CN204966478U - Cooling fin structure surface mounting rectifier bridge device - Google Patents
Cooling fin structure surface mounting rectifier bridge device Download PDFInfo
- Publication number
- CN204966478U CN204966478U CN201520775218.4U CN201520775218U CN204966478U CN 204966478 U CN204966478 U CN 204966478U CN 201520775218 U CN201520775218 U CN 201520775218U CN 204966478 U CN204966478 U CN 204966478U
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- CN
- China
- Prior art keywords
- metal substrate
- diode chip
- backlight unit
- electrically connected
- negative
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
- H01L2224/8438—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/84385—Shape, e.g. interlocking features
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- Rectifiers (AREA)
Abstract
The utility model relates to a cooling fin structure surface mounting rectifier bridge device, include: by wrap -around first, the second of epoxy packaging body, third, fourth diode chip and cathode metal strip, epoxy packaging body bottom and lie in left and right side and be fixed with first, the 2nd metal substrate and E shape metal substrate respectively, first, second, third, fourth connection piece along fore -and -aft direction parallel arrangement, cathode metal strip lies in front end between a metal substrate and the E shape metal substrate and has a ninety percent discount turn of bilge, and this bend portion bottom and first, the 2nd metal substrate and the respective bottom of E shape metal substrate lie in same horizontal plane and all exposed and go out the epoxy packaging body, first, the 2nd metal substrate is as AC input, cathode metal strip holds as the direct current negative pole, E shape metal substrate is as the direct current positive terminal. The utility model discloses chip and PCB's heat dissipation path is the shortest, and the fin be the metal material, the coefficient of heat conductivity superiority, make full use of the heat -sinking capability of PCB board self, avoided the air convection who passes through quick -witted incasement of existing product, epoxy capacity of heat transmission subalternation defect.
Description
Technical field
The utility model relates to a kind of rectified semiconductor device, particularly relates to a kind of heat radiating fin structure surface mount rectifier bridge device.
Background technology
The bridge architecture that rectifier is made up of four rectifier diodes, it utilizes the unilateal conduction characteristic of diode to carry out rectification to alternating current, because bridge rectifier doubles than ripple rectification to the positive sinusoidal wave utilization ratio of input, be that the one of diode halfwave rectifier is significantly improved, therefore be widely used in alternating current and convert in galvanic circuit.
On the one hand, existing biserial laminated structure rectifier, production technology is simple, easy to operate.But the support chip evenness at every diode crystal particle place interacts and causes interiors of products stress state in procedure for producing stable not, crystal grain situation that is impaired or loose contact happens occasionally.On the other hand, existing product be 4 independently diode (accompanying drawing 1) or plug-in type bridge heap product (accompanying drawing 2) or minimize bridge heap product.The following drawback of main existence: 4 independently diodes: product thickness is large, take pcb board space comparatively large, inapplicable Reflow Soldering mode is welded.In-line arrangement bridge heap product: product thickness is large, and heat dispersion is not good, and inapplicable Reflow Soldering mode is welded.Minimize bridge heap product, without fin, client wishes that product can have better heat dispersion.To sum up, it is large to there is product thickness in prior art, takies pcb board space comparatively large, is not suitable with the demand of end product miniaturization; Product heat dispersion is not good, causes end product caloric value large, is unfavorable for energy-conserving and environment-protective; Inapplicable Reflow Soldering mode is welded, and when on pcb board, other product needed Reflow Soldering modes are welded, whole pcb board needs secondary to be heated, and can bring the technical problems such as infringement to the device assembled.
Summary of the invention
The utility model object is to provide a kind of heat radiating fin structure surface mount rectifier bridge device, this surface mount rectifier bridge thickness of detector is thin, the heat dissipation path of chip and PCB is the shortest, fin is metal material, conductive coefficient is superior, takes full advantage of the heat-sinking capability of pcb board self, avoids being dispelled the heat by the cross-ventilation in cabinet of existing product, the defects such as chip heating just can will be transmitted in outside air by epoxy, epoxy capacity of heat transmission difference.
