CN201527972U - Thin-type power module - Google Patents
Thin-type power module Download PDFInfo
- Publication number
- CN201527972U CN201527972U CN 200920045634 CN200920045634U CN201527972U CN 201527972 U CN201527972 U CN 201527972U CN 200920045634 CN200920045634 CN 200920045634 CN 200920045634 U CN200920045634 U CN 200920045634U CN 201527972 U CN201527972 U CN 201527972U
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- China
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- formwork
- power
- supply terminal
- power supply
- power model
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A thin-type power module comprises a top cap and a base. The base comprises a baseboard and a module shell installed on the periphery of the baseboard, wherein the module shell is adhered to the baseboard, the bottom layer of the baseboard is a ceramic substrate, the upper surface of the ceramic substrate is provided with a metal layer, the metal layer and the ceramic substrate are directly combined to form a DBC substrate, and chips are distributed on the DBC substrate and welded on the DBC substrate. The front side surface and the back side surface of the module shell extend upwards, the left side and the right side of the module shell respectively extend outwards and upwards, the left end and the right end of the module shell are respectively provided with an installing hole, a metal ring of the installing hole and the module shell are integrated into a whole; the module shell is also provided with a power terminal slot, a power terminal is inserted into the power terminal slot and integrally injection-molded with the module shell; the top cap is provided with a socket with a nut, at a position corresponding to the power terminal slot, and the top cap is fixedly connected with the base. The thin-type power module eliminates welding fatigue and greatly increases reliability to temperature circulation.
Description
Technical field
The utility model relates to a kind of power model device, more specifically to a kind of thin type power module with industrial standard installation and bus linkage function.
Background technology
Power IGBT (insulated gate bipolar transistor) and MOSFET (mos field effect transistor) module are widely used in the various Electric Machine Control frequency converters, and for energy-conservation, systematic function and reliability, these modules are crucial electronic components.These power components also are used for Switching Power Supply, UPS, medical system, grid-connected power generation system (solar energy, wind energy, fuel cell etc.), transportation system's (bullet train, subway), commercial aircraft and national defense system.Power IGBT and MOSFET module forward high power density, high reliability and low-cost direction develop.
Power model is generally according to module width name, " 34mm " IGBT module for example, and the base width is 34mm, installing hole is apart from being 80mm.According to design, this kind of power model can provide 50A electric current to 200A, charged single IGBT or the MOSFET of disposing, half-bridge IGBT or MOSFET, and IGBT band upper arm or underarm fast recovery diode (chopper).Based on its power output capacity, this module is highly suitable for mid power output system (hundred multikilowatts), and has a wide range of applications in a lot of inversion systems.So this module has become a kind of industrial standard module, a plurality of power model company is just at production and selling.
1. adopt the copper soleplate of high heat conduction, make module have lower thermal resistance.
2. base plate carries double mounting port, makes module be easy to be installed on the radiator.
3. power supply terminal adopts screw/nut crimping, makes module can export bigger electric current, the fatigue cracking of having avoided soldering to bring simultaneously.
In some new application, as composite power and electrically driven vehicle, environmental requirement for power and temperature cycles and specification is very high, existing power model adopts weld layer (weld layer b among the figure) to connect DBC layer and base plate, solder joint fatigue appears in pad easily, and temperature cycles and power cycle capacity are reduced greatly.Because it is big to be welded to connect area between DBC and base plate, and the thermal coefficient of expansion (CTE) of copper soleplate and DBC layer differs greatly, during variations in temperature, this is welded to connect and bears very big stress, solder joint fatigue causes weld cracking, causes the power model thermal resistance constantly to increase, and causes the module premature failure by thermal runaway.On the other hand, the power supply terminal of this kind of module is to be welded direct on the DBC substrate.Because the difference of CTE between copper tip and the DBC substrate, in the use of module, variation of temperature will cause these pads and produce bigger thermal stress, thereby cause the thermal fatigue cracking of solder joint, and then make the module premature failure.Though can slow down stress design (S type bottom) at the copper tip bottom, its effect is limited, and the stray inductance of unfavorable reduction module.So in order to adapt to the needs in market better, existing this kind of reliability of Power Modules awaits further raising.
Summary of the invention
The purpose of this utility model overcomes the defective of prior art, provides a kind of cost low and reliability is high, and electric current output surpasses the power model of 200A.
