CN212364657U - High-expansibility FC optical fiber bus - Google Patents

Abstract

The utility model discloses a from high expansibility FC fiber bus, concretely relates to FC fiber bus technical field, including the integrated circuit board body, integrated circuit board body one side is connected with FC control chip, FC control chip communication connection has PCIE interface and the multiplexing interface of port, and PCIE interface and the multiplexing interface of port all set firmly in integrated circuit board body one side, FC control chip communication connection has bus interface, bus interface sets firmly in integrated circuit board body one side, FC control chip electricity is connected with power control chip, FC control chip board card communication connection has memory interface and control interface. The utility model discloses a set up the multiplexing interface of port and cooling body, heat radiation fins effectively increases and has improved the radiating efficiency of heat with air area of contact, compares with prior art and has accelerateed the heat and distribute when improving PC control chip's data suitability, is showing improvement connect the suitability.

Description

High-expansibility FC optical fiber bus

Technical Field

The utility model relates to a FC fiber bus technical field, more specifically say, the utility model relates to a high expansibility FC fiber bus.

Background

FC is a high-speed serial transport bus proposed in 1988 by the X3T11 group of the american standards institute (ANSI), which addresses the technical bottleneck encountered by parallel bus SCSI and allows more FC-4 upper layer protocols to be mapped within the same large protocol platform framework. The FC has the advantages of being dual in channel and network, high in bandwidth, reliability and stability, resistant to electromagnetic interference and the like, capable of providing very stable and reliable optical fiber connection, easy to construct large-scale data transmission and communication networks, and supporting bandwidth connection rates of 1x, 2x, 4x and 8x, and the bandwidth is continuously expanded along with continuous development of the technology so as to meet technical performance requirements of higher bandwidth data transmission.

In the prior art, the heat of the FC optical fiber bus cannot be well dissipated during data transmission, the normal work of a chip is influenced when the temperature is too high, the interface is mostly a common PCIE interface, the expandability performance is insufficient, and the use requirement cannot be well met.

SUMMERY OF THE UTILITY MODEL

In order to overcome the above-mentioned defect of the prior art, the embodiment of the utility model provides a high expansibility FC fiber bus, the utility model aims to solve the technical problem that: the FC optical fiber bus can not well emit heat during data transmission, normal work of a chip is affected when the temperature is too high, and most of interfaces are common PCIE interfaces, so that the expandability is insufficient.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a high expansibility FC fiber bus, includes the integrated circuit board body, integrated circuit board body one side is connected with FC control chip, FC control chip communication connection has PCIE interface and the multiplexing interface of port, and PCIE interface and the multiplexing interface of port all set firmly in integrated circuit board body one side, FC control chip communication connection has the bus interface, the bus interface sets firmly in integrated circuit board body one side, FC control chip electricity is connected with power control chip, FC control chip board card communication connection has memory interface and control interface, FC control chip one side fixed mounting has cooling body, cooling body is laminated with PCEI interface, the multiplexing interface of port, memory interface, control interface, bus interface and power control chip one side respectively.

The FC control chip is used for processing and converting data information of FC-VE network multiprotocol, realizing serial system bus interaction, FC network AV, RW, ASM, IP and other protocol interaction, the FC control chip adopts a port multiplexing mode on the basis of facing to central processor information interaction, expands the functions of an Aurora interface and a DP video output interface on a PCIE interface, realizes the mapping and remote RDMA operation of a FlexRay bus on the FC-ASM protocol, realizes the mapping and remote RDMA operation of a 1553B bus on the FC-ASM protocol by adopting a mode of sharing a parallel bus interface, simultaneously supports control interfaces such as GPIO, I2C and the like and a DDR3 memory interface, thereby effectively improving the expansibility of PCIE signals and the adaptation performance of the bus interface, simultaneously the heat of the FC control chip can be led in by attaching with a heat absorption base, meanwhile, heat absorbed by the heat absorption base is led into the plurality of heat dissipation fins through the heat conduction copper columns, the contact area between the heat dissipation fins and air is effectively increased, heat dissipation is improved, data adaptability of the PC control chip is improved, heat dissipation is accelerated, and connection adaptability is obviously improved.

