CN216775160U - Electronic equipment heat dissipation shell subassembly - Google Patents

Abstract

The utility model discloses a heat dissipation shell component of electronic equipment, which comprises a first heat-conducting plastic shell, a second shell and a substrate, wherein the substrate is loaded with a heating electronic element; the first heat-conducting plastic shell and the second shell are covered to form a containing cavity for placing a substrate carrying a heating electronic element, one or a plurality of heat-conducting plastic structural members are integrally formed on the inner wall of the first heat-conducting plastic shell in an injection molding mode, and the end faces of the heat-conducting plastic structural members are attached to and connected with the heating electronic element on the substrate. The utility model realizes the coexistence of heat radiation in a heat conduction mode and convection radiation heat radiation through the material selection and the structural design of the shell, and is very suitable for the heat radiation of electronic equipment with relatively sealed inner space or electronic equipment carrying high-power heating electronic elements.

Description

Electronic equipment heat dissipation shell subassembly

Technical Field

The utility model relates to the technical field of heat dissipation equipment, in particular to a heat dissipation shell assembly of electronic equipment.

Background

Along with the development of science and technology, electronic components, the chip is gradually toward high performance, high integration, the development of miniaturization direction, what follow is the promotion of power and the increase of calorific capacity, and be numerous electronic equipment still certain waterproof requirement such as surveillance camera head, transformer, wireless cell-phone charging box etc. mostly closed structure, inside air convection exchanges very slowly, in the operation process, the heat that inside electronic component produced can't directly give off to the external environment in, thereby cause the inside high temperature of electronic equipment, influence equipment performance and life-span, cause the conflagration even.

Currently, for electronic devices with slow convection exchange of internal air, the conventional technical means for accelerating the removal of heat generated during their operation are: firstly, a small radiator is additionally arranged at a heating element part in the electronic equipment to take away heat generated by the heating element, but the method only conducts the heat generated by the heating element to the radiator relatively quickly to be exchanged to the internal space of the electronic equipment, the heat in the electronic equipment is transferred to a shell of the electronic equipment in a natural convection and radiation heat dissipation mode and is exchanged to the external environment through the shell, the heat dissipation efficiency is low, the method is only suitable for heat dissipation of the low-power heating element, and the method cannot be suitable when the power of the heating element is further improved; two, the inside filling heat conduction epoxy of electronic equipment, it becomes the heat conduction bridge between heating element and shell to treat the epoxy solidification back, the heat that makes heating element produce transmits the shell through the conduction mode, and then go in exchanging the external environment, its radiating effect is better than above-mentioned first technical means, but this method need fill a large amount of heat conduction resin in electronic equipment inner space, electronic equipment weight has greatly been increased, to needs pivoted equipment such as surveillance camera head, it can bring very big burden for transmission system, in addition, the heat conduction resin of filling is mostly thermosetting material, it is irreversible after the solidification, equipment in case break down will not maintain, can only wholly change, the replacement cost is higher.

Furthermore, the conventional plastic or metal material is mostly adopted for the current electronic equipment housing, the conventional plastic has a very low thermal conductivity coefficient and cannot meet the heat dissipation requirement of the high-power heating element, while the metal housing has a high thermal conductivity coefficient and can well transfer heat, but generally can only be processed into a simpler shape due to the limitation of a forming process, so that the application occasion of the metal housing is limited, and the cost is relatively high.

Therefore, it is the focus of the present invention to improve the disadvantages of the conventional techniques.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a heat dissipation shell component for electronic equipment, which is suitable for relatively sealing an internal space or carrying a high-power heating electronic element.

