 13, which is often slightly larger than, leads
Protrude the via hole 13 in the depth of through hole 13, its two ends.
Fig. 2 and Fig. 3 are referred to, Fig. 2 is the side block diagram of existing sheet-shaped LED device, and Fig. 3 is existing sheet-shaped LED device
Back view, the resin 15 in the sheet-shaped LED device formed after dicing processes the still via hole 13 with original wiring board 1.By
10 μm are generally only in the thickness of lower surface of the lower end of resin 15 beyond bottom copper 12, and hole copper 14, therefore follow-up
In test and braid process, the lower end of resin 15 is easily collided by external force, is broken the junction of itself and hole copper 14, is led
Cause comes off as the bottom copper 12 of the bottom electrode of the sheet-shaped LED device, causes product to damage.In addition, the resin 15 can also make
The problem of loose contact occurs in the bottom electrode of LED component, causes test result to be judged by accident, reduces production efficiency, and influence LED devices
The paster of part is used.
Utility model content
For the drawbacks described above of prior art, the purpose of this utility model is to provide a kind of reliability higher LED branch
Frame, to solve the problem of LED component bottom electrode easy to fall off and loose contact, improves product qualification rate and production efficiency；This reality
It is to provide a kind of LED support array, LED component and LED display for including above-mentioned LED support with new another object.
To achieve these goals, the technical solution adopted in the utility model is as follows：
A kind of LED support, the LED support includes PCB circuit base plates and insulating materials, and the PCB circuit base plates include
At least two electrode districts being mutually electrically insulated；Each electrode district is by top electrodes area, side electrode area and bottom electrode district's groups
Top electrodes area and bottom electrode area are linked into an integrated entity structure into, the side electrode area, the side electrode area is from outer
To the side of the PCB circuit base plates inner recess；The insulating materials is filled in the side electrode area；The insulation material
Expect the upper and lower surface without departing from the PCB circuit base plates, and its thickness h is less than the thickness H of the PCB circuit base plates.
Relative to prior art, the insulating materials filled in LED support of the present utility model is without departing from PCB circuit base plates
Upper and lower surface, the probability that it is collided in the processes such as die bond, bonding wire, test and braid by external force is small, therefore can avoid a slurry
The production equipments such as head, bonding wire porcelain mouth are impacted and run bad or damage, and ensure the LED component as made from the LED support
Bottom electrode is difficult for drop-off, the problem of preventing loose contact, it is ensured that the accuracy of test result, and then improves manufacture LED
The product qualification rate and production efficiency of device, and be conducive to the paster of LED component to use.Moreover, the thickness of the insulating materials
Less than the thickness of PCB circuit base plates, both having realized prevents packaging plastic from being flowed out along via hole, and unnecessary insulating materials is reduced again and is used
Amount, reduces production cost.
Further, the upper surface flush of the upper end face of the insulating materials and the PCB circuit base plates；Or it is described exhausted
The upper end face of edge material is less than the upper surface of the PCB circuit base plates, and the rear surface of the insulating materials is higher than the PCB
The lower surface of circuit base plate.
Further, the thickness h of the insulating materials and the thickness H of the PCB circuit base plates meet relational expression：
It is side while preventing packaging plastic from being flowed out along via hole by the position to insulating materials and the restriction of thickness
Face electrode district reserves more spaces to plate metal, realizes its interconnection with the bottom electrode area as bottom electrode,
The adhesion in side electrode area and bottom electrode area is enhanced, and reduces the consumption of insulating materials.
Further, the top electrodes area, side electrode area and bottom electrode area are respectively arranged with layers of copper, the top
Layers of copper, the layers of copper in side electrode area and the layers of copper in bottom electrode area of electrode district link into an integrated entity structure.
Further, the top electrodes area is provided with layer gold, nickel dam and layers of copper from top to bottom, and the side electrode area is certainly
The export-oriented PCB circuit base plates direction is provided with layer gold, nickel dam and layers of copper, and the bottom electrode area is provided with gold from bottom to top
Layer, nickel dam and layers of copper；The layer gold in the side electrode area and the layer gold in bottom electrode area link into an integrated entity structure, the side electricity
The nickel dam of polar region and the nickel dam in bottom electrode area link into an integrated entity structure.
