JP2019071446A - Shingled solar cell module - Google Patents

Abstract

To provide a high efficiency arrangement for a solar cell module, and a method of making such a solar cell module.SOLUTION: A solar cell module includes solar cells 10 that are conductively bonded to each other in a shingled manner to form a super cell 100. A solar photovoltaic system may include two or more such high-voltage solar cell modules which are electrically connected in parallel to each other and to an inverter. A solar cell cleaving tool and a solar cell cleaving method apply a vacuum between a curved support surface and a bottom surface of a solar cell wafer to flex the solar cell wafer against the curved support surface and thereby cleave the solar cell wafer along one or more previously prepared scribe lines to provide a plurality of solar cells. These cleaving tool and cleaving method have such advantages that there is no need to require a physical contact with the top face of the solar cell wafer. Solar cells with reduced carrier recombination losses at edges of the solar cell can be manufactured, for example, without cleaved edges that promote carrier recombination.SELECTED DRAWING: Figure 1

Description

[Cross-reference to related applications]
This international patent application is described in U.S. Patent Application No. 14 / 530,405 (title of the invention "Shingled Solar Cell Module", filed October 31, 2014), U.S. Patent Application No. 14 / 532,293 (filed on October 31, 2014). The title of the invention is "Shingled Solar Cell Module", the filing date is November 4, 2014), U.S. Patent Application No. 14 / 536,486 (the title of the invention is "Shingled Solar Cell Module", the filing date is 2014 14 No. 14 / 539,546 (title of the invention "Shingled Solar Cell Module", filing date November 12, 2014), U.S. patent application no. 14 / 543,580 (invention) The name of the "Shingled Solar Cell Module No. 14 / 548,081 (title of the invention is "Singled Solar Cell Module", filing date November 19, 2014), U.S. Patent Application No. 14 / 548,081. No. 14 / 552,761 (the title of the invention is "Shingled Solar Cell Module", the title of the invention is the title of the invention "Shingled Solar Cell Module", No. 14 / 560,577 filed on Nov. 25, 2014, entitled "Shingled Solar Cell Module", filed Dec. 4, 2014, and U.S. Pat. No. 566, 278 (title of the invention "Shinled Solar Cell Module, filed on Dec. 10, 2014), U.S. Patent Application No. 14 / 565,820 (titled as "Shinled Solar Cell Module", filed on Dec. 10, 2014), U.S. Patent Application No. 14 / 572,206 (title of the invention "Shingled Solar Cell Module", filing date: December 16, 2014), U.S. Patent Application No. 14 / 577,593 (title of the invention "Shingled Solar Cell Module" Module, filed on December 19, 2014), U.S. Patent Application No. 14 / 586,025 (title of the invention is "Singled Solar Cell Module", filed on December 30, 2014), U.S. Patent Application No. 14/585, 917 (the title of the invention is “Sh filing date: December 30, 2014), U.S. Patent Application No. 14 / 594,439 (title of the invention "Shingled Solar Cell Module", filing date: January 12, 2015), U.S. Patent Application No. 14 / 605,695 (title of the invention "Shingled Solar Cell Module", filing date January 26, 2015), U.S. Provisional Patent Application No. 62 / 003,223 (name of the invention " Shingled Solar Cell Module, filed May 27, 2014), US Provisional Patent Application No. 62 / 036,215 (titled as "Shinled Solar Cell Module", filed August 12, 2014) U.S. Provisional Patent Application No. 62 / 042,615 (The title of the invention is "Shingled Solar Cell Module", filed on August 27, 2014), US Provisional Patent Application No. 62 / 048,858 (the title of the invention is "Shingled Solar Cell Module", the filing date is 2014 U.S. Provisional Patent Application No. 62 / 064,260 (titled as "Singled Solar Cell Module", filed on October 15, 2014), U.S. Provisional Patent Application No. 62/064, No. 834 (titled as "Singled Solar Cell Module", filed October 16, 2014), U.S. Patent Application No. 14 / 674,983 (titled as "Singled Solar Cell Panel Employing Hidden Taps"), application U.S. Provisional Patent Application No. 62 / 081,200, entitled "Solar Cell Panel Employing Hidden Taps", filed on Nov. 18, 2014, U.S. Provisional Patent Application No. 62 / 081,200; No. 62 / 113,250 (title of the invention "Shingled Solar Cell Panel Employing Hidden Taps", filing date: February 6, 2015), U.S. Provisional Patent Application No. 62 / 082,904 (title of the invention "High "Voltage Solar Panel", filed on Nov. 21, 2014), US Provisional Patent Application No. 62 / 103,816 (title of the invention is "High Voltage Solar Panel", filed on Jan. 15, 2015), US Provisional Patent Application No. 62 / 111,75 No. (title of the invention "High Voltage Solar Panel", filed on February 4, 2015), US Provisional Patent Application No. 62 / 134,176 (title of the invention "Solar Cell Cleaving Tools and Methods", application) U.S. Provisional Patent Application No. 62 / 150,426, entitled "Shingled Solar Cell Panel Composing Stencil-Printed Cell Metallization", filed on April 21, 2015, US Provisional Patent Application No. 62 / 035,624 (The title of the invention is "Solar Cells with Reduced Edge Carrier Recombination", filed on August 11, 2014, US) Takumi application 29/506, 415 (filing date: October 15, 2014), US design application 29/506, 755 (filing date: October 20, 2014), US design application 29/508 , No. 323 (filing date: November 5, 2014), U.S. Design Application No. 29 / 509,586 (filing date: November 19, 2014), and U.S. Design Application no. Sun claims the priority of November 19, 2014). Each of the patent applications in the above list is incorporated herein by reference in its entirety for all purposes.

  The present invention generally relates to a solar cell module in which the solar cells are arranged in a ground state.

  Alternative energy sources are needed to meet the ever increasing global energy demand. Solar energy sources are sufficient to meet such needs, in many geographical areas, in part by the provision of electrical power generated by solar (eg, light) cells.

  Disclosed herein is a highly efficient arrangement of solar cells within a solar cell module, and a method of making such a solar module.

  In one aspect, the solar module comprises a series connected string of N (≧ 25) rectangular or nearly rectangular solar cells having on average a breakdown voltage greater than about 10 volts. The plurality of solar cells are grouped into one or more supercells, in which the long sides of adjacent solar cells overlap and are conductively joined to each other by an electrical and thermally conductive adhesive. With two or more of the solar cells arranged side by side. No single solar cell in the string of solar cells, or a group of less than N solar cells, is individually electrically connected in parallel with the bypass diode. The safe and reliable operation of the solar module is effective to prevent or reduce the formation of hot spots in reverse biased solar cells along the supercell through the joining overlapping portions of adjacent solar cells Heat conduction makes it easy. The supercell can be enclosed within a thermoplastic olefin polymer sandwiched, for example, between a glass front sheet and a back sheet, which further enhances the robustness of the module with respect to thermal damage. In some variations, N ≧ 30, 5050, or 100100.

  In another aspect, the supercell is a rectangular or substantially rectangular shape having a shape defined by oppositely positioned parallel first and second long sides and two oppositely positioned short sides. It includes a plurality of silicon solar cells each having a front (sun side) and a back surface. Each solar cell includes an electrically conductive front metallization pattern including at least one front contact pad positioned adjacent to the first long side, and at least one back side positioned adjacent to the second long side. And an electrically conductive back surface metallization pattern including contact pads. In the plurality of silicon solar cells, the first long side and the second long side of the adjacent silicon solar cells overlap, and the contact pads on the front and rear faces on the adjacent silicon solar cells overlap and conduct The adjacent silicon solar cells are arranged side by side in a state of being electrically connected in series by conductive bonding with each other by the adhesive adhesive. The front metallized pattern of each silicon solar cell substantially transfers the conductive adhesive bond to the at least one front contact pad prior to curing of the conductive adhesive bond during fabrication of the supercell. Includes a barrier configured to contain.

  In another aspect, the supercell is a rectangular or substantially rectangular shape having a shape defined by oppositely positioned parallel first and second long sides and two oppositely positioned short sides. It includes a plurality of silicon solar cells each including a front (sun side) and a back surface. Each solar cell includes an electrically conductive front metallization pattern including at least one front contact pad positioned adjacent to the first long side, and at least one back side positioned adjacent to the second long side. And an electrically conductive back surface metallization pattern including contact pads. In the plurality of silicon solar cells, the first long side and the second long side of the adjacent silicon solar cells overlap, and the contact pads on the front and rear faces on the adjacent silicon solar cells overlap and conduct The adjacent silicon solar cells are arranged side by side in a state of being electrically connected in series by conductive bonding with each other by the adhesive adhesive. The backside metallized pattern of each silicon solar cell may substantially transfer the conductive adhesive bond to the at least one rear contact pad prior to curing of the conductive adhesive during manufacture of the supercell. Includes a barrier configured to contain.

  In another aspect, a method of making a solar cell string comprises combining one or more pseudo-square silicon wafers along a plurality of lines parallel to the long edge of each pseudo-square silicon wafer of one or more pseudo-square silicon wafers. Dicing to form a plurality of rectangular silicon solar cells each having substantially the same length along the major axis. The method also includes the step of arranging the plurality of rectangular silicon solar cells side-by-side in a state in which the long sides of adjacent solar cells overlap and are conductively connected to each other to electrically connect the adjacent solar cells in series. The plurality of rectangular silicon solar cells comprises at least one rectangular solar cell including two beveled corners corresponding to a plurality of corners of the pseudo-square wafer or a portion of the plurality of corners; And one or more rectangular silicon solar cells that each does not have. The spacing between the plurality of parallel lines along which dicing of the pseudo-square wafer is performed does not have a width perpendicular to the long axis of the rectangular silicon solar cell including the chamfered corner, the chamfered corner The chamfers are selected to compensate for the chamfered corners by making them wider than the major axis of the plurality of rectangular silicon solar cells, whereby each of the plurality of rectangular silicon solar cells in the solar cell string is The front surface is substantially the same in area exposed to light in the operation of the solar cell string.

  In another aspect, the supercells are made up of a plurality of silicon solar cells arranged side by side with the ends of adjacent solar cells overlapping and in conductive junction with each other to electrically connect the adjacent solar cells in series. Including. At least one of the plurality of silicon solar cells has a chamfered corner corresponding to a plurality of corners or a portion of a plurality of corners of the pseudo square silicon wafer from which dicing is performed, and At least one does not have beveled corners, and each of the plurality of silicon solar cells has substantially the same area exposed to light during operation of the solar cell string. Have.

In another aspect, a method of making two or more supercells comprises combining one or more pseudo-square silicon wafers along a plurality of lines parallel to the long edge of each pseudo-square silicon wafer. A first plurality of rectangular silicon solar cells including chamfered corners corresponding to a plurality of corners of the one or more pseudo square silicon wafers, or dicing the pseudo square silicon wafer; Forming a second plurality of rectangular silicon solar cells each having a first length extending across the entire width of the one or more pseudo-square silicon wafers and having no chamfered corners . The method removes the beveled corner from each of the first plurality of rectangular silicon solar cells, each having a second length shorter than the first length, and having a beveled corner. Also included is the step of forming a third plurality of rectangular silicon solar cells. The way is
The second plurality of rectangular silicon solar cells are arranged side by side in a state in which the long sides of adjacent rectangular silicon solar cells overlap and are conductively connected to each other to electrically connect the second plurality of rectangular silicon solar cells in series. Forming a solar cell string having a width equal to the first length;
The third plurality of rectangular silicon solar cells are arranged side by side in a state in which the long sides of adjacent rectangular silicon solar cells overlap and are conductively connected to each other to electrically connect the third plurality of rectangular silicon solar cells in series. Forming a solar cell string having a width equal to the second length.

In another aspect,
How to make two or more supercells,
The one or more pseudo square silicon wafers are diced along a plurality of lines parallel to the long edge of each pseudo square silicon wafer among one or more pseudo square silicon wafers, and the one or more pseudo square silicon wafers A first plurality of rectangular silicon solar cells including chamfered corners corresponding to a plurality of corners of the plurality of corners or a plurality of corners, and a second plurality of rectangular silicon solar cells having no chamfered corners Forming the
The first plurality of rectangular silicon solar cells are arranged side by side in a state where the long sides of adjacent rectangular silicon solar cells overlap and are conductively connected to each other to electrically connect the first plurality of rectangular silicon solar cells in series. Process,
The second plurality of rectangular silicon solar cells are arranged side by side in a state in which the long sides of adjacent rectangular silicon solar cells overlap and are conductively connected to each other to electrically connect the second plurality of rectangular silicon solar cells in series. Including processes and

In another aspect, the supercell is
A plurality of silicon solar cells arranged in the first direction in a state in which the ends of adjacent silicon solar cells overlap and conductively bond with each other to electrically connect the adjacent silicon solar cells in series;
Long and narrow flexible electrical interconnections,
A longitudinal axis of the elongated flexible electrical interconnect is oriented parallel to a second direction perpendicular to the first direction;
The elongated flexible electrical interconnect is
Conducting bonding to the front or back surface of the silicon solar cell at one end of the plurality of silicon solar cells at a plurality of discontinuous positions arranged along the second direction;
Extends at least the full width of the end solar cell in the second direction,
The conductor thickness measured in the direction perpendicular to the front or back of the silicon solar cell at the end is less than or equal to about 100 microns,
Provide a resistance less than or equal to about 0.012 ohms to the flow of current in the second direction,
Configured to provide flexibility to accommodate differential expansion in the second direction between the silicon solar cell at the end and the interconnect at a temperature range of about -40.degree. C. to about 85.degree. C. ing.

  The flexible electrical interconnect may, for example, have a conductor thickness measured in a direction perpendicular to the front and back surfaces of the silicon solar cell at the end is less than or equal to about 30 microns in thickness . The flexible electrical interconnect extends beyond the supercell in the second direction and at least to the second supercell positioned parallel to and adjacent to the supercell in the solar module. It can provide interconnections. Additionally or alternatively, the flexible electrical interconnect extends in the first direction beyond the supercell and is positioned parallel to and alongside the supercell in the solar module It can provide electrical interconnection to the supercell.

In another aspect, the solar module includes a plurality of supercells disposed in two or more parallel rows extending across the width of the solar module to form the front surface of the solar module. Each supercell includes a plurality of silicon solar cells arranged side by side, with the ends of adjacent silicon solar cells overlapping and conducting junctions with each other to electrically connect the adjacent silicon solar cells in series. At least the end of the first supercell adjacent to the edge of the solar module in the first row is:
Bonded to the front of the first supercell by means of an electrically conductive adhesive in discrete locations,
Extends parallel to the edge of the solar module,
At least a part of which is broken around the end of the first supercell and is hidden from view from the front of the solar module,
Through flexible electrical interconnections,
Electrically connected to the end of the second supercell adjacent to the same edge of the solar module in the second row.

In another aspect, a method of making a supercell is
Laser scribing one or more scribe lines on each silicon solar cell of one or more silicon solar cells to define a plurality of rectangular regions on the one or more silicon solar cells;
Applying an electrically conductive adhesive to the scribed one or more silicon solar cells at one or more locations adjacent to the long side of each rectangular region;
A plurality of rectangles each including a portion of the electrically conductive adhesive, disposed on the front surface adjacent to the long side, with the one or more silicon solar cells separated along the one or more scribe lines Providing a silicon solar cell;
Arranging the plurality of rectangular silicon solar cells side by side in a state in which the long sides of adjacent rectangular silicon solar cells are partially overlapped with each other in a state in which a part of the electrically conductive adhesive is disposed therebetween;
Curing the electrically conductive bonding agent, thereby bonding adjacent and overlapping rectangular silicon solar cells together and electrically connecting them in series.

In another aspect, a method of making a supercell is
Laser scribing one or more scribe lines on each silicon solar cell of one or more silicon solar cells to define a plurality of rectangular regions on the one or more silicon solar cells;
Applying an electrically conductive adhesive to a portion of the top surface of the one or more silicon solar cells;
A vacuum is drawn between the bottom surface and the curved support surface of the one or more silicon solar cells to move the one or more silicon solar cells toward the curved support surface, thereby bending the one or more silicon solar cells. Cleavage of the one or more silicon solar cells along the scribe line to provide a plurality of rectangular silicon solar cells each including a portion of the electrically conductive adhesive bond disposed on the front surface adjacent to the long side The process to
Arranging the plurality of rectangular silicon solar cells side by side in a state in which the long sides of adjacent rectangular silicon solar cells are partially overlapped with each other in a state in which a part of the electrically conductive adhesive is disposed therebetween;
Curing the electrically conductive bonding agent, thereby bonding adjacent and overlapping rectangular silicon solar cells together and electrically connecting them in series.

In another aspect, a method of making a solar module comprises forming a plurality of rectangular silicon solar cells arranged side by side with a plurality of ends on adjacent long sides of rectangular silicon solar cells overlapping in a scaly manner. Including the steps of assembling a plurality of supercells that each has. The method also cures the conductive binder disposed between the overlapping ends of adjacent rectangular silicon solar cells by heating and pressing the plurality of supercells, thereby adjacent and overlapping. Bonding the rectangular silicon solar cells together and electrically connecting them in series. The way is also
Placing and interconnecting the plurality of supercells in a desired solar module configuration in a layer stack including an encapsulant;
Heating and pressing the layer stack to form a laminated structure.

  Some variations of the method include heating and pressing the layer stack to heat and press the plurality of supercells prior to the step of forming the laminated structure. And curing or partially curing, thereby forming a cured or partially cured supercell as an intermediate product prior to formation of the laminated structure. In some variations, as each additional rectangular silicon solar cell is added to the supercell during assembly of the supercell, the newly added solar cell and its adjacent overlapping solar cell are added The electrically conductive adhesive binder between the cells is cured or partially cured before any other rectangular silicon solar cells are added to the supercell. Alternatively, some variations include curing or partially curing all of the above described conductive binders in the supercell in the same step.

  If the supercell is formed as a partially cured intermediate product, the method comprises completing the curing of the electrically conductive binder while heating and pressing the layer stack to form the laminated structure. May be included.

  Some variations of the method may include, prior to formation of the laminated structure, the electrically conductive bond while heating and pressing the layer stack without forming a hardened or partially hardened supercell as an intermediate product. Curing the agent to form a laminated structure.

  The method may include dicing one or more standard sized silicon solar cells into smaller rectangles to provide the plurality of rectangular silicon solar cells. The electrically conductive adhesive is applied to the one or more silicon solar cells prior to the step of dicing the one or more silicon solar cells and has a previously applied electrically conductive adhesive. Multiple rectangular silicon solar cells can be provided. Alternatively, the electrically conductive adhesive binder may be applied to the rectangular silicon solar cell after dicing the one or more silicon solar cells to provide the rectangular silicon solar cell.

In one aspect, the solar module includes a plurality of supercells arranged in two or more parallel rows. A plurality of rectangular or substantially rectangular silicons arranged side by side in a state in which the adjacent silicon solar cells are electrically connected in series, with each supercell having the long sides of adjacent silicon solar cells overlapping and in direct conductive junction with each other Includes solar cells. Solar panels are also
A first hidden tap contact pad located on the back surface of the first solar cell located at an intermediate position along the first supercell among the plurality of supercells;
A first electrical interconnect conductively coupled to the first hidden tap contact pad. The first electrical interconnect includes stress relief features that accommodate differential thermal expansion between the interconnect and the silicon solar cell to which it is bonded. The term "stress relaxation features" as used herein with respect to interconnects includes, for example, geometric features such as kinks, loops, or slots, the thickness (eg, very thin) of the interconnect, and And / or may refer to the ductility of the interconnect. For example, the stress relief feature may be that the interconnect is formed of a very thin copper ribbon.

Solar modules are
A second hidden tap contact pad located on a back surface of a second solar cell positioned adjacent to the first solar cell at an intermediate position along the second supercell among the plurality of supercells in the adjacent supercell row; May be included
The first hidden tap contact pad may be electrically connected to the second hidden tap contact pad through the first electrical interconnect. In such a case, the first electrical interconnect may extend across the gap between the first supercell and the second supercell and be conductively bonded to the second hidden tap contact pad. Alternatively, the electrical connection between the first hidden tap contact pad and the second hidden tap contact pad is conductively coupled to the second hidden tap contact pad and electrically connected to the first electrical interconnect (eg, conductive junction) Other electrical interconnections may be included. Any interconnection scheme may optionally extend across additional supercell rows. For example, any interconnection scheme may optionally extend across the full width of the module to interconnect the solar cells of each row through hidden tap contact pads.

Solar modules are
A second hidden tap contact pad located on the back surface of the second solar cell located at another intermediate position along the first supercell among the plurality of supercells;
A second electrical interconnect conductively bonded to the second hidden tap contact pad;
A bypass diode electrically connected by the first electrical interconnection and the second electrical interconnection in parallel with the solar cell positioned between the first hidden tap contact pad and the second hidden tap contact pad; May be included.

In any of the above variations, the first hidden tap contact pad may be a plurality of hidden tap contacts disposed on the back surface of the first solar cell in a row extending parallel to the long axis of the first solar cell. Can be one of the pads,
The first electrical interconnect is conductively bonded to each of the plurality of hidden contacts and extends substantially over the length of the first solar cell along the major axis. Additionally or alternatively, the first hidden contact pad is one of a plurality of hidden tap contact pads disposed on the back surface of the first solar cell in a row extending perpendicularly to the long axis of the first solar cell. obtain. In the latter case, a row of hidden tap contact pads may be located, for example, adjacent to the short edge of the first solar cell. The first hidden contact pad may be one of a plurality of hidden tap contact pads arranged in a two-dimensional array on the back surface of the first solar cell.

Alternatively, in any of the above variations, the first hidden tap contact pad may be located adjacent to the short side of the back surface of the first solar cell,
The first electrical interconnect does not extend substantially inward from the hidden tap contact pad along the long axis of the solar cell;
The above interconnect wherein the back side metallization pattern on the first solar cell preferably has a sheet resistance less than or equal to about 5 ohms / square, or less than or equal to about 2.5 ohms / square Provide a conduction path to In such case, the first interconnect may include, for example, two tabs positioned on opposite sides of the stress relief feature,
One of the two tabs may be conductively bonded to the first hidden tap contact pad. The two tabs may be of different lengths.

  In any of the above variations, the first electrical interconnect identifies a desired alignment with the first hidden tap contact pad, or is desired with the edge of the first supercell. Alignment features, or alignment features identifying the desired alignment with the first hidden tap contact pad and the desired alignment with the edge of the first supercell.

  In another aspect, the solar module comprises a plurality of supercells arranged in two or more parallel rows between a glass front sheet, a back sheet, the glass front sheet and the back sheet. And. A plurality of rectangles or approximately arranged in parallel in a state in which the adjacent silicon solar cells are electrically connected in series, with each supercell having the long sides of the adjacent silicon solar cells overlapping and flexibly conducting junctions with each other in a flexible manner It has a rectangular silicon solar cell. A first flexible electrical interconnect is conductively bonded to a first one of the plurality of supercells. The plurality of flexible conductive junctions between overlapping solar cells may be arranged in parallel to the plurality of rows in a temperature range of about -40.degree. C. to about 100.degree. C. without damaging the solar modules. Provide mechanical compliance to the plurality of supercells that accommodates thermal expansion mismatches between the two and the glass front sheet. The strong conductive junction between the first supercell and the first flexible electrical interconnect provides a first flexible electrical interconnection at a temperature range of about -40.degree. C. to about 180.degree. C. without damaging the solar module. The connection is adapted to the thermal expansion mismatch between the first supercell and the first flexible electrical interconnect in a direction perpendicular to the plurality of rows.

  The plurality of conductive junctions between overlapping adjacent solar cells in a supercell may utilize a different conductive adhesive than the plurality of conductive junctions between the supercell and the flexible electrical interconnect. The conductive bond of one side of at least one solar cell in the supercell may utilize a conductive adhesive different from the conductive bond of the other side. For example, the conductive adhesive that forms a strong bond between the supercell and the flexible electrical interconnect can be a solder. In some variations, the plurality of conductive junctions between overlapping solar cells in the supercell are formed of a non-solder conductive adhesive, and the conductive junction between the supercell and the flexible electrical interconnect is soldered It is formed by

  In some variations that utilize two different conductive adhesives as just described, both conductive adhesives may be in the same process step (eg, at the same temperature, at the same pressure, and / or for the same time) Can be cured).

  The plurality of conductive junctions between overlapping and adjacent solar cells may, for example, accommodate differential motion greater than or equal to about 15 microns between each cell and the glass front sheet.

  The plurality of conductive junctions between overlapping and adjacent solar cells may, for example, have a thickness perpendicular to the adjacent solar cells less than or equal to about 50 microns, The thermal conductivity in the direction perpendicular to the cell may be greater than or equal to about 1.5 W / (meter-K).

  The first flexible electrical interconnect may, for example, withstand thermal expansion or contraction of the first flexible interconnect greater than or equal to about 40 microns.

  The portion of the first flexible electrical interconnect, which is conductively bonded to the supercell, is in the form of a ribbon formed of copper, for example, having a thickness in the direction perpendicular to the surface of the solar cell to be bonded. It may be less than or equal to 30 microns, or less than or equal to about 50 microns. The first flexible electrical interconnect has an integral conductive copper portion which is conductively bonded to the solar cell and provides higher conductivity than the portion of the first flexible electrical interconnect, which is not bonded to the solar cell It can. The first flexible electrical interconnect has a thickness in a direction perpendicular to the surface of the solar cell to which it is bonded is less than or equal to about 30 microns, or less than or equal to about 50 microns, or less The width in the direction perpendicular to the flow of current through the interconnect, in the plane of the surface of the solar cell, may be greater than or equal to about 10 mm. The first flexible electrical interconnect may be conductively bonded to a conductor in proximity to the solar cell that provides higher conductivity than the first electrical interconnect.

  In another aspect, the solar module includes a plurality of supercells arranged in two or more parallel rows. A plurality of rectangular or substantially rectangular silicons arranged side by side in a state in which the adjacent silicon solar cells are electrically connected in series, with each supercell having the long sides of adjacent silicon solar cells overlapping and in direct conductive junction with each other Includes solar cells. An intermediate position along the first supercell of the plurality of supercells in the first of the two or more parallel rows of supercells in which the hidden tap contact pads do not conduct substantial current in normal operation Is located on the back of the first solar cell. The hidden tap contact pads electrically connect in parallel to at least a second solar cell in a second of the two or more parallel rows of supercells.

A solar module may include an electrical interconnect that bonds to the hidden tap contact pad and electrically interconnects the hidden tap contact pad to the second solar cell. In some variations, the electrical interconnects do not extend substantially along the length of the first solar cell.
The back side metallization pattern on the first solar cell provides a conductive path to the hidden tap contact pad having a sheet resistance less than or equal to about 5 ohms / square.

The plurality of supercells may be arranged in three or more parallel rows extending across the width of the solar module perpendicular to the plurality of rows,
The hidden tap contact pads are electrically connected to the hidden contact pads on at least one solar cell in each of the three or more parallel rows of supercells to provide the three or more of the supercells. Electrically connect all of the parallel rows in parallel. In such variations, the solar module connects at least one to a bypass diode or other electronic device to at least one of the hidden tap contact pads or to an interconnection between the hidden tap contact pads. May include a bus connection.

  The solar module may include a flexible electrical interconnect conductively coupled to the hidden tap contact pad to electrically connect it to the second solar cell. The portion of the flexible electrical interconnect that is conductively bonded to the hidden tap contact pad is, for example, in the form of a ribbon formed of copper and has a thickness in the direction perpendicular to the surface of the solar cell to which it is bonded. It may be less than or equal to 50 microns. The conductive junction between the hidden tap contact pad and the flexible electrical interconnect may be applied to the flexible electrical interconnect at a temperature range of about -40.degree. C. to about 180.degree. C. without damaging the solar module. Enduring the thermal expansion mismatch between the first solar cell and the flexible interconnect, and adapting to the relative movement between the first solar cell and the second solar cell resulting from the thermal expansion. obtain.

  In some variations, in operation of the solar module, the first hidden contact pad may conduct a current greater than the current generated by any one of the plurality of solar cells.

  Typically, the front side of the first solar cell lying on the first hidden tap contact pad is not occupied by the contact pad or any other interconnect feature. Typically, any area of the first solar cell in the front of the first supercell where some of the adjacent solar cells in the first supercell do not overlap is occupied by the contact pad or any other interconnect feature. Absent.

  In some variations, within each supercell, most of the plurality of cells do not have a hidden tap contact pad. In such variations, the plurality of cells with hidden tap contact pads may have a larger collection area than the plurality of cells without hidden tap contact pads.

  In another aspect, the solar module comprises a plurality of supercells arranged in two or more parallel rows between a glass front sheet, a back sheet, the glass front sheet and the back sheet. And. A plurality of rectangles or approximately arranged in parallel in a state in which the adjacent silicon solar cells are electrically connected in series, with each supercell having the long sides of the adjacent silicon solar cells overlapping and flexibly conducting junctions with each other in a flexible manner It has a rectangular silicon solar cell. A first flexible electrical interconnect is conductively bonded to a first one of the plurality of supercells. The flexible conductive junction between overlapping solar cells is formed from the first conductive adhesive and has a stiffness less than or equal to about 800 megapascals. The rigid conductive junction between the first supercell and the first flexible electrical interconnect is formed of a second conductive adhesive and has a stiffness coefficient greater than or equal to about 2000 megapascals.

  The first conductive adhesive may, for example, have a glass transition temperature less than or equal to about 0 ° C.

  In some variations, unlike the first conductive adhesive and the second conductive adhesive, both conductive adhesives can be cured in the same process step.

  In some variations, the plurality of conductive junctions between overlapping adjacent solar cells have a thickness in a direction perpendicular to the solar cells less than or equal to about 50 microns and perpendicular to the solar cells Thermal conductivity in the direction is greater than or equal to about 1.5 W / (meter-K).

  In one aspect, the solar module comprises N (a number greater than or equal to about 150) rectangular or nearly rectangular silicon solar cells arranged as a plurality of supercells in two or more parallel rows. Each supercell includes a plurality of silicon solar cells arranged side by side in a state in which the adjacent silicon solar cells are electrically connected in series, with the long sides of the adjacent silicon solar cells overlapping and in conductive connection with each other. The supercell is electrically connected to provide a high DC voltage above or equal to about 90 volts.

  In one variation, the solar module includes one or more flexible electrical interconnects arranged to electrically connect the plurality of supercells in series to provide the high DC voltage. The solar module may include module level power electronics including an inverter that converts the high DC voltage to an AC voltage. The module level power electronics can sense the high DC voltage and allow the module to operate at an optimal current-voltage power point.

In another variation, the solar module is
A module level module electrically connected to a plurality of individual, adjacent series-connected supercell row pairs, and one or more of the plurality of supercell row pairs connected in series to provide the high DC voltage. With power electronics,
And an inverter for converting the high DC voltage into an AC voltage. Optionally, the module level power electronics may sense the voltage across each individual supercell row pair and operate each individual supercell row pair at an optimal current-voltage power point. Optionally, the module level power electronics may switch out the row pair from the circuit providing the high DC voltage if the voltage across the individual supercell row pair falls below a threshold.

In another variation, the solar module is electrically connected to each individual supercell row, and two or more of the plurality of supercell rows are electrically connected in series to provide the high DC voltage. Level power electronics,
And an inverter for converting the high DC voltage into an AC voltage. Optionally, the module level power electronics may sense the voltage across each individual supercell row and operate each individual supercell row at an optimal current-voltage power point. Optionally, the module level power electronics may switch out the supercell row from the circuit providing the high DC voltage if the voltage across the individual supercell row falls below a threshold.

In another variation, a solar module is electrically connected to each individual supercell, and module-level power to electrically connect two or more of the plurality of supercells in series to provide the high DC voltage. With electronics,
And an inverter for converting the high DC voltage into an AC voltage. Optionally, the module level power electronics can sense the voltage across each individual supercell and operate each individual supercell at an optimal current-voltage power point. Optionally, the module level power electronics may switch out the supercell from the circuit providing the high DC voltage if the voltage across the individual supercell falls below a threshold.

In another variation, each supercell in the module is electrically segmented into multiple segments with multiple hidden taps. The solar module electrically connects to each segment of each supercell through the plurality of hidden taps and electrically connects two or more segments in series to provide module level power electronics that provide the high DC voltage. Including
The inverter includes an inverter for converting the high DC voltage into an AC voltage. Optionally, the module level power electronics can sense the voltage across each individual segment of each supercell and operate each individual segment at an optimal current-voltage power point. Optionally, the module level power electronics may switch out the segments from the circuit providing the high DC voltage if the voltage across the individual segments falls below a threshold.

  In any of the above variations, the optimal current-voltage power point may be the maximum current-voltage power point.

  In any of the above variations, the module level power electronics may not have a DC-DC boost component.

  In any of the above variations, N is greater than or equal to about 200, greater than or equal to about 250, greater than or equal to about 250, greater than or equal to about 300, greater than or equal to about 350, or about Greater than or equal to 400, greater than or equal to about 450, or greater than or equal to about 500, greater than or equal to about 500, greater than or equal to about 550, greater than or equal to about 600, or greater than or equal to about 650 It may be equal to it, or greater than or equal to about 700.

  In any of the above variations, the high DC voltage is higher than or equal to about 120 volts, higher than or equal to about 180 volts, higher than or equal to about 240 volts, higher than about 300 volts Or equal to, greater than or equal to about 360 volts, higher than or equal to about 420 volts, higher than or equal to about 480 volts, higher than or equal to about 540 volts, or about 600 volts It may be at a higher or equal voltage.

  In another aspect, a photovoltaic system comprises two or more solar modules electrically connected in parallel and an inverter. Each solar module comprises N (greater than or equal to about 150) rectangular or nearly rectangular silicon solar cells arranged as a plurality of supercells in two or more parallel rows. The supercells in each module are arranged side by side with the long sides of the adjacent silicon solar cells overlapping and conducting junctions with each other to electrically connect the adjacent silicon solar cells in series. It includes two or more silicon solar cells of the plurality of silicon solar cells. Within each module, the supercell is electrically connected to provide a high voltage DC module output above or equal to about 90 volts. The inverter is electrically connected to two or more solar modules to convert their high voltage DC output into AC.

  Each solar module may include one or more flexible electrical interconnects arranged to electrically connect the plurality of supercells in the solar module in series to provide a high voltage DC output of the solar module.

  The photovoltaic system may include at least a third solar module electrically connected in series with a first solar module of the two or more solar modules electrically connected in parallel. In such cases, the third solar module may be N 'number (greater than or equal to about 150) rectangular or near rectangular silicon arranged as a plurality of supercells in two or more parallel rows. It may include a solar cell. The super cells in the third solar module are arranged side by side with the long sides of adjacent silicon solar cells overlapping and conductively joined to electrically connect the adjacent silicon solar cells in series. Among the plurality of silicon solar cells, two or more silicon solar cells are included. Within the third solar module, the supercell is electrically connected to provide a high voltage DC module output above or equal to about 90 volts.

  As just described, of the two or more solar modules, the variant comprising the third solar module electrically connected in series with the first solar module consists of two or more solar modules electrically connected in parallel. At least a fourth solar module electrically connected in series with the second solar module may also be included. The fourth solar module may include N ′ ′ (number greater than or equal to about 150) rectangular or nearly rectangular silicon solar cells arranged as a plurality of supercells in two or more parallel rows . The super cells in the fourth solar module are arranged side by side in a state in which the long sides of adjacent silicon solar cells overlap and are conductively connected to each other to electrically connect the adjacent silicon solar cells in series. Among the plurality of silicon solar cells, two or more silicon solar cells are included. Within the fourth solar module, the supercell is electrically connected to provide a high voltage DC module output above or equal to about 90 volts.

  The photovoltaic system is configured such that a short circuit occurring on any one of the two or more solar modules dissipates power generated by the other solar modules of the two or more solar modules. It may include a plurality of fuses and / or blocking diodes arranged to prevent this.

  The photovoltaic system may include positive and negative buses of the parallel electrical connection of the two or more solar modules and the electrical connection of the inverter. Alternatively, the photovoltaic system may include a combiner box to which the two or more solar modules are electrically connected by separate conductors. The combiner box electrically connects the solar modules in parallel, and optionally, a short circuit occurring in any one of the two or more solar modules dissipates the power generated by the other solar modules May include a plurality of fuses and / or blocking diodes arranged to prevent

  The inverter may be configured to operate the two or more solar modules at a DC voltage higher than a minimum value set to avoid reverse biasing the solar modules.

  The inverter may be configured to recognize a reverse bias condition occurring in one or more of the solar modules and to operate the solar module at a voltage that avoids the reverse bias condition.

  A photovoltaic system may be positioned on the roof.

  In any of the above variations, N, N ′ and N ′ ′ are greater than or equal to about 200, greater than or equal to about 250, or greater than or equal to about 300, about 350 Greater than or equal to, greater than about 400 or equal to, greater than or equal to about 450, greater than or equal to about 500, greater than or equal to about 500, greater than or equal to about 550, or greater than about 600 It may be equal to, greater than about 650, or equal to, or greater than or equal to about 700. N, N 'and N' 'may have the same or different values.

  In any of the above variations, the high DC voltage provided by the solar module is greater than or equal to about 120 volts, greater than or equal to about 180 volts, or greater than about 240 volts or Equal, higher than or equal to about 300 volts, higher than or equal to about 360 volts, higher than or equal to about 420 volts, higher than or equal to about 480 volts, or higher than about 540 volts The voltage may be equal to, or greater than or equal to about 600 volts.

  In another aspect, the photovoltaic system comprises N (approximately greater than or equal to about 150) rectangular or nearly rectangular silicon solar cells arranged as a plurality of supercells in two or more parallel rows. Including a first solar module. Each supercell includes a plurality of silicon solar cells arranged side by side in a state in which the adjacent silicon solar cells are electrically connected in series, with the long sides of the adjacent silicon solar cells overlapping and in conductive connection with each other. The system also comprises an inverter. The inverter may, for example, be a micro-inverter integrated with the first solar module. The plurality of supercells in the first solar module are electrically connected to provide a high DC voltage, greater than or equal to about 90 volts, to the inverter that converts the DC to AC.

  The first solar module may include one or more flexible electrical interconnects arranged to electrically connect the plurality of supercells in the solar module in series to provide a high voltage DC output of the solar module .

  The photovoltaic system may at least include a second solar module in electrical connection in series with the first solar module. The second solar module may include N 'number (greater than or equal to about 150) rectangular or nearly rectangular silicon solar cells arranged as a plurality of supercells in two or more parallel rows. The super cells in the second solar module are arranged side by side with the long sides of adjacent silicon solar cells overlapping and conductively joined to electrically connect the adjacent silicon solar cells in series. Among the plurality of silicon solar cells, two or more silicon solar cells are included. Within the second solar module, the supercell is electrically connected to provide a high voltage DC module output above or equal to about 90 volts.

  The inverter (eg, a micro-inverter) may not have a DC-DC boost component.

  In any of the above variations, N and N ′ are greater than or equal to about 200, greater than or equal to about 250, greater than or equal to about 250, greater than or equal to about 300, or greater than or about 350 Equal to, greater than about 400, or equal to, greater than about 450, equal to, greater than about 500, equal to, greater than about 550, or greater than about 600, or greater than about 650 It may be greater than or equal to it, or greater than or equal to about 700. N, N ′ may have the same or different values.

  In any of the above variations, the high DC voltage provided by the solar module is greater than or equal to about 120 volts, greater than or equal to about 180 volts, or greater than about 240 volts or Equal, higher than or equal to about 300 volts, higher than or equal to about 360 volts, higher than or equal to about 420 volts, higher than or equal to about 480 volts, or higher than about 540 volts The voltage may be equal to, or greater than or equal to about 600 volts.

  In another aspect, the solar modules are arranged as a plurality of series-connected supercells in two or more parallel rows, N (a number greater than or equal to about 250) rectangular or substantially rectangular silicon solar Including batteries. Each supercell comprises a plurality of silicon solar cells, wherein the long sides of adjacent silicon solar cells overlap and are directly conductively joined to each other by an electrical and thermally conductive adhesive to form a supercell. The silicon solar cells are arranged side by side in a state of being electrically connected in series. The solar module comprises less than one bypass diode per 25 solar cells. The electrically and thermally conductive adhesive has a thickness in the direction perpendicular to the plurality of solar cells less than or equal to about 50 microns and a thermal conductivity in the direction perpendicular to the plurality of solar cells of about 50 microns. Form multiple junctions between adjacent solar cells higher than or equal to 1.5 W / (meter-K).

  The plurality of supercells may be enclosed in a thermoplastic olefin layer between the front and back sheets. The supercell and their encapsulants can be sandwiched between a glass front sheet and a back sheet.

  The solar module may, for example, comprise less than one bypass diode per thirty solar cells, or less than one bypass diode per fifty solar cells, or less than one bypass diode per hundred solar cells. The solar module may, for example, comprise no bypass diode, or only a single bypass diode, or 3 or less bypass diodes, or 6 or less bypass diodes, or 10 or less bypass diodes.

  A plurality of conductive junctions between overlapping solar cells are optional, the plurality in the direction parallel to the plurality of rows at a temperature range of about -40 ° C to about 100 ° C without damaging the solar module Mechanical compliance can be provided to the plurality of supercells to accommodate the thermal expansion mismatch between the supercell and the glass front sheet.

  In any of the above variations, N is greater than or equal to about 300, greater than or equal to about 350, greater than or equal to about 350, greater than or equal to about 400, or greater than or equal to about 450, about It may be a value greater than or equal to 500, greater than or equal to about 550, greater than or equal to about 600, greater than or equal to about 600, greater than or equal to about 650, or greater than or equal to about 700.

  In any of the above variations, the plurality of supercells are electrically connected to be greater than or equal to about 120 volts, greater than or equal to about 180 volts, or greater than about 240 volts, or Equal, higher than or equal to about 300 volts, higher than or equal to about 360 volts, higher than or equal to about 420 volts, higher than or equal to about 480 volts, or higher than about 540 volts A high DC voltage may be provided that is equal to, or greater than or equal to about 600 volts.

Solar energy system
The solar module of any of the above variations,
And an inverter (e.g., a micro-inverter) configured to be electrically connected to the solar module and to convert a DC output from the solar module to provide an AC output. The inverter may not have a DC-DC boost component. The inverter may be configured to operate the solar module at a DC voltage higher than a minimum value set to avoid reverse biasing the solar cell. The minimum voltage value may be temperature dependent. The inverter may be configured to recognize a reverse bias condition and operate the solar module at a voltage that avoids the reverse bias condition. For example, the inverter may be configured to operate the solar module in the maximum region of the voltage-current output curve of the solar module to avoid the reverse bias condition.

  The present specification discloses a solar cell cleaving tool and a solar cell cleaving method.

In one aspect, a method of manufacturing a solar cell comprises
Advancing the solar cell wafer along the curved surface;
A vacuum is drawn between the curved surface and the bottom surface of the solar cell wafer to bend the solar cell wafer toward the curved surface, whereby the solar is along one or more previously prepared scribe lines. Cleaving the cell wafer to separate a plurality of solar cells from the cell solar wafer. The solar cell wafer can, for example, be advanced continuously along the curved surface. Alternatively, the solar cells can be advanced along the curved surface in discrete motions.

  The curved surface may be, for example, a curved portion of the top surface of a vacuum manifold that pulls the vacuum against the bottom surface of the solar cell wafer. The vacuum drawn to the bottom surface of the solar cell wafer by the vacuum manifold may change along the moving direction of the solar cell wafer, for example, the solar cell wafer is sequentially cleaved. It may be the strongest in the area.

  The method comprises the step of transporting the solar cell wafer by a perforated belt along the curved upper surface of the vacuum manifold, wherein the vacuum is applied to the solar cell wafer through a plurality of perforations in the perforated belt. It may include the step of being drawn against the bottom. The plurality of perforations is optionally such that the leading and trailing edges of the solar cell wafer along the direction of movement of the solar cell wafer overlie at least one of the perforations in the perforated belt, and thus the curved surface due to vacuum. It may be arranged on the belt so as to be pulled towards, but this is not necessary.

  The method advances the solar cell wafer along the flat region of the top surface of the vacuum manifold to reach a transition curve region of the top surface of the vacuum manifold having a first curvature, and then the solar cell wafer Advancing the solar cell wafer into the cleavage region of the top surface of the vacuum manifold, wherein the cleavage region of the vacuum manifold has a second curvature higher than the first curvature. A process may be provided. The method may further include the step of advancing the plurality of cleaved solar cells into the post-cleavage region of the vacuum manifold having a third curvature higher than the second curvature.

  In any of the above variations, the method pulls a vacuum between the stronger solar cell wafer and the curved surface at one end of each scribe line and then at the opposite end of each scribe line. And providing a non-symmetrical stress distribution along each scribe line, promoting nucleation and propagation of a single blemish break line along each scribe line. Alternatively, or additionally, in any of the above variations, the method comprises, for each scribe line, a solar cell wafer such that one end reaches the curved cleavage area of the vacuum manifold before the other end The process may include the step of orienting the upper scribe line at an angle to the vacuum manifold.

  In any of the above variations, the method may include the step of removing the cleaved solar cell from the curved surface before the edges of the cleaved solar cell touch. For example, the method may include removing the cell in a direction tangent or approximately tangent to the curved surface of the manifold at a rate faster than the rate of movement of the cell along the manifold. This may be achieved, for example, by a moving belt arranged to be tangent or by any other suitable mechanism.

  In any of the above variations, the method comprises the steps of: scribing a scribe line on the solar cell wafer; and, before cleaving the solar cell wafer along the scribe line, one of the top or bottom surface of the solar cell wafer. Applying a conductive adhesive to the part. Each of the resulting cleaved solar cells may then include a portion of the electrically conductive adhesive that is disposed along the top or bottom cleavage edge thereof. The scribe line may be formed before or after the electrically conductive adhesive is applied using any suitable scribing method. The scribe line can be formed, for example, by laser scribing.

  In any of the above variations, the solar cell wafer may be a square or pseudo square silicon solar cell wafer.

  In another aspect, a method of making a solar cell string comprises arranging a plurality of rectangular solar cells side by side with the long sides of adjacent rectangular solar cells interspersed in an electrically conductive adhesive adhesive interposed therebetween. The steps of disposing and curing the electrically conductive bonding agent thereby bonding adjacent and overlapping rectangular solar cells together and electrically connecting them in series. The solar cell may be manufactured, for example, by any of the variants of the method for manufacturing a solar cell described above.

In one aspect, a method of making a solar cell string comprises forming a backside metallization pattern on each square solar cell of one or more square solar cells;
And, in a single stencil printing step, stencil printing the complete front metallization pattern on each square solar cell of the one or more square solar cells using a single stencil. These steps may be performed in any order or simultaneously as appropriate. By "complete front metallization pattern" is meant that after the stencil printing process, no additional metallization material needs to be deposited on the front of the square solar cell to complete the formation of the front metallization. The way is also
Separating each square solar cell into two or more rectangular solar cells such that a plurality of rectangular solar cells each comprising a full front metallization pattern and a back metallization pattern, Forming from square solar cells;
Arranging the plurality of rectangular solar cells side by side in a state in which the long sides of adjacent rectangular solar cells overlap each other in the form of grit;
Conductively bonding together said rectangular solar cells contained in each pair of adjacent and overlapping rectangular solar cells with an electrically conductive bonding agent disposed therebetween, one of said rectangular solar cells contained in said pair Electrically connecting the front surface metallization pattern of the rectangular solar cell to the backside metal coverage pattern of the other rectangular solar cell of the rectangular solar cells included in the pair, whereby the plurality of rectangular solar cells are connected in series Electrically connect to the process.

  The stencil defines one or more features of the front side metallization pattern on the one or more square solar cells, such that all portions of the stencil lie in the plane of the stencil during stencil printing. It may be configured to be secured by physical connection to other parts of the stencil.

  The front surface metallization pattern on each rectangular solar cell may, for example, include a plurality of fingers oriented in a direction perpendicular to the long side of the rectangular solar cell, the plurality of fingers in the front surface metallization pattern being None are physically connected to one another by the front side metallization pattern.

  This specification describes, for example, a solar cell without cleavage edge promoting carrier recombination and reducing carrier recombination loss at the edge of the solar cell, a method for manufacturing such a solar cell, and formation of a supercell And the use of such solar cells in a scaly arrangement (overlapping).

In one aspect,
The method of manufacturing multiple solar cells is
Depositing one or more front amorphous silicon layers on the front of the crystalline silicon wafer;
Depositing one or more backside amorphous silicon layers on the backside of the crystalline silicon wafer opposite the front side of the crystalline silicon wafer;
Patterning the one or more front amorphous silicon layers to form one or more front trenches in the one or more front amorphous silicon layers;
Depositing a front passivation layer on the one or more front amorphous silicon layers and in the one or more front trenches;
Patterning the one or more backside amorphous silicon layers to form one or more backside trenches in the one or more backside amorphous silicon layers;
Depositing a backside passivation layer on the one or more backside amorphous silicon layers and in the one or more backside trenches. Each of the one or more back side trenches is formed alongside the corresponding one of the front side trenches. The method is cleaving the crystalline silicon wafer at one or more cleavage planes, each cleavage plane being centered or substantially centered on different pairs of corresponding front and back trenches. , Further including a process. In the operation of the resulting solar cell, the front amorphous silicon layer will be illuminated by light.

  In some variations, only the front trench is formed and the back trench is not formed. In another variation, only the back surface trench is formed and the front surface trench is not formed.

  The method forms the one or more front trenches and penetrates the front amorphous silicon layer to reach the front of the crystalline silicon wafer and / or forms one or more back trenches. The method may include penetrating the one or more backside amorphous silicon layers to reach the backside of the crystalline silicon wafer.

  The method may comprise forming the front passivation layer and / or the back passivation layer from a transparent conductive oxide.

  A pulsed laser or diamond tip may be used to initiate a cleavage point (e.g., approximately 100 microns long). A CW laser and cooling nozzle are used sequentially to cause high thermal stress to compress and stretch and to induce the propagation of complete cleavage within the crystalline silicon wafer to separate the crystalline silicon wafer at one or more cleavage planes Can be Alternatively, crystalline silicon wafers can be mechanically cleaved at one or more cleavage planes. Any suitable cleaving method may be used.

  The one or more front side amorphous crystalline silicon layers may form an np junction with the crystalline silicon wafer, in which case it may be preferable to cleave the crystalline silicon wafer from its back side. Alternatively, the one or more backside amorphous crystalline silicon layers may form an np junction with the crystalline silicon wafer, in which case it may be preferable to cleave the crystalline silicon wafer from its front side.

In another aspect, a method of fabricating a plurality of solar cells comprises
Forming one or more trenches in the first surface of the crystalline silicon wafer;
Depositing one or more amorphous silicon layers on the first surface of the crystalline silicon wafer;
Depositing a passivation layer in the one or more trenches on the first surface of the crystalline silicon wafer and on the one or more amorphous silicon layers;
Depositing one or more amorphous silicon layers on a second surface of the crystalline silicon wafer opposite the first surface of the crystalline silicon wafer;
Cleaving the crystalline silicon wafer at one or more cleavage planes, each cleavage plane being centered or substantially centered on a different one of the one or more trenches Includes and.

  The method may include the step of forming the passivated layer from a transparent conductive oxide.

  A laser may be used to cause thermal stress in the crystalline silicon wafer to cleave the crystalline silicon wafer at the one or more cleavage planes. Alternatively, crystalline silicon wafers can be mechanically cleaved at one or more cleavage planes. Any suitable cleaving method may be used.

  The one or more front amorphous crystalline silicon layers may form an np junction with the crystalline silicon wafer. Alternatively, the one or more backside amorphous crystalline silicon layers may form an np junction with the crystalline silicon wafer.

In another embodiment, a plurality of solar panels are arranged side by side with the adjacent solar cells connected in series, with the ends of the adjacent solar cells overlapping and conductingly bonding to each other. A plurality of supercells each having a solar cell of Each solar cell is
A crystalline silicon substrate,
One or more first surface amorphous silicon layers disposed on the first surface of the crystalline silicon substrate to form an np junction;
One or more second surface amorphous silicon layers disposed on the second surface of the crystalline silicon substrate opposite to the first surface of the crystalline silicon substrate;
The edge of the one or more first surface amorphous silicon layers, or the edge of the one or more second surface amorphous silicon layers, or the edge of the one or more first surface amorphous silicon layers and the one or more And a plurality of passivated layers to prevent carrier recombination at the edge of the second surface amorphous silicon layer. The plurality of passivated layers may comprise transparent conductive oxides.

  The solar cells may be formed, for example, by any of the methods summarized above or otherwise disclosed herein.

  These and other embodiments, features, and advantages of the present invention will become apparent to those skilled in the art upon review of the following more detailed description of the present invention in conjunction with the accompanying drawings, which are briefly described first. It becomes clearer.

FIG. 5 shows a cross-sectional view of a string of serially connected solar cells arranged in a grid-like fashion, with the ends of adjacent solar cells forming an overlapping marble-like supercell.

FIG. 5 shows a diagram of the front (sun side) surface and front metallization pattern of an exemplary rectangular solar cell that may be used to form a glazed supercell.

FIG. 6 shows a diagram of the front (solar side) surface and front metallization patterns of two exemplary rectangular solar cells that include rounded corners that may be used to form a glazed supercell. FIG. 6 shows a diagram of the front (solar side) surface and front metallization patterns of two exemplary rectangular solar cells that include rounded corners that may be used to form a glazed supercell.

FIG. 2B shows a view of the backside of the solar cell shown in FIG. 2A and an exemplary backside metallization pattern. FIG. 2B shows a view of the backside of the solar cell shown in FIG. 2A and an exemplary backside metallization pattern.

FIG. 2B shows a view of the back side of the solar cell shown in FIGS. 2B and 2C, respectively, and an exemplary back side metallization pattern. FIG. 2B shows a view of the back side of the solar cell shown in FIGS. 2B and 2C, respectively, and an exemplary back side metallization pattern.

FIG. 7 shows a diagram of the front (solar side) surface and front metallization pattern of another exemplary rectangular solar cell that may be used to form a glaze-like supercell. The front side metallization pattern includes discrete contact pads, each of which includes uncured conductive adhesive deposited on the contact pads flowing away from the contact pads. It is surrounded by a barrier configured to prevent that.

FIG. 2C shows a cross-sectional view of the solar cell of FIG. 2H and identifies details of the front side metallization pattern shown in the enlarged views of FIGS.

Figure 21 shows an enlarged view of the detail of Figure 21;

Figure 21 shows a close-up view of the detail of Figure 21 with the uncured conductive adhesive bond substantially contained at the discrete contact pad locations by the barrier.

FIG. 3 shows a back side and an illustration of an example back side metallization pattern for the solar cell of FIG. 2H. The backside metallization pattern includes discontinuous contact pads, each one of which is a flow of uncured conductive adhesive deposited on the contact pads away from the contact pads It is surrounded by a barrier configured to prevent that.

FIG. 2C shows a cross-sectional view of the solar cell of FIG. 2L, and identifies details of the backside metallization pattern shown in the enlarged view of FIG. 2N including the contact pad and a portion of the barrier surrounding the contact pad.

FIG. 2B shows an enlarged view of the detail of FIG. 2M.

FIG. 7 illustrates another variation of a metallized pattern including a barrier configured to prevent uncured conductive adhesive bonding from flowing away from the contact pad. The barrier abuts one side of the contact pad and is higher than the contact pad.

FIG. 21 illustrates another variation of the metallization pattern of FIG. 20 with the barriers resting on at least two sides of the contact pad.

FIG. 6 shows a back side and an illustration of an example back side metallization pattern for another example rectangular solar cell. The backside metallization pattern comprises a continuous contact pad extending substantially the length of the long side of the solar cell along the edge of the solar cell. The contact pad is surrounded by a barrier configured to prevent the uncured conductive adhesive deposited on the contact pad from flowing away from the contact pad.

FIG. 7 shows a diagram of the front (solar side) surface and front metallization pattern of another exemplary rectangular solar cell that may be used to form a glaze-like supercell. The front side metallization pattern includes discrete contact pads arranged in rows along the edge of the solar cell and long thin conductors extending inwardly from the rows in parallel with the rows of contact pads. The long thin conductor forms a barrier configured to prevent the uncured conductive adhesive bond deposited on its contact pad from flowing away from the contact pad onto the active area of the solar cell .

Separate (eg, cut or fold) quasi-square silicon solar cells of standard size and shape into two different lengths of rectangular solar cells that can be used to form a scaly supercell FIG. 6 shows a diagram illustrating an exemplary method of obtaining.

FIG. 6 shows a diagram illustrating another exemplary method by which pseudo square silicon solar cells can be separated to be rectangular solar cells. FIG. 3B shows the front side of the wafer and an exemplary front side metallization pattern. FIG. 3C shows the backside of the wafer and an exemplary backside metallization pattern. FIG. 6 shows a diagram illustrating another exemplary method by which pseudo square silicon solar cells can be separated to be rectangular solar cells. FIG. 3B shows the front side of the wafer and an exemplary front side metallization pattern. FIG. 3C shows the backside of the wafer and an exemplary backside metallization pattern.

FIG. 7 shows a diagram illustrating an exemplary method by which square silicon solar cells can be separated to be rectangular solar cells. FIG. 3D shows the front side of the wafer and an exemplary front side metallization pattern. FIG. 3E shows the backside of the wafer and an exemplary backside metallization pattern. FIG. 7 shows a diagram illustrating an exemplary method by which square silicon solar cells can be separated to be rectangular solar cells. FIG. 3D shows the front side of the wafer and an exemplary front side metallization pattern. FIG. 3E shows the backside of the wafer and an exemplary backside metallization pattern.

FIG. 2 shows a fragmentary view of the front of an exemplary rectangular supercell comprising a plurality of rectangular solar cells, for example as shown in FIG. 2A, arranged in a square like as shown in FIG.

Front view of an exemplary rectangular supercell comprising a plurality of "chevron" rectangular solar cells comprising a plurality of chamfered corners, for example as shown in Fig. 2B, arranged in a flail as shown in Fig. 1 A back view is shown, respectively. Front view of an exemplary rectangular supercell comprising a plurality of "chevron" rectangular solar cells comprising a plurality of chamfered corners, for example as shown in Fig. 2B, arranged in a flail as shown in Fig. 1 and A back view is shown, respectively.

Fig. 3 shows a diagram of an exemplary rectangular solar module. The rectangular solar module comprises a plurality of rectangular scaly shaped supercells each having a long side approximately half the length of the short side of the module. Multiple pairs of supercells are placed end to end to form multiple rows with the long sides of the supercells parallel to the short sides of the module.

FIG. 7 shows a diagram of another exemplary rectangular solar module. The same rectangular solar module comprises a plurality of rectangular scaly supercells each having a long side approximately the same length as the short side of the module. The supercells are arranged with their long sides parallel to the short sides of the module.

FIG. 7 shows a diagram of another exemplary rectangular solar module. The same rectangular solar module includes a plurality of rectangular scaly supercells each having a long side approximately the same length as the long side of the module. The supercells are arranged with their long sides parallel to the sides of the module.

Fig. 3 shows a diagram of an exemplary rectangular solar module. The rectangular solar module comprises a plurality of rectangular, scaly supercells, each having a long side approximately half the length of the long side of the module. Multiple pairs of supercells are placed end to end to form multiple rows with the long sides of the supercells parallel to the long sides of the same module.

FIG. 5C shows a view of another exemplary rectangular solar module similar in configuration to that of FIG. 5C. In that configuration, all of the solar cells that form the supercell are chevron solar cells that include chamfered corners that correspond to the corners of the pseudo-square wafer from which the solar cells are separated.

FIG. 5C shows a view of another exemplary rectangular solar module similar in configuration to that of FIG. 5C. In that configuration, the solar cells forming the supercell include a mixture of chevron solar cells and rectangular solar cells arranged to reproduce the shape of the pseudo square wafer from which they are separated.

FIG. 5C shows a view of another exemplary rectangular solar module similar in configuration to that of FIG. 5E. The difference is that adjacent chevron solar cells in the supercell are arranged as mirror images of one another such that their overlapping edges have the same length.

FIG. 7 illustrates an exemplary arrangement of three supercell rows interconnected by flexible electrical interconnects to series the supercells in each row with each other in parallel. These may be, for example, three rows in the solar module of FIG. 5D.

3 illustrates an exemplary flexible interconnect that may be used to interconnect supercells in series or in parallel. Some of the examples exhibit patterning that enhances their flexibility (mechanical compliance) along their long axis, along their short axis, or along their long and short axes. There is. FIG. 7A illustrates an exemplary stress relief long interconnect configuration that may be used in a hidden tap to a supercell as described herein, or as an interconnect to a front or back supercell end contact. . 7 illustrates an example of an out-of-plane stress relief feature. 7B-1 and 7B-2 illustrate exemplary long interconnects that may be used in hidden taps to a supercell or as interconnects to front or back supercell end contacts, including out-of-plane stress relaxation features. Indicates the configuration. 7 illustrates an example of an out-of-plane stress relief feature. 7B-1 and 7B-2 illustrate exemplary long interconnects that may be used in hidden taps to a supercell or as interconnects to front or back supercell end contacts, including out-of-plane stress relaxation features. Indicates the configuration.

Detail A from FIG. 5D is shown. FIG. 5D is a cross-sectional view of the exemplary solar module of FIG. 5D showing details of the cross-section of the flexible electrical interconnects joining back end contacts of the plurality of supercell rows.

Detail C from FIG. 5D is shown. FIG. 5D is a cross-sectional view of the exemplary solar module of FIG. 5D showing details of the cross-section of the flexible electrical interconnect joining to the front (sun-side) face end contacts of the plurality of supercell rows.

Fig. 5B shows detail B from Fig. 5D. FIG. 5D is a cross-sectional view of the exemplary solar module of FIG. 5D showing details of the cross section of a flexible interconnect arranged to interconnect two supercells in a row in series.

FIG. 7 illustrates several additional examples of electrical interconnects that join the front end contacts of the supercell at the end of the supercell row, adjacent to the edge of the solar module. The exemplary interconnects are configured to reduce the footprint of the front of the module. FIG. 7 illustrates several additional examples of electrical interconnects that join the front end contacts of the supercell at the end of the supercell row, adjacent to the edge of the solar module. The exemplary interconnects are configured to reduce the footprint of the front of the module. FIG. 7 illustrates several additional examples of electrical interconnects that join the front end contacts of the supercell at the end of the supercell row, adjacent to the edge of the solar module. The exemplary interconnects are configured to reduce the footprint of the front of the module. FIG. 7 illustrates several additional examples of electrical interconnects that join the front end contacts of the supercell at the end of the supercell row, adjacent to the edge of the solar module. The exemplary interconnects are configured to reduce the footprint of the front of the module.

FIG. 7 shows a diagram of another exemplary rectangular solar module. The same rectangular solar module includes six rectangular scaly supercells each having a long side approximately the same length as the long side of the module. The supercells are arranged in six rows electrically connected to each other in parallel and with bypass diodes arranged in the junction box on the back of the solar module. Electrical connection between the supercell and the bypass diode is established through a ribbon embedded in the laminated structure of the module.

FIG. 7 shows a diagram of another exemplary rectangular solar module. The same rectangular solar module includes six rectangular scaly supercells each having a long side approximately the same length as the long side of the module. The supercells are arranged in parallel with one another and in six rows electrically connected in parallel with bypass diodes arranged on the back of the solar module and in a junction box near the edge of the solar module. A second junction box is located on the back side near the opposite edge of the solar module. Electrical connection between the supercell and the bypass diode is established through an external cable between the junction boxes.

FIG. 6 shows a diagram of an exemplary glass-glass rectangular solar module. The same rectangular solar module includes six rectangular scaly supercells each having a long side approximately the same length as the long side of the module. The supercells are arranged in six rows electrically connected to one another in parallel. Two junction boxes are mounted on opposite edges of the module to maximize the active area of the module.

FIG. 9C shows a side view of the solar module illustrated in FIG. 9C.

7 illustrates another exemplary solar module. The solar module includes six rectangular scaly supercells each having a long side approximately the same length as the long side of the module. The supercells are arranged in six rows with three pairs of rows individually connected to the power management devices on the solar module.

7 illustrates another exemplary solar module. The solar module includes six rectangular scaly supercells each having a long side approximately the same length as the long side of the module. The supercells are arranged in six rows with each row individually connected to the power management device on the solar module.

FIG. 7 illustrates another embodiment of a module level power management architecture using a scaly supercell. FIG. 7 illustrates another embodiment of a module level power management architecture using a scaly supercell.

FIG. 5B shows an exemplary schematic electrical circuit diagram of a solar module as illustrated in FIG. 5B.

FIG. 10B illustrates an exemplary physical layout of various electrical interconnects for a solar module as illustrated in FIG. 5B having the schematic circuit diagram of FIG. 10A. FIG. 10B illustrates an exemplary physical layout of various electrical interconnects for a solar module as illustrated in FIG. 5B having the schematic circuit diagram of FIG. 10A.

FIG. 5B shows an exemplary schematic electrical diagram of a solar module as illustrated in FIG. 5A.

FIG. 11B illustrates an example physical layout of various electrical interconnects for the solar module as illustrated in FIG. 5A having the schematic electrical diagram of FIG. 11A. FIG. 11B illustrates an example physical layout of various electrical interconnects for the solar module as illustrated in FIG. 5A having the schematic electrical diagram of FIG. 11A.

FIG. 11C illustrates another exemplary physical layout of various electrical interconnects for the solar module as illustrated in FIG. 5A having the schematic electrical diagram of FIG. 11A. FIG. 11C illustrates another exemplary physical layout of various electrical interconnects for the solar module as illustrated in FIG. 5A having the schematic electrical diagram of FIG. 11A.

FIG. 5B shows another exemplary schematic circuit diagram of a solar module as illustrated in FIG. 5A.

FIG. 12B illustrates an exemplary physical layout of various electrical interconnects for a solar module as illustrated in FIG. 5A having the schematic circuit diagram of FIG. 12A. FIG. 12B illustrates an exemplary physical layout of various electrical interconnects for a solar module as illustrated in FIG. 5A having the schematic circuit diagram of FIG. 12A.

FIG. 12B illustrates another exemplary physical layout of various electrical interconnects for the solar module as illustrated in FIG. 5A having the schematic circuit diagram of FIG. 12A. FIG. 12B illustrates another exemplary physical layout of various electrical interconnects for the solar module as illustrated in FIG. 5A having the schematic circuit diagram of FIG. 12A. FIG. 12B illustrates another exemplary physical layout of various electrical interconnects for the solar module as illustrated in FIG. 5A having the schematic circuit diagram of FIG. 12A.

FIG. 5B shows another exemplary schematic circuit diagram of a solar module as illustrated in FIG. 5A.

FIG. 5B shows another exemplary schematic circuit diagram of a solar module as illustrated in FIG. 5B.

FIG. 13C illustrates an exemplary physical layout of various electrical interconnects for the solar module as illustrated in FIG. 5A having the schematic circuit diagram of FIG. 13A. Slightly modified, the physical layouts of FIGS. 13C-1 and 13C-2 are suitable for a solar module as illustrated in FIG. 5B having the schematic circuit diagram of FIG. 13B. FIG. 13C illustrates an exemplary physical layout of various electrical interconnects for the solar module as illustrated in FIG. 5A having the schematic circuit diagram of FIG. 13A. Slightly modified, the physical layouts of FIGS. 13C-1 and 13C-2 are suitable for a solar module as illustrated in FIG. 5B having the schematic circuit diagram of FIG. 13B.

FIG. 7 shows a diagram of another exemplary rectangular solar module. The rectangular solar module comprises a plurality of rectangular scaly shaped supercells each having a long side approximately half the length of the short side of the module. Multiple pairs of supercells are placed end to end to form multiple rows with the long sides of the supercells parallel to the short sides of the module.

FIG. 14B shows an exemplary schematic circuit diagram of a solar module as illustrated in FIG. 14A.

FIG. 14B illustrates an example physical layout of various electrical interconnects for a solar module as illustrated in FIG. 14A having the schematic circuit diagram of FIG. 14B. FIG. 14B illustrates an example physical layout of various electrical interconnects for a solar module as illustrated in FIG. 14A having the schematic circuit diagram of FIG. 14B.

FIG. 10B illustrates another exemplary physical layout of various electrical interconnects for a solar module as illustrated in FIG. 5B having the schematic circuit diagram of FIG. 10A.

Fig. 3 shows an exemplary arrangement of a smart switch interconnecting two solar modules in series.

3 shows a flowchart of an exemplary method of making a solar module with a supercell.

5 shows a flowchart of another exemplary method of making a solar module with a supercell.

Fig. 6 shows an exemplary arrangement in which the supercell can be cured by heat and pressure. Fig. 6 shows an exemplary arrangement in which the supercell can be cured by heat and pressure. Fig. 6 shows an exemplary arrangement in which the supercell can be cured by heat and pressure. Fig. 6 shows an exemplary arrangement in which the supercell can be cured by heat and pressure.

1 schematically illustrates an exemplary apparatus that may be used to cleave scribed solar cells. The same device may be particularly advantageous when a conductive adhesive binder is used to cleave a scribed supercell to which it has been applied. 1 schematically illustrates an exemplary apparatus that may be used to cleave scribed solar cells. The same device may be particularly advantageous when a conductive adhesive binder is used to cleave a scribed supercell to which it has been applied. 1 schematically illustrates an exemplary apparatus that may be used to cleave scribed solar cells. The same device may be particularly advantageous when a conductive adhesive binder is used to cleave a scribed supercell to which it has been applied.

By means of dark lines that can be used to reduce the visual contrast between the supercell and a portion of the backsheet visible from the front of the module within a solar module that includes multiple parallel supercell rows Fig. 6 shows an exemplary white "rear" sheet with "zebra-like stripes".

FIG. 5 shows a top view of a conventional module utilizing a traditional ribbon connection in a hot spot condition. FIG. 6 shows a top view of a module utilizing thermal diffusion according to an embodiment, also in a hot spot condition.

Fig. 6 shows an example of a string layout of a supercell with beveled cells. Fig. 6 shows an example of a string layout of a supercell with beveled cells.

FIG. 7 shows a simplified cross-sectional view of an array including a plurality of modules assembled in a diamond-like configuration. FIG. 7 shows a simplified cross-sectional view of an array including a plurality of modules assembled in a diamond-like configuration.

Shown is a view of the back (shadow) side of the module illustrating an exemplary electrical interconnection of the front (solar side) face end electrical contact of the scaly supercell to the junction box on the back side of the solar module .

Exemplary electrical of two or more parallel scaly supercells with front (solar side) face end electrical contacts of the supercell connected to each other and to a junction box on the back of the solar module Figure 2 shows a view of the back (shadow) side of the module, illustrating the interconnections.

