CN213462772U - Heat radiation structure of power module - Google Patents
Heat radiation structure of power module Download PDFInfo
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- CN213462772U CN213462772U CN202022434115.5U CN202022434115U CN213462772U CN 213462772 U CN213462772 U CN 213462772U CN 202022434115 U CN202022434115 U CN 202022434115U CN 213462772 U CN213462772 U CN 213462772U
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- heat
- power module
- heat dissipation
- semiconductor device
- dissipation metal
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Abstract
The utility model discloses a power module's heat radiation structure, power module contains the semiconductor device that a plurality of installed on module printing board, be provided with heat dissipation metal device on the semiconductor device, the heat that semiconductor device work produced can conduct to heat dissipation metal device, by heat dissipation metal device with the heat give off to the air in. Has the advantages that: the heat dissipation structure of the utility model can enhance the heat dissipation performance of the semiconductor device in the power module, and ensure that the heat generated by the semiconductor device during working can be timely dissipated into the air, thereby ensuring the long-time reliable work of the power module and having good practicability; the heat dissipation structure is simple, small in size and low in cost, does not affect the structure of the existing power module, can be directly additionally installed on the basis of the existing power module, and is wide in popularization and application prospect.
Description
Technical Field
The utility model relates to a power module field, concretely relates to power module's heat radiation structure.
Background
When the power module works, the semiconductor device in the power module generates heat, and if the heat is not dissipated in time, the normal operation of the semiconductor device is influenced;
at present, the heat dissipation of the semiconductor device is generally achieved by arranging a plurality of heat dissipation through holes on a shell of a power module and exhausting heat generated by the semiconductor device out of the power module by means of natural air flow. The structure design is simple, the cost of the power module is hardly increased, and the power module is common on the power module, but the semiconductor device has small volume and limited contact area with air, so that the heat dissipation performance is not ideal, and once the outside air temperature is high, the power module can be failed due to poor heat dissipation of the semiconductor device, and the use is influenced.
SUMMERY OF THE UTILITY MODEL
The utility model relates to a solve the problem among the above-mentioned background art and provide a power module's heat radiation structure, this heat radiation structure can strengthen the heat dispersion of semiconductor device in the power module, ensures that the heat that the semiconductor device during operation produced can in time be distributed to the air in to guarantee the long-time reliable work of power module, the practicality is good, the details are described below.
In order to achieve the above purpose, the utility model provides a following technical scheme:
the utility model provides a pair of power module's heat radiation structure, power module contains the semiconductor device that a plurality of installed on module printing board, be provided with heat dissipation metal device on the semiconductor device, the heat that semiconductor device work produced can conduct to heat dissipation metal device, by heat dissipation metal device with the heat give off to the air in.
As an important design of the scheme, the heat dissipation metal device and the semiconductor device are bonded through heat conduction bonding glue.
As the optimized design of the scheme, the heat dissipation metal device comprises a flat plate and a plurality of vertical plates which are in contact with the flat plate and fixedly connected with the flat plate, wherein the vertical plates are inserted into the heat conduction adhesive.
As the optimization design of the scheme, at least one vertical plate is provided with a conduction part for filling the heat-conducting bonding glue so as to prevent the vertical plate from being separated from the heat-conducting bonding glue.
Has the advantages that: the heat dissipation structure of the utility model can enhance the heat dissipation performance of the semiconductor device in the power module, and ensure that the heat generated by the semiconductor device during working can be timely dissipated into the air, thereby ensuring the long-time reliable work of the power module and having good practicability;
the heat dissipation structure is simple, small in size and low in cost, does not affect the structure of the existing power module, can be directly additionally installed on the basis of the existing power module, and is wide in popularization and application prospect.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of the present invention;
FIG. 2 is a front view of a heat sink metal device;
FIG. 3 is a left side view of a heat sink metal device according to one embodiment;
FIG. 4 is a top view of a heat dissipating metal device;
fig. 5 is a left side view of the heat-dissipating metal device of the second embodiment.
