JP2004128099A - Water cooling inverter - Google Patents

Abstract

An object of the present invention is to provide an inverter device that is directly water-cooled and that can further reduce the possibility that a high-voltage portion is exposed to water when a cooling water leaks.
A water supply / drain pipe for cooling water, a water channel cover connected to the water supply / drain pipe, a housing covering the periphery of the inverter, a metal core printed circuit board in which a metal foil pattern is fixed to a metal plate via an insulating resin layer, and a power semiconductor In a water-cooled inverter with a package in which the chip is sealed and one electrode of the power semiconductor is exposed on the opposite side of the power semiconductor, the power circuit solders the back electrode of the power semiconductor package to the metal foil pattern of the metal core printed circuit board The bottom surface of the housing is covered with a metal core printed circuit board, and the opposite surface of the mounted metal core printed circuit board is covered with a water channel cover, and cooling water is directly applied to the back of the metal core printed circuit board.
[Selection diagram] Fig. 1

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a water-cooled inverter. In particular, I nsulated G ate B ipolar T The present invention relates to a water-cooled inverter having a high heat-generating power semiconductor element such as a transcriptor (IGBT) and cooling the power semiconductor element with water.
[0002]
[Prior art]
Patent Literature 1 relates to cooling of a semiconductor chip, in which a protrusion is formed in a coolant chamber of a flow path casing to cause turbulence in a flow downstream of the protrusion, thereby promoting heat exchange between the module substrate and the coolant. It is described that the installation position of the projection is located on the forward side of the flow from the IGBT element so that the position where the disturbance occurs and the position of the IGBT element are the same.
[0003]
Patent Literature 2 discloses that an inverter main circuit in an inverter device is joined and mounted on a surface of a heat sink and water-cooled by a cooling water channel formed on the back side of the heat sink, and a cooling water channel is formed on the back surface of the heat sink and heat exchange inside the cooling water channel is performed. On the surface, it is described that uneven fins are formed in order to increase the efficiency of heat exchange (radiation).
[0004]
[Patent Document 1]
JP-A-10-22428
[Patent Document 2]
JP-A-11-346480
[0005]
[Problems to be solved by the invention]
The conventional water cooling structure has the following problems in terms of system configuration and reliability.
[0006]
In order to reduce the temperature rise of the IGBT chip junction and to improve the reliability and life of the inverter, the heat resistance from the IGBT chip junction to the cooling water must be reduced.
Rth (jw) must be reduced. As this means, direct water cooling is an extremely effective method as compared with indirect water cooling. However, it has been found that the direct water cooling structure has the following problems. That is, in the case of the indirect water cooling, even if the seal of the cooling water is broken, the cooling water flows out from the periphery of the water channel cover and does not enter the inverter case. However, in the case of direct water cooling, there is a possibility that cooling water may enter the inverter case due to an abnormality of a waterproof O-ring or the like. Water immersion in the inverter case may shorten the life of the inverter.
[0007]
An object of the present invention is to provide an inverter device that is directly water-cooled and that can further reduce the possibility that a high-voltage part is flooded when cooling water leaks.
[0008]
[Means for Solving the Problems]
The present invention for achieving the above object will be described. FIG. 1 is a schematic sectional view showing the basic structure of the present invention. Even in direct water cooling, a structure in which water leaks out of the inverter case even if the cooling water seal is broken should be used, as in the indirect water cooling structure shown in FIG. FIG. 1 shows a structure that achieves this.
[0009]
An IGBT package with a built-in FWD (hereinafter referred to as PKG) in which IGBTs and FWDs as main current driving elements are sealed on a so-called metal core printed circuit board 125 in which a copper foil pattern serving as a circuit pattern is pressure-bonded to an Al plate via an insulating resin layer. 100) are mounted on a plurality of surfaces. The PKG (package) surface mounting board becomes a power circuit constituting the inverter. The entire bottom surface of the inverter case 110 is covered with the substrate 125 to form a bottom plate of the housing. Further, the back surface of the metal core printed circuit board 125 is covered with a water channel cover 109 to form a PKG 100, a cooling water channel 101, and a filter capacitor 126 a cooling water channel 102.