The purpose of the utility model is realized by adopting the following technical scheme:

a heat dissipation shell assembly of electronic equipment comprises a first heat-conducting plastic shell, a second shell and a substrate carrying a heating electronic element; the first heat-conducting plastic shell and the second shell are covered to form an accommodating cavity for placing a substrate carrying a heating electronic element; the first heat-conducting plastic shell is characterized in that one or a plurality of heat-conducting plastic structural members are integrally formed on the inner wall of the first heat-conducting plastic shell in an injection molding mode, and the end faces of the heat-conducting plastic structural members are attached to and connected with the heating electronic elements on the substrate.

The size, the number and the arrangement position of the heat-conducting plastic structural parts are determined according to the size, the number and the arrangement position of the heating electronic elements in the electronic equipment on the substrate. The utility model adopts the heat-conducting plastic as a part of the shell component of the electronic equipment, and the heat-conducting plastic structural component arranged on the inner wall of the heat-conducting plastic shell is communicated with the heating electronic element, so that the heat dissipation is realized in a heat conduction mode, the heat generated in the working process of the heating electronic element can be quickly taken away, and the heat-conducting plastic shell is very suitable for the heat dissipation of the electronic equipment with relatively sealed inner space based on the waterproof requirement or the electronic equipment with a high-power heating electronic element.

Optionally, the cover closing connection mode between the first heat-conducting plastic shell and the second shell is a buckle type connection, an adhesive bonding, a threaded connection, a screw fixing connection, a bolt connection or a welding type connection.

Optionally, for the electronic device with a high waterproof requirement, the joint between the first heat-conducting plastic shell and the second shell is coated with a sealant or provided with a sealing ring, so that the sealing and waterproof performance of the heat-radiating shell is further ensured, and the operation of the electronic device is not affected by an external damp environment or rain.

Optionally, the first heat-conducting plastic shell and the second shell are fixedly connected through screws, a plurality of plastic mounting columns embedded with copper nuts are arranged on the end portion of the first heat-conducting plastic shell or the side edge of the inner wall of the bottom of the first heat-conducting plastic shell, and corresponding assembling through holes are formed in the end portion of the second shell. The copper nut is embedded in the plastic mounting column, so that the cover closing assembly strength of the first heat-conducting plastic shell and the second shell can be improved, and the problem that the shell assembly cannot be used due to the fact that the sliding wires are generated in multiple assembly operations and easily generated through direct assembly of the plastic mounting column can be avoided.

Preferably, the end face of the heat-conducting plastic structural member is in fit connection with the heating electronic element on the substrate through a heat-conducting gasket or heat-conducting glue, so that the heat-conducting plastic structural member and the heating electronic element are in zero-clearance fit, the thermal resistance phenomenon is eliminated, the heat generated by the heating electronic element in the operation process of the electronic equipment is ensured, the heat is conducted to the heat-conducting plastic shell through the heat-conducting plastic structural member in a heat conduction mode at the first time, and the heat is rapidly transmitted and dissipated to the external environment through the heat-conducting plastic shell.

Preferably, the heat conduction gasket is a high-temperature-resistant soft heat conduction silica gel sheet with two sides rich in viscosity.

Preferably, the joint of the heat-conducting plastic structural part and the inner wall of the first heat-conducting plastic shell is provided with a reinforcing rib for enhancing the strength of the plastic heat-conducting plastic structural part, increasing the heat dissipation area and accelerating heat conduction.

Optionally, according to the use purpose and the functional requirement of the electronic device, the second housing may be made of transparent glass, transparent plastic, common plastic, transparent plastic or heat-conducting plastic.

Optionally, for an electronic device with a shell having insulation requirements and a heating electronic element having a general power, based on performance and cost considerations, the first thermal conductive plastic shell is made of an insulation thermal conductive engineering plastic with a thermal conductivity greater than or equal to 1W/m · k.

Optionally, for the high-power heating electronic component, the first thermally conductive plastic shell is made of a high thermally conductive nylon composite material with a thermal conductivity coefficient greater than or equal to 3W/m · k, such as a graphite thermally conductive nylon composite material, a graphene thermally conductive nylon composite material, and the like.