By setting layers of copper, nickel dam and layer gold in electrode district, improve the electric conductivity of LED support, make side electrode area with
Bottom electrode area is not only combined by layers of copper, is also combined by nickel dam and layer gold, both adhesions of enhancing, and prevents joint portion
Position is broken, and further improves the reliability of LED support.
Further, copper layer thickness >=12.5 μm in the side electrode area, nickel layer thickness >=4.5 μm, layer gold thickness >=
0.1μm.By the copper layer thickness, nickel layer thickness and the layer gold thickness that limit side electrode area, it is ensured that side electrode area and bottom electricity
Possess enough adhesions between polar region, while reducing the consumption of unnecessary copper, nickel and gold, reduce production cost.
Further, the insulating materials is resin or green oil.
Second purpose of the present utility model is to provide a kind of LED support array, and the LED support array includes multiple LED
Support, the LED support is the LED support described in any of the above-described.
Further, the LED support includes four electrode districts being mutually electrically insulated, the side electrode of each electrode district
Area is the side from the export-oriented internal stent depression；In the LED support array, the side of every four adjacent LED supports
Electrode district encloses to form a via hole.
3rd purpose of the present utility model is to provide a kind of LED component, and the LED component includes LED support, LED chip
With encapsulation glue-line, the LED chip is arranged on the LED support, and the encapsulation glue-line coats the LED chip；The LED
Support is the LED support described in any of the above-described.
4th purpose of the present utility model is to provide a kind of LED display, and the LED display includes multiple LED components
And PCB, the LED component is in the PCB；The LED component is above-mentioned LED component.
Brief description of the drawings
Fig. 1 is the side block diagram of the wiring board obtained by existing sheet-shaped LED device fabrication.
Fig. 2 is the side block diagram of existing sheet-shaped LED device.
Fig. 3 is the back view of existing sheet-shaped LED device.
Fig. 4 is the side block diagram of LED support of the present utility model.
Fig. 5 is the front elevation of LED support of the present utility model.
Fig. 6 is the back view of LED support of the present utility model.
Fig. 7 is the side block diagram of LED support array of the present utility model.
Fig. 8 is the front Local map of LED support array of the present utility model.
Fig. 9 is the back side Local map of LED support array of the present utility model.
Figure 10 is the side block diagram of LED component of the present utility model.
Figure 11 is the front elevation of LED component of the present utility model.
Embodiment
The utility model provides a kind of LED support, LED support array, LED component and LED display, in order that ability
The technical staff in domain is better understood when and implemented, and describes the utility model in detail with reference to the accompanying drawings and examples.
A kind of LED support embodiment
The side block diagram that Fig. 4-6, Fig. 4 is LED support 2 of the present utility model is referred to, Fig. 5 is of the present utility model
The front elevation of LED support 2, Fig. 6 is the back view of LED support 2 of the present utility model.The LED support 2 that the utility model is provided is wrapped
Include PCB circuit base plates 20 and insulating materials 21.The PCB circuit base plates 20 include at least two electrodes being mutually electrically insulated
Area, each electrode district is made up of top electrodes area 201, side electrode area 202 and bottom electrode area 203, the side electrode area
Top electrodes area 201 and bottom electrode area 203 are linked into an integrated entity structure to realize electric connection, the side electrode area by 202
202 be from the side of the export-oriented inner recess of PCB circuit base plates 20.The insulating materials 21 is filled in the side electrode area
In 202, and without departing from the upper and lower surface of the PCB circuit base plates 20, the thickness h of the insulating materials is less than the PCB circuits
The thickness H of substrate.
In the present embodiment, as shown in Figure 5 and Figure 6, the PCB circuit base plates 20 of the LED support 2 are quadrangle, the PCB
Circuit base plate 20 includes four electrode districts being mutually electrically insulated, and the side electrode area 202 of each electrode district is from export-oriented described
1/4 cylindrical side of the inner recess of PCB circuit base plates 20.