[0010]
As described above, even when the seal of the O-ring 103 is broken and the cooling water leaks, the cooling water only flows to the outside and does not enter the inverter housing. Further, the PKG 100 can achieve high cooling performance because the metal core printed circuit board 125 as the base plate is directly cooled. Further, by adopting a structure in which the PKG 100 is surface-mounted on the metal core printed circuit board 125, it is possible to solve the problem of a decrease in yield, which is a problem when configuring a large-area power module.
[0011]
BEST MODE FOR CARRYING OUT THE INVENTION
This time, the inventors have applied a structure in which cooling water is directly applied to the base plate of a circuit composed of power semiconductors to cool the circuit board (direct cooling structure). And the water-cooled inverter were studied in various ways.
[0012]
Inverters that control high-output motors, such as motors for hybrid electric vehicles, often use water cooling. FIGS. 2 and 3 are schematic diagrams of a conventional water-cooled inverter structure. Only a portion related to cooling of the IGBT modules 205 and 300 is shown. FIG. 2 shows an example in which a fin 202 is formed on a part of the outside of an Al die-casting inverter case 203, and a water channel 207 in which an antifreeze as cooling water circulates is formed with a water channel cover 204 (indirect water cooling). The IGBT module 205 is fixed on the water channel 207 in the inverter case 203 with the heat conductive grease 201. Therefore, the heat of the IGBT module 205 is radiated to the cooling water through the metal base 206, the heat conductive grease 201, the inverter case 203, and the fins 202. The greatest advantage of using water cooling is that it can achieve significantly higher heat transfer than air cooling. However, in the case of the present structure, the fin 202 is formed of an aluminum die-cast material having a low thermal conductivity, so that the fin efficiency is low, and the thermal conductive grease 201 having a very low thermal conductivity as compared with a metal member is interposed. Therefore, there is a disadvantage that the thermal resistance from the IGBT chip junction to the cooling water cannot be remarkably reduced.
[0013]
On the other hand, the example shown in FIG. 3 improves this drawback. The fins 304 are formed on the metal base 305 of the IGBT module 300, and are taken out of the case 301 through the opening 307 of the Al die-cast inverter case 301, and are directly cooled with water (direct water cooling). That is, in the present embodiment, the water channel 306 includes the metal base 305 of the IGBT module 300 and the water channel cover 308. With this structure, the thermal conductive grease 201 of FIG. 2 can be omitted, and the fin 304 is formed of a metal such as copper having high thermal conductivity, so that the fin efficiency is high and the thermal resistance can be significantly reduced.
[0014]
In order to reduce the temperature rise of the IGBT chip junction and improve the reliability and life of the inverter, it is necessary to reduce the thermal resistance from the IGBT chip junction to the cooling water, Rth (j−w). As this means, the direct water cooling shown in FIG. 3 is an extremely effective method as described above, as compared with the indirect water cooling shown in FIG. However, the inventors have found that the direct water cooling structure shown in FIG. 3 has a problem.
[0015]
Hereinafter, embodiments will be described in detail with reference to the drawings.
[0016]
(Example 1)
The first embodiment will be described with reference to FIGS. 1, 4, 5, 6, 7, and 8. FIG. This is an embodiment of a 50 kW class water-cooled three-phase inverter. In each of the figures, a cooling water supply / drain pipe, control terminals for controlling an inverter, P, N, U, V, W terminals and the like are omitted. FIG. 1 is a schematic diagram of a cross-sectional structure, FIGS. 4 to 7 are schematic diagrams in plan view of each assembling process, and FIG. 8 is a parasitic inductance model diagram of a main circuit for one phase (U phase) of a three-phase inverter.
