CN212727850U - Storage device - Google Patents

Abstract

The utility model provides a storage device, it contains body and radiating module. The body comprises a shell, a substrate, a memory unit and a controller. The memory unit and the controller are arranged on the substrate, and the substrate is arranged in the shell. The housing includes a first heat-dissipating structure thermally coupled to at least one of the substrate, the memory unit, and the controller. The heat dissipation module is detachably assembled with the body and comprises a first component. The first assembly comprises a second heat dissipation structure. The outline of the second heat dissipation structure is matched with the outline of the first heat dissipation structure, and the second heat dissipation structure and the first heat dissipation structure are oppositely arranged and are mutually embedded. The storage device can be carried by the body and the heat dissipation module which can be selectively assembled with each other, and the storage device and the heat dissipation module can be assembled according to the use requirement so as to improve the heat dissipation efficiency of the storage device.

Description

Storage device

Technical Field

The utility model relates to a storage device especially relates to a storage device of the heat dissipation module of utensil alternative installation.

Background

With the progress of science and technology, storage devices are gradually developed in a direction of small size and high efficiency. As the performance of electronic components is improved, heat dissipation problems are also accompanied. How to improve the heat dissipation efficiency of the storage device while maintaining the original advantage of small size has become a problem to be solved by many engineers and designers. In addition, although there are many active heat dissipation designs in the market to greatly increase the heat dissipation efficiency, the active heat dissipation devices occupy a large volume, and are difficult to be applied to portable storage devices. Furthermore, active heat sinks all require additional energy input to operate, such as inputting electrical energy to drive a fan, which wastes energy compared to passive heat sinks.

Therefore, there is a need to develop a storage device to solve the problems of the prior art.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a storage device to solve and improve aforementioned prior art's problem and shortcoming.

Another object of the present invention is to provide a storage device, which is connected to its internal heat source through the casing thermal coupling with heat dissipation structure, so as to increase the heat dissipation surface area, and further through selectively assembling the heat dissipation module, the heat dissipation structure of the casing and the heat dissipation module are aligned and embedded with each other, so as to reduce the thermal resistance and improve the heat dissipation efficiency, minimize the size of the storage device, so as to facilitate carrying, and meet the requirements of different situations and needs.

To achieve the above object, the present invention provides a storage device, which comprises a body and a heat dissipation module. The body comprises a shell, a substrate, a memory unit and a controller. The memory unit and the controller are arranged on the substrate, and the substrate is arranged in the shell. The housing includes a first heat-dissipating structure thermally coupled to at least one of the substrate, the memory unit, and the controller. The heat dissipation module is detachably connected with the body and comprises a first component. The first assembly comprises a second heat dissipation structure. The outline of the second heat dissipation structure is matched with the outline of the first heat dissipation structure, and the second heat dissipation structure and the first heat dissipation structure are oppositely arranged and are mutually embedded.

According to one embodiment of the present invention, the first heat dissipation structure includes a plurality of first protrusions and a plurality of first recesses, and the second heat dissipation structure includes a plurality of second protrusions and a plurality of second recesses, wherein the plurality of second protrusions are opposite to the plurality of first recesses and have mutually matching shapes, and the plurality of second recesses are opposite to the plurality of first protrusions and have mutually matching shapes.

According to one embodiment of the present invention, the plurality of first protrusions and the plurality of first recesses are disposed alternately, and the plurality of second protrusions and the plurality of second recesses are disposed alternately.

According to one embodiment of the present invention, the first protrusions and the second protrusions extend outward from a surface of the housing and a surface of the first component in a vertical or inclined direction.

According to one embodiment of the present invention, the first assembly further includes a third heat dissipation structure disposed on an opposite side of the second heat dissipation structure, wherein the third heat dissipation structure includes a plurality of fins.

According to one embodiment of the present invention, the heat dissipation module further includes a second component assembled with the first component, and the second component includes a receiving space for receiving a heat conducting medium.

According to one embodiment of the present invention, the third heat dissipation structure of the first component is partially accommodated in the accommodating space of the second component and is covered by the heat conductive medium.

According to one embodiment of the present invention, the heat transfer medium is liquid, colloid, or sand.

