CN211349236U

CN211349236U - Involutive sealing packaging structure for tablet personal computer

Info

Publication number: CN211349236U
Application number: CN202020330536.0U
Authority: CN
Inventors: 刘慧阳; 刘志聪
Original assignee: Dongguan Lianzhou Electronic Technology Co Ltd
Current assignee: Dongguan Lianzhou Electronic Technology Co Ltd
Priority date: 2020-03-16
Filing date: 2020-03-16
Publication date: 2020-08-25
Anticipated expiration: 2030-03-16

Abstract

The utility model relates to the technical field of tablet equipment, in particular to a folding sealing packaging structure for a tablet personal computer, which comprises a computer main body, a lower shell and an upper shell which are arranged on the computer main body, wherein the lower shell comprises a mounting bar and a supporting block, the lower shell is provided with a mounting hole, the supporting block is connected with a lower fixing plate, and the lower fixing plate is provided with a lower buckle; go up the casing and include circuit board, power supply module, chip subassembly, temperature controller and buffer, heat-radiating component is installed to the circuit board, power supply module installs the fan module, it is provided with solid board to go up the casing, goes up solid board and installs the buckle, the utility model provides a traditional panel computer's thermal conductivity is relatively poor, leads to panel computer's high temperature easily, and the sealing performance of encapsulation is relatively poor scheduling problem also, adopts the mode encapsulation panel computer that joint and joint strip combined together, and it is effectual to encapsulate to the auxiliary design heat radiation structure, overall structure reasonable in design.

Description

Involutive sealing packaging structure for tablet personal computer

Technical Field

The utility model relates to a panel equipment technical field especially relates to a panel computer is with closing sealed packaging structure.

Background

The existing tablet personal computer, also called as a portable computer, is a small-sized and portable personal computer, and the tablet personal computers are divided into two types, one is to lighten the computer, the differences between this type of computer and a conventional computer are only the running speed, what the computer does, what he can do, under the condition that the performance is sufficient, the touch screen is used as basic input equipment, the other type of the touch screen is provided with the touch pen or the digital pen, a user is allowed to operate through the touch pen or the digital pen instead of a traditional keyboard or a traditional mouse, the user can realize input through built-in handwriting recognition, a soft keyboard on a screen, voice recognition or a real keyboard, certain defects exist in the existing tablet personal computer during use, the traditional tablet personal computer is poor in heat conduction performance, the temperature of the tablet personal computer is easily overhigh, the tablet is burnt, the sealing performance of packaging is poor, and the use experience of the user is influenced.

SUMMERY OF THE UTILITY MODEL

In order to solve the problem, the utility model provides a panel computer is with closing sealed packaging structure has solved traditional panel computer's heat conductivility relatively poor, leads to panel computer's high temperature easily, burns out the flat board, and the sealing performance of encapsulation also relatively poor scheduling problem adopts the mode encapsulation panel computer that joint and joint strip combined together, and it is effectual to encapsulate to the auxiliary design heat radiation structure, overall structure reasonable in design.

In order to solve the above-mentioned object, the utility model adopts the following technical scheme:

a folding sealing packaging structure for a tablet personal computer comprises a computer main body, a lower shell and an upper shell, wherein the lower shell is installed on the computer main body, the upper shell is installed on the computer main body and connected with the lower shell, the lower shell comprises a mounting bar and a supporting block installed on the mounting bar, the lower shell is provided with a mounting hole corresponding to the mounting bar, the supporting block penetrates through the mounting hole to be connected with a lower fixing plate, and the lower fixing plate is provided with a lower buckle; go up the casing and include circuit board, power supply module, chip subassembly, temperature controller and buffer, circuit board surface mounting has radiator unit, power supply module installs the fan module, and the fan module includes fan holding tank and radiator fan, the fan module is connected with the temperature controller electricity, chip subassembly periphery is provided with the supporting seat, it still is provided with and holds the chamber to go up the casing, holds the intracavity and is provided with solid board on, go up solid board install with lower buckle complex go up the buckle.

The further improvement of the scheme is that the upper shell is provided with a touch display screen and a volume key.