[0017]
First, a schematic structure will be described with reference to FIG. A PKG 100 having a size of 16 mm × 21 mm and a thickness of 5 mm, which is transfer-molded with an epoxy resin, is surface-mounted on a copper pattern on a metal core printed circuit board 125 with 6 PKG per arm by eutectic solder. The eutectic solder thickness is about 0.1 mm. The PKG is a so-called 1 in 1 PKG in which each IGBT and FWD is built in one chip, and 6 PKGs are connected in parallel. The rating of the PKG 100 is 600 V / 60 A, and as a result, the rating of the entire power circuit is about 600 V / 400 A. The thickness of the metal core printed circuit board 125 is 2 mm, and the size is 25 cm × 20 cm (approximately A4 size). The thickness of the copper foil pattern is 70 μm, and it is a pattern having only one surface. The main terminal 105 and the control terminal 106 are further surface-mounted on the metal core printed circuit board 125. The material of the main terminal is tough pitch copper and the thickness is 1.5 mm. The main terminal 105
The P bus bar 121, the N bus bar 123, the U, V, and W output wirings 124 are connected by M5 volts 120. The material of each bus bar is tough pitch copper and the thickness is 1.5 mm. Since the P bus bar 121 and the N bus bar 123 are insulated by the insulating sheet 122 having a thickness of 1 mm and are arranged close to each other, they have a low inductance structure. A filter capacitor 126 is similarly mounted between the P bus bar 121 and the N bus bar 123 with an M5 bolt 120. The filter capacitor is an electrolytic capacitor having a diameter of 3 cm, a height of 2 cm, and a capacity of 1000 μF. Four filter capacitors 126 are connected in parallel. The control terminal 106 is connected to a control power transformer 128, a gate driver 129, an electrolytic capacitor 119, various chip resistor chip capacitors 115, and a gate drive / power supply board 114 on which an interface terminal 107 with the microcomputer board 116 is mounted. ing. The U, V, W output wirings 124 are arranged on the present gate drive / power supply board 114. A microcomputer board 116 is attached to the inverter cover 113 with attachment bolts (M3) 127 and connected with the interface cable 108. On the microcomputer board 116, a microcomputer 117, a control IC 118, an electrolytic capacitor 119, various chip resistor chip capacitors 115 and the like are surface-mounted. The merit of attaching the microcomputer board 116 to the inverter cover 113 is that heat of the microcomputer 117 and the like is released to the inverter cover 113 to suppress a rise in temperature. The inverter cover 113 is attached with M5 bolts 112.
[0018]
The back surface of the metal core printed circuit board 125 is covered with a water channel cover 109 made of Al die casting, and a water channel 101 for cooling the power circuit (PKG 100) and a water channel 102 for cooling the filter capacitor are formed. The water channel 101 and the water channel 102 are connected in series. The channel 101 has a depth of 2 mm and a width of 12 cm, and the channel 102 has a depth of 17 mm and a width of 3.5 cm. The water channel cover 109 is attached with M6 bolts 111 using the O-ring 103, and the cooling water is sealed. The O-ring 103 is 1.9 mmφ. At this time, the inverter case 110, the metal core printed circuit board 125, and the water channel cover 109 are fastened together using the same mounting holes. If the seal of the O-ring 103 is broken, the water leaks out of the inverter case 110 as described above. However, there is a possibility that the bolt 110 may seep into the case 110 from the clearance 130 of the bolt hole. In order to eliminate this, the seal washer 104 is used in the present structure. With the above configuration, the height of the inverter is 6 cm, and the size is 25 cm × 20 cm, which is the same size as the metal core printed circuit board 125.