Another example of two or more parallel scaly supercells with front (solar side) face end electrical contacts of the supercell connected to each other and to a junction box at the back of the solar module Of the back side (shadow) of the module illustrating various electrical interconnections.

Fragment of two supercells, illustrating the use of flexible interconnects sandwiched between overlapping ends of adjacent supercells to electrically connect the supercells in series and provide electrical connection to the junction box Cross-sectional view and perspective view. Fig. 30 shows an enlarged view of the target area of Fig. 29;

Fig. 6 shows an exemplary supercell with electrical interconnects bonded to front and back end contacts. FIG. 30B shows two of the supercells of FIG. 30A interconnected in parallel.

FIG. 7 shows a diagram of an exemplary back side metallization pattern that may be employed to form a hidden tap into a supercell as described herein. FIG. 7 shows a diagram of an exemplary back side metallization pattern that may be employed to form a hidden tap into a supercell as described herein. FIG. 7 shows a diagram of an exemplary back side metallization pattern that may be employed to form a hidden tap into a supercell as described herein.

Figure 7 illustrates an example of the use of a hidden tap with interconnects extending around the full width of the supercell. Figure 7 illustrates an example of the use of a hidden tap with interconnects extending around the full width of the supercell.

FIG. 34B shows an example of an interconnect joining to the supercell backside (FIG. 34A) end contact and the front side (FIG. 34B-34C) end contact. FIG. 34B shows an example of an interconnect joining to the supercell backside (FIG. 34A) end contact and the front side (FIG. 34B-34C) end contact. FIG. 34B shows an example of an interconnect joining to the supercell backside (FIG. 34A) end contact and the front side (FIG. 34B-34C) end contact.

Figure 17 illustrates an example of the use of a hidden tap having short interconnects that extend into the gaps between adjacent supercells but do not extend substantially inward along the long axis of a rectangular solar cell. Figure 17 illustrates an example of the use of a hidden tap having short interconnects that extend into the gaps between adjacent supercells but do not extend substantially inward along the long axis of a rectangular solar cell.

FIG. 7 illustrates an exemplary configuration of a short hidden tap interconnect that includes in-plane stress relief features. FIG. 7 illustrates an exemplary configuration of a short hidden tap interconnect that includes in-plane stress relief features. FIG. 7 illustrates an exemplary configuration of a short hidden tap interconnect that includes in-plane stress relief features. FIG. 7 illustrates an exemplary configuration of a short hidden tap interconnect that includes in-plane stress relief features. FIG. 7 illustrates an exemplary configuration of a short hidden tap interconnect that includes in-plane stress relief features. FIG. 7 illustrates an exemplary configuration of a short hidden tap interconnect that includes in-plane stress relief features. FIG. 7 illustrates an exemplary configuration of a short hidden tap interconnect that includes in-plane stress relief features. FIG. 7 illustrates an exemplary configuration of a short hidden tap interconnect that includes in-plane stress relief features. FIG. 7 illustrates an exemplary configuration of a short hidden tap interconnect that includes in-plane stress relief features. FIG. 7 illustrates an exemplary configuration of a short hidden tap interconnect that includes in-plane stress relief features. FIG. 7 illustrates an exemplary configuration of a short hidden tap interconnect that includes in-plane stress relief features. FIG. 7 illustrates an exemplary configuration of a short hidden tap interconnect that includes in-plane stress relief features. FIG. 7 illustrates an exemplary configuration of a short hidden tap interconnect that includes in-plane stress relief features.

FIG. 7 illustrates an exemplary configuration of a short hidden tap interconnect that includes out-of-plane stress relief features. FIG. 7 illustrates an exemplary configuration of a short hidden tap interconnect that includes out-of-plane stress relief features. FIG. 7 illustrates an exemplary configuration of a short hidden tap interconnect that includes out-of-plane stress relief features. FIG. 7 illustrates an exemplary configuration of a short hidden tap interconnect that includes out-of-plane stress relief features.

FIG. 7 illustrates an exemplary configuration of a short hidden tap interconnect including alignment features. FIG. 7 illustrates an exemplary configuration of a short hidden tap interconnect including alignment features. FIG. 7 illustrates an exemplary configuration of a short hidden tap interconnect including an asymmetric tab length. FIG. 7 illustrates an exemplary configuration of a short hidden tap interconnect including an asymmetric tab length.

FIG. 6 shows an exemplary solar module layout that employs a hidden tap. FIG. 6 shows an exemplary solar module layout that employs a hidden tap. FIG. 6 shows an exemplary solar module layout that employs a hidden tap. FIG. 6 shows an exemplary solar module layout that employs a hidden tap. FIG. 6 shows an exemplary solar module layout that employs a hidden tap. FIG. 6 shows an exemplary solar module layout that employs a hidden tap.

FIG. 40 shows an exemplary electrical schematic of the solar module layout of FIGS. 40 and 42A-44B.

7 illustrates the flow of current in a conductive state in an exemplary solar module having a bypass diode.

Each illustrates relative motion between solar module components resulting from thermal cycling in a direction parallel to the plurality of supercell rows and in a direction perpendicular to the plurality of supercell rows in the solar module. Each illustrates relative motion between solar module components resulting from thermal cycling in a direction parallel to the plurality of supercell rows and in a direction perpendicular to the plurality of supercell rows in the solar module.

FIG. 6A shows another exemplary solar module layout employing a hidden tap, and a corresponding electrical schematic, respectively. FIG. 6A shows another exemplary solar module layout employing a hidden tap, and a corresponding electrical schematic, respectively.

FIG. 7 illustrates an additional solar cell module layout that employs a hidden tap in combination with an embedded bypass diode. FIG. 7 illustrates an additional solar cell module layout that employs a hidden tap in combination with an embedded bypass diode.

FIG. 7 shows respectively a block diagram of a solar module providing a conventional DC voltage to a microinverter and a high voltage solar module as described herein providing a high DC voltage to the microinverter. FIG. 7 shows respectively a block diagram of a solar module providing a conventional DC voltage to a microinverter and a high voltage solar module as described herein providing a high DC voltage to the microinverter.

FIG. 7 shows an exemplary physical layout and electrical schematic of an exemplary high voltage solar module incorporating a bypass diode. FIG. 7 shows an exemplary physical layout and electrical schematic of an exemplary high voltage solar module incorporating a bypass diode.

FIG. 7 illustrates an exemplary structure of module level power management of a high voltage solar module including a scaly supercell. FIG. 7 illustrates an exemplary structure of module level power management of a high voltage solar module including a scaly supercell. FIG. 7 illustrates an exemplary structure of module level power management of a high voltage solar module including a scaly supercell. FIG. 7 illustrates an exemplary structure of module level power management of a high voltage solar module including a scaly supercell. FIG. 7 illustrates an exemplary structure of module level power management of a high voltage solar module including a scaly supercell. FIG. 7 illustrates an exemplary structure of module level power management of a high voltage solar module including a scaly supercell. FIG. 7 illustrates an exemplary structure of module level power management of a high voltage solar module including a scaly supercell. FIG. 7 illustrates an exemplary structure of module level power management of a high voltage solar module including a scaly supercell. FIG. 7 illustrates an exemplary structure of module level power management of a high voltage solar module including a scaly supercell. FIG. 7 illustrates an exemplary structure of module level power management of a high voltage solar module including a scaly supercell.

FIG. 7 illustrates an exemplary arrangement of six supercells in six parallel rows, with the ends of adjacent rows offset and serially interconnected by flexible electrical interconnects.

Fig. 1 schematically illustrates a photovoltaic system comprising a plurality of high DC voltage ground solar cell modules in electrical connection with each other and to a string inverter. FIG. 57B shows the photovoltaic system of FIG. 57A positioned on a roof.

A high DC voltage ground solar cell module having a short circuit is prevented from dissipating a significant amount of power generated by the other high DC voltage ground solar cell module at its parallel electrical connection FIG. 7 shows an arrangement of current limiting fuses and blocking diodes that may be used in A high DC voltage ground solar cell module having a short circuit is prevented from dissipating a significant amount of power generated by the other high DC voltage ground solar cell module at its parallel electrical connection FIG. 7 shows an arrangement of current limiting fuses and blocking diodes that may be used in A high DC voltage ground solar cell module having a short circuit is prevented from dissipating a significant amount of power generated by the other high DC voltage ground solar cell module at its parallel electrical connection FIG. 7 shows an arrangement of current limiting fuses and blocking diodes that may be used in A high DC voltage ground solar cell module having a short circuit is prevented from dissipating a significant amount of power generated by the other high DC voltage ground solar cell module at its parallel electrical connection FIG. 7 shows an arrangement of current limiting fuses and blocking diodes that may be used in

FIG. 6 illustrates an exemplary arrangement of electrically connecting two or more high DC voltage ground solar cell modules in parallel in a combiner box that may include a current limiting fuse and a blocking diode. FIG. 6 illustrates an exemplary arrangement of electrically connecting two or more high DC voltage ground solar cell modules in parallel in a combiner box that may include a current limiting fuse and a blocking diode.

FIG. 7 shows respectively a current versus voltage plot and a power versus voltage plot of a plurality of high DC voltage ground solar cell modules electrically connected in parallel. The plots in FIG. 60A are for the exemplary case where none of the modules include reverse biased solar cells. The plots in FIG. 60B are for the exemplary case where some of the modules include one or more reverse biased solar cells. FIG. 7 shows respectively a current versus voltage plot and a power versus voltage plot of a plurality of high DC voltage ground solar cell modules electrically connected in parallel. The plots in FIG. 60A are for the exemplary case where none of the modules include reverse biased solar cells. The plots in FIG. 60B are for the exemplary case where some of the modules include one or more reverse biased solar cells.

Figure 7 illustrates an example of a solar module that utilizes about one bypass diode per supercell. FIG. 7 illustrates an example of a solar module that utilizes a nested bypass diode. Figure 4 illustrates an exemplary configuration of bypass diodes connecting between two neighboring supercells using flexible electrical interconnects.

Figures 7A and 7B schematically illustrate side and plan views, respectively, of another exemplary cleavage tool. Figures 7A and 7B schematically illustrate side and plan views, respectively, of another exemplary cleavage tool.

FIG. 5 schematically illustrates the use of an exemplary asymmetric vacuum arrangement to control the nucleation and propagation of crevices along scribe lines when cleaving a wafer. 63A schematically illustrates the use of an exemplary symmetrical vacuum arrangement that provides less control of cleavage than the arrangement of FIG. 63A.

FIG. 62 schematically illustrates a plan view of a portion of an example vacuum manifold that may be used in the cleave tool of FIGS. 62A-62B.

FIG. 65 provides schematic illustrations of a top view and a perspective view, respectively, of the exemplary vacuum manifold of FIG. 64, with a perforated belt over it. FIG. 65 provides schematic illustrations of a top view and a perspective view, respectively, of the exemplary vacuum manifold of FIG. 64, with a perforated belt over it.

FIG. 62 schematically illustrates a side view of an exemplary vacuum manifold that may be used in the cleave tool of FIGS. 62A-62B.

Figure 1 schematically illustrates a cleaved solar cell lying on an exemplary arrangement of a perforated belt and a vacuum manifold.

1 schematically illustrates the relative position and orientation of a cleaved solar cell and an uncleaved portion of a standard sized wafer from which the solar cell is cleaved in an exemplary cleavage process.

1 schematically illustrates an apparatus and method that can continuously remove cleaved solar cells from a cleavage tool. 1 schematically illustrates an apparatus and method that can continuously remove cleaved solar cells from a cleavage tool. 1 schematically illustrates an apparatus and method that can continuously remove cleaved solar cells from a cleavage tool. 1 schematically illustrates an apparatus and method that can continuously remove cleaved solar cells from a cleavage tool. 1 schematically illustrates an apparatus and method that can continuously remove cleaved solar cells from a cleavage tool. 1 schematically illustrates an apparatus and method that can continuously remove cleaved solar cells from a cleavage tool. 1 schematically illustrates an apparatus and method that can continuously remove cleaved solar cells from a cleavage tool.

FIG. 62B provides a view from another direction of another variation of the exemplary cleave tool of FIGS. 62A-62B. FIG. 62B provides a view from another direction of another variation of the exemplary cleave tool of FIGS. 62A-62B. FIG. 62B provides a view from another direction of another variation of the exemplary cleave tool of FIGS. 62A-62B.

FIG. 70B provides a perspective view of the exemplary cleaving tool of FIGS. 70A-70C at two different steps of the cleaving process. FIG. 70B provides a perspective view of the exemplary cleaving tool of FIGS. 70A-70C at two different steps of the cleaving process.

FIG. 70C illustrates details of the perforated belt and vacuum manifold of the exemplary cleavage tool of FIGS. 70A-70C. FIG. 70C illustrates details of the perforated belt and vacuum manifold of the exemplary cleavage tool of FIGS. 70A-70C. FIG. 70C illustrates details of the perforated belt and vacuum manifold of the exemplary cleavage tool of FIGS. 70A-70C. FIG. 70C illustrates details of the perforated belt and vacuum manifold of the exemplary cleavage tool of FIGS. 70A-70C. FIG. 70C illustrates details of the perforated belt and vacuum manifold of the exemplary cleavage tool of FIGS. 70A-70C. FIG. 70C illustrates details of the perforated belt and vacuum manifold of the exemplary cleavage tool of FIGS. 70A-70C.

10A-10C illustrate details of some exemplary hole patterns that may be used for a perforated vacuum belt in the exemplary cleaving tool of FIGS. 10A-10C. 10A-10C illustrate details of some exemplary hole patterns that may be used for a perforated vacuum belt in the exemplary cleaving tool of FIGS. 10A-10C. 10A-10C illustrate details of some exemplary hole patterns that may be used for a perforated vacuum belt in the exemplary cleaving tool of FIGS. 10A-10C. 10A-10C illustrate details of some exemplary hole patterns that may be used for a perforated vacuum belt in the exemplary cleaving tool of FIGS. 10A-10C. 10A-10C illustrate details of some exemplary hole patterns that may be used for a perforated vacuum belt in the exemplary cleaving tool of FIGS. 10A-10C. 10A-10C illustrate details of some exemplary hole patterns that may be used for a perforated vacuum belt in the exemplary cleaving tool of FIGS. 10A-10C. 10A-10C illustrate details of some exemplary hole patterns that may be used for a perforated vacuum belt in the exemplary cleaving tool of FIGS. 10A-10C.

1 illustrates an exemplary frontside metallization pattern on a rectangular solar cell.

1 shows an exemplary back side metallization pattern on a rectangular solar cell. 1 shows an exemplary back side metallization pattern on a rectangular solar cell.

FIG. 76 illustrates an exemplary frontside metallization pattern on square solar cells that may be diced to form a plurality of rectangular solar cells each having a frontside metallization pattern shown in FIG. 76.

FIG. 77B illustrates an exemplary back surface metallization pattern on square solar cells that may be diced to form a plurality of rectangular solar cells each having a back surface metallization pattern shown in FIG. 77A.

FIG. 7 is a schematic view showing that conventional sized HIT solar cells are diced into narrow strip solar cells using conventional cleaving methods, resulting in a cleaved edge that promotes carrier recombination.

Figure 3 schematically illustrates the steps of an exemplary method of dicing a conventionally sized HIT solar cell into a narrow solar cell strip without a cleaved edge promoting carrier recombination. Figure 3 schematically illustrates the steps of an exemplary method of dicing a conventionally sized HIT solar cell into a narrow solar cell strip without a cleaved edge promoting carrier recombination. Figure 3 schematically illustrates the steps of an exemplary method of dicing a conventionally sized HIT solar cell into a narrow solar cell strip without a cleaved edge promoting carrier recombination. Figure 3 schematically illustrates the steps of an exemplary method of dicing a conventionally sized HIT solar cell into a narrow solar cell strip without a cleaved edge promoting carrier recombination. Figure 3 schematically illustrates the steps of an exemplary method of dicing a conventionally sized HIT solar cell into a narrow solar cell strip without a cleaved edge promoting carrier recombination. Figure 3 schematically illustrates the steps of an exemplary method of dicing a conventionally sized HIT solar cell into a narrow solar cell strip without a cleaved edge promoting carrier recombination. Figure 3 schematically illustrates the steps of an exemplary method of dicing a conventionally sized HIT solar cell into a narrow solar cell strip without a cleaved edge promoting carrier recombination. Figure 3 schematically illustrates the steps of an exemplary method of dicing a conventionally sized HIT solar cell into a narrow solar cell strip without a cleaved edge promoting carrier recombination. Figure 3 schematically illustrates the steps of an exemplary method of dicing a conventionally sized HIT solar cell into a narrow solar cell strip without a cleaved edge promoting carrier recombination. Figure 3 schematically illustrates the steps of an exemplary method of dicing a conventionally sized HIT solar cell into a narrow solar cell strip without a cleaved edge promoting carrier recombination.

5 schematically illustrates the steps of another exemplary method of dicing a conventionally sized HIT solar cell into a narrow solar cell strip that does not have cleaved edges that promote carrier recombination. 5 schematically illustrates the steps of another exemplary method of dicing a conventionally sized HIT solar cell into a narrow solar cell strip that does not have cleaved edges that promote carrier recombination. 5 schematically illustrates the steps of another exemplary method of dicing a conventionally sized HIT solar cell into a narrow solar cell strip that does not have cleaved edges that promote carrier recombination. 5 schematically illustrates the steps of another exemplary method of dicing a conventionally sized HIT solar cell into a narrow solar cell strip that does not have cleaved edges that promote carrier recombination. 5 schematically illustrates the steps of another exemplary method of dicing a conventionally sized HIT solar cell into a narrow solar cell strip that does not have cleaved edges that promote carrier recombination. 5 schematically illustrates the steps of another exemplary method of dicing a conventionally sized HIT solar cell into a narrow solar cell strip that does not have cleaved edges that promote carrier recombination. 5 schematically illustrates the steps of another exemplary method of dicing a conventionally sized HIT solar cell into a narrow solar cell strip that does not have cleaved edges that promote carrier recombination. 5 schematically illustrates the steps of another exemplary method of dicing a conventionally sized HIT solar cell into a narrow solar cell strip that does not have cleaved edges that promote carrier recombination. 5 schematically illustrates the steps of another exemplary method of dicing a conventionally sized HIT solar cell into a narrow solar cell strip that does not have cleaved edges that promote carrier recombination. 5 schematically illustrates the steps of another exemplary method of dicing a conventionally sized HIT solar cell into a narrow solar cell strip that does not have cleaved edges that promote carrier recombination.

  The following detailed description should be read with reference to the drawings in which the same reference numerals indicate the same elements throughout the different drawings. The drawings, which are not necessarily to scale, depict selected embodiments and are not intended to limit the scope of the present invention. The mode for carrying out the invention is illustrated by way of example and not limitation of the principles of the invention. The present description clearly enables one skilled in the art to make and use the present invention, and the present description includes several embodiments of the present invention, including the best mode of practicing the present invention and what is presently considered. , Adaptations, variations, alternatives, and uses.

  As used in the specification and the appended claims, the singular forms "a", "an" and "the" include plural referents unless the context clearly indicates otherwise. Also, the term "parallel" means "parallel or substantially parallel" and requires that any parallel arrangements described herein be exactly parallel. Rather, it is intended to cover some deviations from parallel geometry. The term "vertical" means "perpendicular, or substantially perpendicular" and requires that any vertical arrangement described herein be exactly perpendicular. It is intended to encompass some deviations from the geometry that is vertical rather than vertical. The term "square" is meant to be "square or nearly square" and with some deviation from a square shape, eg, chamfered (eg, rounded or otherwise end) It is intended to encompass shapes that are approximately square including the corners. The term "rectangular" is meant to be "rectangular or nearly rectangular" and with some deviation from rectangular shape, eg, chamfered (eg, rounded or otherwise end) It is intended to encompass shapes that are substantially rectangular, including the corners.

  This specification discloses a highly efficient shingled arrangement of silicon solar cells within a solar cell module, and front and back metallization patterns and interconnects for the solar cells that can be used in such an arrangement. Do. The present specification also discloses a method for manufacturing such a solar module. Solar cell modules can be advantageously employed under "one solar" (decentralized) illumination, which allows them to be used in place of conventional silicon solar cell modules, with physical dimensions and electricity Characteristics may be possessed.

  FIG. 1 shows a cross-sectional view of a string of serially connected solar cells 10 arranged in a glazed state with the ends of adjacent solar cells overlapped and electrically connected to form a supercell 100. Each solar cell 10 includes a semiconductor diode structure and a plurality of electrical contacts to the semiconductor diode structure. Thereby, when the solar cell 10 is irradiated with light, the current generated in the solar cell 10 may be provided to the external load.

  In the example described herein, each solar cell 10 is a crystalline silicon with a front (sun side) and back (shadow) side metallization pattern that provides electrical contact on opposite sides of the np junction. In a solar cell, the front surface metallization pattern is disposed on the n-type conductivity semiconductor layer, and the back surface metallization pattern is disposed on the p-type conductivity semiconductor layer. However, instead of, or in addition to the solar cells 10 in the solar modules described herein, any other suitable material system, diode structure, physical dimensions, or any other that employs electrical contact arrangements A suitable solar cell may be used. For example, the front (sun side) side metallization pattern may be disposed on a p-type conductive semiconductor layer, and the back (shadow side) side metallization pattern may be disposed on an n-type conductive semiconductor layer.

  Referring back to FIG. 1, in the supercell 100, adjacent solar cells 10 electrically connect the front metallization pattern of one solar cell to the back metallization pattern of the adjacent solar cell in the area where they overlap. Conductingly bond to each other by an electrically conductive bonding agent. Suitable electrically conductive binders may include, for example, electrically conductive adhesives, electrically conductive adhesive films and tapes, and conventional solders. Preferably, the electrically conductive bonding agent is mechanical compliant to adapt to the stress resulting from the mismatch between the coefficient of thermal expansion (CTE) of the electrically conductive bonding agent and the CTE of the solar cell (e.g. the CTE of silicon) Provide for junctions between adjacent solar cells. To provide such mechanical compliance, in some variations, the electrically conductive bonding agent is selected to have a glass transition temperature less than or equal to about 0 ° C. In order to further reduce the stress in the direction parallel to the overlapping edges of the solar cells resulting from the CTE mismatch and to accommodate that stress, the electrically conductive bonding agent is optionally a length of substantially the edge of the solar cells It can be applied only at a plurality of discrete locations along the overlapping area of the solar cells, rather than in a solid line extending across.

  The thickness measured in the direction perpendicular to the front and back surfaces of the solar cells of the conductive junction between adjacent and overlapping solar cells formed by the electrically conductive bonding agent may be, for example, less than about 0.1 mm. Such thin junctions reduce resistive losses in the interconnections between the cells and also facilitate heat flow along the supercell from any hot spots in the supercell that may appear during operation . The thermal conductivity of the junction between the solar cells may be, for example, ≧ about 1.5 watts / (meter K).

  FIG. 2A shows the front of an exemplary rectangular solar cell 10 that may be used in supercell 100. Other shapes may be used as appropriate for the solar cell 10. In the illustrated example, the front surface metallization pattern of the solar cell 10 is positioned adjacent to one of the long sides of the solar cell 10 and is substantially parallel to the long side over the length of the long side And a plurality of fingers 20 attached in a direction perpendicular to the bus bars and extending parallel to one another and substantially parallel to the short sides of the solar cell 10.

  In the example of FIG. 2A, the solar cell 10 has a length of about 156 mm and a width of about 26 mm, so that the aspect ratio (short side length / long side length) is about 1: 6. is there. Six such solar cells can be prepared on a standard 156 mm × 156 mm sized silicon wafer and then separated (diced) to provide a plurality of solar cells as shown. In another variation, eight solar cells 10 having dimensions of about 19.5 mm × 156 mm and an aspect ratio of about 1: 8 can be prepared from a standard silicon wafer. More generally, the solar cell 10 may have an aspect ratio of, for example, about 1: 2 to about 1:20, and may be prepared from a standard sized wafer or from any other suitable sized wafer.

  FIG. 3A illustrates that a quasi-square silicon solar cell wafer 45 of standard size and shape may be cut, broken or otherwise divided to form a plurality of rectangular solar cells as just described. Show the method. In this example, several full width rectangular solar cells 10L are cut from the central portion of the wafer, and in addition, several shorter rectangular solar cells 10S are cut from the edge of the wafer to chamfer the wafer. Rounded or rounded corners are discarded. The solar cell 10L can be used to form a single-width, scaly supercell, and the solar cell 10S can be used to form a narrower, scaly supercell.

  Alternatively, chamfered (eg, rounded) corners may be left on the solar cells cut from the edge of the wafer. FIGS. 2B and 2C show the front face of an exemplary “chevron” rectangular solar cell 10 substantially similar to that of FIG. 2A, but including chamfered corners left from the wafer from which the solar cell was cut. . In FIG. 2B, the bus bar 15 is positioned adjacent to the shorter one of the two long sides, extends substantially parallel to the length of the same side, and at least partially at both ends. , Extends around the beveled corner of the solar cell. In FIG. 2C, the bus bar 15 is positioned adjacent to the longer side of the two long sides, and extends substantially parallel to the same side over the length of the same side. FIGS. 3B and 3C are a plurality of solar cells 10 having a front surface metallization pattern similar to that shown in FIG. 2A and diced along the dashed lines shown in FIG. 3C, and a front surface metallization similar to that shown in FIG. 2B. FIG. 6 shows front and back views of a pseudo-square wafer 45 that may provide two beveled solar cells 10 with a pattern.

  In the exemplary front surface metallization pattern shown in FIG. 2B, the two ends of the bus bar 15 extending around the beveled corners of the cell are each located adjacent to the long side of the cell, of the bus bar It may have a width that gradually decreases (is gradually narrowed) as the distance from the portion increases. Similarly, in the exemplary frontside metallization pattern shown in FIG. 3B, the two ends of the thin conductor interconnecting the discontinuous contact pads 15 extend around the beveled corners of the solar cell and are discontinuous The contact pads are arranged along and gradually decrease as the distance from the long side of the solar cell increases. Such gradual reduction in width is optional, but can advantageously reduce the use of metal and substantially reduce shadowing of the solar cell's active area without substantially increasing resistive losses. .

  FIGS. 3D and 3E are front views of a full square wafer 47 which can be diced along the dashed lines shown in FIG. 3E to provide a plurality of solar cells 10 having a front side metallization pattern similar to that shown in FIG. 2A. The reverse view is shown.

  Chamfered rectangular solar cells may be used to form a supercell that includes only beveled solar cells. Additionally or alternatively, one or more such beveled rectangular solar cells are combined with one or more non-chamfered rectangular solar cells (eg, FIG. 2A) to form a supercell It can be used. For example, the solar cell at the end of the supercell may be a beveled solar cell, and the middle solar cell may be an unchamfered solar cell. When chamfered solar cells are used in combination with unchamfered solar cells in the supercell or more generally in the solar module, the resulting chamfered solar cells and chamfers are It may be desirable to use the dimensions of a solar cell such that the area of the front surface exposed to light during operation of the solar cell is the same. By matching the areas of the solar cells in this way, the currents generated by the beveled solar cells and the non-chamfered solar cells are matched, which means that the beveled solar cells and the non-chamfered solar cells Improve the performance of series connected strings that include both batteries. The area of the chamfered solar cell and the area of the non-chamfered solar cell cut from the same pseudo-square wafer, for example, adjust the position of the line along which wafer dicing is performed, and the chamfered solar cell The width of the solar cell in a direction perpendicular to the long axis of the solar cell may be made slightly larger than that of the unchamfered solar cell to match by compensating for the missing corner on the beveled solar cell.

  The solar module may include only supercells formed exclusively from unchamfered rectangular solar cells, or only supercells formed from chamfered rectangular solar cells, or may be chamfered solar It may only comprise supercells comprising cells and unchamfered solar cells, or it may comprise any combination of these three variants of supercells.

  In some cases, a portion of a standard sized square or pseudo-square solar cell wafer (e.g., wafer 45 or wafer 47) near the edge of the wafer is located away from the edge of the portion of the wafer Light can be converted to electricity with low efficiency. In order to improve the efficiency of the resulting rectangular solar cells, in some variations, one or more edges of the wafer are trimmed to remove low efficiency portions before the wafer is diced. The portion to be trimmed from the edge of the wafer may be, for example, about 1 mm to about 5 mm in width. Furthermore, as shown in FIGS. 3B and 3D, the two end solar cells 10 to be diced from the wafer have their front bus bars (or discontinuous contact pads) 15 along their outer edges Therefore, it can be oriented along two of the edges of the wafer. Within the supercell disclosed herein, the bus bars (or discontinuous contact pads) 15 typically have low light along those two edges of the wafer, as adjacent solar cells overlap. Conversion efficiency typically does not affect the performance of the solar cell. As a result, in some variations, the edge of a square or pseudo-square wafer oriented parallel to the short side of the rectangular solar cell is trimmed as just described, but parallel to the long side of the rectangular solar cell The edge of the wafer directed to is not trimmed. In other variations, one, two, three or four edges of a square wafer (e.g., wafer 47 of FIG. 3D) are trimmed as just described. In other variations, one, two, three, or four of the long edges of the pseudo-square wafer are trimmed as just described.

A solar cell having a long narrow aspect ratio as shown and having an area smaller than that of a standard 156 mm × 156 mm solar cell is I ² in the solar cell module disclosed herein. It may be advantageously employed to reduce R resistive power losses. In particular, the reduced area of the solar cell 10 compared to a standard sized silicon solar cell reduces the current generated by the solar cell, within the solar cell, and within the series connected string of such solar cells. Directly reduce the resistive power loss of In addition, by placing such a rectangular solar cell in the supercell such that the current passes through the supercell 100 parallel to the short sides of the solar cell, the current is semiconductor to reach the fingers 20 of the front surface metallization pattern The distance that must flow through the material can be shortened and the required finger length can be shortened, which can also reduce resistive power losses.

  As described above, bonding the overlapping solar cells 10 to one another in the overlapping region and electrically connecting the overlapping solar cells in series is compared to a series connection string of solar cells, conventionally tabbed. Shorten the electrical connection between adjacent solar cells. This also reduces resistive power losses.

  Referring back to FIG. 2A, in the illustrated example, the front metallization pattern on the solar cell 10 includes an optional bypass conductor 40 that extends parallel to and away from the bus bars 15. (Such bypass conductors may also optionally be used with the metallization patterns shown in FIGS. 2B-2C, 3B and 3D, and are also shown in FIG. 2Q in combination with discontinuous contact pads 15 rather than continuous bus bars The bypass conductors 40 interconnect the fingers 20 to electrically bypass the crevices that may be formed between the bus bars 15 and the bypass conductors 40. Such a crevice that may cut the finger 20 in a position close to the bus bar 15 may in other cases separate the area of the solar cell 10 from the bus bar 15. The bypass conductor provides an alternative electrical path between such disconnected fingers and the bus bar. The illustrated example shows a bypass conductor 40 positioned parallel to the bus bar 15 and extending approximately the entire length of the bus bar, interconnecting all the fingers 20. This arrangement may be preferred but not required. If present, the bypass conductor does not have to extend parallel to the bus bar and does not have to extend the entire length of the bus bar. Furthermore, the bypass conductor interconnects at least two fingers, but not all fingers need to be interconnected. For example, two or more short bypass conductors may be used instead of longer bypass conductors. Any suitable arrangement of bypass conductors may be used. The use of such a bypass conductor is disclosed in US patent application Ser. No. 13 / 371,790, filed on Feb. 13, 2012, entitled "Solar Cell With Metallization Compensating For Or Preventing Cracking" and filed on Feb. 13, 2012. It is explained in detail. The same patent application is incorporated herein by reference in its entirety.

  The exemplary front surface metallization pattern of FIG. 2A also includes an optional end conductor 42 that interconnects the fingers 20 at the far end of the fingers 20 opposite the bus bars 15. (Such end conductors may optionally be used with the metallization patterns shown in FIGS. 2B-2C, 3B and 3D and 2Q.) The width of the conductor 42 may be, for example, about the same as the width of the finger 20. The conductors 42 interconnect the fingers 20 to electrically bypass the crevices that may be formed between the bypass conductor 40 and the conductor 42, and thereby electrically in other cases by such crevices It provides a current path to the bus bar 15 for the area of the solar cell 10 that may be separated.

  Although some of the illustrated examples have a uniform width, the front bus bar 15 extending substantially the length of the long side of the solar cell 10, this is not required. For example, as mentioned above, the front bus bars 15 may for example be two or more, which may be arranged alongside one another along the sides of the solar cell 10, for example as shown in FIGS. 2H, 2Q and 3B. The front discontinuous contact pad 15 can be replaced. Such discontinuous contact pads may optionally be interconnected by thinner conductors extending between them, as shown for example in the drawing just touched. In such variations, the width of the contact pads, measured in a direction perpendicular to the long side of the solar cell, can be, for example, about 2 to about 20 times the width of the thin conductors interconnecting the contact pads. There may be separate (eg, small) contact pads for each finger in the front surface metallization pattern, or each contact pad may connect to two or more fingers. The front contact pad 15 may, for example, be square or have an elongated rectangular shape parallel to the edge of the solar cell. The front contact pad 15 may have a width in the direction perpendicular to the long side of the solar cell of, for example, about 1 mm to about 1.5 mm, and a length in the direction parallel to the long side of the solar cell, for example It can be about 1 mm to about 10 mm. The distance between the contact pads 15 measured in a direction parallel to the long side of the solar cell may be, for example, about 3 mm to about 30 mm.

  Alternatively, the solar cell 10 may not have both the front bus bar 15 and the discontinuous front contact pad 15 and may include only the fingers 20 in the front surface metallization pattern. In such a variant, the current collecting function which would otherwise be performed by the front bus bar 15 or the contact pad 15 instead joins the two solar cells 10 together in the overlapping configuration described above Can be implemented or partially implemented by the conductive material used in

  A solar cell that does not have both the bus bars 15 and the contact pads 15 may or may not include the bypass conductor 40. In the absence of the bus bars 15 and the contact pads 15, the bypass conductor 40 is arranged to bypass the crevice formed between the same bypass conductor and the part of the front metallization pattern which is conductively joined to the overlapping solar cells It can be done.

  A front side metallization pattern comprising bus bars or discontinuous contact pads 15, fingers 20, bypass conductors 40 (if present) and end conductors 42 (if present) is for example for such purpose It is formed from a silver paste conventionally used and can be deposited, for example, by a conventional screen printing method. Alternatively, the front side metallization pattern may be formed of electroplated copper. Any other suitable materials and processes may also be used. In the variation where the front side metallization pattern is formed of silver, the amount of silver on the solar cell by using discontinuous front contact pads 15 instead of continuous bus bars 15 along the cell edge Is reduced, which can advantageously reduce costs. In variations where the front side metallization pattern is formed of copper or other conductors cheaper than silver, a continuous bus 15 can be employed without cost penalty.

  Figures 2D through 2G, 3C and 3E show exemplary back side metallization patterns for solar cells. In these examples, the backside metallization pattern covers the discontinuous backside contact pad 25 disposed along one of the long edges of the backside of the solar cell and substantially all of the remaining backside of the solar cell And a metal contact portion 30. Within the scaly supercell, the contact pads 25 are joined, for example, to bus bars disposed along the edge of the top surface of the adjacent overlapping solar cells, or to the discontinuous contact pads, for example, two solar Connect the batteries in series. For example, each non-continuous back contact pad 25 is aligned with the corresponding non-continuous front contact pad 15 on the front of the overlapping solar cell, with an electrically conductive adhesive applied only to the non-continuous contact pad It can be joined. The discontinuous contact pads 25 may, for example, be square (FIG. 2D) or have an elongated rectangular shape parallel to the edge of the solar cell (FIGS. 2E-2G, 3C, 3E). The contact pad 25 may have a width in the direction perpendicular to the long side of the solar cell of, for example, about 1 mm to about 5 mm, and a length in the direction parallel to the long side of the solar cell of, for example, about 1 mm to It may be about 10 mm. The distance between the contact pads 25 measured in a direction parallel to the long side of the solar cell may be, for example, about 3 mm to about 30 mm.

  The contacts 30 may be formed, for example, of aluminum and / or electroplated copper. The formation of the aluminum back contact 30 typically results in a back surface field that reduces back surface recombination within the solar cell, thereby improving solar cell efficiency. If contact 30 is formed from copper rather than aluminum, contact 30 may be used in combination with other passivation schemes (eg, aluminum oxide) to reduce back surface recombination as well. The discontinuous contact pads 25 can be formed, for example, from a silver paste. By using discontinuous silver contact pads 25 instead of continuous silver contact pads along the edge of the cell, the amount of silver in the backside metallization pattern is reduced, which has an advantage in cost It can be reduced.

  Furthermore, to reduce back surface recombination, when the solar cell relies on the back surface field provided by the formation of aluminum contacts, it uses discrete silver contacts rather than continuous silver contacts. By doing this, the solar cell efficiency can be improved. This is because the silver back contact does not provide a back surface field, thus promoting carrier recombination and tending to cause dead volume in the solar cell above the silver contact. As with conventional ribbon tabbed solar cell strings, their dead volume was typically shaded by the ribbon and / or bus bars on the front of the solar cell and thus did not result in any additional efficiency loss . However, in the solar cells and supercells disclosed herein, the volume of the solar cell above the backside silver contact pad 25 is typically not shadowed by any front side metallization and the silver backside Any dead volume resulting from the use of the metallization reduces the efficiency of the cell. Thus, by using discontinuous silver contact pads 25 instead of continuous silver contact pads along the edge of the back of the solar cell, the volume of any corresponding dead zone is reduced and the efficiency of the solar cell is increased. Increase.

  In variations where the back surface field is not relied upon to reduce back surface recombination, the back surface metallization pattern extends across the length of the solar cell rather than the discontinuous contact pads 25, as shown for example in FIG. 2Q. A continuous bus bar 25 can be employed. Such bus bars 25 may be formed, for example, from tin or silver.

  Another variation of the backside metallization pattern may employ a discontinuous tin contact pad 25. A variation of the back side metallization pattern may employ finger contacts similar to those shown in the front side metallization pattern of FIGS. 2A-2C, and may not have contact pads and bus bars.

  Although the particular exemplary solar cells shown in the drawings are described as having a particular combination of front and back metallization patterns, more generally, any suitable combination of front and back metallization patterns is It can be used. For example, one suitable combination is a silver front metallization pattern including discontinuous contact pads 15, fingers 20 and an optional bypass conductor 40, and discontinuities with aluminum contacts 30. A backside metallization pattern may be employed, including silver contact pads 25. Another suitable combination includes a copper front metallization pattern including a continuous bus bar 15, fingers 20 and an optional bypass conductor 40, and a continuous bus bar 25 and copper contacts 30. A backside metallization pattern may be employed.

  In the supercell manufacturing process (described in more detail below), the electrically conductive bonding agent used to join adjacent overlapping solar cells in the supercell is at the edge of the front or back of the solar cell (not It may be distributed only on contact pads which are continuous or continuous, and may not be distributed on the peripheral portion of the solar cell. This reduces the use of the material and may reduce or adapt to the stress resulting from the CTE mismatch between the electrically conductive bonding agent and the solar cell, as described above. However, during or after deposition and before curing, a portion of the electrically conductive bonding agent may tend to spread over the contact pad and onto the peripheral portion of the solar cell. For example, the bonding resin portion of the electrically conductive bonding agent may be separated from the contact pad and drawn by capillary forces onto a plurality of adjacent portions of the surface of the solar cell where there are many rough or small holes. In addition, during the deposition process, a portion of the conductive bonding agent may break off the contact pad, instead being deposited on, and possibly extending from, a plurality of adjacent portions of the solar cell surface It may end up. This spreading and / or incorrect deposition of the conductive bonding agent may weaken the bonding between the overlapping solar cells, and the conductive bonding agent may be spread over or incorrectly deposited. It may damage the club. Such spreading of the electrically conductive bond is reduced, for example, by the metallization pattern forming a dam or barrier near or around each contact pad to keep the conductive bond substantially in place. Or may be prevented.

  As shown in FIGS. 2H-2K, for example, the front surface metallization pattern acts as a dam that encloses the corresponding discrete contact pads 15 with each barrier 17 and forms a moat between the contact pads and the barriers. In the state, the contact pad 15 may include the finger 20 and the barrier 17. Portions 19 of uncured conductive adhesive 18 that may flow away from the contact pad or dislodge from the contact pad when dispensed onto the solar cell may be contained in the moat by the barrier 17. This further prevents the conductive adhesive from spreading out from the contact pads on the peripheral part of the cell. Barrier 17 may be formed, for example, from the same material (eg, silver) as finger 20 and contact pad 15, and may be, for example, about 10 microns to about 40 microns in height, for example, about 30 microns in width. It may be about 100 microns. The moat formed between the barrier 17 and the contact pad 15 may be, for example, about 100 microns to about 2 mm in width. Although the illustrated example includes only a single barrier 17 around each front contact pad 15, in other variations two or more such barriers, for example, around each contact pad Can be positioned concentrically. The front contact pad and the one or more surrounding barriers may form, for example, a shape similar to a "bulls-eye" target. As shown in FIG. 2H, for example, the barriers 17 may interconnect with the fingers 20 and with thin conductors interconnecting the contact pads 15.

  Similarly, as shown in FIGS. 2L-2N, for example, the back side metallization pattern covers substantially all of the back side contact pads 25 (eg, made of silver) and the remaining back side of the solar cell (eg, , Aluminum), and a barrier 27 (eg, silver) each acting as a dam surrounding the corresponding back contact pad 25 and forming a moat between the contact pad and itself. obtain. As shown, a portion of the contact portion 30 may fill the moat. A portion of the uncured conductive adhesive that may flow away from the contact pad 25 or dislodged from the contact pad when dispensed onto the solar cell may be contained in the moat by the barrier 27. This further prevents the conductive adhesive from spreading out from the contact pads on the peripheral part of the cell. The barrier 27 may, for example, be about 10 microns to about 40 microns in height, for example, about 50 microns to about 500 microns in width. The moat formed between the barrier 27 and the contact pad 25 may be, for example, about 100 microns to about 2 mm in width. Although the illustrated example includes only a single barrier 27 around each back contact pad 25, in other variations two or more such barriers may be provided, for example, around each contact pad. Can be positioned concentrically. The back contact pad and the one or more surrounding barriers may form, for example, a shape similar to a "bulls-eye" target.

  A continuous bus bar or contact pad extending substantially the length of the edge of the solar cell may also be surrounded by a barrier that prevents the spreading of the conductive adhesive. For example, FIG. 2Q shows such a barrier 27 surrounding the back bus bar 25. The front bus bar (eg, bus bar 15 of FIG. 2A) may be similarly surrounded by the barrier. Similarly, rather than being individually surrounded by separate barriers, rows of multiple front or back contact pads may be surrounded by such barriers as a group.

  As just described, rather than surrounding the bus bar or one or more contact pads, the front metallization pattern or the back metallization pattern feature locates the bus bar or contact pad between the barrier and the overlapping edge of the solar cell In the as-formed state, a barrier can be formed that extends substantially the length of the solar cell in a direction parallel to the edge of the solar cell. Such a barrier may serve two roles as a bypass conductor (described above). For example, in FIG. 2R, the bypass conductor 40 provides a barrier that helps to prevent the uncured conductive adhesive bond on the contact pad 15 from spreading over the active area of the front of the solar cell. A similar arrangement can be used for the backside metallization pattern.

  The barrier to the spread of the conductive adhesive bond may form a moat apart from the contact pads or bus bars, just as described, but this is not required. Such barriers may alternatively abut the contact pads or bus bars, for example as shown in FIG. 2O or 2P. In such variations, the barrier is preferably higher than the contact pad or bus bar to keep the uncured conductive adhesive bond on the contact pad or bus bar. Although Figures 2O and 2P show a portion of the front side metallization pattern, similar arrangements can be used for the back side metallization pattern.

  A barrier to the spread of the conductive adhesive, and / or a moat between such a barrier and the contact pad or bus bar, and any conductive adhesive that has spread inside such moat, is optionally super Adjacent solar cells in the cell may lie in an overlapping area of the solar cell surface and thus be hidden from view and shielded from exposure to solar radiation.

  Alternatively, or in addition to the use of a barrier as just described, the electrically conductive bonding agent may be deposited using a mask or deposited by any other suitable method (eg screen printing) It is possible to require a smaller amount of electrically conductive bonding agent, which allows for deposition and thus extends beyond the contact pad or is less likely to come off the contact pad during deposition.

  More generally, solar cell 10 may employ any suitable front and back metallization patterns.

  FIG. 4A shows a portion of the front surface of an exemplary rectangular supercell 100 including a solar cell 10 as shown in FIG. 2A arranged in a square pattern as shown in FIG. As a result of the scaly geometry, there is no physical gap between the pairs of solar cells 10. In addition, while the bus bars 15 of the solar cells 10 at one end of the supercell 100 are visible, the bus bars (or front contact pads) of the other solar cells are hidden below the overlapping portions of adjacent solar cells. As a result, the supercell 100 efficiently uses the area it occupies in the solar module. In particular, the larger part of the area compared to that of a conventional tabbed solar cell arrangement and a solar cell arrangement comprising a large number of visible bus bars on the irradiated surface of the solar cell It can be used to generate. 4B-4C show front and back views, respectively, of another exemplary supercell 100 that includes a plurality of predominantly beveled chevron rectangular silicon solar cells but otherwise is similar to that of FIG. 4A. It shows.

  In the example illustrated in FIG. 4A, the bypass conductors 40 are hidden in the overlapping portions of adjacent cells. Alternatively, solar cells comprising bypass conductor 40 may overlap similarly to those shown in FIG. 4A without covering the bypass conductor.

  The exposed front bus bar 15 at one end of the supercell 100 and the back side metallization of the solar cell at the other end of the supercell 100 may be supercelled to other supercells and / or other electrical components as desired. The negative and positive (end) end contacts that can be used to electrically connect 100 are provided to the supercell.

  Adjacent solar cells in supercell 100 may overlap in any suitable amount, for example, about 1 millimeter (mm) to about 5 mm.

  As shown in FIGS. 5A-5G, for example, a scaly supercell as just described may effectively fill the area of the solar module. Such solar modules may be, for example, square or rectangular. A rectangular solar module as illustrated in FIGS. 5A-5G has a short side, for example about 1 meter in length, and a long side, for example about 1.5 to about 2.0 meters in length. It can. Any other suitable shape and size may be used for the solar module. Any suitable arrangement of supercells within the solar module may be used.

  Within the square or rectangular solar modules, the supercells are typically arranged in rows parallel to the short sides or long sides of the solar modules. Each row may include one, two, or more supercells arranged end to end. The supercell 100 forming part of such a solar module may include any suitable number of solar cells 10 and may be of any suitable length. In some variations, the supercells 100 are each approximately equal in length to the length of the short side of the rectangular solar module of which they are a part. In another variant, the supercells 100 are each approximately equal in length to the half length of the short side of the rectangular solar module of which they are a part. In another variation, the supercells 100 are each approximately equal in length to the length of the long side of the rectangular solar module of which they are a part. In another variant, the supercells 100 are each approximately equal in length to the length of one half of the long side of the rectangular solar module of which they are a part. The number of solar cells needed to make supercells of these lengths will, of course, depend on the size of the solar modules, the size of the solar cells, and the amount of overlap between adjacent solar cells. Any other suitable length may be used for the supercell.

  In variations where the length of the supercell 100 is approximately equal to the length of the short side of the rectangular solar module, the supercell may, for example, have 56 rectangular suns having dimensions of about 19.5 millimeters (mm) by about 156 mm. The cells may be included with adjacent solar cells overlapping for about 3 mm. Eight such rectangular solar cells can be separated from a conventional square or pseudo-square 156 mm wafer. Alternatively, such supercells may include, for example, 38 rectangular solar cells having dimensions of about 26 mm by about 156 mm, with adjacent solar cells overlapping by about 2 mm. Six such rectangular solar cells can be separated from a conventional square or pseudo-square 156 mm wafer. In variations where the length of the supercell 100 is approximately equal to the length of the short half of the rectangular solar module, the supercell has, for example, 28 pieces having dimensions of about 19.5 millimeters (mm) by about 156 mm. Rectangular solar cells may be included with adjacent solar cells overlapping for about 3 mm. Alternatively, such a supercell may include, for example, 19 rectangular solar cells having dimensions of about 26 mm by about 156 mm, with adjacent solar cells overlapping by about 2 mm.

  In variations where the length of the supercell 100 is approximately equal to the length of the long side of the rectangular solar module, the supercell may, for example, have 72 rectangular solar cells having dimensions of about 26 millimeters (mm) by about 156 mm. The adjacent solar cells may include about 2 mm in an overlapping state. In a variant in which the length of the supercell 100 is approximately equal to the length of one half of the long side of the rectangular solar module, the supercell adjoins, for example, 36 rectangular solar cells having the dimensions About 2 mm of overlapping solar cells may be included in an overlapping state.

  FIG. 5A shows an exemplary rectangular solar module 200 including twenty rectangular supercells 100 each having a length approximately equal to the length of one half of the short side of the solar module. The supercells are arranged in pairs and connected end to end, so that ten supercell rows are oriented with the rows and the long sides of the supercells parallel to the short sides of the solar module. It is formed in the In other variations, each supercell row may include three or more supercells. Also, similarly configured solar modules may include more or fewer supercell rows than shown in this example. (For example, FIG. 14A shows a solar module that includes 24 rectangular supercells arranged in 12 rows of 2 supercells each.)

  In the variation where the supercell 100 in each row is arranged such that at least one of the supercells in each row has a front end contact on the end of the supercell adjacent to the other supercell in that row, FIG. A gap 210 shown in FIG. 1 facilitates electrical contact with the front end contacts of the supercell (eg, exposed bus bars or discontinuous contacts 15) along the centerline of the solar module. For example, two supercells in a row have front end contacts with one supercell along the centerline of the solar module and the other supercell with back end contacts along the centerline of the solar module. It can be arranged in the closed state. In such an arrangement, the two supercells in a row are joined to the front end contacts of one supercell and to the back end contacts of the other supercell, arranged along the centerline of the solar module Electrical connections may be made in series by means of interconnects. (See, for example, FIG. 8C described below.) In variations where each supercell row includes three or more supercells, there may be additional gaps between the supercells, as well as in the solar module. Electrical contact with the front end contacts located away from the side may be facilitated.

  FIG. 5B shows an exemplary rectangular solar module 300 comprising ten rectangular supercells 100 each having a length approximately equal to the length of the short side of the solar module. The supercells are arranged in ten parallel rows, with the long side oriented parallel to the short side of the module. A similarly configured solar module may include more or less rows of supercells of such side lengths than shown in this example.

  FIG. 5B also shows how the solar module 200 of FIG. 5A would look if there were no gaps between adjacent supercells in the plurality of supercell rows in the solar module 200. The gaps 210 in FIG. 5A can be removed, for example, by arranging the supercells such that both supercells in each row have back end contacts along the centerline of the module. In this case, the supercells may be arranged substantially abutting one another with little or no additional gap between them, as it is not necessary to approach the front of the supercell along the center of the module. Alternatively, two supercells 100 in a row, one with front end contacts along the sides of the module and the other end contact with the back end along the centerline of the module, the other of the modules There may be front end contacts along the centerline, and back end contacts along the opposite side of the module, with adjacent ends of the supercell being arranged in an overlapping manner. The flexible interconnects are sandwiched between the overlapping ends of the supercell without shadowing any portion of the front of the solar module, and one of the front end contacts of the supercell and the back of the other supercell Electrical connections may be provided to the end contacts. These two approaches may be used in combination for rows containing three or more supercells.

  The supercells and supercell rows shown in FIGS. 5A-5B may be interconnected by any suitable combination of series and parallel electrical connections, for example, as further described below with respect to FIGS. 10A-15. The interconnections between the supercells may be established using flexible interconnections, for example, as described below with respect to FIGS. 5C-5G and subsequent figures. As illustrated by many of the examples described herein, the supercells in the solar modules described herein are interconnected by a combination of series and parallel connections to form a conventional solar module An output voltage may be provided to the module that is substantially the same as In such cases, the output current from the solar module may also be substantially the same as that of the conventional solar module. Alternatively, as discussed further below, the supercells in the solar modules may be interconnected to provide substantially higher output voltages from the solar modules than provided by conventional solar modules.

  FIG. 5C shows an exemplary rectangular solar module 350 comprising six rectangular supercells 100 each having a length approximately equal to the length of the long side of the solar module. The supercells are arranged in six parallel rows, with the long side oriented parallel to the long side of the module. A similarly configured solar module may include more or less rows of supercells of such side lengths than shown in this example. In this example (and in some of the following examples), each supercell comprises 72 rectangular solar cells, each having a width equal to approximately 1/6 of the width of a 156 mm square or pseudo-square wafer. Any other suitable number of rectangular solar cells of any other suitable dimensions may also be used. In this example, the front end contacts of the supercell are electrically connected to one another with the flexible interconnect 400 positioned adjacent the edge of one short side of the module and extending parallel to the same edge. The back end contacts of the supercell are likewise connected to one another by means of flexible interconnects which are located behind the solar module and adjacent to the other short side edge and extend parallel to the same edge. The backside interconnects are hidden from view in FIG. 5C. This arrangement electrically connects six module length supercells in parallel. Details of the flexible interconnects in this and other solar module configurations, and their placement, are described in more detail below with respect to FIGS. 6-8G.

  FIG. 5D shows an exemplary rectangular solar module 360 including twelve rectangular supercells 100 each having a length approximately equal to the length of one half of the long side of the solar module. The supercells are arranged in pairs and connected end to end so that the six supercell rows, with the rows and the long sides of the supercells, are oriented parallel to the long sides of the solar module It is formed in the In other variations, each supercell row may include three or more supercells. Also, similarly configured solar modules may include more or fewer supercell rows than shown in this example. In this example (and in some of the following examples), each supercell comprises 36 rectangular solar cells, each having a width equal to approximately 1/6 of the width of a 156 mm square or pseudo-square wafer. Any other suitable number of rectangular solar cells of any other suitable dimensions may also be used. The gap 410 facilitates establishing electrical contact to the front end contact of the supercell 100 along the centerline of the solar module. In this example, a flexible interconnect 400 positioned adjacent to and extending parallel to one short side edge of the module electrically interconnects the six front end contacts of the supercell. Similarly, a flexible interconnect located behind and adjacent to the other short side edge of the module and extending parallel to the same edge electrically connects the back end contacts of the other six supercells . A flexible interconnect (not shown in this figure) positioned along the gap 410 interconnects each pair of supercells in a row in series, optionally laterally extending, adjacent Interconnect each other's rows in parallel. This arrangement electrically connects the six supercell rows in parallel. Optionally, in the first group of supercells, the first supercell in each row is electrically connected in parallel with the first supercell in each row of the other rows, and in the second group of supercells, The two supercells are electrically connected in parallel with the second supercell in each row of the other rows, and the two groups of supercells are electrically connected in series. The latter arrangement allows each of the two groups of supercells to be individually paralleled with bypass diodes.

  Detail A of FIG. 5D identifies the location of the cross-section shown in FIG. 8A of the interconnection of the back end contacts of the supercell along the edge of one short side of the module. Detail B likewise locates the cross-section shown in FIG. 8B of the interconnection of the front end contacts of the supercell along the edge of the other short side of the module. Detail C specifies the position of the cross-over shown in FIG. 8C of the series interconnection of supercells in a row along the gap 410.

  FIG. 5E shows a view of an exemplary rectangular solar module 370 configured similarly to that of FIG. 5C. The difference is that, in this example, all of the solar cells forming the supercell are chevron solar cells that include chamfered corners that correspond to the corners of the pseudo-square wafer from which the solar cells are separated.

  FIG. 5F shows another exemplary rectangular solar module 380 configured similarly to that of FIG. 5C. The difference is that, in this example, the solar cells forming the supercell comprise a mixture of chevron solar cells and rectangular solar cells arranged to reproduce the shape of the pseudo square wafer from which they were separated. In the example of FIG. 5F, the chevron solar cells are rectangular solar cells so that the active areas to which the chevron solar cells and the rectangular solar cells are exposed to solar radiation during the operation of the module are the same, thus the currents are matched. The cells may be wider in the direction perpendicular to their long axes to compensate for missing corners on the chevron cells.

  FIG. 5G shows another exemplary rectangular solar module configured similarly to that of FIG. 5E (ie, including only chevron solar cells). The difference is that within the solar module of FIG. 5G, adjacent chevron solar cells in the supercell are arranged as mirror images of one another such that their overlapping edges have the same length. This maximizes the length of each overlapping link, thereby facilitating the flow of heat through the supercell.

  Another configuration of the rectangular solar module is one or more supercell rows formed with only rectangular (not chamfered) solar cells and one or more supercells formed with chamfered solar cells only And cell rows. For example, a rectangular solar module may be configured similar to that of FIG. 5C except that it has two outer supercell rows, each of which is replaced with a supercell row formed only of beveled solar cells. The beveled solar cells in the rows may be arranged, for example, as mirror image pairs as shown in FIG. 5G.

  In the exemplary solar modules shown in FIGS. 5C-5G, the rectangular solar cells forming the supercell have an active area of about 1/6 of the active area of conventional sized solar cells, so along each supercell row The current is about 1/6 of the current in a conventional solar module of the same area. However, in these examples, the six supercell rows are electrically connected in parallel, so the exemplary solar module may generate a total current equal to the total current generated by a conventional solar module of the same area. This facilitates replacing the conventional solar module with the exemplary solar module of FIGS. 5C-5G (and the other examples described below).

  FIG. 6 illustrates in more detail FIGS. 5C-5G an exemplary arrangement of three supercell rows interconnected by flexible electrical interconnects such that the supercells in each row are in series with one another and the rows are in parallel with one another. Show. These may be, for example, three rows in the solar module of FIG. 5D. In the example of FIG. 6, each supercell 100 has a flexible interconnect 400 conductively bonded to its front end contact and another flexible interconnect conductively bonded to its back end contact. The two supercells in each row are electrically connected in series by a shared flexible interconnect that is conductively bonded to the front end contacts of one supercell and the back end contacts of the other supercell. Each flexible interconnect is positioned adjacent to the end of its mating supercell, extends parallel to the same end, extends laterally beyond the supercell, and on the supercell in an adjacent row Conducting bonds to the flexible interconnects may be used to electrically connect adjacent rows in parallel. The dotted lines in FIG. 6 represent the portion of the flexible interconnect that is hidden from view by the overlying portion of the supercell, or the portion of the supercell that is obscured from view by the portion that overlies the flexible interconnect. It depicts a part.

  The flexible interconnect 400 may be conductively bonded to the supercell, for example, with an electrically conductive bond having mechanical compliance as described above for use in overlapping solar cell bonding. Optionally, the electrically conductive bonding agent is not in the form of a solid line extending substantially the length of the edge of the supercell, but only at discrete locations along the edge of the supercell. Can reduce or adapt to stresses parallel to the edge of the supercell resulting from a mismatch between the coefficient of thermal expansion of the conductive bonding agent or interconnect and the coefficient of thermal expansion of the supercell obtain.

  Flexible interconnect 400 may be formed, for example, of a thin copper plate, or may include a thin copper plate. The flexible interconnect 400 is optionally configured to be patterned or otherwise enhance mechanical compliance (flexibility) both in a direction perpendicular and parallel to the edge of the supercell, The stress in the direction perpendicular to and parallel to the edge of the supercell can be reduced or can result from the mismatch between the CTE of the interconnect and the CTE of the supercell. Such patterning may include, for example, slits, slots, or holes. The plurality of conductive portions of interconnect 400 may have a thickness of, for example, less than about 100 microns, less than about 50 microns, less than about 30 microns, or less than about 25 microns to enhance the flexibility of the interconnects. obtain. The mechanical compliance of the flexible interconnect and its connection to the supercell is during the lamination process described in more detail below with respect to how the interconnecting supercell manufactures a glazed solar cell module. It should be sufficient to withstand the stress resulting from the CTE mismatch and the stress resulting from the CTE mismatch during the temperature cycling test between about -40 ° C and about 85 ° C.

  Preferably, the flexible interconnects 400 have a resistance to current flow in a direction parallel to the end of their mating supercell less than or equal to about 0.015 ohms, less than about 0.012 ohms Low, or equal to, or less than or equal to about 0.01 ohms.

  FIG. 7A illustrates some exemplary configurations identified by reference numbers 400A-400T, which may be suitable for flexible interconnect 400. FIG.

  As shown in the cross-sectional views of FIGS. 8A-8C, for example, the solar modules described herein typically include a supercell and one or more encapsulant materials 4101, a transparent front sheet 420 and a back surface. The laminated structure in the state of being sandwiched between the sheet 430 is included. The transparent front sheet can be, for example, glass. Optionally, the backsheet may also be transparent, which may allow two-sided operation of the solar module. The back sheet can be, for example, a polymer sheet. Alternatively, the solar module may be a glass-glass module in which both the front and back sheets are glass.

  The cross-sectional view of FIG. 8A (detail A from FIG. 5D) is conductively bonded to the back end contact of the supercell near the edge of the solar module, hidden from view from the front of the solar module, and inward below the supercell. An example of an extending flexible interconnect 400 is shown. An additional strip of encapsulant may be disposed between the interconnect 400 and the back of the supercell, as shown.

  The cross-sectional view of FIG. 8B (detail B from FIG. 5B) shows an example of a flexible interconnect 400 conductively bonded to the front end contact of the supercell.

  The cross-sectional view of FIG. 8C (detail C from FIG. 5B) shows a conductive junction between the front end contact of one supercell and the back end contact of the other supercell to electrically connect two supercells in series. An example of a shared shared flexible interconnect 400 is shown.

  The flexible interconnects that electrically connect to the front end contacts of the supercell can be configured or arranged to occupy only a narrow width of the front of the solar module, which can be located, for example, adjacent to the edge of the solar module. The area of the front of the module occupied by such interconnects may be as narrow as, for example, ≦ about 10 mm, ≦ about 5 mm, or ≦ about 3 mm in the direction perpendicular to the edge of the supercell. In the arrangement shown in FIG. 8B, for example, the flexible interconnect 400 can be configured to extend beyond the end of the supercell by such distance or less. 8D-8G show additional examples of arrangements in which the flexible interconnects electrically connected to the front end contacts of the supercell may occupy only the narrow width of the front of the module. Such an arrangement facilitates efficient use for the electrical generation of the frontal area of the module.

  FIG. 8D shows a flexible interconnect 400 conductively bonded to the distal front contact of the supercell and folded to the back of the supercell around the edge of the supercell. An insulating film 435, which may be pre-coated on the flexible interconnect 400, may be disposed between the flexible interconnect 400 and the back of the supercell.

  FIG. 8E shows a flexible interconnect 400 including a thin narrow ribbon 440 conductively bonded to the distal front contact of the supercell and to a thin wide ribbon 445 extending behind the back of the supercell. An insulating film 435, which may be pre-coated on the ribbon 445, may be disposed between the ribbon 445 and the back surface of the supercell.

  FIG. 8F shows a flexible interconnect 400 bonded to the distal front contact of the supercell and pressed into a flat coil that occupies only a narrow width on the front of the solar module.

  FIG. 8G shows a flexible interconnect 400 including a thin ribbon section conductively bonded to the distal front contact of the supercell, and a thick cross-sectional portion located adjacent to the supercell.

  In Figures 8A-8G, the flexible interconnect 400 may extend along the entire length of the edge of the supercell (e.g., into the page of the drawing), as shown for example in Figure 6.

  Optionally, in other cases a portion of the flexible interconnect 400 visible from the front of the module is covered with a dark film or coating or otherwise colored to provide normal color vision Can reduce the visible contrast between the interconnect and the supercell, as perceived by a person having the For example, in FIG. 8C, an optional black film or coating 425 covers a portion of interconnect 400 that would otherwise be visible from the front of the module. Portions of the otherwise visible interconnect 400 shown in other figures may be similarly covered or colored.

  Conventional solar modules typically include three or more bypass diodes with each bypass diode connected in parallel with a series connected group of 18 to 24 silicon solar cells. This is done to limit the amount of power that can be dissipated as heat in a reverse biased solar cell. The solar cell may be reverse biased due to, for example, defects that reduce the ability to pass current generated in the string, a dirty front, or uneven illumination. The heat generated in a reverse biased solar cell depends on the voltage across the solar cell and the current through the solar cell. If the voltage across the reverse biased solar cell exceeds the solar cell's breakdown voltage, the heat dissipated in the cell will be equal to the breakdown voltage multiplied by the total current generated in the string. . Silicon solar cells typically have a breakdown voltage of 16 to 30 volts. As each silicon solar cell produces a voltage of about 0.64 volts in operation, a string of more than 24 solar cells can produce a voltage above the breakdown voltage in the reverse biased solar cells.

  It is not easy to transfer heat away from the hot solar cells in a conventional solar module where the solar cells are separated from one another and interconnected by a ribbon. As a result, the power dissipated in the breakdown voltage solar cells can create hot spots in the solar cells that cause considerable thermal damage, possibly ignition. Thus, in a conventional solar module, a bypass diode for each group of 18 to 24 series connected solar cells is used to ensure that any solar cells in the string can not be reverse biased beyond the breakdown voltage in a conventional solar module is necessary.

  Applicants have found that heat is easily transferred along the silicon supercell through thin electrical and thermally conductive junctions between adjacent and overlapping silicon solar cells. Furthermore, the supercells described herein typically have rectangular solar cells each having a smaller active area (e.g., 1/6) than that of conventional solar cells. Thus, the current through the supercell in a solar module described herein is typically less than the current through a string of conventional solar cells. Furthermore, the rectangular aspect ratio of the solar cells typically employed herein enlarges the area of thermal contact between adjacent solar cells. As a result, the amount of heat dissipated in the reverse biased solar cell at breakdown voltage is reduced and heat is easily spread through the supercell and the solar module without creating dangerous hot spots. Thus, the applicant has found that a solar module formed from a supercell as described herein may employ far fewer bypass diodes than previously considered necessary.

  For example, in some variations of solar modules as described herein, N> 25 solar cells, N ≧ about 30 solar cells, N ≧ about 50 solar cells, N ≧ about 70 Single solar cell or a group of less than N solar cells are individually electrically connected in parallel with the bypass diode in the supercell, with one solar cell or supercell comprising N ≧ about 100 solar cells It can be adopted without doing. Optionally, the entire supercell of these lengths may be electrically connected in parallel with a single bypass diode. Optionally, supercells of these lengths may be employed without bypass diodes.

  Several additional and optional design features make solar modules employing supercells as described herein more resistant to the heat dissipated in reverse biased solar cells It can be Referring back to FIGS. 8A-8C, the encapsulant 4101 can be or can include a thermoplastic olefin (TPO) polymer. TPO encapsulant is more stable to light and heat than standard ethylene vinyl acetate (EVA) encapsulant. EVA is browned with temperature and ultraviolet light, leading to issues with hot spots generated by cells that limit the current. These issues are mitigated or avoided by the TPO encapsulant. Additionally, the solar module may have a glass-glass structure in which both the transparent front sheet 420 and the back sheet 430 are glass. Such glass-glass allows solar modules to operate safely at higher temperatures than conventional polymer backsheets can withstand. Furthermore, the junction box may be mounted on one or more edges of the solar module rather than behind the solar module. Here the junction box will add an additional thermal isolation layer to the module solar cells above it.

  FIG. 9A shows an exemplary rectangular solar module comprising six rectangular scaly supercells arranged in six rows extending the length of the long side of the solar module. The six supercells are electrically connected to one another and in parallel with bypass diodes arranged in the junction box 490 on the back of the solar module. Electrical connection between the supercell and the bypass diode is established through the ribbon 450 embedded in the laminated structure of the module.

  FIG. 9B illustrates another exemplary rectangular solar module that includes six rectangular scaly supercells arranged in six rows extending the length of the long side of the solar module. The supercells are electrically connected in parallel with one another. Separate positive terminal connection boxes 490P and negative terminal connection boxes 490N are disposed on the back of the solar module at opposite ends of the solar module. The supercell is electrically connected in parallel with a bypass diode located in one of the junction boxes by an external cable 455 extending between the junction boxes.

  9C-9D show six rectangular scaly supercell-like supercells arranged in six rows extending across the length of the long side of the solar module in a laminated structure including glass front and back sheets Fig. 6 illustrates an exemplary glass-glass rectangular solar module including: The supercells are electrically connected in parallel with one another. Separate positive terminal connection boxes 490P and negative terminal connection boxes 490N are attached to the opposite edges of the solar module.

  Super-Like Supercell is unique for module layout with respect to module level power management devices (eg, DC / AC micro-inverters, DC / DC module power optimizers, voltage intelligence and smart switches, and related devices) Create an opportunity. The main feature of the module level power management system is power optimization. Supercells as described and employed herein can generate higher voltages than traditional panels. In addition, the layout of the supercell module may further divide the module. Both higher voltages and further partitioning create potential benefits for power optimization.

  FIG. 9E illustrates one exemplary structure of module level power management using a ground supercell. In the figure, the exemplary rectangular solar module comprises six rectangular grid-like supercells arranged in six rows extending over the length of the long side of the solar module. The three pairs of supercells are individually connected to the power management system 460, which allows more personalized power optimization of the modules.

  FIG. 9F illustrates another exemplary structure of module level power management using a ground supercell. In the figure, the exemplary rectangular solar module comprises six rectangular grid-like supercells arranged in six rows extending over the length of the long side of the solar module. The six supercells are individually connected to the power management system 460, which allows for even more personalized power optimization of the modules.

  FIG. 9G illustrates another exemplary structure of module level power management using a ground supercell. In the figure, an exemplary rectangular solar module includes six or more rectangular scaly supercells 998 arranged in six or more rows. Here, three or more super cell pairs can be separately connected to the bypass diode or power management system 460 to enable even more personalized power optimization of the modules.

  FIG. 9H illustrates another exemplary structure of module level power management using a ground supercell. In the figure, an exemplary rectangular solar module includes six or more rectangular scaly supercells 998 arranged in six or more rows. Here, every two super cells are connected in series, and all pairs are connected in parallel. A bypass diode or power management system 460 is connected in parallel with all the pairs, which allows power optimization of the module.

In some variations, module level power management makes it possible to remove all bypass diodes on the solar module while still eliminating the risk of hot spots. This is achieved by integrating voltage intelligence at the module level. By monitoring the voltage output of the solar cell circuitry (eg, one or more supercells) within the solar module, the “smart switch” power management device determines if the circuitry includes any reverse biased solar cells. It can. If a reverse biased solar cell is detected, the power management device can disconnect the corresponding circuit from the electrical system, for example using a relay switch or other component. For example, if the voltage of the solar cell circuit being monitored falls below a predetermined threshold (V _Limit ), the power management device shuts off the circuit while keeping the module or string of modules connected securely. (Open circuit).