According to one embodiment of the present invention, the heat dissipation module further includes an elastic washer disposed between the first component and the second component.

According to one embodiment of the present invention, the first component and the second component are integrally formed or assembled with each other by a screw lock.

According to one embodiment of the present invention, the heat dissipation module further includes a plug, the second component further includes a hole, the hole is communicated with the accommodating space, and the plug is detachably covering the hole.

According to one embodiment of the present invention, the housing of the body is made of a metal material or a plastic material, the first component of the heat dissipation module is made of a metal material, and the second component is made of a metal material or a plastic material.

According to one embodiment of the present invention, the housing is made of a light-transmitting plastic material, and the second component is made of a light-transmitting plastic material.

According to the present invention, the substrate, the memory unit and the controller are a heat source, and the first component further comprises a plate body, a through groove and a heat dissipation block, wherein the through groove is formed in the plate body, the heat dissipation block is embedded in the through groove and disposed opposite to the heat source in the body, and a heat conductivity coefficient of the heat dissipation block is higher than a heat conductivity coefficient of the plate body.

According to one embodiment of the present invention, the body further includes a bottom plate, the bottom plate supports the substrate and covers one side of the housing, wherein the first heat dissipation structure and the bottom plate are respectively located at two opposite sides of the housing.

According to one embodiment of the present invention, the storage device is a solid state disk.

The beneficial effects of the utility model reside in that, the utility model discloses a body and the heat radiation module of storage device through the mutual montage of alternative can reach and be convenient for hand-carry and can promote storage device radiating efficiency's efficiency when necessary, satisfy storage device's small-size trend and heat dissipation demand with the low cost. Furthermore, the utility model discloses a storage device more can pass through the first heat radiation structure's of body a plurality of first convex parts, a plurality of first concave parts, heat radiation module's the second heat radiation structure's a plurality of second convex parts, a plurality of second concave parts, and the profile design of a plurality of fins of third heat radiation structure to and the use of collocation second subassembly and conducting medium, in order to promote heat dissipation efficiency and can make storage device have the visual effect of preferred according to the user demand.

Drawings

Fig. 1 is a schematic structural diagram of a storage device according to an embodiment of the present invention.

Fig. 2 discloses a schematic structural diagram of the storage device shown in fig. 1 when the body and the heat dissipation module are separated.

Fig. 3 discloses an exploded view of the structure of the storage device of fig. 1.

FIG. 4 is a schematic cross-sectional view of the memory device of FIG. 1 taken along the line A-A'.

Fig. 5 is a schematic cross-sectional view of a storage device according to another embodiment of the present invention.

The reference numbers are as follows:

1. 1 a: storage device

2: body

20. 20 a: shell body

21: substrate

22: memory unit

23: controller

24: first heat dissipation structure

241. 241 a: first convex part

242. 242 a: first concave part

25: base plate

3: heat radiation module

31. 31 a: first assembly

310: plate main body

311: trough penetrating

312: heat dissipation block

32: second heat dissipation structure

321. 321 a: second convex part

322. 322 a: second concave part

33. 33 a: third heat dissipation structure

34: second assembly

341: containing space

342: hole(s)

35: elastic washer

36: plug member

A-A': tangent line

H: horizontal line

V: vertical line

Detailed Description

Some exemplary embodiments that embody the features and advantages of the present invention will be described in detail in the description of the later sections. It is to be understood that the invention is capable of modification in various ways, all without departing from the scope of the invention, and that the description and drawings are to be regarded as illustrative in nature and not as restrictive.