[0019]
Next, a planar structure will be described with reference to FIGS. FIG. 4 is a schematic view of the inside after the PKG 100, the main terminal 105, and the control terminal 106 are surface-mounted on the metal core printed circuit board 125 and the filter capacitor 126 is fixed. The back surface of the PKG 100 is a 1.5 mm thick copper plate, and this copper plate also serves as a collector electrode and a heat sink. Terminals 403 and 404 of the PKG 100 are an emitter and a gate terminal, respectively. The terminals 403 and 404 are soldered to the gate pattern 406, the N pattern 402 and the U, V, and W patterns 408 of the metal core printed circuit board 125, respectively. Note that the PKG 100 has a built-in gate resistor to prevent resonance inherent in parallel connection. The copper foil pattern 405 is a collector pattern, and the PKG 100 is surface-mounted on this pattern. The U and V phase emitter patterns and the V and W phase collector patterns are shared to prevent an increase in the area of the power circuit. The filter capacitor 126 has a structure in which the filter capacitor 126 is pressed against the insulating resin layer of the metal core printed circuit board 125, and heat dissipation is taken into consideration. Further, the main terminal 105 has a structure in which a protrusion is provided on the resin layer of the terminal and a recess for the protrusion is provided on the metal core printed circuit board 125 so as to be fitted therein, so that the main terminal 105 can withstand the tightening torque of the M5 bolt. This main terminal 105 can be removed and the P, N, U, V, and W busbars can be directly solder-bonded to the copper pattern on the metal core printed circuit board if the assembling property is not reduced. Thermistor 407 is surface-mounted for each arm to detect the temperature, so that the protection against heating can be performed. Further, the control terminal 106 is surface-mounted on the collector pattern 405 of each arm, and protection such as short-circuit protection can be performed by detecting the collector voltage.
[0020]
FIG. 5 is a schematic view of the inside after the P bus bar 121 is attached to the main terminal 105 and the filter capacitor 126 with bolts 120. A hole of 20 mmφ is provided around the N terminal of the filter capacitor 126 to secure an insulation distance. FIG. 6 is a schematic diagram after the insulating sheet 122 and the N bus bar 123 are mounted. FIG. 7 is a schematic diagram after the gate drive 114, U, V, W output wiring 124 is mounted. The gate drive / power supply board 114 is bonded to the control terminal 106 through-hole solder. The U, V, and W output wirings 124 are attached with M5 bolts 120. The microcomputer board 116 attached to the cover 113 is connected to the above structure by the interface cable 108, and the attachment other than the waterway cover 109 is completed.
[0021]
The feature of this structure is that, as described above, the direct cooling structure prevents the circuit components from being wet by water leakage. However, there are the following characteristics in terms of performance. First, it has the following characteristics thermally. One arm is configured in six parallels. Therefore, as compared with the conventional case where the current capacity of one chip is large and the two-parallel connection is used, the heat source is greatly dispersed. Increasing the mounting area by increasing the number of parallel circuits is advantageous for reducing the thermal resistance for this reason. However, in the heat dissipation structure using grease, the warpage becomes remarkable due to the increase in the substrate area, and the contact thermal resistance increases. Therefore, it has not been realized. In the case of this structure, this problem can be eliminated because of direct cooling. Therefore, a large number of parallel connections as in the present structure were realized.
[0022]
A flow rate of 20 L / min. Was passed through the cooling water (ethylene glycol 50 vol%), and the thermal resistance from the cooling water to the IGBT chip junction, Rth (j−w), was measured. As a result, Rth (j−w) = 0.14 K / W, which was sufficiently small. Conventionally, it has been considered impossible to apply the metal core printed circuit board 125 to such a large capacity module. This is because the thickness of the copper pattern is as thin as about 70 μm, so that it has been considered impossible in terms of current capacity. However, as in the present structure, it was realized by devising the layout so as to minimize the length of the copper pattern on the metal core printed circuit board 125. For example, in this structure, since the PKG 100 is not mounted, the maximum length of the portion where the resistance of only the copper pattern is a problem is about 4 cm, and the width is 2 cm. Assuming that a current of 60 A flows from each of the three PKGs 100 into this portion, the calorific value of the copper pattern is about 10 W. With such a calorific value, there is no problem thermally. Furthermore, the current density has no problem in terms of electromigration.