  In certain embodiments where the voltage of a circuit drops more than some percentage or magnitude (e.g., 20% or 10 V) than other circuits in the same solar array, that circuit will be shut off. The electronics will detect this change based on inter-module communication.

  Examples of such voltage intelligence can be integrated into existing module level power management solutions (eg from Enphase Energy Inc., Solaredge Technologies, Inc., Tigo Energy, Inc.) or through custom circuit design obtain.

An example of how the V _Limit threshold voltage can be calculated is
Cell _Voc @ _{Low Irr & High Temp} x N _{number of cells in series-} Vrb _{Reverse breakdown voltage} V V _Limit
It is. here,
CellVoc @ _{Low Irr & High Temp} = Open circuit voltage of the battery operating at low illumination and high temperature (lowest expected operating Voc).
N _{number of cells in series} = _{number of cells connected in series in} each supercell to be monitored.
● Vrb _{Reverse breakdown voltage} = reverse polarity voltage required to pass current through the battery.

  This approach to module level power management using smart switches does not affect safety or module reliability, for example, connecting more than 100 silicon solar cells in series in a single module Can be made possible. In addition, such smart switches can be used to limit the string voltage going to the central inverter. Thus, longer module strings can be installed without concern regarding safety or tolerance for overvoltages. The weakest module can be bypassed (switched off) if the voltage of the string rises against the limit.

  FIGS. 10A, 11A, 12A, 13A, 13B and 14B, described below, provide additional exemplary schematic electrical schematics for a solar module that employs a scaly supercell. 10B-1, 10B-2, 11B-1, 11B-2, 11C-1, 11C-2, 12B-1, 12B-2, 12C-1, 12C-2, 12C-3, 13C-1, 13C -2, 14C-1 and 14C-2 provide an exemplary physical layout corresponding to their schematic circuit diagrams. In the description of the physical layout, it is assumed that the front end contact portion of each supercell has negative polarity, and the back end contact portion of each supercell has positive polarity. Alternatively, if the module employs a supercell having a front end contact with positive polarity and a back end contact with negative polarity, the following description of the physical layout is to replace the positive and negative electrodes, and It can be changed by reversing the direction of the bypass diode. Some of the various buses mentioned in the description of these figures may be formed, for example, with the interconnect 400 described above. The other buses described in these figures can be implemented, for example, with ribbons embedded in the laminated structure of the solar module or with external cables.

  FIG. 10A is an exemplary schematic electrical diagram of a solar module as illustrated in FIG. 5B, including ten rectangular supercells 100 each having a length approximately equal to the length of the short side of the solar module. Indicates The supercells are arranged in the solar module with the long side oriented parallel to the short side of the module. All of the supercells are electrically connected in parallel with the bypass diode 480.

  10B-1 and 10B-2 show an exemplary physical layout of the solar module of FIG. 10A. Bus 485 N connects the negative (front) end contact of supercell 100 to the positive terminal of bypass diode 480 in junction box 490 located on the back of the module. Bus 485 P connects the positive (back) end contact of supercell 100 to the negative terminal of bypass diode 480. The bus 485P may lie entirely behind the supercell. The bus 485N and / or its interconnection to the supercell occupies part of the front of the module.

  FIG. 11A is an exemplary schematic diagram of a solar module as illustrated in FIG. 5A, including 20 rectangular supercells 100 each having a length approximately equal to the length of one half of the short side of the solar module. Shown in the circuit diagram, the supercells are arranged in pairs and connected end to end to form ten supercell rows. The first supercell in each row is connected in parallel with the first supercell in the other row and in parallel with the bypass diode 500. The second supercell in each row is connected in parallel with the bypass diode 510 in parallel with the second supercell in the other row. Two groups of supercells are connected in series in the same manner as two bypass diodes.

  11B-1 and 11B-2 show an exemplary physical layout of the solar module of FIG. 11A. In this layout, the first supercell in each row has the front (negative) end contacts along the first side of the module and the back (positive) end contacts along the centerline of the module, each row The second supercell has a front (negative) end contact along the centerline of the module and a back (positive) end contact along the second side of the module opposite the first side . Bus 515 N connects the front (negative) end contacts of the first supercell in each row to the positive terminal of bypass diode 500. Bus 515 P connects the back (positive) end contacts of the second supercell in each row to the negative terminal of bypass diode 510. Bus 520 connects the back (positive) end contact of the first supercell in each row and the front (negative) end contact of the second supercell in each row to the negative terminal of bypass diode 500 and the positive terminal of bypass diode 510 Do.

  The bus 515P may lie entirely behind the supercell. The bus 515 N and / or its interconnection to the supercell occupies a portion of the front of the module. The bus 520 occupies a portion of the front of the module and may require a gap 210 as shown in FIG. 5A. Alternatively, the bus 520 may lie entirely behind the supercell and electrically connect to the supercell with the hidden interconnects sandwiched between the overlapping ends of the supercell. In such cases, little or no gap 210 is required.

  11C-1, 11C-2 and 11C-3 illustrate another exemplary physical layout of the solar module of FIG. 11A. In this layout, the first supercell in each row has the front (negative) end contact along the first side of the module, the back (positive) end contact along the centerline of the module, and the first supercell in each row In the second supercell, the back (positive) end contact portion is along the centerline of the module, and the front (negative) end contact is along the second side of the module opposite to the first side. Bus 525 N connects the front (negative) end contact of the first supercell in each row to the positive terminal of bypass diode 500. Bus 530 N connects the front (negative) end contact of the second battery of each row to the negative terminal of bypass diode 500 and the positive terminal of bypass diode 510. A bus 535 P connects the back (positive) end contact of the first battery of each row to the negative terminal of bypass diode 500 and the positive terminal of bypass diode 510. The bus 540 P connects the back (positive) end contacts of the second battery of each row to the negative terminal of the bypass diode 510.

  The bus 535P and the bus 540P may lie entirely behind the supercell. The bus 525N and the bus 530N and / or their interconnections to the supercell occupy part of the front of the module.

  FIG. 12A is another exemplary solar module as illustrated in FIG. 5A, including 20 rectangular supercells 100 each having a length approximately equal to the length of one half of the short side of the solar module. A schematic circuit diagram is shown, in which the supercells are arranged in pairs and connected end to end to form ten supercell rows. In the circuit shown in FIG. 12A, supercells are arranged in four groups. In the first group, the top five rows of first supercells are connected to each other and in parallel with the bypass diode 545. In the second group, the top five rows of second supercells are connected to each other and in parallel with the bypass diode 505. In the third group, the lowermost five rows of first supercells are connected to one another and in parallel with the bypass diode 560. In the fourth group, the lowermost five rows of second supercells are connected to each other and in parallel with bypass diode 555. The four groups of supercells are connected in series with one another. The fourth bypass diode is also in series.

  12B-1 and 12B-2 show an exemplary physical layout of the solar module of FIG. 12A. In this layout, the first group of supercells has a front (negative) end contact along the first side of the module and a back (positive) end contact along the centerline of the module; In the supercell, the front (negative) end contact portion is along the center line of the module, and the back (positive) end contact portion is along the second side of the module opposite to the first side, and the third group In the supercell, the back (positive) end contact portion is along the first side of the module, the front (negative) end contact is along the centerline of the module, and the fourth group of supercells is The positive) end contact is along the centerline of the module, and the front (negative) end contact is along the second side of the module.

  A bus 565 N connects the front (negative) end contacts of supercells included in the first group of supercells to each other and to the positive terminal of the bypass diode 545. The bus 570 connects the back (positive) end contact portion of the supercell included in the first group supercell and the front (negative) end contact portion of the supercell included in the second group supercell to each other. Connect to the negative terminal and to the positive terminal of the bypass diode 550. The bus 575 connects the back (positive) end contact portion of the supercell included in the second group supercell and the front (negative) end contact portion of the supercell included in the fourth group supercell to each other. Connect to the negative terminal and to the positive terminal of bypass diode 555. The bus 580 is configured such that the back (positive) end contact portion of the supercell included in the fourth group supercell and the front (negative) end contact portion of the supercell included in the third group supercell are mutually connected. Connect to the negative terminal and to the positive terminal of bypass diode 560. The bus 585 P connects the back (positive) end contacts of supercells included in the third group of supercells to each other and to the negative terminal of the bypass diode 560.

  The bus 585P and the portion of the bus 575 connected to the supercell supercell of the second group may all lie behind the supercell. Bus 575 and the rest of bus 565N, and / or their interconnections to the supercell, occupy a portion of the front of the module.

  Bus 570 and bus 580 occupy a portion of the front of the module and may require gaps 210 as shown in FIG. 5A. Alternatively, they may lie entirely behind the supercell, and the hidden interconnects may electrically connect to the supercell with the supercell overlapping between the overlapping ends. In such cases, little or no gap 210 is required.

  12C-1, 12C-2 and 12C-3 show alternative physical layouts of the solar module of FIG. 12A. This layout uses two junction boxes 490A and 490B instead of the single junction box 490 shown in FIGS. 12B-1 and 12B-2, but is otherwise equivalent to that of FIGS. 12B-1 and 12B-2. It is.

  FIG. 13A is another exemplary solar module as illustrated in FIG. 5A, including 20 rectangular supercells 100 each having a length approximately equal to the length of one half of the short side of the solar module. A schematic circuit diagram is shown, in which the supercells are arranged in pairs and connected end to end to form ten supercell rows. In the circuit shown in FIG. 13A, supercells are arranged in four groups. In the first group, the top five rows of first supercells are connected in parallel with one another. In the second group, the top five rows of second supercells are connected in parallel with one another. In the third group, the lowermost five rows of first supercells are connected in parallel with one another. In the fourth group, the lowermost five rows of second supercells are connected in parallel with each other. The first group and the second group are connected in series with each other, and thus in parallel with the bypass diode 590. The third and fourth groups are connected in series with each other and thus in parallel with the other bypass diodes 595. The first group and the second group are connected in series to the third group and the fourth group, and the two bypass diodes are also in series.

  13C-1 and 13C-2 show an exemplary physical layout of the solar module of FIG. 13A. In this layout, the first group of supercells has a front (negative) end contact along the first side of the module and a back (positive) end contact along the centerline of the module; In the supercell, the front (negative) end contact is along the centerline of the module, and the back (positive) end contact is along the second side of the module opposite to the first side, and The back face (positive electrode) end contacts of the three groups of supercells are along the first side of the module, the front face (negative electrode) end contacts are along the centerline of the module, and the fourth group of supercells is The back (positive) end contact portion is along the centerline of the module, and the front (negative) end contact portion is along the second side of the module.

  The bus 600 connects the front (negative) end contacts of the first group of supercells to each other, to the back (positive) end contacts of the third group of supercells, to the positive terminal of the bypass diode 590 and Connect to the negative terminal. A bus 605 connects the back (positive) end contacts of the first group of supercells to each other and to the front (negative) end contacts of the second group of supercells. Buses 610 P connect the back (positive) end contacts of the second group of super cells to each other and to the negative terminal of bypass diode 590. Bus 615 N connects the front (negative) end contacts of the fourth group of supercells to each other and to the positive terminal of bypass diode 595. A bus 620 connects the front (negative) end contacts of the third group of supercells to each other and to the back (positive) end contacts of the fourth group of supercells.

  The bus 610P and the portion of the bus 600 connected to the supercell included in the third group of supercells may all lie behind the supercell. The bus 600 and the rest of the bus 615N and / or their interconnections to the supercell occupy a portion of the front of the module.

  Bus 605 and bus 620 occupy a portion of the front of the module and require a gap 210 as shown in FIG. 5A. Alternatively, they may lie entirely behind the supercell, and the hidden interconnects may electrically connect to the supercell with the supercell overlapping between the overlapping ends. In such cases, little or no gap 210 is required.

  FIG. 13B shows an exemplary schematic electrical diagram of a solar module as illustrated in FIG. 5B, wherein the solar modules each have ten lengths each approximately equal to the length of the short side of the solar module A rectangular supercell 100 is included. The supercells are arranged in the solar module with the long side oriented parallel to the short side of the module. In the circuit shown in FIG. 13B, the supercells are arranged in two groups. In the first group, the top five supercells are connected to each other and in parallel with the bypass diode 590, and in the second group, the bottom five supercells are in parallel with each other and the bypass diode 595 Connect to The two groups are connected in series with one another. The bypass diodes are also connected in series.

  The schematic circuit of FIG. 13B differs from that of FIG. 13A in that each row of the two supercells of FIG. 13A is replaced by a single supercell. As a result, the physical layout of the solar module of FIG. 13B may be as shown in FIGS. 13C-1, 13C-2 and 13C-3, with bus 605 and bus 620 omitted.

  FIG. 14A shows an exemplary rectangular solar module 700 including 24 rectangular supercells 100 each having a length approximately equal to the length of one half of the short side of the solar module. The super cells are arranged in pairs and connected end to end, with 12 super cell rows, with those rows and the long side of the super cell, oriented parallel to the short side of the solar module It is formed in the state.

  FIG. 14B shows an exemplary schematic circuit diagram of a solar module as illustrated in FIG. 14A. In the circuit shown in FIG. 14B, supercells are arranged in three groups. In the first group, the top eight first supercells in the top row are connected in parallel with each other and with the bypass diode 705, and in the second group the bottom four supercells in each other and the bypass Connected in parallel with the diode 710, in the third group, the top eight rows of second super cells are connected in parallel with each other and with the bypass diode 715. Three groups of supercells are connected in series. The three bypass diodes are also in series.

  14C-1 and 14C-2 show an exemplary physical layout of the solar module of FIG. 14B. In this layout, the first group of supercells has a front (negative) end contact along the first side of the module and a back (positive) end contact along the centerline of the module. In the second group of supercells, the first supercell included in each of the lowermost four rows has the back (positive) end contact portion along the first side of the module, and the front (negative) end contact The second supercell in which the section is along the centerline of the module and in each of the lowermost four rows has the front (negative) end contact along the centerline of the module, and the back (positive) end The contact portion is along the second side of the module opposite to the first side. In the third solar cell group, the back (positive) end contact portion is along the center line of the module, and the back (negative) end contact is along the second side of the module.

  Bus 720 N connects the front (negative) end contacts of the first group of supercells to each other and to the positive terminal of bypass diode 705. Bus 725 connects the back (positive) end contact of the first group of supercells to the front (negative) end contact of the second group of supercells, to the negative terminal of bypass diode 705, and the positive terminal of bypass diode 710. Connect to the terminal. A bus 730 P connects the back (positive) end contacts of the third group of supercells to each other and to the negative terminal of the bypass diode 715. The bus 735 connects the front (negative) end contacts of the third group of supercells to each other, to the back (positive) end contacts of the second group of supercells, to the negative terminal of the bypass diode 710 and Connect to the positive terminal.

  The part of the bus 725 connected to the supercell included in the first group supercell, and the part of the bus 735 connected to the bus 730P and the supercell included in the second group supercell are all It can lie behind the supercell. Bus 720N, the rest of bus 725 and bus 735, and / or their interconnection to the supercell occupy a portion of the front of the module.

  Some of the examples described above accommodate bypass diodes in one or more junction boxes on the back of the solar module. However, this is not essential. For example, some or all of the bypass diodes may be positioned in the plane of the supercell or in the space around the solar module, or in the gaps between the supercells, or may be positioned behind the supercell. In such cases, the bypass diode may be arranged, for example, in a stacked structure in which the supercell is enclosed. Thus, the position of the bypass diode is dispersed and removed from the junction box and located on the back of the solar module, for example near the outer edge of the solar module, of the central junction box containing both positive and negative module terminals. Replacement with the two separate single terminal connection boxes obtained can be facilitated. This approach generally reduces the length of the current path in the ribbon conductors in the solar modules and in the cabling between the solar modules, both of which lowers the material cost (reducing the resistive power loss Can increase the power of the module).

  Referring to FIG. 15, for example, the physical layout of various electrical interconnections of the solar module as illustrated in FIG. 5B having the schematic circuit diagram of FIG. 10A is a bypass diode 480 located within the supercell stack structure. And two single terminal connection boxes 490P and 490N. FIG. 15 may be best understood by comparison with FIGS. 10B-1 and 10B-2. The layout of the other modules described above may be modified as well.

  The use of in-stack bypass diodes as just described may be facilitated by the use of current-reduced (area-reduced) rectangular solar cells as described above. This is because the reduced current solar cells can dissipate the power dissipated in the forward-biased bypass diode than would be dissipated with conventional sized solar cells. Thus, the bypass diodes in the solar modules described herein may have less heat absorption and as a result may be moved out of the junction box on the back of the module into the stack.

  An interconnect, another conductor, and / or, a single solar module corresponds to two or more electrical configurations, eg, to two or more of the electrical configurations described above It may include a bypass diode. In such cases, a particular configuration for operation of the solar module may be selected from two or more alternatives, for example, in conjunction with the use of switches and / or jumpers. Between different configurations, the number of series and / or parallel supercells may be different to provide different combinations of voltage and current output from the solar module. Thus, such solar modules are selected, for example, between high voltage and low current configurations and low voltage and high current configurations to select from a combination of two or more different voltages and currents. Can be configurable at the factory or in the field.

  FIG. 16 shows an exemplary arrangement of a smart switch module level power management device 750 as described above between two solar modules.

  Referring now to FIG. 17, an exemplary method 800 for making a solar module as disclosed herein includes the following steps. In step 810, conventional sized solar cells (eg, 156 mm × 156 mm or 125 mm × 125 mm) are cut and / or cleaved to form narrow rectangular solar cell “strips”. (See, eg, FIGS. 3A-3E and the related discussion above). The resulting solar cell strips can optionally be tested and sorted according to current-voltage performance. Batteries with matching or approximately matching current-voltage performance may advantageously be used in the same supercell or in the same row of series connected supercells. For example, cells connected in series in a supercell or in a row of supercells may be advantageous to generate matching or approximately matching currents under the same illumination.

  In step 815, the supercell is assembled from the strip solar cells with the conductive adhesive being disposed between overlapping portions of adjacent solar cells in the supercell. The conductive adhesive binder can be applied, for example, by ink jet printing or screen printing.

  In step 820, heating or pressing is performed to cure or partially cure the conductive adhesive bond between the solar cells in the supercell. In one variation, as each additional solar cell is added to the supercell, between the newly added solar cell and its adjacent overlapping solar cell (which is already part of the supercell) The conductive adhesive is cured or partially cured before the next solar cell is added to the supercell. In other variations, more than two solar cells, or all solar cells in a supercell, can be positioned in the desired overlapping manner before the conductive adhesive binder is cured or partially cured. The resulting supercell from this step can optionally be tested and sorted according to current-voltage performance. Supercells with current or voltage performance that are matched or approximately matched can advantageously be used in the same supercell row or in the same solar module. For example, it may be advantageous for the supercell or rows of supercells electrically connected in parallel to produce a matching or approximately matching voltage under the same illumination.

  In step 825, the cured or partially cured supercell is in the desired modular configuration within the layered structure including the encapsulant material, the transparent front (sun side) sheet, and the (optionally transparent) back surface sheet Arranged and interconnected. The layered structure may be, for example, a first layer of encapsulant on a glass substrate, an interconnecting supercell disposed on the solar side below the first layer of encapsulant, a second layer of encapsulant on a layer of supercells And a back sheet on the second layer of encapsulant. Any other suitable arrangement may also be used.

  In the laminating step 830, heating and pressing are performed on the layered structure to form a hardened layered structure.

  In one variation of the method of FIG. 17, conventional sized solar cells are separated into a plurality of solar cell strips, after which a conductive adhesive binder is applied to each individual solar cell strip. In an alternative variation, the conductive adhesive is applied to conventional sized solar cells before the solar cells are separated into a plurality of solar cell strips.

  In the curing step 820, the conductive adhesive may be fully cured or only partially cured. In the latter case, the conductive adhesive may be first partially cured in step 820 to facilitate handling and interconnection of the supercell and may be fully cured during the subsequent lamination step 830.

  In some variations, the supercell 100 assembled as an intermediate product in the method 800 has overlapping and conductive junctions with the long sides of adjacent solar cells as described above, and the plurality of interconnects are supercell And a plurality of rectangular solar cells 10 arranged in contact with the end contacts at opposite ends of the.

  FIG. 30A shows an exemplary supercell with electrical interconnects bonded to the front and back end contacts. The electrical interconnects extend parallel to the distal edge of the supercell and extend laterally beyond the supercell to facilitate electrical interconnect with an adjacent supercell.

  FIG. 30B shows two of the supercells of FIG. 30A interconnected in parallel. In other cases some of the interconnects visible from the front of the module may be covered or colored (eg darkened) as perceived by a person with normal color vision It can reduce the visible contrast between the connection and the supercell. In the example illustrated in FIG. 30A, the interconnect 850 is conductively bonded to the front end contact of the first polarity (eg, + or-) at one end (right side of the drawing) of the supercell and the other The connection 850 is conductively joined to the reverse terminal back end contact at the other end of the supercell (left side of the drawing). As with the other interconnects described above, interconnect 850 may, for example, be conductively bonded to the supercell using the same conductive adhesive bond between the solar cells, although this is not required. In the illustrated example, a portion of each interconnect 850 extends beyond the edge of supercell 100 in a direction perpendicular to the long axis of the supercell (and parallel to the long axis of solar cell 10). Do. As shown in FIG. 30B, this causes two or more supercells 100 to overlap and conductively interconnect one supercell's interconnect 850 to a corresponding interconnect 850 on an adjacent supercell. The two supercells can be positioned side by side with electrical interconnection in parallel. Several such interconnects 850 interconnected in series as just described may form a bus for the module. This arrangement may be suitable, for example, if the individual supercells extend over the full width or length of the module (e.g., FIG. 5B). In addition, interconnects 850 can also be used to electrically connect the end contacts of two adjacent supercells in a supercell row in series. Such pairs of interconnecting supercells in a row or longer strings overlap one row of interconnects 850 and adjacent rows of interconnects 850, as shown in FIG. 30B. Conducting junctions can provide an electrical connection in parallel with similarly interconnected supercells in adjacent rows.

  The interconnects 850 may, for example, be die-cut from a conductive sheet, optionally patterned to increase their mechanical compliance in both the perpendicular and parallel directions to the edges of the supercell, and to each other. The stress in the direction perpendicular and parallel to the edge of the supercell can be reduced or adapted to that resulting from the mismatch between the CTE of the connection and the CTE of the supercell. Such patterning may include, for example, slits, slots, or holes (not shown). The mechanical compliance of interconnect 850, and its junction or junctions to the supercell, allow the connection to the supercell to resist the stresses resulting from CTE mismatch during the lamination process described in more detail below. It should be enough to be The interconnects 850 may be bonded to the supercell, for example, by means of an electrically conductive bond having mechanical compliance as described above for use in overlapping solar cell bonding. Optionally, the electrically conductive bonding agent is not in the form of a solid line extending substantially the length of the edge of the supercell, but only at discrete locations along the edge of the supercell. Can reduce or adapt to stresses parallel to the edge of the supercell resulting from a mismatch between the coefficient of thermal expansion of the conductive bonding agent or interconnect and the coefficient of thermal expansion of the supercell obtain.

  The interconnect 850 can be cut, for example, from a thin copper plate, and the supercell 100 is formed from a smaller area solar cell than a standard silicon solar cell, and thus, operates with less current than conventional. It may be thinner than the conductive interconnect. For example, interconnect 850 may be formed of a copper plate having a thickness of about 50 microns to about 300 microns. The interconnects 850, as well as the interconnects described above, may be sufficiently thin and flexible enough to be folded around and behind the edge of the supercell to which they are attached.

  19A-19D illustrate some exemplary arrangements in which heating and pressing may be performed during method 800 to cure or partially cure a conductive adhesive bond between adjacent solar cells in a supercell. . Any other suitable arrangement may also be employed.

  In FIG. 19A, heating and local pressure are applied to cure or partially cure the conductive adhesive 12 at one joint (overlapping area) per degree. The supercell may be supported by the surface 1000 and pressing may be performed mechanically from above onto the connection, for example by means of bars, pins or other mechanical contacts. Heating may be performed on the connection, for example, by means of high-temperature air (or other high-temperature gas), by means of an infrared bulb, or by heating a mechanical contact which exerts a local pressure on the connection. It can be done.

  In FIG. 19B, the arrangement of FIG. 19A is extended to a batch process in which heating and localized pressurization are simultaneously performed on multiple connections in the supercell.

  In FIG. 19C, the uncured supercell is positioned between the release liner 1015 and the reusable thermoplastic sheet 1020 and positioned on the carrier plate 1010 supported by the surface 1000. The thermoplastic material of sheet 1020 is selected to melt at the temperature at which the supercell is cured. The release liner 1015 can be formed, for example, of fiber glass and PTFE, and does not stick to the supercell after the curing process. Preferably, the release liner 1015 is formed of a material having a CTE that matches or substantially matches the thermal expansion coefficient of the solar cell (eg, the CTE of silicon). Because if the CTE of the release liner is too different from the CTE of the solar cell, then the solar cell and the release liner will be lengthened by different amounts during the curing process, which lengthens the supercell at the junction Because they will tend to pull apart in the longitudinal direction. A vacuum bladder 1005 is lying on this arrangement. The uncured supercell is heated from below, for example, through surface 1000 and carrier plate 1010, and a vacuum is drawn between bladder 1005 and support surface 1000. As a result, the bladder 1005 applies static pressure to the supercell through the molten thermoplastic sheet 1020.

  In FIG. 19D, the uncured supercell is carried by the perforated moving belt 1025 through the oven 1035 which heats the supercell. The vacuum drawn through the perforations in the belt pulls the solar cells 10 towards the belt, thereby exerting pressure on the connection between them. The conductive adhesive binders at their junctions are cured as the supercell passes through the oven. Preferably, the perforated belt 1025 is formed of a material having a CTE that matches or substantially matches the CTE of the solar cell (e.g., the CTE of silicon). Because if the CTE of the belt 1025 is too different from the CTE of the solar cells, the solar cells and the belt will be lengthened by different amounts in the oven 1035, which will lengthen the supercell at the junction Because they will tend to pull away with respect to

  The method 800 of FIG. 17 includes separate supercell curing and lamination steps, resulting in an intermediate supercell product. In contrast, in the method 900 shown in FIG. 18, the curing and laminating steps of the supercell are combined. At step 910, conventional sized solar cells (eg, 156 mm × 156 mm or 125 mm × 125 mm) are cut and / or cleaved to form narrow rectangular solar cell strips. The resulting solar cell strips can optionally be tested and sorted.

  In step 915, the solar cell strips are arranged and interconnected in the desired modular configuration of a layered structure including encapsulant material, a transparent front (solar side) sheet, and a back sheet. The solar cell strip is arranged as a supercell with the uncured conductive adhesive being disposed between overlapping portions of adjacent solar cells in the supercell. (The conductive adhesive bond may be applied, for example, by ink jet printing or screen printing.) The interconnects are arranged to electrically interconnect the uncured supercell in the desired configuration. The layered structure may be, for example, a first layer of encapsulant on a glass substrate, an interconnecting supercell disposed on the solar side below the first layer of encapsulant, a second layer of encapsulant on a layer of supercells And a back sheet on the second layer of encapsulant. Any other suitable arrangement may also be used.

  In the lamination step 920, heating and pressure are applied to the layered structure to cure the conductive adhesive in the supercell to form a cured laminated structure. The conductive adhesive used to bond the interconnect to the supercell can also be cured in this step.

  In one variation of method 900, conventional sized solar cells are separated into a plurality of solar cell strips, and then a conductive adhesive binder is applied to each individual solar cell strip. In an alternative variation, the conductive adhesive binder is applied to conventional sized solar cells before the solar cells are separated into multiple solar cell strips. For example, a plurality of conventional sized solar cells are placed on a large template, and then a conductive adhesive binder is distributed over the solar cells, and then the solar cells are simultaneously treated with a plurality of solar cells with a large fixture. It can be separated into a battery strip. The resulting solar cell strips can then be transported as a group and placed in the desired module configuration as described above.

  As mentioned above, in some variations of the method 800 and the method 900, the conductive adhesive bonding agent is applied to conventional sized solar cells before the solar cells are separated into multiple solar cell strips. Ru. When conventional sized solar cells are separated to form a plurality of solar cell strips, the conductive adhesive bond is uncured (i.e. still "not dry"). In some of these variations, a conductive adhesive binder is applied (e.g., by ink jet or screen printing) to a conventionally sized solar cell, and then a laser is used to scribe the lines on the solar cell. The solar cells are cleaved to define the locations that will form the solar cell strips, and then the solar cells are cleaved along the scribe line. In these variations, the laser power and / or the distance between the scribe lines, and the adhesive bond are selected to avoid accidental curing or partial curing of the conductive adhesive bond with heat from the laser. obtain. In another variation, a laser is used to scribe the wire onto a conventionally sized solar cell to define the locations where the solar cell is to be cleaved to form a solar cell strip and then conductive adhesive bonding The agent is applied to the solar cell (eg, by ink jet or screen printing) and then the solar cell is cleaved along the scribe line. In the latter variant, it may be preferable to achieve the step of applying the conductive adhesive binder without accidentally cleaving or breaking the scribed solar cell during this step.

  Referring back to FIGS. 20A-20C, FIG. 20A schematically illustrates a side view of an exemplary device 1050 that may be used to cleave a scribed solar cell to which a conductive adhesive binder has been applied. . (The scribing and application of the conductive adhesive bond may occur in any order.) In this device, the scribed conventional sized solar cell 45 to which the conductive adhesive adhesive is applied is a vacuum manifold It is carried by a perforated moving belt 1060 above the curved portion of 1070. As the solar cell 45 passes over the curved portion of the vacuum manifold, the vacuum drawn through the perforations in the belt pulls the bottom of the solar cell 45 toward the vacuum manifold, thereby bending the solar cell. The radius of curvature R of the curved portion of the vacuum manifold may be selected to cleave the solar cell along the scribe line by bending the solar cell 45 in this manner. Advantageously, the solar cell 45 can be cleaved by this method without contacting the top surface of the solar cell 45 to which the conductive adhesive binder has been applied.

  If cleavage is preferably initiated at one end of the scribe line (ie one edge of the solar cell 45), this means that for each scribe line, one end reaches the curved portion of the vacuum manifold in front of the other end Thus, for example, by arranging the scribe line to be oriented at an angle θ with respect to the vacuum manifold, this can be achieved in the device 1050 of FIG. 20A. As shown in FIG. 20B, for example, the solar cells are oriented with their scribe lines angled with respect to the direction of movement of the belt and the manifolds oriented in a direction perpendicular to the direction of movement of the belt. Can be As another example, FIG. 20C shows cells oriented with the scribe line perpendicular to the direction of belt travel, and an angled oriented manifold.

  Any other suitable device is also used to cleave the scribed solar cell with the conductive adhesive bond applied to form a strip solar cell with the pre-applied conductive adhesive bond obtain. Such devices may use, for example, a roller to apply pressure to the top surface of the solar cell to which the conductive adhesive binder has been applied. In such a case, it is preferred that the roller touch the top surface of the solar cell only in the area where the conductive adhesive binder is not applied.

  In some variations, the solar modules are not initially absorbed by the solar cells, and a portion of the solar radiation passing through the solar cells is reflected by the back sheet back into the solar cells to produce electricity As it may be, it comprises supercells arranged in a plurality of rows on a white or otherwise reflective backsheet. A reflective backsheet can be viewed through the gaps between the plurality of supercell rows, as a result of which the solar module has a plurality of parallel bright (e.g. white) lines extending across the front surface. It can appear to have a line. Referring to FIG. 5B, for example, a plurality of parallel dark lines extending between a plurality of rows of supercells 100 appear as white lines when supercells 100 are disposed on a white back sheet. It may be. This may be aesthetically unpleasant for some applications of the solar module, for example on a roof.

  Referring to FIG. 21, in order to improve the aesthetic appearance of the solar module, some variations are located at positions corresponding to the gaps between the rows of supercells to be placed on the back sheet. A white backsheet 1100 is employed that includes dark stripes 1105. The stripes 1105 are wide enough so that in the assembled module the white portions of the backsheet are not visible through the gaps between the plurality of supercell rows. This reduces the visual contrast between the supercell and the back sheet perceived by a person with normal color vision. The resulting module includes a white backsheet, but may have a front that looks similar to that of the module illustrated in, for example, FIGS. 5A-5B. Dark stripes 1105 may be produced, for example, on multiple length dark tapes, or in any other suitable manner.

  As mentioned earlier, the shadowing of the individual cells in the solar module may cause the power of the non-shadowed cells to create "hot spots" that may dissipate in the shaded cells. This dissipated power produces local temperature spikes that can degrade the module.

  In order to minimize the potential severity of these hot spots, bypass diodes are conventionally inserted as part of the module. The maximum number of batteries between bypass diodes is set to limit the maximum temperature of the module and to prevent irreversible damage to the module. A standard layout for silicon cells may utilize one bypass diode for every 20 or 24 cells, the number being determined by the typical breakdown voltage of silicon cells. In certain embodiments, the breakdown voltage can be in the range between about 10-50V. In particular embodiments, the breakdown voltage may be about 10V, about 15V, about 20V, about 25V, about 30V, or about 35V.

  According to an embodiment, the thermal contact between the solar cells is enhanced by firing a strip of the plurality of cut solar cells with a thin thermally conductive adhesive. This enhanced thermal contact allows for a higher degree of heat diffusion than traditional interconnect technology. Such thermal thermal diffusion design based on shimmering makes it longer than 24 (or fewer) solar cells per bypass diode, which has been a constraint for conventional designs A string of solar cells can be used. The heat diffusion facilitated by grinding according to an embodiment may thus alleviate the need for providing bypass diodes at short intervals and may provide one or more advantages. For example, this allows the creation of a layout of modules of different solar cell string lengths without being hampered by the need to provide multiple bypass diodes.

  According to embodiments, thermal diffusion is achieved by maintaining physical and thermal bonding with adjacent cells. This allows for sufficient heat dissipation through the joined connections.

  In certain embodiments, the connection is maintained at a thickness of about 200 micrometers or less and extends across the length of the solar cell in a segmented pattern. Depending on the embodiment, the connection is about 200 micrometers or thinner, about 150 micrometers or thinner, about 125 micrometers or thinner, about 100 micrometers or thinner, It may be about 90 micrometers or thinner, about 80 micrometers or thinner, about 70 micrometers or thinner, about 50 micrometers or thinner, or about 25 micrometers or thinner.

  The exact adhesive curing process may be important to ensure that the reliable connections are maintained, while maintaining a small thickness to promote heat transfer between cells that join.

  The ability to extend longer strings (e.g., more than 24 cells) provides flexibility to the solar cell and module design. For example, in certain embodiments, a string of cut multiple solar cells can be utilized that are assembled into a grit. Such an arrangement may utilize substantially more batteries per module than conventional modules.

  In the absence of thermal diffusivity, one bypass diode would be required for every 24 cells. When the solar cell is disconnected in 1/6, the bypass diode per module is 6 times that of the conventional module (consisting of 3 uncut cells), for a total of 18 diodes Will. Thus, heat diffusion allows a significant reduction in the number of bypass diodes.

  Furthermore, a bypass circuit is required for each bypass diode to complete the bypass electrical path. Each diode requires two interconnection points and conductor routing to connect them to such interconnection points. This leads to complex circuits and leads to considerable outlays over standard layout costs associated with assembling solar modules.

  In contrast, thermal diffusion techniques require only one bypass diode per module, or even none at all. Such an arrangement streamlines the module assembly process and allows simple automation tools to perform the layout manufacturing process.

  Thus, avoiding the need for bypass protection every 24 cells makes battery module manufacture easier. Complex tap outs in the middle of the module and long parallel connections for bypass circuits are avoided. This heat spread is implemented by creating a long, scaly strip of batteries extending across the width and / or length of the module.

  In addition to providing thermal thermal diffusion, hoarring according to an embodiment may also allow enhanced hot spot performance by reducing the magnitude of the current dissipated in the solar cell I assume. Specifically, during hot spot conditions, the amount of current dissipated in the solar cell depends on the area of the cell.

  The amount of current passing through one cell in a hot spot condition is a function of the size to be cut, as this allows the cells to be cut into smaller areas. During the hot spot condition, the current passes through the path of lowest resistance, which is usually a cell level defect interface or grain boundary. It is an advantage to reduce this current, which minimizes the failure of reliability risks in hot spot conditions.

  FIG. 22A shows a top view of a conventional module 2200 utilizing a traditional ribbon connection 2201 in a hot spot condition. Here, as a result of shadow 2202 on one cell 2204 heat will be concentrated to that single cell.

  In contrast, FIG. 22B shows a plan view of the module utilizing thermal diffusion, also in a hot spot condition. Here, the shadow 2250 on the battery 2252 generates heat within the battery. However, this heat is diffused to other electrically and thermally bonded cells 2254 in module 2256.

  Still further, the benefit of reducing the dissipated current is several-fold with polycrystalline solar cells. Such polycrystalline cells are known to only perform poorly in hot spot conditions due to the high level of defect interface.

  As indicated above, certain embodiments may employ grinding of the beveled and cut cells. In such a case, there is a similar thermal diffusion advantage along the bond line between each cell and the adjacent cell.

  This maximizes the bond length of each overlapping link. Since the joined connections are the main interface for heat diffusion between the cells, maximizing this length may ensure that optimum heat diffusion is obtained.

  FIG. 23A shows an example of a supercell string layout 2300 that includes beveled cells 2302. In this configuration, the beveled cells are oriented in the same direction, so the conduction paths of all joined connections are the same (125 mm).

  As a result of the shadow 2306 on one cell 2304, the cell is reverse biased. The heat diffuses to the adjacent cells. The non-bonded end 2304a of the chamfered cell is the hottest due to the longer conduction length to the next cell.

  FIG. 23B shows another example of a supercell string layout 2350 that includes beveled cells 2352. In this configuration, the beveled cells are oriented in different directions, and some of the long edges of the beveled cells face each other. As a result of this, the lengths of the conductive paths of the joined connections are two, 125 mm and 156 mm.

  When battery 2354 is shaded 2356, the configuration of FIG. 23B exhibits enhanced thermal diffusion along the longer junction length. Thus, FIG. 23B shows thermal diffusion in the supercell with the beveled cells facing each other.

  The above description has focused on assembling multiple solar cells (which can be cut solar cells) on a common substrate. As a result of this, a module with a single electrical interconnect-junction box (or j-box) will be formed.

  However, in order to collect a sufficient amount of solar energy to be useful, the installation typically comprises a large number of such modules that themselves will be assembled together. According to embodiments, a plurality of solar cell modules may also be assembled in a glazed manner to increase the area efficiency of the array.

  In certain embodiments, the module may include an upper conductive ribbon facing in the direction of solar energy and a lower conductive ribbon facing away from the direction of solar energy.

  The lower ribbon is buried below the battery. Thus, it does not block incident light and does not adversely affect the area efficiency of the module. In contrast, the upper ribbon is exposed and can block incident light, which can adversely affect efficiency.

  According to embodiments, the module itself may be fired, whereby the upper ribbon may be covered by neighboring modules. FIG. 24 shows a simplified cross-sectional view of such an arrangement 2400 in which the ends 2401 of adjacent modules 2402 function to overlap the upper ribbon 2404 of the instant module 2406. Each module itself comprises a plurality of ground solar cells 2407.

  The lower ribbon 2408 of the module 2406 to be considered is embedded. It is located on the raised edge of the target Gauze-like module to be superimposed on the next adjacent Gauze-like module.

  This square shaped module configuration may also provide additional area on the module for other elements without adversely affecting the final exposed area of the module array. Examples of modular elements that may be positioned in overlapping areas may include, but are not limited to, connection boxes (j-boxes) 2410 and / or bus ribbons.

  FIG. 25 illustrates another embodiment of a glazed module configuration 2500. Here, the j-boxes 2502, 2504 of the respective adjacent floor modules 2506 and 2508 are in a mating arrangement 2510 to achieve an electrical connection therebetween. This simplifies the construction of the array of ground-like modules by removing the wiring.

  In certain embodiments, the j-box may be enhanced by additional structural standoffs and / or combined with the standoffs. Such an arrangement can yield an integrated, inclined modular roof mount rack solution where the dimensions of the junction box determine the inclination. Such an embodiment may be particularly useful when the array of glazed modules is mounted on a flat roof.

  If the module includes a glass substrate and a glass cover (glass-glass module), the module shortens the overall module length (and thus the exposed length L resulting from grinding) Can be used without additional frame members. Such shortening would allow the modules of the tilted array to withstand the expected physical load (e.g. snow load limit of 5400 Pa) without breaking due to strain.

  It is emphasized that by using a supercell structure comprising a plurality of individual solar cells assembled in a scalloped manner, the module can be adapted to the specific length required by the physical load and other requirements. It is possible to easily adapt to changes in length.

  FIG. 26 illustrates an exemplary electrical interconnection of the front (solar side) face end electrical contact of the glazed supercell to the junction box on the back side of the solar module, of the back (shadow) side of the module Figure shows. The front end contact of the glazed supercell may be located adjacent to the edge of the module.

  FIG. 26 illustrates the use of the flexible interconnect 400 in electrical contact with the front end contact of the supercell 100. In the illustrated example, the flexible interconnect 400 extends in a direction parallel to and adjacent to the end of the supercell 100 and a ribbon portion 9400A and a direction perpendicular to the ribbon portion to provide a supercell with a conductive junction. And a finger 9400B in contact with the front metallization pattern (not shown) of the inner end solar cell. A ribbon conductor 9410 conductively bonded to the interconnect 9400 passes through the back of the supercell 100 to provide the interconnect 9400 with the electrical components on the back of the solar module of which the supercell forms part (e.g. junction box) Electrically connect to the internal module terminals and / or bypass diode). An insulating film 9420 may be disposed between the conductor 9410 and the edge and back surface of the supercell 100 to electrically isolate the ribbon conductor 9410 from the supercell 100.

  The interconnect 400 may optionally fold around the edge of the supercell such that the ribbon portion 9400A lies behind or partially behind the supercell. In such cases, an electrically insulating layer is typically provided between the interconnect 400 and the edge and back of the supercell 100.

  The interconnect 400 may be die cut from, for example, a conductive sheet, and optionally patterned to increase its mechanical compliance in both the perpendicular and parallel directions to the edges of the supercell, and to each other. The stress in the direction perpendicular and parallel to the edge of the supercell can be reduced or adapted to that resulting from the mismatch between the CTE of the connection and the CTE of the supercell. Such patterning may include, for example, slits, slots, or holes (not shown). The mechanical compliance of the interconnect 400, and its connection to the supercell, is sufficient to allow the connection to the supercell to withstand the stresses resulting from CTE mismatch during the lamination process described in more detail below. Should be. The interconnect 400 may be bonded to the supercell, for example, by an electrically conductive bonding agent having mechanical compliance as described above for use in overlapping solar cell bonding. Optionally, the electrically conductive bonding agent is not in the form of a solid line extending substantially the length of the edge of the supercell (eg, corresponding to the location of the discontinuous contact pads on the edge solar cells) Supercell, which is located only at discrete locations along the edge of the supercell, resulting from a mismatch between the coefficient of thermal expansion of the electrically conductive bonding agent or interconnect and the coefficient of thermal expansion of the supercell The stress in the direction parallel to the edge of the can be reduced or adapted to the same.

  The interconnect 400 can be cut, for example, from a thin copper plate, and the supercell 100 is formed from a smaller area solar cell than a standard silicon solar cell, and thus, operates with less current than conventional. It may be thinner than the conductive interconnect. For example, interconnect 400 may be formed of a copper plate having a thickness of about 50 microns to about 300 microns. Interconnect 400 is perpendicular to the edge of the supercell and resulting from the mismatch between the CTE of the interconnect and the CTE of the supercell, even if not patterned as described above. It may be thin enough to accommodate stresses in parallel directions. The ribbon conductor 9410 may be formed, for example, of copper.

  FIG. 27 shows two or more parallel scaly supercells with the front (solar side) face end electrical contacts of the supercell connected to each other and to the junction box on the back of the solar module FIG. 7 shows a view of the back (shadow) side of the module illustrating an exemplary electrical interconnect. The front end contact of the glazed supercell may be located adjacent to the edge of the module.

  FIG. 27 shows the use of two flexible interconnects 400 as just described, in electrical contact with the front end contacts of two adjacent supercells 100. A bus 9430 extending parallel to and adjacent to the end of the supercell 100 conductively joins the two flexible interconnects to electrically connect the supercells in parallel. This scheme can be extended to interconnect additional supercells 100 in parallel, as desired. The bus 9430 may be formed of, for example, a copper ribbon.

  Similar to those described above with respect to FIG. 26, the interconnect 400 and the bus 9430 are optional so that the ribbon portion 9400A and the bus 9430 lie behind or partially behind the supercell. Can be broken around the edge of the supercell. In such cases, an electrically insulating layer is typically provided between the interconnect 400 and the edge and back surface of the supercell 100, and between the bus 9430 and the edge and back surface of the supercell 100. Ru.

  Figure 28 shows two or more parallel scaly supercells with the front (solar side) face end electrical contacts of the supercell connected to each other and to the junction box at the back of the solar module FIG. 7 shows a view of the back (shadow) side of the module illustrating another exemplary electrical interconnect. The front end contact of the glazed supercell may be located adjacent to the edge of the module.

  FIG. 28 illustrates the use of another exemplary flexible interconnect 9440 in electrical contact with the front end contact of the supercell 100. In the present example, the flexible interconnect 9440 extends in a direction parallel to and adjacent to the end of the supercell 100 and a ribbon portion 9440A and a direction perpendicular to the ribbon portion, the end in the supercell being the conductive junction. And a finger 9440C contacting the front metallization pattern (not shown) of the solar cell, and a finger 9440C extending in a direction perpendicular to the ribbon portion and at the back of the supercell. Finger 9440 C conductively bonds to bus 9450. A bus 9450 extends parallel to and adjacent to the end of the supercell 100 along the back surface of the supercell 100 and extends to overlap adjacent supercells, which may be its similar electrical contacts. , Thereby connecting the supercells in parallel. A ribbon conductor 9410 conductively coupled to the bus 9450 electrically interconnects the supercell to electrical components on the back of the solar module (eg, module terminals in the junction box and / or bypass diodes). An electrically insulating film 9420 is provided between the finger 9440C and the edge and back surface of the supercell 100, the bus 9450 and the back surface of the supercell 100, and between the ribbon conductor 9410 and the back surface of the supercell 100. It can be done.

  The interconnects 9440 can be die cut from, for example, a conductive sheet, and optionally are patterned to enhance their mechanical compliance in both the perpendicular and parallel directions to the edges of the supercell, The stress in the direction perpendicular and parallel to the edge of the supercell can be reduced or adapted to that resulting from the mismatch between the CTE of the connection and the CTE of the supercell. Such patterning may include, for example, slits, slots, or holes (not shown). The mechanical compliance of interconnect 9440 and its connection to the supercell are sufficient to allow the connection to the supercell to withstand the stresses resulting from CTE mismatch during the lamination process described in more detail below. Should be. The interconnects 9440 can be bonded to the supercell, for example, by means of an electrically conductive bonding agent that has mechanical compliance as described above for use in overlapping solar cell bonding. Optionally, the electrically conductive bonding agent is not in the form of a solid line extending substantially the length of the edge of the supercell (eg, corresponding to the location of the discontinuous contact pads on the edge solar cells) Supercell, which is located only at discrete locations along the edge of the supercell, resulting from a mismatch between the coefficient of thermal expansion of the electrically conductive bonding agent or interconnect and the coefficient of thermal expansion of the supercell The stress in the direction parallel to the edge of the can be reduced or adapted to the same.

  The interconnects 9440 can be cut, for example, from a thin copper plate, and the supercell 100 is formed from a smaller area solar cell than a standard silicon solar cell, and thus, operates with less current than conventional. It may be thinner than the conductive interconnect. For example, interconnect 9440 may be formed of a copper plate having a thickness of about 50 microns to about 300 microns. Interconnect 9440 is perpendicular to the edge of the supercell and resulting from the mismatch between the CTE of the interconnect and the CTE of the supercell, even if not patterned as described above. It may be thin enough to accommodate stresses in parallel directions. The bus 9450 may be formed of, for example, a copper ribbon.

  Finger 9440 C may join to bus 9450 after finger 9440 B joins to the front of supercell 100. In such a case, the finger 9440 C may be bent away from the back surface of the supercell 100, eg, in a direction perpendicular to the supercell 100 when joining the bus 9450. The fingers 9440C may then be bent to extend along the back of the supercell 100, as shown in FIG.

  FIG. 29 illustrates two supers, which are sandwiched between overlapping ends of adjacent supercells to electrically connect the supercells in series and to provide electrical connection to the junction box. FIG. 7 shows a fragmentary cross-sectional view and perspective view of the cell. FIG. 29A shows an enlarged view of the target area of FIG.

  Figures 29 and 29A are partially sandwiched between the overlapping ends of the two supercells 100, with the ends electrically interconnected to one of the front end contacts of the supercells and the other The use of an exemplary flexible interconnect 2960 to provide electrical connections to the back end contacts of the cells, thereby interconnecting the supercells in series, is illustrated. In the illustrated example, the interconnect 2960 is hidden from view in front of the solar module by the upper one of the two overlapping solar cells. In another variation, the portions of interconnect 2960 that connect adjacent ends of the two supercells do not overlap and connect to the front end contacts of one of the two supercells are visible from the front of the solar module It can be done. Optionally, in such a variant, the part of the interconnect, which is otherwise visible from the front of the module, is covered or colored (eg darkened) for the usual color vision Can reduce the visible contrast between the interconnect and the supercell, as perceived by a person having the Interconnect 2960 extends parallel to the adjacent edges of the supercell, beyond the side edges of the two supercells, and in parallel to the pair of similarly arranged supercells in adjacent rows. A pair of cells can be electrically connected.

  A ribbon conductor 2970 is conductively coupled to the interconnect 2960 as shown to allow adjacent ends of the two supercells to be exposed to electrical components on the back of the solar module (eg, module terminals within the junction box and And / or electrically connected to the bypass diode). In another variation (not shown), instead of conductively bonding the ribbon conductor 2970 to the interconnect 2960, electrical connection is made to the back contact of one of the overlapping supercells away from their overlapping ends It can. The configuration may also provide a hidden tap to one or more bypass diodes or other electrical components on the back of the solar module.

  Interconnect 2960 may optionally be die-cut from, for example, a conductive sheet, and optionally patterned to enhance its mechanical compliance both in the direction perpendicular and parallel to the edges of the supercell. The stress in the direction perpendicular to and parallel to the edge of the supercell resulting from the mismatch between the CTE of the interconnect and the CTE of the supercell may be reduced or adapted to that stress. Such patterning may include, for example, slits, slots (as shown), or holes. The mechanical compliance of the flexible interconnect, and its junction or junctions to the supercell, allow the interconnecting supercell to withstand the stresses resulting from CTE mismatch during the lamination process described in more detail below. It should be enough to be The flexible interconnect may be bonded to the supercell, for example, by means of an electrically conductive bonding agent that has mechanical compliance as described above for use in overlapping solar cell bonding. Optionally, the electrically conductive bonding agent is not in the form of a solid line extending substantially the length of the edge of the supercell, but only at discrete locations along the edge of the supercell. Can reduce or adapt to stresses parallel to the edge of the supercell resulting from a mismatch between the coefficient of thermal expansion of the conductive bonding agent or interconnect and the coefficient of thermal expansion of the supercell obtain. The interconnect 2960 can be cut from, for example, a thin copper plate.

  Embodiments may include one or more features described in the following US Patent Publication Documents. U.S. Patent Publication No. 2014/0124013 and U.S. Patent Publication No. 2014/0124014. Both of these are incorporated herein by reference in their entirety for all purposes.

  The present specification is directed to a silicon solar cell arranged in a flaky fashion and electrically connected in series to form a supercell with the supercell arranged in multiple physically parallel rows in a solar module Disclose a high efficiency solar module including: The supercell may have, for example, a length extending essentially over the entire length or width of the solar module, or two or more supercells may be arranged end to end in a row . This arrangement hides the electrical interconnections between the solar cells and the solar cells, thus forming a visually attractive solar module with little or no contrast between adjacent series connected solar cells. It can be used for

  The supercell may include at least 19 solar cells in some embodiments, and any number of solar cells, including, for example, a number of silicon solar cells greater than or equal to 100 in particular embodiments. Electrical contacts at intermediate locations along the supercell can electrically segment the supercell into two or more serially connected segments while maintaining a physically continuous supercell. It may be desirable. The present specification establishes that such electrical connections are made with the back contact pads of one or more silicon solar cells in the supercell to hide them from the view from the front of the solar module, thus “hidden” in the present specification. An arrangement is disclosed which provides an electrical tap connection point called a "tap". The hidden tap is an electrical connection between the back of the solar cell and the conductive interconnect.

  This specification provides a flexible interconnect that electrically interconnects the front supercell end contact pads, the back supercell end contact pads, or the hidden tap contact pads to other solar cells or to other electrical components within the solar module. It also discloses the use of the department.

  In addition, the present specification provides a machine for directly joining adjacent solar cells within the supercell to accommodate the thermal expansion mismatch between the supercell and the glass front sheet of the solar module. Use of an electrically conductive adhesive to provide electrically conductive joints with dynamic compliance to a flexible interconnect by means of a mechanically rigid joint adapted to the thermal expansion mismatch between the flexible interconnect and the supercell Disclosed is in combination with the use of an electrically conductive adhesive bonding the connection to the supercell. This may avoid damage to the solar module which may otherwise occur as a result of thermal cycling of the solar module.

  Electrical connections to the hidden tap contact pads electrically connect the segments of the supercell in parallel with corresponding segments of one or more supercells in adjacent rows, as further described below; Or electrical connections to solar module circuitry for various applications including, but not limited to, power optimization (eg, bypass diodes, AC / DC microinverters, DC / DC converters) and reliability applications It can be used to provide.

  The use of a hidden tap as just described can further improve the aesthetic appearance of the solar module by providing the solar module with a substantially all-black appearance in combination with the hidden battery-cell connection, which is The efficiency of the solar module may also be enhanced by allowing the active area to be filled in a larger portion of the module's surface area.

  Turning now to the drawings for a more detailed understanding of the solar modules described herein, FIG. 1 shows that the ends of adjacent solar cells overlap and form an electrical connection to form a supercell 100. FIG. 4 shows a cross-sectional view of a string of serially connected solar cells 10 arranged in a glazed state. Each solar cell 10 includes a semiconductor diode structure and a plurality of electrical contacts to the semiconductor diode structure. Thereby, the current generated in the solar cell 10 may be provided to the external load when the solar cell 10 is irradiated with light.

  In the example described herein, each solar cell 10 has a rectangular shape with a front (sun side) and back (shadow) side metallization pattern that provides electrical contact on opposite sides of the np junction. In the crystalline silicon solar cell, the front surface metallization pattern is disposed on the n-type conductivity semiconductor layer, and the back surface metallization pattern is disposed on the p-type conductivity semiconductor layer. However, other material systems, diode structures, physical dimensions, or electrical contact arrangements may be used where appropriate. For example, the front (sun side) side metallization pattern may be disposed on a p-type conductive semiconductor layer, and the back (shadow side) side metallization pattern may be disposed on an n-type conductive semiconductor layer.

  Referring back to FIG. 1, in the supercell 100, adjacent solar cells 10 electrically connect the front metallization pattern of one solar cell to the back metallization pattern of the adjacent solar cell in the area where they overlap. Directly conductively bond together with electrically conductive bonding agent. Suitable electrically conductive binders may include, for example, electrically conductive adhesives, electrically conductive adhesive films and tapes, and conventional solders.

  31AA and 31A are partially sandwiched between the overlapping ends of the two supercells 100, with the ends electrically interconnected to one of the front end contacts of the supercells and the other supercell FIG. 10 illustrates the use of an exemplary flexible interconnect 3160 to provide electrical connection to the back end contacts of the, thereby interconnecting the supercells in series. In the illustrated example, the interconnect 3160 is hidden from the front view of the solar module by the upper one of the two overlapping solar cells. In another variation, the adjacent ends of the two supercells do not overlap, and the portion of interconnect 3160 that connects to the front end contact of one of the two supercells is visible from the front of the solar module It can be done. Optionally, in such a variant, the part of the interconnect, which is otherwise visible from the front of the module, is covered or colored (eg darkened) for the usual color vision Can reduce the visible contrast between the interconnect and the supercell, as perceived by a person having the Interconnect 3160 extends parallel to the adjacent edges of the supercell, beyond the side edges of the two supercells, and in parallel to a pair of similarly arranged supercells in adjacent rows. A pair of cells can be electrically connected.

  A ribbon conductor 3170 is conductively bonded to the interconnect 3160 as shown to allow adjacent ends of the two supercells to be exposed to electrical components on the back of the solar module (eg, module terminals within the junction box and And / or electrically connected to the bypass diode). In another variation (not shown), instead of conductively bonding the ribbon conductor 3170 to the interconnect 3160, it is electrically connected to the back contact of one of the overlapping supercells in a direction away from their overlapping ends It can. The configuration may also provide a hidden tap to one or more bypass diodes or other electrical components on the back of the solar module.

  2A-2R illustrate an exemplary rectangular solar module 200 including six rectangular supercells 100 each having a length approximately equal to the length of the long side of the solar module. The supercells are arranged in six parallel rows, with the long side oriented parallel to the long side of the module. A similarly configured solar module may include more or less rows of supercells of such side lengths than shown in this example. In another variation, each supercell has a length approximately equal to the length of the short side of the rectangular solar module, with their long sides oriented parallel to the short side of the module, in parallel rows It can be arranged. In still other arrangements, each row may include two or more supercells electrically interconnected in series. The module may have short sides, eg, about 1 meter in length, and long sides, eg, about 1.5 to about 2.0 meters in length. Any other suitable shape (eg, square) and dimensions may also be used for the solar module.

  Each supercell in the present example comprises 72 rectangular solar cells, each having a width equal to approximately 1/6 of the width of a 156 mm square or pseudo-square wafer. Any other suitable number of rectangular solar cells of any other suitable dimensions may also be used.

A solar cell having a long narrow aspect ratio as shown and having an area smaller than that of a standard 156 mm × 156 mm solar cell is I ² in the solar cell module disclosed herein. It may be advantageously employed to reduce R resistive power losses. In particular, the small area of the solar cell 10 compared to standard sized silicon solar cells reduces the current generated by the solar cell and the resistance within that solar cell and within the series connected string of such solar cells Reduce power loss directly.

  A hidden tap on the back of the supercell can be established, for example, using an electrical interconnect that conductively bonds to one or more hidden tap contact pads located only at the edge of the back surface metallization pattern of the solar cell . Alternatively, the hidden taps can be established with interconnects extending substantially the entire length of the solar cell (perpendicular to the long axis of the supercell) to the solar cell length in the back surface metallization pattern Conductively bond to multiple hidden tap contact pads distributed along.

  FIG. 31A shows an exemplary solar cell back surface metallization pattern 3300 suitable for use with edge connected hidden taps. The metallized pattern comprises a continuous aluminum electrical contact 3310, a plurality of silver contact pads 3315 arranged parallel to and adjacent to the long edge of the back of the solar cell, a short side of the back of the solar A silver hidden tap contact pad 3320 is disposed parallel to one of the adjacent edges. When the solar cells are disposed in the supercell, the contact pads 3315 overlap the front surfaces of adjacent rectangular solar cells and are directly bonded. The interconnect may be conductively bonded to one or the other of the hidden tap contact pads 3320 to provide a hidden tap to the supercell. (If desired, two such interconnects may be employed to provide two hidden taps.)

  In the arrangement shown in FIG. 31A, the flow of current to the hidden taps passes through the back side cell metallization substantially parallel to the long side of the solar cell to reach the interconnection junction (contact 3320). The resistance of the back side metallized sheet is preferably less than or equal to about 5 ohms / square, or less than or equal to about 2.5 ohms / square, to facilitate current flow along this path.

  FIG. 31B illustrates another exemplary solar cell back surface metallization pattern 3301 suitable for use with a hidden tap that employs bus-like interconnects along the back surface length of the solar cell. The metallized pattern comprises a continuous aluminum electrical contact 3310, a plurality of silver contact pads 3315 arranged parallel to and adjacent to the long edge of the back face of the solar cell, and the long side of the solar cell And a plurality of silver hidden tap contact pads 3325 arranged in parallel rows and approximately centered on the back surface of the solar cell. An interconnect extending substantially the entire length of the solar cell can be conductively bonded to the hidden tap contact pad 3325 to provide a hidden tap to the supercell. Current flow to the hidden taps is primarily through the bus-like interconnects, making the conductivity of the back surface metallization pattern less important to the hidden taps.

  The location and number of hidden tap contact pads on the backside of the solar cell's hidden tap interconnect affect the length of the current path through the solar cell's backside metallization, the hidden tap contact pad, and the interconnect. give. As a result, the placement of the hidden tap contact pads can be selected to minimize the resistance to current collection in and through the hidden tap interconnects. In addition to the configuration shown in FIGS. 31A-31B (and FIG. 31C described below), suitable hidden tap contact pad arrangements may include, for example, a two-dimensional array and rows extending perpendicular to the long axis of the solar cell. . In the latter case, a row of hidden tap contact pads may be located, for example, adjacent to the short edge of the first solar cell.

  FIG. 31C shows another exemplary solar cell suitable for use with either the edge connecting hidden taps along the length of the back face of the solar cell, or the hidden taps that employ bus-like interconnects. A back surface metallized pattern 3303 is shown. The metallized pattern is connected to a continuous copper contact pad 3315 and a contact pad 3315 arranged parallel to and adjacent to the long edge of the rear face of the solar cell, and extending vertically from the contact pad 3315 Copper fingers 3317 and a continuous copper bus hidden tap contact pad 3325 extending parallel to the long side of the solar cell and approximately centered on the back surface of the solar cell. An edge-connecting interconnect can be bonded to the end of copper bus 3325 to provide a hidden tap to the supercell. (If desired, two such interconnects may be employed at both ends of copper bus 3325 to provide two hidden taps.) Alternatively, over substantially the entire length of the solar cell Extending interconnects can be conductively bonded to copper bus 3325 to provide a hidden tap to the supercell.

  The interconnects employed to form the hidden taps may be joined to the hidden tap contact pads in the back side metallization pattern in a soldering, welding, conductive adhesive, or any other suitable manner. For metallization patterns that employ silver pads as illustrated in FIGS. 31A-31B, the interconnects can be formed, for example, from tin-coated copper. Another approach is directly to the rear contact 3310 made of aluminum, for example by means of an aluminum conductor forming an aluminum-aluminum bond, which can be formed by electrical or laser welding, soldering or conductive adhesive, for example. Is to establish a hidden tap. In certain embodiments, the contact may include tin. In the case just described, the back side metallization of the solar cell may not have silver contact pads 3320 (FIG. 31A) or 3325 (FIG. 31B), but may be edge-connected or bus-like aluminum Interconnects may be bonded to aluminum (or tin) contacts 3310 at locations corresponding to the contact pads.

  Differential thermal expansion between the hidden tap interconnect (or interconnect to the front or back supercell end contact) and the silicon solar cell, and the resulting solar cell and interconnect Stress can lead to tears and other forms of failure that can degrade the performance of the solar module. As a result, the hidden taps and other interconnects are desirably configured to accommodate such differential expansion without the appearance of substantial stress. The interconnect is formed of, for example, a high ductility material (eg, soft copper, very thin copper plate) to provide a low thermal expansion coefficient material (eg, Kovar, Invar, or other, low thermal expansion) Adapted to differential thermal expansion between the interconnect and the silicon solar cell by being formed from an iron-nickel alloy) or from a material having a thermal expansion coefficient approximately matching that of silicon By incorporating in-plane geometric magnification features such as slits, slots, holes or truss structures and / or out-of-plane geometry such as kinks, jogs or dimples to accommodate such differential thermal expansion Adoption of features can provide stress and thermal expansion relief. Bonding to the hidden tap contact pad (or bonding to the front or back end contact pad of the supercell as described below), a portion of the interconnect has a thickness, for example, less than about 100 microns, about Less than 50 microns, less than about 30 microns, or less than about 25 microns may enhance the flexibility of the interconnect.

  Referring back to FIGS. 7A, 7B-1 and 7B-2, these figures adopt stress relaxation geometry features and are for use as interconnects for hidden taps, or front or back supercell ends. 7 illustrates some exemplary interconnection configurations identified by reference numerals 400A-400U, which may be suitable for electrical connection to contacts. The length of these interconnects is typically approximately equal to the length of the long side of the rectangular solar cells to which they are connected, but may be any other suitable length. The example interconnects 400A-400T shown in FIG. 7A employ various in-plane stress relaxation features. The exemplary interconnect 400U shown in the in-plane (xy) view of FIG. 7B-1 and in the out-of-plane (xz) view of FIG. 7B-2 is as an out-of-plane stress relief feature in thin metal ribbons. A bent portion 3705 is adopted. Bends 3705 reduce the apparent tensile stiffness of the ribbon metal. The bends allow the ribbon material to bend locally instead of only being elongated when the ribbon is under tension. For thin ribbons, this can reduce the apparent tensile stiffness substantially, for example, by 90% or more. The exact amount of decrease in apparent tensile stiffness depends on several factors, including the number of bends, the geometry of the bends, and the thickness of the ribbon. The interconnects may also be employed in combination with in-plane and out-of-plane stress relief features.

  Figures 37A-1 to 38B-2, described further below, employ in-plane and / or out-of-plane stress relaxation geometry features and may be suitable for use as edge-connecting interconnects for hidden taps. Fig. 6 illustrates some exemplary interconnection configurations.

  Hidden tap interconnect buses may be utilized to reduce or minimize the number of extending conductors needed to connect each hidden tap. In this approach, hidden tap contact pads of adjacent supercells are connected to each other by using a hidden tap interconnect. (The electrical connections are typically positive-negative, or negative-negative, ie, of the same polarity at each end.)

  For example, FIG. 32 shows a first hidden tap interconnect that extends across substantially the entire width of the solar cell 10 in the first supercell 100 and conductively bonds to the hidden tap contact pad 3325 positioned as shown in FIG. 31B. A second hidden tap interconnect 3400 and a second hidden tap interconnect that extends across the full width of the corresponding solar cell in supercell 100 in an adjacent row and is similarly conductively joined to the hidden tap contact pad 3325 disposed as shown in FIG. 31B. And 3400 are shown. The two interconnects 3400 are arranged side by side and optionally abutting or overlapping each other, in conductive junction with each other or in other cases electrically connected, and two adjacent super It can form a bus interconnecting the cells. This scheme can be extended across additional rows of supercells (eg, all rows), as desired, to form parallel segments of solar modules that include multiple segments of several adjacent supercells. It can. FIG. 33 shows a perspective view of a portion of the supercell of FIG.

  FIG. 35 shows that the supercells in adjacent rows extend into the gaps between the supercells to the hidden tap contact pads 3320 on one supercell and the other hidden tap contact pads 3320 on the other supercell. An example of interconnection by a short interconnection 3400 that is conductively bonded to the Here, the contact pads are arranged as shown in FIG. FIG. 36 shows that short interconnects extend into the gap between two supercells in adjacent rows, and at the end of the central copper bus portion of the back surface metallization on one supercell and the other A similar arrangement is shown with conductive bonding to the adjacent end of the central copper bus portion of the back side metallization of the cell. Here, the copper back side metallization is configured as shown in FIG. 31C. In both these examples, the interconnection scheme may be extended across additional rows (e.g., all rows) of supercells, as desired, to extend multiple segments of several adjacent supercells. It can form parallel segments of the solar modules that it contains.

  37A-1 through 37F-3 show in-plane (xy) and out-of-plane (xz) views of an exemplary short hidden tap interconnect 3400 including in-plane stress relaxation features 3405. FIG. (The xy plane is the plane of the back surface metallized pattern of the solar cell.) In the example of FIGS. 37A-1 to 37E-2, each interconnect 3400 is opposed to one or more in-plane stress relaxation features. It includes tabs 3400A and 3400B positioned on the mating side. Exemplary in-plane stress relief features include one, two or more hollow diamond-shaped arrangements, zig-zag, and one, two or more slot arrangements.

  The term "in-plane stress relief feature" as used herein may also refer to the thickness or ductility of an interconnect or of a portion of an interconnect. For example, the interconnect 3400 shown in FIGS. 37F-1 to 37F-3 may have a straight, flat length, thickness T in the x-y plane, for example, less than or equal to about 100 microns, Formed from a thin copper ribbon or copper foil thinner than or equal to about 50 microns, thinner than or equal to about 30 microns, or thinner than or equal to about 25 microns, to provide interconnect flexibility Increase. The thickness T may be, for example, about 50 microns. The interconnect length L may be, for example, about 8 centimeters (cm), and the interconnect width W may be, for example, about 0.5 cm. 37F-3 and 37F-1 show front and back views, respectively, of the interconnect in the xy plane. The front of the interconnect faces the back of the solar module. The interconnect may extend across the gap between two parallel supercell rows in the solar module so that a portion of the interconnect may be visible through the gap from the front of the solar module. Optionally, the visible portion of the interconnect may be blackened, for example coated with a black polymer layer to reduce its visibility. In the illustrated example, the central portion 3400C of the front of the interconnect having a length L2 of about 0.5 cm is coated with a thin black polymer layer. Typically, L2 is greater than or equal to the width of the gap between the supercell rows. The black polymer layer may have a thickness of, for example, about 20 microns. Such thin copper ribbon interconnects are optional and may also employ in-plane or out-of-plane stress relief features as described above. For example, the interconnect may include a stress relief out-of-plane bend as described above in connection with FIGS. 7B-1 and 7B-2.

  38A-1 through 38B-2 show in-plane (xy) and out-of-plane (x-z) views of an exemplary short hidden tap interconnect 3400 including out-of-plane stress relief features 3407. FIG. In these examples, each interconnect 3400 includes tabs 3400A and 3400B positioned on opposite sides of one or more out-of-plane stress relief features. Exemplary out-of-plane stress relief features include one, two or more bend arrangements, kinks, dimples, jogs, or bumps.

  Types and arrangements of stress relaxation features illustrated in FIGS. 37A-1 to 37E-2, and 38A-1 to 38B-2, and the interconnections described above in connection with FIGS. 37F-1 to 37F-3. Ribbon thickness may also be employed, as appropriate, in long hidden tap interconnects as described above, and in interconnects joining to the back or front end contacts of the supercell. The interconnect may include a combination of both in-plane and out-of-plane stress relief features. The in-plane and out-of-plane stress relief features are designed to reduce or minimize the effects of strain and stress on the joints of the solar cell, thereby forming a reliable, resilient electrical connection.