The top electrodes area 201 of each electrode district is coated with layer gold 2011, nickel dam 2012 and layers of copper 2013 from top to bottom, each
The side electrode area 202 of electrode district is coated with layer gold 2021, nickel dam 2022 and layers of copper from the export-oriented direction of PCB circuit base plates 20
2023, the bottom electrode area 203 of each electrode district is coated with layer gold 2031, nickel dam 2032 and layers of copper 2033 from bottom to top.Each
In electrode district, the layers of copper 2013 in its top electrodes area 201, the layers of copper 2023 in side electrode area 202 and the copper in bottom electrode area 203
Layer 2023 is linked into an integrated entity structure, and the layer gold 2021 in its side electrode area 202 is connected into the layer gold 2031 in bottom electrode area 203
Integrative-structure, the nickel dam 2022 in its side electrode area 202 and the nickel dam 2032 in bottom electrode area 203 link into an integrated entity structure.Make
For further preferred, the thickness d of layers of copper 2023 in the side electrode area 202 of each electrode district3>=12.5 μm, the thickness d of nickel dam 20222
>=4.5 μm, the thickness d of layer gold 20211≥0.1μm。
The insulating materials 21 is any one in resin or green oil, and green oil is a kind of conventional acrylic acid of PCB industries
Oligomer.Specifically, the thickness h and the PCB circuits for the insulating materials 21 filled in the side electrode area 202 of each electrode district
The thickness H of plate substrate 20 meets relational expression：In the present embodiment, the side electrode area of each electrode district
The upper surface flush of the upper end face of the insulating materials 21 of filling and the PCB circuit base plates 20, the side electrode area in 202
The part of fill insulant 21 only sets layers of copper 2023 in 202, is not provided with layer gold 2021 and nickel dam 2022；In other embodiment
In may be configured as, in the side electrode area of each electrode district fill insulating materials upper end face be less than the PCB circuits base
The upper surface of plate, the rear surface of insulating materials is higher than the lower surface of the PCB circuit base plates, so fills and is advantageous in that
When device is encapsulated below, strengthen the adhesion of packaging plastic such as epoxy resin and substrate, then can also increase tin on bottom
Area.
LED support of the present utility model also has various deformation in addition to the present embodiment, for example, the PCB circuit base plates can have
Body is the shapes such as square, parallelogram, regular hexagon or equilateral triangle；The PCB circuit base plates can also have two, three
The individual, electrode district of five or more；The upper end face of the insulating materials can be less than upper surface of the PCB circuit base plates etc..
A kind of LED support array embodiment
The side block diagram that Fig. 7-9, Fig. 7 is LED support array 3 of the present utility model is referred to, Fig. 8 is the utility model
LED support array 3 front Local map, Fig. 9 is the back side Local map of LED support array 3 of the present utility model.The present embodiment
The LED support array 3 of offer includes LED support that is multiple arranged in arrays and being connected with each other.The LED support is above-mentioned one kind
The side electrode of every four adjacent LED supports 2 in LED support 2 described in LED support embodiment, the LED support array 3
Area 202 is enclosed to form a via hole 30, and the insulating materials 21 is filled in the via hole 30.
In actual LED component manufacturing process, the LED support array 3 of the present embodiment is by die bond, bonding wire and encapsulation work
After sequence, in dicing processes, single LED component is formed after the horizontal and vertical cutting along the via hole 30.
A kind of LED component embodiment
Figure 10 and Figure 11 are referred to, Figure 10 is the side block diagram of LED component 4 of the present utility model, and Figure 11 is this practicality
The front elevation of new LED component 4.The LED component 4 that the utility model is provided includes LED support, LED chip and encapsulation glue-line
40.The LED chip is arranged on the LED support, and the encapsulation glue-line 40 coats the LED chip.
Specifically, in the present embodiment, the LED component 4 is all-colour LED device.The LED support is above-mentioned one kind
LED support 2 described in LED support embodiment.Three top electrodes areas 201 in the LED component 4 as three bonding wire portions,
Three angles of the PCB circuit base plates 20 are respectively arranged at, remaining top electrodes area 201 is set as chip installation portion
In the centre of the PCB circuit base plates 20 and extend to another angles of the PCB circuit base plates 20.The chip installation portion and described
Mutually it is electrically insulated between three bonding wire portions.