Please refer to fig. 1, fig. 2 and fig. 3. Fig. 1 is a schematic structural diagram of a storage device according to an embodiment of the present invention. Fig. 2 discloses a schematic structural diagram of the storage device shown in fig. 1 when the body and the heat dissipation module are separated. Fig. 3 discloses an exploded view of the structure of the storage device of fig. 1. As shown in the figure, the storage device 1 includes a body 2 and a heat dissipation module 3 that can be selectively combined with or separated from each other. The main body 2 includes a housing 20, a substrate 21, a memory unit 22, and a controller 23. The memory unit 22 and the controller 23 are disposed on the substrate 21, and the substrate 21 is disposed in the casing 20, wherein the memory unit 22, the controller 23 and the substrate 21 can be regarded as a heat source when the storage device 1 operates. The housing 20 includes a first heat dissipation structure 24, and the first heat dissipation structure 24 is thermally coupled to at least one of the memory unit 22, the controller 23, and the substrate 21. The heat sink module 3 is detachably assembled with the body 2 and includes a first assembly 31. The first component 31 includes a second heat dissipation structure 32. The outline of the second heat dissipation structure 32 is matched with the outline of the first heat dissipation structure 24, and the second heat dissipation structure 32 and the first heat dissipation structure 24 are oppositely arranged and are mutually embedded. Therefore, the first heat dissipation structure 24 and the second heat dissipation structure 32 can form a heat dissipation channel, and the body 2 and the heat dissipation module 3 can be assembled by using a close-fit and embedded structure. Through the utility model discloses a storage device 1, the user can carry storage device 1's body 2 alone according to the user demand, uses storage device 1's body 2 anytime and anywhere. When the storage device 1 needs to be used for a long time at a certain point, the heat dissipation module 3 can be combined with the body 2, so that the heat dissipation efficiency of the storage device 1 is improved to maintain the smooth operation of the storage device.

Please refer to fig. 3 and 4. FIG. 4 is a schematic cross-sectional view of the memory device of FIG. 1 taken along the line A-A'. In the embodiment, the storage device 1 is a solid state disk. The first heat dissipation structure 24 of the housing 20 includes a plurality of first protrusions 241 and a plurality of first recesses 242. The second heat dissipation structure 32 of the first component 31 of the heat dissipation module 3 includes a plurality of second protrusions 321 and a plurality of second recesses 322. The second protrusions 321 are opposite to the first recesses 242 and are matched in shape and are fitted with each other, and the second recesses 322 are opposite to the first protrusions 241 and are matched in shape and are fitted with each other. In an embodiment, the plurality of first protrusions 241 and the plurality of first recesses 242 are disposed alternately, and the plurality of second protrusions 321 and the plurality of second recesses 322 are disposed alternately, but not limited thereto.

Please refer to fig. 3, 4 and 5. Fig. 5 is a schematic cross-sectional view of a storage device according to another embodiment of the present invention. In the present embodiment, the first component 31 of the heat dissipation module 3 may be, for example, but not limited to, a plate, and further includes a third heat dissipation structure 33 disposed opposite to the second heat dissipation structure 32 on two opposite sides of the first component 31. In the present embodiment, the first protrusion 241 and the second protrusion 321 are fins, and the third heat dissipation structure 33 also includes a plurality of fins. In an embodiment, the plurality of first protrusions 241 and the housing 20 are integrally formed as a single structure, and the plurality of second protrusions 321 and the plurality of fins of the third heat dissipation structure 33 and the first component 31 are integrally formed as a single structure, but not limited thereto. It should be emphasized that, under the condition that the first protrusion 241 of the housing 20 and the second recess 322 of the first component 31 and the first recess 242 of the housing 20 and the second protrusion 321 of the first component 31 can be tightly fitted with each other, the profiles of the fins of the first protrusion 241, the second protrusion 321 and the third heat dissipation structure 33 are not limited, and can be changed according to the actual application requirements, thereby achieving different heat dissipation or visual effects. For example, in an embodiment, the number of the fins of the third heat dissipation structure 33 is greater than the number of the second protrusions 321 of the second heat dissipation structure 32, so as to increase the heat dissipation area of the storage device 1 when the body 2 and the first component 31 of the heat dissipation module 3 are assembled with each other. In another embodiment, as shown in fig. 4, the plurality of first protrusions 241, the plurality of second protrusions 321, and the plurality of fins of the third heat dissipation structure 33 all extend outward from the surface of the housing 20 and the surface of the first component 31 in a direction parallel to the vertical line V, are arranged in a direction parallel to the horizontal line H, and have wavy undulations. In other embodiments, as shown in fig. 5, the plurality of first protrusions 241a, the plurality of second protrusions 321a, and the plurality of fins of the third heat dissipation structure 33a extend outward from the surface of the housing 20a and the surface of the first component 31a in a direction inclined with respect to the vertical line V.