  39A-1 and 39A-2 illustrate example short hidden tap interconnects that improve automation, ease of manufacture, and placement accuracy, including battery contact pad alignment and supercell edge alignment features. Show a typical configuration. 39B-1 and 39B-2 illustrate an exemplary configuration of a short hidden tap interconnect including asymmetric tab lengths. Such asymmetric interconnections may be used in the opposite orientation to avoid overlapping of conductors extending parallel to the long axis of the supercell. (See the description of FIGS. 42A-42B below.)

  Hidden taps as described herein may form the required electrical connections in the layout of the module to provide the desired module electrical circuit. Hidden tap connections may be established, for example, at intervals of 12, 24, 36, or 48 solar cells along the supercell, or at any other suitable interval. The spacing between the hidden taps may be determined depending on the application.

  Each supercell typically includes a front end contact at one end of the supercell and a back end contact at the other end of the supercell. In variations where the supercell extends across the length or width of the solar module, these end contacts are located adjacent to opposite edges of the solar module.

  A flexible interconnect may be conductively bonded to the front or back end contacts of the supercell to electrically connect the supercell to other solar cells or to other electrical components in the module. For example, FIG. 34A shows a cross-sectional view of an exemplary solar module with interconnect 3410 conductively bonded to the back end contact at the end of the supercell. The back end contact interconnect 3410 may, for example, have a thickness in a direction perpendicular to the surface of the solar cell it is bonded of less than or equal to about 100 microns, less than or equal to about 50 microns, Copper ribbons or foils smaller than or equal to about 30 microns, smaller than or equal to about 25 microns, or thinner may be included to enhance the flexibility of the interconnect. The interconnect may have a width in the direction perpendicular to the flow of current through the interconnect, for example, greater than or equal to about 10 mm, in the plane of the surface of the solar cell to improve conductivity. As shown, the back end contact interconnect 3410 may lie behind the solar cell with no portion of the interconnect extending beyond the supercell in a direction parallel to the supercell row.

  Similar interconnects can be used to connect to the front end contacts. Alternatively, to reduce the area of the front of the solar module occupied by the front end interconnects, the front interconnects provide higher conductivity with thin flexible portions that bond directly to the supercell And may include thicker portions. This arrangement reduces the width of the interconnects required to achieve the desired conductivity. The thicker portion of the interconnect may be, for example, an integral part of the interconnect, or may be a separate piece joined to the thinner portion of the interconnect. For example, FIGS. 34B-34C show cross-sectional views of an exemplary interconnect 3410 conductively bonded to the front end contact at the end of the supercell, respectively. In both instances, the thin flexible portion 3410A of the interconnect, which is directly bonded to the supercell, has a thickness in the direction perpendicular to the surface of the solar cell to which it is bonded less than about 100 microns, Or equal to, less than about 50 microns, or equal to, less than about 30 microns, or equal to, or less than about 25, or include a thin copper ribbon or foil. The thicker copper ribbon portion 3410B of the interconnect bonds to the thinner portion 3410A to improve the conductivity of the interconnect. In FIG. 34B, the electrically conductive tape 3410C on the back of the thin interconnect portion 3410A bonds the thin interconnect portion to the supercell and to the thick interconnect portion 3410B. In FIG. 34C, thin interconnect portion 3410A is bonded to thick interconnect portion 3410B by electrically conductive adhesive 3410D and is bonded to the supercell by electrically conductive adhesive 3410E. The electrically conductive adhesives 3410D and 3410E may be the same or different. Electrically conductive adhesive 3410E may be, for example, a solder.

  The solar module described herein includes a laminated structure as shown in FIG. 34A with the supercell and one or more encapsulant materials 3610 sandwiched between the transparent front sheet 3620 and the back sheet 3630. obtain. The transparent front sheet can be, for example, glass. The backsheet may also be glass or any other suitable material. An additional strip of encapsulant may be disposed between the back end interconnect 3410 and the back of the supercell as shown.

  As mentioned above, the hidden tap brings beauty to the "all black" module. Since these connections are typically established with highly reflective conductors, they will usually have high contrast to the attached solar cells. However, by forming connections on the back side of the solar cell, and by routing other conductors in the solar module circuit to the back of the solar cell, various conductors are hidden from view. This allows multiple connection points (hidden taps) while still maintaining an "all black" appearance.

  Hidden taps can be used to form various module layouts. In the example of FIG. 40 (physical layout) and FIG. 41 (electrical circuit diagram), the solar module comprises six supercells, each extending along the length of the module. Hidden tap contact pads and short interconnects 3400 segment each supercell into thirds and electrically connect adjacent supercell segments in parallel, thereby making three groups of parallel connected supercells Segments are formed. Each group is connected in parallel with a different one of the bypass diodes 1300A-1300C embedded (embedded therein) in the stack of modules. The bypass diode may, for example, be located directly behind the supercell or between the supercells. The bypass diode may be located approximately along the centerline of the solar module, eg, parallel to the long side of the solar module.

  In the example of FIGS. 42A-42B (which also corresponds to the electrical schematic of FIG. 41), the solar module includes six supercells, each extending along the length of the module. Hidden tap contact pads and short interconnects 3400 segment each supercell into thirds and electrically connect adjacent supercell segments in parallel, thereby making three groups of parallel connected supercells Segments are formed. Each group is located behind the supercell, and bypass diodes 1300A-1300C through bus connections 1500A-1500C, connecting the hidden tap contact pads and short interconnects to bypass diodes located on the back of the modules in the junction box. Connect in parallel with one of the different ones.

  FIG. 42B provides a detailed view of the connection of short hidden tap interconnect 3400 with conductors 1500B and 1500C. As depicted, these conductors do not overlap one another. In the example shown, this is made possible by the use of asymmetric interconnections 3400 arranged in opposite directions. An alternative approach to avoiding conductor overlap is to employ a first symmetrical interconnect 3400 with tabs of a certain length and a second symmetrical interconnect 3400 with tabs of a different length.

  In the example of FIG. 43 (which also corresponds to the electrical circuit diagram of FIG. 41), the solar module is configured similar to that shown in FIG. 42A. The difference is that the hidden tap interconnect 3400 forms a continuous bus that extends across substantially the entire width of the solar module. Each bus may be a single long interconnect 3400 conductively bonded to the back surface metallization of each supercell. Alternatively, the busses may each extend across a single supercell, conductively connect to each other, or otherwise electrically interconnect as described above in connection with FIG. It may include individual interconnects. FIG. 43 shows a supercell end interconnect 3410 forming a continuous bus along one end of the solar module to electrically connect the front end contacts of the supercell, and along the opposite end of the solar module. An additional supercell end interconnect 3410 is also shown forming a continuous bus to electrically connect the back end contacts of the supercell.

  The exemplary solar modules of FIGS. 44A-44B also correspond to the electrical schematic of FIG. This example includes a short hidden tap interconnect 3400 as in FIG. 42A and interconnects 3410 as in FIG. 43 forming a continuous bus for the supercell front and back end contacts. adopt.

  In the example of FIG. 47A (physical layout) and FIG. 47B (electrical circuit diagram), the solar module comprises six supercells, each extending along the entire length of the solar module. Hidden tap contact pads and short interconnects 3400 segment each supercell into 2/3 long sections and 1/3 long sections. The interconnections 3410 at the lower edge of the solar module (in the depiction of the drawing) have 3 lines on the left side parallel to each other, 3 lines on the right side parallel to each other, and 3 lines on the left side to the right Interconnected in series with the three lines of. This arrangement forms three groups of parallel connected supercell segments each having a length of 2/3 of the supercell length. Each group is connected in parallel with a different one of bypass diodes 2000A-2000C. This arrangement provides about twice the voltage that would be provided by the same supercell and about half the current that would be provided if the same supercell were instead electrically connected as shown in FIG. Do.

  As described above with reference to FIG. 34A, the interconnects that join the supercell back end contacts lie entirely behind the supercell and can be hidden from view from the front (solar) side of the solar module. The interconnects 3410 joining the supercell front end contacts may be visible in the back view of the solar module (eg, as in FIG. 43). Because they extend beyond the end of the supercell (eg, as in FIG. 44A), or because they fold around the end of the supercell and below the same end. It is.

  The use of hidden taps facilitates reducing the number of solar cells grouped per bypass diode. In the example of FIGS. 48A-48B (each showing a physical layout), the solar module includes six supercells, each extending along the length of the module. Hidden tap contact pads and short interconnects 3400 segment each supercell by 5 and electrically connect adjacent supercell segments in parallel, thereby providing five groups of parallel connected supercell segments Is formed. Each group is connected in parallel with a different one of the bypass diodes 2100A-2100E embedded (embedded therein) in the stack of modules. The bypass diode may, for example, be located directly behind the supercell or between the supercells. A supercell end interconnect 3410 forms a continuous bus along one end of the solar module to electrically connect the front end contacts of the supercell, and an additional supercell end interconnect 3410 is a solar module Forming a continuous bus along the opposite end of the to electrically connect the back end contacts of the supercell. In the example of FIG. 48A, a single junction box 2110 electrically connects to the front and back end interconnect busses by conductors 2115A and 2115B. However, since there is no diode in the junction box, alternatively (FIG. 48B), the long return conductors 2215A and 2115B may be removed, and a single junction box 2110 may, for example, be located at two opposing edges of the module. Are replaced by two unipolar (+ or-) junction boxes 2110A-2110B. This eliminates resistive losses in long return conductors.

  Although the examples described herein use hidden taps to electrically segment each supercell into three or five solar cell groups, these examples are intended to be illustrative and not limiting. It is done. More generally, the hidden taps can be super-sized to be more or less solar cell groups shown and / or more or less solar cells shown per group. It can be used to electrically segment the cell.

  In the normal operation of the solar modules described herein, with no forward biased and conducting bypass diode, little or no current flows through any hidden tap contact pads. Instead, current flows through the length of each supercell through cell-cell conductive junctions formed between adjacent and overlapping solar cells. In contrast, FIG. 45 shows the current flow when a portion of the solar module is bypassed through a forward biased bypass diode. As indicated by the arrows, in this example, the current of the leftmost supercell flows along the supercell until it reaches the tap-connected solar cell, and then the back side metallization of the same solar cell, Hidden tap contact pad (not shown), interconnect 3400 to a second solar cell in an adjacent supercell, another hidden tap contact pad (on the second solar cell) to which the same interconnect is attached Not shown), through the back side metallization of the second solar cell, through additional hidden tap contact pads, interconnects, and the back side metallization of the solar cell to the bus connection 1500 to the bypass diode To reach. The flow of current through the other supercells is similar. As is apparent from the illustration, under such circumstances, the hidden tap contact pads conduct current from two or more supercell rows, thus, with any single solar cell in the module It can conduct current larger than the generated current.

  Typically, there are no bus bars, contact pads, or other light blocking elements (other than front metallized fingers or overlapping portions of adjacent solar cells) on the front of the solar cell opposite the hidden tap contact pads. As a result, when the hidden tap contact pad is formed of silver on a silicon solar cell, the light conversion efficiency of the solar cell in the area of the hidden tap contact pad is such that the silver contact pad prevents back side carrier recombination It can be reduced if the effects of the back surface field are reduced. To avoid this loss of efficiency, typically most of the solar cells in the supercell do not include hidden tap contact pads. (For example, in some variations, only solar cells that require a hidden tap contact pad for bypass diode circuitry will include such a hidden tap contact pad. In addition, includes a hidden tap contact pad To match the current generation of the solar cell with the current generation of the solar cell without the hidden tap contact pad, the solar cell including the hidden tap contact pad has a larger collection area than the solar cell without the hidden tap contact pad It can have

  Individual hidden tap contact pads may have, for example, a rectangular dimension less than or equal to about 2 mm, or less than or equal to about 5 mm.

  Solar modules undergo thermal cycling as a result of temperature changes during operation and during testing and in the environment in which they are installed. As shown in FIG. 46A, as a result of the thermal expansion mismatch between the silicon solar cells in the supercell and other parts of the module, such as the glass front sheet of the module, during such temperature cycling. There will be relative movement between the supercell and these other parts of the module, along the long axis of the supercell row. This mismatch tends to stretch or compress the supercell and can damage the solar cells or the conductive junctions between the solar cells in the supercell. Similarly, as shown in FIG. 46B, as a result of the thermal expansion mismatch between the interconnects joining the solar cells and the solar cells during temperature cycling, in a direction perpendicular to the plurality of supercell rows. The relative movement between the same interconnect and the solar cell will occur. This mismatch can pull and damage the solar cells, the interconnects, and the conductive junctions between them. This can occur for interconnects joining to the hidden tap contact pads and for interconnects joining to the supercell front or back end contacts.

  Similarly, the cyclic mechanical loading of the solar modules, for example during transport or from weather (for example wind and snow), at cell-to-cell junctions in the supercell, and interconnects with the solar cells Local shear forces can be generated at the joints between the parts. These shear forces can also damage the solar module.

  Conductive adhesive used to bond adjacent and overlapping solar cells together to prevent problems arising from relative motion between the supercell and the other parts of the solar module along the long axis of the supercell row The agent thermally expands between the supercell and the glass front sheet of the module in a direction parallel to the rows in a temperature range of about -40.degree. C. to about 100.degree. C. without damaging the solar modules. Can be selected to form a flexible conductive junction 3515 (FIG. 46A) between overlapping solar cells, which provides the supercell with mechanical compliance that accommodates the. The conductive adhesive may be, for example, less than or equal to about 100 megapascals (MPa), less than or equal to about 200 MPa, or less than about 300 MPa, or under standard test conditions (ie, 25 ° C.) Equal thereto, lower than or equal to about 400 MPa, lower than or equal to about 500 MPa, lower than or equal to about 600 MPa, lower than or equal to about 700 MPa, lower than or equal to about 800 MPa, or about 900 MPa It may be selected to form a conductive bond having a lower, or equal, or less than or equal to about 1000 MPa stiffness. Multiple flexible conductive junctions between overlapping and adjacent solar cells can accommodate, for example, differential movement greater than or equal to about 15 microns between each cell and the glass front sheet. Suitable conductive adhesives may include, for example, ECM 1541-S3, available from Engineered Conductive Materials LLC.

  A supercell that reduces the risk of damage to the solar module from hot spots that may occur during operation of the solar module if the solar cells in the solar module are reverse biased due to shadows or for any other reason For example, the thermal conductivity in the direction perpendicular to the solar cell is about 1.5 W /, for example, the thickness in the direction perpendicular to the solar cell is less than or equal to about 50 microns. A conductive junction between overlapping and adjacent solar cells may be formed, which is higher than or equal to (meter-K).

  The conductive adhesive used to bond the interconnect to the solar cell damages the solar module to prevent problems arising from relative motion between the interconnect and the solar cell to which it is bonded The solar cells and the interconnects are sufficiently hard to accommodate the thermal expansion mismatch between the solar cells and the interconnects, without a temperature range of about -40 ° C to about 180 ° C. May be selected to form a conductive junction between The conductive adhesive is, for example, higher than or equal to about 1800 MPa, higher than or equal to about 1900 MPa, higher than or equal to about 2000 MPa, at standard test conditions (ie 25 ° C.) Greater than or equal to 2100 MPa, greater than or equal to about 2200 MPa, greater than or equal to about 2300 MPa, greater than or equal to about 2400 MPa, greater than or equal to about 2500 MPa, or greater than about 2600 MPa, or Equal thereto, greater than or equal to about 2700 MPa, greater than or equal to about 2800 MPa, or greater than about 2900 MPa, or about 3000 MP Higher than or equal to, higher than or equal to about 3100 MPa, higher than or equal to about 3200 MPa, higher than or equal to about 3300 MPa, higher than or equal to about 3400 MPa, or higher than about 3500 MPa or Equal rigidity higher than or equal to about 3600 MPa, higher than or equal to about 3700 MPa, higher than or equal to about 3800 MPa, higher than or equal to about 3900 MPa, or higher than or equal to about 4000 MPa It can be selected to form a conductive junction that it has. In such variations, the interconnect may withstand thermal expansion or contraction of the interconnect, for example, greater than or equal to about 40 microns. Suitable conductive adhesives may include, for example, Hitachi CP-450, and solder.

  Thus, the plurality of conductive junctions between overlapping adjacent solar cells in the supercell may utilize different conductive adhesives than the plurality of conductive junctions between the supercell and the flexible electrical interconnect. For example, the conductive bond between the supercell and the flexible electrical interconnect may be formed from solder, and the conductive bond between overlapping and adjacent solar cells may be formed from a non-solder conductive adhesive. In some variations, both conductive adhesives can be cured in a single process step, for example, with a process window of about 150 ° C. to about 180 ° C.

  The above description has focused on assembling multiple solar cells (which can be cut solar cells) on a common substrate. As a result of this, a module is formed.

  However, in order to collect a sufficient amount of solar energy to be useful, the installation typically comprises a large number of such modules that themselves will be assembled together. According to embodiments, a plurality of solar cell modules may also be assembled in a glazed manner to increase the area efficiency of the array.

  In certain embodiments, the module may include an upper conductive ribbon facing in the direction of solar energy and a lower conductive ribbon facing away from the direction of solar energy.

  The lower ribbon is buried below the battery. Thus, it does not block incident light and does not adversely affect the area efficiency of the module. In contrast, the upper ribbon is exposed and can block incident light, which can adversely affect efficiency.

  According to embodiments, the module itself may be fired, whereby the upper ribbon may be covered by neighboring modules. This square shaped module configuration may also provide additional area on the module for other elements without adversely affecting the final exposed area of the module array. Examples of modular elements that may be positioned in overlapping areas may include, but are not limited to, connection boxes (j-boxes) and / or bus ribbons.

  In a particular embodiment, the j-boxes of each adjacent tiled module are mated to achieve an electrical connection therebetween. This simplifies the construction of the array of ground-like modules by removing the wiring.

  In certain embodiments, the j-box may be enhanced by additional structural standoffs and / or combined with the standoffs. Such an arrangement can yield an integrated, inclined modular roof mount rack solution where the dimensions of the junction box determine the inclination. Such an embodiment may be particularly useful when the array of glazed modules is mounted on a flat roof.

  Super-Like Supercell is unique for module layout with respect to module level power management devices (eg, DC / AC micro-inverters, DC / DC module power optimizers, voltage intelligence and smart switches, and related devices) Create an opportunity. The main feature of the module level power management system is power optimization. Supercells as described and employed herein can generate higher voltages than traditional panels. In addition, the layout of the supercell module may further divide the module. Both higher voltages and further partitioning create potential benefits for power optimization.

  The present specification is arranged in a shed and electrically connected in series to form narrow supercells with supercells being arranged in multiple physically parallel rows within a solar module. Disclosed are highly efficient solar modules (i.e., solar panels) that include silicon solar cells. The supercell may have, for example, a length extending essentially over the entire length or width of the solar module, or two or more supercells may be arranged end to end in a row . Any supercell, for example, including in some variations at least 19 solar cells, and in particular variations more than or equal to 100 or more silicon solar cells It may include a number of solar cells. Each solar module has a conventional size and shape, and thus includes hundreds of silicon solar cells, which allows the supercells in a single solar module to be electrically interconnected, eg, about 90 volts. It may be possible to provide a direct current (DC) voltage of about 450 V or higher from (V).

  As discussed further below, this high DC voltage causes DC-to-AC conversion by an inverter (eg, a micro-inverter located on a solar module) to be DC Facilitate by eliminating or reducing the need for DC boost (raising DC voltage). Also, as described further below, high DC voltage allows DC / AC conversion to electrically connect to each other in parallel with high voltage DC output from two or more high voltage glazed solar cell modules It also facilitates the use of the arrangement implemented by the central inverter.

  Turning now to the drawings for a more detailed understanding of the solar modules described herein, FIG. 1 shows that the ends of adjacent solar cells overlap and form an electrical connection to form a supercell 100. FIG. 4 shows a cross-sectional view of a string of serially connected solar cells 10 arranged in a glazed state. Each solar cell 10 includes a semiconductor diode structure and a plurality of electrical contacts to the semiconductor diode structure. Thereby, the current generated in the solar cell 10 may be provided to the external load when the solar cell 10 is irradiated with light.

  In the example described herein, each solar cell 10 has a rectangular shape with a front (sun side) and back (shadow) side metallization pattern that provides electrical contact on opposite sides of the np junction. In the crystalline silicon solar cell, the front surface metallization pattern is disposed on the n-type conductivity semiconductor layer, and the back surface metallization pattern is disposed on the p-type conductivity semiconductor layer. However, other material systems, diode structures, physical dimensions, or electrical contact arrangements may be used where appropriate. For example, the front (sun side) side metallization pattern may be disposed on a p-type conductive semiconductor layer, and the back (shadow side) side metallization pattern may be disposed on an n-type conductive semiconductor layer.

  Referring back to FIG. 1, in the supercell 100, adjacent solar cells 10 electrically connect the front metallization pattern of one solar cell to the back metallization pattern of the adjacent solar cell in the area where they overlap. Conductingly bond to each other by an electrically conductive bonding agent. Suitable electrically conductive binders may include, for example, electrically conductive adhesives, electrically conductive adhesive films and tapes, and conventional solders.

  2A-2R illustrate an exemplary rectangular solar module 200 including six rectangular supercells 100 each having a length approximately equal to the length of the long side of the solar module. The supercells are arranged in six parallel rows, with the long side oriented parallel to the long side of the module. A similarly configured solar module may include more or less rows of supercells of such side lengths than shown in this example. In another variation, each supercell has a length approximately equal to the length of the short side of the rectangular solar module, with their long sides oriented parallel to the short side of the module, in parallel rows It can be arranged. In still other arrangements, each row may include two or more supercells electrically interconnected in series. The module may have short sides, eg, about 1 meter in length, and long sides, eg, about 1.5 to about 2.0 meters in length. Any other suitable shape (eg, square) and dimensions may also be used for the solar module.

  In some variations, the plurality of conductive junctions between overlapping solar cells may be formed in a plurality of parallel directions with the plurality of rows at a temperature range of about -40.degree. A plurality of supercells are provided with mechanical compliance that accommodates the thermal expansion mismatch between the supercell and the glass front sheet of the solar module.

  Each supercell in the illustrated example has a width equal to or approximately equal to one-sixth of the width of a 156 mm square or pseudo-square silicon wafer of conventional size, and a length of a square or pseudo-square wafer It includes 72 rectangular solar cells equal to or approximately equal to the width. More generally, the rectangular silicon solar cells employed in the solar modules described herein have, for example, a length equal to or approximately equal to the width of a square or pseudo-square silicon wafer of conventional size, For example, the width may be equal to or approximately equal to 1 / M of the width of a conventional sized square or pseudo-square wafer. M is any integer ≦ 20. M may be, for example, 3, 4, 5, 6 or 12. M may be greater than twenty. The supercell may include any suitable number of such rectangular solar cells.

  Supercells in a solar module 200 are interconnected in series by electrical interconnects (optionally, flexible electrical interconnects) or by module level power electronics as described below, a solar module of conventional size Can provide a higher voltage than before. The reason is that the just described method incorporates more cells per module than before. For example, a conventional sized solar module that includes a supercell made of silicon solar cells cut into 1/8 can include over 600 solar cells per module. In comparison, conventional sized solar modules, including conventional sized conventional interconnected silicon solar cells, typically include about 60 solar cells per module. Within conventional silicon solar modules, square or pseudo-square solar cells are interconnected, typically by copper ribbons, separated from one another to accommodate the interconnections. In such a case, cutting a square or pseudo-square wafer of conventional size into narrow rectangles will reduce the total amount of working solar cell area in the module, and thus the additional required. The inter-battery interconnections will cause module power to be reduced. In contrast, within the solar modules disclosed herein, the ground arrangement hides inter-cell electrical interconnections below the working solar cell area. As a result, the solar modules described herein have little or no tradeoff between module power and the number of solar cells (and the required interconnections between cells) within the solar module. Can provide a high output voltage without reducing the module output power.

  When all the solar cells are connected in series, the ground solar cell module as described herein may provide, for example, a DC voltage in the range of about 90 volts to about 450 volts, or higher. . As mentioned above, this high DC voltage may be advantageous.

  For example, a micro-inverter placed on or near the solar module may be used for module level power optimization and DC-AC conversion. Referring now to FIGS. 49A-49B, conventionally, the microinverter 4310 receives a 25V to 40V DC input from a single solar module 4300 and outputs a 230V AC output to match the grid to be connected. The microinverter typically includes two major components, DC / DC boost, and DC / AC inversion. DC / DC boost is used to increase the DC bus voltage required for DC / AC conversion, and is typically the most expensive and lossy (2% efficiency loss) component. As the solar modules described herein provide high voltage output, the need for DC / DC boost may be reduced or eliminated (FIG. 49B). This may reduce the cost of the solar module 200 and increase efficiency and reliability.

In a conventional arrangement using a central ("string") inverter rather than a micro-inverter, conventional low DC power solar modules electrically connect to each other and to the string inverter in series. The voltages generated by the strings of solar modules are equal to the sum of the individual module voltages, as the modules are connected in series. The allowed voltage range determines the maximum and minimum number of modules in the string. The maximum number of modules is set by the module voltage and the defined voltage limits. For example, N _max × V _oc <600 V (home standard in the United States) or N _max × V _oc <1,000 V (commercial standard). The minimum number of modules in series is set by the module voltage and the minimum operating voltage required by the string inverter. N _min × V _mp > V _Invertermin . String inverter (e.g., Fronius, powerOne or SMA inverters,) minimum operating voltage required by _{(V Invertermin)} is typically between about 180V and about 250V. Typically, the optimal operating voltage for string inverters is about 400V.

  A single high DC voltage ground solar cell module as described herein may optionally use a voltage greater than the minimum operating voltage required by the string inverter, with the optimal operating voltage of the string inverter. Or at a voltage close to it. As a result, the high DC voltage ground solar cell modules described herein may be electrically connected to the string inverters in parallel with one another. This avoids the requirement for string length of series connected modules which can complicate system design and installation. Also, in series connected strings of solar modules, the modules with the least current dominate, and the system may be different for the modules on different roof slopes, or as a result of wood shadows, If the module receives different illumination, it can not operate efficiently. Because the current through each solar module is independent of the current through the other solar modules, these problems can also be avoided by the parallel high voltage module configuration described herein. Furthermore, such an arrangement does not have to require module level power electronics, and thus can improve the reliability of the solar module, which is particularly important in the variant where the solar module is arranged on the roof possible.

  Referring now to FIGS. 50A-50B, as described above, the supercell may extend over approximately the entire length or width of the solar module. A hidden electrical tap connection point (from a front view) can be integrated into the solar module structure to allow electrical connection along the length of the supercell. This can be achieved by connecting the electrical conductor to the back surface metallization of the solar cell at the end or middle position of the supercell. Such hidden taps allow electrical segmentation of the supercell, bypass diodes of the supercell, or segments of the supercell, module-level power electronics (eg, micro-inverters, power optimizers, voltage intelligence and Interconnections to smart switches and related devices) or other components are possible. The use of hidden taps is further described in US Provisional Application No. 62 / 081,200, US Provisional Application No. 62 / 133,205, and US Application No. 14 / 674,983. Each of these is incorporated herein by reference in its entirety.

  In the example of FIG. 50A (exemplary physical layout) and FIG. 50B (exemplary electrical schematic), the illustrated solar modules 200 are each electrically connected in series to provide six high DC voltages. The supercell 100 is included. With each solar cell group electrically connected in parallel with a different bypass diode 4410, each supercell is electrically segmented by the hidden tap 4400 into several solar cell groups. In these examples, the bypass diode is disposed in the laminated structure of the solar module, ie, the solar cells are in the encapsulant between the front transparent sheet and the backing sheet. Alternatively, the bypass diode may be disposed in a junction box located on the back or edge of the solar module and interconnected to the hidden tap by the extending conductor.

  In the example of FIG. 51A (physical layout) and FIG. 51B (corresponding electrical schematic), the illustrated solar module 200 also includes six supercells 100 that are electrically connected in series to provide a high DC voltage. In this example, the solar modules are electrically segmented into three pairs of supercells in series with each pair of supercells being electrically connected in parallel with a different bypass diode. In the present example, the bypass diode is disposed in the junction box 4500 located on the rear surface of the solar module. The bypass diode may alternatively be located in the stacked structure of the solar module or in a junction box attached to the edge.

  In the example of FIGS. 50A-51B, in normal operation of the solar module, each solar cell is forward biased, and thus all bypass diodes are reverse biased and do not conduct. However, if one or more solar cells in a group are reverse biased at a sufficiently high voltage, then the bypass diode corresponding to that group is turned on and the current flow through the module is reverse biased It will bypass the solar cell. This prevents the formation of dangerous hot spots in shaded or faulty solar cells.

  Alternatively, the functionality of the bypass diode may be achieved in module level power electronics, for example in a micro-inverter placed on or near the solar module. (Module level power electronics, and their use may also be referred to herein as module level power management devices or systems, and module level power management. Such modules optionally integrated with solar modules Power electronics from the supercell group (eg, by operating a supercell group, a supercell, or a supercell segment in an electrically segmented supercell at its maximum power point) The power from each supercell or from each individual supercell segment may be optimized, thereby enabling individual power optimization within the module. Module-level power electronics may be used to determine when to bypass one or more specific individual supercells and / or one or more specific supercell segments. It can eliminate the need.

  This can be achieved, for example, by integrating voltage intelligence at the module level. By monitoring the voltage output of a solar cell circuit (eg, one or more supercells, or a segment of a supercell) within a solar module, the “smart switch Power management devices can be determined. If a reverse biased solar cell is detected, the power management device can disconnect the corresponding circuit from the electrical system, for example using a relay switch or other component. For example, if the voltage of the solar cell circuit being monitored falls below a predetermined threshold, the power management device will shut off that circuit (open the circuit). The predetermined threshold may be, for example, a certain percentage or magnitude (eg, 20% or 10V) as compared to the normal operation of the circuit. Examples of such voltage intelligence may be incorporated into existing module level power electronics products (eg from Enphase Energy Inc., Solaredge Technologies, Inc., Tigo Energy, Inc.) or through custom circuit design. obtain.

  FIG. 52A (physical layout) and FIG. 52B (corresponding electrical schematic) show an exemplary structure of module level power management of a high voltage solar module including a scaly supercell. In this example, the rectangular solar module 200 includes six rectangular scaly supercell 100 arranged in six rows extending the length of the long side of the solar module. The six supercells are electrically connected in series to provide a high DC voltage. Module level power electronics 4600 may perform voltage sensing, power management, and / or DC / AC conversion of the entire module.

  FIG. 53A (physical layout) and FIG. 53B (corresponding electrical schematic) show another exemplary structure of module level power management of a high voltage solar module including a scaly supercell. In this example, the rectangular solar module 200 includes six rectangular scaly supercell 100 arranged in six rows extending the length of the long side of the solar module. The six supercells are electrically grouped into three pairs of series connected supercells. Each pair of supercells can independently perform voltage sensing and power optimization on individual pairs of supercells, of which two or more may be connected in series to provide a high DC voltage, and And / or connect to module level power electronics 4600 that may implement DC / AC conversion.

  FIG. 54A (physical layout) and FIG. 54B (corresponding electrical schematic) show another exemplary structure of module level power management of a high voltage solar module including a scaly supercell. In this example, the rectangular solar module 200 includes six rectangular scaly supercell 100 arranged in six rows extending the length of the long side of the solar module. Each supercell may independently perform voltage sensing and power optimization for each supercell, of which two or more may be connected in series to provide a high DC voltage, and / or DC // Connect to module level power electronics 4600 that can perform AC conversion.

  FIG. 55A (physical layout) and FIG. 55B (corresponding electrical schematic) show another exemplary structure of module level power management of a high voltage solar module including a scaly supercell. In this example, the rectangular solar module 200 includes six rectangular scaly supercell 100 arranged in six rows extending the length of the long side of the solar module. Each supercell is electrically segmented by the hidden taps 4400 to be two or more solar cell groups. Each resulting solar cell group may independently perform voltage sensing and power optimization on each solar cell group, connecting multiple such groups in series to provide a high DC voltage, and / or Connect to module level power electronics 4600 that can perform DC / AC conversion.

  In some variations, two or more high voltage DC shingled solar cell modules as described herein are electrically connected in series and the high voltage converted to AC by the inverter Brings DC output. The inverter may be, for example, a micro-inverter integrated with one of the solar modules. In such cases, the micro-inverter can optionally be a component of module level power management electronics that also performs additional sensing and connection functions as described above. Alternatively, the inverters may be central "string" inverters as described further below.

  As shown in FIG. 56, when stringing multiple supercells in series in a solar module, adjacent supercell rows may be slightly offset in a staggered fashion from one another along their long axes. Can be This offsetting from one another saves module area (space / length) and streamlines manufacturing, while the adjacent ends of the supercell rows are on top of one supercell and the other supercell An electrical connection can be made in series by means of an interconnect 4700 joining to the bottom of the. Adjacent supercell rows may be offset by, for example, approximately 5 millimeters.

  Differential thermal expansion between electrical interconnects 4700 and silicon solar cells, and the resulting stresses on the solar cells and interconnects, can cause tears and other defects in the performance of the solar module Can lead to the form of As a result, it is desirable that the interconnect be flexible and be configured to accommodate such differential expansion without the appearance of substantial stress. The interconnect is formed of, for example, a high ductility material (eg, soft copper, very thin copper plate) to provide a low thermal expansion coefficient material (eg, Kovar, Invar, or other, low thermal expansion) Adapted to differential thermal expansion between the interconnect and the silicon solar cell by being formed from an iron-nickel alloy) or from a material having a thermal expansion coefficient approximately matching that of silicon By incorporating in-plane geometric magnification features such as slits, slots, holes or truss structures and / or out-of-plane geometry such as kinks, jogs or dimples to accommodate such differential thermal expansion Adoption of features can provide stress and thermal expansion relief. The conductive portion of the interconnect may have a thickness of, for example, less than about 100 microns, less than about 50 microns, less than about 30 microns, or less than about 25 microns to enhance the flexibility of the interconnect. (The generally low current in these solar modules allows the use of thin flexible and conductive ribbons without excessive power loss resulting from the electrical resistance of the thin interconnects.)

  In some variations, the conductive junctions between the supercell and the flexible electrical interconnect can be applied to the flexible electrical interconnect at a temperature range of about -40.degree. C. to about 180.degree. C. without damaging the solar module. , Adapts to the thermal expansion mismatch between the supercell and the flexible electrical interconnect.

  FIG. 7A (described above) shows several exemplary interconnection configurations identified by reference numerals 400A-400T, which employ in-plane stress relaxation geometry features, and is also a drawing (also described above). 7B-1 and 7B-2 show an exemplary interconnect configuration identified by reference numerals 400U and 3705, which employs out-of-plane stress relaxation geometry features. Any one of these interconnect configurations employing stress relaxation features or any combination thereof electrically interconnects the supercells in series as described herein to provide a high DC voltage It may be suitable for.

  The description related to FIGS. 51A-55B has focused on module level power management, possibly using DC / AC conversion of high DC module voltage by module level power electronics to provide AC output from the module. As mentioned above, DC / AC conversion of high DC voltage from a flat solar cell module as described herein may instead be performed by a central string inverter. For example, FIG. 57A includes light comprising a plurality of high DC voltage solar cell modules 200 electrically connected in parallel to string inverter 4815 via high DC voltage negative bus 4820 and high DC voltage positive bus 4810. An electromotive force system 4800 is schematically illustrated. Typically, each solar module 200 includes a plurality of scaly supercells that are electrically connected in series with the electrical interconnects to provide a high DC voltage, as described above. The solar module 200 may optionally include, for example, a bypass diode arranged as described above. FIG. 57B shows an exemplary placement of a photovoltaic system 4800 on the roof.

  In some variations of the photovoltaic system 4800, two or more short series connected strings of high DC voltage ground solar cell modules may be electrically connected in parallel with a string inverter. Referring back to FIG. 57A, for example, each solar module 200 can be replaced with a series connection string of two or more high DC voltage ground solar cell modules 200. This may be done, for example, to maximize the voltage provided to the inverter while complying with regulatory standards.

  Conventional solar modules typically produce about 8 amps Isc (short circuit current), about 50 Voc (open circuit voltage), and about 35 Vmp (maximum power point voltage). As described above, as described herein, including M times as many conventional solar cells (each having an area of about 1 / M as compared to the conventional solar cell area), as described herein Such high DC voltage ground solar cell modules roughly generate M times higher voltage and 1 / M current compared to conventional solar modules. As mentioned above, M may be any suitable integer, typically ≦ 20, but may be greater than 20. M may be, for example, 3, 4, 5, 6 or 12.

  When M = 6, the Voc of the high DC voltage ground solar cell module may be, for example, about 300V. By connecting two such modules in series, approximately 600 V DC will be provided to the bus. This is in accordance with the maximum set by the US Housing Standard. When M = 4, the Voc of the high DC voltage ground solar cell module may be, for example, about 200V. By connecting three such modules in series, approximately 600 V DC will be provided to the bus. When M = 12, the Voc of the high DC voltage ground solar cell module may be, for example, about 600V. Systems with bus voltages less than 600V can also be configured. In such variations, the high DC voltage ground solar cell modules may be combined, for example, in a combiner box, in pairs, or one in three, or any other suitable combination. To provide the optimum voltage to the inverter.

  The issue arising from the parallel configuration of the high DC voltage solar cell modules described above is that in the event of a short circuit in one solar module, another solar module potentially potentially shorts their power It can be thrown up (i.e., drive the current through the shorted module and dissipate the power in the shorted module), creating a hazard. This problem may be caused, for example, by the use of blocking diodes arranged to prevent other modules from driving current through the shorted module, the use of current limiting fuses, or current limiting fuses in combination with blocking diodes Can be avoided by the use of FIG. 57B schematically illustrates the use of two current limiting fuses 4830 on the positive and negative terminals of a high DC voltage ground solar cell module 200.

  The arrangement intended for the protection of blocking diodes and / or fuses may depend on whether the inverter includes a transformer. Systems using an inverter that includes a transformer typically ground the negative electrode conductor. Systems using a transformerless inverter typically do not ground the negative conductor. For transformerless inverters, it may be preferable to have a current limiting fuse alongside the positive terminal of the solar module and another current limiting fuse alongside the negative terminal.

  Blocking diodes and / or current limiting fuses can be mounted, for example, with each module in a junction box or in a module stack. Suitable junction boxes, blocking diodes (eg, side-by-side blocking diodes), and fuses (eg, side-by-side fuses) can include those available from Shoals Technology Group.

  FIG. 58A shows an exemplary high voltage DC ground solar cell module including a junction box 4840 in which a blocking diode 4850 is aligned with the positive terminal of the solar module. The junction box does not contain a current limiting fuse. This configuration may be preferably used in other places (eg, in the combiner box) in combination with one or more current limiting fuses located alongside the positive and / or negative terminals of the solar module (eg, See Figure 58D). FIG. 58B shows an exemplary high voltage DC shredded solar cell module that includes a junction box 4840 with a blocking diode aligned with the positive terminal of the solar module and a current limiting fuse 4830 aligned with the negative terminal. FIG. 58C illustrates an exemplary high voltage DC shredded solar cell module including a junction box 4840 with a current limiting fuse 4830 aligned with the positive terminal of the solar module and another current limiting fuse 4830 aligned with the negative terminal. Indicates FIG. 58D is an exemplary high voltage DC burn-out including a junction box 4840 configured as in FIG. 58A and a fuse located on the outside of the junction box alongside the positive and negative terminals of the solar module. FIG. 6 shows a flat solar cell module.

  Referring now to FIGS. 59A-59B, as an alternative to the configuration described above, all blocking diodes and / or current limiting fuses of the high DC voltage scaly solar cell module are mounted together in the combiner box 4860. It can be placed. In these variations, one or more individual conductors extend separately from each module into the combiner box. In one option, as shown in FIG. 59A. A single conductor of one polarity (e.g., negative as shown) is shared among all modules. In another option (FIG. 59B), both polarities have individual conductors of each module. Although FIGS. 59A-59B show only the fuses located within the combiner box 4860, any suitable combination of fuses and / or blocking diodes may be located within the combiner box. In addition, electronics may be implemented in the combiner box to perform other functions such as, for example, monitoring, tracking of the maximum power point, and / or individual modules or disconnection of groups of modules.

  The reverse bias operation of the solar module is shaded by one or more solar cells in the solar module or otherwise producing a small current, which the solar module corresponds to the small current solar cells This can occur when operating at a voltage-current point which drives a higher current that can be driven through the low current solar cell. Reverse biased solar cells can heat up and cause dangerous situations. For example, the parallel arrangement of high DC voltage square solar cell modules as shown in FIG. 58A may allow to protect the modules from reverse bias operation by setting the appropriate operating voltage of the inverter. This is illustrated, for example, in FIGS. 60A-60B.

  FIG. 60A shows a plot 4870 of current versus voltage and a plot 4880 of power versus voltage for a parallel connected string of approximately 10 high DC voltage square solar modules. These curves were calculated for models in which none of the solar modules included a reverse biased solar cell. Because the solar modules are electrically connected in parallel, they all have the same operating voltage and their currents are summed. Typically, an inverter changes the load on the circuit to explore on the power-voltage curve, identify the largest pole on that curve, and then operate the module circuit at that point to maximize output power. Turn

  In contrast, FIG. 60B shows the plot of current versus voltage 4890 and the power of the model system of FIG. 60A for the case where some of the solar modules in the circuit include one or more reverse biased solar cells. A plot 4900 of voltage versus voltage is shown. The reverse biased module has a knee transitioning from about 10 amps operation down to about 210 volts to about 16 amps less than about 200 volts in the exemplary current-voltage curve. Appears by the formation of a shape. At voltages less than about 210 volts, the shaded modules include reverse biased solar cells. The reverse biased module also appears in the power-voltage curve due to the two maxima, the absolute maxima at about 200 volts and the presence of the maxima at about 240 volts. The inverter recognizes such an indication of a reverse biased solar module and may be configured to operate the solar module at a voltage at an absolute maximum or maximum power point where no reverse bias is applied to any module. In the example of FIG. 60B, the inverter may operate the modules at maximum power points to ensure that no reverse bias is applied to any module. In addition, or alternatively, a minimum operating voltage may be selected for the inverter that is less likely to reverse bias any of the modules. The minimum operating voltage may be adjusted based on ambient temperature, operating current and other parameters such as calculated or measured solar module temperature and other information received from an external source, such as, for example, brightness.

  In some embodiments, the high DC voltage solar modules are themselves arranged in adjacent solar modules, optionally in an electrically interconnected manner, in a partially overlapping manner, It can be scalded. Such an optional configuration optionally provides a high DC voltage to the string inverter, for a parallel electrically connected high voltage solar module, or a microinverter to convert the solar module high DC voltage to an AC module output May be used for high voltage solar modules each containing The pair of high voltage solar modules may, for example, be ground and electrically connected in series to provide the desired DC voltage, as just described.

Conventional string inverters often 1) they must be able to accommodate different string lengths of modules in series connection, 2) some modules in a string are totally or partially It is necessary to have a fairly wide range of potential input voltages (or “dynamic range”), as 3) environmental temperature and radiation changes will change the module voltage. In a system employing a parallel structure as described in, the length of a string of solar modules connected in parallel does not affect the voltage, and some modules are partially shaded, If the shadow is not a shadow, decide to operate the system with the voltage of the unshaded module (eg, as described above) Thus, the input voltage range of the inverters in the parallel structure system may only be adapted to the "dynamic range" of the "temperature and radiation change" of element # 3, which is smaller, For example, about 30% of the conventional dynamic range required for the inverter, the inverter employed with the parallel structure system as described herein has a narrower range, eg, about 250 at standard conditions. For high temperature and low radiation between approximately 175 volts at high temperature and low radiation, or for example approximately 450 volts at normal conditions, approximately 350 volts at high temperature and low radiation (in this case 450 volts MPPT (maximum power point tracking) operation may have a MPPT between the lowest may correspond to the V _OC of less than 600 volts at a temperature of operation). in addition, as described above The inverter may receive a DC voltage sufficient to convert directly to AC without the boost stage, as a result, the string inverter employed with the parallel structure system as described herein is simpler They are less expensive and can operate at higher efficiencies than the string inverters employed in conventional systems.

  For both micro-inverters and string inverters employed with the high voltage direct current solar cell modules described herein, solar modules (or solar modules short) to eliminate the need for DC boost of the inverter It may be preferable to configure the series connection string) to provide an operating (eg, maximum power point Vmp) DC voltage that exceeds the peak-to-peak of AC. For example, for 120 V AC, the peak-to-peak is sqrt (2) * 120 V = 170 V. Thus, the solar module may be configured to provide a minimum Vmp of, for example, about 175V. The standard state Vmp may be approximately 212 V (assuming a negative voltage temperature coefficient of 0.35% and a maximum operating temperature of 75 ° C), and at the lowest temperature operating state (eg -15 ° C) Vmp is , (Depending on the module fill factor) may be about 242 V and thus Voc below about 300 V. For single-phase 120 V AC (or 240 V AC), all of these numbers are doubled, which is because 600 V DC is the largest allowable in the US for many residential applications. It is convenient. These numbers can be even larger for commercial applications where higher voltages are required and to allow it.

High voltage shingled solar cell modules as described herein may be configured to operate at> 600 V _OC or> 1000 V _OC , where the module is provided by the module It may include integrated power electronics that prevent the external voltage from exceeding defined requirements. Such an arrangement may allow the operating V _mp to be sufficient for single phase 120 V (240 V, about 350 V required) without problems with V _OC at low temperatures above 600 V.

  A solar module (for example, on the roof of a building) that provides electricity to the building (for example, on the roof of the building) still produces power if the sun shines, for example, if the building's connection to the grid is cut by a firefighter You can do it. A concern that arises from this is that such solar modules can cause the roof to remain at a dangerous voltage and "live" after disconnection of the building from the grid. To address this concern, the high voltage direct current solar cell modules described herein may optionally include disconnectors, for example, in or adjacent to the module junction box. The disconnects may be, for example, physical disconnects or solid state disconnects. The disconnector can be configured, for example, to be "normally OFF" to disconnect the high voltage output of the solar module from the roof circuit when it does not receive a particular signal (e.g., from an inverter). Communication to the disconnect can be made, for example, on a high voltage cable, through a separate wire, or wirelessly.

  An important advantage of the high voltage solar modules in the scallop is that heat is diffused between the solar cells in the scaly supercell. Applicants have discovered that heat can be easily transferred along the silicon supercell through thin electrical and thermally conductive junctions between adjacent and overlapping silicon solar cells. The thickness measured in the direction perpendicular to the front and back surfaces of the solar cells of the conductive junctions between adjacent overlapping solar cells formed by the electrically conductive bonding agent is, for example, less than or equal to about 200 microns , Or less than or equal to about 150 microns, or less than or equal to about 125 microns, or less than or equal to about 100 microns, or less than or equal to about 90 microns, or less than about 80 microns Small or equal to or less than about 70 microns or equal to or less than about 60 microns or equal to or less than about 50 microns or equal to or less than about 25 microns At the same it may be the same thickness. Such thin junctions reduce resistive losses in the interconnections between the cells and also facilitate heat flow along the supercell from any hot spots in the supercell that may appear during operation. . The thermal conductivity of the junction between the solar cells may be, for example, ≧ about 1.5 watts / (meter K). Furthermore, the rectangular aspect ratio of the solar cells typically employed herein enlarges the area of thermal contact between adjacent solar cells.

  In contrast, in conventional solar modules that employ ribbon interconnections between adjacent solar cells, the heat generated by one solar cell passes through the ribbon interconnections to the other solar cells in the module. It does not spread easily. This makes conventional solar modules more prone to hot spots than the solar modules described herein.

  Furthermore, the supercells described herein typically have rectangular solar cells each having a smaller active area (e.g., 1/6) than that of conventional solar cells. Thus, the current through the supercell in a solar module described herein is typically less than the current through a string of conventional solar cells.

  As a result, within the solar module disclosed herein, the amount of heat dissipated in the reverse biased solar cell at breakdown voltage is reduced, and the supercell and solar module without creating dangerous hot spots Heat can easily diffuse through.

  Several additional and optional features make the high voltage solar module employing the supercell as described herein more resistant to the heat dissipated in the reverse biased solar cell It is possible to have For example, the supercell can be encapsulated within an olefinic thermoplastic (TPO) polymer. TPO encapsulant is more stable to light and heat than standard ethylene vinyl acetate (EVA) encapsulant. EVA is browned with temperature and ultraviolet light, leading to issues with hot spots generated by cells that limit the current. In addition, the solar module may have a glass-glass structure in which the encapsulated supercell is sandwiched between a glass front sheet and a glass back sheet. Such glass-glass construction allows the solar module to operate safely at higher temperatures than conventional polymer backsheets can withstand. Furthermore, if present, the junction box may be mounted on one or more edges of the solar module rather than behind the solar module. Here the junction box will add an additional thermal isolation layer to the module solar cells above it.

  Thus, Applicants have determined that heat flow through the supercell may allow the module to operate without substantial risk associated with the reverse biased solar cell or cells. It has been recognized that high voltage solar modules formed from supercells as described herein may employ far fewer bypass diodes than employed in conventional solar modules. For example, in some variations, a high voltage solar module as described herein may have less than one bypass diode per 25 solar cells, less than one bypass diode per 30 solar cells, 50 Less than one bypass diode per solar cell, less than one bypass diode per 75 solar cells, less than one bypass diode per 100 solar cells, only a single bypass diode may be employed, or It is not necessary to employ a bypass diode.

  Referring now to FIGS. 61A-61C, an exemplary high voltage solar module utilizing bypass diodes is provided. The use of a bypass diode can prevent or reduce damage to the module if part of the solar module is shaded. With respect to the exemplary solar module 4700 shown in FIG. 61A, ten supercells 100 are connected in series. As shown, the ten supercells are arranged in parallel rows. Each supercell includes 40 serially connected solar cells 10, each of which is approximately 1/6 of a square or pseudo-square as described herein. It is done. In normal non-shadowed operation, current flows from and into junction box 4716 through each of the supercells 100 connected in series through connector 4715, after which current flows out through junction box 4717. Optionally, a single junction box can be used instead of separate junction boxes 4716 and 4717 so that the current returns to one junction box. The example shown in FIG. 61A shows an embodiment using approximately one bypass diode per supercell. As shown, a single bypass diode electrically connects between adjacent pairs of supercells at approximately the midpoint along the supercell (e.g., a single bypass diode 4901A is the first supercell). And the second bypass diode 4901 B is electrically connected between the second supercell and the third supercell. Connect, etc.). The first cell string and the last cell string have only about half the number of solar cells in the supercell per bypass diode. For the example shown in FIG. 61A, the first cell string and the last cell string include only 22 cells per bypass diode. For the high voltage solar module variation illustrated in FIG. 61A, the total number of bypass diodes (11) is equal to the number of supercells plus one additional bypass diode.

  Each bypass diode may, for example, be incorporated into a flex circuit. Referring now to FIG. 61B, an enlarged view of the bypass diode connection region of two neighboring supercells is shown. The view of FIG. 61B is viewed from the side where the sun does not hit. As shown, the two solar cells 10 on neighboring supercells are electrically connected using a flex circuit 4718 that includes a bypass diode 4720. Flex circuit 4718 and bypass diode 4720 are electrically connected to solar cell 10 using contact pads 4719 located on the back of the solar cell. (See also further discussion below for the use of hidden contact pads to provide hidden taps for bypass diodes.) An additional bypass diode electrical connection scheme reduces the number of solar cells per bypass diode. Can be adopted. An example is illustrated in FIG. 61C. As shown, one bypass diode electrically connects at approximately the midpoint along each supercell between each pair of neighboring supercells. A bypass diode 4901A electrically connects between neighboring solar cells on the first and second supercells, a bypass diode 4901B electrically connects between neighboring solar cells on the second and third supercell, and a bypass diode 4901 C make an electrical connection between neighboring solar cells on the third and fourth supercells, and so on. A second set of bypass diodes may be included to reduce the number of solar cells that would be bypassed if partial shadowing occurs. For example, a bypass diode 4902A is electrically connected between the first supercell and the second supercell at a midpoint between the bypass diode 4901A and the bypass diode 4901B, and a bypass diode 4902B is connected to the second supercell and the second supercell. Electrical connection between the three supercells and the middle point between bypass diode 4901B and bypass diode 4901C, etc., thereby reducing the number of cells per bypass diode. Optionally, yet another set of bypass diodes may be electrically connected to further reduce the number of solar cells bypassed if partial shadowing occurs. A bypass diode 4903A is electrically connected between the first supercell and the second supercell at a midpoint between the bypass diode 4902A and the bypass diode 4901B, and a bypass diode 4903B is connected between the second supercell and the third supercell. Electrical connection is made between the cells at a midpoint between the bypass diode 4902B and the bypass diode 4901C, which further reduces the number of cells per bypass diode. The result of this configuration is a nested configuration of bypass diodes that allow small groups of cells to be bypassed during partial shadowing. Additional diodes are thus electrically connected until the desired number of solar cells per bypass diode is achieved, for example about 8, about 6, about 4 or about 2 per bypass diode It can. In some modules, about four solar cells per bypass diode are desirable. If desired, one or more of the bypass diodes illustrated in FIG. 61C may be incorporated into the hidden flexible interconnect as illustrated in FIG. 61B.

  This specification discloses a solar cell cleavage tool and solar cell cleaving method that can be used, for example, to separate conventionally sized square or pseudo-square solar cells into multiple narrow rectangular or near rectangular solar cells. . These cleaving tools and methods draw a vacuum between the bottom surface and the curved support surface of a conventional size solar cell and move it to a curved support surface to bend the conventional size solar cell, thereby providing in advance Cleavage the solar cell along the scribe line. An advantage of these cleavage tools and methods is that they do not require physical contact with the top surface of the solar cell. As a result, these cleavage tools and methods can be employed to cleave solar cells that include soft and / or uncured materials on the top surface that can be damaged by physical contact. In addition, in some variations, these cleavage tools and methods may require contact with only a portion of the bottom surface of the solar cell. In such variations, these cleaving tools and methods may be employed to cleave a solar cell that includes a soft and / or uncured material on a portion of the bottom surface not contacted by the cleaving tool.

For example, one solar cell manufacturing method that utilizes the cleavage tools and methods disclosed herein is:
Laser scribing one or more scribe lines on each silicon solar cell of one or more conventionally sized silicon solar cells to define a plurality of rectangular regions on the one or more silicon solar cells;
Applying an electrically conductive adhesive to a portion of the top surface of the one or more silicon solar cells;
A vacuum is drawn between the bottom surface and the curved support surface of the one or more silicon solar cells to bend the one or more silicon solar cells toward the curved support surface, thereby along the one or more scribe lines Cleaving one or more silicon solar cells to provide a plurality of rectangular silicon solar cells each comprising a portion of the electrically conductive adhesive adhesive disposed on the front side adjacent to the long side. The conductive adhesive binder may be applied to conventional sized silicon solar cells either before or after the solar cells are laser scribed.

  The resulting plurality of rectangular silicon solar cells are arranged with the long sides of adjacent rectangular silicon solar cells side-by-side with some of the electrically conductive adhesive bonding between them and overlapping each other. It can be done. The electrically conductive bonding agent may then be cured to thereby bond adjacent and overlapping rectangular silicon solar cells together and electrically connect them in series. This process results in the formation of a glittering "supercell" as described in the patent applications listed in the "Cross-References to Related Applications" above.

  For a better understanding of the cleavage tools and methods disclosed herein, and looking now at the drawings, FIG. 20A shows a side view of an exemplary apparatus 1050 that can be used to cleave scribed solar cells. It is schematically illustrated. In the present apparatus, the scribed conventional size solar cell wafer 45 is carried by the perforated moving belt 1060 above the curved portion of the vacuum manifold 1070. As the solar cell wafer 45 passes over the curved portion of the vacuum manifold, the vacuum drawn through the perforations in the belt pulls the bottom of the solar cell wafer 45 toward the vacuum manifold, thereby bending the solar cell. The radius of curvature R of the curved portion of the vacuum manifold may be selected to cleave the solar cells along the scribe line to form a rectangular solar cell 10 by bending the solar cell wafer 45 in this manner. The rectangular solar cell 10 may be used, for example, in a supercell as illustrated in FIGS. 1 and 2. The solar cell wafer 45 can be cleaved by the present method without contacting the top surface of the solar cell wafer 45 to which the conductive adhesive binder has been applied.

  For each scribe line, cleaving is accomplished, for example, by arranging for the scribe line to be oriented at an angle θ relative to the vacuum manifold, such that one end reaches the curved portion of the vacuum manifold in front of the other end. Can be preferentially initiated at one end of the scribe line (ie, at one edge of the solar cell 45). As shown in FIG. 20B, for example, the solar cells have their scribe lines directed to the direction of movement of the belt and to the curved cleavage portion of the manifold, which is oriented in a direction perpendicular to the direction of movement of the belt. It can be oriented at an angle. As another example, FIG. 20C shows a battery in which the scribe line is oriented perpendicular to the direction of movement of the belt, and a curved cleavage portion of the manifold oriented at an angle to the direction of movement of the belt. Indicates

  The cleaving tool 1050 may utilize, for example, a single perforated moving belt 1060 having a width in a direction perpendicular to its direction of movement approximately equal to the width of the solar cell wafer 45. Alternatively, the tool 1050 may include, for example, two, three, four, or more perforated transport belts 1060 arranged side by side and parallel and optionally separated from one another. Cleavage tool 1050 may utilize, for example, a single vacuum manifold that may have a width in a direction perpendicular to the direction of movement of the solar cells approximately equal to the width of solar cell wafer 45. Such vacuum manifolds may, for example, be employed with a single full-width perforated moving belt 1060 or, for example, with two or more such side-by-side parallel and optionally spaced apart belts obtain.

  The cleaving tool 1050 can include curved vacuum manifolds arranged side by side and parallel and each having two or more separate curvatures of the same distance. Such an arrangement may be employed, for example, with a single full-width perforated moving belt 1060 or with two or more such side-by-side parallel disposed, optionally separate, belts. For example, the tool may include a perforated moving belt 1060 per vacuum manifold. In the latter arrangement, the vacuum manifolds and their corresponding perforated moving belts can be arranged to contact the bottom of the solar cell wafer along only the two narrow strips defined by the width of the belts. In such cases, the solar cells may include soft material in the area of the bottom of the solar cell wafer not contacted by the belt, and there is no risk of damage to the soft material during the cleaving process.

  Any suitable arrangement of perforated moving belts and vacuum manifolds may be used in the cleaving tool 1050.

  In some variations, the scribed solar cell wafers 45 are uncured conductive adhesive and / or other soft on their top and / or bottom before being cleaved using the cleaving tool 1050 Contains the material. The scribing of the solar cell wafer and the application of the soft material may occur in any order.

  FIG. 62A schematically illustrates a side view of another exemplary cleaving tool 5210 similar to the cleaving tool 1050 described above, and FIG. 62B schematically illustrates a top view thereof. In the use of cleaving tool 5210, a pair of corresponding parallel spaced apart perforated belts 5230 wherein a scribed solar cell wafer 45 of conventional size travels at a constant speed over a pair of parallel spaced apart vacuum manifolds 5235. It is placed on top. The vacuum manifold 5235 typically has the same curvature. As the wafer travels with the belt over the vacuum manifold through the cleave region 5235C, the wafer is bent around the cleavage area defined by the curved support surface of the vacuum manifold by the force of the vacuum pulling on the bottom of the wafer. As the wafer is bent around the cleavage area, the scribe lines become clefts that separate the wafers into individual rectangular solar cells. As discussed further below, the curvature of the vacuum manifold is such that the adjacent cleaved rectangular solar cells are not coplanar and the edges of the adjacent cleaved rectangular solar cells result in a cleavage process. They are arranged so as not to touch each other. Cleaved rectangular solar cells can be continuously lowered from the perforated belt by any suitable method described in the several exemplary below. Typically, the lowering method also causes adjacent cleaved solar cells to be separated from one another and subsequently prevented from contacting one another when they are coplanar.

  With further reference to FIGS. 62A-62B, each vacuum manifold may optionally include, for example, a flat region 5235F that does not draw a vacuum or draws a low or high vacuum, optionally with a low or high vacuum along its length. It may include a curved transition region 5235T that pulls or transitions from low vacuum to high vacuum, a cleavage region 5235C that pulls a high vacuum, and a smaller radius post-cleavage region 5235PC that pulls a low vacuum. Belt 5230 transports wafer 45 from flat area 5235F into and through transition area 5235T, and then into cleavage area 5235C where the wafer cleaves, and then the resulting cleaved sun The battery 10 is transported out of the cleave region 5235C and into the post cleave region 5235PC.

  Flat region 5235F typically operates at a low enough vacuum to hold wafer 45 to the belt and vacuum manifold. Here the vacuum may be low (or absent) to reduce friction and thus the required belt tension and to keep the wafer 45 on a flat surface is easier than on a curved surface . The vacuum at flat area 5235F may be, for example, about 1 to about 6 inches of mercury.

  Transition region 5235T provides a curvature that transitions from flat region 5235F to cleave region 5235C. The radius of curvature, or radii of curvature, at transition region 5235T is greater than the radius of curvature at cleave region 5235C. The bend at transition region 5235T may be, for example, a portion of an ellipse, although any suitable bend may be used. Bringing the wafer 45 closer to the cleavage region 5235C with a smaller change in curvature through the transition region 5235T rather than a direct transition from the flat orientation in the region 5235F to the cleavage region in the cleavage region 5235C lifts the edge of the wafer 45 Helps to ensure that the vacuum is gone and that it is not difficult for the wafer to stay in the cleave region at cleave region 5235C. The vacuum at transition region 5235T may be, for example, the same as that at cleavage region 5235C, may be intermediate to the vacuum at regions 5235F and 5235C, or between the vacuum at region 5235F and the vacuum at region 5235C. , Along the length of region 5235T. The vacuum at transition region 5235T may be, for example, about 2 to about 8 inches of mercury.

  The cleave region 5235C may have a varying radius of curvature, or optionally, a constant radius of curvature. Such constant radius of curvature may be, for example, between about 11.5 inches, about 12.5 inches, or about 6 inches and about 18 inches. Any suitable range of curvature may be used, and may be selected based in part on the thickness of the wafer 45 and the depth and geometry of scribe lines on the wafer 45. Typically, the thinner the wafer, the shorter the radius of curvature required to bend the wafer to fully tear the wafer along the scribe line. The scribe line may have, for example, a depth of about 60 microns to about 140 microns, although any other suitable shallower or deeper scribe line depth may also be used. Typically, the shallower the scribe, the shorter the radius of curvature required to bend the wafer to fully tear the wafer along the scribe line. The cross-sectional shape of the scribe line also affects the required radius of curvature. A scribe line having a wedge shape or a wedge shaped bottom can effectively concentrate stress from a scribe line having a rounded shape or a rounded bottom. A scribe line that concentrates stress more effectively may not require a radius of curvature in the cleave region that is as small as a scribe line that concentrates stress less effectively.

  For at least one of the two parallel vacuum manifolds, the vacuum at the cleave region 5235C is typically higher than the vacuum at the other regions, ensuring that the wafer is properly clamped to the cleave radius of curvature. Maintain a constant bending stress. Optionally, and as further described below, one of the manifolds may pull a higher vacuum than the other to better control tearing along the scribe line in this region. The vacuum at cleave region 5235C may be, for example, about 4 to about 15 inches of mercury, or about 4 to about 26 inches of mercury.

  Post-cleavage region 5235PC typically has a smaller radius of curvature than cleave region 5235C. This causes the cracked surfaces of the adjacent cleaved solar cells to not rub or touch them (these can cause solar cell failure resulting from the form of the crevice or other failure), It becomes easy to transport the cleaved solar cells from the belt 5230. In particular, the smaller radius of curvature results in greater separation between the edges of adjacent cleaved solar cells on the belt. The vacuum at the post-cleavage region 5235PC may be low, as the wafer 45 has already been cleaved into multiple solar cells 10 and it is no longer necessary to keep the solar cells at the curved radius of the vacuum manifold ( For example, similar to or the same as in flat area 5235F). The edge of the cleaved solar cell 10 may, for example, lift away from the belt 5230. Furthermore, it may be desirable that the cleaved solar cell 10 be not overstressed.

  The flat region, the transition region, the cleavage region, and the post-cleavage region of the vacuum manifold can be discrete portions of different curves whose ends coincide. For example, the top surface of each manifold may be a flat planar portion, a portion of an ellipse for the transition region, an arc of a circle for the cleave region, and a portion of another arc or ellipse of the circle for the post-cleavage region May be included. Alternatively, some or all of the curved portions of the top surface of the manifold may include continuous geometric functions of increasing curvature (shortening of the diameter of the contact circle). Suitable such functions may include, but are not limited to, for example, helical functions such as clothoid and natural logarithmic functions. A clothoid is a curve whose curvature increases linearly along the length of the curve path. For example, in some variations, the transition region, the cleavage region, and the post-cleavage region are all part of a single clothoid curve that matches the flat region at one end. In some other variations, the transition region is a clothoid curve with one end corresponding to the flat region and the other end corresponding to a cleave region having a circular curvature. In the latter variant, the post-cleavage region may, for example, have a higher radius circular curvature, or a higher radius clothoid curvature.

  As noted above and schematically illustrated in FIGS. 62B and 63A, in some variations, one manifold is high vacuum at cleave region 5235C and the other manifold is cleave region 5235C. Apply a low vacuum at. The high vacuum manifold generally clamps the end of the wafer it supports to the curvature of the manifold, which causes the edge of the scribe line lying on top of the high vacuum manifold to initiate a tear along the scribe line Provide enough stress. Because the low vacuum manifold does not hold the entire wafer edge it supports to the curvature of the manifold as a whole, the bend radius of the wafer on that side creates the stress necessary to initiate a tear at the scribe line Is not small enough. However, the stress is high enough to propagate a crevice initiated at the other end of the scribe line lying above the high vacuum manifold. Without some vacuum on the "low vacuum" side to partially and fully secure the end of the wafer to the curvature of the manifold, a crack initiated at the opposite "high vacuum" end of the wafer traverses the entire wafer Risk of not transmitting In variations as just described, one manifold may optionally draw a low vacuum along its entire length from flat area 5235F through post-cleavage area 5235PC.

  The asymmetric vacuum placement at the cleave region 5235C, as just described, provides an asymmetric stress along the scribe line that controls the nucleation and propagation of the cleft along the scribe line. For example, referring to FIG. 63B, if instead two vacuum manifolds pull equal (eg high) vacuum at cleavage region 5235C, the splits nucleate at both ends of the wafer and propagate towards each other, the central region of the wafer You may meet somewhere in Under these circumstances, the clefts may not be in line with each other, so there is a risk that they will create points of potential mechanical failure in the resulting cleaved cell where the cribs meet.

  As an alternative to, or in addition to, the asymmetric vacuum configuration described above, cleaving is preferentially scribed by disposing one end of the scribe line in the cleavage region of the manifold and in front of the other end. It can be started at one end of the line. This may be achieved, for example, by orienting the solar cell wafer at an angle to the vacuum manifold as described above in connection with FIG. 20B. Alternatively, the cleavage region of one of the two manifolds may be located further along the belt path than the cleavage region of the other vacuum manifold. For example, the two vacuum manifolds of the moving belt are such that the solar cell wafer reaches the cleavage region of one of the two vacuum manifolds having the same curvature before reaching the cleavage region of the other vacuum manifold. It may be slightly offset in the direction of movement.

  Referring now to FIG. 64, in the illustrated example, each vacuum manifold 5235 includes through holes 5240 arranged side-by-side below the center of the vacuum channel 5245. As shown in FIGS. 65A-65B, the vacuum channel 5245 is recessed into the top surface of the manifold that supports the perforated belt 5230. Each vacuum manifold also includes central posts 5250 located between through holes 5240 and arranged side by side under the center of vacuum channel 5245. The central column 5250 effectively separates the vacuum channels 5245 into two parallel vacuum channels on either side of the plurality of central column rows. The central post 5250 also provides support for the belt 5230. Without the central post 5250, the belt 5230 would be exposed to a longer unsupported area and could be drawn towards the through hole 5240. As a result of this, the wafer 45 can be bent in three dimensions (bending by cleavage range and bending in a direction perpendicular to the cleavage range), which damages the solar cell and inhibits the cleavage process It can.

  As shown in FIGS. 65A-65B and 66-67, in the illustrated example, the through hole 5240 includes a low vacuum chamber 5260L (the flat region 5235F and the transition region 5235T in FIG. 62A) and a high vacuum chamber (5260H). 62A in communication with the other low vacuum chamber 5260L (post-cleavage region 5235PC in FIG. 62A) This arrangement provides a smooth between the low vacuum region and the high vacuum region within the vacuum channel 5245. The through hole 5240 is such that if the corresponding area of one hole remains completely open, the flow of air is not completely biased to that hole, which allows the other area to maintain a vacuum. The vacuum channel 5245 is positioned between the through holes 5240 so that the vacuum belt holes 5255 always have a vacuum. It helps to ensure that it does not become a dead spot in the case that was.

  Referring back to FIGS. 65A-65B and also referring to FIG. 67, the perforated belt 5230, for example, always has the leading and trailing edges 527 of the wafer 45 or cleaved solar cell 10 as the belt advances along the manifold. It may include two rows of holes 5255 optionally arranged to be evacuated. In particular, the staggered arrangement of the plurality of holes 5255 in the illustrated example ensures that the wafer 45 or the edge of the cleaved solar cell 10 always overlaps at least one hole 5255 of each belt 5230. . This helps to prevent the edge of the wafer 45 or cleaved solar cell 10 from lifting away from the belt 5230 and the manifold 5235. Any other suitable arrangement of holes 5255 may also be used. In some variations, the arrangement of the plurality of holes 5255 does not ensure that the wafer 45 or the edge of the cleaved solar cell 10 is always evacuated.

  The perforated moving belt 5230 in the illustrated example of the cleaving tool 5210 is only for the solar cell wafer 45 along the two narrow strips defined by the width of the belt along the lateral edge of the solar cell wafer. Contact the bottom of the As a result, the solar cell wafer may include soft materials, such as, for example, uncured adhesive, in the area of the bottom of the solar cell wafer not contacted by the belt 5230 and the risk of damage to the soft materials during the cleaving process Does not occur.