The LED chip includes a red LED chip 41, a green LED chip 42 and a blue-light LED chip
43, the red LED chip 41, green LED chip 42 and blue-light LED chip 43 may be contained within the chip peace of the LED support 2
In dress portion, and electric connection is realized by lead and three bonding wire portions respectively.
The encapsulation glue-line 40 is transparent enclosure glue-line.
In actual LED component manufacturing process, the LED component 4 of the present embodiment passes through die bond, weldering by LED support array
Formed after line, encapsulation and dicing processes.
LED component of the present utility model also has various deformation in addition to the present embodiment, for example, the LED component can also be single
Color device or two-color device, its LED chip are a monochromatic LED chip or include the LED chip of two different colours；It is described
The LED support of LED component includes a chip installation portion and a bonding wire portion, or is welded including a chip installation portion and two
Line portion, or including three chip installation portions and three bonding wire portions etc..
A kind of LED display embodiment
The LED display that the present embodiment is provided includes multiple LED components, PCB and mask.The LED component
Install and be electrically connected at the PCB, the mask is fastened on above the PCB.
The LED component is the LED component 4 described in a kind of above-mentioned LED component embodiment, therefore be will not be repeated here.
Relative to prior art, the utility model has the advantages that：
(1) insulating materials filled by limiting in LED support is reduced exhausted without departing from the upper and lower surface of PCB circuit base plates
The probability that edge material is collided in the processes such as die bond, bonding wire, test and braid by external force, it is to avoid point slurry head, bonding wire porcelain mouth etc.
Production equipment is impacted and runs bad or damage, and ensures that the bottom electrode of LED component as made from the LED support is difficult to take off
Fall, while preventing the generation of loose contact problem, it is ensured that the accuracy of test result, and then improve the product of manufacture LED component
Qualification rate and production efficiency, and be conducive to the paster of LED component to use.
(2) by the position to insulating materials and the restriction of thickness, while preventing packaging plastic from being flowed out along via hole, it is
Side electrode area reserves more spaces to plate metal, realizes its mutually interconnection with the bottom electrode area as bottom electrode
Connect, enhance the adhesion in side electrode area and bottom electrode area, and reduce the consumption of insulating materials.
(3) by setting layers of copper, nickel dam and layer gold in electrode district, the electric conductivity of LED support is improved, makes side electrode area
Not only combined, also combined by nickel dam and layer gold by layers of copper with bottom electrode area, both adhesions of enhancing, and prevent from combining
Position is broken, and further improves the reliability of LED support.
(4) by limiting copper layer thickness, nickel layer thickness and the layer gold thickness in side electrode area, it is ensured that side electrode area and bottom
Possess enough adhesions between portion's electrode district, while reducing the consumption of unnecessary copper, nickel and gold, reduce production cost.
(5) by providing a kind of LED support array for including the utility model LED support, be conducive to improving manufacture LED devices
The product qualification rate and production efficiency of part, and ensure the reliability and using effect of LED component.
(6) by providing a kind of LED component for including the utility model LED support, the reliable of LED component is advantageously ensured that
Property and using effect.
(7) by providing a kind of LED display for including the utility model LED component, LED display is advantageously ensured that
Reliability and using effect.
The utility model is not limited to above-mentioned embodiment, if do not taken off to various changes or deformation of the present utility model
From spirit and scope of the present utility model, if these are changed and deformation belongs to claim of the present utility model and equivalent technologies
Within the scope of, then the utility model is also intended to comprising these changes and deformed.
Claims (11)
1. a kind of LED support, the LED support includes PCB circuit base plates and insulating materials, the PCB circuit base plates are included extremely
Lack two electrode districts being mutually electrically insulated；Each electrode district by top electrodes area, side electrode area and bottom electrode district's groups into,
The side electrode area links into an integrated entity top electrodes area and bottom electrode area structure, and the side electrode area is from export-oriented institute
State the side of PCB circuit base plate inner recess；The insulating materials is filled in the side electrode area；It is characterized in that：Institute
Upper and lower surface of the insulating materials without departing from the PCB circuit base plates is stated, and its thickness h is less than the thickness of the PCB circuit base plates
H。
2. LED support according to claim 1, it is characterised in that：The upper end face of the insulating materials and the PCB lines
The upper surface flush of base board；It is described exhausted or the upper end face of the insulating materials is less than the upper surface of the PCB circuit base plates
The rear surface of edge material is higher than the lower surface of the PCB circuit base plates.
