CN214205608U - Mobile phone motherboard heat radiation structure - Google Patents
Mobile phone motherboard heat radiation structure Download PDFInfo
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- CN214205608U CN214205608U CN202120572718.3U CN202120572718U CN214205608U CN 214205608 U CN214205608 U CN 214205608U CN 202120572718 U CN202120572718 U CN 202120572718U CN 214205608 U CN214205608 U CN 214205608U
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Abstract
The utility model provides a mobile phone mainboard heat dissipation structure, which comprises a support plate and a shell, wherein the mainboard is arranged on the support plate, and the support plate is arranged in the shell; the supporting plate comprises a frame and an elastic connecting plate, the elastic connecting plate is connected with the frame, one side of the frame, which is positioned in the accommodating groove, is concavely provided with a sealing groove, one side of the frame is provided with a first through hole, a heat conduction copper pipe is embedded in the elastic connecting plate, and the heat conduction copper pipe is connected with the frame; one side of the elastic connecting plate, which is positioned in the accommodating groove, is bonded with a heat conducting film, the surface of the heat conducting film is bonded with a heat radiating copper sheet, and one end, far away from the heat conducting film, of the heat radiating copper sheet penetrates through the sealing ring and extends into the first through hole; one side of the shell close to the mainboard is provided with a micro fan. The utility model discloses in, be provided with first through-hole and second through-hole respectively on backup pad and casing, be equipped with the heat dissipation copper sheet on the heat conduction membrane, in the heat dissipation copper sheet conducts heat to first through-hole, the circulation of air above the mainboard can be driven to miniature fan, improves the radiating efficiency.
Description
Technical Field
The utility model relates to a mobile phone technology field particularly, relates to a mobile phone motherboard heat radiation structure.
Background
The mobile phone mainboard is a core component of the mobile phone, various card seats, connectors and the like are welded on the mainboard, and when the mobile phone is assembled, the mobile phone mainboard needs to be installed on a mainboard frame or a supporting plate so as to protect the mobile phone mainboard. When the mobile phone is used, especially when large-memory software is operated, a mobile phone mainboard and a battery are easy to heat, if the heat cannot be dissipated in time, the operation of the mobile phone is affected, and a dead halt and a black screen can be caused in serious cases.
Patent CN212086248U discloses an active heat radiation structure of mobile phone motherboard, it sets up exhaust hole and miniature fan on the cell-phone casing, miniature fan and mobile phone motherboard are connected, the air that drives in the cell-phone shell through miniature fan flows, play radiating effect, the radiating problem of the mobile phone motherboard of the fine solution of this scheme, nevertheless in this scheme, only dispel the heat through the exhaust hole, its radiating efficiency is not high, when the big memory software of cell-phone long-time operation, the cell-phone that can not be timely dispels the heat.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a mobile phone motherboard heat radiation structure, it has mainboard backup pad and cell-phone casing, is equipped with first through-hole in the backup pad, is equipped with the heat dissipation copper sheet in the first through-hole, is equipped with miniature fan and second through-hole on the cell-phone casing, through miniature fan, drives the circulation of air for the air flow on the heat dissipation copper sheet improves the radiating efficiency.
The utility model discloses a realize through following technical scheme: a mobile phone mainboard heat dissipation structure comprises a support plate and a shell, wherein a mainboard is arranged on the support plate, and the support plate is arranged in the shell;
the supporting plate comprises a frame and an elastic connecting plate, and the elastic connecting plate is connected with the frame to form a containing groove for containing the mainboard; a sealing groove is concavely arranged on one side of the frame, which is positioned in the accommodating groove, a sealing ring matched with the sealing groove is arranged in the sealing groove, a first through hole is formed on one side of the frame, which is far away from the accommodating groove, and the first through hole is communicated with the sealing groove; a heat conduction copper pipe is embedded in the elastic connecting plate and connected with the frame; a heat-conducting film is adhered to one side, located in the accommodating groove, of the elastic connecting plate, a heat-radiating copper sheet is adhered to the surface of the heat-conducting film, and one end, far away from the heat-conducting film, of the heat-radiating copper sheet penetrates through the sealing ring and extends into the first through hole;
a cavity is formed between the shell and the mainboard, a micro fan is arranged on one side of the shell close to the mainboard, and the micro fan is connected with the mainboard; the casing is close to the concave second through-hole that is equipped with in one side of first through-hole, the second through-hole with first through-hole intercommunication, the second through-hole with the cavity intercommunication, just the second through-hole with the casing outside intercommunication to form the wind channel that is used for the circulation of air, the air inlet of miniature fan with the cavity intercommunication, the gas outlet of miniature fan is located the casing is outside.