[0023]
Next, characteristics of the electrical performance will be described with reference to FIG. The problem when the number of parallel connections is increased is that current concentration occurs due to imbalance in current sharing. This is mainly caused by the difference in parasitic inductance. FIG. 8 shows a U-phase parasitic inductance model. P bus bar inductance 800, N terminal inductance 810, collector copper pattern inductance 801, inductance 802, 803, 804, 805 in PKG 100, emitter terminal 403 inductance 806, U wiring copper pattern inductance 807, U terminal inductance 808, emitter copper pattern inductance 809 It is composed of Among the above parasitic inductances, those that cause the current imbalance are the parasitic inductances 801, 807 and 809. The calculated inductance is about 6 nH in all cases. Therefore, in each of the wiring patterns 801, 807, and 809, the difference in the parasitic inductance among the PKGs 100 is at most 4 nH. With such a difference, the effect on the current imbalance at the time of switching can be ignored. The reason why such an imbalance is small despite the fact that the number of parallel circuits is 6 and the number of parallel circuits is large is that the inductance is reduced due to the eddy current effect in consideration of layout compatibility.
[0024]
The drainage pipe was sealed, and high water pressure was applied to the water channel to verify the leakage resistance. As a result, it was confirmed that water did not leak up to about 300 kPa. For example, in consideration of application to an electric vehicle, the maximum discharge pressure of the electric pump is about 50 kPa, and it was confirmed that the electric pump was sufficiently leak-proof.
[0025]
(Example 2)
A second embodiment will be described with reference to FIG. In the first embodiment, the cooling water was sealed with an O-ring. However, if the seal is broken, the cooling water may penetrate into the case from the bolt hole, and the seal washer 104 is required as a preventive measure. Therefore, more ideally, it is desired that no means such as a seal washer be used for improving the assemblability. The present embodiment is an embodiment that addresses this.
[0026]
The metal core printed circuit board 904 and the Al die-casting inverter case 901 are welded at a welding location 903 to ensure a more reliable seal. As a welding method, welding utilizing plastic flow by friction stirring is desired. This is to suppress the rise in temperature as much as possible. In the resin insulating layer of the metal core printed circuit board 904, a region about 2 cm inside the welded portion 903 is deleted as much as possible. This is to prevent the deterioration of the resin due to the temperature rise. With this structure, even if the seal of the O-ring is broken, water leakage could not enter the case 901. The inverter shape, capacity, thermal and electrical performance, and the like are the same as in the first embodiment.
[0027]
(Example 3)
A third embodiment will be described with reference to a schematic sectional view of FIG. Both the conventional water-cooled inverter structure and the structures of the first and second embodiments have a structure in which a power circuit is disposed on the bottom of the inverter to perform water cooling. Conventionally, an IGBT module has been sealed with a soft resin such as silicone gel. Therefore, mounting the module upside down has been feared that the sealing resin may be deformed by gravity, and has not been intentionally performed. However, as in the present invention, it is sealed with an epoxy resin which is a hard resin.
When a power circuit is configured by PKG, it is not necessary to arrange the power circuit on the bottom of the inverter. Therefore, this is an embodiment in which the power circuit is arranged on the upper surface of the inverter. The same substrate 125 as in the first embodiment is mounted on the upper surface of the Al die-casting case 1202 with the M6 bolt 111 using the O-ring 103 and the seal washer 104. According to this structure, the filter condenser 126 is not disposed on the cooling water passage, but is disposed on the bottom lid 1203. With this change, P, N bus bar 1204,
The shape of 1206 can be flat, and the inductance can be reduced. The water channel cover 1201 has a simpler structure by removing the water channel for the filter condenser 126 from the case of the first embodiment. The shape of the PKG 100 cooling water channel 101 is exactly the same. The advantages of this structure are lower inductance of the P and N bus bars 1204 and 1206 and a lower temperature of the microcomputer 119. This is because the microcomputer board 116 is disposed below the power circuit, so that heat generated by the power circuit is not easily transmitted downward.