  In an alternative variant, the cleaving tool 5210 is not two perforated moving belts as just described, but has a width in the direction perpendicular to its direction of movement, for example approximately equal to the width of the solar cell wafer 45 A single perforated moving belt 5230 may be utilized. Alternatively, the cleaving tools 5210 may include three, four or more perforated moving belts 5230 arranged side by side and parallel and optionally separated from one another. Cleavage tool 5210 may utilize, for example, a single vacuum manifold 5235 that may have a width in a direction perpendicular to the direction of movement of the solar cells approximately equal to the width of solar cell wafer 45. Such vacuum manifolds may be employed, for example, with a single full-width perforated moving belt 5230 or with two or more such side-by-side parallel and optionally spaced apart belts. Cleavage tool 5210 is, for example, single drilled supported along opposing lateral edges by two curved vacuum manifolds 5235 arranged side by side, parallel and spaced apart and each having the same curvature. An attached moving belt 5230 may be included. The cleaving tool 5210 may include three or more curved vacuum manifolds 5235, arranged side by side and parallel and separated from one another, each having the same curvature. Such an arrangement may be employed, for example, with a single full-width perforated moving belt 5230 or with three or more such side-by-side parallel disposed, optionally separate, belts. The cleave tool may include, for example, a perforated moving belt 5230 for each vacuum manifold.

  Any suitable arrangement of perforated moving belts and vacuum manifolds may be used in the cleaving tool 5210.

  As noted above, in some variations, scribed solar cell wafers 45 cleaved by cleavage tool 5210 are uncured conductive adhesive bonds on their top and / or bottom surfaces prior to cleavage. Agents and / or other soft materials. The scribing of the solar cell wafer and the application of the soft material may occur in any order.

  Perforated belt 5230 in cleaving tool 5210 (and perforated belt 1060 in cleaving tool 1050) may be at a speed, for example, about 40 millimeters per second (mm / s) to about 2000 mm / s or faster, or , About 40 mm / s to about 500 mm / s or faster, or about 80 mm / s or faster. Cleavage of the solar cell wafer 45 may be easier to perform at a faster rate than at a slower rate.

  Referring now to FIG. 68, once cleaved, there is some separation between the leading edge 527 and the trailing edge 527 of the adjacent cleaved cell 10 due to the geometry of the bend around the bend. This creates a wedge-shaped gap between adjacent cleaved solar cells. If the cleaved cells are allowed to return to a flat coplanar orientation without significant separation between the cleaved cells first, the edges of adjacent cleaved cells can come into contact with each other and cause damage There is sex. Thus, it is advantageous to remove them from the belt 5230 (or belt 1060) while the cleaved cells are still supported by the curved surface.

  69A-69G show how many cleaved solar cells can be removed from belt 5230 (or belt 1060) and delivered to one or more additional moving belts or moving surfaces with an increased separation between the cleaved solar cells 1 schematically illustrates the apparatus and method of the present invention. In the example of FIG. 69A, the cleaved solar cells 10 move from the belt 5230 by one or more transport belts 5265 that move faster than the belt 5230 and thus increase the separation between the cleaved solar cells 10. Transport belt 5265 may be positioned, for example, between two belts 5230. In the example of FIG. 69B, cleaved wafer 10 is separated by sliding down slide 5270 positioned between two belts 5230. In this example, the belt 5230 advances each cleaved cell 10 into the low vacuum (eg, no vacuum) area of the manifold 5235 and cleaves with the uncleaved portion of the wafer 45 still held by the belt 5230. Release the battery pack to slide 5270. Providing an air cushion between the cleave cell 10 and the slide 5270 helps to ensure that both the cell and the slide do not rub off during this operation, and the cleave cell 10 also Can slide faster in the direction away from the wafer 45, thereby allowing faster cleavage belt motion speeds.

  In the example of FIG. 69C, the carriage 5275A of the rotating “large ferris wheel” arrangement 5275 transports the cleaved solar cell 10 from the belt 5230 to one or more belts 5280.

  In the example of FIG. 69D, the rotating roller 5285 draws a vacuum through the actuator 5285A to pick up the cleaved solar cells 10 from the belt 5230 and places them on the belt 5280.

  In the example of FIG. 69E, carriage actuator 5290 includes a carriage 5290A and an extendable actuator 5290B mounted on the carriage. The carriage 5290A translates back and forth to position the actuator 5290B to remove the cleaved solar cell 10 from the belt 5230 and then to position the actuator 5290B to place the cleaved solar cell on the belt 5280.

  In the example of FIG. 69F, the carriage track arrangement 5295 locates the carriage 5295A and removes the cleaved solar cells 10 from the belt 5230 and then locates the carriage 5295A to load the cleaved solar cells 10 on the belt 5280. It includes a carriage 5295A attached to a moving belt 5300 to be placed. The latter action occurs as the carriage falls or leaves the belt 5280 due to the path of the belt 5230.

  In the example of FIG. 69G, a reversed vacuum belt arrangement 5305 draws a vacuum through one or more moving perforated belts to convey the cleaved solar cell 10 from belt 5230 to belt 5280.

  FIGS. 70A-70C provide orthogonal views of additional variations of the exemplary tool described above with reference to FIGS. 62A-62B and the subsequent figures. In this variation 5310, as in the example of FIG. 69A, the transported belt 5265 is used to remove the cleaved solar cell 10 from the perforated belt 5230 that transports the uncleaved wafer 45 into the cleavage region of the tool. . The perspectives of FIGS. 71A-71B illustrate this variation of the cleave tool in two different motion steps. In FIG. 71A, the uncleaved wafer 45 is approaching the cleavage region of the tool, and in FIG. 71B, the wafer 45 has entered the cleavage region, and the two cleaved solar cells 10 are separated from the wafer, Thereafter, they are further separated from one another as they are transported by the transport belt 5265.

  In addition to the previously described features, FIGS. 70A-71B illustrate multiple vacuum ports 5315 on each manifold. Using multiple ports per manifold may allow a greater degree of control over changes in vacuum along the length of the top surface of the manifold. For example, multiple different vacuum ports 5315 may optionally be in communication with different multiple vacuum chambers (eg, 5260L and 5260H in FIGS. 66 and 72B) and / or optionally connected with multiple different vacuum pumps Thus, multiple different vacuum pressures can be provided along the manifold. 70A-70B also show the entire path of the perforated belt 5230 looping around the wheel 5325, the top surface of the vacuum manifold 5235, and the wheel 5320. FIG. Belt 5230 may be driven by, for example, either wheel 5320 or wheel 5325.

  72A and 72B show a perspective view of a portion of vacuum manifold 5235 with a portion of perforated belt 5230 lying thereon, with respect to the variation of FIGS. 70A-71B, and FIG. 72A approaches a portion of FIG. 72B. Provide the FIG. 73A shows a top view of the portion of the vacuum manifold 5235 on which the perforated belt 5230 lies, and FIG. 73B shows the same vacuum manifold and the perforated belt taken along line C-C shown in FIG. 73A. FIG. 6 shows a cross-sectional view of As shown in FIG. 73B, the relative orientation of the through holes 5240 is the length of the vacuum manifold such that each through hole is oriented perpendicular to the portion of the top surface of the manifold immediately above the through holes. May change along. FIG. 74A shows another top view of the portion of vacuum manifold 5235 on which perforated belt 5230 lies, with vacuum chambers 5260L and 5260H shown in localized perspective. FIG. 74B shows a view approaching a portion of FIG. 74A.

  75A-75G illustrate some exemplary hole patterns that may optionally be used for perforated vacuum belt 5230. FIG. A common feature of these patterns is that at any position on the belt, the straight edge of the wafer 45 or cleaved solar cell 10 crossing the pattern in a direction perpendicular to the long axis of the belt always always at least in each belt It is to say that one hole 5255 will overlap. The pattern may be, for example, two or more rows of square or rectangular holes offset from one another (Figures 75A, 75D), two or more rows of circular holes offset from one another (Figure 75B, 75E, 75G), two or more rows of angled slots (FIG. 75C, 75F), or any other suitable arrangement of holes.

  The present specification is arranged in overlapping shingles and electrically connected in series by conductive junctions between adjacent and overlapping solar cells so that the supercells are arranged in multiple physically parallel rows within the solar module. SUMMARY OF THE INVENTION A high efficiency solar module is disclosed that includes a silicon solar cell that forms a supercell in the cold state. The supercell may include any suitable number of solar cells. The supercell may have, for example, a length extending essentially over the entire length or width of the solar module, or two or more supercells may be arranged end to end in a row . This arrangement hides the electrical interconnections between the solar cells and the solar cells, thus forming a visually attractive solar module with little or no contrast between adjacent series connected solar cells. It can be used for

  The specification further discloses a cell metallization pattern that facilitates stencil printing of the metalization on the front (and optionally) back side of the solar cell. As used herein, "venturing" of a cell metallization is a metallizing material (eg, silver paste) on the surface of the solar cell through the patterning openings in the otherwise impervious sheet of material Refers to applying. The stencil may be, for example, a patterned stainless steel sheet. The patterning openings in the stencil generally do not include stencil material, for example, no mesh or screen. The absence of a mesh or screen material in the patterned stencil openings distinguishes "stencil printing" as used herein from "screen printing". In contrast, in screen printing, a metallized material is applied to the solar cell surface through a screen (eg, a mesh) that supports the patterned, impermeable material. The pattern comprises an opening in the impermeable material through which the metallisation material is applied to the solar cell. The supporting screen extends across the opening in the impermeable material.

  Compared to screen printing, stencil printing of battery metallization patterns has narrower line width, higher aspect ratio (line height to width), better line uniformity and definition It offers a number of advantages, including longer stencil life as compared to screens. However, stencil printing can not print "islands" in a single pass as would be required in a conventional three bus bar metallization design. In addition, stencil printing will require the stencil to include unsupported structures that may not impede the placement and use of the stencil, which is not clamped to lie in the plane of the stencil during printing. The metallized pattern can not be printed in one pass. For example, stencil printing can not print in a single pass a metallized pattern in which parallel arranged metallized fingers interconnect with bus bars or other metallized features extending perpendicularly to the fingers. This is because a single stencil for such a design would include the unsupported tongue of the sheet material defined by the openings for the bus bars and the openings for the fingers. The tongues will not be held in place by the physical connection to the other part of the stencil so that they lie in the plane of the stencil during printing, and can be offset from the plane and distort the placement and use of the stencil Sex is high.

  As a result, attempts to use stencils to print traditional solar cells require two passes for front side metallization by two different stencils or by a stencil printing process combined with a screen printing process This adds to the total number of printing steps per cell and also gives rise to the problem of "stitching" where the two prints overlap and are doubled in height. Stitching further complicates the process, and the additional printing and related steps add cost. Thus, stencil printing is not common to solar cells.

  As discussed further below, the frontside metallization patterns described herein may include an array (eg, parallel lines) of fingers that are not connected to one another by the frontside metallization pattern. These patterns can be stenciled in a single pass with a single stencil, as the stencils needed do not have to include unsupported portions or structures (e.g., tongue). Such front side metallization patterns can be disadvantageous for standard sized solar cells and for strings of solar cells where remote solar cells are interconnected by a copper ribbon. This is because the metallization pattern itself does not provide any substantial current spreading or conduction in the direction perpendicular to the fingers. However, the front side metallization pattern described herein overlaps a portion of the front side metallization pattern of the solar cell with the back side metallization pattern of the adjacent solar cell, a portion of which is conductive to the same back side metallization pattern It can work well in a maroon-like arrangement of rectangular solar cells as described herein, which are bonded. This is because the overlapping back side metallization of adjacent solar cells can allow the diffusion and conduction of current in a direction perpendicular to the fingers in the front side metallization pattern.

  Turning now to the drawings for a more detailed understanding of the solar modules described herein, FIG. 1 shows that the ends of adjacent solar cells overlap and form an electrical connection to form a supercell 100. FIG. 4 shows a cross-sectional view of a string of serially connected solar cells 10 arranged in a glazed state. Each solar cell 10 includes a semiconductor diode structure and a plurality of electrical contacts to the semiconductor diode structure. Thereby, the current generated in the solar cell 10 may be provided to the external load when the solar cell 10 is irradiated with light.

  In the example described herein, each solar cell 10 has a rectangular shape with a front (sun side) and back (shadow) side metallization pattern that provides electrical contact on opposite sides of the np junction. In the crystalline silicon solar cell, the front surface metallization pattern is disposed on the n-type conductivity semiconductor layer, and the back surface metallization pattern is disposed on the p-type conductivity semiconductor layer. However, other material systems, diode structures, physical dimensions, or electrical contact arrangements may be used where appropriate. For example, the front (sun side) side metallization pattern may be disposed on a p-type conductive semiconductor layer, and the back (shadow side) side metallization pattern may be disposed on an n-type conductive semiconductor layer.

  Referring back to FIG. 1, in the supercell 100, adjacent solar cells 10 electrically connect the front metallization pattern of one solar cell to the back metallization pattern of the adjacent solar cell in the area where they overlap. Directly conductively bond together with electrically conductive bonding agent. Suitable electrically conductive binders may include, for example, electrically conductive adhesives, electrically conductive adhesive films and tapes, and conventional solders.

  Referring back to FIGS. 2A-2R, FIGS. 2A-2R illustrate an exemplary rectangular solar module 200 including six rectangular supercells 100 each having a length approximately equal to the length of the long side of the solar module. . The supercells are arranged in six parallel rows, with the long side oriented parallel to the long side of the module. A similarly configured solar module may include more or less rows of supercells of such side lengths than shown in this example. In another variation, each supercell has a length approximately equal to the length of the short side of the rectangular solar module, with their long sides oriented parallel to the short side of the module, in parallel rows It can be arranged. In still other arrangements, for example, each row may include two or more supercells that may be interconnected electrically in series. The module may have short sides, eg, about 1 meter in length, and long sides, eg, about 1.5 to about 2.0 meters in length. Any other suitable shape (eg, square) and dimensions may also be used for the solar module. Each supercell in this example comprises 72 rectangular solar cells, each having a width equal to approximately 1/6 of the width of a 156 millimeter (mm) square or pseudo-square wafer, and a length of about 156 mm. Any other suitable number of rectangular solar cells of any other suitable dimensions may also be used.

  FIG. 76 shows an exemplary front side metallization pattern on a rectangular solar cell 10 that facilitates stencil printing as described above. The front side metallization pattern may be formed, for example, from a silver paste. In the example of FIG. 76, the front surface metallization pattern includes a plurality of fingers 6015 extending parallel to one another, parallel to the short side of the solar cell, and perpendicular to the long side of the solar cell. The front side metallization pattern also extends parallel to and adjacent to the long edge of the solar cell with each contact pad 6020 located at the end of the finger 6015, and also includes an optional plurality of rows of contact pads 6020. If present, each contact pad 6020 is an electrically conductive adhesive (ECA), solder, or otherwise used to conductively bond the front of the illustrated solar cell to the overlapping portion of the back of the adjacent solar cell. Form an area for an individual bead of electrically conductive bonding agent. The pad may be, for example, circular, square or rectangular, but any suitable pad shape may be used. As an alternative to using individual beads of an electrically conductive binder, solid or dashed ECAs, solders, conductive tapes, or other electrically conductive bonds disposed along the long edge of the solar cell The agent may interconnect some or all of the fingers and also bond the solar cells to the adjacent overlapping solar cells. Such dashed or solid electrically conductive bonding agents may be used in combination with or without such conductive pads at the ends of the fingers.

  The solar cell 10 may have, for example, a length of about 156 mm and a width of about 26 mm, so that the aspect ratio (short side length / long side length) may be about 1: 6. Six such solar cells can be prepared on a standard 156 mm × 156 mm sized silicon wafer and then separated (diced) to provide a plurality of solar cells as shown. In another variation, eight solar cells 10 having dimensions of about 19.5 mm × 156 mm, and thus an aspect ratio of about 1: 8, can be prepared from a standard silicon wafer. More generally, the solar cell 10 may have an aspect ratio of, for example, about 1: 2 to about 1:20, and may be prepared from a standard sized wafer or from any other suitable sized wafer.

  Referring back to FIG. 76, the front surface metallization pattern may include, for example, about 60 to about 120 fingers, eg, about 90 fingers, per battery of width 156 mm. The fingers 6015 may be, for example, about 10 to about 90 microns in width, such as about 30 microns. The fingers 6015 may have a height in a direction perpendicular to the surface of the solar cell of, for example, about 10 to about 50 microns. The height of the finger is, for example, about 10 microns or more, about 20 microns or more, about 30 microns or more, about 40 microns or more, or about 50 microns or more and obtain. The diameter (circle) or side length (square or rectangle) of the pad 6020 may be, for example, about 0.1 mm to about 1 mm, for example about 0.5 mm.

  The back side metallization pattern of the rectangular solar cell 10 is, for example, a plurality of discontinuous contact pad rows, a plurality of interconnecting contact pad rows, or a continuous extending parallel and adjacent to the long edge of the solar cell. Bus bar can be included. However, such contact pads or bus bars are not required. If the front side metallization pattern includes contact pads 6020 disposed along one of the long sides of the solar cell, the rows or bus bars (if present) of the plurality of contact pads in the backside metallization pattern are: It arrange | positions along the edge of the other long side of a solar cell. The backside metallization pattern may further include a metal back contact covering substantially all of the remaining backside of the solar cell. The exemplary back surface metallization pattern of FIG. 77A includes a plurality of rows of discontinuous contact pads 6025 in combination with the metal back contact 6030 as just described, and the exemplary back surface metallization pattern of FIG. It includes a continuous bus bar 35 in combination with a metal back contact 6030 as just described.

  Within the scaly supercell, the front metallization pattern of a solar cell is conductively bonded to the overlapping portion of the back metallization pattern of an adjacent solar cell. For example, if the solar cell includes a front surface metallized contact pad 6020, each contact pad 6020 is aligned and bonded to a corresponding rear surface metallized contact pad 6025 (if present), or a rear surface metallized bus bar 35 (present) And may be bonded to the metal back contact 6030 (if present) on adjacent solar cells. This means, for example, the discontinuities of electrically conductive bonding material disposed on each contact pad 6020 extending parallel to the edge of the solar cell and optionally electrically interconnecting two or more of the contact pads 6020. This can be achieved by a portion (e.g., a bead) or by a dashed or solid electrically conductive bonding agent.

  If the solar cell does not have front surface metallized contact pads 6020, for example, each front surface metallized pattern finger 6015 may be aligned and bonded to the corresponding rear surface metallized contact pad 6025 (if present), or It may be bonded to metal coated bus bar 35 (if present) or to metal back contact 6030 (if present) on an adjacent solar cell. This may for example be made of an electrically conductive bonding material disposed on the overlapping ends of each finger 6015 that extends parallel to the edge of the solar cell and optionally electrically interconnects two or more of the fingers 6015 It can be achieved by discrete portions (e.g. beads) or by dashed or solid electrically conductive bonding agents.

  As mentioned above, a portion of the overlapping back side metallization of adjacent solar cells, eg, back bus bars 35 and / or back metal contacts 6030, if present, are in a direction perpendicular to the fingers in the front side metallization pattern Current diffusion and conduction. In variations utilizing dashed or solid electrically conductive bonding agents as described above, the conductive bonding agent is capable of spreading and conducting current in a direction perpendicular to the fingers in the front surface metallization pattern. It can be. Overlapping back metallization and / or an electrically conductive bonding agent may, for example, carry electrical current bypassing breaks of broken fingers or other fingers in the front metallization pattern.

  If present, back side metallized contact pads 6025 and bus bars 35 may be formed from silver paste, which may be applied by, for example, stencil printing, screen printing, or any other suitable method. The metal back contact 6030 can be formed, for example, of aluminum.

  Any other suitable backside metallization pattern and material may also be used.

  FIG. 78 illustrates an exemplary front side metallization pattern of square solar cells 6300 that may be diced to form a plurality of rectangular solar cells each having a front side metallization pattern as shown in FIG.

  FIG. 79 shows an exemplary back surface metallization pattern of square solar cells 6300 that may be diced to form a plurality of rectangular solar cells each having a back surface metallization pattern shown in FIG. 77A.

  The front side metallization pattern described herein may enable stencil printing of the front side metallization on a standard three printer solar cell manufacturing line. For example, the manufacturing process may use a first printer to stencil or screen print a silver paste on the back of a square solar cell to form a back contact pad or a back silver bus bar, and dry the back silver paste. Perforating or screen printing aluminum contacts on the back of the solar cell using a second printer, drying aluminum contacts, third printer a single stencil in a single stencil step The method may be used to stencil print a silver paste onto the front of the solar cell to form a complete front metallization pattern, dry the silver paste, and bake the solar cell. These printing steps and associated steps may occur or be omitted in any other order, as appropriate.

  Printing the front surface metallization pattern using a stencil enables the production of narrower fingers, which is possible by screen printing, which improves the solar cell efficiency, the use of silver and hence the cost of production Can be reduced. By stenciling the front side metallization pattern in a single stencil printing step with a single stencil, for example, to overlap the prints to define features having uniform height, eg extending in different directions In addition, it is possible to produce a front surface metallization pattern without exhibiting stitching that can occur when stencil printing is used in combination with multiple stencils or screen printing.

  After the front and back metallization patterns are formed on the square solar cells, each square solar cell can be separated to be two or more rectangular solar cells. This may be achieved, for example, by laser scribing followed by cleavage or by any other suitable method. The rectangular solar cells may then be arranged in overlapping textures and conductively bonded to one another to form a supercell, as described above. The present specification discloses, for example, a method for manufacturing a solar cell that has no cleavage edge that promotes carrier recombination and reduces carrier recombination loss at the edge of the solar cell. The solar cell can be, for example, a silicon solar cell, and more specifically, can be a HIT silicon solar cell. The present specification also discloses the scaly (overlapping) supercell arrangement of such solar cells. The individual solar cells in such supercells may have a narrow rectangular geometry (e.g., a strip-like shape) with the long sides of adjacent solar cells being arranged to overlap.

  A major challenge with cost-effective implementation of high efficiency solar cells such as HIT solar cells is the large amount of large current carrying from one such high efficiency solar cell to an adjacent high efficiency solar cell in series connection. There is a recognized need for metals. Dicing such high efficiency solar cells into multiple narrow rectangular solar cell strips, and then overlapping the resulting solar cells with the conductive junctions between overlapping portions of adjacent solar cells ( The arrangement of the series connected solar cell strings in the supercell, in a jellied pattern, provides an opportunity to reduce module costs through process simplification. This is because it is possible to eliminate the tabbing process step conventionally required to interconnect adjacent solar cells with metal ribbons. This sculpting approach reduces the current flow through the solar cells (since the individual solar cell strips can have a smaller area than conventional active areas), and between adjacent solar cells Module efficiency may also be increased by shortening the current path length, both of which help reduce resistive losses. The reduced current also results in less expensive but more resistant conductors (eg, copper), and more expensive but less resistant conductors (eg, silver) without substantial loss of performance. Can be used instead of In addition, this sculpting approach can reduce the non-working module area by removing the interconnecting ribbon and associated contacts from the front of the solar cell.

  Conventional sized solar cells may have, for example, substantially square front and back sides measuring about 156 millimeters (mm) by about 156 mm. In the just described scheme, such solar cells are diced into two or more (e.g., 2 to 20) solar cell strips with a length of 156 mm. A potential difficulty with this burnishing method is that by dicing the conventional sized solar cells into thin strips, the edge length of the cells per working area of the solar cells compared to conventional sized solar cells Is longer, which may reduce the performance due to carrier recombination at the edge.

  For example, FIG. 80 shows the front and back surfaces to be several solar cell strips (7100a, 7100b, 7100c, and 7100d), each having a narrow rectangular front and back dimension of about 156 mm × about 40 mm. FIG. 7 schematically illustrates dicing of a HIT solar cell 7100 with dimensions of the back surface of about 156 mm × about 156 mm. (The long 156 mm sides of the solar cell strip extend into the page.) In the illustrated example, the HIT cell 7100 may have a thickness of, for example, about 180 microns and dimensions of about 156 mm by about It includes an n-type single crystal substrate 5105 which can have a front and back square face of 156 mm. A layer of about 5 nanometers (nm) in thickness of intrinsic amorphous Si: H (a-Si: H) and a layer of about 5 nm in thickness of n + doped a-Si: H (both layers have the same reference number 7110) are disposed on the front side of the crystalline silicon substrate 7105. An approximately 65 nm thick film 5120 of transparent conductive oxide (TCO) is disposed on the a-Si: H layer 7110. Conductive metal grid lines 7130 disposed on the TCO layer 7120 provide electrical contact to the front of the solar cell. A layer with a thickness of about 5 nm of intrinsic a-Si: H and a layer with a thickness of about 5 nm of p + -doped a-Si: H (both layers are shown together by reference number 7115), crystalline silicon substrate 7105 Are arranged on the back of the A film 7125 having a thickness of transparent conductive oxide (TCO) of about 65 nm is disposed on the a-Si: H layer 7115, and a conductive metal grid line 7135 disposed on the TCO layer 7125 is a solar cell. Provides electrical contact to the back of the (The dimensions and materials mentioned above are intended to be illustrative rather than limiting, and may be varied as appropriate.)

  Still referring to FIG. 80, when HIT solar cell 7100 is cleaved in a conventional manner to form strip solar cells 7100a, 7100b, 7100c and 7100d, the newly formed cleavage edge 7140 is not passivated. These non-passivated edges contain high density dangling chemical bonds that promote carrier recombination and reduce the performance of the solar cell. In particular, the cleave surface 7145 exposing the np junction and the cleave surface exposing the heavily doped front field (in layer 7110) are not passivated and may substantially promote carrier recombination. In addition, if a conventional laser cutting or scribing process is used to dice the solar cell 7100, thermal damage such as amorphous silicon recrystallization 7150 can occur on the newly formed edge. As a result of unpassivated edges and thermal damage, the new edges formed on the cleaved solar cells 7100a, 7100b, 7100c and 7100d will cause the solar cell's short circuit current if conventional manufacturing processes are used. It can be expected to reduce the open circuit voltage, and the false fill factor. This is combined to lead to a substantial reduction in the performance of the solar cell.

  During dicing of a conventionally sized HIT solar cell to a narrower solar cell strip, the formation of an edge promoting recombination can be avoided by the method illustrated in FIGS. 81A-81J. The method uses the isolation trenches on the front and back of the conventionally sized solar cell 7100 and from the cleavage edge which may serve as a recombination site for minority carriers in other cases, from the pn junction and the heavily doped front. Electrically separate the fields. The edge of the trench is not a conventional cleave, but instead is defined by chemical etching or laser patterning, followed by the deposition of a passivation layer such as TCO which passivates both the front and back trenches. Compared to heavily doped regions, the doping of the substrate is sufficiently low that the electrons at the junction have a low probability of reaching the unpassivated cutting edge of the substrate. In addition, a grooveless wafer dicing technique, Thermal Laser Separation (TLS), can be used to cut the wafer, which can avoid potential thermal damage.

  In the example illustrated in FIGS. 81A-81J, the starting material may have a bulk resistance of, for example, about 1 to about 3 ohm centimeters, and a thickness of, for example, about 180 mm square which may be about 180 microns. N-type single crystal silicon as-cut wafer. (Wafer 7105 forms the substrate of the solar cell.)

  Referring to FIG. 81A, the as-cut cut wafer 7105 is conventionally texture etched, acid cleaned, rinsed and dried.

  Next, in FIG. 81B, an intrinsic a-Si: H layer with a thickness of about 5 nm and a doped n + a-Si: H layer with a thickness of about 5 nm (both layers are indicated by reference numeral 7110). Are deposited on the front side of the wafer 7105, for example, by plasma enhanced chemical vapor deposition (PECVD), for example, at a temperature of about 150.degree. C. to about 200.degree.

  Next, in FIG. 81C, an intrinsic a-Si: H layer of about 5 nm thickness and a doped p + a-Si: H layer of about 5 nm thickness (both layers are shown together with reference number 7115) Is deposited on the backside of the wafer 7105, for example by PECVD, at a temperature of, for example, about 150.degree. C. to about 200.degree.

  Next, in FIG. 81 D, the front a-Si: H layer 7110 is patterned to form isolation trenches 7112. The isolation trenches 7112 typically penetrate the layer 7110 to reach the wafer 7105 and may, for example, be about 100 microns to about 1000 microns in width, for example about 200 microns. Typically, the trench has the accuracy of the patterning technique and the narrowest width that can be used depending on the subsequently applied cleaving technique. Patterning of the trench 7112 can be achieved, for example, using laser patterning or chemical etching (eg, inkjet wet patterning).

  Next, in FIG. 81E, the back a-Si: H layer 7115 is patterned to form isolation trenches 7117. Similar to isolation trench 7112, isolation trench 7117 typically penetrates layer 7115 to reach wafer 7105 and can be, for example, about 100 microns to about 1000 microns, eg, about 200 microns in width. . Patterning of the trenches 7117 can be achieved, for example, using laser patterning or chemical etching (eg, ink jet wet patterning). Each trench 7117 is aligned with a corresponding trench 7112 on the front of the structure.

  Next, in FIG. 81F, a TCO layer 7120 about 65 nm thick is deposited on the patterned pre-a-Si: H layer 7110. This can be achieved, for example, by physical vapor deposition (PVD) or by ion plating. The TCO layer 7120 fills the trench 7112 in the a-Si: H layer 7110 and coats the outer edge of the layer 7110, thereby passivating the surface of the layer 7110. TCO layer 7120 also functions as an antireflective coating.

  Next, in FIG. 81 G, a TCO layer 7125 about 65 nm thick is deposited on the patterned back a-Si: H layer 7115. This can be achieved, for example, by PVD or by ion plating. The TCO layer 7125 fills the trench 7115 in the a-Si: H layer 7117 and coats the outer edge of the layer 115, thereby passivating the surface of the layer 7115. TCO layer 7125 also functions as an antireflective coating.

  Next, in FIG. 81H, conductive (eg, metal) front grid lines 7130 are screen printed on the TCO layer 7120. The grid lines 7130 may be formed, for example, from a low temperature silver paste.

  Next, in FIG. 81I, a conductive (eg, metal) backside grid line 7135 is screen printed on the TCO layer 7125. The grid lines 7135 can be formed, for example, from a low temperature silver paste.

  Next, after deposition of grid lines 7130 and grid lines 7135, the solar cell is cured at a temperature of about 200 ° C., for about 30 minutes, for example.

  Next, in FIG. 81J, the solar cells are separated into solar cell strips 7155a, 7155b, 7155c and 7155d by dicing the solar cells at the center of the trench. Dicing may be achieved, for example, by cleaving the solar cell along the trench, using conventional laser scribing and mechanical cleavage at the center of the trench. Alternatively, dicing is accomplished using a Thermal Laser Separation process (such as that developed by Jenoptik AG), which causes mechanical stress that leads to cleavage of the solar cell along the trench, at the center of the trench (eg, as developed by Jenoptik AG) It can be done. The latter approach can avoid thermal damage to the edge of the solar cell.

  The resulting strip solar cells 7155a-7155d differ from the strip solar cells 7100a-7100d shown in FIG. In particular, the edges of the a-Si: H layers 7110 and a-Si: H layers 7115 in the solar cells 7140a-7140d are formed by etching or laser patterning, not by mechanical cleavage. In addition, the edges of layers 7110 and 7115 in solar cells 7155a-7155d are passivated by the TCO layer. As a result, solar cells 7140a-7140d do not have cleavage edges present in solar cells 7100a-7100d, which promote carrier recombination.

  The methods described in connection with FIGS. 81A-81J are intended to be illustrative rather than limiting. The steps described as being performed in a particular order may be performed in other orders or in parallel, as appropriate. The process and material layers may be omitted, added or replaced as appropriate. For example, if copper plated metallization is used, additional patterning or seed layer deposition steps can be included in the process. Furthermore, in some variations, only the front a-Si: H layer 7110 is patterned to form an isolation trench and no isolation trench is formed in the back a-Si: H layer 7115. In another variation, only the back a-Si: H layer 7115 is patterned to form an isolation trench and no isolation trench is formed in the previous a-Si: H layer 7115. Dicing also occurs in the center of the trench in these variations, as in the example of FIGS. 81A-81J.

  The formation of an edge that promotes recombination while dicing a conventionally sized HIT solar cell to a narrower solar cell strip should be employed in the method described in conjunction with FIGS. 81A-81J. It can also be avoided by the method illustrated in FIGS. 82A-82J, which also use isolation trenches.

  Referring to FIG. 82A, in the present example, the starting material may again have a bulk resistance of, for example, about 1 to about 3 ohm centimeters and a thickness of, for example, about 180 mm square which may be about 180 microns. N-type single crystal silicon as-cut wafer 7105.

  Referring to FIG. 82B, a trench 7160 is formed on the front surface of the wafer 7105. These trenches may be, for example, about 80 microns to about 150 microns, for example, about 90 microns in depth, and may be, for example, about 10 microns to about 100 microns in width. The isolation trenches 7160 define the geometry of the solar cell strip to be formed from the wafer 7105. The wafer 7105 will be cleaved along these trenches, as described below. These trenches 7160 may be formed, for example, by conventional laser wafer scribing.

  Next, in FIG. 82C, wafer 7105 is conventionally texture etched, acid cleaned, rinsed and dried. The etching typically removes the damage originally present on the surface of the as-cut wafer 7105 or caused during the formation of the trench 7160. The etch may also widen and deepen the trench 7160.

  Next, in FIG. 82D, an intrinsic a-Si: H layer having a thickness of about 5 nm and a doped n + a-Si: H layer having a thickness of about 5 nm (both layers are shown together with reference numeral 7110). Is deposited on the front side of the wafer 7105, for example by PECVD, at a temperature of, for example, about 150.degree. C. to about 200.degree.

  Next, in FIG. 82E, an intrinsic a-Si: H layer with a thickness of about 5 nm and a doped p + a-Si: H layer with a thickness of about 5 nm (both layers are shown together with reference number 7115) Is deposited on the backside of the wafer 7105, for example by PECVD, at a temperature of about 150.degree. C. to about 200.degree.

  Next, in FIG. 82F, a TCO layer 7120 about 65 nm thick is deposited on the previous a-Si: H layer 7110. This can be achieved, for example, by physical vapor deposition (PVD) or by ion plating. The TCO layer 7120 can fill the trench 7160 and typically coat the walls and bottom of the trench 7160 and the outer edge of the layer 7110, thereby passivating the coated surface. TCO layer 7120 also functions as an antireflective coating.

  Next, in FIG. 82G, a TCO layer 7125 about 65 nm thick is deposited on the back a-Si: H layer 7115. This can be achieved, for example, by PVD or by ion plating. TCO layer 7125 passivates the surface (including, for example, the outer edge) of layer 7115 and also functions as an antireflective coating.

  Next, in FIG. 82H, conductive (eg, metal) front grid lines 7130 are screen printed on the TCO layer 7120. The grid lines 7130 may be formed, for example, from a low temperature silver paste.

  Next, in FIG. 82I, a conductive (eg, metal) backside grid line 7135 is screen printed on the TCO layer 7125. The grid lines 7135 can be formed, for example, from a low temperature silver paste.

  Next, after deposition of grid lines 7130 and grid lines 7135, the solar cell is cured at a temperature of about 200 ° C., for about 30 minutes, for example.

  Next, in FIG. 82J, the solar cells are separated into solar cell strips 7165a, 7165b, 7165c and 7165d by dicing the solar cells at the center of the trench. Dicing may be achieved, for example, by cleaving the solar cell along the trench using conventional mechanical cleavage at the center of the trench. Alternatively, dicing may be accomplished, for example, using a Thermal Laser Separation process as described above.

  The resulting strip solar cells 7165a-7165d differ from the strip solar cells 7100a-7100d shown in FIG. In particular, the edges of the a-Si: H layer 7110 in the solar cells 7165a-7165d are formed by etching, not by mechanical cleavage. In addition, the edge of layer 7110 in solar cells 7165a-7165d is passivated by the TCO layer. As a result, solar cells 7165a-7165d do not have the cleavage edge present in solar cells 7100a-7100d, which promotes carrier recombination.

  The methods described in connection with FIGS. 82A-82J are intended to be illustrative rather than limiting. The steps described as being performed in a particular order may be performed in other orders or in parallel, as appropriate. The process and material layers may be omitted, added or replaced as appropriate. For example, if copper plated metallization is used, additional patterning or seed layer deposition steps can be included in the process. Furthermore, in some variations, the trenches 7160 may be formed on the back side of the wafer 7105 rather than on the front side of the wafer 7105.

  The methods described above in connection with FIGS. 81A-81J and 86A-86J are applicable to both n-type and p-type HIT solar cells. The solar cell can be a front emitter or a back emitter. It may be preferable to apply the separation process on the side without the emitter. Furthermore, using isolation trenches and passivation layers as described above to reduce recombination on the cleaved wafer edge is applicable to other solar cell designs and solar cells using material systems other than silicon. is there.

  Referring again to FIG. 1, a string of a plurality of series connected solar cells 10, formed according to the method described above, advantageously has the ends of adjacent solar cells overlapped and electrically connected to form a supercell 100. It can be arranged in a fine-grained manner. In supercell 100, adjacent solar cells 10 are connected to each other by an electrically conductive bonding agent that electrically connects the front metallization pattern of one solar cell to the back metallization pattern of the adjacent solar cells in the area where they overlap. Conduction bonding. Suitable electrically conductive binders may include, for example, electrically conductive adhesives, electrically conductive adhesive films and tapes, and conventional solders.

  Referring back to FIGS. 5A-5B, FIG. 5A shows an exemplary rectangular solar module 200 including twenty rectangular supercells 100 each having a length approximately equal to the length of one half of the short side of the solar module. . The super cells are arranged in pairs and connected end to end, with 10 super cell rows, with those rows and the long sides of the super cells, oriented parallel to the short sides of the solar module It is formed in the state. In other variations, each supercell row may include three or more supercells. Also, in other variations, the supercells are oriented in rows, with the rows and the long sides of the supercells oriented parallel to the long sides of the rectangular solar module, or parallel to the sides of the square solar modules In the closed state, the ends can be arranged to connect the ends. In addition, the solar module may include more or less supercells and more or less supercell rows as shown in this example.

  In the variation where the supercell 100 in each row is arranged such that at least one of the supercells in each row has a front end contact on the end of the supercell adjacent to the other supercell in that row, FIG. An optional gap 210, shown in FIG. 1, may be present to facilitate electrical contact with the front end contact of the supercell along the centerline of the solar module. In variations where each supercell row includes three or more supercells, there may be additional optional gaps between the supercells, as well as front end contacts located away from the sides of the solar module It can facilitate electrical contact with the

  FIG. 5B shows another exemplary rectangular solar module 300 including ten rectangular supercells 100 each having a length approximately equal to the length of the short side of the solar module. The supercells are arranged with their long sides oriented parallel to the short sides of the module. In another variation, the supercell may have a length approximately equal to the length of the long side of the rectangular solar module, and those long sides may be oriented parallel to the long side of the solar module. Also, the supercell may have a length approximately equal to the length of the sides of the square solar module, and their long sides may be oriented parallel to the sides of the solar module. Furthermore, the solar module may include more or less such side length supercells as shown in this example.

  FIG. 5B also shows how the solar module 200 looks when there is no gap between adjacent supercells in the plurality of supercell rows in the solar module 200 of FIG. 5A. Any other suitable arrangement of supercell 100 in a solar module may also be used.

  The following enumerated paragraphs provide additional non-limiting aspects of the present disclosure.

1. A series connected string of rectangular or nearly rectangular solar cells having a breakdown voltage higher than about 10 volts, N (N 25) on average, such that the rectangular or nearly rectangular solar cells are one or more supercells. The plurality of solar cells, which are grouped, and each of the one or more supercells are arranged side by side with the long sides of adjacent solar cells overlapping and conductively bonded to each other by an electrical and thermal conductive adhesive. Comprising a series connected string of rectangular or nearly rectangular solar cells, including two or more of the cells;
A solar module, wherein none of the single solar cells in the string of solar cells, or a group of less than N solar cells, are individually electrically connected in parallel with the bypass diodes.

  2. The solar module according to item 1, wherein N is greater than or equal to 30.

  3. The solar module according to item 1, wherein N is greater than or equal to 50.

  4. The solar module according to item 1, wherein N is greater than or equal to 100.

  5. The adhesive has a thickness in a direction perpendicular to the plurality of solar cells of less than or equal to about 0.1 mm, and a thermal conductivity of about 1.5 w / in a direction perpendicular to the plurality of solar cells. The solar module according to Item 1, which forms a plurality of junctions between adjacent solar cells higher than or equal to m / k.

  6. The solar module according to Item 1, wherein the N solar cells are grouped into a single supercell.

  7. The solar module according to Item 1, wherein the plurality of supercells are enclosed in a polymer.

  7A. Item 8. The solar module according to item 7, wherein the polymer comprises a thermoplastic olefin polymer.

  7B. The solar module according to Item 7, wherein the polymer is sandwiched between a glass front sheet and a rear sheet.

  7C. The solar module according to Item 7B, wherein the back sheet includes glass.

  8. The solar module according to Item 1, wherein the plurality of solar cells are silicon solar cells.

9. A solar module,
A supercell extending substantially the entire length or width of the solar module parallel to the edge of the solar module, wherein the supercell is formed by overlapping the long sides of adjacent solar cells to form an electrical and thermal conductive adhesive Comprising a series connected string of rectangular or nearly rectangular solar cells having N breakdown voltages higher than about 10 volts, arranged side by side in conductive junction with each other,
A solar module, wherein none of the single solar cells in the supercell, or a group of less than N solar cells, are individually electrically connected in parallel with the bypass diodes.

  10. Item 10. The solar module according to item 9, wherein N> 24.

  11. Item 10. The solar module according to item 9, wherein the length of the supercell in the direction of current flow is at least about 500 mm.

  12. Item 10. The solar module according to item 9, wherein the plurality of supercells are enclosed in a thermoplastic olefin polymer sandwiched between a glass front sheet and a back sheet.

13. A supercell,
Equipped with multiple silicon solar cells,
Each silicon solar cell is
An oblong or substantially oblong front and back face having a shape defined by oppositely positioned parallel first and second long sides and two oppositely located short sides Front and back surfaces, at least a portion of which are exposed to solar radiation during operation of the solar cell string;
An electrically conductive front metallization pattern disposed on the front and including at least one front contact pad positioned adjacent to the first long side;
An electrically conductive back surface metallization pattern disposed on the back surface and including at least one back surface contact pad positioned adjacent to the second long side;
In the plurality of silicon solar cells, the first long side and the second long side of the adjacent silicon solar cells overlap, and the contact pads on the front and rear faces on the adjacent silicon solar cells overlap and conduct Conductively bonded to each other by the adhesive adhesive, and the adjacent silicon solar cells are arranged side by side electrically connected in series,
The front metallized pattern of each silicon solar cell substantially encapsulates the conductive adhesive bond to at least one front contact pad prior to curing of the conductive adhesive bond during fabrication of the supercell. Supercell, including a barrier configured as follows.

  14. For each pair of adjacent and overlapping silicon solar cells, a portion of the other silicon solar cell of the silicon solar cell overlaps the barrier of the front of one of the silicon solar cells, the barrier being Partially concealing, thereby substantially confining the conductive adhesive in overlapping areas of the front surface of the silicon solar cell prior to curing of the conductive adhesive during manufacture of the supercell , Supercell according to Item 13.

  15. The barrier includes a continuous conductive line extending substantially the entire length of the first long side in parallel with the first long side, the at least one front contact pad comprising the continuous conductive line, and Item 14. The supercell according to item 13, which is located between the first long side of the solar cell.

  16. The front side metallization pattern electrically connects to the at least one front contact pad and includes the fingers extending in a direction perpendicular to the first long side, and the continuous conductive line electrically interconnects the plurality of fingers. Item 20. The supercell of item 15, providing multiple conductive paths from each finger to at least one front contact pad.

  17. The front side metallization pattern includes a plurality of discrete contact pads arranged in rows adjacent and parallel to the first long side, the barrier being for each of the discrete contact pads the superstructure Prior to curing of the conductive adhesive during cell fabrication, including a plurality of features forming a plurality of discrete barriers substantially encapsulating the conductive adhesive in the discontinuous contact pad; Item 13. A supercell according to item 13.

  18. Item 18. The supercell according to Item 17, wherein the plurality of separate barriers abut on and are higher than their corresponding discontinuous contact pads.

19. A supercell,
Equipped with multiple silicon solar cells,
Each silicon solar cell is
An oblong or substantially oblong front and back face having a shape defined by oppositely positioned parallel first and second long sides and two oppositely located short sides Front and back surfaces, at least a portion of which are exposed to solar radiation during operation of the solar cell string;
An electrically conductive front metallization pattern disposed on the front and including at least one front contact pad positioned adjacent to the first long side;
An electrically conductive back surface metallization pattern disposed on the back surface and including at least one back surface contact pad positioned adjacent to the second long side;
In the plurality of silicon solar cells, the first long side and the second long side of the adjacent silicon solar cells overlap, and the contact pads on the front and rear faces on the adjacent silicon solar cells overlap and conduct Conductively bonded to each other by the adhesive adhesive, and the adjacent silicon solar cells are arranged side by side electrically connected in series,
The backside metallized pattern of each silicon solar cell may substantially transfer the conductive adhesive bond to the at least one rear contact pad prior to curing of the conductive adhesive during manufacture of the supercell. A supercell that contains a barrier configured to contain it.

  20. The back surface metallization pattern includes one or more discontinuous contact pads arranged in rows adjacent and parallel to the second long side, the barrier being for each discontinuous contact pad Prior to curing of the conductive adhesive during manufacture of the supercell, a plurality of features forming a plurality of discrete barriers substantially encapsulating the conductive adhesive in the discontinuous contact pad. Item 20. The supercell according to item 19.

  21. 21. The supercell according to clause 20, wherein the plurality of separate barriers abut on their higher discrete contact pads and are higher.

22. A method of making a solar cell string,
Dicing the one or more quasi-square silicon wafers along a plurality of lines parallel to the long edge of each quasi-square silicon wafer among one or more quasi-square silicon wafers to substantially the same along the major axis Forming a plurality of rectangular silicon solar cells each having a length;
Arranging the plurality of rectangular silicon solar cells side by side in a state in which the long sides of adjacent solar cells overlap and are conductively joined to each other, and the adjacent solar cells are electrically connected in series;
The plurality of rectangular silicon solar cells comprises at least one rectangular solar cell including two beveled corners corresponding to a plurality of corners of the pseudo-square wafer or a portion of the plurality of corners; And one or more rectangular silicon solar cells that each does not have
The spacing between the plurality of parallel lines along which dicing of the pseudo-square wafer is performed does not have a width perpendicular to the long axis of the rectangular silicon solar cell including the chamfered corner, the chamfered corner One or more rectangular silicon solar cells are selected to compensate for the chamfered corners by making them wider than the long axis perpendicular to the long axis, thereby making the plurality of rectangular silicon solar cells in the solar cell string A method, each having a front surface where the areas exposed to light in operation of the solar cell string are substantially the same.

23. A solar cell string,
And a plurality of silicon solar cells arranged side by side in a state in which the adjacent solar cells are electrically connected in series, with the ends of the adjacent solar cells overlapping and conductively joined to each other,
At least one of the plurality of silicon solar cells has a chamfered corner corresponding to a plurality of corners or a portion of a plurality of corners of the pseudo square silicon wafer from which dicing is performed, and At least one does not have beveled corners, and each of the plurality of silicon solar cells has substantially the same area exposed to light during operation of the solar cell string. Have, solar cell string.

How to make 24.2 or more solar cell strings,
The one or more pseudo square silicon wafers are diced along a plurality of lines parallel to the long edge of each pseudo square silicon wafer among one or more pseudo square silicon wafers, and the one or more pseudo square silicon wafers A first plurality of rectangular silicon solar cells including chamfered corners corresponding to a plurality of corners of the plurality of corners, or a plurality of first corners spread across the entire width of the one or more pseudo-square silicon wafers Forming a second plurality of rectangular silicon solar cells each having a length and having no chamfered corners;
The chamfered corner is removed from each of the first plurality of rectangular silicon solar cells, and each has a second length shorter than the first length and does not have a chamfered corner. Forming three or more rectangular silicon solar cells;
The second plurality of rectangular silicon solar cells are arranged side by side in a state in which long sides of adjacent rectangular silicon solar cells overlap and are conductively connected to each other, and the second plurality of rectangular silicon solar cells are electrically connected in series Forming a solar cell string having a width equal to the first length;
The third plurality of rectangular silicon solar cells are arranged side by side in a state in which long sides of adjacent rectangular silicon solar cells overlap and are conductively connected to each other, and the third plurality of rectangular silicon solar cells are electrically connected in series Forming a solar cell string having a width equal to said second length.

A method of making a solar cell string of 25.2 or more,
The one or more pseudo square silicon wafers are diced along a plurality of lines parallel to the long edge of each pseudo square silicon wafer among one or more pseudo square silicon wafers, and the one or more pseudo square silicon wafers A first plurality of rectangular silicon solar cells including chamfered corners corresponding to a plurality of corners of the plurality of corners or a plurality of corners, and a second plurality of rectangular silicon solar cells having no chamfered corners Forming the
The first plurality of rectangular silicon solar cells are arranged side by side in a state in which the long sides of adjacent rectangular silicon solar cells overlap and are conductively connected to each other, and the first plurality of rectangular silicon solar cells are electrically connected in series Process,
The second plurality of rectangular silicon solar cells are arranged side by side in a state in which long sides of adjacent rectangular silicon solar cells overlap and are conductively connected to each other, and the second plurality of rectangular silicon solar cells are electrically connected in series And a process.

26. How to make a solar module,
A chamfered corner corresponding to a plurality of corners of the plurality of pseudo square silicon wafers by dicing the wafer along a plurality of lines parallel to a long edge of each of the plurality of pseudo square silicon wafers. Forming a plurality of rectangular silicon solar cells including the plurality of rectangular silicon solar cells and a plurality of rectangular silicon solar cells without chamfered corners from the plurality of pseudo square silicon wafers;
At least some of the plurality of rectangular silicon solar cells without chamfered corners are arranged, and the long sides of the plurality of rectangular silicon solar cells overlap and are conductively bonded to each other to form the plurality of rectangular silicon solar cells Forming a first plurality of supercells, each comprising only rectangular silicon solar cells without chamfered corners, arranged side by side electrically connected in series;
At least some of the plurality of rectangular silicon solar cells including the chamfered corner are arranged, and the long sides of the plurality of rectangular silicon solar cells overlap and are conductively bonded to each other to serially connect the plurality of rectangular silicon solar cells Forming a second plurality of supercells each including only rectangular silicon solar cells having chamfered corners arranged side by side in electrical connection;
A plurality of parallel supercell rows of substantially equal length, each row including only a plurality of supercells from the first plurality of supercells or only a plurality of supercells from the second plurality of supercells. Placing the plurality of supercells on the to form the front surface of the solar module.

  27. Two of the plurality of supercell rows adjacent to parallel opposing edges of the solar module include only the plurality of supercells from the second plurality of supercells and all other plurality of supercells. 27. The solar module of clause 26, wherein the cell row comprises only supercells from the first plurality of supercells.

  28. The solar module according to Item 27, wherein the solar module includes a total of six supercell rows.

29. A plurality of silicon solar cells arranged in the first direction in a state in which the ends of adjacent silicon solar cells overlap and conductively bond with each other to electrically connect the adjacent silicon solar cells in series;
Long and narrow flexible electrical interconnections,
A longitudinal axis of the elongated flexible electrical interconnect is oriented parallel to a second direction perpendicular to the first direction;
The elongated flexible electrical interconnect is
Conducting bonding to the front or back surface of the end silicon solar cell of the plurality of silicon solar cells at three or more discontinuous positions arranged along the second direction;
Extends at least the full width of the end solar cell in the second direction,
The conductor thickness measured in the direction perpendicular to the front or back of the silicon solar cell at the end is less than or equal to about 100 microns,
Provide a resistance less than or equal to about 0.012 ohms to the flow of current in the second direction,
Configured to provide flexibility to accommodate differential expansion in the second direction between the silicon solar cell at the end and the interconnect at a temperature range of about -40.degree. C. to about 85.degree. C. You are a supercell.

  30. 30. The supercell of claim 29, wherein the flexible electrical interconnect has a conductor thickness measured in a direction perpendicular to the front and back surfaces of the end silicon solar cell is less than or equal to about 30 microns. .

  31. The flexible electrical interconnect extends beyond the supercell in the second direction and at least to the second supercell positioned parallel to and adjacent to the supercell in the solar module. 30. A supercell according to clause 29, which provides interconnection.

  32. The flexible electrical interconnect extends beyond the supercell in the first direction to provide electrical interconnect to a second supercell positioned parallel to and alongside the supercell in the solar module The supercell according to Item 29, which is provided.

33. A solar module,
Arranged in two or more parallel rows extending across the width of the solar module to form the front surface of the solar module, the ends of adjacent silicon solar cells overlap and conductively bond to each other Comprising a plurality of supercells, each comprising a plurality of silicon solar cells arranged side by side in a state in which the mutually opposing silicon solar cells are electrically connected in series;
At least the end of the first supercell adjacent to the edge of the solar module in the first row is:
Bonded to the front of the first supercell by means of an electrically conductive adhesive in discrete locations,
Extends parallel to the edge of the solar module,
At least a part of which is broken around the end of the first supercell and is hidden from view from the front of the solar module,
Through flexible electrical interconnections,
Electrically connected to the end of the second supercell, adjacent to the same edge of the solar module in the second row,
Solar module.

  34. 34. The solar module of clause 33, wherein the surface of the flexible electrical interconnect on the front surface of the solar module is covered or colored to reduce the visible contrast to the supercell.

35. The two or more parallel rows of supercells are disposed on a white back sheet to form the front of the solar module that will be irradiated by solar radiation during operation of the solar module,
The white backsheet includes parallel dark multiple stripes having locations and widths corresponding to locations and widths of multiple gaps between two or more parallel rows of the supercell,
34. The solar module of paragraph 33, wherein a plurality of white portions of the plurality of backsheets are not visible through the plurality of gaps between two or more parallel rows of the supercell.

36. A method of making a solar cell string,
Laser scribing one or more scribe lines on each silicon solar cell of one or more silicon solar cells to define a plurality of rectangular regions on the one or more silicon solar cells;
Applying an electrically conductive adhesive to the scribed one or more silicon solar cells at one or more locations adjacent to the long side of each rectangular region;
A plurality of rectangles each including a portion of the electrically conductive adhesive, disposed on the front surface adjacent to the long side, with the one or more silicon solar cells separated along the one or more scribe lines Providing a silicon solar cell;
Arranging the plurality of rectangular silicon solar cells side by side in a state in which the long sides of adjacent rectangular silicon solar cells are partially overlapped with each other in a state in which a part of the electrically conductive adhesive is disposed therebetween;
Curing the electrically conductive bonding agent, thereby bonding adjacent and overlapping rectangular silicon solar cells together and electrically connecting them in series.

37. A method of making a solar cell string,
Laser scribing one or more scribe lines on each silicon solar cell of the one or more silicon solar cells each having a top surface and an oppositely positioned bottom surface; Defining a plurality of rectangular areas on the battery;
Applying an electrically conductive adhesive to a portion of the top surface of the one or more silicon solar cells;
A vacuum is drawn between the bottom surface and the curved support surface of the one or more silicon solar cells to move the one or more silicon solar cells toward the curved support surface, thereby bending the one or more silicon solar cells. Cleavage of the one or more silicon solar cells along the scribe line to provide a plurality of rectangular silicon solar cells each including a portion of the electrically conductive adhesive bond disposed on the front surface adjacent to the long side The process to
Arranging the plurality of rectangular silicon solar cells side by side in a state in which the long sides of adjacent rectangular silicon solar cells are partially overlapped with each other in a state in which a part of the electrically conductive adhesive is disposed therebetween;
Curing the electrically conductive bonding agent, thereby bonding adjacent and overlapping rectangular silicon solar cells together and electrically connecting them in series.

  38. Applying the electrically conductive adhesive to the one or more silicon solar cells, and then laser scribing the one or more scribe lines on each silicon solar cell of the one or more silicon solar cells 38. A method according to clause 37, comprising:

  39. A step of laser scribing the one or more scribe lines on each silicon solar cell of the one or more silicon solar cells, and thereafter applying the electrically conductive adhesive to the one or more silicon solar cells 38. A method according to clause 37, comprising:

40. A solar module,
The plurality of supercells arranged in two or more parallel rows to form the front face of the solar module, each supercell overlapping adjacent conductive solar cell ends and conducting junctions with one another. It has a plurality of silicon solar cells arranged side by side in a state in which adjacent silicon solar cells are electrically connected in series,
Each supercell has a front end contact at one end of the supercell and a reverse polarity rear end contact at the opposite end of the supercell,
The first supercell row includes a first supercell arranged with the front end contact adjacent and parallel to the first edge of the solar module;
The solar module elongates parallel to the first edge of the solar module, conductively bonded to the front end contact of the first supercell, and adjacent to the first edge of the solar module A solar module, comprising: a first flexible electrical interconnect that occupies only a narrow portion of the front surface of the solar module having a width measured in a direction perpendicular to the first edge of the solar module of about 1 centimeter or less.

  41. Item 40. A portion of the first flexible electrical interconnect extends closest to the first edge of the solar module and extends around the end of the first supercell, behind the first supercell. Solar module described in.

  42. Item 40. The item 40, wherein the first flexible interconnect comprises a thin ribbon portion conductively bonded to the front end contact of the first supercell, and a thicker portion extending parallel to the first edge of the solar module. Solar module described in.

  43. The first flexible interconnect includes a thin ribbon portion conductively bonded to the front end contact portion of the first supercell and a coiled ribbon portion extending parallel to the first edge of the solar module. The solar module according to Item 40.

  44. The second supercell row includes a second supercell arranged with the front end contact portion adjacent and parallel to the first edge of the solar module, the front end contact of the first supercell A solar module according to clause 40, wherein a portion is electrically connected to the front end contact of the second supercell via the first flexible electrical interconnect.

45. Said rear end contact portion of said first supercell is located adjacent to and parallel to a second edge of said solar module opposite said first edge of said solar module,
A second flexible electrical interconnect extending in parallel to the second edge of the solar module and conductively bonded to the back end contact of the first supercell, the whole lying behind the supercell The solar module according to 40.

46. A second supercell row has a front end contact adjacent and parallel to the first edge of the solar module and a rear end contact adjacent to the second edge of the solar module And a second supercell arranged in parallel orientation,
The front end contact portion of the first supercell is electrically connected to the front end contact portion of the second supercell via the first flexible electrical interconnect,
46. The solar module of clause 45, wherein the back end contact portion of the first supercell is electrically connected to the back end contact portion of the second supercell via the second flexible electrical interconnect.

47. A first supercell row disposed in series with the first supercell with a back end contact portion adjacent to a second edge of the solar module opposite the first edge of the solar module; With 2 super cells,
A second flexible electrical interconnect extending elongated parallel to the second edge of the solar module and conductively bonded to the back end contact of the first supercell, the whole lying behind the supercell; The solar module according to Item 40.

48. The second supercell row is such that the front end contact of the third supercell is adjacent to the first edge of the solar module and the back end contact of the fourth supercell is adjacent to the second edge of the solar module The third supercell and the fourth supercell arranged in series in a state;
The front end contact portion of the first supercell is electrically connected to the front end contact portion of the third supercell via the first flexible electrical interconnect, and the back end contact of the second supercell The solar module according to paragraph 47, wherein a portion is electrically connected to the back end contact of the fourth supercell via the second flexible electrical interconnect.

49. The plurality of supercells is a white back surface including a plurality of parallel dark stripes having positions and widths corresponding to positions and widths of gaps between the two or more parallel rows of supercells. Placed on the sheet,
51. The solar module of clause 40, wherein a plurality of white portions of the plurality of backsheets are not visible through the plurality of gaps between two or more parallel rows of the supercell.

  50. 51. The solar of claim 40, wherein all portions of the first flexible electrical interconnect, located on the front surface of the solar module, are covered or colored to reduce the visible contrast to the supercell. module.

51. Each silicon solar cell is
An oblong or substantially oblong front and back face having a shape defined by oppositely positioned parallel first and second long sides and two oppositely located short sides Front and back surfaces, at least a portion of which are exposed to solar radiation during operation of the solar cell string;
A plurality of fingers disposed on the front surface and extending perpendicularly to the first long side and the second long side, and a plurality of discontinuous front contact pads positioned in a row adjacent to the first long side An electrically conductive front metallization pattern, each front contact pad electrically connecting to at least one of the plurality of fingers;
An electrically conductive back surface metallization pattern comprising a plurality of discontinuous back surface contact pads disposed on the back surface and positioned in a row adjacent to the second long side;
In each supercell, the plurality of silicon solar cells are in a state in which the first long side and the second long side of the adjacent silicon solar cells overlap with each other, and corresponding non-matching on the adjacent silicon solar cells A continuous front contact pad and a discontinuous back contact pad are aligned with one another, overlapped, and conductively bonded by means of a conductive adhesive, to arrange the adjacent silicon solar cells in series in a series electrically connected state Item 40. The solar module according to Item 40.

  52. The front surface metallization pattern of each silicon solar cell includes a plurality of thin conductors electrically interconnecting adjacent discontinuous front contact pads, each thin conductor being perpendicular to the long side of the plurality of solar cells. 52. A solar module according to item 51, which is thinner than the width of the plurality of discontinuous contact pads measured in a direction.

  53. The conductive adhesive adhesive forms one or more barriers adjacent to the plurality of discontinuous front contact pads, and according to the plurality of features of the front side metallization pattern, the plurality of discontinuous front contact pads 52. A solar module according to clause 51, substantially enclosed in said plurality of locations.

  54. The conductive adhesive bond forms one or more barriers adjacent to the plurality of discontinuous back contact pads, and according to the plurality of features of the back surface metallized pattern, the plurality of discontinuous back contact pads 52. A solar module according to clause 51, substantially enclosed in said plurality of locations.

55. A step of assembling a plurality of supercells, each of a plurality of rectangular silicon solar cells arranged side by side in a state in which a plurality of ends on the long sides of adjacent rectangular silicon solar cells overlap each other The process of supercell includes heating and pressurizing the plurality of supercells to cure the electrically conductive bonding agent disposed between the overlapping ends of adjacent rectangular silicon solar cells, thereby causing adjacent Bonding mutually overlapping rectangular silicon solar cells together and electrically connecting them in series;
Placing and interconnecting the plurality of supercells in a desired solar module configuration in a layer stack including an encapsulant;
Heating and pressing the layer stack to form a laminated structure.

  56. Heating and pressing the layer stack to heat or press the plurality of supercells prior to the step of forming the laminated structure, thereby curing or partially curing the electrically conductive bonding agent; 56. A method according to clause 55, comprising the step of thereby forming a cured or partially cured supercell as an intermediate product prior to formation of the laminated structure.

  57. The above electricity between the newly added solar cell and its adjacent overlapping solar cell as each additional rectangular silicon solar cell is added to the supercell during assembly of the supercell 57. The method of clause 56, wherein the conductive adhesive binder is allowed to cure or partially cure before the other rectangular silicon solar cells are added to the supercell.

  58. 57. A method according to clause 56, comprising curing or partially curing all of the electrically conductive bonding agent in the supercell in the same step.

59. Heating and pressurizing the layer stack to partially cure the electrically conductive binder by heating and pressurizing the plurality of supercells prior to the step of forming the laminated structure; Thereby forming the partially cured supercell as an intermediate product prior to formation of the laminated structure, completing the curing of the electrically conductive bonding agent while heating and pressing the layer stack. 61. A method according to clause 56, comprising forming the laminated structure.

  60. Prior to the formation of the laminated structure, the electrically conductive bonding agent is cured while heating and pressing the layer stack to form a laminated structure without forming a cured or partially cured supercell as an intermediate product. 56. A method according to clause 55, comprising the step of forming.

  61. 56. A method according to clause 55, comprising dicing one or more silicon solar cells into a plurality of rectangles to provide the plurality of rectangular silicon solar cells.

  62. Applying the electrically conductive adhesive to the one or more silicon solar cells prior to the step of dicing the one or more silicon solar cells; 72. A method according to clause 61, comprising providing a rectangular silicon solar cell.

  63. Apply the conductive adhesive to the one or more silicon solar cells and then scribe one or more lines on each silicon solar cell of the one or more silicon solar cells using a laser 63. A method according to clause 62, further comprising the step of cleaving the one or more silicon solar cells along the scribed one or more lines.

  64. Using a laser, scribe one or more lines on each silicon solar cell of the one or more silicon solar cells, and then apply the electrically conductive adhesive to the one or more silicon solar cells 63. A method according to clause 62, comprising subsequently cleaving the one or more silicon solar cells along the scribed one or more lines.

65. The electrically conductive adhesive is applied to the top surface of each silicon solar cell of the one or more silicon solar cells, and positioned opposite to each other of the one or more silicon solar cells. Not applied to the bottom of the
A vacuum is drawn between the bottom surface and the curved support surface of the one or more silicon solar cells to move the one or more silicon solar cells toward the curved support surface, thereby bending a plurality of scribe lines 63. A method according to clause 62, comprising cleaving the one or more silicon solar cells along.

  66. Applying a step of applying the electrically conductive adhesive to the plurality of rectangular silicon solar cells after the step of dicing the one or more silicon solar cells to provide the plurality of rectangular silicon solar cells 61. The method according to 61.

  67. 56. The method of paragraph 55, wherein the conductive adhesive binder has a glass transition temperature less than or equal to about 0 ° C.

1A. A solar module,
Comprising a plurality of supercells arranged in two or more parallel rows to form the front of the solar module,
Each supercell has a plurality of silicon solar cells arranged side by side with the ends of adjacent silicon solar cells overlapping and conducting junctions with each other to electrically connect the adjacent silicon solar cells in series. ,
Each supercell has a front end contact at one end of the supercell and a reverse polarity rear end contact at the opposite end of the supercell,
The first supercell row includes a first supercell arranged with the front end contact adjacent and parallel to the first edge of the solar module;
The solar module elongates parallel to the first edge of the solar module, conductively bonded to the front end contact of the first supercell, and adjacent to the first edge of the solar module A solar module, comprising: a first flexible electrical interconnect that occupies only a narrow portion of the front surface of the solar module having a width measured in a direction perpendicular to the first edge of the solar module of about 1 centimeter or less.

  2A. Item 1A, wherein a portion of the first flexible electrical interconnect extends closest to the first edge of the solar module and behind the first supercell, around the edge of the first supercell Solar module described in.

  3A. The first flexible interconnect includes a thin ribbon portion conductively bonded to the front end contact portion of the first supercell and a thicker portion extending parallel to the first edge of the solar module. Solar module described in.

  4A. The first flexible interconnect includes a thin ribbon portion conductively bonded to the front end contact portion of the first supercell and a coiled ribbon portion extending parallel to the first edge of the solar module. The solar module according to Item 1A.

  5A. The second supercell row includes a second supercell arranged with the front end contact portion adjacent and parallel to the first edge of the solar module, the front end contact of the first supercell The solar module of paragraph 1A, wherein a portion is electrically connected to the front end contact of the second supercell via the first flexible electrical interconnect.

6A. Said rear end contact portion of said first supercell is located adjacent to and parallel to a second edge of said solar module opposite said first edge of said solar module,
A second flexible electrical interconnect extending parallel to the second edge of the elongated solar module and conductively bonded to the back end contact of the first supercell, the whole lying behind the supercell The solar module according to Item 1A.

7A. A second supercell row has a front end contact adjacent and parallel to the first edge of the solar module and a rear end contact adjacent to the second edge of the solar module And a second supercell arranged in parallel orientation,
The front end contact portion of the first supercell is electrically connected to the front end contact portion of the second supercell via the first flexible electrical interconnect,
The solar module of paragraph 6A, wherein the back end contact portion of the first supercell is electrically connected to the back end contact portion of the second supercell via the second flexible electrical interconnect.

8A. A first supercell row disposed in series with the first supercell with a back end contact portion adjacent to a second edge of the solar module opposite the first edge of the solar module; With 2 super cells,
A second flexible electrical interconnect extending elongated parallel to the second edge of the solar module and conductively bonded to the back end contact of the first supercell, the whole lying behind the supercell; The solar module according to Item 1A.

9A. The second supercell row is such that the front end contact of the third supercell is adjacent to the first edge of the solar module and the back end contact of the fourth supercell is adjacent to the second edge of the solar module The third supercell and the fourth supercell arranged in series in a state;
The front end contact portion of the first supercell is electrically connected to the front end contact portion of the third supercell via the first flexible electrical interconnect, and the back end contact of the second supercell The solar module according to paragraph 8A, wherein a portion is electrically connected to the back end contact of the fourth supercell via the second flexible electrical interconnect.

  10A. The solar module according to paragraph 1A, wherein there is no electrical interconnection between the plurality of supercells that reduces the active area of the front surface of the solar module in a direction away from the plurality of outer edges of the solar module.

  11A. At least one supercell pair is arranged in a row with the back contact end of one supercell included in the supercell pair adjacent to the back contact end of the other supercell included in the supercell pair The solar module according to Item 1A, which is disposed.

12A. At least one supercell pair is arranged side by side in a row, with the adjacent ends of the two supercells having end contacts of opposite polarity,
The adjacent ends of the supercell pair overlap,
The solar module according to paragraph 1A, wherein the two supercells included in the supercell pair are sandwiched between their overlapping ends and electrically connected in series by a flexible interconnect that does not obscure the front surface.

13A. The plurality of supercells is a white backing comprising a plurality of parallel dark stripes having positions and widths corresponding to positions and widths of gaps between two or more parallel rows of supercells. Placed on the sheet,
The solar module of paragraph 1A wherein a plurality of white portions of the plurality of backing sheets are not visible through the plurality of gaps between two or more parallel rows of the supercell.

  14A. Solar according to paragraph 1A, wherein all parts of the first flexible electrical interconnect, located on the front face of the solar module, are covered or colored to reduce the visible contrast to the supercell module.

15A. Each silicon solar cell is
An oblong or substantially oblong front and back face having a shape defined by oppositely positioned parallel first and second long sides and two oppositely located short sides Front and back surfaces, at least a portion of which are exposed to solar radiation during operation of the solar cell string;
A plurality of fingers disposed on the front surface and extending perpendicularly to the first long side and the second long side, and a plurality of discontinuous front contact pads positioned in a row adjacent to the first long side An electrically conductive front metallization pattern, each front contact pad electrically connecting to at least one of the plurality of fingers;
An electrically conductive back surface metallization pattern comprising a plurality of discontinuous back surface contact pads disposed on the back surface and positioned in a row adjacent to the second long side;
In each supercell, the plurality of silicon solar cells are in a state in which the first long side and the second long side of the adjacent silicon solar cells overlap with each other, and corresponding non-matching on the adjacent silicon solar cells A continuous front contact pad and a discontinuous back contact pad are aligned with one another, overlapped, and conductively bonded by means of a conductive adhesive, to arrange the adjacent silicon solar cells in series in a series electrically connected state The solar module according to Item 1A.