Has the advantages that:

1. the electronic equipment shell selects the heat-conducting plastic as at least one part of the electronic equipment shell component, and simultaneously, the heat-conducting plastic structural component for communicating the heating electronic element and the heat-conducting plastic shell is integrally injection-molded on the inner wall of the heat-conducting plastic shell through a unique structural design, so that the coexistence of heat conduction and convection radiation is realized, the electronic equipment shell has good heat-conducting property and excellent heat-radiating effect, and the electronic equipment shell is very suitable for heat radiation of electronic equipment with relatively sealed inner space or electronic equipment with high-power heating electronic elements.

2. The first heat-conducting plastic shell and the heat-conducting plastic structural component in the electronic equipment heat-radiating shell component are integrally formed through an injection molding process, so that the electronic equipment heat-radiating shell component is simple in processing process, low in energy consumption, high in production efficiency and simpler and more convenient to use and assemble.

3. Compared with the prior art, the electronic equipment heat dissipation shell assembly has high design freedom, can be selected according to the use purpose and the function requirement of the electronic equipment, can obtain the most effective heat dissipation effect at the same time of low cost, and has firmer structure because the heat conduction plastic shell and the heat conduction plastic structural part are integrally formed by injection molding of the same material.

Drawings

FIG. 1 is an exploded view of a three-dimensional structure according to an embodiment of the present invention;

fig. 2 is a schematic view of an internal structure of a thermally conductive plastic housing according to an embodiment of the utility model.

Description of reference numerals: 1-a first heat-conducting plastic shell, 2-a second shell, 3-a substrate carrying a heating element, 4-a heat-conducting plastic structural member, 5-a heat-conducting plastic structural member end face, 6-a heating electronic element 6, 7-a heat-conducting silica gel sheet, 8-an assembly screw, 9-an installation column, 10-a reinforcing rib and 11-an assembly through hole.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Fig. 1 and 2 show a heat dissipation housing assembly for electronic devices, which includes a first thermally conductive plastic housing 1, a second housing 2, a substrate 3 carrying a plurality of heat generating electronic components; the first heat-conducting plastic shell 1 and the second shell 2 are covered to form a containing cavity for placing a substrate 3 loaded with heating electronic elements, the inner wall of the first heat-conducting plastic shell 1 is integrally injection-molded with heat-conducting plastic structural members 4 with the same quantity as the heating electronic elements 6, the heat-conducting plastic material is graphite heat-conducting nylon composite material with the heat conductivity coefficient of 3W/m.k, the second shell is made of common plastic, reinforcing ribs 10 are arranged at equal intervals on the periphery of the joint of the heat-conducting plastic structural members 4 and the inner wall of the first heat-conducting plastic shell 1, the inner part of the heat-conducting plastic shell where each heat-conducting plastic structural member 4 is located is arranged after the substrate is assembled, the end face 5 of each heat-conducting plastic structural member is over against the surface of each heating electronic element 6 on the substrate 3, and the inner wall at the bottom of the first heat-conducting plastic shell 1 is provided with a plurality of mounting columns 9 embedded with copper nuts, and an assembly through hole 11 is formed at the corresponding position of the end part of the second shell.

As shown in fig. 1, the heat dissipation housing assembly of the electronic device of this embodiment is very simple and convenient to assemble, first, a high temperature resistant soft heat conductive silicone sheet 7 with two sticky sides is adhered to the surface of the heat generating electronic element 6 on the substrate 3 carrying the heat generating electronic element, then the substrate 3 is pressed against and covered on the surface of the first heat conductive plastic housing 1, so that the surface of the heat generating electronic element 6 is correspondingly adhered to the corresponding end face 5 of the heat conductive plastic structural member in the first heat conductive plastic housing 1 one by one, then the second housing is covered, and screws are screwed through the assembly through holes of the second housing and the substrate face to align with the mounting posts on the inner wall of the bottom of the first heat conductive plastic housing.

In some embodiments, the first thermally conductive plastic housing 1 and the second housing 2 may be connected by a snap-fit connection, an adhesive, a screw connection, a bolt connection, or a welding connection.

In some embodiments, the joint between the first thermally conductive plastic shell 1 and the second shell 2 can be sealed by applying a sealant or adding a sealing ring.

In some embodiments, the end face 5 of the thermally conductive plastic structural member and the heat generating electronic component 6 on the substrate may be attached by thermal adhesive.

In some embodiments, the material of the second housing 2 may be transparent glass, transparent plastic, light-transmissive plastic or heat-conductive plastic according to the purpose and functional requirements of the electronic device.

In some embodiments, the first thermally conductive plastic housing 1 may be made of an insulating and thermally conductive engineering plastic with a thermal conductivity greater than or equal to 1W/m · k.

The first heat-conducting plastic shell with the heat-conducting plastic structural part in the electronic equipment heat-radiating shell component is integrally formed by adopting an injection molding process, the production process is simple, the material is heat-conducting plastic, the whole body is light, the cost is low, the heat conduction effect and the heat radiation effect are good, the heat radiation requirements of electronic equipment with relatively sealed inner space and electronic equipment with a high-power heating electronic element can be met, and the electronic equipment heat-radiating shell component has a great application value and a wide market prospect.

It should be noted that the above contents described in the present specification are only illustrations of the technical solutions of the present invention. All simple and equivalent changes, which are made according to the characteristics and principles described in the present patent concepts, are included in the scope of protection of the present patent.

Claims (9)

1. A heat dissipation shell component of electronic equipment is characterized by comprising a first heat-conducting plastic shell, a second shell and a substrate carrying a heating electronic element; the first heat-conducting plastic shell and the second shell are covered to form a containing cavity for placing a substrate carrying a heating electronic element, one or a plurality of heat-conducting plastic structural members are integrally formed on the inner wall of the first heat-conducting plastic shell in an injection molding mode, and the end faces of the heat-conducting plastic structural members are attached to and connected with the heating electronic element on the substrate.

2. The electronic device heat dissipation housing assembly of claim 1, wherein the first thermally conductive plastic housing and the second housing are coupled to each other via a snap-fit connection, an adhesive bond, a threaded connection, a screw-on connection, a bolt connection, or a welded connection.

3. The electronic device heat dissipation enclosure assembly of claim 2, wherein a sealant is coated or a sealing ring is added at the joint of the first thermally conductive plastic housing and the second housing.

4. The electronic device heat dissipation housing assembly of claim 2, wherein the first thermally conductive plastic housing is fixedly connected to the second housing by screws, a plurality of plastic mounting posts with embedded copper nuts are disposed on the inner wall side of the end or bottom of the first thermally conductive plastic housing, and corresponding mounting through holes are disposed on the end surface of the second housing.

5. The electronic device heat dissipation housing assembly of claim 1, wherein the end face of the thermally conductive plastic structural member is bonded to the heat generating electronic component on the substrate by a thermally conductive gasket or a thermally conductive adhesive.

6. The electronic device heat dissipating housing assembly of claim 5, wherein the thermally conductive gasket is a high temperature resistant soft thermally conductive silicone sheet with adhesive on both sides.

7. The electronic device heat dissipation housing assembly of claim 1, wherein a stiffener is disposed at an interface between the thermally conductive plastic structural member and an inner wall of the first thermally conductive plastic housing.

8. The electronic equipment heat dissipation housing assembly of any one of claims 1 to 7, wherein the first thermally conductive plastic casing is made of an insulating and thermally conductive engineering plastic having a thermal conductivity of 1W/m-k or more.

9. The electronic equipment heat dissipation housing assembly of any one of claims 1 to 7, wherein the first thermally conductive plastic housing is made of a high thermal conductivity nylon composite material having a thermal conductivity of 3W/m-k or more.

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