[0028]
(Example 4)
The fourth embodiment will be described with reference to the schematic diagram of the sectional structure of FIG. In the embodiments described above, the shape of the water channel for cooling the PKG 100 as the power circuit was 12 cm in width and 2 mm in depth. 20 L / min. , The average flow velocity is 1.4 m / s. When improving the cooling performance, it is known to increase the flow rate of the cooling water. However, increasing the flow rate in order to increase the flow rate of the cooling water increases the size of the pump that circulates the cooling water, and is preferably used when the installation space for the inverter is severely restricted, such as in an electric vehicle. Absent. Therefore, in the present embodiment, the width of the flow path is reduced to increase the flow velocity. That is, although one channel is used in the above-described embodiment, a spacer 1303 is provided in the main terminal area, and two reciprocating channels 1302 are provided. The channel 1302 has a width of 5 cm and a depth of 2 mm. Therefore, in this embodiment, 20 L / min. , The average flow velocity is 3.4 m / s. As in the example, a 50 vol% solution of ethylene glycol, a refrigerant at a temperature of 60 ° C., 20 L / min. When flowing through and measuring Rth (j−w), it was 0.1 K / W, which was about 0.7 times that in Example 1.
[0029]
Hereinafter, two embodiments are embodiments in which the arrangement of the PKG 100, the main terminal 105, and the control terminal 106, which are power circuits, is changed. 10 and 11 are schematic plan views of a metal core printed circuit board on which the PKG 100, the main terminal 105, and the control terminal 106 are surface-mounted.
[0030]
(Example 5)
A fifth embodiment will be described with reference to FIG. In FIG. 10, the control terminal 106 shows only a gate and a control emitter terminal, and omits other control terminals and the thermistor. This embodiment is an embodiment in which lower inductance is taken into consideration than in the first embodiment. In the first embodiment, the collector terminals 105 exist in the same row as the PKG 100. In the present embodiment, the collector terminal 105 is removed from the arrangement of the PKGs 100, and the length of the collector pattern copper foil 1003 is reduced and the width is increased to 4 cm. As a result, the copper foil pattern inductance 801 in FIG. 8 could be reduced to 4 nH as compared with the first embodiment, including the effect of changing the way of current flow. Therefore, the resistance to the current imbalance can be further improved. The disadvantage is that the size of the inverter is increased as compared with the first embodiment. The longitudinal direction increased by 3 cm to 28 cm.
[0031]
(Example 6)
A sixth embodiment will be described with reference to FIG. As in the fifth embodiment, control terminals other than the thermistor, gate, and control emitter are omitted. In Examples 1 and 5, the main terminals are arranged at the center of each of the three PKGs in consideration of the layout of the PKG 100 and the resistance of the copper foil pattern on the metal core printed circuit board. For this reason, the size of the gate drive / power supply substrate must be less than half the size of the inverter. Therefore, in this embodiment, the P, N, U, V, and W terminals are arranged at both ends of the PKG 100 group at the expense of the above advantages. With this structure, the area of the gate drive / power supply substrate could be doubled as compared with the above embodiment. As a result, the microcomputer board, which was a separate board in the above embodiment, could be made the same board as the gate drive / power supply board.
[0032]
According to the embodiment described above, a PKG in which IGBTs and FWDs are sealed is surface-mounted on a metal core printed circuit board which forms a circuit pattern by pressing a copper foil on an Al plate surface via an insulating resin layer, and Is formed. The entire bottom surface of the inverter case is sealed with this metal core printed circuit board. Further, a water channel cover is attached to the back surface of the metal core printed circuit board with a sealing means such as an O-ring to form a water channel for directly cooling the back surface of the metal core printed circuit board with water. With this structure, even if the seal of the O-ring is broken, the possibility that the cooling water enters the inverter case can be further reduced.
[0033]
Further, according to each of the embodiments described above, the entire bottom surface of the inverter case is sealed with the metal core printed circuit board on which the PKG constituting the power circuit is surface-mounted, and cooling water is directly applied to the back surface of the metal core printed circuit board. Cool the power circuit. Thereby, even if the cooling water seal is broken, it is possible to further reduce the possibility that the water leak enters the inverter case. Therefore, there is an effect of preventing the circuit components from being wet. In addition, when the power circuit constituting the inverter is constituted by a plurality of PKGs per arm, direct water cooling can be made more effective by dispersing the heat source, and the thermal resistance can be reduced. In addition, it is possible to prevent a decrease in yield due to an increase in area.