The utility model discloses in, be provided with first through-hole and second through-hole respectively on backup pad and casing, be equipped with the heat dissipation copper sheet on the heat conduction membrane, in the heat dissipation copper sheet conducts the heat to first through-hole, the miniature fan of setting on the casing accelerates the circulation of air in the first through-hole, and outside the heat can be quick on the heat dissipation copper sheet was led to the casing, simultaneously, miniature fan was located the cavity top, can drive the circulation of air of mainboard top, improved the radiating efficiency.
The first through holes are multiple, the second through holes are multiple, and the second through holes are in one-to-one correspondence with the first through holes.
The heat conduction copper pipes are a plurality of, and the heat conduction copper pipes are embedded in the elastic connecting plate in a criss-cross mode. Inlay the heat conduction copper pipe and establish in elastic connection board, the heat conduction copper pipe can play certain supporting role, provides certain holding power for the mainboard, can prevent on the one hand that the frame warp, and on the other hand, the heat conduction copper pipe inlays and establishes in elastic connection board, and the mainboard is installed on elastic connection board, and the heat of mainboard can be absorbed to the heat conduction copper pipe, plays the radiating effect of cooling.
The elastic connecting plate is made of rubber.
The heat conducting film is a double-layer film formed by bonding a graphene polyimide composite film and a copper foil through a pressure sensitive adhesive, the graphene polyimide composite film is arranged on one side, close to the mainboard, of the double-layer film, and the copper foil is arranged on one side, far away from the mainboard, of the double-layer film.
One end of the heat dissipation copper sheet, which is connected with the heat conduction film, is in a strip shape, a fan shape or a tree shape. The contact area between the heat dissipation copper sheet and the heat conduction film is enlarged, so that heat on the heat conduction film can be conducted into the first through hole through the heat dissipation copper sheet, and the heat dissipation efficiency is improved.
The utility model discloses following advantage and beneficial effect have at least:
1. in the utility model discloses in, install the mainboard on elastic connection board, utilize elastic connection board's elasticity, absorb the external force that the mainboard received, reduce the damage to the mainboard to, still be provided with a plurality of through-holes on the frame, the through-hole is connected with the seal groove, is provided with the sealing washer at the seal groove, and the external force that the through-hole dispersible frame that sets up on the frame received to with the sealing washer cooperation, the further external force that the reduction mainboard received plays the effect of protection mainboard. Still be provided with the heat conduction membrane on the elastic connection board, heat conduction membrane and heat conduction copper pipe combined action improve the radiating efficiency of mainboard.
2. The utility model discloses in, be provided with first through-hole and second through-hole respectively on backup pad and casing, be equipped with the heat dissipation copper sheet on the heat conduction membrane, in the heat dissipation copper sheet conducts the heat to first through-hole, the miniature fan of setting on the casing accelerates the circulation of air in the first through-hole, heat on the heat dissipation copper sheet can be quick outside being led to the casing, and simultaneously, the miniature fan is located the cavity top, can drive the circulation of air of mainboard top, improves the radiating efficiency.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic front view of a support plate of a heat dissipation structure according to the present invention;
fig. 2 is a schematic front view of a mobile phone with a heat dissipation structure according to the present invention;
FIG. 3 is a schematic cross-sectional view taken along the line B-B in FIG. 1;
FIG. 4 is a schematic cross-sectional view taken along the line A-A in FIG. 2;
FIG. 5 is an enlarged view of portion C of FIG. 4;
icon: 1-support plate, 11-frame, 12-elastic connecting plate, 13-sealing ring, 14-first through hole, 15-heat conducting copper pipe, 16-heat conducting film, 17-connecting block, 18-heat radiating copper sheet, 2-shell, 21-micro fan, 22-second through hole and 3-mainboard.
Detailed Description
Example (b): as shown in the attached figures 1-5,
a mobile phone mainboard heat dissipation structure comprises a support plate 1 and a shell 2, wherein a mainboard 3 is arranged on the support plate 1, and the support plate 1 is arranged in the shell 2; the support plate 1 and the housing 2 are assembled together by assembly means known in the art.