3. LED support according to claim 1, it is characterised in that：The thickness h of the insulating materials and the PCB circuits
The thickness H of substrate meets relational expression：
4. LED support according to claim 1, it is characterised in that：The top electrodes area, side electrode area and bottom electricity
Polar region is respectively arranged with layers of copper, and layers of copper, the layers of copper in side electrode area and the layers of copper in bottom electrode area in the top electrodes area connect
It is connected into integrative-structure.
5. LED support according to claim 4, it is characterised in that：The top electrodes area be provided with from top to bottom layer gold,
Nickel dam and layers of copper, the side electrode area are provided with layer gold, nickel dam and layers of copper from the export-oriented PCB circuit base plates direction, described
Bottom electrode area is provided with layer gold, nickel dam and layers of copper from bottom to top；The layer gold in the side electrode area and the gold in bottom electrode area
Layer links into an integrated entity structure, and the nickel dam in the side electrode area and the nickel dam in bottom electrode area link into an integrated entity structure.
6. LED support according to claim 5, it is characterised in that：Copper layer thickness >=12.5 μm in the side electrode area,
Nickel layer thickness >=4.5 μm, layer gold thickness >=0.1 μm.
7. LED support according to claim 1, it is characterised in that：The insulating materials is resin or green oil.
8. a kind of LED support array, including multiple LED supports, it is characterised in that：The LED support is that claim 1-7 is any
LED support described in.
9. LED support array according to claim 8, it is characterised in that：The LED support is mutually electrically exhausted including four
The electrode district of edge, the side electrode area of each electrode district is the side from the export-oriented internal stent depression；The LED support battle array
In row, the side electrode area of every four adjacent LED supports encloses to form a via hole.
10. a kind of LED component, including LED support, LED chip and encapsulation glue-line, the LED chip are arranged at the LED support
On, the encapsulation glue-line coats the LED chip；It is characterized in that：The LED support is described in claim any one of 1-7
LED support.
11. a kind of LED display, including multiple LED components and PCB, the LED component are arranged on the PCB circuits
On plate；It is characterized in that：The LED component is the LED component described in claim 10.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720276852.2U CN206584961U (en) | 2017-03-21 | 2017-03-21 | A kind of LED support, LED support array, LED component and LED display |
| US15/799,272 US10378736B2 (en) | 2016-11-03 | 2017-10-31 | LED bracket, LED bracket array, LED device and LED display screen |
| JP2017005016U JP3214514U (en) | 2016-11-03 | 2017-11-02 | LED bracket, LED bracket array, LED element and LED display screen |
| KR1020170145992A KR20180049807A (en) | 2016-11-03 | 2017-11-03 | LED support, LED support array, LED elements and LED display screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720276852.2U CN206584961U (en) | 2017-03-21 | 2017-03-21 | A kind of LED support, LED support array, LED component and LED display |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206584961U true CN206584961U (en) | 2017-10-24 |
Family
ID=60114815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720276852.2U Active CN206584961U (en) | 2016-11-03 | 2017-03-21 | A kind of LED support, LED support array, LED component and LED display |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206584961U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109656018A (en) * | 2018-12-17 | 2019-04-19 | 中国科学院长春光学精密机械与物理研究所 | A kind of array type optical device and its mounting bracket |
| CN109860371A (en) * | 2019-01-23 | 2019-06-07 | 佛山市国星光电股份有限公司 | Supporting structure, support array and LED component |
-
2017
- 2017-03-21 CN CN201720276852.2U patent/CN206584961U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109656018A (en) * | 2018-12-17 | 2019-04-19 | 中国科学院长春光学精密机械与物理研究所 | A kind of array type optical device and its mounting bracket |
| CN109860371A (en) * | 2019-01-23 | 2019-06-07 | 佛山市国星光电股份有限公司 | Supporting structure, support array and LED component |
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