The technical scheme that realizes the utility model purpose is: a kind of slim high-current power module, comprise top cover and base, and described base comprises base plate and at base plate periphery formwork; The bottom of base plate is a ceramic substrate, and top (towards the inside modules) of ceramic substrate is provided with metal level, and metal level and ceramic substrate directly in conjunction with forming DBC substrate (metal substrate), are distributed with chip on the DBC substrate, and chips welding is on the DBC substrate; The two sides, front and back of described formwork extend upward, and outwards and is upwards extending on the both direction respectively the left and right sides; The DBC substrate is furnished with chip one side and formwork is sealing adhesive; The two ends, the left and right sides of formwork are respectively equipped with installing hole, and the becket of installing hole and module formwork are one-body molded, but limiting module is in the displacement of spreader surface vertical direction when module is installed, and excessive moment of torsion is to the infringement of ceramic substrate in the time of can effectively preventing to install.Also be provided with the power supply terminal slot on the described die housing, power supply terminal inserts the power supply terminal slot, and with the housing integrated injection molding.The power supply terminal bottom is the required metal flat of bonding, and realizes that with the metal level on chip and the ceramic substrate circuit is connected by bonding wire; Bonding wire is generally the high-purity aluminum steel, and can design the quantity of bonding wire by the size of module output current; Because the highly-malleable of bonding wire can be eliminated the thermal stress between above-mentioned power supply terminal and the DBC substrate basically, thereby the reliability of modular power source terminal under the temperature cycles condition is significantly improved; Be provided with the socket of band nut on the described top cover with the corresponding position of described power supply terminal slot; Described top cover is fixedlyed connected with base.
Described power supply terminal slot and power supply terminal are generally 3, are located at the same side of formwork or three sides, and mounting distance equates each other, can directly replace existing power model.
Described DBC substrate back is used for installing and heat radiation, also can be provided with metal level.Described metal level generally adopts the copper layer.For guaranteeing the radiating effect of DBC substrate back, the DBC substrate is installed its substrate back of back can exceed certain distance than housing installing hole ground.This distance is controlled between the 0.05mm to 0.2mm usually.
As further improvement of the utility model; between the installing hole at the two ends, bottom of described formwork, be provided with stress hole or stress groove; has the function that reduces peak stress; can guarantee at power model when being heated and mechanical impact takes place; housing produces certain deformation; the peak stress that restriction DBC substrate is suffered, protection DBC substrate is intact.
The utility model has been cancelled the copper soleplate in the existing power model and base plate has been connected to weld layer on the DBC substrate, and this has eliminated solder joint fatigue, and has improved the reliability for temperature cycles greatly.Owing to cancelled copper soleplate, and designed new housing, the height of power model is reduced, become thin type power module.
Description of drawings
Fig. 1 is the structural representation of the utility model background technology
Fig. 2 is a base arrangement schematic diagram in the utility model background technology
Fig. 3 is a base plate cross-sectional view in the utility model background technology
Fig. 4 is a plastic casing structural representation in the utility model background technology
Fig. 5 is the thin type power module structural representation of the utility model embodiment
Fig. 6 is the thin type power module contour structures schematic diagram of the utility model embodiment
Fig. 7 is a base back surface structural representation among the utility model embodiment
Fig. 8 is a base plate cross-sectional view among the utility model embodiment
Fig. 9 is a base plate cross-sectional view among the another kind of embodiment of the utility model
Embodiment
Be described further below in conjunction with embodiment.
As shown in Figure 5, a kind of thin type power module 100 comprises top cover 2 and base 1, and base 1 comprises base plate 3 and at the formwork 9 of base plate periphery, formwork 9 is bonding with base plate 3, is distributed with chip 4 on DBC substrate 3, and chip 4 is welded on the DBC substrate 15.The two sides, front and back of formwork 4 extend upward, be provided with 3 power supply terminal slots 5 in front side edge, adjacent two power supply terminal slots, 5 equidistant settings are respectively equipped with power supply terminal 6 in the power supply terminal slot 5, power supply terminal 6 forms circuit by bonding wire at bonding surface 7 with DBC substrate 15 and is connected.Be provided with band nut socket 8 with the corresponding position of described power supply terminal slot on the top cover 2.
Outwards and is upwards extending on the both direction respectively formwork 4 left and right sides, and the two ends, the left and right sides of formwork 4 are respectively equipped with installing hole 10, and an end also is provided with signal terminal 11 therein.Signal terminal 11 and formwork 4 integrated injection moldings, and be connected by bonding wire with DBC substrate 15.