The supporting plate 1 comprises a frame 11 and an elastic connecting plate 12, wherein the elastic connecting plate 12 is connected with the frame 11 to form a containing groove for containing the mainboard 3; in this embodiment, the elastic connection plate 12 is made of elastic rubber, and has certain flexibility. The frame 11 is located one side of storage tank is the concave seal groove that is equipped with, be equipped with in the seal groove with seal groove matched's sealing washer 13, the cross section of this seal groove is cross, and is corresponding, and the cross section of the sealing washer 13 that sets up in the seal groove also is cross, and this sealing washer 13 is big with frame 11's area of contact, and when frame 11 received external force, sealing washer 13 also can play certain cushioning effect to protection mainboard 3.
A plurality of first through holes 14 are formed in one side, away from the accommodating groove, of the frame 11, and the first through holes 14 are communicated with the sealing groove; when the seal ring 13 is placed in the seal groove, the seal ring 13 blocks the through hole 4 to prevent dust from entering the joint between the seal ring 13 and the main board 3.
A plurality of heat conduction copper pipes 15 are embedded in the elastic connecting plate 12, and the plurality of heat conduction copper pipes 15 are connected with the frame 11; one side of the frame 11, which is positioned in the accommodating groove, is convexly provided with a connecting block 17, the connecting block 17 is also embedded in the elastic connecting plate 12, the copper pipe which is transversely arranged is connected with the connecting block 17, and the copper pipe which is longitudinally arranged is connected with the copper pipe which is transversely arranged. Inlay heat conduction copper pipe 15 and establish in elastic connection board 12, heat conduction copper pipe 15 can play certain supporting role, provides certain holding power for mainboard 3, can prevent on the one hand that frame 11 from warping, and on the other hand, heat conduction copper pipe 15 inlays and establishes in elastic connection board 12, and mainboard 3 is installed on elastic connection board 12, and heat conduction copper pipe 15 can absorb the heat of mainboard 3, plays the radiating effect of cooling. One side of the elastic connecting plate 12, which is located in the accommodating groove, is adhered with a heat conducting film 16, and the heat conducting film 16 and the heat conducting copper pipe 15 act together to improve the heat dissipation efficiency of the mainboard 3.
As shown in fig. 5, a heat dissipating copper sheet 18 is adhered to the surface of the heat conducting film 16, and one end of the heat dissipating copper sheet 18, which is far away from the heat conducting film 16, penetrates through the sealing ring 13 and extends into the first through hole 14; the heat conducting film 16 is a double-layer film formed by bonding a graphene polyimide composite film and a copper foil through a pressure sensitive adhesive, the graphene polyimide composite film is arranged on one side of the double-layer film close to the mainboard 3, and the copper foil is arranged on one side far away from the mainboard 3. One end of the heat dissipation copper sheet 18 connected with the heat conduction film 16 is in a strip shape, a fan shape or a tree shape. The contact area between the heat dissipation copper sheet 18 and the heat conduction film 16 is enlarged, so that heat on the heat conduction film 16 can be conducted into the first through hole 14 through the heat dissipation copper sheet 18, and the heat dissipation efficiency is improved.
A cavity is formed between the shell 2 and the mainboard 3, a micro fan 21 is arranged on one side of the shell 2 close to the mainboard 3, and the micro fan 21 is connected with the mainboard 3; one side of the shell 2, which is close to the first through hole 14, is concavely provided with a second through hole 22, the second through hole 22 is communicated with the first through hole 14, the second through hole 22 is communicated with the cavity, and the second through hole 22 is communicated with the outside of the shell 2 to form an air channel for air circulation, an air inlet of the micro fan 21 is communicated with the cavity, and an air outlet of the micro fan 21 is positioned outside the shell 2. The number of the first through holes 14 is plural, the number of the second through holes 22 is plural, and the plural second through holes 22 correspond to the plural first through holes 14 one to one.
In the heat dissipation structure using this embodiment, the micro fan 21 rotates under the control of the motherboard 3 to drive the air to flow, and the flowing air transfers the heat on the heat dissipation copper sheet 18 and the heat on the motherboard 3 to the outside of the housing 2, so as to dissipate the heat for the motherboard 3 of the mobile phone.