For achieving the above object, the technical solution adopted in the utility model is: a kind of heat radiating fin structure surface mount rectifier bridge device, comprise: first, second, third, fourth diode chip for backlight unit coated by epoxy packages body and negative metal bar, be positioned at left and right side and be fixed with first, second metal substrate and E shape metal substrate respectively bottom described epoxy packages body, described negative metal bar is between first, second metal substrate and E shape metal substrate;
The positive terminal of the first diode chip for backlight unit is electrically connected with the first metal substrate upper surface, the negative pole end of the second diode chip for backlight unit is electrically connected with E shape metal substrate one end upper surface, the negative pole end of the 3rd diode chip for backlight unit is electrically connected with E shape metal substrate other end upper surface, and the positive terminal of the 4th diode chip for backlight unit is electrically connected with the second metal substrate upper surface;
First brace two ends are electrically connected with the negative pole end of the first diode chip for backlight unit and the upper surface of negative metal bar respectively, second brace two ends are electrically connected with the positive terminal of the second diode chip for backlight unit and the upper surface of the first metal substrate respectively, have lug boss and this lug boss and negative metal bar are isolated by epoxy packages body in the middle part of the second brace;
3rd brace two ends are electrically connected with the upper surface of the negative pole end of the 4th diode chip for backlight unit and negative metal article respectively, and the 4th brace two ends are electrically connected with the positive terminal of the 3rd diode chip for backlight unit and the upper surface of the second metal substrate respectively;
Described first, second, third, fourth brace be arranged in parallel along the longitudinal direction, the front end of described negative metal bar between the first metal substrate and E shape metal substrate has a bending part, is positioned at same level and all exposes described epoxy packages body bottom this bending part with first, second metal substrate and E shape metal substrate bottom separately;
First, second metal substrate is as ac input end, and the bending part of described negative metal bar is as direct current negative pole end, and described E shape metal substrate is as direct-flow positive pole end.
In technique scheme, further improved plan is as follows:
1., in such scheme, the thickness of described epoxy packages body is less than 2mm.
2., in such scheme, the end face that first, second metal substrate described is positioned at epoxy packages body edge is respectively arranged with at least 2 the first pin male part.
3., in such scheme, the end face that described E shape metal substrate is positioned at epoxy packages body edge is provided with 4 the second pin male part.
Because technique scheme is used, the utility model compared with prior art has following advantages and effect:
1. the utility model heat radiating fin structure surface mount rectifier bridge device, its relatively existing minimize bridge heap product is double-faced packaging, the utility model one side encapsulation in a thickness direction, this product thickness is thin, more than 5mm is had by thickness to be adjusted within 2mm, not only as fin but also simultaneously as first of electric terminal, second metal substrate and E shape metal substrate, be connected with chip above, PCB when using with client is below connected, chip is heat generating components, the heat dissipation path of chip and PCB is the shortest, fin is metal material, conductive coefficient is superior, take full advantage of the heat-sinking capability of pcb board self, avoid being dispelled the heat by the cross-ventilation in cabinet of existing product, chip heating just can will be transmitted in outside air by epoxy, the defects such as epoxy capacity of heat transmission difference.
2. the utility model heat radiating fin structure surface mount rectifier bridge device, its this product is surface mount product, be applicable to more advanced Reflow Soldering mode weld, this product uses the internal structure of original creation, four braces stride across a lead-in wire bridge joint and realize bridge joint, this layout makes 4 chips spacing farthest, four heating minimum designs of mutual cumulative effect and brand-new pad configuration design, first, second metal substrate and E shape metal substrate adopt the design of E type, fin area and the wide area ratio of the long x of product reach 50%, make use of PCB heat-sinking capability to greatest extent.
Accompanying drawing explanation
Accompanying drawing 1 is existing axialmode product structure schematic diagram;
Accompanying drawing 2 is existing in-line arrangement bridge pile structure schematic diagram;
Accompanying drawing 3 is the utility model heat radiating fin structure surface mount rectifier bridge device structural representation;
What accompanying drawing 4 was accompanying drawing 3 looks up and postrotational structural representation;
Accompanying drawing 5 is the A-A cross-sectional view of accompanying drawing 3;
Accompanying drawing 6 is the B-B cross-sectional view of accompanying drawing 3.
In above accompanying drawing: 1, epoxy packages body; 2, the first diode chip for backlight unit; 3, the second diode chip for backlight unit; 4, the 3rd diode chip for backlight unit; 5, the 4th diode chip for backlight unit; 6, negative metal bar; 7, the first metal substrate; 8, the second metal substrate; 9, E shape metal substrate; 10, the first brace; 11, the second brace; 111, lug boss; 12, the 3rd brace; 13, the 4th brace; 14, bending part; 15, the first pin male part; 16, the second pin male part.