[0034]
【The invention's effect】
According to the present invention, it is possible to provide an inverter device that is directly water-cooled and that can further reduce the possibility that a high-voltage portion is flooded when cooling water leaks.
[Brief description of the drawings]
FIG. 1 is a schematic sectional view showing a basic structure.
FIG. 2 is a schematic structural diagram (indirect water cooling).
FIG. 3 is a schematic structural diagram (direct water cooling).
FIG. 4 is a schematic plan view (before mounting a control board and a bus bar).
FIG. 5 is a schematic plan view (after mounting a P bus bar).
FIG. 6 is a schematic plan view (after the N bus bar is mounted).
FIG. 7 is a schematic plan view (after mounting a gate drive / power supply board, U, V, and W wirings).
FIG. 8 is an equivalent circuit including a parasitic inductance of a power circuit (one phase).
FIG. 9 is a schematic diagram of a cross-sectional structure of one embodiment.
FIG. 10 is a schematic diagram of a copper foil circuit pattern according to one embodiment.
FIG. 11 is a schematic diagram of a copper foil circuit pattern according to one embodiment.
FIG. 12 is a schematic diagram of a cross-sectional structure of one embodiment.
FIG. 13 is a schematic diagram of a cross-sectional structure of one embodiment.
[Explanation of symbols]
100: IGBT package with built-in FWD (PKG), 101, 1302: Water channel for cooling power circuit, 102: Water channel for cooling filter capacitor, 103, 302: O-ring, 104: Seal washer, 106: Control terminal, 107: Connector (interface terminal) 108, control board connection cable (interface cable), 109, 204, 308, 902, 1201, 1301 water channel cover, 110, 203, 301, 901, 1202 inverter case, 112, 210 ... housing, cover fastening Bolts (M5 volts), 113, 209 inverter cover, 114 gate drive / power supply board, 115 chip resistor, chip capacitor, 116 microcomputer board, 117 microcomputer, 118 control IC, 120 main terminal / bus bar fastening (M5), 121, 1204: P bus bar, 122, 1205: Insulating sheet, 123, 1206: N bus bar, 124: Output wiring, 125, 904, 1001, 1101: Metal core printed circuit board, 126: Filter capacitor, 127 ... Mounting bolt (M3), 128 ... Transformer, 129 ... Gate driver, 130 ... Water leakage concern (gap), 201 ... Grease, 202 ... Fin, 205,300 ... IGBT module, 206 ... Metal (copper) base, 207, 306: cooling water channel, 208: module mounting bolt, 211: water channel cover / housing mounting bolt, 304: copper fin, 305: finned copper base (metal base), 307: IGBT module cooling opening, 401: cover mounting Bolt hole, 402 ... Copper foil pattern (Emi 403: Emitter terminal, 404: Gate terminal, 405, 1003: Copper foil pattern (collector pattern), 406: Copper foil pattern (gate pattern), 407: Thermistor, 408: Copper foil pattern (U, V, W pattern), 800: P bus bar inductance, 801: Copper foil pattern (P wiring) inductance, 802, 803, 804, 805: PKG100 inductance, 806: Emitter terminal inductance, 807: U wiring copper pattern inductance, 808 ... U terminal inductance, 809 ... N bus bar inductance, 810 ... N terminal inductance, 903 ... Welding point, 1203 ... Inverter bottom cover, 1303 ... Cooling channel spacer.