Top cover 2 usefulness lock screw are fixedlyed connected with base 1, thin type power module 100 contour structures after the installation as shown in Figure 6, best length is of a size of 94mmx34mmx17mm, the 30mm of its aspect ratio existing power supply module reduces 40%, so under the same current rated value, power density of the present utility model is higher.
As shown in Figure 7, also be respectively equipped with stress hole 12, one ends at the two ends, the left and right sides of formwork 9 and make trapezoidal shape, to reduce the stressed of DBC substrate 15.
As shown in Figure 8, the bottom of base plate 3 is a ceramic substrate 13, and the material of ceramic substrate 13 is Al
2O
3, AlN or Si
3N
4, being provided with copper layer 14 above the ceramic substrate 13, directly in conjunction with forming DBC substrate (copper substrate) 15, DBC substrate 15 back sides are used for installing and heat radiation for copper layer 14 and ceramic substrate 13.
As shown in Figure 9, Fig. 9 is the another kind of embodiment of base plate 3, and ceramic substrate 13 back sides also are provided with copper layer 17, ceramic substrate 13 and its up and down copper layer 14 and copper layer down 17 directly in conjunction with formation DBC substrates (copper substrate) 15.The base plate that promptly is provided with chip 4 positions is provided with chip 4, weld layer 16, copper layer 14, ceramic substrate 13 and copper layer 17 from top to bottom successively.
Claims (8)
1. thin type power module, comprise top cover and base, it is characterized in that, described base comprises base plate and at the formwork of base plate periphery, formwork and base plate are bonding, and the bottom of base plate is a ceramic substrate, be provided with metal level above the ceramic substrate, metal level and ceramic substrate directly in conjunction with forming the DBC substrate, are distributed with chip on the DBC substrate, chips welding is on the DBC substrate; The two sides, front and back of described formwork extend upward, outwards and is upwards extending on the both direction respectively the left and right sides, the two ends, the left and right sides of formwork are respectively equipped with installing hole, the becket and the formwork of installing hole are one-body molded, also be provided with the power supply terminal slot on the described formwork, power supply terminal inserts the power supply terminal slot, and with the formwork integrated injection molding; Be provided with the socket of band nut on the described top cover with the corresponding position of described power supply terminal slot; Described top cover is fixedlyed connected with base.
2. power model according to claim 1 is characterized in that, described power supply terminal slot is 3, is located at formwork one side, and mounting distance equates each other.
3. power model according to claim 1 is characterized in that, is provided with stress hole or stress groove at the two ends of described formwork.
4. power model according to claim 1 is characterized in that, described DBC substrate back is provided with metal level.
5. power model according to claim 1 is characterized in that, described metal level is the copper layer.
6. power model according to claim 1 is characterized in that, the end about described formwork in the end is provided with signal terminal.
7. power model according to claim 1 is characterized in that, an end of described power model is trapezoidal.
8. power model according to claim 1 is characterized in that, the length of described power model is of a size of 94mm x 34mm x 17mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200920045634 CN201527972U (en) | 2009-05-22 | 2009-05-22 | Thin-type power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200920045634 CN201527972U (en) | 2009-05-22 | 2009-05-22 | Thin-type power module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201527972U true CN201527972U (en) | 2010-07-14 |
Family
ID=42519254
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200920045634 Expired - Lifetime CN201527972U (en) | 2009-05-22 | 2009-05-22 | Thin-type power module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201527972U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106340500A (en) * | 2016-09-20 | 2017-01-18 | 东南大学 | Power module with different section diameter welding line |
| CN106340501A (en) * | 2016-09-20 | 2017-01-18 | 东南大学 | High heat reliability power module |
-
2009
- 2009-05-22 CN CN 200920045634 patent/CN201527972U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106340500A (en) * | 2016-09-20 | 2017-01-18 | 东南大学 | Power module with different section diameter welding line |
| CN106340501A (en) * | 2016-09-20 | 2017-01-18 | 东南大学 | High heat reliability power module |
| CN106340501B (en) * | 2016-09-20 | 2018-10-23 | 东南大学 | A kind of high thermal reliability power module |
| CN106340500B (en) * | 2016-09-20 | 2018-10-23 | 东南大学 | A kind of power module with different cross section diameter bonding wire |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20100714 |