Embodiment
Below in conjunction with drawings and Examples, the utility model is further described:
Embodiment: a kind of heat radiating fin structure surface mount rectifier bridge device, comprise: first, second, third, fourth diode chip for backlight unit 2,3,4,5 and the negative metal bar 6 coated by epoxy packages body 1, be positioned at left and right side and be fixed with first, second metal substrate 7,8 and E shape metal substrate 9 respectively bottom described epoxy packages body 1, described negative metal bar 6 is between first, second metal substrate 7,8 and E shape metal substrate 9;
The positive terminal of the first diode chip for backlight unit 2 is electrically connected with the first metal substrate 7 upper surface, the negative pole end of the second diode chip for backlight unit 3 is electrically connected with E shape metal substrate 9 one end upper surface, the negative pole end of the 3rd diode chip for backlight unit 4 is electrically connected with E shape metal substrate 9 other end upper surface, and the positive terminal of the 4th diode chip for backlight unit 5 is electrically connected with the second metal substrate 8 upper surface;
First brace 10 two ends are electrically connected with the negative pole end of the first diode chip for backlight unit 2 and the upper surface of negative metal bar 6 respectively, second brace 11 two ends are electrically connected with the positive terminal of the second diode chip for backlight unit 3 and the upper surface of the first metal substrate 7 respectively, have lug boss 111 and this lug boss 111 and negative metal bar 6 are isolated by epoxy packages body 1 in the middle part of the second brace 11;
3rd brace 12 two ends are electrically connected with the upper surface of the negative pole end of the 4th diode chip for backlight unit 5 and negative metal articles 6 respectively, and the 4th brace 13 two ends are electrically connected with the positive terminal of the 3rd diode chip for backlight unit 4 and the upper surface of the second metal substrate 8 respectively;
Described first, second, third, fourth brace 10,11,12,13 be arranged in parallel along the longitudinal direction, the front end of described negative metal bar 6 between the first metal substrate 7 and E shape metal substrate 9 has a bending part 14, is positioned at same level and all exposes described epoxy packages body 1 bottom this bending part 14 with first, second metal substrate 7,8 and the respective bottom of E shape metal substrate 9;
First, second metal substrate 7,8 is as ac input end, and the bending part 14 of described negative metal bar 6 is as direct current negative pole end, and described E shape metal substrate 9 is as direct-flow positive pole end.
The thickness of above-mentioned epoxy packages body 1 is less than 2mm.
The end face that first, second metal substrate 7,8 above-mentioned is positioned at epoxy packages body 1 edge is respectively arranged with at least 2 the first pin male part 15.
The end face that above-mentioned E shape metal substrate 9 is positioned at epoxy packages body 1 edge is provided with 4 the second pin male part 16.
When adopting above-mentioned heat radiating fin structure surface mount rectifier bridge device, its relatively existing minimize bridge heap product is double-faced packaging, the utility model one side encapsulation in a thickness direction, this product thickness is thin, more than 5mm is had by thickness to be adjusted within 2mm, not only as fin but also simultaneously as first of electric terminal, second metal substrate and E shape metal substrate, be connected with chip above, PCB when using with client is below connected, chip is heat generating components, the heat dissipation path of chip and PCB is the shortest, fin is metal material, conductive coefficient is superior, take full advantage of the heat-sinking capability of pcb board self, avoid being dispelled the heat by the cross-ventilation in cabinet of existing product, chip heating just can will be transmitted in outside air by epoxy, the defects such as epoxy capacity of heat transmission difference, secondly, its this product is surface mount product, be applicable to more advanced Reflow Soldering mode weld, this product uses the internal structure of original creation, and four braces stride across a lead-in wire bridge joint and realize bridge joint, and this layout makes 4 chips spacing farthest, four heating minimum designs of mutual cumulative effect and brand-new pad configuration design, first, second metal substrate and E shape metal substrate adopt the design of E type, and fin area and the wide area ratio of the long x of product reach 50%, make use of PCB heat-sinking capability to greatest extent.