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. The utility model provides a mobile phone motherboard heat radiation structure which characterized in that: the portable electronic device comprises a support plate (1) and a shell (2), wherein a main board (3) is arranged on the support plate (1), and the support plate (1) is arranged in the shell (2);
the supporting plate (1) comprises a frame (11) and an elastic connecting plate (12), wherein the elastic connecting plate (12) is connected with the frame (11) to form a containing groove for containing the main plate (3); a sealing groove is concavely arranged on one side, located in the accommodating groove, of the frame (11), a sealing ring (13) matched with the sealing groove is arranged in the sealing groove, a first through hole (14) is formed in one side, away from the accommodating groove, of the frame (11), and the first through hole (14) is communicated with the sealing groove; a heat conduction copper pipe (15) is embedded in the elastic connecting plate (12), and the heat conduction copper pipe (15) is connected with the frame (11); a heat-conducting film (16) is adhered to one side, located in the accommodating groove, of the elastic connecting plate (12), a heat-radiating copper sheet (18) is adhered to the surface of the heat-conducting film (16), and one end, far away from the heat-conducting film (16), of the heat-radiating copper sheet (18) penetrates through the sealing ring (13) and extends into the first through hole (14);
a cavity is formed between the shell (2) and the main board (3), a micro fan (21) is arranged on one side, close to the main board (3), of the shell (2), and the micro fan (21) is connected with the main board (3); casing (2) are close to one side of first through-hole (14) is concave to be equipped with second through-hole (22), second through-hole (22) with first through-hole (14) intercommunication, second through-hole (22) with the cavity intercommunication, just second through-hole (22) with casing (2) outside intercommunication to form the wind channel that is used for the circulation of air, the air inlet of miniature fan (21) with the cavity intercommunication, the gas outlet of miniature fan (21) is located casing (2) outside.
2. The heat dissipation structure for a main board of a mobile phone of claim 1, wherein: the number of the first through holes (14) is multiple, the number of the second through holes (22) is multiple, and the second through holes (22) correspond to the first through holes (14) in a one-to-one mode.
3. The heat dissipation structure for a main board of a mobile phone of claim 1, wherein: the heat conduction copper pipes (15) are multiple, and the heat conduction copper pipes (15) are embedded in the elastic connecting plate (12) in a criss-cross mode.
4. The heat dissipation structure for a main board of a mobile phone of claim 3, wherein: the elastic connecting plate (12) is made of rubber.
5. The heat dissipation structure for a main board of a mobile phone of claim 1, wherein: the heat conducting film (16) is a double-layer film formed by bonding a graphene polyimide composite film and a copper foil through a pressure sensitive adhesive, the graphene polyimide composite film is arranged on one side of the double-layer film close to the main board (3), and the copper foil is arranged on one side far away from the main board (3).
6. The heat dissipation structure for a main board of a mobile phone of claim 1, wherein: one end of the heat dissipation copper sheet (18) connected with the heat conduction film (16) is in a strip shape, a fan shape or a tree shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120572718.3U CN214205608U (en) | 2021-03-19 | 2021-03-19 | Mobile phone motherboard heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120572718.3U CN214205608U (en) | 2021-03-19 | 2021-03-19 | Mobile phone motherboard heat radiation structure |
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| Publication Number | Publication Date |
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| CN214205608U true CN214205608U (en) | 2021-09-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120572718.3U Active CN214205608U (en) | 2021-03-19 | 2021-03-19 | Mobile phone motherboard heat radiation structure |
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| CN (1) | CN214205608U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113810528A (en) * | 2021-09-15 | 2021-12-17 | Oppo广东移动通信有限公司 | Electronic device |
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2021
- 2021-03-19 CN CN202120572718.3U patent/CN214205608U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113810528A (en) * | 2021-09-15 | 2021-12-17 | Oppo广东移动通信有限公司 | Electronic device |
| CN113810528B (en) * | 2021-09-15 | 2024-01-09 | Oppo广东移动通信有限公司 | Electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220701 Address after: 638100 No. 2, Shibin Road, Kuige street, economic and Technological Development Zone, Guang'an City, Sichuan Province Patentee after: GUANG'AN YIGE ELECTRONICS CO.,LTD. Address before: 638100 No. 2, Shibin Road, Kuige street, economic and Technological Development Zone, Guang'an City, Sichuan Province Patentee before: GUANG'AN HUAGE TECHNOLOGY Co.,Ltd. |
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| TR01 | Transfer of patent right |