  16A. The front surface metallization pattern of each silicon solar cell includes a plurality of thin conductors electrically interconnecting adjacent discontinuous front contact pads, each thin conductor being perpendicular to the long side of the plurality of solar cells. The solar module according to Item 15A, which is thinner than the widths of the plurality of discontinuous contact pads measured in a direction.

  17A. The conductive adhesive bond forms a plurality of barriers around each discontinuous front contact pad, and according to the plurality of features of the front surface metallization pattern, in the plurality of locations of the plurality of discontinuous front contact pads The solar module according to Item 15A, which is substantially contained.

  18A. The conductive adhesive bond forms a plurality of barriers around each discontinuous back surface contact pad, and according to the plurality of features of the back surface metallization pattern, at the plurality of locations of the plurality of discontinuous back surface contact pads The solar module according to Item 15A, which is substantially contained.

  19A. The plurality of discontinuous back surface contact pads are a plurality of discontinuous silver back surface contact pads, except for the plurality of discontinuous silver back surface contact pads, the back surface metallization pattern of each silicon solar cell is The solar module according to paragraph 15A, wherein no silver contact is included in any position lying below the part of the front face of the solar cell where adjacent silicon solar cells do not overlap.

20A. A solar module,
A plurality of supercells, wherein the ends of adjacent silicon solar cells overlap and are conductively joined to each other, and the plurality of adjacent silicon solar cells are electrically connected in series and arranged side by side. Comprising a plurality of supercells, each supercell having
Each silicon solar cell is
An oblong or substantially oblong front and back face having a shape defined by oppositely positioned parallel first and second long sides and two oppositely located short sides Front and back surfaces, at least a portion of which are exposed to solar radiation during operation of the solar cell string;
A plurality of fingers disposed on the front surface and extending perpendicularly to the first long side and the second long side, and a plurality of discontinuous front contact pads positioned in a row adjacent to the first long side An electrically conductive front metallization pattern, each front contact pad electrically connecting to at least one of the plurality of fingers;
An electrically conductive back surface metallization pattern comprising a plurality of discontinuous back surface contact pads disposed on the back surface and positioned in a row adjacent to the second long side;
In each supercell, the plurality of silicon solar cells are in a state in which the first long side and the second long side of the adjacent silicon solar cells overlap with each other, and corresponding non-matching on the adjacent silicon solar cells A continuous front contact pad and a discontinuous back contact pad are aligned with one another, overlapped, and conductively bonded by means of a conductive adhesive, to arrange the adjacent silicon solar cells in series in a series electrically connected state Has been
The plurality of supercells may be arranged in a single row extending substantially across the length or width of the solar module, or in two or more parallel rows to provide for solar operation during operation of the solar module. A solar module, which forms the front of the solar module which is to be irradiated by radiation.

  21A. The plurality of discontinuous back surface contact pads are a plurality of discontinuous silver back surface contact pads, except for the plurality of discontinuous silver back surface contact pads, the back surface metallization pattern of each silicon solar cell is The solar module according to Item 20A, wherein no silver contact portion is included at any position lying below the part of the front surface of the solar cell where adjacent silicon solar cells do not overlap.

  22A. The front surface metallization pattern of each silicon solar cell includes a plurality of thin conductors electrically interconnecting adjacent discontinuous front contact pads, each thin conductor being perpendicular to the long side of the plurality of solar cells. The solar module according to Item 20A, which is thinner than the widths of the plurality of discontinuous contact pads measured in a direction.

  23A. The conductive adhesive bond forms a plurality of barriers around each discontinuous front contact pad, and according to the plurality of features of the front surface metallization pattern, in the plurality of locations of the plurality of discontinuous front contact pads The solar module according to Item 20A, which is substantially contained.

  24A. The conductive adhesive bond forms a plurality of barriers around each discontinuous back surface contact pad, and according to the plurality of features of the back surface metallization pattern, at the plurality of locations of the plurality of discontinuous back surface contact pads The solar module according to Item 20A, which is substantially contained.

25A. A supercell,
Equipped with multiple silicon solar cells,
Each silicon solar cell is
An oblong or substantially oblong front and back face having a shape defined by oppositely positioned parallel first and second long sides and two oppositely located short sides Front and back surfaces, at least a portion of which are exposed to solar radiation during operation of the solar cell string;
A plurality of fingers disposed on the front surface and extending perpendicularly to the first long side and the second long side, and a plurality of discontinuous front contact pads positioned in a row adjacent to the first long side An electrically conductive front metallization pattern, each front contact pad electrically connecting to at least one of the plurality of fingers;
An electrically conductive back surface metallization pattern comprising a plurality of discontinuous silver back surface contact pads disposed on the back surface and positioned in rows adjacent to the second long side;
The plurality of silicon solar cells are formed by overlapping the first long sides and the second long sides of adjacent silicon solar cells, and corresponding discontinuous front contact pads on the adjacent silicon solar cells. Supercell, in which the discrete back contact pads are aligned with one another, overlapped, conductively joined with a conductive adhesive, and electrically connected in series with the adjacent silicon solar cells. .

  26A. The plurality of discontinuous back surface contact pads are a plurality of discontinuous silver back surface contact pads, except for the plurality of discontinuous silver back surface contact pads, the back surface metallization pattern of each silicon solar cell is 26. The solar module according to paragraph 25A, wherein no silver contact is included in any position lying below the part of the front face of the solar cell where adjacent silicon solar cells do not overlap.

  27A. The front side metallization pattern includes a plurality of thin conductors electrically interconnecting adjacent discontinuous front contact pads, each thin conductor measuring in a direction perpendicular to the long sides of the plurality of solar cells, The solar cell string according to Item 25A, which is thinner than the widths of the plurality of discontinuous contact pads.

  28A. The conductive adhesive bond forms a plurality of barriers around each discontinuous front contact pad, and according to the plurality of features of the front surface metallization pattern, in the plurality of locations of the plurality of discontinuous front contact pads The solar cell string according to Item 25A, which is substantially contained.

  29A. The conductive adhesive bond forms a plurality of barriers around each discontinuous back surface contact pad, and according to the plurality of features of the back surface metallization pattern, at the plurality of locations of the plurality of discontinuous back surface contact pads The solar cell string according to Item 25A, which is substantially contained.

  30A. The solar cell string according to Item 25A, wherein the conductive adhesive binder has a glass transition lower than or equal to about 0 ° C.

31A. A step of assembling a plurality of supercells, each of a plurality of rectangular silicon solar cells arranged side by side in a state in which a plurality of ends on the long sides of adjacent rectangular silicon solar cells overlap each other The process of supercell includes heating and pressurizing the plurality of supercells to cure the electrically conductive bonding agent disposed between the overlapping ends of adjacent rectangular silicon solar cells, thereby causing adjacent Bonding mutually overlapping rectangular silicon solar cells together and electrically connecting them in series;
Placing and interconnecting the plurality of supercells in a desired solar module configuration in a layer stack including an encapsulant;
Heating and pressing the layer stack to form a laminated structure.

  32A. Heating and pressing the layer stack to heat or press the plurality of supercells prior to the step of forming the laminated structure, thereby curing or partially curing the electrically conductive bonding agent; The method according to paragraph 31A, comprising the step of thereby forming a cured or partially cured supercell as an intermediate product prior to formation of the laminated structure.

  33A. The above electricity between the newly added solar cell and its adjacent overlapping solar cell as each additional rectangular silicon solar cell is added to the supercell during assembly of the supercell The method of paragraph 32A wherein the conductive adhesive is cured or partially cured before the other rectangular silicon solar cells are added to the supercell.

  34A. The method according to paragraph 32A, comprising curing or partially curing all of the electrically conductive bonding agent in the supercell in the same step.

35A. Heating and pressurizing the layer stack to partially cure the electrically conductive binder by heating and pressurizing the plurality of supercells prior to the step of forming the laminated structure; Thereby forming the partially cured supercell as an intermediate product prior to formation of the laminated structure, completing the curing of the electrically conductive bonding agent while heating and pressing the layer stack. The method according to Item 32A, comprising: forming the laminated structure.

  36A. Prior to the formation of the laminated structure, the electrically conductive bonding agent is cured while heating and pressing the layer stack to form a laminated structure without forming a cured or partially cured supercell as an intermediate product. The method of paragraph 31A, comprising the step of forming.

  37A. The method of paragraph 31A, comprising dicing one or more silicon solar cells into a plurality of rectangles to provide the plurality of rectangular silicon solar cells.

  38A. Applying the electrically conductive adhesive to the one or more silicon solar cells prior to the step of dicing the one or more silicon solar cells; The method according to paragraph 37A, comprising providing a rectangular silicon solar cell.

  39A. Apply the conductive adhesive to the one or more silicon solar cells and then scribe one or more lines on each silicon solar cell of the one or more silicon solar cells using a laser 44. The method of clause 38A, comprising the step of subsequently cleaving the one or more silicon solar cells along the scribed one or more lines.

  40A. Using a laser, scribe one or more lines on each silicon solar cell of the one or more silicon solar cells, and then apply the electrically conductive adhesive to the one or more silicon solar cells 39. The method according to clause 38A, then comprising cleaving the one or more silicon solar cells along the scribed one or more lines.

41A. The electrically conductive adhesive is applied to the top surface of each silicon solar cell of the one or more silicon solar cells, and positioned opposite to each other of the one or more silicon solar cells. Not applied to the bottom of the
A vacuum is drawn between the bottom surface and the curved support surface of the one or more silicon solar cells to move the one or more silicon solar cells toward the curved support surface, thereby bending a plurality of scribe lines The method of paragraph 38A, comprising cleaving the one or more silicon solar cells along.

  42A. Applying a step of applying the electrically conductive adhesive to the plurality of rectangular silicon solar cells after the step of dicing the one or more silicon solar cells to provide the plurality of rectangular silicon solar cells Method described in 37A.

  43A. The method of paragraph 31A, wherein the conductive adhesive binder has a glass transition temperature less than or equal to about 0 ° C.

44A. How to make a supercell,
Laser scribing one or more scribe lines on each silicon solar cell of one or more silicon solar cells to define a plurality of rectangular regions on the one or more silicon solar cells;
Applying an electrically conductive adhesive to the scribed one or more silicon solar cells at one or more locations adjacent to the long side of each rectangular region;
A plurality of rectangles each including a portion of the electrically conductive adhesive, disposed on the front surface adjacent to the long side, with the one or more silicon solar cells separated along the one or more scribe lines Providing a silicon solar cell;
Arranging the plurality of rectangular silicon solar cells side by side in a state in which the long sides of adjacent rectangular silicon solar cells are partially overlapped with each other in a state in which a part of the electrically conductive adhesive is disposed therebetween;
Curing the electrically conductive bonding agent, thereby bonding adjacent and overlapping rectangular silicon solar cells together and electrically connecting them in series.

45A. How to make a supercell,
Laser scribing one or more scribe lines on each silicon solar cell of the one or more silicon solar cells each having a top surface and an oppositely positioned bottom surface; Defining a plurality of rectangular areas on the battery;
Applying an electrically conductive adhesive to a portion of the top surface of the one or more silicon solar cells;
A vacuum is drawn between the bottom surface and the curved support surface of the one or more silicon solar cells to move the one or more silicon solar cells toward the curved support surface, thereby bending the one or more silicon solar cells. Cleavage of the one or more silicon solar cells along the scribe line to provide a plurality of rectangular silicon solar cells each including a portion of the electrically conductive adhesive bond disposed on the front surface adjacent to the long side The process to
Arranging the plurality of rectangular silicon solar cells side by side in a state in which the long sides of adjacent rectangular silicon solar cells are partially overlapped with each other in a state in which a part of the electrically conductive adhesive is disposed therebetween;
Curing the electrically conductive bonding agent, thereby bonding adjacent and overlapping rectangular silicon solar cells together and electrically connecting them in series.

46A. How to make a supercell,
Dicing the one or more quasi-square silicon wafers along a plurality of lines parallel to the long edge of each quasi-square silicon wafer among one or more quasi-square silicon wafers to substantially the same along the major axis Forming a plurality of rectangular silicon solar cells each having a length;
Arranging the plurality of rectangular silicon solar cells side by side in a state in which the long sides of adjacent solar cells overlap and are conductively joined to each other, and the adjacent solar cells are electrically connected in series;
The plurality of rectangular silicon solar cells comprises at least one rectangular solar cell including two beveled corners corresponding to a plurality of corners of the pseudo-square wafer or a portion of the plurality of corners; And one or more rectangular silicon solar cells that each does not have
The spacing between the plurality of parallel lines along which dicing of the pseudo-square wafer is performed does not have a width perpendicular to the long axis of the rectangular silicon solar cell including the chamfered corner, the chamfered corner One or more rectangular silicon solar cells are selected to compensate for the chamfered corners by making them wider than the long axis perpendicular to the long axis, thereby making the plurality of rectangular silicon solar cells in the solar cell string A method, each having a front surface where the areas exposed to light in operation of the solar cell string are substantially the same.

47A. A supercell,
And a plurality of silicon solar cells arranged side by side in a state in which the adjacent solar cells are electrically connected in series, with the ends of the adjacent solar cells overlapping and conductively joined to each other,
At least one of the plurality of silicon solar cells has a chamfered corner corresponding to a plurality of corners or a portion of a plurality of corners of the pseudo square silicon wafer from which dicing is performed, and At least one does not have beveled corners, and each of the plurality of silicon solar cells has substantially the same area exposed to light during operation of the solar cell string. Having a supercell.

48A. How to make two or more supercells,
The one or more pseudo square silicon wafers are diced along a plurality of lines parallel to the long edge of each pseudo square silicon wafer among one or more pseudo square silicon wafers, and the one or more pseudo square silicon wafers A first plurality of rectangular silicon solar cells including chamfered corners corresponding to a plurality of corners of the plurality of corners, or a plurality of first corners spread across the entire width of the one or more pseudo-square silicon wafers Forming a second plurality of rectangular silicon solar cells each having a length and having no chamfered corners;
The chamfered corner is removed from each of the first plurality of rectangular silicon solar cells, and each has a second length shorter than the first length and does not have a chamfered corner. Forming three or more rectangular silicon solar cells;
The second plurality of rectangular silicon solar cells are arranged side by side in a state in which long sides of adjacent rectangular silicon solar cells overlap and are conductively connected to each other, and the second plurality of rectangular silicon solar cells are electrically connected in series Forming a solar cell string having a width equal to the first length;
The third plurality of rectangular silicon solar cells are arranged side by side in a state in which long sides of adjacent rectangular silicon solar cells overlap and are conductively connected to each other, and the third plurality of rectangular silicon solar cells are electrically connected in series Forming a solar cell string having a width equal to said second length.

49A. How to make two or more supercells,
The one or more pseudo square silicon wafers are diced along a plurality of lines parallel to the long edge of each pseudo square silicon wafer among one or more pseudo square silicon wafers, and the one or more pseudo square silicon wafers A first plurality of rectangular silicon solar cells including chamfered corners corresponding to a plurality of corners of the plurality of corners or a plurality of corners, and a second plurality of rectangular silicon solar cells having no chamfered corners Forming the
The first plurality of rectangular silicon solar cells are arranged side by side in a state in which the long sides of adjacent rectangular silicon solar cells overlap and are conductively connected to each other, and the first plurality of rectangular silicon solar cells are electrically connected in series Process,
The second plurality of rectangular silicon solar cells are arranged side by side in a state in which long sides of adjacent rectangular silicon solar cells overlap and are conductively connected to each other, and the second plurality of rectangular silicon solar cells are electrically connected in series And a process.

50A. A series connected string of rectangular or nearly rectangular solar cells having a breakdown voltage higher than about 10 volts, N (N 25) on average, such that the rectangular or nearly rectangular solar cells are one or more supercells. The plurality of solar cells, which are grouped, and each of the one or more supercells are arranged side by side with the long sides of adjacent solar cells overlapping and conductively bonded to each other by an electrical and thermal conductive adhesive. Comprising a series connected string of rectangular or nearly rectangular solar cells, including two or more of the cells;
A solar module, wherein none of the single solar cells in the string of solar cells, or a group of less than N solar cells, are individually electrically connected in parallel with the bypass diodes.

  51A. The solar module according to Item 50A, wherein N is greater than or equal to 30.

  52A. The solar module according to Item 50A, wherein N is greater than or equal to 50.

  53A. The solar module according to Item 50A, wherein N is greater than or equal to 100.

  54A. The adhesive has a thickness in a direction perpendicular to the plurality of solar cells of less than or equal to about 0.1 mm, and a thermal conductivity of about 1.5 w / in a direction perpendicular to the plurality of solar cells. The solar module according to Item 50A, which forms a plurality of junctions between adjacent solar cells higher than or equal to m / k.

  55A. The solar module according to Item 50A, wherein the N solar cells are grouped into a single supercell.

  56A. The solar module according to Item 50A, wherein the plurality of solar cells are silicon solar cells.

57A. A solar module,
A supercell extending substantially the entire length or width of the solar module parallel to the edge of the solar module, wherein the supercell is formed by overlapping the long sides of adjacent solar cells to form an electrical and thermal conductive adhesive Comprising a series connected string of rectangular or nearly rectangular solar cells having N breakdown voltages higher than about 10 volts, arranged side by side in conductive junction with each other,
A solar module, wherein none of the single solar cells in the supercell, or a group of less than N solar cells, are individually electrically connected in parallel with the bypass diodes.

  58A. The solar module according to Item 57A, wherein N> 24.

  59A. 56. The solar module of paragraph 57A, wherein the length of the supercell in the direction of current flow is at least about 500 mm.

60A. A supercell,
Equipped with multiple silicon solar cells,
Each silicon solar cell is
An oblong or substantially oblong front and back face having a shape defined by oppositely positioned parallel first and second long sides and two oppositely located short sides Front and back surfaces, at least a portion of which are exposed to solar radiation during operation of the solar cell string;
An electrically conductive front metallization pattern disposed on the front and including at least one front contact pad positioned adjacent to the first long side;
An electrically conductive back surface metallization pattern disposed on the back surface and including at least one back surface contact pad positioned adjacent to the second long side;
In the plurality of silicon solar cells, the first long side and the second long side of the adjacent silicon solar cells overlap, and the contact pads on the front and rear faces on the adjacent silicon solar cells overlap and conduct Conductively bonded to each other by the adhesive adhesive, and the adjacent silicon solar cells are arranged side by side electrically connected in series,
The front metallized pattern of each silicon solar cell substantially transfers the conductive adhesive bond to the at least one front contact pad prior to curing of the conductive adhesive bond during fabrication of the supercell. A supercell that contains a barrier configured to contain it.

  61A. For each pair of adjacent and overlapping silicon solar cells, a portion of the other silicon solar cell of the silicon solar cell overlaps the barrier of the front of one of the silicon solar cells, the barrier being Partially concealing, thereby substantially confining the conductive adhesive in the overlapping area of the front surface of the silicon solar cell, prior to curing of the conductive adhesive during manufacture of the supercell , Supercell according to Item 60A.

  62A. The barrier includes a continuous conductive line extending substantially the entire length of the first long side in parallel with the first long side, the at least one front contact pad comprising the continuous conductive line, and The supercell according to Item 60A, which is located between the solar cell and the first long side.

  63A. The front side metallization pattern electrically connects to the at least one front contact pad and includes the fingers extending in a direction perpendicular to the first long side, and the continuous conductive line electrically interconnects the plurality of fingers. 82. The supercell of paragraph 62A, providing multiple conductive paths from each finger to at least one front contact pad.

  64A. The front side metallization pattern includes a plurality of discrete contact pads arranged in rows adjacent and parallel to the first long side, the barrier being for each of the discrete contact pads the superstructure Prior to curing of the conductive adhesive during cell fabrication, including a plurality of features forming a plurality of discrete barriers substantially encapsulating the conductive adhesive in the discontinuous contact pad; The supercell according to Item 60A.

  65A. The supercell according to clause 64A, wherein the plurality of discrete barriers abut against and are higher than their corresponding discrete contact pads.

66A. A supercell,
Equipped with multiple silicon solar cells,
Each silicon solar cell is
An oblong or substantially oblong front and back face having a shape defined by oppositely positioned parallel first and second long sides and two oppositely located short sides Front and back surfaces, at least a portion of which are exposed to solar radiation during operation of the solar cell string;
An electrically conductive front metallization pattern disposed on the front and including at least one front contact pad positioned adjacent to the first long side;
An electrically conductive back surface metallization pattern disposed on the back surface and including at least one back surface contact pad positioned adjacent to the second long side;
In the plurality of silicon solar cells, the first long side and the second long side of the adjacent silicon solar cells overlap, and the contact pads on the front and rear faces on the adjacent silicon solar cells overlap and conduct Conductively bonded to each other by the adhesive adhesive, and the adjacent silicon solar cells are arranged side by side electrically connected in series,
The backside metallized pattern of each silicon solar cell may substantially transfer the conductive adhesive bond to the at least one rear contact pad prior to curing of the conductive adhesive during manufacture of the supercell. A supercell that contains a barrier configured to contain it.

  67A. The back surface metallization pattern includes one or more discontinuous contact pads arranged in rows adjacent and parallel to the second long side, the barrier being for each discontinuous contact pad Prior to curing of the conductive adhesive during manufacture of the supercell, a plurality of features forming a plurality of discrete barriers substantially encapsulating the conductive adhesive in the discontinuous contact pad. The supercell according to Item 66A, including.

  68A. 70. The supercell according to clause 67A, wherein the plurality of discrete barriers abut against and are higher than their corresponding discrete contact pads.

69A. A method of making a solar cell string,
Dicing the one or more quasi-square silicon wafers along a plurality of lines parallel to the long edge of each quasi-square silicon wafer among one or more quasi-square silicon wafers to substantially the same along the major axis Forming a plurality of rectangular silicon solar cells each having a length;
Arranging the plurality of rectangular silicon solar cells side by side in a state in which the long sides of adjacent solar cells overlap and are conductively joined to each other, and the adjacent solar cells are electrically connected in series;
The plurality of rectangular silicon solar cells comprises at least one rectangular solar cell including two beveled corners corresponding to a plurality of corners of the pseudo-square wafer or a portion of the plurality of corners; And one or more rectangular silicon solar cells that each does not have
The spacing between the plurality of parallel lines along which dicing of the pseudo-square wafer is performed does not have a width perpendicular to the long axis of the rectangular silicon solar cell including the chamfered corner, the chamfered corner One or more rectangular silicon solar cells are selected to compensate for the chamfered corners by making them wider than the long axis perpendicular to the long axis, thereby making the plurality of rectangular silicon solar cells in the solar cell string A method, each having a front surface where the areas exposed to light in operation of the solar cell string are substantially the same.

70A. A solar cell string,
And a plurality of silicon solar cells arranged side by side in a state in which the adjacent solar cells are electrically connected in series, with the ends of the adjacent solar cells overlapping and conductively joined to each other,
At least one of the plurality of silicon solar cells has a chamfered corner corresponding to a plurality of corners or a portion of a plurality of corners of the pseudo square silicon wafer from which dicing is performed, and At least one does not have beveled corners, and each of the plurality of silicon solar cells has substantially the same area exposed to light during operation of the solar cell string. Have, solar cell string.

71A. How to make two or more solar cell strings,
The one or more pseudo square silicon wafers are diced along a plurality of lines parallel to the long edge of each pseudo square silicon wafer among one or more pseudo square silicon wafers, and the one or more pseudo square silicon wafers A first plurality of rectangular silicon solar cells including chamfered corners corresponding to a plurality of corners of the plurality of corners, or a plurality of first corners spread across the entire width of the one or more pseudo-square silicon wafers Forming a second plurality of rectangular silicon solar cells each having a length and having no chamfered corners;
The chamfered corner is removed from each of the first plurality of rectangular silicon solar cells, and each has a second length shorter than the first length and does not have a chamfered corner. Forming three or more rectangular silicon solar cells;
The second plurality of rectangular silicon solar cells are arranged side by side in a state in which long sides of adjacent rectangular silicon solar cells overlap and are conductively connected to each other, and the second plurality of rectangular silicon solar cells are electrically connected in series Forming a solar cell string having a width equal to the first length;
The third plurality of rectangular silicon solar cells are arranged side by side in a state in which long sides of adjacent rectangular silicon solar cells overlap and are conductively connected to each other, and the third plurality of rectangular silicon solar cells are electrically connected in series Forming a solar cell string having a width equal to said second length.

72A. How to make two or more solar cell strings,
The one or more pseudo square silicon wafers are diced along a plurality of lines parallel to the long edge of each pseudo square silicon wafer among one or more pseudo square silicon wafers, and the one or more pseudo square silicon wafers A first plurality of rectangular silicon solar cells including chamfered corners corresponding to a plurality of corners of the plurality of corners or a plurality of corners, and a second plurality of rectangular silicon solar cells having no chamfered corners Forming the
The first plurality of rectangular silicon solar cells are arranged side by side in a state in which the long sides of adjacent rectangular silicon solar cells overlap and are conductively connected to each other, and the first plurality of rectangular silicon solar cells are electrically connected in series Process,
The second plurality of rectangular silicon solar cells are arranged side by side in a state in which long sides of adjacent rectangular silicon solar cells overlap and are conductively connected to each other, and the second plurality of rectangular silicon solar cells are electrically connected in series And a process.

73A. How to make a solar module,
A chamfered corner corresponding to a plurality of corners of the plurality of pseudo square silicon wafers by dicing the wafer along a plurality of lines parallel to a long edge of each of the plurality of pseudo square silicon wafers. Forming a plurality of rectangular silicon solar cells including the plurality of rectangular silicon solar cells and a plurality of rectangular silicon solar cells without chamfered corners from the plurality of pseudo square silicon wafers;
At least some of the plurality of rectangular silicon solar cells without chamfered corners are arranged, and the long sides of the plurality of rectangular silicon solar cells overlap and are conductively bonded to each other to form the plurality of rectangular silicon solar cells Forming a first plurality of supercells, each comprising only rectangular silicon solar cells without chamfered corners, arranged side by side electrically connected in series;
At least some of the plurality of rectangular silicon solar cells including the chamfered corner are arranged, and the long sides of the plurality of rectangular silicon solar cells overlap and are conductively bonded to each other to serially connect the plurality of rectangular silicon solar cells Forming a second plurality of supercells each including only rectangular silicon solar cells without chamfered corners, arranged side by side in electrical connection;
A plurality of parallel supercell rows of substantially equal length, each row including only a plurality of supercells from the first plurality of supercells or only a plurality of supercells from the second plurality of supercells. Placing the plurality of supercells on the to form the front surface of the solar module.

  74A. Two of the plurality of supercell rows adjacent to parallel opposing edges of the solar module include only the plurality of supercells from the second plurality of supercells and all other plurality of supercells. 73. A solar module according to clause 73A, wherein a cell row comprises only supercells from the first plurality of supercells.

  75A. The solar module of paragraph 74A, wherein the solar module comprises a total of six supercell rows.

76A. A plurality of silicon solar cells arranged in the first direction in a state in which the ends of adjacent silicon solar cells overlap and conductively bond with each other to electrically connect the adjacent silicon solar cells in series;
Long and narrow flexible electrical interconnections,
A longitudinal axis of the elongated flexible electrical interconnect is oriented parallel to a second direction perpendicular to the first direction;
The elongated flexible electrical interconnect is
Conducting bonding to the front or back surface of the end silicon solar cell of the plurality of silicon solar cells at three or more discontinuous positions arranged along the second direction;
Extends at least the full width of the end solar cell in the second direction,
The conductor thickness measured in the direction perpendicular to the front or back of the silicon solar cell at the end is less than or equal to about 100 microns,
Provide a resistance less than or equal to about 0.012 ohms to the flow of current in the second direction,
Configured to provide flexibility to accommodate differential expansion in the second direction between the silicon solar cell at the end and the interconnect at a temperature range of about -40.degree. C. to about 85.degree. C. You are a supercell.

  77A. 76. The supercell according to clause 76A, wherein the flexible electrical interconnect has a conductor thickness measured in a direction perpendicular to the front and back surfaces of the end silicon solar cell is less than or equal to about 30 microns .

  78A. The flexible electrical interconnect extends beyond the supercell in the second direction and at least to the second supercell positioned parallel to and adjacent to the supercell in the solar module. 81. A supercell according to clause 76A which provides interconnection.

  79A. The flexible electrical interconnect extends beyond the supercell in the first direction to provide electrical interconnect to a second supercell positioned parallel to and alongside the supercell in the solar module The supercell according to clause 76A, which is provided.

80A. A solar module,
Arranged in two or more parallel rows extending across the width of the solar module to form the front surface of the solar module, the ends of adjacent silicon solar cells overlap and conductively bond to each other Comprising a plurality of supercells, each comprising a plurality of silicon solar cells arranged side by side in a state in which the mutually opposing silicon solar cells are electrically connected in series;
At least the end of the first supercell adjacent to the edge of the solar module in the first row is:
Bonded to the front of the first supercell by means of an electrically conductive adhesive in discrete locations,
Extends parallel to the edge of the solar module,
At least a part of which is broken around the end of the first supercell and is hidden from view from the front of the solar module,
Through flexible electrical interconnections,
Electrically connected to the end of the second supercell, adjacent to the same edge of the solar module in the second row,
Solar module.

  81A. 81. The solar module according to clause 80A, wherein a surface of the flexible electrical interconnect on the front surface of the solar module is covered or colored to reduce the visible contrast to the supercell.

82A. The two or more parallel rows of supercells are disposed on a white backing sheet to form a front surface of the solar module that is to be irradiated by solar radiation during operation of the solar module,
The white backing sheet includes a plurality of parallel dark stripes having positions and widths corresponding to positions and widths of gaps between two or more parallel rows of the supercell,
81. A solar module according to clause 80A, wherein a plurality of white portions of the plurality of backing sheets are not visible through the plurality of gaps between two or more parallel rows of the supercell.

83A. A method of making a solar cell string,
Laser scribing one or more scribe lines on each silicon solar cell of one or more silicon solar cells to define a plurality of rectangular regions on the one or more silicon solar cells;
Applying an electrically conductive adhesive to the scribed one or more silicon solar cells at one or more locations adjacent to the long side of each rectangular region;
A plurality of rectangles each including a portion of the electrically conductive adhesive, disposed on the front surface adjacent to the long side, with the one or more silicon solar cells separated along the one or more scribe lines Providing a silicon solar cell;
Arranging the plurality of rectangular silicon solar cells side by side in a state in which the long sides of adjacent rectangular silicon solar cells are partially overlapped with each other in a state in which a part of the electrically conductive adhesive is disposed therebetween;
Curing the electrically conductive bonding agent, thereby bonding adjacent and overlapping rectangular silicon solar cells together and electrically connecting them in series.

84A. A method of making a solar cell string,
Laser scribing one or more scribe lines on each silicon solar cell of the one or more silicon solar cells each having a top surface and a bottom surface positioned opposite to each other Defining a rectangular area of
Applying an electrically conductive adhesive to a portion of the top surface of the one or more silicon solar cells;
A vacuum is drawn between the bottom surface and the curved support surface of the one or more silicon solar cells to move the one or more silicon solar cells toward the curved support surface, thereby bending the one or more silicon solar cells. Cleavage of the one or more silicon solar cells along the scribe line to provide a plurality of rectangular silicon solar cells each including a portion of the electrically conductive adhesive bond disposed on the front surface adjacent to the long side The process to
Arranging the plurality of rectangular silicon solar cells side by side in a state in which the long sides of adjacent rectangular silicon solar cells are partially overlapped with each other in a state in which a part of the electrically conductive adhesive is disposed therebetween;
Curing the electrically conductive bonding agent, thereby bonding adjacent and overlapping rectangular silicon solar cells together and electrically connecting them in series.

  85A. Applying the electrically conductive adhesive to the one or more silicon solar cells, and then laser scribing the one or more scribe lines on each silicon solar cell of the one or more silicon solar cells 84. A method according to clause 84A, comprising:

  86A. A step of laser scribing the one or more scribe lines on each silicon solar cell of the one or more silicon solar cells, and thereafter applying the electrically conductive adhesive to the one or more silicon solar cells 84. A method according to clause 84A, comprising:

1B. A series connected string of at least 25 solar cells connected in parallel with a common bypass diode,
Each solar cell has a breakdown voltage higher than about 10 volts resulting in a supercell comprising the at least 25 solar cells arranged with the long sides of adjacent solar cells overlapping and conducting bonded by the adhesive. Devices that are grouped together.

  2B. The apparatus according to Item 1B, wherein N is greater than or equal to 30.

  3B. The apparatus according to Item 1B, wherein N is greater than or equal to 50.

  4B. The apparatus according to Item 1B, wherein N is greater than or equal to 100.

  5B. The device of paragraph 1 B, wherein the adhesive has a thickness less than about 0.1 mm, or equivalent, and a thermal conductivity greater than or equal to about 1.5 W / m / K.

  6B. The device of paragraph 1 B, wherein the N solar cells are grouped into a single supercell.

  7B. The device of paragraph 1 B, wherein the N solar cells are grouped into multiple supercells on the same backing.

  8B. The device according to paragraph 1B, wherein the at least 25 solar cells are silicon solar cells.

  9B. The device according to paragraph 1B, wherein the length of the supercell in the direction of current flow is at least about 500 mm.

  10B. The device according to paragraph 1B, wherein the at least twenty-five solar cells include features configured to contain the adhesive spread.

  11B. The apparatus according to clause 10B, wherein the features include raised features.

  12B. The apparatus according to clause 10B, wherein the feature comprises a metal coating.

13B. The metal coating includes a line extending along the entire length of the first long side,
The device of paragraph 12B, further comprising at least one contact pad located between the line and the first long side.

14B. The metallization further includes a plurality of fingers electrically connected to the at least one contact pad and extending in a direction perpendicular to the first long side,
14. The apparatus of paragraph 13B, wherein the conductive wire interconnects the plurality of fingers.

  15B. The apparatus according to claim 10B, wherein the feature is on the front side of the solar cell.

  16B. The device according to clause 10B, wherein the feature is behind the solar cell.

  17B. The apparatus according to clause 10B, wherein the features include recessed features.

  18B. The device according to clause 10B, wherein the features are hidden in the adjacent solar cells of the supercell.

  19B. The first solar cell of the supercell has a plurality of beveled corners, and the second solar cell of the supercell has no beveled corners, and the first solar cell and the second solar cell The device according to paragraph 1B, wherein the areas exposed to light are the same.

20B. Further comprising a flexible electrical interconnect where the major axis is parallel to a second direction perpendicular to said first direction,
The device according to paragraph 1 B, wherein the flexible electrical interconnect is conductively bonded to the surface of the solar cell and adapted for thermal expansion of the solar cell in two dimensions.

  21B. 21. The apparatus according to clause 20B, wherein the flexible electrical interconnect provides a resistance less than or equal to about 100 microns in thickness and less than or equal to about 0.012 ohms.

  22B. 21. The apparatus according to clause 20B, wherein the surface comprises a back surface.

  23B. 22. The apparatus of clause 20B, wherein the flexible electrical interconnect contacts another supercell.

  24B. 24. The apparatus according to clause 23B, wherein the other supercell is aligned with the supercell.

  25B. 24. The apparatus according to clause 23B, wherein the other supercell is adjacent to the supercell.

  26B. 22. The apparatus according to clause 20B, wherein the first portion of the interconnect folds around the edge of the supercell such that the remaining second interconnect portion is behind the supercell.

  27B. 22. The apparatus according to clause 20B, wherein the flexible electrical interconnect electrically connects to a bypass diode.

28B. A plurality of supercells are arranged in two or more parallel rows on the backing sheet to form the front of the solar module,
The apparatus of paragraph 1 B, wherein the backing sheet is white and includes dark stripes of location and width corresponding to the gaps between the plurality of supercells.

  29B. The apparatus of clause 1 B, wherein the supercell comprises at least one battery string pair connected to a power management system.

30B. Further comprising a power management device in electrical communication with the supercell,
The above power management device is
Receiving the voltage output of the supercell,
Based on the above voltage, it is determined whether the solar cell is reverse biased,
The device of clause 1 B, configured to disconnect the reverse biased solar cell from a supercell module circuit.

31B. The supercell is disposed on a first backing to form a first module having an upper conductive ribbon on a first side facing in the direction of solar energy;
The supercell further comprises another supercell disposed on a second backing to form a second module having a second side lower ribbon facing away from said direction of said solar energy,
The device of paragraph 1 B, wherein the second module overlaps and bonds to a portion of the first module that includes the upper ribbon.

  32B. 32. Apparatus according to clause 31 B, wherein the second module is joined to the first module by an adhesive.

  33B. 32. Apparatus according to clause 31B, wherein the second module is joined to the first module by a mating arrangement.

  34B. An apparatus according to clause 31B, further comprising a junction box wherein the second modules overlap.

  35B. 34. Apparatus according to clause 34B, wherein the second module joins the first module by a mating arrangement.

  36B. 34. The apparatus according to clause 35B, wherein the mating arrangement is between the junction box and another junction box on the second module.

  37B. 32. Apparatus according to clause 31B, wherein the first backing comprises glass.

  38B. 32. Apparatus according to clause 31B, wherein the first backing comprises other than glass.

  39B. The apparatus of paragraph 1 B, wherein the solar cell comprises a beveled portion cut from a larger part.

40B. The supercell further includes another solar cell having a chamfered portion,
The device of paragraph 39B wherein the long side of the solar cell is in electrical contact with the long side of the other solar cell of similar length.

1C1. Forming a supercell comprising a series connected string of at least N (≧ 25) solar cells on the same backing, wherein each solar cell has a breakdown voltage higher than about 10 volts and is adjacent to one another A process in which the long sides of the solar cell are arranged in an overlapping and conductively bonded state by an adhesive
Connecting each supercell with at most a single bypass diode.

  2C1. The method according to Item 1C1, wherein N is greater than or equal to 30.

  3C1. The method according to Item 1C1, wherein N is greater than or equal to 50.

  4C1. The method according to Item 1C1, wherein N is greater than or equal to 100.

  5C1. The method according to paragraph 1C1, wherein the adhesive has a thickness of less than about 0.1 mm, or equivalent, and a thermal conductivity of greater than or equal to about 1.5 w / m / k.

  6C1. The method according to Item 1C1, wherein the plurality of solar cells are silicon solar cells.

  7C1. The method of paragraph 1C1, wherein the length of the supercell in the direction of current flow is at least about 500 mm.

  8C1. The first solar cell of the supercell has a plurality of beveled corners, and the second solar cell of the supercell has no beveled corners, and the first solar cell and the second solar cell The method according to item 1C1, wherein the area exposed to light is the same.

  9C1. The method according to paragraph 1C1, further comprising: using the features of the solar cell surface to contain the spread of the adhesive.

  10C1. A method according to paragraph 9C1, wherein the features include raised features.

  11C1. A method according to paragraph 9C1, wherein the feature comprises a metal coating.

12C1. The metal coating includes a line extending along the entire length of the first long side,
The method of paragraph 11C1, wherein at least one contact pad is located between the line and the first long side.

13C1. The metallization further includes a plurality of fingers electrically connected to the at least one contact pad and extending in a direction perpendicular to the first long side,
The method according to Item 12C1, wherein the conductive wire interconnects the plurality of fingers.

  14C1. The method according to Item 9C1, wherein the feature is on the front side of the solar cell.

  15C1. The method according to Item 9C1, wherein the feature is behind the solar cell.

  16C1. The method according to Item 9C1, wherein the features include recessed features.

  17C1. The method according to paragraph 9C1, wherein the features are hidden in the adjacent solar cells of the supercell.

  18C1. The method of paragraph 1C1 further comprising forming another supercell on the same backing.

19C1. Conductively bonding to the surface of the solar cell a flexible electrical interconnect whose major axis is parallel to a second direction perpendicular to said first direction;
B. The method of clause 1C1, further comprising: adapting the flexible electrical interconnect to thermal expansion of the solar cell in two dimensions.

  20C1. The method according to paragraph 19C1, wherein the flexible electrical interconnect provides a resistance less than or equal to about 100 microns in thickness and less than or equal to about 0.012 ohms.

  21C1. The method according to Item 19C1, wherein the surface comprises a back surface.

  22C1. A method according to paragraph 19C1, further comprising the step of contacting another supercell with the flexible electrical interconnect.

  23C1. The method of paragraph 22C1, wherein the other supercell is aligned with the supercell.

  24C1. The method according to Item 22C1, wherein the other supercell is adjacent to the supercell.

  25C1. The method according to paragraph 19C1, further comprising the step of: folding the first portion of the interconnect around the edge of the supercell such that the remaining second interconnect portion is behind the supercell.

  26C1. The method of paragraph 19C1 further comprising the step of electrically connecting the flexible electrical interconnect to a bypass diode.

27C1. Placing a plurality of supercells in two or more parallel rows on the same backing to form the front of the solar module;
A method according to paragraph 1C1, wherein the backing sheet is white and comprises dark stripes of location and width corresponding to the gaps between the plurality of supercells.

  28C1. The method of paragraph 1C1, further comprising: connecting at least one battery string pair to a power management system.

29C1. Electrically connecting a power management device to the supercell;
Causing the power management device to receive a voltage output of the supercell;
Allowing the power management device to determine whether the solar cell is reverse-biased based on the voltage;
The method of clause 1C1, further comprising: disconnecting the reverse-biased solar cell from the supercell module circuit to the power management device.

30C1. The supercell is disposed on the backing to form a first module having an upper conductive ribbon on a first side facing in the direction of solar energy;
Placing another supercell on another backing to form a second module having a lower ribbon on a second side facing away from said direction of said solar energy;
The method of paragraph 1C1, wherein the second module overlaps and bonds to a portion of the first module that includes the upper ribbon.

  31C1. The method according to Item 30C1, wherein the second module is bonded to the first module by an adhesive.

  32C1. 31. The method according to clause 30C1, wherein the second module is joined to the first module by a mating arrangement.

  33C1. A method according to clause 30C1, further comprising the step of stacking a junction box with the second module.

  34C1. 33. The method according to paragraph 33C1, wherein the second module is joined to the first module by a mating arrangement.

  35C1. 34. The method according to clause 34C1, wherein the mating arrangement is between the connection box and another connection box on the second module.

  36C1. The method according to Item 30C1, wherein the backing comprises glass.

  37C1. The method according to Item 30C1, wherein the backing comprises other than glass.

38C1. Electrically connecting in series relay switches between the first module and the second module;
Sensing an output voltage of the first module by a controller;
The method according to Item 30C1, further comprising: activating the relay switch by the controller when the output voltage falls below a limit.

  39C1. The method according to paragraph 1C1, wherein the solar cell comprises a beveled portion cut from a larger part.

  40C1. The method according to Item 39C1, wherein the step of forming the supercell includes the step of electrically contacting the long side of the solar cell with the long side of a similar length of another solar cell having a chamfered portion.

1C2. A solar comprising a front surface comprising a first series connected string of at least 19 solar cells grouped to be a first supercell arranged with the long sides of adjacent solar cells overlapping and in conductive junction with an adhesive Modules,
A ribbon conductor electrically connected to the back contact of the first supercell to provide a hidden tap to an electrical component.

  2C2. The device of paragraph 1C2, wherein the electrical component comprises a bypass diode.

  3C2. The apparatus according to Item 2C2, wherein the bypass diode is located on the back surface of the solar module.

  4C2. The apparatus according to Item 3C2, wherein the bypass diode is located outside the junction box.

  5C2. The device of paragraph 4C2 wherein the junction box includes a single terminal.

  6C2. The device of paragraph 3C2 wherein the bypass diode is positioned near an edge of the solar module.

  7C2. The device of paragraph 2C2 wherein the bypass diode is positioned within the stacked structure.

  8C2. The device of paragraph 7C2 wherein the first supercell is enclosed within the layered structure.

  9C2. The apparatus according to clause 2C2, wherein the bypass diode is positioned around the solar module.

  10C2. The electrical component described in Item 1C2 includes module terminals, junction box, power management system, smart switch, relay, voltage sensing controller, central inverter, DC / AC microinverter, or DC / DC module power optimizer Device.

  11C2. The device of paragraph 1C1, wherein the electrical component is located on the back of the solar module.

  12C2. The solar module further comprises a second series connected string of at least 19 solar cells grouped together such that the first end is a second supercell electrically connecting the first supercell in series. Device described.

  13C2. The apparatus according to Item 12C2, wherein the second supercell overlaps the first supercell and is electrically connected in series with the first supercell by a conductive adhesive.

  14C2. The apparatus according to Item 12C2, wherein the back contact portion is located away from the first end.

  15C2. The device of paragraph 12C2 further comprising a flexible interconnect between the first end and the first supercell.

  16C2. The flexible interconnect extends beyond the side edges of the first and second supercells and electrically connects the first and second supercells in parallel with other supercells. The apparatus according to Item 15C2.

  17C2. The device of paragraph 1C2, wherein the adhesive has a thickness less than about 0.1 mm, or equal, and a thermal conductivity greater than or equal to about 1.5 w / m / k.

  18C2. The device of paragraph 1C2, wherein the plurality of solar cells are silicon solar cells having a breakdown voltage greater than about 10V.

  19C2. The device of paragraph 1C2, wherein the length of the first supercell in the direction of current flow is at least about 500 mm.

  20C2. The device of paragraph 1C2, wherein the solar cells of the first supercell include features configured to contain the spread of the adhesive.

  21C2. An apparatus according to clause 20C2, wherein the features include raised features.

  22C2. An apparatus according to clause 21C2, wherein the feature comprises a metal coating.

23C2. The metal coating includes a conductive wire extending over the entire length of the first long side,
The device of paragraph 22C2, further comprising at least one contact pad located between the conductive wire and the first long side.

24C2. The metallization further includes a plurality of fingers electrically connected to the at least one contact pad and extending in a direction perpendicular to the first long side,
The apparatus according to clause 23C2, wherein the conductive wire interconnects the plurality of fingers.

  25C2. The apparatus according to Item 20C2, wherein the feature is on the front side of the solar cell.

  26C2. The apparatus according to clause 20C2, wherein the feature is behind the solar cell.

  27C2. The apparatus according to clause 20C2, wherein the features include recessed features.

  28C2. 22. The apparatus according to clause 20C2, wherein the feature is hidden in an adjacent solar cell of the first supercell.

  29C2. The device of paragraph 1C2 wherein the solar cells of the first supercell comprise beveled portions.

30C2. The first supercell further includes another solar cell having a chamfered portion,
The apparatus according to Item 29C2, wherein a long side of the solar cell is in electrical contact with a long side of the other solar cell of similar length.

31C2. The first supercell further includes another solar cell having no chamfered corner,
The apparatus according to Item 29C2, wherein the solar cell and the other solar cell have the same area exposed to light.

32C2. The first supercell, along with the second supercell, are arranged in a plurality of parallel rows in front of the backing sheet,
The apparatus according to clause 1C2, wherein the backing sheet is white and includes dark stripes of a location and width corresponding to the gap between the first supercell and the second supercell.

  33C2. The device of paragraph 1C2, wherein the first supercell comprises at least one battery string pair connected to a power management system.

34C2. A power management device in electrical communication with the first supercell;
The above power management device is
Receiving the voltage output of the first supercell,
Based on the voltage, it is determined whether the solar cell of the first supercell is reverse biased,
The device of clause 1C2, configured to disconnect the reverse biased solar cell from a supercell module circuit.

  35C2. The device of paragraph 34C2, wherein the power management device comprises a relay.

36C2. The first supercell is disposed on a first backing to form the module with an upper conductive ribbon on a first side facing in the direction of solar energy;
It further comprises another supercell disposed on a second backing to form a different module having a second side lower ribbon facing away from said direction of said solar energy,
The device of paragraph 1C2, wherein the different modules overlap and bond to a portion of the module that includes the upper ribbon.

  37C2. The apparatus according to Item 36C2, wherein the different modules are joined to the modules by an adhesive.

  38C2. The apparatus according to clause 36C2, wherein the different modules are joined to the modules by a mating arrangement.

  39C2. The device of clause 36C2, further comprising a junction box wherein the different modules overlap.

  40C2. An apparatus according to clause 39C2, wherein the different modules are joined to the modules by a mating arrangement between the junction box and another junction box on a different solar module.

1C3. A first supercell having a plurality of solar cells disposed on the front of the solar module and each having a breakdown voltage higher than about 10 V;
A first ribbon conductor in electrical communication with the back contact of the first supercell to provide a first hidden tap to the electrical component;
A second supercell disposed on the front of the solar module and having a plurality of solar cells each having a breakdown voltage higher than about 10 V;
A second ribbon conductor in electrical communication with the back contact of the second supercell to provide a second hidden tap.

  2C3. The device of paragraph 1C3, wherein the electrical component comprises a bypass diode.

  3C3. The apparatus according to Item 2C3, wherein the bypass diode is located on the back of the solar module.

  4C3. The apparatus according to Item 3C3, wherein the bypass diode is located outside the junction box.

  5C3. The device of paragraph 4C3 wherein the junction box includes a single terminal.

  6C3. The device of paragraph 3C3 wherein the bypass diode is positioned near an edge of the solar module.

  7C3. The device of paragraph 2C3 wherein the bypass diode is positioned in a stacked structure.

  8C3. The device of paragraph 7C3, wherein the first supercell is enclosed within the layered structure.

  9C3. The device according to paragraph 8C3, wherein the bypass diode is positioned around the solar module.

  10C3. The device of paragraph 1C3, wherein the first supercell is connected in series with the second supercell.

11C3. The first supercell and the second supercell form a first pair,
The apparatus of clause 10C3, further comprising two additional supercells included in a second pair connected in parallel with the first pair.

  12C3. The device of paragraph 10C3 wherein the second hidden tap connects to the electrical component.

  13C3. The device of paragraph 12C3, wherein the electrical component comprises a bypass diode.

  14C3. The device of paragraph 13C3, wherein the first supercell comprises nineteen or more solar cells.

  15C3. The device of paragraph 12C3, wherein the electrical component comprises a power management system.

  16C3. The device of paragraph 1C3, wherein the electrical component comprises a switch.

  17C3. The device of paragraph 16C3, further comprising a voltage sensing controller in communication with the switch.

  18C3. The apparatus according to clause 16C3, wherein the switch is in communication with a central inverter.

19C3. The electrical component further includes a power management device,
The above power management device is
Receiving the voltage output of the first supercell,
Based on the voltage, it is determined whether the solar cell of the first supercell is reverse biased,
The device of paragraph 1C3, configured to disconnect the reverse biased solar cell from a supercell module circuit.

  20C3. The device according to claim 1, wherein the electrical component comprises an inverter.

  21C3. The device according to clause 20C3, wherein the inverter comprises a DC / AC micro-inverter.

  22C3. The device of paragraph 1C3, wherein the electrical component comprises a solar module terminal.

  23C3. The device according to clause 22C3, wherein the solar module terminal is a single solar module terminal in a junction box.

  24C3. The apparatus according to Item 1C3, wherein the electrical component is located on the back of the solar module.

  25C3. The device according to clause 1C3, wherein the back contact portion is located away from an end of the first supercell overlapping the second supercell.

  26C3. The device of paragraph 1C3, wherein the length of the first supercell in the direction of current flow is at least about 500 mm.

  27C3. The device of paragraph 1C3, wherein the solar cells of the first supercell include features configured to contain the spread of the adhesive.

  28C3. An apparatus according to clause 27C3, wherein the features include raised features.

  29C3. 28. Apparatus according to clause 28C3, wherein the feature comprises a metal coating.

  30C3. An apparatus according to clause 27C3, wherein the features include recessed features.

  31C3. The apparatus according to clause 27C3, wherein the feature is behind the solar cell.

  32C3. 27. The apparatus according to clause 27C3, wherein the feature is hidden in an adjacent solar cell of the first supercell.

  33C3. The device of paragraph 1C3 wherein the solar cells of the first supercell comprise beveled portions.

34C3. The first supercell further includes another solar cell having a chamfered portion,
The device according to clause 33C3, wherein a long side of the solar cell is in electrical contact with a long side of the other solar cell of similar length.

35C3. The first supercell further includes another solar cell having no chamfered corner,
The device according to Item 33C3, wherein the solar cell and the other solar cell have the same area exposed to light.

36C3. The first supercell, along with the second supercell, are arranged in a plurality of parallel rows in front of the backing sheet,
The apparatus of clause 1C3, wherein the backing sheet is white and includes dark stripes of a location and width corresponding to the gap between the first supercell and the second supercell.

37C3. The first supercell is disposed on a first backing to form the module with an upper conductive ribbon on the front of the module facing in the direction of solar energy,
And a third supercell disposed on a second backing to form a different module having a second side lower ribbon facing away from said direction of said solar energy,
The device of paragraph 1C3, wherein the different modules overlap and bond to a portion of the module that includes the upper ribbon.

  38C3. The device according to paragraph 37C3, wherein the different modules are joined to the modules by an adhesive.

  39C3. The device of paragraph 37C3, further comprising a junction box wherein the different modules overlap.

  40C3. The device according to clause 39C3, wherein the different modules are joined to the modules by a mating arrangement between the junction box and another junction box on the different modules.

1C4. A solar module including a front surface including a first series connected solar cell string grouped to be a first supercell arranged with adjacent solar cell sides overlapping and in conductive contact with an adhesive;
A solar cell surface feature configured to contain the adhesive.

  2C4. The device of paragraph 1C4, wherein the solar cell surface features include recessed features.

  3C4. The device of paragraph 1C4, wherein the solar cell surface features include raised features.

  4C4. The device of paragraph 3C4 wherein the raised feature is on the front of the solar cell.

  5C4. The device of paragraph 4C4, wherein the raised features include a metallized pattern.

  6C4. The device according to clause 5C4, wherein the metallization pattern comprises conductive lines extending parallel to the long side of the solar cell and substantially along the long side.

  7C4. The device of paragraph 6C4, further comprising a contact pad between the conductive wire and the long side.

8C4. The metallization pattern further comprises a plurality of fingers,
The device of clause 7C4, wherein the conductive wire electrically interconnects the plurality of fingers to provide a plurality of conductive paths from each finger to the contact pad.

9C4. The semiconductor device further comprises a plurality of discontinuous contact pads arranged in parallel rows adjacent to the long side,
The device of clause 7C4, wherein the metallization pattern forms a plurality of discrete barriers to encapsulate the adhesive in the plurality of discrete contact pads.

  10C4. The apparatus of clause 8C4, wherein the plurality of discrete barriers abut against a plurality of corresponding discrete contact pads.

  11C4. The device of paragraph 8C4, wherein the plurality of discrete barriers are higher than a plurality of corresponding discontinuous contact pads.

  12C4. The device according to clause 1C4, wherein the solar cell surface features are hidden on overlapping sides of other solar cells.

  13C4. The device according to clause 12C4, wherein the other solar cell is part of the supercell.

  14C4. The device according to clause 12C4, wherein the other solar cell is part of another supercell.

  15C4. The device of paragraph 3C4 wherein the raised feature is on the back side of the solar cell.

  16C4. The device of paragraph 15C4, wherein the raised features include a metallized pattern.

  17C4. The apparatus according to clause 16C4, wherein the metallization pattern forms a plurality of discrete barriers to enclose the adhesive in a plurality of discontinuous contact pads located on the front of another solar cell on which the solar cells overlap. .

  18C4. The device of paragraph 17C4, wherein the plurality of discrete barriers abut against a plurality of corresponding discrete contact pads.

  19C4. The device of paragraph 17C4, wherein the plurality of discrete barriers are higher than a plurality of corresponding discontinuous contact pads.

  20C4. The device of paragraph 1C1, wherein each solar cell of the supercell has a breakdown voltage of 10 V or higher.

  21C4. The device of paragraph 1C1, wherein the length of the supercell in the direction of current flow is at least about 500 mm.

  22C4. The device of paragraph 1C1, wherein the solar cell of the first supercell comprises a beveled portion.

23C4. The supercell further includes another solar cell having a chamfered portion,
The device according to clause 22C4, wherein a long side of the solar cell is in electrical contact with a long side of the other solar cell of similar length.

24C4. The supercell further includes other solar cells without chamfered corners,
The device according to Item 22C4, wherein the solar cell and the other solar cell have the same area exposed to light.

  25C4. The apparatus according to clause 1C4, wherein the supercell is disposed on the front side of the first backing sheet with the second supercell to form a first module.

  26C4. The device according to clause 25C4, wherein the backing sheet is white and comprises a plurality of dark stripes of position and width corresponding to the gap between the supercell and the second supercell.

27C4. The first module has an upper conductive ribbon on the front of the first module facing in the direction of the solar energy,
And a third supercell disposed on the second backing to form a second module having a lower ribbon on the side of the second module facing away from the solar energy,
The device according to clause 25C4, wherein the second module overlaps and bonds to a portion of the first module that includes the upper ribbon.

  28C4. The apparatus according to Item 27C4, wherein the second module is joined to the first module by an adhesive.

  29C4. The device of paragraph 27C4, further comprising a junction box wherein the second modules overlap.

  30C4. 30. The apparatus according to clause 29C4, wherein the second module joins the first module by the mating arrangement between the connection box and another connection box on the second module.

  31C4. The apparatus of clause 29C4, wherein the junction box contains a single module terminal.

  32C4. The device of paragraph 27C4, further comprising a switch between the first module and the second module.

  33C4. The device of clause 32C4, further comprising a voltage sensing controller in communication with the switch.

  34C4. 27. The apparatus according to clause 27C4, wherein the supercell comprises nineteen or more solar cells individually electrically connected in parallel with a single bypass diode.

  35C4. The device of paragraph 34C4, wherein the single bypass diode is positioned near an edge of the first module.

  36C4. The device of paragraph 34C4, wherein the single bypass diode is positioned in a stacked structure.

  37C4. The device according to clause 36C4, wherein the supercell is enclosed within the layered structure.

  38C4. The device according to paragraph 34C4, wherein the single bypass diode is positioned around the first module.

  39C4. The apparatus according to Item 25C4, wherein the supercell and the second supercell constitute a pair individually connected to a power management device.

40C4. Further comprising a power management device,
The above power management device is
Receiving the voltage output of the supercell,
Based on the voltage, it is determined whether the solar cell of the supercell is reverse biased,
The device of clause 25C4 configured to disconnect the reverse biased solar cell from a supercell module circuit.

1C5. A solar module including a front surface including a first series connected string of silicon solar cells grouped together to be a first supercell,
The first supercell comprises a first silicon solar cell having a plurality of beveled corners and arranged with the sides overlapping the second silicon solar cell and conducting bonded by an adhesive.

2C5. The second silicon solar cell does not have beveled corners,
The device according to clause 1C5, wherein the silicon solar cells of the first supercell are substantially the same in area of the front surface exposed to light.

3C5. The first silicon solar cell and the second silicon solar cell have the same length,
The apparatus according to Item 2C5, wherein the width of the first silicon solar cell is larger than the width of the second silicon solar cell.

  4C5. An apparatus according to clause 3C5, wherein the length reproduces the shape of a pseudo-square wafer.

  5C5. The apparatus according to Item 3C5, wherein the length is 156 mm.

  6C5. The apparatus according to Item 3C5, wherein the length is 125 mm.

  7C5. The device of paragraph 3C5, wherein an aspect ratio between the width and the length of the first solar cell is between about 1: 2 to about 1:20.

  8C5. The device according to clause 3C5, wherein the first silicon solar cell overlaps the second silicon solar cell by about 1 mm to about 5 mm.

  9C5. The device of paragraph 3C5, wherein the first supercell comprises at least nineteen silicon solar cells, each having a breakdown voltage greater than about 10 volts.

  10C5. The device of paragraph 3C5, wherein the length of the first supercell in the direction of current flow is at least about 500 mm.

11C5. The first supercell is connected in parallel with the second supercell on the front side,
The device according to clause 3C5, wherein the front surface comprises a white backing having a plurality of dark stripes of location and width corresponding to the gap between the first supercell and the second supercell.

  12C5. The device according to clause 1C5, wherein the second silicon solar cell comprises beveled corners.

  13C5. The device according to Item 12C5, wherein a long side of the first silicon solar cell overlaps a long side of the second silicon solar cell.

  14C5. The device according to Item 12C5, wherein a long side of the first silicon solar cell overlaps a short side of the second silicon solar cell.

15C5. The front is
A first row comprising the first supercell comprising a plurality of solar cells comprising a plurality of beveled corners;
A second row comprising a second series connected string of silicon solar cells grouped in parallel to the first supercell and grouped into a second supercell consisting of a plurality of solar cells without chamfered corners Including and
The device of paragraph 1C5, wherein the length of the second row is substantially the same as the length of the first row.

  16C5. The device according to clause 15C5, wherein the first row is adjacent to a module edge and the second row is not adjacent to the module edge.

17C5. The first supercell comprises at least nineteen solar cells, each having a breakdown voltage greater than about 10 volts,
The device of paragraph 15C5, wherein the length of the first supercell in the direction of current flow is at least about 500 mm.

  18C5. The device according to clause 15C5, wherein the front surface comprises a white backing having a plurality of dark stripes of location and width corresponding to the gap between the first supercell and the second supercell.

  19C5. The device of paragraph 1C5, further comprising a metallization pattern on the front side of the second solar cell.

  20C5. An apparatus according to clause 19C5, wherein the metallization pattern comprises a tapered portion extending around a beveled corner.

  21C5. The device of paragraph 19C5, wherein the metallization pattern comprises raised features that contain the spread of the adhesive.

22C5. The above metal coating pattern is
With multiple discrete contact pads,
A plurality of fingers electrically connected to the plurality of discrete contact pads;
The device of paragraph 19C5, comprising: conductive wires interconnecting the plurality of fingers.

  23C5. The device of paragraph 22C5, wherein the metallization pattern forms a plurality of discrete barriers to enclose the adhesive in the plurality of discrete contact pads.

  24C5. The device according to clause 23C5, wherein the plurality of discrete barriers abut a plurality of corresponding discontinuous contact pads and are higher than the plurality of corresponding discontinuous contact pads.

  25C5. The device according to clause 1C5, further comprising a flexible electrical interconnect that is conductively bonded to the surface of the first solar cell and adapted for thermal expansion of the first solar cell in two dimensions.

  26C5. 26. The apparatus according to clause 25C5, wherein a first portion of the interconnect folds around an edge of the first supercell such that the remaining second interconnect portion is behind the first supercell.

27C5. The module has an upper conductive ribbon on the front face facing in the direction of the solar energy;
Another module having a second supercell disposed on the front, the lower ribbon on the other module further comprising the other module facing away from the solar energy,
The device according to clause 1C5, wherein the second module overlaps and bonds to a portion of the first module that includes the upper ribbon.

  28C5. The apparatus according to Item 27C5, wherein the other module is joined to the module by an adhesive.

  29C5. The apparatus according to Item 27C5, further comprising a junction box in which the other modules overlap.

  30C5. The apparatus according to Item 29C5, wherein the other module is joined to the module by a mating arrangement between the connection box and another connection box on the other module.

  31C5. An apparatus according to clause 29C5, wherein the junction box contains a single module terminal.

  32C5. The device of clause 27C5, further comprising a switch between the module and the other module.

  33C5. The device of clause 32C5, further comprising a voltage sensing controller in communication with the switch.

  34C5. The device of clause 27C5, wherein the first supercell comprises nineteen or more solar cells in electrical communication with a single bypass diode.

  35C5. The device according to clause 34C5, wherein the single bypass diode is positioned near an edge of the first module.

  36C5. The device of paragraph 34C5, wherein the single bypass diode is positioned in a stacked structure.

  37C5. 273. The apparatus according to clause 36C5, wherein the supercell is enclosed within the layered structure.

  38C5. The device of paragraph 34C5, wherein the single bypass diode is positioned around the first module.

  39C5. The apparatus according to Item 27C5, wherein the first supercell and the second supercell constitute a pair connected to a power management device.

40C5. Further comprising a power management device,
The above power management device is
Receiving the voltage output of the first supercell,
Based on the voltage, it is determined whether the solar cell of the first supercell is reverse biased,
The apparatus of clause 27C5, configured to disconnect the reverse biased solar cell from a supercell module circuit.

1C6. A solar module including a front surface including a first series connected string of silicon solar cells grouped to be a first supercell,
The first supercell comprises a first silicon solar cell having a plurality of beveled corners and arranged with the sides overlapping the second silicon solar cell and conducting bonded by an adhesive.

2C6. The second silicon solar cell does not have beveled corners,
The device according to clause 1C6, wherein the silicon solar cells of the first supercell are substantially the same in area of the front surface exposed to light.

3C6. The first silicon solar cell and the second silicon solar cell have the same length,
The apparatus according to Item 2C6, wherein the width of the first silicon solar cell is larger than the width of the second silicon solar cell.

  4C6. An apparatus according to clause 3C6, wherein the length reproduces the shape of a pseudo-square wafer.

  5C6. The apparatus according to Item 3C6, wherein the length is 156 mm.

  6C6. The apparatus according to Item 3C6, wherein the length is 125 mm.

  7C6. The device according to clause 3C6, wherein an aspect ratio between the width and the length of the first solar cell is between about 1: 2 and about 1:20.

  8C6. The device according to clause 3C6, wherein the first silicon solar cell overlaps the second silicon solar cell by about 1 mm to about 5 mm.

  9C6. The device of clause 3C6, wherein the first supercell comprises at least nineteen silicon solar cells, each having a breakdown voltage greater than about 10 volts.

  10C6. The device of clause 3C6 wherein the length of the first supercell in the direction of current flow is at least about 500 mm.

11C6. The first supercell is connected in parallel with the second supercell on the front side,
The device according to clause 3C6, wherein the front surface comprises a white backing having a plurality of dark stripes of location and width corresponding to the gap between the first supercell and the second supercell.

  12C6. The device according to clause 1C6, wherein the second silicon solar cell comprises beveled corners.

  13C6. The device according to Item 12C6, wherein a long side of the first silicon solar cell overlaps a long side of the second silicon solar cell.

  14C6. The device according to Item 12C6, wherein a long side of the first silicon solar cell overlaps a short side of the second silicon solar cell.

15C6. The front is
A first row comprising the first supercell comprising a plurality of solar cells comprising a plurality of beveled corners;
A second row comprising a second series connected string of silicon solar cells grouped in parallel to the first supercell and grouped into a second supercell consisting of a plurality of solar cells without chamfered corners Including and
The device of clause 1C6, wherein a length of the second row is substantially the same as a length of the first row.

  16C6. The apparatus according to clause 15C6, wherein the first row is adjacent to a module edge and the second row is not adjacent to the module edge.

17C6. The first supercell comprises at least nineteen solar cells, each having a breakdown voltage greater than about 10 volts,
The device of paragraph 15C6, wherein the length of the first supercell in the direction of current flow is at least about 500 mm.

  18C6. The device according to clause 15C6, wherein the front surface comprises a white backing having a plurality of dark stripes of location and width corresponding to the gap between the first supercell and the second supercell.

  19C6. The device of paragraph 1C6, further comprising a metallization pattern on the front side of the second solar cell.

  20C6. The apparatus of paragraph 19C6, wherein the metallization pattern comprises a tapered portion extending around a beveled corner.

  21C6. The apparatus of paragraph 19C6, wherein the metallization pattern comprises raised features that contain the spread of the adhesive.

22C6. The above metal coating pattern is
With multiple discrete contact pads,
A plurality of fingers electrically connected to the plurality of discrete contact pads;
The device of paragraph 19C6, comprising: conductive wires interconnecting the plurality of fingers.

  23C6. The device of paragraph 22C6, wherein the metallization pattern forms a plurality of discrete barriers to enclose the adhesive in the plurality of discrete contact pads.

  24C6. The device according to clause 23C6, wherein the plurality of discrete barriers abut a plurality of corresponding discontinuous contact pads and are higher than the plurality of corresponding discontinuous contact pads.

  25C6. The device of clause 1C6, further comprising a flexible electrical interconnect that is conductively bonded to the surface of the first solar cell and adapted for thermal expansion of the first solar cell in two dimensions.

  26C6. The device of clause 25C6, wherein the first portion of the interconnect folds around the edge of the first supercell such that the remaining second interconnect portion is on the back side of the first supercell.

27C6. The module has an upper conductive ribbon on the front face facing in the direction of the solar energy;
Another module having a second supercell disposed on the front, the lower ribbon on the other module further comprising the other module facing away from the solar energy,
The apparatus according to clause 1C6, wherein the second module overlaps and bonds to a portion of the first module that includes the upper ribbon.

  28C6. The device according to Item 27C6, wherein the other module is bonded to the module by an adhesive.

  29C6. The device of clause 27C6, further comprising a junction box wherein the other modules overlap.

  30C6. The apparatus according to Item 29C6, wherein the other module is joined to the module by a mating arrangement between the connection box and another connection box on the other module.

  31C6. An apparatus according to clause 29C6, wherein the junction box contains a single module terminal.

  32C6. The device of clause 27C6, further comprising a switch between the module and the other module.

  33C6. The device of clause 32C6, further comprising a voltage sensing controller in communication with the switch.

  34C6. 27. The apparatus of clause 27C6, wherein the first supercell comprises nineteen or more solar cells in electrical communication with a single bypass diode.

  35C6. The apparatus according to clause 34C6, wherein the single bypass diode is positioned near an edge of the first module.

  36C6. The device of paragraph 34C6, wherein the single bypass diode is positioned in a stacked structure.

  37C6. 27. The apparatus according to clause 36C6, wherein the supercell is enclosed within the layered structure.

  38C6. The apparatus according to clause 34C6, wherein the single bypass diode is positioned around the first module.

  39C6. The apparatus according to Item 27C6, wherein the first supercell and the second supercell constitute a pair connected to a power management device.

40C6. Further comprising a power management device,
The above power management device is
Receiving the voltage output of the first supercell,
Based on the voltage, it is determined whether the solar cell of the first supercell is reverse biased,
27. The apparatus of clause 27C6, configured to disconnect the reverse biased solar cell from a supercell module circuit.

1C7. A solar module having a front surface comprising a first series connected string of at least nineteen solar cells, wherein each of the at least nineteen solar cells has a breakdown voltage greater than about 10 V, and an end is a second silicon solar A solar module, grouped into a supercell comprising a first silicon solar cell arranged in a battery-overlap and conductively bonded state,
An interconnect for conductively bonding to the solar cell surface.

  2C7. The device of paragraph 1C7, wherein the solar cell surface comprises the back surface of the first silicon solar cell.

  3C7. The apparatus of clause 2C7, further comprising a ribbon conductor electrically connecting the supercell to an electrical component.

  4C7. The device according to clause 3C7, wherein the ribbon conductor conductively bonds to the solar cell surface in a direction away from the overlapping edge.

  5C7. The apparatus according to Item 4C7, wherein the electrical component is on the back of a solar module.

  6C7. The apparatus according to clause 4C7, wherein the electrical component comprises a junction box.