The reference numerals are explained below:
1. a semiconductor device;
2. a heat dissipating metal device;
21. a flat plate; 22. a vertical plate; 23. a conduction part;
3. and a module printed board.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be described in detail below. It is to be understood that the embodiments described are only some embodiments of the invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
As shown in fig. 1, a power module's heat radiation structure, this power module contains a plurality of and installs semiconductor device 1 on module printed board 3, be provided with heat dissipation metal device 2 on a plurality of semiconductor device 1, the heat that semiconductor device 1 work produced can conduct to heat dissipation metal device 2, give off the heat to the air by heat dissipation metal device 2 in, the design like this, the heat radiating area who is equivalent to indirect semiconductor device 1 has increased, take away the heat behind the heat dissipation metal device 2 of air flow-through, thereby reduce the temperature of semiconductor device 1, guarantee power module reliable work for a long time, the radiating rate is fast, high efficiency, and the practicality is good.
In order to facilitate the installation of the heat dissipation metal device 2, the heat dissipation metal device 2 and the semiconductor device 1 can be bonded through heat conduction bonding glue, the heat conduction performance of the heat conduction bonding glue is good, heat generated in the working process of the semiconductor device 1 can be conducted to the heat dissipation metal device 2 in time, the connection mode can be directly operated on the basis of the existing power module, the heat dissipation metal device 2 is additionally installed, and the popularization and application prospect is wide.
As shown in fig. 2-4, the heat dissipation metal device 2 includes a flat plate 21 and a plurality of vertical plates 22 contacting and fixedly connected with the flat plate 21, and one ends of the plurality of vertical plates 22 far from the flat plate 21 are inserted into the heat-conducting adhesive, so that the heat dissipation metal device 2 is not only ensured to be firmly and reliably mounted, but also has a simple heat dissipation structure, a small volume, a low cost, a large contact area with air, and no influence on the structure of the existing power module.
Preferably, the vertical plate 22 penetrates through the heat-conducting adhesive to be in contact with the semiconductor device 1, so that one part of heat generated in the working process of the semiconductor device 1 is conducted to the flat plate 21 through the heat-conducting adhesive, the other part of heat is directly conducted to the flat plate 21 through the vertical plate 22, and the heat conduction efficiency is higher.
Be provided with on at least a slice riser 22 and supply heat conduction bonding glue to fill wherein in order to prevent riser 22 and the conduction portion 23 of heat conduction bonding glue separation, it is not hard up that the heat conduction bonding glue can denaturize and arouse riser 22 to take place after considering that heat radiation structure uses for a long time, then make riser 22 break away from in the heat conduction bonding glue easily, so can set up conduction portion 23 on riser 22, conduction portion 23 both can be the groove (as shown in fig. 3) that sets up at riser 22 both ends, also can be the hole (as shown in fig. 5) that sets up on riser 22, after riser 22 inserts in the heat conduction bonding glue, can be filled by heat conduction bonding glue in groove or the hole, thereby prevent that riser 22 is not hard up and breaks away from heat conduction bonding glue, further strengthened the joint strength of heat dissipation metal device 2 and semiconductor device 1, the life of heat radiation structure has been prolonged.
The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (2)
1. The utility model provides a heat radiation structure of power module, power module contains a plurality of semiconductor device of installing on module printed board, its characterized in that, be provided with heat dissipation metal device on the semiconductor device, the heat that semiconductor device work produced can conduct to heat dissipation metal device, is dispelled the heat to the air by heat dissipation metal device, heat dissipation metal device and semiconductor device bond through heat conduction bonding glue, heat dissipation metal device includes a flat board and the multiple-disc riser of contact and fixed connection with the flat board, the multiple-disc riser is pegged graft in heat conduction bonding glue.
2. The heat dissipating structure of claim 1, wherein at least one of the risers has a conduction portion for the thermally conductive adhesive to fill therein to prevent the riser from separating from the thermally conductive adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022434115.5U CN213462772U (en) | 2020-10-28 | 2020-10-28 | Heat radiation structure of power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022434115.5U CN213462772U (en) | 2020-10-28 | 2020-10-28 | Heat radiation structure of power module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213462772U true CN213462772U (en) | 2021-06-15 |
Family
ID=76295912
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022434115.5U Active CN213462772U (en) | 2020-10-28 | 2020-10-28 | Heat radiation structure of power module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213462772U (en) |
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2020
- 2020-10-28 CN CN202022434115.5U patent/CN213462772U/en active Active
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