Please refer to fig. 3 and 4. In the present embodiment, the heat dissipation module 3 further includes a second component 34. The second component 34 may be, for example but not limited to, a cavity, and includes a receiving space 341 for receiving a heat conducting medium therein. The heat transfer medium may be a liquid, a gel, or sand, such as water, silica gel, or metal sand, but is not limited thereto. In one embodiment, the heat-conducting medium is preferably water. The heat dissipation module 3 further includes an elastic gasket 35 disposed between the first component 31 and the second component 34 to achieve waterproof and sealing functions when the first component 31 and the second component 34 are assembled, but not limited thereto. In the embodiment, when the first module 31 is assembled with the second module 34, the plurality of fins of the third heat dissipation structure 33 of the first module 31 are partially accommodated in the accommodating space 341 of the second module 34 and are covered by the heat conductive medium. Therefore, when the body 2 is assembled with the heat dissipation module 3, the heat conducting media in the first heat dissipation structure 24, the second heat dissipation structure 32, the third heat dissipation structure 33 and the second component 34 can form a heat dissipation channel, so that heat generated by the heat source can be dissipated through the heat dissipation channel, thereby improving the heat dissipation efficiency.

In the embodiment, the first component 31 and the second component 34 are assembled by gluing, screwing or fastening, but not limited thereto. In some embodiments, the first component 31 and the second component 34 can also be a single-piece structure integrally formed. The heat dissipation module 3 further includes a plug 36, and the second component 34 further includes a hole 342, wherein the hole 342 is communicated with the accommodating space 341. Plug 36 may detachably cover hole 342 to facilitate filling and, if necessary, replacement of the heat transfer medium within second component 34.

In the present embodiment, the first component 31 further includes a plate body 310, a through slot 311 and a heat dissipation block 312. The through-slot 311 is formed in the board body 310, and the heat dissipation block 312 is embedded in the through-slot 311. The second protrusions 321, the second recesses 322, and the fins of the third heat dissipation structure 33 of the second heat dissipation structure 32 are formed on the plate body 310 and the heat dissipation block 312, and their respective outlines are substantially continuous, but not limited thereto. In some embodiments, the thermal conductivity of the heat dissipation block 312 is higher than that of the board main body 310, and when the body 2 of the storage device 1 is assembled with the heat dissipation module 3, the heat dissipation block 312 corresponds to the heat source position in the body 2, so as to improve the heat dissipation effect at the heat source, so that the storage device 1 does not have a local overheating condition, and further, the temperature equalization effect is achieved. In an embodiment, the heat dissipation block 312 is disposed opposite to at least one of the substrate 21, the memory unit 22 and the controller 23, and is preferably disposed opposite to the memory unit 22, but not limited thereto. In the present embodiment, the heat dissipation block 312 is tightly embedded in the through slot 311 and assembled with the plate body 310 by gluing, locking, buckling or propping. In an embodiment, the board body 310 and the heat dissipation block 312 are made of different metal materials, wherein the board body 310 is made of aluminum or an alloy thereof, and the heat dissipation block 312 is made of copper or an alloy thereof, but not limited thereto.

In the embodiment, the main body 2 further includes a bottom plate 25 for carrying the substrate 21 and covering one side of the housing 20. In the present embodiment, at least one of the substrate 21, the memory unit 22 and the controller 23 is thermally coupled to the first heat dissipation structure 24, wherein at least one of the substrate 21, the memory unit 22 and the controller 23 is directly attached to the first heat dissipation structure 24 or thermally coupled thereto through a thermal pad or a thermal adhesive (not shown). In the present embodiment, the first heat dissipation structure 24 and the bottom plate 25 are respectively located at two opposite sides of the housing 20, but not limited thereto.

In some embodiments, to achieve better heat dissipation effect, the housing 20 of the body 2, the first component 31 of the heat dissipation module 3 and the second component 34 can be made of a metal material, such as aluminum, aluminum alloy, copper or copper alloy, but not limited thereto. In other embodiments, since the housing 20 of the body 2 and the second component 34 of the heat dissipation module 3 occupy a larger external area of the storage device 1, the housing 20 and the second component 34 may be, for example, but not limited to, made of a transparent plastic material, and the heat-conducting medium inside the second component 34 may also have a special color, so that the storage device 1 has a better visual effect.

To sum up, the storage device of the present invention can achieve the effects of being convenient to carry about and enhancing the heat dissipation efficiency of the storage device when necessary by the body and the heat dissipation module which can be selectively assembled, and can satisfy the small-size trend and the heat dissipation requirement of the storage device with low cost. Furthermore, the utility model discloses a storage device more can pass through the first heat radiation structure's of body a plurality of first convex parts, a plurality of first concave parts, heat radiation module's the second heat radiation structure's a plurality of second convex parts, a plurality of second concave parts, and the profile design of a plurality of fins of third heat radiation structure to and the use of collocation second subassembly and conducting medium, in order to promote heat dissipation efficiency and can make storage device have the visual effect of preferred according to the user demand.

The present invention may be modified by those skilled in the art without departing from the scope of the appended claims.

Claims (16)

1. A storage device, comprising:

a body including a housing, a substrate, a memory unit and a controller, wherein the memory unit and the controller are disposed on the substrate, the substrate is disposed in the housing, and the housing includes a first heat dissipation structure thermally coupled to at least one of the substrate, the memory unit and the controller; and

the heat dissipation module is detachably assembled with the body and comprises a first assembly, the first assembly comprises a second heat dissipation structure, the outline of the second heat dissipation structure is matched with the outline of the first heat dissipation structure, and the second heat dissipation structure and the first heat dissipation structure are oppositely arranged and are mutually embedded.

2. The storage device as claimed in claim 1, wherein the first heat dissipation structure comprises a plurality of first protrusions and a plurality of first recesses, and the second heat dissipation structure comprises a plurality of second protrusions and a plurality of second recesses, wherein the plurality of second protrusions are opposite to the plurality of first recesses and have shapes matching with each other and are embedded with each other, and the plurality of second recesses are opposite to the plurality of first protrusions and have shapes matching with each other and are embedded with each other.

3. The storage device of claim 2, wherein the first protrusions and the first recesses are staggered, and the second protrusions and the second recesses are staggered.

4. The storage device of claim 2, wherein the first protrusions and the second protrusions extend outwardly from a surface of the housing and a surface of the first member in a vertical or oblique direction.

5. The storage device of claim 1, wherein the first assembly further comprises a third heat dissipation structure disposed on an opposite side of the second heat dissipation structure, wherein the third heat dissipation structure comprises a plurality of fins.

6. The storage device as claimed in claim 5, wherein the heat dissipation module further comprises a second component assembled with the first component, and the second component comprises a receiving space for receiving a heat conductive medium.

7. The storage device as claimed in claim 6, wherein the third heat dissipation structure of the first component is partially received in the receiving space of the second component and is covered by the heat conductive medium.

8. A storage device according to claim 6 wherein the heat transfer medium is a liquid, gel or grit.

9. The storage device of claim 6, wherein the heat sink module further comprises a resilient gasket disposed between the first component and the second component.

10. The storage device of claim 6, wherein the first member and the second member are integrally formed or assembled with each other by a screw lock.

11. The storage device as claimed in claim 6, wherein the heat sink module further comprises a plug member, the second member further comprises a hole communicating with the receiving space, and the plug member detachably covers the hole.

12. The storage device as claimed in claim 6, wherein the housing of the body is made of metal or plastic material, the first component of the heat dissipation module is made of metal material, and the second component is made of metal or plastic material.

13. The storage device of claim 12 wherein the housing is constructed of a light transmissive plastic material and the second component is constructed of a light transmissive plastic material.

14. The storage device of claim 1, wherein the substrate, the memory unit and the controller are a heat source, and the first assembly further comprises a main body, a through-slot and a heat dissipation block, wherein the through-slot is formed in the main body, the heat dissipation block is embedded in the through-slot and disposed opposite to the heat source in the main body, and a thermal conductivity of the heat dissipation block is higher than a thermal conductivity of the main body.

15. The storage device as claimed in claim 1, wherein the body further comprises a bottom plate, the bottom plate is used for supporting the substrate and is covered on one side of the housing, and the first heat dissipation structure and the bottom plate are respectively located on two opposite sides of the housing.

16. The storage device of claim 1, wherein the storage device is a solid state drive.

Images