Claims (11)

A plumbing pipe having a cooling water inlet and an outlet,
A water channel cover connected to the plumbing pipe,
A housing having a partly open wall and covering the periphery of the inverter;
A metal core printed circuit board in which a metal foil pattern is fixed to a metal plate via an insulating resin layer,
A power-cooled inverter having a package in which a power semiconductor chip is sealed and one electrode of the power semiconductor is exposed on the opposite surface of the power semiconductor;
The power circuit constituting the inverter has a structure in which a back electrode of the power semiconductor package is solder-bonded to a metal foil pattern of the metal core printed circuit board,
The bottom surface of the housing is covered with a metal core printed circuit board on which the power semiconductor package is mounted,
The opposite surface of the mounting metal core printed circuit board on which the power semiconductor package is mounted is opposite to the surface on which the power semiconductor is mounted, is covered with the waterway cover,
A structure of a water-cooled inverter, wherein cooling water is directly applied to a back surface of the metal core printed circuit board mounted with the power semiconductor package. In claim 1,
The housing, the metal core printed circuit board, and the waterway cover have substantially the same plane dimensions, and the same specifications such as the position and number of mounting bolt holes. The seal between the metal core printed circuit board and the waterway cover is A water-cooled inverter, wherein an O-ring is disposed between the rear surface of the metal core printed circuit board and the waterway cover, and the metal core printed circuit board, the housing, and the waterway cover are tightened with the mounting bolt holes. In claim 2,
A water-cooled inverter, wherein the O-ring is disposed outside the inner periphery of the housing and inside a mounting bolt. In claim 2,
Substrate material of the metal core printed circuit board is Al, the material of the metal foil pattern Cu, the power semiconductor PKG is, I nsulated G ate B ipolar T ransistor (IGBT), F ree W heeling D iode (FWD) each A water-cooled inverter characterized by having at least one chip built-in. In claim 4,
The power semiconductor PKG is a PKG in which IGBT and FWD are built in one chip each, and one arm of the inverter has a structure in which two or more PKGs are connected in parallel. In claim 1,
The casing is Al die-cast, the substrate material of the metal core printed circuit board is Al, and the aluminum material of the metal core printed circuit board and the casing are welded by means such as friction stirring. Water-cooled inverter. At least, a water supply / drain pipe through which cooling water is supplied / drained, a water channel cover connected to the water supply / drainage pipe, a housing having an upper surface opened to cover the periphery of the inverter, and a metal foil pattern formed on a metal plate via an insulating resin layer. In a structure of a water-cooled inverter composed of a fixed so-called metal core printed circuit board and a package (PKG) in which a power semiconductor chip is sealed and one electrode of the power semiconductor is exposed on the back surface,
The power circuit constituting the inverter has a structure in which a back electrode of the power semiconductor PKG is solder-bonded to a metal foil pattern of the metal core printed circuit board, and the entire upper surface of the housing is covered with the power semiconductor PKG-mounted metal core printed circuit board. A structure of a water-cooled inverter, wherein the water channel cover further covers the entire back surface of the power semiconductor PKG-mounted metal core printed circuit board, and cooling water is directly applied to the back surface of the power semiconductor PKG-mounted metal core printed circuit board. A water supply / drain pipe through which cooling water is supplied / drained, a water channel cover connected to the water supply / drain pipe, a housing having an open bottom surface and surrounding the inverter, a metal plate sealing the entire bottom surface of the housing, and a power semiconductor. In the structure of a water-cooled inverter composed of a power circuit composed of a chip and
The structure of the water-cooled inverter, wherein the casing is made of an Al die-cast material and the metal plate is made of an Al material, and heat generated by the power circuit is cooled by cooling water directly applied to a back surface of the Al plate. In claim 5,
A main terminal for supplying a current of the power circuit is arranged at a substantially center of the plurality of PKG groups constituting each arm, and the copper foil length of the metal core printed circuit board connected to the main terminal is determined by each arm. A water-cooled inverter characterized by being substantially equal in each case. In claim 9,
A water-cooled inverter, wherein a spacer for dividing the water channel into two is provided at a position substantially below the main terminal in the water channel cover, and the water channel for cooling the PKG group is divided into two by the spacer. In claim 4,
The channel cover has at least two types of depressions, a depression having a depth of 5 mm or less, and a depression having a depth of 5 mm or more. The shallow depression is used for the PKG group cooling water passage, and the deep depression is used for circuits other than PKG. A water-cooled inverter characterized by forming a water channel for cooling components.

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