  7C7. The apparatus according to clause 6C7, wherein the junction box is in meshing engagement with another junction box on a different module on which the modules overlap.

  8C7. The apparatus according to clause 4C7, wherein the electrical component comprises a bypass diode.

  9C7. The apparatus according to clause 4C7, wherein the electrical component comprises a module terminal.

  10C7. The apparatus according to clause 4C7, wherein the electrical component comprises an inverter.

  11C7. The apparatus according to clause 10C7, wherein the inverter comprises a DC / AC micro-inverter.

  12C7. The apparatus according to Item 11C7, wherein the DC / AC micro-inverter is on the back of a solar module.

  13C7. The apparatus of clause 4C7, wherein the electrical component comprises a power management device.

  14C7. The apparatus of clause 13C7, wherein the power management device comprises a switch.

  15C7. The apparatus of clause 14C7, further comprising a voltage sensing controller in communication with the switch.

16C7. The above power management device is
Receiving the voltage output of the supercell,
Based on the voltage, it is determined whether the solar cell of the supercell is reverse biased,
The device of clause 13C7 configured to disconnect the solar cell from a supercell module circuit that is reverse biased.

  17C7. The apparatus of clause 16C7, wherein the power management device is in electrical communication with a central inverter.

  18C7. The apparatus of clause 13C7, wherein the power management device comprises a DC / DC module power optimizer.

  19C7. The device according to clause 3C7, wherein the interconnect is sandwiched between the supercell and another supercell on the front surface of the solar module.

  20C7. The device according to paragraph 3C7, wherein the ribbon conductor is conductively bonded to the interconnect.

  21C7. The device according to clause 3C7, wherein the interconnect provides a resistance to current flow that is less than or equal to about 0.012 ohms.

  22C7. The term is configured to accommodate differential expansion between the first silicon solar cell and the interconnect in a temperature range between about -40 ° C and about 85 ° C. The device described in 3C7.

  23C7. The device of paragraph 3C7, wherein the thickness of the interconnect is less than or equal to about 100 microns.

  24C7. The device of paragraph 3C7, wherein the thickness of the interconnect is less than or equal to about 30 microns.

  25C7. The device according to paragraph 3C7, wherein the length of the supercell in the direction of current flow is at least about 500 mm.

  26C7. The device of paragraph 3C7, further comprising another supercell at the front of the solar module.

  27C7. 27. The apparatus according to clause 26C7, wherein the interconnect connects the other supercell in series with the supercell.

  28C7. 27. The apparatus according to clause 26C7, wherein the interconnect connects the other supercell in parallel with the supercell.

  29C7. The apparatus according to clause 26C7, wherein the front surface comprises a white backing having a plurality of dark stripes of location and width corresponding to the gap between the supercell and the other supercell.

  30C7. The device of paragraph 3C7 wherein the interconnect comprises a pattern.

  31C7. An apparatus according to clause 30C7, wherein the pattern comprises slits, slots and / or holes.

  32C7. The device of clause 3C7 wherein a portion of the interconnect is dark.

33C7. The first silicon solar cell comprises a plurality of beveled corners,
The second silicon solar cell does not have beveled corners,
The device according to clause 3C7, wherein the silicon solar cells of the supercell are substantially the same in area of the front surface exposed to light.

34C7. The first silicon solar cell comprises a plurality of beveled corners,
The second silicon solar cell comprises a plurality of beveled corners,
The apparatus according to Item 3C7, wherein the side includes a long side overlapping a long side of the second silicon solar cell.

  35C7. The device according to clause 3C7, wherein the interconnects form a bus.

  36C7. The device according to clause 3C7, wherein the interconnects are conductively bonded to the solar cell surface at bonded joints.

  37C7. The device of clause 3C7 wherein the first portion of the interconnect is broken around the edge of the supercell such that the remaining second portion is located behind the supercell.

38C7. The metallized pattern further includes a line on the front surface and extending along the long side,
The device of paragraph 3C7, further comprising a plurality of discontinuous contact pads located between the line and the long side.

39C7. The metallisation further includes a plurality of fingers extending in a direction perpendicular to the long side, electrically connected to respective discontinuous contact pads,
The device according to clause 38C7, wherein the conductive wire interconnects the plurality of fingers.

  40C7. The device according to clause 38C7, wherein the metallized pattern includes raised features that contain the spread of the adhesive.

1C8. A plurality of supercells arranged in a plurality of rows in front of the solar module, each supercell being in series with said adjacent silicon solar cells, with the ends of the adjacent silicon solar cells overlapping and in conductive junction; Comprising a plurality of supercells comprising at least 19 silicon solar cells having a breakdown voltage of at least 10 V, arranged side by side in electrical connection,
An end of a first supercell adjacent to a module edge in a first row is a second supercell adjacent to the module edge in a second row via a flexible electrical interconnect joining to the front surface of the first supercell An electrical connection to the end of the device.

  2C8. The device of clause 1C8, wherein a portion of the flexible electrical interconnect is covered by a dark film.

  3C8. The apparatus according to clause 2C8, wherein the front of the solar module includes a backing sheet having low visual contrast to the flexible electrical interconnect.

  4C98. The device according to clause 1C8, wherein a portion of the flexible electrical interconnect is colored.

  5C8. The apparatus according to clause 4C8, wherein the front of the solar module includes a backing sheet having low visual contrast to the flexible electrical interconnect.

  6C8. The device of paragraph 1C8, wherein the solar module front surface comprises a white backing sheet.

  7C8. The device of paragraph 6C8, further comprising: a plurality of dark stripes corresponding to gaps between the plurality of rows.

  8C8. The device according to Item 6C8, wherein the n-type semiconductor layer of the silicon solar cell faces the backing sheet.

9C8. The front of the solar module includes a backing sheet,
The device according to clause 1C8, wherein the backing sheet, the flexible electrical interconnect, the first supercell, and the encapsulant constitute a laminated structure.

  10C8. The device according to clause 9C8, wherein the encapsulant comprises a thermoplastic polymer.

  11C8. The device according to clause 10C8, wherein the thermoplastic polymer comprises a thermoplastic olefin polymer.

  12C8. The device of paragraph 9C8, further comprising a glass front sheet.

  13C8. The apparatus according to Item 12C8, wherein the backing sheet comprises glass.

  14C8. The device according to clause 1C8, wherein the flexible electrical interconnects join at a plurality of discrete locations.

  15C8. The device according to clause 1C8, wherein the flexible electrical interconnects are joined by an electrically conductive adhesive binder.

  16C8. The device of paragraph 1C8, further comprising a bonded link.

  17C8. The device according to clause 1C8, wherein the flexible electrical interconnect extends parallel to the module edge.

  18C8. The device according to clause 1C8, wherein a portion of the flexible electrical interconnect folds and hides around the first supercell.

  19C8. The device of paragraph 1C8, further comprising a ribbon conductor electrically connecting the first supercell to an electrical component.

  20C8. The device of paragraph 19C8 wherein the ribbon conductor conductively bonds to the flexible electrical interconnect.

  21C8. The device of paragraph 19C8, wherein the ribbon conductors conductively bond to the solar cell surface in a direction away from the overlapping ends.

  22C8. The apparatus according to Item 19C8, wherein the electrical component is on the back of a solar module.

  23C8. The device of paragraph 19C8 wherein the electrical component comprises a junction box.

  24C8. The apparatus according to Item 23C8, wherein the junction box engages with another junction box on the front of another solar module.

  25C8. The device of paragraph 23C8, wherein the junction box comprises a single terminal junction box.

  26C8. The device of paragraph 19C8 wherein the electrical component comprises a bypass diode.

  27C8. The apparatus according to clause 19C8, wherein the electrical component comprises a switch.

28C8. Further comprising a voltage sensing controller,
The above voltage sensing controller
Receiving the voltage output of the first supercell,
Based on the voltage, it is determined whether the solar cell of the first supercell is reverse biased,
The device of clause 27C8, configured to communicate with the switch to disconnect the reverse biased solar cell from a supercell module circuit.

  29C8. The device according to clause 1C8, wherein the first supercell is in series with the second supercell.

30C8. The first silicon solar cell of the first supercell comprises a plurality of beveled corners,
The second silicon solar cell of the first supercell does not have beveled corners,
The device according to clause 1C8, wherein the silicon solar cells of the first supercell are substantially the same in area of the front surface exposed to light.

31C8. The first silicon solar cell of the first supercell comprises a plurality of beveled corners,
The second silicon solar cell of the first supercell comprises a plurality of beveled corners,
The device according to Item 1C8, wherein a long side of the first silicon solar cell overlaps a long side of the second silicon solar cell.

  32C8. The device of paragraph 1C8, wherein the silicon solar cell of the first supercell comprises a strip approximately 156 mm in length.

  33C8. The device of paragraph 1C8, wherein the silicon solar cell of the first supercell comprises a strip about 125 mm in length.

  34C8. The device of paragraph 1C8, wherein the silicon solar cell of the first supercell comprises a strip having an aspect ratio between width and length between about 1: 2 and about 1:20.

35C8. The overlapping adjacent silicon solar cells of the first supercell are conductively bonded by an adhesive,
The device of paragraph 1C8, further comprising a feature configured to contain the spread of the adhesive.

  36C8. The apparatus according to Item 35C8, wherein the features include moats.

  37C8. The apparatus according to Item 36C8, wherein the moat is formed by a metallized pattern.

38C8. The metallized pattern includes a line extending along the long side of the silicon solar cell,
The device of paragraph 37C8, further comprising a plurality of discontinuous contact pads located between the line and the long side.

  39C8. The device of paragraph 37C8 wherein the metallization pattern is located on the front of the silicon solar cell of the first supercell.

  40C8. The device according to clause 37C8, wherein the metallization pattern is located on the back of the silicon solar cell of the second supercell.

1C9. A solar module including a front surface including a plurality of silicon solar cells connected in series;
The apparatus wherein the plurality of silicon solar cells are grouped into a first supercell comprising a first cut strip having a front side metallization pattern along a first outer edge where the second cut strips overlap.

  2C9. The apparatus according to Item 1C9, wherein lengths of the first cut strip and the second cut strip reproduce a shape of a wafer from which the first cut strip is divided.

  3C9. The apparatus according to Item 2C9, wherein the length is 156 mm.

  4C9. The apparatus according to Item 2C9, wherein the length is 125 mm.

  5C9. The device according to clause 2C9, wherein the aspect ratio between the width of the first cut strip and the length is between about 1: 2 and about 1:20.

  6C9. The apparatus according to clause 2C9, wherein the first cut strip comprises a first beveled corner.

  7C9. The apparatus according to clause 6C9, wherein the first chamfered corner is along the first outer edge.

  8C9. The apparatus according to Item 6C9, wherein the first chamfered corner does not follow the first outer edge.

  9C9. The apparatus according to clause 6C9, wherein the second cut strip comprises a second beveled corner.

  10C9. The apparatus according to clause 9C9, wherein the overlapped edge of the second cut strip comprises the second beveled corner.

  11C9. The apparatus according to paragraph 9C9, wherein the overlapping edges of the second cut strip do not include the second beveled corner.

  12C9. The apparatus according to Item 6C9, wherein the length reproduces the shape of the pseudo square wafer from which the first cut strip is divided.

  13C9. The device according to clause 6C9, wherein the width of the first cut strip is different from the width of the second cut strip such that the first cut strip and the second cut strip have approximately the same area.

  14C9. The apparatus according to Item 1C9, wherein the second cut strip overlaps the first cut strip by about 1 to 5 mm.

  15C9. The apparatus according to clause 1C9, wherein the front metallization pattern comprises bus bars.

  16C9. The apparatus according to Item 15C9, wherein the bus bar includes a tapered portion.

  17C9. The apparatus of paragraph 1C9, wherein the front metallization pattern comprises discontinuous contact pads.

18C9. The second cut strip is bonded to the first cut strip by an adhesive.
The apparatus according to Item 17C9, wherein the discontinuous contact pad further comprises a feature to contain adhesive spread.

  19C9. The apparatus according to Item 18C9, wherein the features include moats.

  20C9. The apparatus of paragraph 1C9, wherein the front metallization pattern comprises a bypass conductor.

  21C9. The apparatus according to clause 1C9, wherein the front metallization pattern comprises fingers.

  22C9. The apparatus according to clause 1C9, wherein the first cut strip further comprises a backside metallization pattern along a second outer edge opposite the first outer edge.

  23C9. The apparatus of paragraph 22C9, wherein the backside metallization pattern comprises a contact pad.

  24C9. The apparatus according to Item 22C9, wherein the backside metallization pattern comprises a bus bar.

  25C9. The apparatus according to clause 1C9, wherein the supercell comprises at least nineteen silicon cut strips each having a breakdown voltage greater than about 10 volts.

  26C9. The apparatus according to Item 1C9, wherein the supercell is connected to another supercell on the front surface of the solar module.

  27C9. The device according to clause 26C9, wherein the front surface of the solar module comprises a white backing having a plurality of dark stripes corresponding to the gap between the supercell and the other supercell.

28C9. The front side of the solar module includes a backing sheet,
The device according to clause 26C9, wherein the backing sheet, the interconnect, the supercell, and the encapsulant constitute a laminated structure.

  29C9. The device according to Item 28C9, wherein the encapsulant comprises a thermoplastic polymer.

  30C9. The device according to paragraph 29C9, wherein the thermoplastic polymer comprises a thermoplastic olefin polymer.

  31C9. The apparatus of clause 26C9, further comprising an interconnect between the supercell and the other supercell.

  32C9. An apparatus according to clause 31C9, wherein a portion of the interconnect is covered by a dark film.

  33C9. The device of paragraph 31C9, wherein a portion of the interconnect is colored.

  34C9. An apparatus according to clause 31C9, further comprising a ribbon conductor electrically connecting the supercell to an electrical component.

  35C9. The apparatus according to Item 34C9, wherein the ribbon conductor is conductively bonded to the back side of the first cut strip.

  36C9. The apparatus according to clause 34C9, wherein the electrical component comprises a bypass diode.

  37C9. The apparatus according to Item 34C9, wherein the electrical component comprises a switch.

  38C9. The apparatus according to Item 34C9, wherein the electrical component comprises a junction box.

  39C9. The device according to Item 38C9, wherein the junction box overlaps with the other junction box and is fitted with the other junction box.

  40C9. The apparatus according to Item 26C9, wherein the supercell and the other supercell are connected in series.

1C10. Laser scribing scribe lines on a silicon wafer to define a solar cell area;
Applying an electrically conductive adhesive to the top surface of the scribed silicon wafer adjacent to the long side of the solar cell area;
Separating the silicon wafer along the scribe line to provide a solar cell strip including a portion of the electrically conductive adhesive bonding material disposed adjacent to the long side of the solar cell strip. ,Method.

  2C10. The method according to clause 1C10, further comprising the step of providing the silicon wafer with the metallized pattern such that the separating step produces the solar cell strip having the metallized pattern along the long side. .

  3C10. The method according to Item 2C10, wherein the metallized pattern includes bus bars or discontinuous contact pads.

  4C10. The method according to Item 2C10, wherein the providing step comprises printing the metallized pattern.

  5C10. A method according to clause 2C10, wherein the providing step comprises electroplating the metallized pattern.

  6C10. A method according to clause 2C10, wherein the metallized pattern comprises features adapted to contain the spread of the electrically conductive adhesive binder.

  7C10. The apparatus according to clause 6C10, wherein the features include moats.

  8C10. The method according to Item 1C10, wherein the applying step comprises a printing step.

  9C10. The method according to Item 1C10, wherein the applying includes depositing using a mask.

  10C10. The method according to Item 1C10, wherein the long side length of the solar cell strip reproduces the shape of the wafer.

  11C10. The method according to item 10C10, wherein the length is 156 mm or 125 mm.

  12C10. The method according to clause 10C10, wherein the aspect ratio between the width of the solar cell strip and the length is between about 1: 2 and about 1:20.

  13C10. The separating step draws a vacuum between the bottom surface of the wafer and the curved support surface to move the solar cell area toward the curved support surface, thereby bending the silicon wafer along the scribe line. The method according to Item 1C10, which is cleaved.

14C10. Arranging the plurality of solar cell strips side by side, with the long sides of adjacent solar cell strips overlapping and part of the electrically conductive adhesive being interposed therebetween;
A method according to clause 1C10, further comprising: curing the electrically conductive bonding agent, thereby bonding adjacent overlapping solar cell strips together and electrically connecting them in series.

  15C10. The method according to Item 14C10, wherein the curing step includes a heating step.

  16C10. The method according to Item 14C10, wherein the curing step includes a pressing step.

  17C10. The method according to Item 14C10, wherein the arranging includes forming a layered structure.

  18C10. The method according to Item 17C10, wherein the curing comprises pressing and heating the layered structure.

  19C10. The method according to Item 17C10, wherein the layered structure comprises an encapsulant.

  20C10. The method according to item 19C10, wherein the encapsulant comprises a thermoplastic polymer.

  21C10. The method according to Item 20C10, wherein the thermoplastic polymer comprises a thermoplastic olefin polymer.

  22C10. The method according to Item 17C10, wherein the layered structure comprises a backing sheet.

23C10. The backing sheet is white.
The method according to Item 22C10, wherein the layered structure further comprises dark stripes.

  24C10. The method according to Item 14C10, wherein the arranging includes arranging at least nineteen solar cell strips side by side.

  25C10. The method according to Item 24C10, wherein each of the at least 19 solar cell strips has a breakdown voltage of at least 10V.

  26C10. A method according to clause 24C10, further comprising: bringing the at least nineteen solar cell strips into communication with only a single bypass diode.

  27C10. The method of clause 26C10, further comprising forming a ribbon conductor between one of the at least nineteen solar cell strips and the single bypass diode.

  28C10. The method according to Item 27C10, wherein the single bypass diode is located in a junction box.

  29C10. The method according to Item 28C10, wherein the junction box is on the rear side of the solar module in a mating arrangement with other junction boxes of different solar modules.

  30C10. The method according to Item 14C10, wherein overlapped cell strips of the plurality of solar cell strips overlap the solar cell strip by about 1 to 5 mm.

  31C10. The method of paragraph 14C10, wherein the solar cell strip comprises a first beveled corner.

  32C10. The method according to Item 31C10, wherein a long side of overlapping solar cell strips among the plurality of solar cell strips does not include a second chamfered corner.

  33C10. A method according to clause 32C10, wherein the width of the solar cell strips is greater than the width of the overlapping solar cell strips such that the solar cell strips and the overlapping solar cell strips have approximately the same area.

  34C10. The method according to Item 31C10, wherein a long side of overlapping solar cell strips among the plurality of solar cell strips includes a second chamfered corner.

  35C10. The method according to clause 34C10, wherein the long side of the overlapping solar cell strip of the plurality of solar cell strips overlaps the long side of the cell strip including the first beveled corner.

  36C10. The method according to Item 34C10, wherein the long side of the overlapping solar cell strip of the plurality of solar cell strips overlaps a long side of the cell strip not including the first chamfered corner.

  37C10. A method according to clause 14C10, further comprising connecting the plurality of solar cell strips to another plurality of solar cell strips utilizing interconnects.

  38C10. A method according to clause 37C10, wherein a portion of the interconnect is covered by a dark film.

  39C10. The method of paragraph 37C10 wherein a portion of the interconnect is colored.

  40C10. The method according to Item 37C10, wherein the plurality of solar cell strips are connected in series with the other plurality of solar cell strips.

1C11. Providing a silicon wafer having a length;
Scribing a scribe line on the silicon wafer to define a solar cell area;
Applying an electrically conductive adhesive to the surface of the silicon wafer;
Separating the silicon wafer along the scribe line to provide a solar cell strip including a portion of the electrically conductive adhesive bonding material disposed adjacent to the long side of the solar cell strip. ,Method.

  2C11. The method according to Item 1C11, wherein the scribing comprises laser scribing.

  3C11. A method according to Item 2C11, comprising the step of laser scribing the scribe line and thereafter applying the electrically conductive adhesive.

  4C11. A method according to clause 2C11, comprising applying the electrically conductive adhesive bond to the wafer and then laser scribing the scribe line.

5C11. The step of applying comprises the step of applying an uncured electrically conductive adhesive binder,
The method according to Item 4C11, wherein the step of laser scribing includes a step of avoiding curing of the uncured conductive adhesive bond by heat from the laser.

  6C11. A method according to clause 5C11, wherein the step of avoiding comprises the step of selecting the laser power and / or the distance between the scribe line and the uncured conductive adhesive binder.

  7C11. The method according to Item 1C11, wherein the applying step comprises a printing step.

  8C11. The method according to Item 1C11, wherein the applying step comprises depositing using a mask.

  9C11. The method according to Item 1C11, wherein the scribe line and the electrically conductive adhesive are on the surface.

  10C11. The separating step draws a vacuum between the surface of the silicon wafer and the curved support surface to move the solar cell area toward the curved support surface, thereby bending the silicon wafer along the scribe line. The method according to Item 1C11, which cleaves

  11C11. The method according to Item 10C11, wherein the step of separating includes disposing the scribe line at an angle with respect to a vacuum manifold.

  12C11. The method according to Item 1C11, wherein the separating step includes a step of pressing the wafer using a roller.

  13C11. The step of providing includes the step of providing the silicon wafer with the metallized pattern such that the solar cell strip having the metallized pattern along the long side is generated by the separating step. The method described in.

  14C11. The method of claim 13C11, wherein the metallization pattern comprises bus bars or discontinuous contact pads.

  15C11. The method according to Item 13C11, wherein the step of providing comprises printing the metallized pattern.

  16C11. The method according to paragraph 13C11, wherein the providing step comprises electroplating the metallized pattern.

  17C11. The method of paragraph 13C11, wherein the metallized pattern includes features configured to contain a spread of the electrically conductive adhesive binder.

  18C11. The method according to Item 1C11, wherein the length of the long side of the solar cell strip reproduces the shape of the wafer.

  19C11. The method according to item 18C11, wherein the length is 156 mm or 125 mm.

  20C11. The method of paragraph 18C11, wherein the aspect ratio between the width of the solar cell strip and the length is between about 1: 2 to about 1:20.

21C11. Arranging the plurality of solar cell strips side by side, with the long sides of adjacent solar cell strips overlapping and part of the electrically conductive adhesive being interposed therebetween;
A method according to clause 1C11, further comprising: curing the electrically conductive bonding agent, thereby bonding adjacent overlapping solar cell strips together and electrically connecting them in series.

22C11. The step of arranging includes the step of forming a layered structure,
The method according to Item 21C11, wherein the curing includes heating and / or pressing the layered structure.

  23C11. The method according to Item 22C11, wherein the layered structure comprises a thermoplastic olefin polymer encapsulant.

24C11. A method according to item 22C11, wherein the layered structure comprises a white backing sheet and dark stripes on the white backing sheet.

25C11. Multiple wafers are provided on the template,
The conductive adhesive is distributed on the plurality of wafers,
The method according to Item 21C11, wherein the plurality of wafers are cells separated simultaneously into a plurality of solar cell strips by a fixture.

26C11. The method further comprises the step of conveying the plurality of solar cell strips as a group,
The method according to Item 25C11, wherein the disposing includes disposing the plurality of solar cell strips in a module.

  27C11. The method according to paragraph 21C11, wherein the arranging comprises arranging side by side only a single bypass diode and at least 19 solar cell strips having a breakdown voltage of at least 10V.

  28C11. The method of paragraph 27C11 further comprising forming a ribbon conductor between one of the at least nineteen solar cell strips and the single bypass diode.

  29C11. The method according to Item 28C11, wherein the single bypass diode is located in a first connection box of a first solar module, which is arranged to be fitted with a second connection box of a second solar module.

  30C11. A method according to clause 27C11, further comprising forming a ribbon conductor between one of the at least nineteen solar cell strips and a smart switch.

  31C11. The method according to paragraph 21C11, wherein overlapped cell strips of the plurality of solar cell strips overlap the solar cell strips by about 1 to 5 mm.

  32C11. A method according to clause 21C11, wherein the solar cell strip comprises a first beveled corner.

  33C11. The method according to Item 32C11, wherein a long side of overlapping solar cell strips among the plurality of solar cell strips does not include a second chamfered corner.

  34C11. A method according to clause 33C11, wherein the width of the solar cell strips is greater than the width of the overlapping solar cell strips such that the solar cell strips and the overlapping solar cell strips have approximately the same area.

  35C11. The method according to Item 32C11, wherein a long side of overlapping solar cell strips among the plurality of solar cell strips includes a second chamfered corner.

  36C11. The method according to Item 35C11, wherein the long side of the overlapping solar cell strip of the plurality of solar cell strips overlaps the long side of the cell strip including the first chamfered corner.

  37C11. The method according to Item 35C11, wherein the long side of the overlapping solar cell strip of the plurality of solar cell strips overlaps the long side of the cell strip not including the first chamfered corner.

  38C11. A method according to paragraph 21C11, further comprising connecting the plurality of solar cell strips to another plurality of solar cell strips utilizing interconnects.

  39C11. A method according to clause 38C11, wherein a portion of the interconnect is covered or colored by a dark film.

  40C11. The method according to Item 38C11, wherein the plurality of solar cell strips are connected in series with the other plurality of solar cell strips.

1C12. Providing a silicon wafer having a length;
Scribing a scribe line on a silicon wafer to define a solar cell area;
Separating the silicon wafer along the scribe line to provide a solar cell strip;
Applying an electrically conductive adhesive bond disposed adjacent to the long side of the solar cell strip.

  2C12. The method according to Item 1C12, wherein the step of scribing includes a step of laser scribing.

  3C12. The method according to Item 1C12, wherein the applying includes screen printing.

  4C12. The method according to Item 1C12, wherein the applying step comprises an inkjet printing step.

  5C12. The method according to Item 1C12, wherein the applying includes depositing using a mask.

  6C12. The method according to Item 1C12, wherein the separating includes drawing a vacuum between the surface of the wafer and the curved surface.

  7C12. A method according to clause 6C12, wherein the curved surface comprises a vacuum manifold and the separating comprises orienting the scribe line at an angle to the vacuum manifold.

  8C12. The method according to Item 7C12, wherein the angle is vertical.

  9C12. The method according to Item 7C12, wherein the angle is other than vertical.

  10C12. A method according to clause 6C12, wherein the vacuum is drawn through a moving belt.

11C12. Arranging the plurality of solar cell strips side by side, with the long sides of adjacent solar cell strips overlapping the electrically conductive adhesive binder disposed therebetween;
The method according to claim 1C12, further comprising: curing the electrically conductive bonding agent to bond adjacent, overlapping, electrically connected solar cell strips in series.

12C12. The disposing step includes the step of forming a layered structure including an encapsulant.
The method according to Item 11C12, further comprising the step of laminating the layered structure.

  13C12. The method according to Item 12C12, wherein the curing step occurs at least partially during the laminating step.

  14C12. The method according to Item 12C12, wherein the curing step occurs separately from the laminating step.

  15C12. The method according to Item 12C12, wherein the step of laminating includes the step of drawing a vacuum.

  16C12. The method according to Item 15C12, wherein the vacuum is drawn to the bladder.

  17C12. The method according to Item 15C12, wherein the vacuum is drawn against a belt.

  18C12. A method according to item 12C12, wherein the encapsulant comprises a thermoplastic olefin polymer.

19C12. A method according to item 12C12, wherein the layered structure comprises a white backing sheet and dark stripes on the white backing sheet.

  20C12. The step of providing includes the step of providing the silicon wafer with the metallized pattern such that the solar cell strip having the metallized pattern along the long side is generated by the separating step. The method described in.

  21C12. The method according to Item 20C12, wherein the metallized pattern includes bus bars or discontinuous contact pads.

  22C12. The method according to Item 20C12, wherein the step of providing comprises printing or electroplating the metallized pattern.

  23C12. A method according to clause 20C12, wherein the step of disposing comprises: using the metallized pattern feature to contain the spread of the electrically conductive adhesive.

  24C12. The method according to Item 23C12, wherein the feature is on the front side of the solar cell strip.

  25C12. The method according to Item 23C12, wherein the feature is behind the solar cell strip.

  26C12. The method according to Item 11C12, wherein the long side length of the solar cell strip reproduces the shape of the wafer.

  27C12. The method according to Item 26C12, wherein the length is 156 mm or 125 mm.

  28C12. A method according to clause 26C12, wherein the aspect ratio between the width of the solar cell strip and the length is between about 1: 2 and about 1:20.

  29C12. The method according to Item 11C12, wherein the disposing step comprises disposing only a single bypass diode and at least 19 solar cell strips having a breakdown voltage of at least 10 V side by side as a first supercell.

  30C12. A method according to clause 29C12, further comprising the step of applying the electrically conductive adhesive binder between the first supercell and the interconnect.

  31C12. 31. The method of clause 30C12, wherein the interconnect connects the first supercell in parallel with a second supercell.

  32C12. 31. The method of clause 30C12, wherein the interconnect connects the first supercell in series with a second supercell.

  33C12. A method according to clause 29C12, further comprising forming a ribbon conductor between the first supercell and the single bypass diode.

  34C12. The method according to Item 33C12, wherein the single bypass diode is located in a first connection box of a first solar module, which is arranged to be fitted with a second connection box of a second solar module.

  35C12. The method of claim 11 C12, wherein the solar cell strip comprises a first beveled corner.

  36C12. The method according to Item 35C12, wherein the long side of the overlapping solar cell strip among the plurality of solar cell strips does not include the second chamfered corner.

  37C12. A method according to clause 36C12, wherein the width of the solar cell strips is greater than the width of the overlapping solar cell strips such that the solar cell strips and the overlapping solar cell strips have approximately the same area.

  38C12. The method according to Item 35C12, wherein a long side of overlapping solar cell strips among the plurality of solar cell strips includes a second chamfered corner.

  39C12. The method according to Item 38C12, wherein the long side of the overlapping solar cell strip of the plurality of solar cell strips overlaps the long side of the cell strip including the first chamfered corner.

  40C12. The method according to Item 38C12, wherein the long side of the overlapping solar cell strip of the plurality of solar cell strips overlaps a long side of the cell strip not including the first chamfered corner.

1C13. A semiconductor wafer having a first surface including a first metallization pattern along a first outer edge and a second metallization pattern along a second outer edge opposite the first outer edge;
The apparatus, wherein the semiconductor wafer further comprises a first scribe line between the first metallization pattern and the second metallization pattern.

  2C13. The device of paragraph 1C13, wherein the first metallization pattern comprises discontinuous contact pads.

  3C13. The device of paragraph 1C13, wherein the first metallization pattern includes a first finger pointing away from the first outer edge towards the second metallization pattern.

  4C13. The device of paragraph 3C13, wherein the first metallization pattern further comprises a bus bar extending along the first outer edge and intersecting the first finger.

5C13. The second metallized pattern is
A second finger pointing in a direction away from the second outer edge towards the first metallization pattern;
The apparatus according to Item 4C13, comprising: a second bus bar extending along the second outer edge and intersecting the second finger.

  6C13. The device of paragraph 3C13, further comprising an electrically conductive adhesive extending along the first outer edge and in contact with the first finger.

  7C13. The device of paragraph 3C13 wherein the first metallization pattern further comprises a first bypass conductor.

  8C13. The device of paragraph 3C13 wherein the first metallization pattern further comprises a first end conductor.

  9C13. The device of paragraph 1C13 wherein the first metallization pattern comprises silver.

  10C13. The device of paragraph 9C13 wherein the first metallization pattern comprises a silver paste.

  11C13. The device of paragraph 9C13, wherein the first metallization pattern comprises discontinuous contacts.

  12C13. The device of paragraph 1C13, wherein the first metallization pattern comprises tin, aluminum, or other less expensive than silver conductor.

  13C13. The device of paragraph 1C13 wherein the first metallization pattern comprises copper.

  14C13. The device of paragraph 13C13, wherein the first metallization pattern comprises electroplated copper.

  15C13. The device of paragraph 13C13, further comprising: providing a passivation scheme to reduce recombination.

16C13. A third metallization pattern of said first surface of said semiconductor wafer not proximate to said first outer edge or said second outer edge;
And a second scribe line between the third metallized pattern and the second metallized pattern.
The apparatus according to Item 1C13, wherein the first scribe line is between the first metallized pattern and the third metallized pattern.

  17C13. The ratio of the first width defined between the first scribe line and the second scribe line by the length of the semiconductor wafer is between about 1: 2 and about 1:20. The device described in.

  18C13. The apparatus according to Item 17C13, wherein the length is about 156 mm or about 125 mm.

  19C13. The apparatus according to Item 17C13, wherein the semiconductor wafer includes a chamfered corner.

20C13. The first scribe line defines, together with the first outer edge, a first rectangular area including two beveled corners and the first metallization pattern.
The first rectangular area has an area corresponding to a value obtained by subtracting an area obtained by combining the two chamfered corners from a product of the length and a second width larger than the first width. ,
The second scribe line, together with the first scribe line, defines a second rectangular area not including a beveled corner and including the third metallization pattern.
The apparatus according to Item 19C13, wherein the second rectangular area has an area corresponding to the product of the length and the first width.

  21C13. The device of paragraph 16C13, wherein the third metallization pattern includes fingers that point to the second metallization pattern.

  22C13. The device of paragraph 1C13 further comprising a third metallization pattern of the second surface of the semiconductor wafer opposite the first surface.

  23C13. 22. The apparatus of paragraph 22C13, wherein the third metallization pattern has a contact pad proximate to the location of the first scribe line.

  24C13. The apparatus according to Item 1C13, wherein the first scribe line is formed by a laser.

  25C13. The apparatus according to Item 1C13, wherein the first scribe line is in the first surface.

  26C13. The device of paragraph 1C13, wherein the first metallization pattern comprises a feature configured to contain a spread of the electrically conductive adhesive.

  27C13. The apparatus according to Item 26C13, wherein the features include raised features.

  28C13. The device of paragraph 27C13, wherein the first metallization pattern comprises a contact pad, and the feature comprises a dam abutting the contact pad and higher than the contact pad.

  29C13. The apparatus according to Item 26C13, wherein the features include recessed features.

  30C13. 30. Apparatus according to clause 29C13, wherein the recessed features include moats.

  31C13. The device of paragraph 26C13, further comprising the electrically conductive adhesive contacting the first metallization pattern.

  32C13. The device according to Item 31C13, wherein the electrically conductive adhesive is printed.

  33C13. The apparatus according to Item 1C13, wherein the semiconductor wafer comprises silicon.

  34C13. The apparatus according to Item 33C13, wherein the semiconductor wafer comprises crystalline silicon.

  35C13. The device according to clause 33C13, wherein the first surface is n-type conductive.

  36C13. The device according to clause 33C13, wherein the first surface is p-type conductive.

37C13. The first metallization pattern is 5 mm or less from the first outer edge,
The second metallization pattern is 5 mm or less from the second outer edge,
An apparatus according to Item 1C13.

  38C13. The apparatus according to clause 1C13, wherein the semiconductor wafer comprises a plurality of beveled corners and the first metallization pattern comprises a tapered portion extending around the beveled corners.

  39C13. The device according to Item 38C13, wherein the tapered portion includes a bus bar.

  40C13. The device according to Item 38C13, wherein the tapered portion includes a conductor connecting discontinuous contact pads.

1C14. Scribing a first scribe line on the wafer;
Separating the wafer along the first scribe line using a vacuum to provide a solar cell strip.

  2C14. The method according to Item 1C14, wherein the step of scribing includes a step of laser scribing.

  3C14. The method according to Item 2C14, wherein the step of separating includes the step of drawing the vacuum between the surface of the wafer and the curved surface.

  4C14. The method of claim 3C14, wherein the curved surface comprises a vacuum manifold.

5C14. The wafer is supported on a belt moving to the vacuum manifold,
The method according to Item 4C14, wherein the vacuum is drawn through the belt.

6C14. The above separation step is
Orienting the first scribe line at an angle relative to the vacuum manifold;
And c. Initiating cleavage at one end of the first scribe line.

  7C14. The method of paragraph 6C14, wherein the angle is substantially vertical.

  8C14. The method according to Item 6C14, wherein the angle is an angle other than substantially vertical.

  9C14. The method of claim 3C14, further comprising the step of applying an uncured electrically conductive adhesive binder.

  10C14. The method according to Item 9C14, wherein the first scribe line and the uncured electrically conductive adhesive binder are on the same surface of the wafer.

  11C14. The step of laser scribing may cure the uncured conductive adhesive by selecting a laser power and / or a distance between the first scribing line and the uncured conductive adhesive. The method according to Item 10C14 to avoid.

  12C14. The method of paragraph 10C14, wherein the same surface is on the opposite side of a wafer surface supported by a belt that moves the wafer to the curved surface.

  13C14. The method according to Item 12C14, wherein the curved surface comprises a vacuum manifold.

  14C14. The method according to Item 9C14, wherein the applying step occurs after the scribing step.

  15C14. The method according to Item 9C14, wherein the applying step occurs after the separating step.

  16C14. The method of claim 9C14, wherein the applying step comprises screen printing.

  17C14. The method according to Item 9C14, wherein the applying step includes an inkjet printing step.

  18C14. The method of claim 9C14, wherein the applying step comprises depositing using a mask.

19C14. The first scribe line is
A first metallization pattern of the surface of the wafer along a first outer edge;
A method according to clause 3C14, between the second metallization pattern of the surface of the wafer along the second outer edge.

20C14. The wafer further includes a third metallization pattern of the surface of the semiconductor wafer not proximate to the first outer edge or the second outer edge,
A second scribe line is scribed between the third metallization pattern and the second metallization pattern such that the first scribe line is between the first metallization pattern and the third metallization pattern. The process to
C. separating the wafer along the second scribe line to provide another solar cell strip.

  21C14. The distance between the first scribe line and the second scribe line defines an aspect ratio of between about 1: 2 and about 1:20 to the length of the wafer being about 125 mm or about 156 mm. The method according to Item 20C14, which forms a width.

  22C14. A method according to clause 19C14, wherein the first metallization pattern comprises fingers pointing to the second metallization pattern.

  23C14. The method of paragraph 22C14, wherein the first metallization pattern further comprises bus bars intersecting the fingers.

  24C14. The method according to Item 23C14, wherein the bus bar is within 5 mm of the first outer edge.

  25C14. The method according to Item 22C14, further comprising an uncured electrically conductive adhesive adhesive in contact with the finger.

  26C14. The method of paragraph 19C14, wherein the first metallization pattern comprises discontinuous contact pads.

  27C14. The method of paragraph 19C14, further comprising printing or electroplating the first metallization pattern on the wafer.

28C14. A first super-layer comprising at least nineteen solar cell strips each having a breakdown voltage of at least 10 V, with the long sides of adjacent solar cell strips overlapping the electrically conductive adhesive binder disposed therebetween Placing the solar cell strip in a cell;
The method according to claim 3, further comprising: curing the electrically conductive bonding agent to bond adjacent, overlapping, electrically connected solar cell strips in series.

29C14. The disposing step includes the step of forming a layered structure including an encapsulant.
The method according to Item 28C14, further comprising the step of laminating the layered structure.

  30C14. The method according to Item 29C14, wherein the curing step occurs at least partially during the laminating step.

  31C14. The method according to Item 29C14, wherein the curing step occurs separately from the laminating step.

  32C14. The method according to Item 29C14, wherein the encapsulant comprises a thermoplastic olefin polymer.

33C14. The method according to Item 29C14, wherein the layered structure comprises a white backing sheet and dark stripes on the white backing sheet.

  34C14. The method of paragraph 28C14, wherein the placing step comprises the step of containing the spread of the electrically conductive adhesive bonding using the metallized pattern feature.

  35C14. The method of paragraph 34C14, wherein a metallized pattern feature is on the front of the solar cell strip.

  36C14. The method of paragraph 34C14, wherein a metallized pattern feature is on the back surface of the solar cell strip.

  37C14. A method according to clause 28C14, further comprising the step of applying the electrically conductive adhesive between the first supercell and an interconnect connecting the second supercell in series.

38C14. Forming a ribbon conductor between the single bypass diodes of the first supercell;
The method according to Item 28C14, wherein the single bypass diode is located in the first connection box of the first solar module in mating arrangement with the second connection box of the second solar module.

39C14. The solar cell strip includes a first beveled corner,
The long side of the overlapping solar cell strip among the plurality of solar cell strips does not include the second chamfered corner,
A method according to clause 28C14, wherein the width of the solar cell strip is greater than the width of the overlapping solar cell strips such that the solar cell strips and the overlapping solar cell strips have approximately the same area.

40C14. The solar cell strip includes a first beveled corner,
The long side of the overlapping solar cell strip of the plurality of solar cell strips includes a second chamfered corner,
The method according to Item 28C14, wherein the long side of the overlapping solar cell strip of the plurality of solar cell strips overlaps the long side of the solar cell strip not including the first chamfered corner.

1C15. Forming a first metallization pattern along a first outer edge of a first surface of the semiconductor wafer;
Forming a second metallization pattern along a second outer edge of the first surface opposite the first outer edge;
Forming a first scribe line between the first metallization pattern and the second metallization pattern.

2C15. The first metallization pattern comprises a first finger pointing to the second metallization pattern,
The method of paragraph 1C15, wherein the second metallization pattern comprises a second finger pointing to the first metallization pattern.

3C15. The first metallization pattern further includes a first bus bar located within 5 mm of the first outer edge intersecting the first finger,
A method according to paragraph 2C15, wherein the second metallization pattern comprises a second bus bar located within 5 mm of the second outer edge intersecting the second finger.

4C15. The method further includes the step of forming on the first surface a third metallized pattern not along the first outer edge or along the second outer edge.
A third bus bar parallel to the first bus bar;
And a third finger pointing to the second metallization pattern.
Forming a second scribe line between the third metallized pattern and the second metallized pattern;
The method according to Item 3C15, wherein the first scribe line is between the first metallized pattern and the third metallized pattern.

  5C15. An item according to item 4C15, wherein the first scribe line and the second scribe line are separated by a width having a ratio to the length of the semiconductor wafer that is between about 1: 2 and about 1:20. the method of.

  6C15. The method according to Item 5C15, wherein the length of the semiconductor wafer is about 156 mm or about 125 mm.

  7C15. The method according to item 4C15, wherein the semiconductor wafer includes a chamfered corner.

8C15. The first scribe line defines, together with the first outer edge, a first solar cell area including two beveled corners and the first metallization pattern.
The first solar cell region has a first area corresponding to a value obtained by subtracting the combined area of the two chamfered corners from the product of the length of the semiconductor wafer and the first width. And
The second scribe line, together with the first scribe line, defines a second solar cell region that does not include a chamfered corner and includes the third metallization pattern.
An item according to item 7C15, wherein the second solar cell region has a second area that is approximately the same as the first area, which corresponds to the product of the length and a second width narrower than the first width. Method.

  9C15. The method according to Item 8C15, wherein the length is about 156 mm or about 125 mm.

  10C15. The method according to Item 4C15, wherein the step of forming the first scribe line and the step of forming the second scribe line have a step of laser scribing.

  11C15. The method according to Item 4C15, wherein the steps of forming the first metallized pattern, forming the second metallized pattern, and forming the third metallized pattern have a printing step.

  12C15. The method according to Item 11C15, wherein the steps of forming the first metallized pattern, forming the second metallized pattern, and forming the third metallized pattern include screen printing. .

  13C15. The method according to Item 11C15, wherein the step of forming the first metallized pattern includes the step of forming a plurality of contact pads containing silver.

  14C15. The method according to Item 4C15, wherein the steps of forming the first metallized pattern, forming the second metallized pattern, and forming the third metallized pattern include electroplating. .

  15C15. The method according to Item 14C15, wherein the first metallized pattern, the second metallized pattern, and the third metallized pattern include copper.

  16C15. A method according to clause 4C15, wherein the first metallization pattern comprises a conductor cheaper than aluminum, tin, silver, copper and / or silver.

  17C15. The method according to Item 4C15, wherein the semiconductor wafer comprises silicon.

  18C15. The method according to Item 17C15, wherein the semiconductor wafer comprises crystalline silicon.

  19C15. The method according to Item 4C15, further comprising the step of forming a fourth metallized pattern on the second surface of the semiconductor wafer between the first outer edge and 5 mm or less of the position of the second scribe line.

  20C15. The method according to Item 4C15, wherein the first surface has a first conductivity type, and the second surface has a second conductivity type opposite to the first conductivity type.

  21C15. The method of paragraph 4C15 wherein the fourth metallization pattern comprises a contact pad.

  22C15. The method of paragraph 3C15 further comprising the step of applying a conductive adhesive to the semiconductor wafer.

  23C15. A method according to clause 22C15, further comprising the step of applying the conductive adhesive in contact with the first finger.

  24C15. The method according to item 23C15, wherein applying the conductive adhesive comprises screen printing or depositing using a mask.

  25C15. The method according to paragraph 3C15, further comprising: separating the semiconductor wafer along the first scribe line to form a first solar cell strip comprising the first metallization pattern.

  26C15. The method according to Item 25C15, wherein the step of separating includes a step of drawing a vacuum on the first scribe line.

  27C15. The method according to Item 26C15, further comprising: disposing the semiconductor wafer on the belt moving to the vacuum.

  28C15. The method of paragraph 25C15, further comprising the step of applying a conductive adhesive to the first solar cell strip.

29C15. In a first supercell comprising at least 19 solar cell strips each having a breakdown voltage of at least 10 V, with the long sides of adjacent solar cell strips overlapping the conductive adhesive disposed therebetween Placing a first solar cell strip;
26. A method according to clause 25C15, further comprising: curing the conductive adhesive to join adjacent, overlapping, electrically connected solar cell strips in series.

30C15. The disposing step includes the step of forming a layered structure including an encapsulant.
The method according to Item 29C15, further comprising the step of laminating the layered structure.

  31C15. The method according to Item 30C15, wherein the curing step occurs at least partially during the laminating step.

  32C15. The method according to Item 30C15, wherein the curing step occurs separately from the laminating step.

  33C15. The method of paragraph 30C15, wherein the encapsulant comprises a thermoplastic olefin polymer.

34C15. The method according to Item 30C15, wherein the layered structure comprises: a white backing sheet; and dark stripes on the white backing sheet.

  35C15. The method according to paragraph 29C15, wherein the disposing step comprises the step of containing the spread of the conductive adhesive by the metallized pattern feature.

  36C15. The method of paragraph 35C15, wherein the metallization pattern feature is on the front of the first solar cell strip.

  37C15. A method according to clause 29C15, further comprising the step of applying the conductive adhesive between the first supercell and an interconnect connecting the second supercell in series.

38C15. Forming a ribbon conductor between the single bypass diodes of the first supercell;
The method according to paragraph 29C15, wherein the single bypass diode is located in the first connection box of the first solar module in a mating arrangement with the second connection box of the second solar module.

39C15. The first solar cell strip includes a first chamfered corner,
The long side of the overlapping solar cell strip of the first supercell does not include the second chamfered corner,
An item according to item 29C15, wherein the width of the first solar cell strip is greater than the width of the overlapping solar cell strips such that the first solar cell strip and the overlapping solar cell strips have approximately the same area Method.

40C15. The first solar cell strip includes a first chamfered corner,
The long side of the overlapping solar cell strip of the first supercell includes a second chamfered corner,
The method according to Item 29C15, wherein the long side of the overlapping solar cell strip overlaps the long side of the first solar cell strip not including the first chamfered corner.

1C16. A first bus bar or contact pad row disposed parallel to and adjacent to the first outer edge of the silicon wafer, and a second of the silicon wafer opposite to and parallel to the first edge of the silicon wafer Obtaining or providing the silicon wafer including a front surface metallization pattern including a second bus bar or a contact pad row disposed parallel to and adjacent to the outer edge;
Separating the silicon wafer along one or more scribe lines parallel to the first outer edge and the second outer edge of the silicon wafer to form a plurality of rectangular solar cells, the first step The bus bar or the contact pad row is disposed parallel to and adjacent to the long outer edge of the first rectangular solar cell among the plurality of rectangular solar cells, and the second bus bar or the contact pad row is formed of the plurality of rectangular solar cells Parallel to and adjacent to the long outer edge of the second rectangular solar cell of
Forming a supercell by arranging the plurality of rectangular solar cells side by side in a state where the long sides of adjacent solar cells overlap and are conductively bonded to each other, and the adjacent solar cells are electrically connected in series Equipped
A method, wherein a bottom surface of an adjacent rectangular solar cell in the supercell overlaps and is conductively joined to the first bus bar or the contact pad row of the first rectangular solar cell among the plurality of rectangular solar cells.

  2C16. The second bus bar or the contact pad row on the second rectangular solar cell among the plurality of rectangular solar cells overlaps the bottom of the adjacent rectangular solar cell in the supercell and is conductively connected, as described in 1C16. the method of.

  3C16. The method according to Item 1C16, wherein the silicon wafer is a square or pseudo square silicon wafer.

  4C16. The method of paragraph 3C16, wherein the silicon wafer has sides having a length of about 125 mm, or a length of about 156 mm.

  5C16. The method of paragraph 3C16, wherein the length to width ratio of each rectangular solar cell is between about 2: 1 and about 20: 1.

  6C16. The method according to Item 1C16, wherein the silicon wafer is a crystalline silicon wafer.

  7C16. The first bus bar or contact pad row and the second bus bar or contact pad row are on the edge regions of the silicon wafer that convert light to electricity less efficiently than the central regions of the silicon wafer. The method according to paragraph 1C16, located.

  8C16. The front metallization pattern is electrically connected to the first bus bar or contact pad row, the first plurality of parallel fingers extending inwardly from the first outer edge of the silicon wafer, and the second bus bar A method according to clause 1C16, comprising a second plurality of parallel fingers extending inward from the second outer edge of the silicon wafer or electrically connected to a contact pad row.

  9C16. The front metallization pattern is oriented at least parallel to the first bus bar or contact pad row and the second bus bar or contact pad row, and the first bus bar or contact pad row and the second bus bar Or a third bus bar or contact pad row located between the contact pad row and a direction perpendicular to the third bus bar or contact pad row and electrically connected to the third bus bar or contact pad row Of the plurality of rectangular solar cells after the silicon wafer is separated to form the plurality of rectangular solar cells. Item 1 disposed parallel to and adjacent to the long outer edge of the third rectangular solar cell The method according to 16.

  10C16. A method according to clause 1C16, comprising applying a conductive adhesive to the first bus bar or contact pad row to conductively bond the first rectangular solar cell to an adjacent solar cell.

  11C16. The method of paragraph 10C16, wherein the metallization pattern comprises a barrier configured to contain the spread of the conductive adhesive.

  12C16. The method of claim 10C16, comprising applying the conductive adhesive by screen printing.

  13C16. The method of claim 10C16, comprising applying the conductive adhesive by inkjet printing.

  14C16. The method according to paragraph 10C16, wherein the conductive adhesive is applied prior to formation of the one or more scribe lines in the silicon wafer.

  15C16. In the step of separating the silicon wafer along the one or more scribe lines, a vacuum is drawn between the bottom surface and the curved support surface of the silicon wafer to bend the silicon wafer toward the curved support surface, A method according to clause 1C16, thereby cleaving the silicon wafer along the one or more scribe lines.

16C16. The silicon wafer is a quasi-square silicon wafer including a plurality of chamfered corners, and after separating the silicon wafer to form the plurality of rectangular solar cells, one or more of the rectangular solar cells The plurality includes one or more of the chamfered corners;
The distance between the scribe lines is a width perpendicular to the long axis of the rectangular solar cell including the chamfered corners, and a width perpendicular to the long axis of the rectangular solar cell having the chamfered corners. The enlargement is selected to compensate for the beveled corners, whereby each of the plurality of rectangular solar cells in the supercell is substantially exposed to light in operation of the supercell. The method according to Item 1C16, having a front surface that is the same.

  17C16. A method according to clause 1C16, comprising disposing the supercell in a layered structure between a transparent front sheet and a back sheet and laminating the layered structure.

  18C16. The step of laminating the layered structure completes the curing of the conductive adhesive disposed between the adjacent rectangular solar cells in the supercell to conductively bond the adjacent rectangular solar cells together. The method according to Item 17C16.

  19C16. The supercell is arranged in the layered structure in one of two or more parallel rows of supercells, the backsheet is a location of a gap between two or more parallel rows of the supercell and A white sheet comprising a plurality of parallel dark stripes having a position and width corresponding to a width, whereby a plurality of white portions of the backsheet are two or more of the supercells in the assembled module The method according to clause 17C16, not visible through gaps between more parallel rows.

  20C16. The method according to Item 17C16, wherein the front sheet and the back sheet are sheets of glass, and the supercell is enclosed in a thermoplastic olefin layer sandwiched between the sheets of glass.

  21C16. A method according to clause 1C16, comprising disposing the supercell in a first module comprising a junction box that is arranged to be fitted with a second junction box of a second solar module.

1D. A plurality of supercells arranged in two or more parallel rows, wherein each supercell is adjacent silicon solar cells, with the long sides of adjacent silicon solar cells overlapping and in direct conductive junction with each other A plurality of supercells, having a plurality of rectangular or substantially rectangular silicon solar cells arranged side by side with an electrical connection in series;
A first hidden tap contact pad located on the back surface of the first solar cell located at an intermediate position along the first supercell among the plurality of supercells;
A first electrical interconnect conductively bonded to the first hidden tap contact pad;
Equipped with
A solar module, wherein the first electrical interconnect comprises stress relaxation features adapted to differential thermal expansion between the interconnect and the silicon solar cell to which it is bonded.

2D. A second hidden tap contact pad located on a back surface of a second solar cell located adjacent to the first solar cell at an intermediate position along the second supercell among the plurality of supercells;
The solar module according to paragraph 1D, wherein the first hidden tap contact pad electrically connects to the second hidden tap contact pad through the first electrical interconnect.

  3D. The solar of claim 2D wherein the first electrical interconnect extends across the gap between the first supercell and the second supercell and is conductively coupled to the second hidden tap contact pad. module.

4D. A second hidden tap contact pad located on the back surface of the second solar cell located at another intermediate position along the first supercell among the plurality of supercells;
A second electrical interconnect conductively bonded to the second hidden tap contact pad;
A bypass diode electrically connected by the first electrical interconnection and the second electrical interconnection in parallel with the solar cell positioned between the first hidden tap contact pad and the second hidden tap contact pad; The solar module according to Item 1D, comprising.

5D. The first hidden tap contact pad is one of a plurality of hidden tap contact pads disposed on the back surface of the first solar cell in a row extending parallel to the long axis of the first solar cell,
The first electrical interconnect is conductively bonded to each of the plurality of hidden contacts and is substantially spread across the length of the first solar cell along the major axis. Solar module.

6D. The first hidden tap contact pad is located adjacent to a short side of the back surface of the first solar cell,
The first electrical interconnect does not extend substantially inward from the hidden tap contact pad along the long axis of the solar cell;
The solar module of paragraph 1D, wherein a back side metallization pattern on the first solar cell provides a conductive path to the interconnect having a sheet resistance less than or equal to about 5 ohms / square.

  7D. The solar module according to Item 6D, wherein the sheet resistance is less than or equal to about 2.5 ohms / square.

8D. The first interconnect includes two tabs positioned on opposite sides of the stress relief feature,
The solar module according to Item 6D, wherein one of the two tabs conductively bonds to the first hidden tap contact pad.

  9D. The solar module according to Item 8D, wherein the lengths of the two tabs are different.

  10D. The solar module of paragraph 1 D, wherein the first electrical interconnect includes alignment features that specify a desired alignment with the first hidden tap contact pad.

  11D. The solar module of paragraph 1 D, wherein the first electrical interconnect includes alignment features that specify a desired alignment with the edge of the first supercell.

  12D. The solar module according to Item 1D, which is arranged in an overlapping manner with other solar modules electrically connected in the overlapping area.

13D. A solar module,
With a glass front sheet,
With the back sheet,
A plurality of supercells arranged in two or more parallel rows between the glass front sheet and the back sheet, wherein each supercell is overlapped by the long sides of adjacent silicon solar cells A plurality of supercells, having a plurality of rectangular or substantially rectangular silicon solar cells arranged in a direct conductive connection with one another in a flexible, direct conductive connection with each other in series.
A first flexible electrical interconnect that is conductively joined to the first supercell among the plurality of supercells;
A plurality of flexible conductive junctions between overlapping solar cells may be provided between the plurality of supercells and the glass front sheet in a temperature range of about -40.degree. C. to about 100.degree. C. without damaging the solar modules. Providing mechanical compliance to the plurality of supercells that accommodates thermal expansion mismatch in a direction parallel to the two or more parallel rows, between
The strong conductive junction between the first supercell and the first flexible electrical interconnect is provided in the temperature range of about -40.degree. C. to about 180.degree. C. without damaging the solar module. Solar module adapted to flexible electrical interconnections for thermal expansion mismatch between the first supercell and the first flexible interconnections in the direction perpendicular to the two or more parallel rows .

  14D. The plurality of conductive junctions between overlapping adjacent solar cells in a supercell utilize a conductive adhesive different from the plurality of conductive junctions between the supercell and the flexible electrical interconnect. Solar module according to 13D.

  15D. The solar module according to Item 14D, wherein both conductive adhesives can be cured in the same processing step.

  16D. The solar module according to paragraph 13D, wherein the conductive bond of one side of at least one solar cell in the supercell utilizes a conductive adhesive different from the conductive bond of the other side.

  17D. The solar module according to paragraph 16D, wherein both conductive adhesives can be cured in the same processing step.

  18D. A plurality of such conductive junctions between overlapping and adjacent solar cells are adapted to differential motions greater than or equal to about 15 microns between each cell and the glass front sheet, as described in paragraph 13D. Solar module.

  19D. The plurality of conductive junctions between overlapping and adjacent solar cells may have a thickness perpendicular to the plurality of solar cells less than or equal to about 50 microns and in a direction perpendicular to the plurality of solar cells. The solar module according to paragraph 13D, wherein the thermal conductivity is greater than or equal to about 1.5 W / (meter-K).

  20D. 14. The solar module of paragraph 13D, wherein the first flexible electrical interconnect resists thermal expansion or contraction greater than or equal to about 40 microns of the first flexible interconnect.

  21D. The portion of the first flexible electrical interconnect that is conductively bonded to the supercell is in the form of a ribbon formed of copper and has a thickness in the direction perpendicular to the surface of the solar cell to which it is bonded. The solar module according to Item 13D, which is smaller than or equal to 50 microns.

  22D. The portion of the first flexible electrical interconnect that is conductively bonded to the supercell is in the form of a ribbon formed of copper and has a thickness in the direction perpendicular to the surface of the solar cell to which it is bonded. The solar module according to Item 21D, which is smaller than or equal to 30 microns.

  23D. The first flexible electrical interconnect has an integral conductive copper portion that is conductively bonded to the solar cell and provides higher conductivity than the portion of the first flexible electrical interconnect that is not bonded to the solar cell , The solar module according to item 21D.

  24D. The first flexible electrical interconnect is as described in paragraph 21D, wherein the width of the first surface of the solar cell in the direction perpendicular to the flow of current through the interconnect is greater than or equal to about 10 mm. Solar module.

  25D. The solar module according to paragraph 21D, wherein the first flexible electrical interconnect is conductively bonded to a conductor proximate to the solar cell, which provides higher conductivity than the first electrical interconnect.

  26D. The solar module according to Item 13D, which is disposed in a gauze shape overlapping with other solar modules electrically connected in the overlapping area.

27D. A plurality of supercells arranged in two or more parallel rows, wherein each supercell is adjacent silicon solar cells, with the long sides of adjacent silicon solar cells overlapping and in direct conductive junction with each other A plurality of supercells, having a plurality of rectangular or substantially rectangular silicon solar cells arranged side by side with an electrical connection in series;
A hidden tap contact pad located on the back surface of the first solar cell and conducting substantially no current in normal operation;
The first solar cell is located at an intermediate position along the first supercell of the plurality of supercells in the first of the two or more parallel rows of supercells, and the hidden tap contact pad A solar module, in electrical connection in parallel with at least a second solar cell in a second row of the two or more parallel rows of supercells.

28D. An electrical interconnect that bonds to the hidden tap contact pad and electrically interconnects the hidden tap contact pad to the second solar cell;
The electrical interconnections do not extend substantially along the length of the first solar cell,
The solar module of paragraph 27D, wherein a back side metallization pattern on the first solar cell provides a conductive path to the hidden tap contact pad having a sheet resistance less than or equal to about 5 ohms / square.

29D. The plurality of supercells are arranged in the three or more parallel rows extending across the width of the solar module perpendicular to the three or more parallel rows,
The hidden tap contact pads are electrically connected to the hidden contact pads on at least one solar cell in each of the three or more parallel rows of supercells to provide the three or more of the supercells. Electrically connect parallel rows in parallel,
Item 27D, wherein at least one bus connection to at least one of the plurality of hidden tap contact pads or to an interconnect between the plurality of hidden tap contact pads connects to a bypass diode or other electronic device Solar module described in.

30D. A flexible electrical interconnect conductively bonded to the hidden tap contact pad to electrically connect it to the second solar cell;
The portion of the flexible electrical interconnect, conductively bonded to the hidden tap contact pad, is in the form of a ribbon formed of copper and has a thickness in the direction perpendicular to the surface of the solar cell to which it is bonded. Less than or equal to 50 microns,
The conductive junction between the hidden tap contact pad and the flexible electrical interconnect may be applied to the flexible electrical interconnect at a temperature range of about -40.degree. C. to about 180.degree. C. without damaging the solar module. Enduring the thermal expansion mismatch between the first solar cell and the flexible interconnect and adapting to the relative motion between the first solar cell and the second solar cell resulting from the thermal expansion The solar module according to Item 27D.

  31D. The solar module according to Item 27D, wherein in the operation of the solar module, the first hidden contact pad can conduct a current larger than the current generated by any one of the plurality of solar cells.

  32D. The solar module according to paragraph 27D, wherein the front side of the first solar cell lying on the first hidden tap contact pad is not occupied by the contact pad or any other interconnect feature.

  33D. Item 27D, wherein no area of the first solar cell in the front of the first supercell in which the adjacent solar cells in the first supercell are not overlapped is occupied by the contact pad or any other interconnect feature Solar module described.

  34D. The solar module of paragraph 27D wherein within each supercell, most of the plurality of cells do not have a hidden tap contact pad.

  35D. The solar module according to paragraph 34D, wherein the plurality of cells having a hidden tap contact pad have a larger collection area than the plurality of cells not having a hidden tap contact pad.

  36D. The solar module according to Item 27D, which is disposed in a gauze shape overlapping with another solar module electrically connected in the overlapping area.

37D. With a glass front sheet,
With the back sheet,
A plurality of supercells arranged in two or more parallel rows between the glass front sheet and the back sheet, wherein each supercell is overlapped by the long sides of adjacent silicon solar cells A plurality of supercells, having a plurality of rectangular or substantially rectangular silicon solar cells arranged in a direct conductive connection with one another in a flexible, direct conductive connection with each other in series.
A first flexible electrical interconnect that is conductively joined to the first supercell among the plurality of supercells;
The plurality of flexible conductive junctions between overlapping solar cells are formed from the first conductive adhesive and have a stiffness less than or equal to about 800 megapascals,
The rigid conductive junction between the first supercell and the first flexible electrical interconnect is formed from a second conductive adhesive and has a rigidity greater than or equal to about 2000 megapascals, Solar module.

  38D. The solar module according to paragraph 37D, wherein unlike the first conductive adhesive and the second conductive adhesive, both conductive adhesives can be cured in the same processing step.

  39D. The plurality of conductive junctions between overlapping and adjacent solar cells may have a thickness perpendicular to the plurality of solar cells less than or equal to about 50 microns and in a direction perpendicular to the plurality of solar cells. The solar module according to Item 37D, wherein the thermal conductivity is higher than or equal to about 1.5 W / (meter-K).

  40D. The solar module according to Item 37D, which is disposed in a gauze shape overlapping with other solar modules electrically connected in the overlapping area.

1E. Comprising N (greater than or equal to about 150) rectangular or nearly rectangular silicon solar cells arranged as a plurality of supercells in two or more parallel rows,
Each supercell includes a plurality of silicon solar cells arranged side by side with the adjacent silicon solar cells electrically connected in series, with the long sides of adjacent silicon solar cells overlapping and conductively connected to each other;
A solar module, wherein the plurality of supercells are electrically connected to provide a high DC voltage higher than or equal to about 90 volts.

  2E. A solar module according to clause 1E, comprising one or more flexible electrical interconnects arranged to electrically connect the plurality of supercells in series to provide the high DC voltage.

  3E. The solar module according to Item 2E, comprising module level power electronics including an inverter that converts the high DC voltage into an AC voltage.

  4E. The solar module according to Item 3E, wherein the module level power electronics sense the high DC voltage and operate the module at an optimal current-voltage power point.

5E. A module level module electrically connected to a plurality of individual, adjacent series-connected supercell row pairs, and one or more of the plurality of supercell row pairs connected in series to provide the high DC voltage. With power electronics,
The solar module according to Item 1E, comprising: an inverter that converts the high DC voltage into an AC voltage.

  6E. The solar module according to paragraph 5E, wherein the module level power electronics sense the voltage across each individual supercell row pair and operate each individual supercell row pair at an optimal current-voltage power point.

  7E. The solar module according to paragraph 6E, wherein the module level power electronics switch out the row pair from the circuit providing the high DC voltage if the voltage across the individual supercell row pair falls below a threshold. .

8E. Module level power electronics electrically connected to each individual supercell row and electrically connecting two or more of the plurality of supercell rows in series to provide the high DC voltage;
The solar module according to Item 1E, comprising: an inverter that converts the high DC voltage into an AC voltage.

  9E. The solar module according to paragraph 8E, wherein the module level power electronics sense the voltage across each individual supercell row and operate each individual supercell row at an optimal current-voltage power point.

  10E. The solar module according to paragraph 9E, wherein the module level power electronics switch out the supercell row from the circuit providing the high DC voltage if the voltage across the individual supercell row falls below a threshold. .

11E. Module level power electronics electrically connected to each individual supercell and electrically connecting two or more of the plurality of supercells in series to provide the high DC voltage;
The solar module according to Item 1E, comprising: an inverter that converts the high DC voltage into an AC voltage.

  12E. The solar module according to paragraph 11E, wherein the module level power electronics sense the voltage across each individual supercell and operate each individual supercell at an optimal current-voltage power point.

  13E. The solar module according to paragraph 12E, wherein the module level power electronics switch out the supercell from the circuit providing the high DC voltage if the voltage on the individual supercell falls below a threshold.

14E. Each supercell is electrically segmented into multiple segments by multiple hidden taps,
Module level power electronics electrically connected to each segment of each supercell through the plurality of hidden taps and electrically connecting two or more segments in series to provide the high DC voltage;
The solar module according to Item 1E, comprising: an inverter that converts the high DC voltage into an AC voltage.

  15E. The solar module according to paragraph 14E, wherein the module level power electronics sense the voltage across each individual segment of each supercell and operate each individual segment at an optimal current-voltage power point.

  16E. The solar module according to paragraph 15E, wherein the module level power electronics switch out the segments from the circuit providing the high DC voltage if the voltage across the individual segments falls below a threshold.

  17E. The solar module according to any one of items 4E, 6E, 9E, 12E, or 15E, wherein the optimal current-voltage power point is a maximum current-voltage power point.

  18E. Item 18. The solar module according to any one of Items 3E to 17E, wherein the module level power electronics do not have a DC-DC boost component.

  19E. N is greater than or equal to about 200, greater than or equal to about 250, greater than or equal to about 300, greater than or equal to about 300, greater than or equal to about 350, greater than or equal to about 400, or about 450 Greater than or equal to, greater than about 500, or equal to, greater than about 550, or equal to, greater than about 600, or equal to, greater than about 650, or equal to, or greater than about 700 The solar module according to any one of Items 1E to 18E, or equivalent thereto.

  20E. The high DC voltage is greater than or equal to about 120 volts, greater than or equal to about 180 volts, greater than or equal to about 240 volts, greater than or equal to about 300 volts, or more than about 360 volts High or equal to, above about 420 volts or above, above about 480 volts or above, above about 540 volts or above, or above about 600 volts, or above 1E The solar module according to any one of to 19E.

21E. Two or more solar modules, with electrical connections in parallel
Equipped with an inverter and
Each solar module has N (more than or equal to about 150) rectangular or nearly rectangular silicon solar cells arranged as a plurality of supercells in two or more parallel rows,
Each supercell in each module is arranged side by side in the state in which the adjacent silicon solar cells are electrically connected in series, with the long sides of the adjacent silicon solar cells overlapping and conductively joining each other in the module. Containing two or more of the above silicon solar cells,
In each module, the plurality of supercells are electrically connected to provide a high voltage DC module output above or equal to about 90 volts,
A photovoltaic system, wherein the inverter is electrically connected to the two or more solar modules to convert their high voltage DC output into alternating current.

  22E. Each solar module is arranged to electrically connect the plurality of supercells in the solar module in series and includes one or more flexible electrical interconnects to provide a high voltage DC output of the solar module The solar power generation system as described in 21E.

23E. At least a third solar module electrically connected in series with the first solar module among the two or more solar modules electrically connected in parallel;
The third solar module has N '(number greater than or equal to about 150) rectangular or nearly rectangular silicon solar cells arranged as a plurality of supercells in two or more parallel rows ,
The supercells in the third solar module are arranged in the module in such a manner that the long sides of adjacent silicon solar cells overlap and are conductively connected to each other to electrically connect the adjacent silicon solar cells in series. Including two or more of the above silicon solar cells arranged in
21. The photovoltaic power generation system of paragraph 21E, wherein within the third solar module, the plurality of supercells are electrically connected to provide a high voltage direct current module output that is greater than or equal to about 90 volts.

24E. At least a fourth solar module electrically connected in series with a second solar module among the two or more solar modules electrically connected in parallel;
The fourth solar module has N ′ ′ (number greater than or equal to about 150) rectangular or nearly rectangular silicon solar cells arranged as a plurality of supercells in two or more parallel rows And
The supercells in the fourth solar module are arranged in the module in such a manner that the long sides of adjacent silicon solar cells overlap and are conductively connected to each other to electrically connect the adjacent silicon solar cells in series. Including two or more of the above silicon solar cells arranged in
The photovoltaic system according to paragraph 23E, wherein, within the fourth solar module, the plurality of supercells are electrically connected to provide a high voltage direct current module output that is greater than or equal to about 90 volts.

  25E. From 21E from paragraph 21E comprising a plurality of fuses arranged to prevent a short circuit occurring in any one of the two or more solar modules from dissipating the power generated by the other solar modules The solar power generation system as described in 24E.

  26E. Arranged to prevent a short circuit occurring on any one of the two or more solar modules from dissipating power generated by other solar modules of the two or more solar modules The solar power generation system according to any one of Items 21E to 25E, comprising a plurality of blocking diodes.

  27E. The solar power generation system according to any one of items 21E to 26E, including a positive electrode bus and a negative electrode bus for parallel electrical connection of the two or more solar modules and electrical connection of the inverter.

28E. A combiner box with electrical connection by separate conductors of the above two or more solar modules,
The solar power generation system according to any one of Items 21E to 26E, wherein the combiner box electrically connects the two or more solar modules in parallel.

  29E. The combiner box is a plurality of fuses arranged to prevent short circuits occurring in any one of the plurality or more of the solar modules from dissipating the power generated by the other solar modules. The photovoltaic power generation system according to Item 28E, having

  30E. The combiner box allows the short circuit occurring on any one of the two or more solar modules to dissipate the power generated by the other solar modules of the two or more solar modules The solar power generation system according to Item 28E or Item 29E, having a plurality of blocking diodes arranged to prevent the.

  31E. The inverter according to any of paragraphs 21E to 30E, wherein the inverter is configured to operate the two or more solar modules at a DC voltage higher than a minimum value set to avoid reverse biasing the module. The solar power generation system as described in a term.

  32E. A solar according to any one of paragraphs 21E to 30E, wherein the inverter is configured to recognize a reverse bias condition and operate the two or more solar modules at a voltage avoiding the reverse bias condition. Photovoltaic system.

  33E. N is greater than or equal to about 200, greater than or equal to about 250, greater than or equal to about 300, greater than or equal to about 300, greater than or equal to about 350, greater than or equal to about 400, or about 450 Greater than or equal to, greater than about 500, or equal to, greater than about 550, or equal to, greater than about 600, or equal to, greater than about 650, or equal to, or greater than about 700 The solar module according to any one of Items 21E to 32E, or equivalent thereto.

  34E. The high DC voltage is greater than or equal to about 120 volts, greater than or equal to about 180 volts, greater than or equal to about 240 volts, greater than or equal to about 300 volts, or more than about 360 volts High or equal to, higher than or equal to about 420 volts, higher than or equal to about 480 volts, higher than or equal to about 540 volts, or higher than or equal to about 600 volts. Solar module according to one of the claims 33-33.

  35E. The solar power generation system according to any one of Items 21E to 34E, which is positioned on a roof.

36E. N (greater than or equal to about 150) rectangular or nearly rectangular silicon solar cells arranged as a plurality of supercells in two or more parallel rows, wherein each supercell is adjacent Rectangular or nearly rectangular silicon solar cells, including a plurality of silicon solar cells arranged side by side with the long sides of the mating silicon solar cells overlapping and conductingly bonded to one another, with the adjacent silicon solar cells electrically connected in series A first solar module having
Equipped with an inverter and
The photovoltaic system, wherein the plurality of supercells are electrically connected to provide a high DC voltage, greater than or equal to about 90 volts, to the inverter that converts the DC to AC.

  37E. The solar power generation system according to Item 36E, wherein the inverter is a micro inverter integrated with the first solar module.

  38E. The first solar module electrically connects the plurality of supercells in the solar module in series to provide one or more flexible electrical interconnects arranged to provide a high voltage DC output of the solar module The solar power generation system according to Item 36E, including.

39E. At least a second solar module electrically connected in series with the first solar module,
The second solar module has N '(number greater than or equal to about 150) rectangular or nearly rectangular silicon solar cells arranged as a plurality of supercells in two or more parallel rows ,
The supercells in the second solar module are arranged in a state in which the adjacent silicon solar cells are electrically connected in series, with the long sides of the adjacent silicon solar cells overlapping and conductively connected to each other in the module. Including two or more of the above silicon solar cells arranged in
38. Within the second solar module, the plurality of supercells are electrically connected to provide a high voltage direct current module output higher than or equal to about 90 volts according to any of paragraphs 36E to 38E. Solar power system.

  40E. The solar module according to any one of paragraphs 36E to 39E, wherein the inverter does not have a DC-DC boost component.

  41E. N is greater than or equal to about 200, greater than or equal to about 250, greater than or equal to about 300, greater than or equal to about 300, greater than or equal to about 350, greater than or equal to about 400, or about 450 Greater than or equal to, greater than about 500, or equal to, greater than about 550, or equal to, greater than about 600, or equal to, greater than about 650, or equal to, or greater than about 700 The solar module according to any one of Items 36E to 40E, or equivalent thereto.

  42E. The high DC voltage is greater than or equal to about 120 volts, greater than or equal to about 180 volts, greater than or equal to about 240 volts, greater than or equal to about 300 volts, or more than about 360 volts High or equal to, greater than or equal to about 420 volts, higher than or equal to about 480 volts, higher than or equal to about 540 volts, or higher than or equal to about 600 volts. Solar module according to one of the claims 41-41.

43E. N (approximately greater than or equal to about 250) rectangular or near rectangular silicon solar cells arranged as a plurality of series connected supercells in two or more parallel rows, each supercell And a plurality of silicon solar cells, wherein the long sides of adjacent silicon solar cells are overlapped and directly conductively joined to each other by an electrical and thermally conductive adhesive, A rectangular or substantially rectangular silicon solar cell, which is disposed side by side in a state in which the plurality of silicon solar cells are electrically connected in series.
With less than one bypass diode per 25 solar cells,
The electrically and thermally conductive adhesive has a thickness in the direction perpendicular to the plurality of solar cells less than or equal to about 50 microns and a thermal conductivity in the direction perpendicular to the plurality of solar cells of about 50 microns. A solar module that forms a plurality of junctions between adjacent solar cells that is higher than or equal to 1.5 W / (meter-K).

  44E. The solar module according to Item 43E, wherein the plurality of supercells are enclosed in a thermoplastic olefin layer between the front sheet and the back sheet.

  45E. The solar module according to Item 43E, wherein the plurality of supercells are enclosed between a glass front sheet and a back sheet.

  46E. Less than 1 bypass diode per 30 solar cells, or less than 1 bypass diode per 50 solar cells, or less than 1 bypass diode per 100 solar cells, or only a single bypass diode The solar module according to Item 43E, which comprises or does not comprise a bypass diode.

  47E. The solar module according to paragraph 43E, comprising no bypass diode, or only a single bypass diode, or 3 or less bypass diodes, or 6 or less bypass diodes, or 10 or less bypass diodes.

  48E. The plurality of conductive junctions between overlapping solar cells may be formed between the plurality of supercells and the glass front sheet in a temperature range of about -40.degree. C. to about 100.degree. C. without damaging the solar modules. 43. The solar module according to clause 43E, providing mechanical compliance to the plurality of supercells that accommodates thermal expansion mismatches in directions parallel to the two or more parallel rows between.

  49E. N is greater than or equal to about 300, greater than or equal to about 350, or greater than or equal to about 400, or greater than or equal to about 400, or greater than or equal to about 500, or greater than or equal to about 500 The solar module according to any one of paragraphs 43E to 48E, which is greater than or equal to, greater than about 600 or equal to, greater than about 650, or equal to, or greater than about 700 .

  50E. The plurality of supercells are electrically connected such that they are higher than or equal to about 120 volts, higher than or equal to about 180 volts, higher than or equal to about 240 volts, or higher than about 300 volts Equal, higher than or equal to about 360 volts, higher than or equal to about 420 volts, higher than or equal to about 480 volts, higher than or equal to about 540 volts, or higher than about 600 volts, The solar module according to any one of Items 43E to 49E, which provides a high DC voltage equal to or equal to that.

51E. The solar module according to item 43E,
A solar energy system, comprising: an inverter configured to electrically connect to the solar module and to convert a DC output from the solar module to provide an AC output.

  52E. 52. The solar energy system of paragraph 51 E, wherein the inverter does not have a DC-DC boost component.

  53E. 52. A solar energy system according to clause 51E, wherein the inverter is configured to operate the solar module at a DC voltage higher than a minimum value set to avoid reverse biasing the solar cell.

  54E. 53. The solar energy system according to paragraph 53E, wherein the minimum voltage value is temperature dependent.

  55E. 52. The solar energy system of paragraph 51 E, wherein the inverter is configured to recognize a reverse bias condition and operate the solar module at a voltage that avoids the reverse bias condition.

  56E. 55. The solar energy system according to clause 55E, wherein the inverter is configured to operate the solar module in a maximum region of the voltage-current output curve of the solar module to avoid the reverse bias condition.

  57E. The solar energy system according to any one of paragraphs 51E to 56E, wherein the inverter is a microinverter integrated with the solar module.

1F. Advancing the solar cell wafer along the curved surface;
A vacuum is drawn between the curved surface and the bottom surface of the solar cell wafer to bend the solar cell wafer toward the curved surface, whereby the solar is along one or more previously prepared scribe lines. Cleaving a cell wafer to separate a plurality of solar cells from the solar cell wafer.

  2F. The method according to paragraph 1F, wherein the curved surface is a curved portion of the top surface of a vacuum manifold that pulls the vacuum against the bottom surface of the solar cell wafer.

  3F. The vacuum drawn against the bottom surface of the solar cell wafer by the vacuum manifold varies along the direction of movement of the solar cell wafer and is the strongest in the region of the vacuum manifold where the solar cell wafer is cleaved. , The method described in Item 2F.

  4F. Transporting the solar cell wafer by the perforated belt along the curved upper surface of the vacuum manifold, wherein the vacuum is applied to the bottom surface of the solar cell wafer through a plurality of perforations in the perforated belt The method according to Item 2F or Item 3F, comprising the steps of:

  5F. The plurality of perforations of the perforated belt are arranged such that the leading and trailing edges of the solar cell wafer along the direction of movement of the solar cell wafer lie on at least one perforation of the perforated belt , The method described in Item 4F.

  6F. The solar cell wafer is advanced along the flat region of the upper surface of the vacuum manifold to reach the transition curved region of the upper surface of the vacuum manifold having a first curvature, and then the solar cell wafer is cleaved. A step of advancing the solar cell wafer into a cleavage region of the top surface of the vacuum manifold, wherein the cleavage region of the vacuum manifold has a second curvature higher than the first curvature; The method according to any one of Items 2F to 5F.

  7F. The method according to clause 6F, wherein the curvature of the transition region is defined by a continuous geometry function of increasing curvature.

  8F. The method according to Item 7F, wherein the curvature of the cleavage region is defined by a continuous geometric function in which the curvature increases.

  9F. The method according to Item 6F, comprising: advancing the plurality of cleaved solar cells in the post-cleavage region of the vacuum manifold having a third curvature higher than the second curvature.

  10F. The method according to Item 9F, wherein the curvatures of the transition curve region, the cleavage region, and the post-cleavage region are defined by a single continuous geometric function of increasing curvature.

  11F. The method according to any one of Items 7F, 8F, or 10F, wherein the continuous geometric function that increases the curvature is a clothoid.

  12F. At one end of each scribe line, then at the opposite end of each scribe line, a stronger vacuum is drawn between the solar cell wafer and the curved surface to create a single ridge break line along each scribe line. 12. The method of any of paragraphs 1F-11F, comprising providing an asymmetric stress distribution along each scribe line to promote nucleation and propagation.

  13F. Removing the plurality of cleaved solar cells from the curved surface, the plurality of edges of the plurality of cleaved solar cells being touched prior to removal of the solar cells from the curved surface The method according to any one of Items 1F to 12F, comprising:

14F. Laser scribing the one or more scribe lines on the solar cell wafer;
Applying an electrically conductive adhesive to a portion of the top surface of the solar cell wafer prior to cleaving the solar cell wafer along the one or more scribe lines;
14. The method of any of paragraphs 1F-13F, wherein each cleaved solar cell comprises a portion of the electroconductive adhesive adhesive disposed along the cleavage edge of its top surface.

  15F. The method according to paragraph 14F, comprising laser scribing the one or more scribe lines and then applying the electrically conductive adhesive binder.

  16F. The method of paragraph 14F comprising applying the electrically conductive adhesive and then laser scribing the one or more scribe lines.

17F. A method of making a solar cell string from a plurality of cleaved solar cells manufactured by the method according to any one of items 14F to 16F,
The plurality of cleaved solar cells are a plurality of rectangular solar cells,
Arranging the plurality of rectangular solar cells side by side in a state in which the long sides of adjacent rectangular solar cells are partially overlapped with each other in a state in which a part of the electrically conductive adhesive is disposed therebetween;
Curing the electrically conductive adhesive binder, thereby joining adjacent and overlapping rectangular solar cells together and electrically connecting them in series.

  18F. The method according to any one of paragraphs 1F to 17F, wherein the solar cell wafer is a square or pseudo square silicon solar cell wafer.

1G. Forming a backside metallization pattern on each square solar cell of the one or more square solar cells;
Stencil printing a complete front metallization pattern on each square solar cell of said one or more square solar cells using a single stencil in a single stencil printing step;
Separate each square solar cell to be two or more rectangular solar cells, a plurality of rectangular solar cells each comprising a full front metallization pattern and a back metallization pattern, the one or more squares Forming from a solar cell,
Arranging the plurality of rectangular solar cells side by side in a state in which the long sides of adjacent rectangular solar cells overlap each other in the form of grit;
Conductively bonding together said rectangular solar cells contained in each pair of adjacent and overlapping rectangular solar cells with an electrically conductive bonding agent disposed therebetween, one of said rectangular solar cells contained in said pair Electrically connecting the front surface metallization pattern of the rectangular solar cell to the backside metal coverage pattern of the other rectangular solar cell of the rectangular solar cells included in the pair, whereby the plurality of rectangular solar cells are connected in series Electrically connecting to the steps of: making a solar cell string.

  2G. The portion of the stencil defining the one or more features of the front surface metallization pattern on the one or more square solar cells, the other portion of the stencil being in the plane of the stencil during stencil printing The method according to paragraph 1G, secured by physical connection to a part of

  3G. The front surface metallization pattern on each rectangular solar cell includes a plurality of fingers oriented in a direction perpendicular to the long side of the rectangular solar cell, any of the plurality of fingers in the front surface metallization pattern being The method according to paragraph 1G, wherein the front metallization patterns do not physically connect to each other.

  4G. The method of paragraph 3G wherein the plurality of fingers are about 10 microns to about 90 microns in width.

  5G. The method of paragraph 3G wherein the plurality of fingers are about 10 microns to about 50 microns in width.

  6G. The method of paragraph 3G wherein the plurality of fingers are about 10 microns to about 30 microns in width.

  7G. The method according to Item 3G, wherein the plurality of fingers have a height in the direction perpendicular to the front surface of the rectangular solar cell of about 10 microns to about 50 microns.

  8G. The method of paragraph 3G, wherein the plurality of fingers have a height in a direction perpendicular to the front surface of the rectangular solar cell of about 30 microns or greater.

  9G. The front surface metallization pattern on each rectangular solar cell includes a plurality of contact pads, each located at the end of a corresponding finger, parallel and adjacent to the long edge of the rectangular solar cell, The method according to Item 3G.

10G. The back side metallization pattern on each rectangular solar cell includes a plurality of contact pads arranged in parallel rows adjacent to the long side edge of the rectangular solar cell,
Each pair of adjacent and overlapping rectangular solar cells is one of the plurality of contact pads on the back surface on one rectangular solar cell included in the rectangular solar cell pair, and each of the plurality of contact pads on the back surface is The method of paragraph 3G, wherein the method is arranged in electrical connection with corresponding fingers in the front surface metallization pattern on the other rectangular solar cell.

11G. The back side metallization pattern on each rectangular solar cell includes bus bars extending parallel to and adjacent to the long side edge of the rectangular solar cell,
In each pair of adjacent and overlapping rectangular solar cells, the bus bar on one rectangular solar cell included in the rectangular solar cell pair is on the other rectangular solar cell of the rectangular solar cells included in the pair. The method of paragraph 3G disposed in an overlapping electrical connection with the plurality of fingers in the front side metallization pattern.

12G. The front surface metallization pattern on each rectangular solar cell includes a plurality of contact pads disposed parallel to and adjacent to the long side edge of the rectangular solar cell, each located at the end of the corresponding finger,
The back side metallization pattern on each rectangular solar cell includes a plurality of contact pads arranged in parallel rows adjacent to the long side edge of the rectangular solar cell,
Each pair of adjacent and overlapping rectangular solar cells is one of the plurality of contact pads on the back surface on one rectangular solar cell included in the rectangular solar cell pair, and each of the plurality of contact pads on the back surface is included in the pair. The method according to paragraph 3G, wherein the method is arranged in an overlapping electrical connection with corresponding contact pads in the front side metallization pattern on the other rectangular solar cell.

  13G. The rectangular solar cells included in each pair of adjacent and overlapping rectangular solar cells have discontinuities in the electrically conductive adhesive disposed between the plurality of contact pads on the overlapping front surface and the plurality of contact pads on the back surface. The method according to Item 12G, in which the conductive portions are conductively bonded to each other.

  14G. The rectangular solar cells included in each pair of adjacent and overlapping rectangular solar cells are included in the front metallization pattern of one rectangular solar cell included in the rectangular solar cell pair and in the pair of rectangular solar cells The method according to paragraph 3G, wherein the conductive junctions are joined together by discrete portions of an electrically conductive binder disposed between the overlapping ends of the plurality of fingers in the back surface metallization pattern of the other rectangular solar cell.

15G. The rectangular solar cells included in each pair of adjacent and overlapping rectangular solar cells are included in the front metallization pattern of one rectangular solar cell included in the rectangular solar cell pair and in the pair of rectangular solar cells Conductingly bond together by means of a dashed or solid electrically conductive bonding agent disposed between the overlapping ends of the plurality of fingers in the back surface metallized pattern of the other rectangular solar cell,
The method according to paragraph 3G, wherein the dashed or solid electrically conductive bonding agent electrically interconnects one or more of the plurality of fingers.

16G. The front surface metallization pattern on each rectangular solar cell includes a plurality of contact pads, each located at the end of the corresponding finger, parallel and adjacent to the long edge of the rectangular solar cell,
The rectangular solar cells included in each pair of adjacent and overlapping rectangular solar cells are the plurality of contact pads of the front surface metallization pattern of one rectangular solar cell included in the pair of rectangular solar cells, and the rectangular solar cells. The method according to paragraph 3G, wherein the conductive junctions are joined together by discrete portions of the electrically conductive binder disposed between the back side metallized pattern of the other rectangular solar cell included in the pair of cells.

17G. The front surface metallization pattern on each rectangular solar cell includes a plurality of contact pads, each located at the end of the corresponding finger, parallel and adjacent to the long edge of the rectangular solar cell,
The rectangular solar cells included in each pair of adjacent and overlapping rectangular solar cells are the plurality of contact pads of the front surface metallization pattern of one rectangular solar cell included in the pair of rectangular solar cells and the rectangular solar cells Conductingly bond together by means of a dashed or solid electrically conductive bonding agent disposed between the back side metallized pattern of the other rectangular solar cell included in the pair of cells,
The method according to paragraph 3G, wherein the dashed or solid electrically conductive bonding agent electrically interconnects one or more of the plurality of fingers.

  18G. The method according to any one of paragraphs 1G-17G, wherein the front side metallization pattern is formed from a silver paste.

1H. A method of manufacturing a plurality of solar cells,
Depositing one or more front amorphous silicon layers on the front of the crystalline silicon wafer, wherein the front amorphous silicon layers are illuminated with light in operation of the plurality of solar cells;
Depositing one or more backside amorphous silicon layers on the backside of the crystalline silicon wafer opposite the front side of the crystalline silicon wafer;
Patterning the one or more front amorphous silicon layers to form one or more front trenches in the one or more front amorphous silicon layers;
Depositing a front passivation layer on the one or more front amorphous silicon layers and in the one or more front trenches;
Patterning the one or more backside amorphous silicon layers to form one or more backside trenches in the one or more backside amorphous silicon layers, each of the one or more backside trenches being , Formed side by side with a corresponding one of the one or more front trenches.
Depositing a backside passivation layer on the one or more backside amorphous silicon layers and in the one or more backside trenches;
Cleaving the crystalline silicon wafer at one or more cleavage planes, each cleavage plane being centered or substantially centered on a different pair of corresponding front and back trenches; A method comprising.

  2H. The method according to paragraph 1H, comprising forming the one or more front trenches and penetrating the front amorphous silicon layer to reach the front of the crystalline silicon wafer.

  3H. The method according to paragraph 1H, comprising forming the one or more back side trenches and penetrating the one or more back side amorphous silicon layers to reach the back side of the crystalline silicon wafer.

  4H. The method according to paragraph 1H, comprising forming the front passivating layer and the back passivating layer from a transparent conductive oxide.

  5H. The method according to paragraph 1H, wherein a laser is used to cause thermal stress in the crystalline silicon wafer to cleave the crystalline silicon wafer at the one or more cleavage planes.

  6H. The method according to Item 1H, comprising mechanically cleaving the crystalline silicon wafer at the one or more cleavage planes.

  7H. The method according to Item 1H, wherein the one or more front amorphous crystalline silicon layers form an np junction with the crystalline silicon wafer.

  8H. The method according to Item 7H, comprising cleaving the crystalline silicon wafer from the back side.

  9H. The method according to Item 1H, wherein the one or more backside amorphous crystalline silicon layers form an np junction with the crystalline silicon wafer.

  10H. The method according to Item 9H, comprising cleaving the crystalline silicon wafer from its front side.

11H. A method of manufacturing a plurality of solar cells,
Forming one or more trenches in the first surface of the crystalline silicon wafer;
Depositing one or more amorphous silicon layers on the first surface of the crystalline silicon wafer;
Depositing a passivation layer in the one or more trenches on the first surface of the crystalline silicon wafer and on the one or more amorphous silicon layers;
Depositing one or more amorphous silicon layers on a second surface of the crystalline silicon wafer opposite the first surface of the crystalline silicon wafer;
Cleaving the crystalline silicon wafer at one or more cleavage planes, each cleavage plane being centered or substantially centered on a different one of the one or more trenches And how to provide.

  12H. The method according to paragraph 11H, comprising forming the passivating layer from a transparent conductive oxide.

  13H. The method according to paragraph 11H, comprising using a laser to cause thermal stress in the crystalline silicon wafer to cleave the crystalline silicon wafer at the one or more cleavage planes.

  14H. The method according to paragraph 11H, comprising mechanically cleaving the crystalline silicon wafer at the one or more cleavage planes.

  15H. The method according to paragraph 11H, wherein the one or more amorphous crystalline silicon layers of the first surface form an np junction with the crystalline silicon wafer.

  16H. The method according to paragraph 11H, wherein the one or more amorphous crystalline silicon layers of the second surface form an np junction with the crystalline silicon wafer.

  17H. The method according to paragraph 11H, wherein the first surface of the crystalline silicon wafer is to be illuminated by light during operation of the plurality of solar cells.

  18H. The method according to paragraph 11H, wherein the second surface of the crystalline silicon wafer is to be illuminated by light during operation of the plurality of solar cells.

19H. A plurality of solar cells each having a plurality of solar cells arranged side by side with their adjacent solar cells being electrically connected in series, with the ends of the adjacent solar cells overlapping each other in a rasp-like manner and conducting junctions. Equipped with a supercell,
Each solar cell is
A crystalline silicon substrate,
One or more first surface amorphous silicon layers disposed on the first surface of the crystalline silicon substrate to form an np junction;
One or more second surface amorphous silicon layers disposed on the second surface of the crystalline silicon substrate opposite to the first surface of the crystalline silicon substrate;
The edge of the one or more first surface amorphous silicon layers, or the edge of the one or more second surface amorphous silicon layers, or the edge of the one or more first surface amorphous silicon layers and the one or more A solar panel comprising: a plurality of passivated layers to prevent carrier recombination at the edge of the second surface amorphous silicon layer.

  20H. The solar panel according to Item 19H, wherein the plurality of passivated layers include a transparent conductive oxide.

  21 H. The plurality of supercells are arranged in a single row, or in two or more parallel rows, to be illuminated by solar radiation during operation of the solar panel. The solar panel according to Item 19H, which forms

Z1. A solar module,
N (approximately greater than or equal to about 250) rectangular or near rectangular silicon solar cells arranged as a plurality of series connected supercells in two or more parallel rows, each supercell And a plurality of silicon solar cells, wherein the long sides of adjacent silicon solar cells are overlapped and directly conductively joined to each other by an electrical and thermally conductive adhesive, A rectangular or substantially rectangular silicon solar cell, which is disposed side by side in a state in which the plurality of silicon solar cells are electrically connected in series.
And one or more bypass diodes,
Each pair of adjacent parallel rows in the solar module conductively bonds to the back surface electrical contact on the solar cell centrally located in one row included in the pair, and in the other row included in the pair Electrically connected by means of a bypass diode which is conductively joined to the back side electrical contact on the adjacent solar cell
Solar module.

  Z2. Each pair of adjacent parallel rows conductively bonds to the back surface electrical contacts on the solar cells in one row included in the pair and back surface electrical contacts on the adjacent solar cells in the other row included in the pair The solar module according to Item Z1, electrically connected by at least one other bypass diode conductively joined to the part.

  Z3. Each pair of adjacent parallel rows conductively bonds to the back surface electrical contacts on the solar cells in one row included in the pair and back surface electrical contacts on the adjacent solar cells in the other row included in the pair The solar module according to Item Z2, electrically connected by at least one other bypass diode conductively joined to the part.

  Z4. The electrical and thermal conductive adhesive has a thickness in the direction perpendicular to the plurality of solar cells less than or equal to about 50 microns, and a thermal conductivity in the direction perpendicular to the plurality of solar cells is about equal. The solar module according to Item Z1, forming a plurality of junctions between adjacent solar cells higher than or equal to 1.5 W / (meter-K).

  Z5. The solar module according to Item Z1, wherein the plurality of supercells are enclosed in a thermoplastic olefin layer between a glass front sheet and a back sheet.

  Z6. The plurality of conductive junctions between overlapping solar cells may be combined with the plurality of supercells and the glass front sheet in a temperature range of about -40 ° C to about 100 ° C without damaging the solar modules. The solar module according to clause Z1, providing mechanical compliance to the plurality of supercells that accommodates thermal expansion mismatch in a direction parallel to the two or more parallel rows between.

  Z7. N is greater than or equal to about 300, greater than or equal to about 350, or greater than or equal to about 400, or greater than or equal to about 400, or greater than or equal to about 500, or greater than or equal to about 500 Solar module according to any one of the claims Z1 to Z6, which is greater than or equal to, greater than about 600 or equal to, greater than about 650 or equal to, or greater than about 700 or equal to .

  Z8. The plurality of supercells are electrically connected such that they are higher than or equal to about 120 volts, higher than or equal to about 180 volts, higher than or equal to about 240 volts, or higher than about 300 volts Equal, higher than or equal to about 360 volts, higher than or equal to about 420 volts, higher than or equal to about 480 volts, higher than or equal to about 540 volts, or higher than about 600 volts, The solar module according to any one of Items Z1 to Z7, which provides a high DC voltage equal to or equal to that.

Z9. A solar module according to item Z1;
A solar energy system, comprising: an inverter configured to electrically connect to the solar module and to convert a DC output from the solar module to provide an AC output.

  Z10. The solar energy system according to Item Z9, wherein the inverter does not have a DC-DC boost component.

  Z11. The solar energy system according to clause Z9, wherein the inverter is configured to operate the solar module at a DC voltage higher than a minimum value set to avoid reverse biasing the solar cell.

  Z12. The solar energy system according to Item Z11, wherein the minimum voltage value is temperature dependent.

  Z13. The solar energy system according to clause Z9, wherein the inverter is configured to recognize a reverse bias condition and operate the solar module at a voltage that avoids the reverse bias condition.

  Z14. The solar energy system according to Item Z13, wherein the inverter is configured to operate the solar module in a maximum region of a voltage-current output curve of the solar module to avoid the reverse bias state.

  Z15. The solar energy system according to any one of items Z9 to Z14, wherein the inverter is a micro inverter integrated with the solar module.

The present disclosure is illustrative and not limiting. Further modifications will become apparent to one skilled in the art in view of the present disclosure, which are intended to be included within the scope of the appended claims.
[Item 1]
A plurality of supercells arranged in two or more parallel rows, wherein each supercell is adjacent silicon solar cells, with the long sides of adjacent silicon solar cells overlapping and in direct conductive junction with each other A plurality of supercells, having a plurality of rectangular or substantially rectangular silicon solar cells arranged side by side with an electrical connection in series;
A hidden tap contact pad located on the back surface of the first solar cell and conducting substantially no current in normal operation
Equipped with
The first solar cell is located at an intermediate position along the first supercell of the plurality of supercells in the first of the two or more parallel rows of supercells, and the hidden tap contact pad A solar module, in electrical connection in parallel with at least a second solar cell in a second row of the two or more parallel rows of supercells.
[Item 2]
An electrical interconnect that bonds to the hidden tap contact pad and electrically interconnects the hidden tap contact pad to the second solar cell;
The electrical interconnections do not extend substantially along the length of the first solar cell,
The solar module of claim 1, wherein a back surface metallization pattern on the first solar cell provides a conductive path to the hidden tap contact pad having a sheet resistance less than or equal to about 5 ohms / square.
[Item 3]
The plurality of supercells are arranged in the three or more parallel rows extending across the width of the solar module perpendicular to the three or more parallel rows,
The hidden tap contact pads are electrically connected to the hidden contact pads on at least one solar cell in each of the three or more parallel rows of supercells to provide the three or more of the supercells. Electrically connect parallel rows in parallel,
At least one bus connection to at least one of the plurality of hidden tap contact pads or to an interconnect between the plurality of hidden tap contact pads connects to a bypass diode or other electronic device Solar module described in.
[Item 4]
A flexible electrical interconnect conductively bonded to the hidden tap contact pad to electrically connect it to the second solar cell;
The portion of the flexible electrical interconnect, conductively bonded to the hidden tap contact pad, is in the form of a ribbon formed of copper and has a thickness in the direction perpendicular to the surface of the solar cell to which it is bonded. Less than or equal to 50 microns,
The conductive junction between the hidden tap contact pad and the flexible electrical interconnect may be applied to the flexible electrical interconnect at a temperature range of about -40.degree. C. to about 180.degree. C. without damaging the solar module. Enduring the thermal expansion mismatch between the first solar cell and the flexible interconnect and adapting to the relative motion between the first solar cell and the second solar cell resulting from the thermal expansion , The solar module according to item 1.
[Item 5]
The solar module according to claim 1, wherein in the operation of the solar module, the first hidden contact pad can conduct a current larger than a current generated by any one of the plurality of solar cells.
[Item 6]
2. A solar module according to item 1, wherein the front side of the first solar cell lying on the first hidden tap contact pad is not occupied by the contact pad or any other interconnect feature.
[Item 7]
Item 1. In item 1 of the first solar cell, where no area of the front surface in the first supercell where some of the adjacent solar cells do not overlap is occupied by a contact pad or any other interconnect feature Solar module described.
[Item 8]
The solar module of claim 1, wherein within each supercell, most of the plurality of cells do not have a hidden tap contact pad.
[Item 9]
9. A solar module according to item 8, wherein the plurality of cells having a hidden tap contact pad have a larger collection area than the plurality of cells not having a hidden tap contact pad.
[Item 10]
2. A solar module according to item 1, which is arranged in the form of a garnish overlapping with another solar module to which the electrical connection is made in the overlapping area.
[Item 11]
A solar module,
With a glass front sheet,
With the back sheet,
A plurality of supercells disposed in two or more parallel rows between the glass front sheet and the back sheet, each having a plurality of rectangular or substantially rectangular silicon solar cells, the plurality of supercells Rectangular or substantially rectangular silicon solar cells are arranged side by side in a state in which the adjacent silicon solar cells are electrically connected in series, with the long sides of the adjacent silicon solar cells overlapping and flexible conductively directly bonded to each other. With multiple supercells,
And a first flexible electrical interconnect that is conductively joined to the first supercell among the plurality of supercells.
Equipped with
A plurality of flexible conductive junctions between overlapping solar cells may be provided between the plurality of supercells and the glass front sheet in a temperature range of about -40.degree. C. to about 100.degree. C. without damaging the solar modules. Providing mechanical compliance to the plurality of supercells that accommodates thermal expansion mismatch in a direction parallel to the two or more parallel rows, between
The strong conductive junction between the first supercell and the first flexible electrical interconnect is provided in the temperature range of about -40.degree. C. to about 180.degree. C. without damaging the solar module. Solar module adapted to flexible electrical interconnections for thermal expansion mismatch between the first supercell and the first flexible interconnections in the direction perpendicular to the two or more parallel rows .
[Item 12]
A plurality of said conductive junctions between overlapping adjacent solar cells in a supercell utilizing a different conductive adhesive than said plurality of conductive junctions between said supercell and said flexible electrical interconnect The solar module as described in 11.
[Item 13]
13. A solar module according to item 12, wherein both conductive adhesives can be cured in the same process step.
[Item 14]
12. A solar module according to item 11, wherein the conductive bond of one side of at least one solar cell in the supercell utilizes a conductive adhesive different from the conductive bond of the other side.
[Item 15]
15. A solar module according to item 14, wherein both conductive adhesives can be cured in the same process step.
[Item 16]
12. The plurality of conductive junctions between overlapping adjacent solar cells are adapted for differential motion greater than or equal to about 15 microns between each cell and the glass front sheet. Solar module.
[Item 17]
The plurality of conductive junctions between overlapping and adjacent solar cells may have a thickness perpendicular to the plurality of solar cells less than or equal to about 50 microns and in a direction perpendicular to the plurality of solar cells. 12. A solar module according to item 11, wherein the thermal conductivity is greater than or equal to about 1.5 W / (meter-K).
[Item 18]
12. A solar module according to item 11, wherein the first flexible electrical interconnect resists thermal expansion or contraction of the first flexible interconnect greater than or equal to about 40 microns.
[Item 19]
The portion of the first flexible electrical interconnect that is conductively bonded to the supercell is in the form of a ribbon formed of copper and has a thickness in the direction perpendicular to the surface of the solar cell to which it is bonded. 12. A solar module according to item 11, smaller than or equal to 50 microns.
[Item 20]
The portion of the first flexible electrical interconnect that is conductively bonded to the supercell is in the form of a ribbon formed of copper and has a thickness in the direction perpendicular to the surface of the solar cell to which it is bonded. The solar module according to item 19, which is smaller than or equal to 30 microns.
[Item 21]
The first flexible electrical interconnect has an integral conductive copper portion that is conductively bonded to the solar cell and provides higher conductivity than the portion of the first flexible electrical interconnect that is not bonded to the solar cell , The solar module according to item 19.
[Item 22]
20. The first flexible electrical interconnect according to claim 19, wherein the width in the direction perpendicular to the flow of current through the interconnect is greater than or equal to about 10 mm in the plane of the surface of the solar cell. Solar module.
[Item 23]
20. The solar module according to item 19, wherein the first flexible electrical interconnect is conductively bonded to a conductor proximate to the solar cell, providing higher conductivity than the first electrical interconnect.
[Item 24]
Item 12. The solar module according to item 11, which is arranged in the form of a pile overlapping with the other solar modules to which it is electrically connected in the overlapping area.
[Item 25]
With a glass front sheet,
With the back sheet,
A plurality of supercells disposed in two or more parallel rows between the glass front sheet and the back sheet, each having a plurality of rectangular or substantially rectangular silicon solar cells, the plurality of supercells Rectangular or substantially rectangular silicon solar cells are arranged side by side in a state in which the adjacent silicon solar cells are electrically connected in series, with the long sides of the adjacent silicon solar cells overlapping and flexible conductively directly bonded to each other. With multiple supercells,
And a first flexible electrical interconnect that is conductively joined to the first supercell among the plurality of supercells.
Equipped with
The plurality of flexible conductive junctions between overlapping solar cells are formed from the first conductive adhesive and have a stiffness less than or equal to about 800 megapascals,
The rigid conductive junction between the first supercell and the first flexible electrical interconnect is formed from a second conductive adhesive and has a rigidity greater than or equal to about 2000 megapascals, Solar module.
[Item 26]
26. A solar module according to item 25, wherein unlike the first conductive adhesive and the second conductive adhesive, both conductive adhesives can be cured in the same processing step.
[Item 27]
The plurality of conductive junctions between overlapping and adjacent solar cells may have a thickness perpendicular to the plurality of solar cells less than or equal to about 50 microns and in a direction perpendicular to the plurality of solar cells. 26. The solar module according to item 25, wherein the thermal conductivity is greater than or equal to about 1.5 W / (meter-K).
[Item 28]
26. A solar module according to item 25, which is arranged in the form of a garnish overlapping with another solar module to which the electrical connection is made in the overlapping area.
[Item 29]
A first bus bar or contact pad row disposed parallel to and adjacent to the first outer edge of the silicon wafer, and a second of the silicon wafer opposite to and parallel to the first edge of the silicon wafer Obtaining or providing the silicon wafer including a front surface metallization pattern including a second bus bar or a contact pad row disposed parallel to and adjacent to the outer edge;
Separating the silicon wafer along one or more scribe lines parallel to the first outer edge and the second outer edge of the silicon wafer to form a plurality of rectangular solar cells, the first step The bus bar or the contact pad row is disposed parallel to and adjacent to the long outer edge of the first rectangular solar cell among the plurality of rectangular solar cells, and the second bus bar or the contact pad row is formed of the plurality of rectangular solar cells Parallel to and adjacent to the long outer edge of the second rectangular solar cell of
Forming a supercell by arranging the plurality of rectangular solar cells such that the long sides of adjacent solar cells overlap and conductively bond each other, and the adjacent solar cells are electrically connected in series;
Equipped with
And a bottom surface of the adjacent rectangular solar cell in the supercell overlaps and is conductively joined to the first bus bar or the contact pad row on the first rectangular solar cell among the plurality of rectangular solar cells.
[Item 30]
The second bus bar or the contact pad row on the second rectangular solar cell of the plurality of rectangular solar cells, the bottom of the adjacent rectangular solar cell in the supercell overlaps and is conductively bonded. the method of.
[Item 31]
30. A method according to item 29, wherein the silicon wafer is a square or pseudo square silicon wafer.
[Item 32]
31. The method according to item 31, wherein the silicon wafer has sides having a length of about 125 mm, or a length of about 156 mm.
[Item 33]
31. The method according to item 31, wherein the length to width ratio of each rectangular solar cell is between about 2: 1 and about 20: 1.
[Item 34]
30. A method according to item 29, wherein the silicon wafer is a crystalline silicon wafer.
[Item 35]
The first bus bar or contact pad row and the second bus bar or contact pad row are on the edge regions of the silicon wafer that convert light to electricity less efficiently than the central regions of the silicon wafer. The method according to item 29, located.
[Item 36]
The front metallization pattern is electrically connected to the first bus bar or contact pad row, the first plurality of parallel fingers extending inwardly from the first outer edge of the silicon wafer, and the second bus bar A method according to claim 29, comprising a second plurality of parallel fingers extending inward from the second outer edge of the silicon wafer or electrically connected to a contact pad row.
[Item 37]
The front metallization pattern is oriented at least parallel to the first bus bar or contact pad row and the second bus bar or contact pad row, and the first bus bar or contact pad row and the second bus bar Or a third bus bar or contact pad row located between the contact pad row and the third bus bar or contact pad row oriented in a direction perpendicular to the third bus bar or contact pad row The third busbar or contact pad row comprising the third plurality of parallel fingers to be connected, the plurality of rectangular solar cells after the silicon wafer is separated to form the plurality of rectangular solar cells. The term parallel to, and adjacent to, the long outer edge of the third rectangular solar cell The method according to 29.
[Item 38]
30. A method according to item 29, comprising applying a conductive adhesive to the first bus bar or contact pad row to conductively bond the first rectangular solar cell to an adjacent solar cell.
[Item 39]
39. The method of claim 38, wherein the metallization pattern comprises a barrier configured to contain the spread of the conductive adhesive.
[Item 40]
39. A method according to item 38, comprising the step of applying the conductive adhesive by screen printing.
[Item 41]
39. A method according to item 38, comprising applying the conductive adhesive by ink jet printing.
[Item 42]
39. The method of item 38, wherein the conductive adhesive is applied prior to formation of the one or more scribe lines in the silicon wafer.
[Item 43]
In the step of separating the silicon wafer along the one or more scribe lines, a vacuum is drawn between the bottom surface and the curved support surface of the silicon wafer to bend the silicon wafer toward the curved support surface, A method according to item 29, thereby cleaving the silicon wafer along the one or more scribe lines.
[Item 44]
The silicon wafer is a quasi-square silicon wafer including a plurality of chamfered corners, and after separating the silicon wafer to form the plurality of rectangular solar cells, one or more of the rectangular solar cells The plurality includes one or more of the chamfered corners;
The distance between the scribe lines is a width perpendicular to the long axis of the rectangular solar cell including the chamfered corners, and a width perpendicular to the long axis of the rectangular solar cell having the chamfered corners. The enlargement is selected to compensate for the beveled corners, whereby each of the plurality of rectangular solar cells in the supercell is substantially exposed to light in operation of the supercell. 30. A method according to item 29, having the same front side.
[Item 45]
30. A method according to item 29, comprising disposing the supercell in a layered structure between a transparent front sheet and a back sheet and laminating the layered structure.
[Item 46]
The step of laminating the layered structure completes the curing of the conductive adhesive disposed between the adjacent rectangular solar cells in the supercell to conductively bond the adjacent rectangular solar cells together. The method according to item 45.
[Item 47]
The supercell is arranged in the layered structure in one of two or more parallel rows of supercells, the backsheet is a location of a gap between two or more parallel rows of the supercell and A white sheet comprising a plurality of parallel dark stripes having a position and width corresponding to a width, whereby a plurality of white portions of the backsheet are two or more of the supercells in the assembled module 46. A method according to item 45, not visible through the gap between more parallel rows.
[Item 48]
46. A method according to item 45, wherein the front and back sheets are sheets of glass and the supercell is enclosed in a layer of thermoplastic olefin sandwiched between the sheets of glass.
[Item 49]
30. A method according to item 29, comprising the step of disposing the supercell in a first module comprising a junction box that is arranged to be fitted with a second junction box of a second solar module.
[Item 50]
Advancing the solar cell wafer along the curved surface;
A vacuum is drawn between the curved surface and the bottom surface of the solar cell wafer to bend the solar cell wafer toward the curved surface, whereby the solar is along one or more previously prepared scribe lines. Cleaving a battery wafer to separate a plurality of solar cells from the solar cell wafer;
A method of manufacturing a solar cell, comprising:
[Item 51]
51. The method according to item 50, wherein the curved surface is a curved portion of the top surface of a vacuum manifold that draws the vacuum against the bottom surface of the solar cell wafer.
[Item 52]
The vacuum drawn against the bottom surface of the solar cell wafer by the vacuum manifold varies along the direction of movement of the solar cell wafer and is the strongest in the region of the vacuum manifold where the solar cell wafer is cleaved. , Method according to item 50.
[Item 53]
Transporting the solar cell wafer by the perforated belt along the curved upper surface of the vacuum manifold, wherein the vacuum is applied to the bottom surface of the solar cell wafer through a plurality of perforations in the perforated belt 52. A method according to item 51 or 52, comprising the steps of:
[Item 54]
The plurality of perforations of the perforated belt are arranged such that the leading and trailing edges of the solar cell wafer along the direction of movement of the solar cell wafer lie on at least one perforation of the perforated belt , Method according to item 53.
[Item 55]
The solar cell wafer is advanced along the flat region of the upper surface of the vacuum manifold to reach the transition curved region of the upper surface of the vacuum manifold having a first curvature, and then the solar cell wafer is cleaved. A step of advancing the solar cell wafer into a cleavage region of the top surface of the vacuum manifold, wherein the cleavage region of the vacuum manifold has a second curvature higher than the first curvature; 54. A method according to any one of items 50 to 54.
[Item 56]
56. A method according to item 55, wherein the curvature of the transition area is defined by a continuous geometry function of increasing curvature.
[Item 57]
57. A method according to item 56, wherein the curvature of the cleave region is defined by a continuous geometry function of increasing curvature.
[Item 58]
58. A method according to item 57, comprising advancing the plurality of cleaved solar cells into a post-cleavage region of the vacuum manifold having a third curvature higher than the second curvature.
[Item 59]
58. A method according to item 57, wherein the curvatures of the transition curve region, the cleavage region and the post-cleavage region are defined by a single continuous geometric function of increasing curvature.
[Item 60]
The method according to Item 57, 58 or 59, wherein the continuous geometric function with increasing curvature is a clothoid.
[Item 61]
At one end of each scribe line, then at the opposite end of each scribe line, a stronger vacuum is drawn between the solar cell wafer and the curved surface to create a single ridge break line along each scribe line. 61. A method according to any one of items 50 to 60, comprising the step of providing an asymmetric stress distribution along each scribe line to promote nucleation and propagation.
[Item 62]
Removing the plurality of cleaved solar cells from the curved surface, the plurality of edges of the plurality of cleaved solar cells being touched prior to removal of the solar cells from the curved surface 61. A method according to any one of items 50 to 61, comprising the step of:
[Item 63]
Laser scribing the one or more scribe lines on the solar cell wafer;
Applying an electrically conductive adhesive to a portion of the top surface of the solar cell wafer prior to cleaving the solar cell wafer along the one or more scribe lines;
Equipped
63. A method according to any one of items 50 to 62, wherein each cleaved solar cell comprises a portion of the electroconductive adhesive binder disposed along the cleavage edge of its top surface.
[Item 64]
64. A method according to item 63, comprising laser scribing the one or more scribe lines and then applying the electrically conductive adhesive binder.
[Item 65]
59. A method according to item 64, comprising applying the electrically conductive adhesive and then laser scribing the one or more scribe lines.
[Item 66]
A method of making a solar cell string from a plurality of cleaved solar cells manufactured by the method according to any one of items 63 to 65, wherein
The plurality of cleaved solar cells are a plurality of rectangular solar cells,
Arranging the plurality of rectangular solar cells side by side in a state in which the long sides of adjacent rectangular solar cells are partially overlapped with each other in a state in which a part of the electrically conductive adhesive is disposed therebetween;
Curing the electrically conductive adhesive, thereby joining adjacent and overlapping rectangular solar cells together and electrically connecting them in series
A method comprising.
[Item 67]
61. The method according to any one of items 50 to 66, wherein the solar cell wafer is a square or pseudo square silicon solar cell wafer.
[Item 68]
Forming a backside metallization pattern on each square solar cell of the one or more square solar cells;
Stencil printing a complete front metallization pattern on each square solar cell of said one or more square solar cells using a single stencil in a single stencil printing step;
Separate each square solar cell to be two or more rectangular solar cells, a plurality of rectangular solar cells each comprising a full front metallization pattern and a back metallization pattern, the one or more squares Forming from a solar cell,
Arranging the plurality of rectangular solar cells side by side in a state in which the long sides of adjacent rectangular solar cells overlap each other in the form of grit;
Conductively bonding together said rectangular solar cells contained in each pair of adjacent and overlapping rectangular solar cells with an electrically conductive bonding agent disposed therebetween, one of said rectangular solar cells contained in said pair Electrically connecting the front surface metallization pattern of the rectangular solar cell to the backside metal coverage pattern of the other rectangular solar cell of the rectangular solar cells included in the pair, whereby the plurality of rectangular solar cells are connected in series Electrical connection to the process and
A method of making a solar cell string comprising:
[Item 69]
The portion of the stencil defining the one or more features of the front surface metallization pattern on the one or more square solar cells, the other portion of the stencil being in the plane of the stencil during stencil printing 70. A method according to item 68, secured by physical connection to a part of.
[Item 70]
The front surface metallization pattern on each rectangular solar cell includes a plurality of fingers oriented in a direction perpendicular to the long side of the rectangular solar cell, any of the plurality of fingers in the front surface metallization pattern being 79. A method according to item 68, not physically connected to each other by said front side metallization pattern.
[Item 71]
91. The method of paragraph 68, wherein the plurality of fingers are about 10 microns to about 90 microns in width.
[Item 72]
91. The method of paragraph 68, wherein the plurality of fingers are about 10 microns to about 50 microns in width.
[Item 73]
91. The method of paragraph 68, wherein the plurality of fingers are about 10 microns to about 30 microns in width.
[Item 74]
79. The method of paragraph 68, wherein the plurality of fingers has a height in a direction perpendicular to the front surface of the rectangular solar cell of about 10 microns to about 50 microns.
[Item 75]
70. The method of paragraph 68, wherein the plurality of fingers has a height in a direction perpendicular to the front surface of the rectangular solar cell of about 30 microns or greater.
[Item 76]
The front surface metallization pattern on each rectangular solar cell includes a plurality of contact pads, each located at the end of a corresponding finger, parallel and adjacent to the long edge of the rectangular solar cell, The method according to Item 68.
[Item 77]
The back side metallization pattern on each rectangular solar cell includes a plurality of contact pads arranged in parallel rows adjacent to the long side edge of the rectangular solar cell,
Each pair of adjacent and overlapping rectangular solar cells is one of the plurality of contact pads on the back surface on one rectangular solar cell included in the rectangular solar cell pair, and each of the plurality of contact pads on the back surface is included in the pair. 91. A method according to item 68, arranged in aligned and in electrical connection with corresponding fingers in the front surface metallization pattern on the other rectangular solar cell.
[Item 78]
The back side metallization pattern on each rectangular solar cell includes bus bars extending parallel to and adjacent to the long side edge of the rectangular solar cell,
In each pair of adjacent and overlapping rectangular solar cells, the bus bar on one rectangular solar cell included in the rectangular solar cell pair is on the other rectangular solar cell of the rectangular solar cells included in the pair. 91. The method of paragraph 68, wherein the plurality of fingers in the front surface metallization pattern are disposed in an overlapping electrical connection.
[Item 79]
The front surface metallization pattern on each rectangular solar cell includes a plurality of contact pads disposed parallel to and adjacent to the long side edge of the rectangular solar cell, each located at the end of the corresponding finger,
The back side metallization pattern on each rectangular solar cell includes a plurality of contact pads arranged in parallel rows adjacent to the long side edge of the rectangular solar cell,
Each pair of adjacent and overlapping rectangular solar cells is one of the plurality of contact pads on the back surface on one rectangular solar cell included in the rectangular solar cell pair, and each of the plurality of contact pads on the back surface is included in the pair. 79. A method according to item 68, arranged overlapping and in electrical contact with corresponding contact pads in the front side metallization pattern on the other rectangular solar cell.
[Item 80]
The rectangular solar cells included in each pair of adjacent and overlapping rectangular solar cells have discontinuities in the electrically conductive adhesive disposed between the plurality of contact pads on the overlapping front surface and the plurality of contact pads on the back surface. 91. A method according to item 68, in which the conductive parts are in conductive junction with one another.
[Item 81]
The rectangular solar cells included in each pair of adjacent and overlapping rectangular solar cells are included in the front metallization pattern of one rectangular solar cell included in the rectangular solar cell pair and in the pair of rectangular solar cells 91. A method according to item 68, wherein the conductive junctions are conducted to one another by discrete portions of an electrically conductive binder disposed between the overlapping ends of the plurality of fingers in the back surface metallization pattern of the other rectangular solar cell.
[Item 82]
The rectangular solar cells included in each pair of adjacent and overlapping rectangular solar cells are included in the front metallization pattern of one rectangular solar cell included in the rectangular solar cell pair and in the pair of rectangular solar cells Conductingly bond together by means of a dashed or solid electrically conductive bonding agent disposed between the overlapping ends of the plurality of fingers in the back surface metallized pattern of the other rectangular solar cell,
79. A method according to item 68, wherein the dashed or solid electrically conductive bonding agent electrically interconnects one or more of the plurality of fingers.
[Item 83]
The front surface metallization pattern on each rectangular solar cell includes a plurality of contact pads, each located at the end of the corresponding finger, parallel and adjacent to the long edge of the rectangular solar cell,
The rectangular solar cells included in each pair of adjacent and overlapping rectangular solar cells are the plurality of contact pads of the front surface metallization pattern of one rectangular solar cell included in the pair of rectangular solar cells, and the rectangular solar cells. 79. A method according to item 68, which is conductively bonded to one another by discrete portions of an electrically conductive binder disposed between the back surface metallized pattern of the other rectangular solar cell included in the cell pair.
[Item 84]
The front surface metallization pattern on each rectangular solar cell includes a plurality of contact pads, each located at the end of the corresponding finger, parallel and adjacent to the long edge of the rectangular solar cell,
The rectangular solar cells included in each pair of adjacent and overlapping rectangular solar cells are the plurality of contact pads of the front surface metallization pattern of one rectangular solar cell included in the pair of rectangular solar cells, and the rectangular solar cells Conductingly bond together by means of a dashed or solid electrically conductive bonding agent disposed between the back side metallized pattern of the other rectangular solar cell included in the pair of cells,
79. A method according to item 68, wherein the dashed or solid electrically conductive bonding agent electrically interconnects one or more of the plurality of fingers.
[Item 85]
89. A method according to any of items 68 to 84, wherein the front side metallization pattern is formed from silver paste.
[Item 86]
N (approximately greater than or equal to about 250) rectangular or near rectangular silicon solar cells arranged as a plurality of series connected supercells in two or more parallel rows, each supercell And a plurality of silicon solar cells, wherein the long sides of adjacent silicon solar cells are overlapped and directly conductively joined to each other by an electrical and thermally conductive adhesive, A rectangular or substantially rectangular silicon solar cell, which is disposed side by side in a state in which the plurality of silicon solar cells are electrically connected in series.
Less than 1 bypass diode per 25 solar cells
Equipped with
The electrical and thermal conductive adhesive has a thickness in the direction perpendicular to the plurality of solar cells less than or equal to about 50 microns, and a thermal conductivity in the direction perpendicular to the plurality of solar cells is about equal. A solar module that forms a plurality of junctions between adjacent solar cells that is higher than or equal to 1.5 W / (meter-K).
[Item 87]
89. A solar module according to item 86, wherein the plurality of supercells are enclosed in a thermoplastic olefin layer between the front and back sheets.
[Item 88]
89. The solar module according to item 86, wherein the plurality of supercells are enclosed between a glass front sheet and a back sheet.
[Item 89]
Less than 1 bypass diode per 30 solar cells, or less than 1 bypass diode per 50 solar cells, or less than 1 bypass diode per 100 solar cells, or only a single bypass diode 89. A solar module according to item 86, comprising or not comprising a bypass diode.
[Item 90]
The solar module according to item 86, comprising no bypass diode, or only a single bypass diode, or 3 or less bypass diodes, or 6 or less bypass diodes, or 10 or less bypass diodes.
[Item 91]
The plurality of conductive junctions between overlapping solar cells may be formed between the plurality of supercells and the glass front sheet in a temperature range of about -40.degree. C. to about 100.degree. C. without damaging the solar modules. 86. The solar module of paragraph 86, providing mechanical compliance to the plurality of supercells that accommodates thermal expansion mismatch in a direction parallel to the two or more parallel rows therebetween.
[Item 92]
N is greater than or equal to about 300, greater than or equal to about 350, or greater than or equal to about 400, or greater than or equal to about 400, or greater than or equal to about 500, or greater than or equal to about 500 91. A solar module according to any one of items 86 to 91, greater than or equal to, greater than about 600, or equal to, greater than about 650, or equal to, or greater than about 700, or equal to .
[Item 93]
The plurality of supercells are electrically connected such that they are higher than or equal to about 120 volts, higher than or equal to about 180 volts, higher than or equal to about 240 volts, or higher than about 300 volts Equal, higher than or equal to about 360 volts, higher than or equal to about 420 volts, higher than or equal to about 480 volts, higher than or equal to about 540 volts, or higher than about 600 volts, 91. A solar module according to any one of items 86 to 92, which provides a high DC voltage equal to or equal to it.
[Item 94]
The solar module according to item 86,
An inverter configured to electrically connect to the solar module and convert a DC output from the solar module to provide an AC output
, A solar energy system.
[Item 95]
100. The solar energy system of item 94, wherein the inverter does not have a DC-DC boost component.
[Item 96]
95. A solar energy system according to item 94, wherein the inverter is configured to operate the solar module at a DC voltage higher than a minimum value set to avoid reverse biasing the solar cell.
[Item 97]
100. A solar energy system according to item 96, wherein the minimum voltage value is temperature dependent.
[Item 98]
100. The solar energy system of item 94, wherein the inverter is configured to recognize a reverse bias condition and operate the solar module at a voltage that avoids the reverse bias condition.
[Item 99]
100. The solar energy system of item 98, wherein the inverter is configured to operate the solar module in a local maximum region of the voltage-current output curve of the solar module to avoid the reverse bias condition.
[Item 100]
100. A solar energy system according to any one of items 94 to 99, wherein the inverter is a micro-inverter integrated with the solar module.
[Item 101]
A series connected string of rectangular or nearly rectangular solar cells having a breakdown voltage higher than about 10 volts, N (N 25) on average, such that the rectangular or nearly rectangular solar cells are one or more supercells. The plurality of solar cells, which are grouped, and each of the one or more supercells are arranged side by side with the long sides of adjacent solar cells overlapping and conductively bonded to each other by an electrical and thermal conductive adhesive. Comprising a series connected string of rectangular or nearly rectangular solar cells, including two or more of the cells;
A solar module, wherein none of the single solar cells in the string of solar cells, or a group of less than N solar cells, are individually electrically connected in parallel with the bypass diodes.
[Item 102]
Item 101. The solar module according to item 101, wherein N is greater than or equal to 30.
[Item 103]
Item 101. The solar module according to item 101, wherein N is greater than or equal to 50.
[Item 104]
Item 101. The solar module according to item 101, wherein N is greater than or equal to 100.
[Item 105]
The adhesive has a thickness perpendicular to the plurality of solar cells less than or equal to about 0.1 mm, and a thermal conductivity of about 1.5 W / in the direction perpendicular to the plurality of solar cells. 101. A solar module according to item 101, which forms a plurality of junctions between adjacent solar cells higher than or equal to m / K.
[Item 106]
101. The solar module of item 101, wherein the N solar cells are grouped into a single supercell.
[Item 107]
101. The solar module of item 101, wherein the plurality of supercells are encapsulated in a polymer.
[Item 108]
110. A solar module according to item 107, wherein the polymer comprises a thermoplastic olefin polymer.
[Item 109]
107. A solar module according to item 107, wherein the polymer is sandwiched between a glass front sheet and a back sheet.
[Item 110]
109. A solar module according to item 109, wherein the back sheet comprises glass.
[Item 111]
101. A solar module according to item 101, wherein the plurality of solar cells is a silicon solar cell.
[Item 112]
A solar module,
A supercell extending substantially the entire length or width of the solar module parallel to the edge of the solar module, wherein the supercell is formed by overlapping the long sides of adjacent solar cells to form an electrical and thermal conductive adhesive Comprising a series connected string of rectangular or nearly rectangular solar cells having N breakdown voltages higher than about 10 volts, arranged side by side in conductive junction with each other,
A solar module, wherein none of the single solar cells in the supercell, or a group of less than N solar cells, are individually electrically connected in parallel with the bypass diodes.
[Item 113]
A solar module according to item 112, wherein N> 24.
[Item 114]
114. A solar module according to item 112, wherein the length of the supercell in the direction of current flow is at least about 500 mm.
[Item 115]
112. The solar module of paragraph 112, wherein the plurality of supercells are encapsulated in a thermoplastic olefin polymer sandwiched between a glass front sheet and a back sheet.
[Item 116]
A solar module,
N (approximately greater than or equal to about 250) rectangular or near rectangular silicon solar cells arranged as a plurality of series connected supercells in two or more parallel rows, each supercell And a plurality of silicon solar cells, wherein the long sides of adjacent silicon solar cells are overlapped and directly conductively joined to each other by an electrical and thermally conductive adhesive, A rectangular or substantially rectangular silicon solar cell, which is disposed side by side in a state in which the plurality of silicon solar cells are electrically connected in series.
With one or more bypass diodes
Equipped with
Each pair of adjacent parallel rows in the solar module conductively bonds to the back surface electrical contact on the solar cell centrally located in one row included in the pair, and in the other row included in the pair Electrically connected by means of a bypass diode which is conductively joined to the back side electrical contact on the adjacent solar cell
Solar module.
[Item 117]
Each pair of adjacent parallel rows conductively bonds to the back surface electrical contacts on the solar cells in one row included in the pair and back surface electrical contacts on the adjacent solar cells in the other row included in the pair 127. A solar module according to item 116, electrically connected by at least one other bypass diode conductively coupled to the part.
[Item 118]
Each pair of adjacent parallel rows conductively bonds to the back surface electrical contacts on the solar cells in one row included in the pair and back surface electrical contacts on the adjacent solar cells in the other row included in the pair 130. A solar module according to item 117, electrically connected by at least one other bypass diode conductively coupled to the part.
[Item 119]
The electrical and thermal conductive adhesive has a thickness in the direction perpendicular to the plurality of solar cells less than or equal to about 50 microns, and a thermal conductivity in the direction perpendicular to the plurality of solar cells is about equal. 117. A solar module according to item 116, which forms a plurality of junctions between adjacent solar cells higher than or equal to 1.5 W / (meter-K).
[Item 120]
117. A solar module according to item 116, wherein the plurality of supercells are enclosed in a thermoplastic olefin layer between a glass front sheet and a back sheet.
[Item 121]
The plurality of conductive junctions between overlapping solar cells may be formed between the plurality of supercells and the glass front sheet in a temperature range of about -40.degree. C. to about 100.degree. C. without damaging the solar modules. 116. The solar module of clause 116, providing mechanical compliance to the plurality of supercells that accommodates thermal expansion mismatch in a direction parallel to the two or more parallel rows between.
[Item 122]
N is greater than or equal to about 300, greater than or equal to about 350, or greater than or equal to about 400, or greater than or equal to about 400, or greater than or equal to about 500, or greater than or equal to about 500 The solar module according to any one of items 116 to 121, greater than or equal to, greater than about 600, or equal to, greater than about 650, or equal to, or greater than about 700, or equal to .
[Item 123]
The plurality of supercells are electrically connected such that they are higher than or equal to about 120 volts, higher than or equal to about 180 volts, higher than or equal to about 240 volts, or higher than about 300 volts Equal, higher than or equal to about 360 volts, higher than or equal to about 420 volts, higher than or equal to about 480 volts, higher than or equal to about 540 volts, or higher than about 600 volts, 126. A solar module according to any one of items 116 to 122, which provides a high DC voltage equal to or equal to it.
[Item 124]
The solar module according to item 116,
An inverter configured to electrically connect to the solar module and convert a DC output from the solar module to provide an AC output
, A solar energy system.
[Item 125]
125. The solar energy system of paragraph 124, wherein the inverter does not have a DC-DC boost component.
[Item 126]
125. A solar energy system according to item 124, wherein the inverter is configured to operate the solar module at a DC voltage higher than a minimum value set to avoid reverse biasing the solar cell.
[Item 127]
126. A solar energy system according to item 126, wherein the minimum voltage value is temperature dependent.
[Item 128]
125. The solar energy system of clause 124, wherein the inverter is configured to recognize a reverse bias condition and operate the solar module at a voltage that avoids the reverse bias condition.
[Item 129]
129. The solar energy system of item 128, wherein the inverter is configured to operate the solar module in a maximum region of a voltage-current output curve of the solar module to avoid the reverse bias condition.
[Item 130]
130. A solar energy system according to any one of items 124 to 129, wherein the inverter is a micro inverter integrated with the solar module.

Claims (20)

A solar module,
A plurality of supercells arranged in two or more physically parallel rows, wherein the supercells are adjacently stacked and conductively joined together to electrically connect the plurality of solar cells in series. A plurality of supercells, comprising a plurality of solar cells arranged in each of the solar cells, each solar cell comprising a front side illuminated by sunlight during the operation of the module and a back side positioned oppositely;
One or more first end interconnects extending laterally with respect to the plurality of rows to electrically interconnect with each solar cell located at the first end of each row;
One or more second end interconnects extending laterally with respect to the plurality of rows to electrically interconnect each solar cell located at the second end of each opposing row from the first end;
Transverse to the plurality of rows along a plurality of back surfaces of a plurality of solar cells at one or more longitudinal positions in the plurality of rows between the first end and the second end of the plurality of rows And a plurality of hidden tap interconnections electrically interconnecting the plurality of solar cells located at the same one of the one or more longitudinal positions in each row. Connection,
With multiple bypass diodes,
Equipped with
The one or more first end interconnections, the one or more second end interconnections, and the plurality of hidden tap interconnections together electrically segment each row into two or more longitudinal segments. And electrically connecting in parallel a plurality of adjacent row segments in a plurality of adjacent rows, thereby forming two or more groups of row segments,
A solar module, wherein each group of a plurality of row segments is electrically connected in parallel with a different one of the plurality of bypass diodes.   The solar module according to claim 1, wherein each row comprises two or more supercells electrically connected in series. Each row has only a single supercell,
The one or more first end interconnects, the one or more second end interconnects, and the plurality of hidden tap interconnects together electrically connect each supercell into two or more longitudinal segments. Segmenting and electrically connecting a plurality of adjacent supercell segments in a plurality of adjacent rows in parallel, thereby forming two or more groups of supercell segments,
The solar module according to claim 1, wherein each group of supercell segments is electrically connected in parallel with a different one of the plurality of bypass diodes.   The solar module of claim 1, wherein a single first end interconnect extends transverse to the plurality of rows to electrically interconnect each solar cell located at the first end of each row.   The solar module of claim 1, wherein a plurality of first end interconnects extend transverse to the plurality of rows to electrically interconnect each solar cell located at the first end of each row.   A single hidden tap interconnect is provided for electrically interconnecting the plurality of solar cells located at that longitudinal position of each row at each of the one or more longitudinal positions. The solar module of claim 1, extending laterally with respect to the plurality of rows along a plurality of backsides.   The solar module of claim 1, wherein the plurality of bypass diodes are located along one or more perimeters of the solar module.   The solar module of claim 1, wherein the plurality of bypass diodes are located behind one or more of the plurality of solar cells.   The supercell of claim 1, wherein the plurality of bypass diodes are located in the plane of the plurality of supercells.   The supercell of claim 1, wherein the plurality of bypass diodes are located between adjacent rows of supercells.   The supercell of claim 1, wherein the plurality of bypass diodes are located along a centerline of the module oriented parallel to the plurality of rows of supercells.   The solar module according to claim 1, wherein the plurality of bypass diodes are in a junction box located on the back of the solar module that is not directly irradiated by sunlight during operation of the solar module. Each row has a single supercell,
A single first end interconnect extends transverse to the plurality of rows to electrically interconnect a plurality of end solar cells in each supercell at the first end of each row;
A single second end interconnect extends transverse to the plurality of rows to electrically interconnect a plurality of end solar cells in each supercell at the second end of each row;
A single hidden tap interconnect is provided to electrically interconnect the plurality of solar cells located at each longitudinal position of each row at each of the one or more longitudinal positions. Extends transverse to the rows along a plurality of backsides,
The one or more first end interconnects, the one or more second end interconnects, and the plurality of hidden tap interconnects together electrically connect each supercell into two or more longitudinal segments. Segmenting and electrically connecting a plurality of adjacent supercell segments in a plurality of adjacent rows in parallel, thereby forming two or more groups of supercell segments,
The solar module according to claim 1, wherein each group of supercell segments is electrically connected in parallel with a different one of the plurality of bypass diodes.   The solar module of claim 13, wherein the plurality of bypass diodes are located along one or more perimeters of the solar module.   14. The supercell of claim 13, wherein the plurality of bypass diodes are located along a centerline of the module oriented parallel to the plurality of rows of the plurality of supercells. A solar module,
A plurality of supercells arranged in two or more physically parallel rows, wherein the supercells are adjacently stacked and conductively joined together to electrically connect the plurality of solar cells in series. A plurality of supercells comprising a plurality of solar cells arranged side by side, each solar cell comprising a front side illuminated by sunlight during operation of said module and a back side positioned oppositely;
One or more first end interconnects extending laterally with respect to the plurality of rows to electrically interconnect with each solar cell located at the first end of each row;
One or more second end interconnects extending laterally with respect to the plurality of rows to electrically interconnect each solar cell located at the second end of each opposing row from the first end;
Transverse to the plurality of rows along a plurality of back surfaces of a plurality of solar cells at a first longitudinal position in the plurality of rows between the first end and the second end of the plurality of rows One or more first hidden tap interconnections, each extending one or more first hidden tap interconnections, electrically interconnecting the plurality of solar cells located at the first longitudinal position in each row Connection,
Transverse to the plurality of rows along a plurality of back surfaces of a plurality of solar cells at a second longitudinal position in the plurality of rows between the first end and the second end of the plurality of rows One or more second hidden tap interconnections, each extending one or more second hidden tap interconnections, electrically interconnecting the plurality of solar cells located in the second longitudinal position in each row Connection,
A first bypass diode electrically interconnected between the one or more first end interconnections and the one or more first hidden tap interconnections;
A second bypass diode electrically interconnected between the one or more first hidden tap interconnections and the one or more second hidden tap interconnections;
A second bypass diode electrically interconnected between the one or more second hidden tap interconnections and the one or more second end interconnections;
, A solar module.   17. The solar module of claim 16, wherein each row comprises two or more supercells electrically connected in series.   17. The solar module of claim 16, wherein each row comprises only a single supercell. A single first end interconnect extends transverse to the plurality of rows to electrically interconnect a plurality of end solar cells in each supercell at the first end of each row;
A single second end interconnect extends transverse to the plurality of rows to electrically interconnect a plurality of end solar cells in each supercell at the second end of each row;
A single first hidden tap interconnect is formed on the back side of the plurality of solar cells at the first longitudinal position in the plurality of rows between the first end and the second end of the plurality of rows. Extending laterally to the plurality of rows, the first hidden tap interconnect electrically interconnects the plurality of solar cells located at the first longitudinal position in each row;
A single second hidden tap interconnect is formed on the back side of the plurality of solar cells at the second longitudinal position in the plurality of rows between the first end and the second end of the plurality of rows. 18. The method of claim 18, wherein the second hidden tap interconnects electrically interconnect the plurality of solar cells located at the second longitudinal position in each row, extending laterally to the plurality of rows. Solar module of description. A solar module,
A plurality of supercells arranged in two or more physically parallel rows, wherein the supercells are adjacently stacked and conductively joined together to electrically connect the plurality of solar cells in series. A plurality of supercells, comprising a plurality of solar cells arranged in each of the solar cells, each solar cell comprising a front side illuminated by sunlight during the operation of the module and a back side positioned oppositely;
A plurality of hidden tap interconnects extending laterally to the plurality of rows along a plurality of back surfaces of a plurality of solar cells, the plurality of series connected segments having adjacent series connection segments electrically connected in parallel And a plurality of hidden tap interconnects interconnecting a plurality of solar cells located along each hidden tap interconnect to electrically segment each supercell.
, A solar module.