The further improvement of the scheme is that the surfaces of the circuit board, the power supply assembly and the chip assembly are all provided with heat dissipation film layers, and the heat dissipation film layers are graphite heat dissipation film layers.

The further improvement to the above scheme is that the heat dissipation assembly comprises a heat dissipation plate and heat dissipation pipes, and the heat dissipation pipes are distributed on two sides of the heat dissipation plate.

The supporting block is surrounded with a sealing rubber strip.

The further improvement of the scheme is that the four buffering devices are respectively positioned at four corners of the upper shell and comprise buffering seats and convex blocks, and the convex blocks are made of rubber elastic materials.

The utility model has the advantages as follows:

the utility model adopts the mode of combining the clamping joint and the sealing rubber strip to package the panel computer, the packaging effect is good, the heat dissipation structure is designed in an auxiliary way, the whole structure design is reasonable, the computer main body is provided with an upper shell and a lower shell which are connected with each other, in particular, the lower shell is connected with the upper shell through the mounting strip, the connection effect is good, the lower shell is provided with the mounting hole corresponding to the mounting strip, the mounting effect is good, the part of the mounting strip positioned below the lower shell is provided with the supporting block, the supporting block is connected with the lower fixing plate through the mounting hole, the lower fixing plate is provided with the lower buckle, the lower buckle is used for clamping joint, the upper shell comprises a circuit board, a power supply module, a chip module, a temperature controller and a buffer device, the circuit board is provided with the heat dissipation module, the heat, the fan holding tank is used for placing radiator fan, and radiator fan is used for dispelling the heat to power supply module, and the radiating effect is good, and fan module is connected with the temperature controller and is used for the interior ground temperature condition of real time monitoring computer main part, chip subassembly periphery is provided with the supporting seat, and the supporting seat plays certain guard action to chip subassembly, goes up the casing and still is provided with and holds the chamber and be used for placing internal element, holds the intracavity and is provided with solid board, goes up solid board and installs and go up the buckle with lower buckle complex, goes up the mutual joint of buckle and lower buckle, and the joint is effectual, and overall structure reasonable in design is reliable and stable.

The utility model provides a traditional panel computer's heat conductivility relatively poor, lead to panel computer's high temperature easily, burn out the flat board, the sealing performance of encapsulation also relatively poor scheduling problem adopts the mode encapsulation panel computer that joint and joint strip combined together, and the packaging effect is good to auxiliary design heat radiation structure, overall structure reasonable in design.

Drawings

Fig. 1 is a schematic perspective view of the present invention;

fig. 2 is a schematic perspective view of another perspective of the present invention;

FIG. 3 is an exploded view of the three-dimensional structure of the present invention;

fig. 4 is a schematic structural view of the lower housing of the present invention.

Description of reference numerals: the computer comprises a computer body 100, a lower shell 110, a mounting hole 111, a mounting bar 112, a supporting block 113, a lower fixing plate 114, a lower buckle 115, a sealing rubber strip 116, an upper shell 120, a circuit board 121, a heat dissipation plate 121a, a heat dissipation pipe 121b, a chip assembly 122, a supporting seat 122a, a power assembly 123, a heat dissipation fan 123a, a fan accommodating groove 123b, a buffer device 124, a buffer seat 124a, a bump 124b, an upper fixing plate 126, an upper buckle 127, a temperature controller 128, a heat dissipation film 129, a volume key 140 and a touch display 150.

Detailed Description

The present invention will be further described with reference to the accompanying drawings.