Above-described embodiment, only for technical conceive of the present utility model and feature are described, its object is to person skilled in the art can be understood content of the present utility model and implement according to this, can not limit protection range of the present utility model with this.All equivalences done according to the utility model Spirit Essence change or modify, and all should be encompassed within protection range of the present utility model.
Claims (4)
1. a heat radiating fin structure surface mount rectifier bridge device, it is characterized in that: comprising: first, second, third, fourth diode chip for backlight unit (2,3,4,5) coated by epoxy packages body (1) and negative metal bar (6), described epoxy packages body (1) bottom and be positioned at left and right side and be fixed with first, second metal substrate (7,8) and E shape metal substrate (9) respectively, described negative metal bar (6) is positioned between first, second metal substrate (7,8) and E shape metal substrate (9);
The positive terminal of the first diode chip for backlight unit (2) is electrically connected with the first metal substrate (7) upper surface, the negative pole end of the second diode chip for backlight unit (3) is electrically connected with E shape metal substrate (9) one end upper surface, the negative pole end of the 3rd diode chip for backlight unit (4) is electrically connected with E shape metal substrate (9) other end upper surface, and the positive terminal of the 4th diode chip for backlight unit (5) is electrically connected with the second metal substrate (8) upper surface;
First brace (10) two ends are electrically connected with the negative pole end of the first diode chip for backlight unit (2) and the upper surface of negative metal bar (6) respectively, second brace (11) two ends are electrically connected with the positive terminal of the second diode chip for backlight unit (3) and the upper surface of the first metal substrate (7) respectively, and the second brace (11) middle part has lug boss (111) and this lug boss (111) and negative metal bar (6) are isolated by epoxy packages body (1);
3rd brace (12) two ends are electrically connected with the negative pole end of the 4th diode chip for backlight unit (5) and the upper surface of negative metal article (6) respectively, and the 4th brace (13) two ends are electrically connected with the positive terminal of the 3rd diode chip for backlight unit (4) and the upper surface of the second metal substrate (8) respectively;
Described first, second, third, fourth brace (10,11,12,13) be arranged in parallel along the longitudinal direction, described negative metal bar (6) front end be positioned between the first metal substrate (7) and E shape metal substrate (9) has a bending part (14), and this bending part (14) bottom is positioned at same level with first, second metal substrate (7,8) and the respective bottom of E shape metal substrate (9) and all exposes described epoxy packages body (1);
First, second metal substrate (7,8) is as ac input end, and the bending part (14) of described negative metal bar (6) is as direct current negative pole end, and described E shape metal substrate (9) is as direct-flow positive pole end.
2. heat radiating fin structure surface mount rectifier bridge device according to claim 1, is characterized in that: the thickness of described epoxy packages body (1) is less than 2mm.
3. heat radiating fin structure surface mount rectifier bridge device according to claim 1, is characterized in that: the end face that first, second metal substrate described (7,8) is positioned at epoxy packages body (1) edge is respectively arranged with at least 2 the first pin male part (15).
4. heat radiating fin structure surface mount rectifier bridge device according to claim 1, is characterized in that: the end face that described E shape metal substrate (9) is positioned at epoxy packages body (1) edge is provided with 4 the second pin male part (16).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520775218.4U CN204966478U (en) | 2015-10-08 | 2015-10-08 | Cooling fin structure surface mounting rectifier bridge device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520775218.4U CN204966478U (en) | 2015-10-08 | 2015-10-08 | Cooling fin structure surface mounting rectifier bridge device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204966478U true CN204966478U (en) | 2016-01-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520775218.4U Withdrawn - After Issue CN204966478U (en) | 2015-10-08 | 2015-10-08 | Cooling fin structure surface mounting rectifier bridge device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204966478U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105185757A (en) * | 2015-10-08 | 2015-12-23 | 苏州固锝电子股份有限公司 | Radiating fin structure surface-mount rectifier bridge device |
-
2015
- 2015-10-08 CN CN201520775218.4U patent/CN204966478U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105185757A (en) * | 2015-10-08 | 2015-12-23 | 苏州固锝电子股份有限公司 | Radiating fin structure surface-mount rectifier bridge device |
| CN105185757B (en) * | 2015-10-08 | 2018-06-29 | 苏州固锝电子股份有限公司 | Heat radiating fin structure surface mount rectifier bridge device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20160113 Effective date of abandoning: 20180629 |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20160113 Effective date of abandoning: 20180629 |
|
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |