CN214505477U - Diode packaging structure capable of reducing overheating - Google Patents
Diode packaging structure capable of reducing overheating Download PDFInfo
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- CN214505477U CN214505477U CN202120802525.2U CN202120802525U CN214505477U CN 214505477 U CN214505477 U CN 214505477U CN 202120802525 U CN202120802525 U CN 202120802525U CN 214505477 U CN214505477 U CN 214505477U
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Abstract
The utility model is suitable for a diode technical field provides a can slow down overheated diode packaging structure, include: the base, the packaging body, its fixed connection in on the base, just all set up flutedly on the both sides wall that the packaging body symmetry set up, have the installation pin of radiating groove, it is provided with two, and two the installation pin inlays respectively to be located and corresponds in the recess of seting up on the packaging body lateral wall, and detachable fixed connection in the top of base, through setting up the radiating groove in the installation pin, can effectual this device of assurance at the during operation, outside air can enter into the radiating groove, simultaneously, flows into in the packaging body, absorbs the heat that diode component during operation produced, simultaneously, because the both ends of radiating groove all are provided with the filter screen, consequently, can effectually keep apart the dust in the outside air, avoids it to enter into the packaging body in the same direction as the radiating groove, influences diode component's normal work.
Description
Technical Field
The utility model belongs to the technical field of the diode, especially, relate to a can slow down overheated diode packaging structure.
Background
The diode is an electronic device capable of conducting current in one direction, a PN junction is arranged in the diode, lead terminals are arranged at two ends of the PN junction, and if the diode has one-way conductivity of current according to the direction of an applied voltage, the current directivity of most diodes is generally called as a rectification function.
In the prior art, a diode packaging body mainly comprises a diode wafer, a conductive pin, a packaging body and a base, the heat dissipation performance is poor, the surface-mounted rectifier bridge is taken as a representative surface-mounted component, on the basis of miniaturization, the heat dissipation problem is more and more difficult to solve due to structural limitation, the power density of the surface-mounted diode hardly meets the design requirement, and the maximum dissipated power of the surface-mounted diode is only 1.2W under the natural heat dissipation environment under the normal temperature condition.
Therefore, a diode package structure capable of reducing overheating is needed to solve the contradiction between miniaturization and power.
SUMMERY OF THE UTILITY MODEL
The utility model provides a can slow down overheated diode packaging structure aims at solving the problem of mentioning in the above-mentioned background art.
The utility model discloses a realize like this, a can slow down overheated diode packaging structure, include:
a base;
the packaging body is fixedly connected to the base, and grooves are formed in two symmetrically arranged side walls of the packaging body;
the packaging structure comprises a packaging body, a base, a plurality of mounting pins and a plurality of connecting pins, wherein the packaging body is provided with a side wall, the side wall is provided with a groove, the mounting pins are provided with heat dissipation grooves, and the two mounting pins are respectively embedded in the grooves formed in the side wall of the corresponding packaging body and are detachably and fixedly connected to the top of the base;
and the diode component comprises a diode crystal and a wire, the diode crystal is fixedly connected to one of the mounting pins, one end of the wire is connected to the diode crystal, the other end of the wire is fixedly connected to the other mounting pin, and heat generated when the diode component works is dissipated through the heat dissipation grooves formed in the two mounting pins.
Preferably, the mounting pin comprises an integrally formed fixing portion, a bending portion and an extending portion, the bottom end of the fixing portion is fixedly connected to the base, the bending portion is arranged at one end, away from the base, of the fixing portion and is perpendicular to the fixing portion, the extending portion is fixedly mounted on the bending portion and is opposite to the fixing portion, and heat dissipation grooves which are communicated with each other are formed in the fixing portion, the bending portion and the extending portion.
Preferably, the top walls of the two fixing parts are respectively composed of a mounting plate, a heat absorbing plate, a heat conducting plate and a heat radiating plate which are sequentially distributed, the diode assembly is fixedly mounted on the mounting plate, and the heat radiating plate is close to the heat radiating groove.
Preferably, both ends of each heat dissipation groove are fixedly connected with a filter screen.
Preferably, an elastic sealing strip which is abutted against the mounting pin is attached to the inner wall of each groove.
Preferably, the lead comprises a copper core wire, and the outer side of the copper core wire is coated with a silver coating.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses a can slow down overheated diode packaging structure:
through setting up the radiating groove in the installation pin, can effectual assurance this device at the during operation, in the outside air can enter into the radiating groove, simultaneously, flows into in the encapsulation body, absorbs the heat that diode subassembly during operation produced, simultaneously, because the both ends of radiating groove all are provided with the filter screen, consequently, can effectually keep apart the dust in the outside air, avoid it to enter into the encapsulation body along with the radiating groove, influence diode subassembly's normal work.
When the diode component works, heat generated by the diode component can be transferred to the mounting plate, the mounting plate transfers the heat to the heat absorbing plate, the heat absorbing plate transfers the heat to the heat dissipating plate through the heat conducting plate, and cold air in the heat dissipating groove can be absorbed after contacting the heat on the heat dissipating plate, so that the heat dissipating efficiency of the diode component is improved.
Drawings
Fig. 1 is a front view of the present invention;
fig. 2 is a schematic structural diagram of the present invention (the package is not shown);
fig. 3 is a front cross-sectional view of a mounting pin in the present invention;
fig. 4 is an enlarged schematic view of a portion of the structure at a in fig. 3 according to the present invention;
in the figure:
1. a base;
2. a package body;
3. mounting a pin; 31. a fixed part; 311. mounting a plate; 312. a heat absorbing plate; 313. a heat conducting plate; 314. A heat dissipation plate; 32. a bending section; 33. an extension portion; 34. a heat sink; 341. a filter screen;
4. a diode assembly; 41. a diode crystal; 42. and (4) conducting wires.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments, it is to be understood that the specific embodiments described herein are only used for explaining the present invention, and are not used for limiting the present invention.
Referring to fig. 1-2, the present invention provides a diode package structure capable of reducing overheating, including:
a base 1.
Specifically, in some embodiments, the staff can set up base 1 into insulating material, and its aim at, can be fine protect diode subassembly 4 installed on it, prevent its phenomenon that the electric leakage appears, also further reduce the work load that the staff maintained diode subassembly 4, prolonged diode subassembly 4's operating time and life, reduced work load for the subsequent maintenance of staff.
It should be noted that, in some other embodiments, a worker may set a plurality of threaded holes on the base 1, set mounting holes matched with the threaded holes on the peripheral side walls of the package body 2, set a locking bolt in the mounting hole, and make the threaded end of the locking bolt screwed in the corresponding threaded hole, so as to ensure the connection tightness between the base 1 and the package body 2, ensure the tight connection between the two, and avoid the two from falling off, which affects the subsequent normal use of the device.
In other embodiments, the worker may further open a slot on the base 1, and a clamping block connected with the clamping slot in a clamping manner is arranged at the bottom of the packaging body 2, so that the usage amount of the locking bolt is reduced, and meanwhile, the worker can conveniently and rapidly detach the packaging body 2 and the base 1 to maintain and maintain the diode assembly 4.
In other embodiments, the worker may also connect the package 2 and the base 1 by riveting, welding, etc., which is not limited herein, and the worker may choose this according to the actual situation.
Referring to fig. 1, the package 2 is fixedly connected to the base 1, two symmetrically disposed side walls of the package 2 are respectively provided with a groove, and an elastic sealing strip abutting against the mounting pin 3 is attached to an inner wall of each groove.
Specifically, the staff is with 2 fixed mounting of packaging body on base 1 backs, and two recess blocks of seting up on packaging body 2 are in the outside of installing pin 3, carry on spacingly and fixed to installing pin 3, and the gap between recess and installing pin 3 can be blocked up to the elastic sealing strip that pastes on the recess inner wall and establish to the effectual dust impurity who avoids in the outside air enters into packaging body 2's inside, has prolonged diode component 4's life.
It should be noted that, in some embodiments, the elastic sealing strip is preferably made of a material having an elastic property, such as rubber, silica gel, or the like, and the elastic property of the elastic sealing strip can generate a certain resilience force when the mounting pin 3 is attached, so as to prevent the package body 2 or the mounting pin 3 from being damaged due to too much force of a worker.
Meanwhile, after the elastic sealing strip is compressed, the elastic sealing strip can generate rebound force to further block a gap between the groove and the mounting pin 3, and the purpose of blocking air is achieved.
Referring to fig. 2-4, two mounting pins 3 with heat dissipation grooves 34 are provided, and the two mounting pins 3 are respectively embedded in the grooves formed on the side wall of the corresponding package 2 and detachably and fixedly connected to the top of the base 1, the mounting pins 3 include a fixing portion 31, a bending portion 32 and an extending portion 33 which are integrally formed, the bottom end of the fixing portion 31 is fixedly connected to the base 1, the bending portion 32 is disposed on one end of the fixing portion 31 away from the base 1 and is perpendicular to the fixing portion 31, the extending portion 33 is fixedly mounted on the bending portion 32 and is opposite to the fixing portion 31, the bending portion 32 and the extending portion 33 are provided with the heat dissipation grooves 34 which are mutually communicated, the top walls of the two fixing portions 31 are respectively composed of a mounting plate 311, a heat absorption plate 312, a heat conduction plate 313 and a heat dissipation plate 314 which are sequentially distributed, and the diode assembly 4 is fixedly mounted on the mounting plate 311, the heat dissipating plate 314 is close to the heat dissipating grooves 34, and a filter screen 341 is fixedly connected to both ends of each heat dissipating groove 34.
Specifically, when the device is in use, due to the tight connection between the package 2 and the base 1, the only way for communicating the air inside the package 2 with the outside is the heat dissipation groove 34, when the diode assembly 4 generates a large amount of heat during operation, the mounting plate 311 disposed on the top wall of the mounting pin 3 absorbs the heat and transfers the heat to the heat absorption plate 312, and then the heat absorption plate 312 transfers the heat to the heat dissipation plate 314 through the heat conduction plate 313, at this time, since the heat dissipation groove 34 communicates with the outside air, the heat on the heat dissipation plate 314 is absorbed by the cold air in the heat dissipation groove 34, thereby absorbing the heat inside of the device, and further, since the air inside the package 2 communicates with the outside through the heat dissipation groove 34, the heat generated during operation of the diode assembly 4 is also discharged out of the package 2 along the heat dissipation groove 34, thereby further achieving the heat dissipation function, the situation that the temperature inside the packaging body 2 is too high is slowed down, and the normal work of the device is guaranteed.
It should be noted that, in some embodiments, the filter screens 341 are disposed at two end portions of the worker in the heat dissipation groove 34, and the dust and impurities in the outside air can be effectively intercepted by the filter screens 341, so that the dust and impurities are prevented from entering the package body 2, the normal service life of the diode assembly 4 is affected, and redundant workload brought to the worker is avoided.
Referring to fig. 2, the diode assembly 4 includes a diode crystal 41 and a lead 42, the diode crystal 41 is fixedly connected to one of the mounting pins 3, and one end of the lead 42 is connected thereto, the other end of the lead 42 is fixedly connected to the other mounting pin 3, heat generated when the diode assembly 4 works is dissipated through the heat dissipation grooves 34 formed in the two mounting pins 3, the lead 42 includes a copper core, and the outer side of the copper core is coated with a silver coating.
Specifically, because the diode crystal 41 and the wire 42 are both connected to the fixing portion 31, the heat generated during the operation can be well transferred to the fixing portion 31, and the mounting plate 311 gradually transfers the heat to the heat dissipation plate 314, so that the heat dissipation is effectively ensured, the heat dissipation efficiency of the device is improved, and the over-high temperature condition in the device is alleviated.
It should be noted that the hardness of copper is greater than that of silver, so that the copper arranged on the wire 42 as a core wire can effectively ensure the firmness and stability of the structure of the wire 42, and meanwhile, the conductivity of silver is better than that of copper, and the silver coating coats the outer side of the copper core wire, so that the overall conductivity of the wire 42 can be effectively improved.
The utility model discloses a theory of operation and use flow: after the utility model is installed, when the device is used, because the tight connection between the packaging body 2 and the base 1, the only way of the internal air and the external communication of the packaging body 2 is the heat dissipation groove 34, when the diode component 4 generates a large amount of heat during operation, the mounting plate 311 arranged on the top wall of the mounting pin 3 absorbs the heat and transmits the heat to the heat absorption plate 312, then the heat absorption plate 312 transmits the heat to the heat dissipation plate 314 through the heat conduction plate 313, at the moment, because the heat dissipation groove 34 is communicated with the external air, the heat on the heat dissipation plate 314 is absorbed by the cold air in the heat dissipation groove 34, thereby absorbing the heat in the device, and further, because the internal air of the packaging body 2 is communicated with the external through the heat dissipation groove 34, therefore, the heat generated during the operation of the diode component 4 can also be discharged out of the packaging body 2 along with the heat dissipation groove 34, further realizing the heat dissipation function, the situation that the temperature inside the packaging body 2 is too high is slowed down, and the normal work of the device is guaranteed.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (6)
1. A diode package structure capable of reducing overheating, comprising:
a base (1);
the packaging body (2) is fixedly connected to the base (1), and grooves are formed in two symmetrically arranged side walls of the packaging body (2);
the packaging structure comprises two mounting pins (3) with heat dissipation grooves (34), wherein the two mounting pins (3) are respectively embedded in grooves formed in the side walls of the corresponding packaging bodies (2) and are detachably and fixedly connected to the top of the base (1);
diode subassembly (4), it includes diode crystal (41) and wire (42), diode crystal (41) fixed connection is in one of them on installation pin (3), and is connected with the one end of wire (42) on it, the other end fixedly connected with of wire (42) is another on installation pin (3), through two set up on installation pin (3) radiating groove (34) are right the heat that diode subassembly (4) during operation produced gives off.
2. The diode package structure capable of alleviating overheating according to claim 1, wherein the mounting pin (3) includes a fixing portion (31), a bending portion (32) and an extending portion (33) that are integrally formed, a bottom end of the fixing portion (31) is fixedly connected to the base (1), the bending portion (32) is disposed at an end of the fixing portion (31) away from the base (1) and perpendicular to the fixing portion (31), the extending portion (33) is fixedly mounted on the bending portion (32) and disposed opposite to the fixing portion (31), and heat dissipation grooves (34) that are mutually connected are formed in the fixing portion (31), the bending portion (32) and the extending portion (33).
3. The diode packaging structure capable of alleviating overheating according to claim 2, wherein the top wall of each of the two fixing portions (31) is composed of a mounting board (311), a heat absorbing board (312), a heat conducting board (313) and a heat dissipating board (314) which are distributed in sequence, and the diode assembly (4) is fixedly mounted on the mounting board (311), and the heat dissipating board (314) is close to the heat dissipating slot (34).
4. The diode package structure capable of reducing overheating as claimed in claim 3, wherein a filter screen (341) is fixedly connected to each end of each heat sink (34).
5. The diode package structure capable of reducing overheating according to claim 1, wherein an elastic sealing strip abutting against the mounting pin (3) is attached to an inner wall of each groove.
6. The diode package structure capable of alleviating overheating according to claim 1, wherein the conductive wires (42) comprise copper core wires, and the outer sides of the copper core wires are coated with silver plating layers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120802525.2U CN214505477U (en) | 2021-04-19 | 2021-04-19 | Diode packaging structure capable of reducing overheating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120802525.2U CN214505477U (en) | 2021-04-19 | 2021-04-19 | Diode packaging structure capable of reducing overheating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214505477U true CN214505477U (en) | 2021-10-26 |
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ID=78203644
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120802525.2U Active CN214505477U (en) | 2021-04-19 | 2021-04-19 | Diode packaging structure capable of reducing overheating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214505477U (en) |
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2021
- 2021-04-19 CN CN202120802525.2U patent/CN214505477U/en active Active
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