Referring to fig. 1 to 4, an involutory sealing and packaging structure for a tablet personal computer comprises a computer main body 100, a lower shell 110 installed on the computer main body 100, and an upper shell 120 installed on the computer main body 100 and connected with the lower shell 110, wherein the connection effect is good, the lower shell 110 comprises a mounting bar 112 and a supporting block 113 installed on the mounting bar 112, the mounting bar 112 is arranged for connecting the upper shell 120 and the lower shell 110 in a packaging manner, a sealing rubber strip 116 is arranged around the supporting block 113, the sealing effect is good, the lower shell 110 is provided with a mounting hole 111 corresponding to the mounting bar 112, the supporting block 113 penetrates through the mounting hole 111 and is connected with a lower fixing plate 114, the lower fixing plate 114 is provided with a lower buckle 115, and the lower buckle 115 is used for clamping; the upper casing 120 comprises a circuit board 121, a power supply module 123, a chip module 122, a temperature controller 128 and a buffer device 124, wherein a heat dissipation module is mounted on the surface of the circuit board 121, the heat dissipation module is arranged to help to dissipate heat of the circuit board 121, the power supply module 123 is provided with a fan module, the fan module comprises a fan accommodating groove 123b and a heat dissipation fan 123a, the fan accommodating groove 123b is used for accommodating the heat dissipation fan 123a, the heat dissipation fan 123a is used for dissipating heat of the power supply module 123, the heat dissipation effect is good, the fan module is electrically connected with the temperature controller 128 and used for monitoring the temperature condition in the computer main body 100 in real time, a supporting seat 122a is arranged on the periphery of the chip module 122, when the computer main body 100 is impacted, the supporting seat 122a plays a certain role in protecting the chip module 122, the upper casing 120 is provided with, the clamping device is used for placing internal elements, an upper fixing plate 126 is arranged in the accommodating cavity, the upper fixing plate 126 is provided with an upper clamping buckle 127 matched with the lower clamping buckle 115, the upper clamping buckle 127 and the lower clamping buckle 115 are clamped mutually, the clamping effect is good, the whole structure is reasonable in design, and the clamping device is stable and reliable.

The surfaces of the circuit board 121, the power supply module 123 and the chip module 122 are all provided with heat dissipation films 129, the heat dissipation films 129 are graphite heat dissipation films 129, the graphite heat dissipation films 129 can conduct heat quickly, and the heat dissipation film 129 has high heat conduction performance and high heat dissipation efficiency.

The heat dissipation assembly includes a heat dissipation plate 121a and a heat dissipation tube 121b, and the heat dissipation tube 121b is disposed on both sides of the heat dissipation plate 121a and connected to the surface of the circuit board 121, so that the heat dissipation effect is good.

The four buffering devices 124 are respectively located at four corners of the upper housing 120, so as to ensure that the computer main body 100 plays a certain buffering role when being impacted, the buffering devices 124 comprise buffering seats 124a and bumps 124b, and the bumps 124b are made of rubber elastic materials, so that the buffering effect is improved.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. A butt-joint sealing packaging structure for a tablet personal computer is characterized by comprising a computer main body, a lower shell and an upper shell, wherein the lower shell is installed on the computer main body, the upper shell is installed on the computer main body and connected with the lower shell, the lower shell comprises an installation strip and a supporting block installed on the installation strip, the lower shell is provided with an installation hole corresponding to the installation strip, the supporting block penetrates through the installation hole to be connected with a lower fixing plate, and the lower fixing plate is provided with a lower buckle; go up the casing and include circuit board, power supply module, chip subassembly, temperature controller and buffer, circuit board surface mounting has radiator unit, power supply module installs the fan module, and the fan module includes fan holding tank and radiator fan, the fan module is connected with the temperature controller electricity, chip subassembly periphery is provided with the supporting seat, it still is provided with and holds the chamber to go up the casing, holds the intracavity and is provided with solid board on, go up solid board install with lower buckle complex go up the buckle.

2. The involutory seal packaging structure for the tablet computer according to claim 1, wherein the upper case is mounted with a touch display screen and volume keys.

3. The involutory sealed packaging structure for the tablet computer as claimed in claim 1, wherein the circuit board, the power supply module and the chip module are all provided with a heat dissipation film layer on their surfaces, and the heat dissipation film layer is a graphite heat dissipation film layer.

4. The involutory sealing packaging structure for a tablet computer as claimed in claim 1, wherein the heat dissipation assembly comprises a heat dissipation plate and a heat dissipation pipe, and the heat dissipation pipe is distributed on two sides of the heat dissipation plate.

5. The involuntary sealing packaging structure for the tablet personal computer as claimed in claim 1, wherein the supporting block is provided with a sealing rubber strip around the supporting block.

6. The involutory sealing packaging structure for the tablet personal computer as claimed in claim 1, wherein the buffering devices are four groups and located at four corners of the upper housing respectively, the buffering devices comprise buffering bases and bumps, and the bumps are made of rubber elastic materials.