In a preferred embodiment, the cooling mechanism comprises a heat absorption base, wherein threaded fixing seats are fixedly connected to the periphery of the heat absorption base, assembling seats are attached to the bottoms of the two threaded fixing seats corresponding to one side, the bottom of each assembling seat is fixedly connected with one side of the board card body, a threaded cap is embedded on one side of each assembling seat, threaded columns are in threaded penetrating connection with the threaded fixing seats and the threaded cap, a plurality of heat-conducting copper columns are fixedly connected to one side of the heat absorption base, radiating fins are embedded on the outer side walls of the heat-conducting copper columns, a first heat absorption sheet is fixedly connected to one side of the heat absorption base, which is close to the power control chip, and is attached to one side of the power control chip, two second heat absorption sheets are fixedly connected to one sides of the heat absorption base, which is close to the memory interface and the control interface, and are respectively attached to, the bottom of the heat absorption base is fixedly connected with a third heat absorption sheet, the bottom of the third heat absorption sheet is attached to the top of the bus interface, the top of the heat absorption base is fixedly connected with two fourth heat absorption sheets, and the two fourth heat absorption sheets are respectively attached to the bottoms of the PCIE interface and the port multiplexing interface.

In a preferred embodiment, heat-conducting silica gel pads are fixedly connected to one sides of the first heat absorbing sheet, the second heat absorbing sheet, the third heat absorbing sheet and the fourth heat absorbing sheet, and the heat-conducting silica gel pads are respectively attached to one sides of the power control chip, the memory interface, the control interface, the bus interface, the PCIE interface and the port multiplexing interface.

In a preferred embodiment, the heat sink base and the heat sink fins are both nickel-plated aluminum members.

In a preferred embodiment, the memory interface is a DDR3 memory interface.

In a preferred embodiment, the control interface is a GPIO and I2C interface.

In a preferred embodiment, the port multiplexing interface is an Aurora interface and a DP video output interface.

In a preferred embodiment, the bus interface is the FC-ASM protocol.

1. The utility model discloses a set up multiplexing interface of port and cooling body, this FC control chip realizes protocol interaction such as serial system bus interaction, FC network AV, RW, ASM, IP, adopt the multiplexing mode of port to expand Aurora interface and DP video output interface function on the PCIE interface, the chip has realized the mapping and the long-range RDMA operation of FlexRay bus on FC-ASM agreement, and through adopting the mode of sharing parallel bus interface, realize the mapping and the long-range RDMA operation of 1553B bus on FC-ASM agreement, thereby can effectively improve the expansibility of PCIE signal, simultaneously the heat of FC control chip can be imported through laminating with the heat absorption base, the heat that the heat absorption base absorbed simultaneously leads into a plurality of heat dissipation fins through the heat conduction copper post, heat dissipation fin effective increase has improved the efficiency of heat dissipation with air area, compare with prior art and accelerated the heat dissipation when improving PC control chip's data suitability, the connection adaptability is obviously improved;

2. the utility model discloses a set up threaded fixing base, the heat absorption base is through four corners department threaded fixing base and integrated circuit board body threaded connection, and first heat absorption piece, the second heat absorption piece, third heat absorption piece and fourth heat absorption piece can be surveyed the chip heat that corresponds the position and dispel the heat in to the heat absorption base, first heat absorption piece simultaneously, the second heat absorption piece, the heat conduction silica gel pad that third heat absorption piece and fourth heat absorption piece are connected can improve and correspond the contact laminating effect of chip, thereby further improved and gived off piling up thermal conduction.

Drawings

Fig. 1 is a schematic view of the front view cross-sectional structure of the present invention.

Fig. 2 is a schematic view of the three-dimensional structure of the heat absorption base of the present invention.

Fig. 3 is a schematic view of the three-dimensional structure of the assembly seat of the present invention.

Fig. 4 is a schematic side view of the heat absorbing base of the present invention.

Fig. 5 is a schematic diagram of the system structure of the present invention.

The reference signs are: the heat-absorbing device comprises a 1 board card body, a 2 FC control chip, a 3 cooling mechanism, a 301 heat-absorbing base, a 302 threaded fixing base, a 303 heat-radiating fin, a 304 heat-conducting copper column, a 305 first heat-absorbing sheet, a 306 second heat-absorbing sheet, a 307 threaded column, a 308 assembling base, a 309 third heat-absorbing sheet, a 310 threaded cap, a 311 fourth heat-absorbing sheet, a 4 bus interface, a 5 PCIE interface, a 6 port multiplexing interface, a 7 heat-conducting silica gel pad, an 8 memory interface, a 9 control interface and a 10 power supply control chip.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

The utility model provides a high-expansibility FC optical fiber bus, which comprises a board card body 1, one side of the board card body 1 is connected with an FC control chip 2, the FC control chip 2 is communicatively connected with a PCIE interface 5 and a port multiplexing interface 6, and the PCIE interface 5 and the port multiplexing interface 6 are both fixedly arranged at one side of the board card body 1, the FC control chip 2 is in communication connection with the bus interface 4, the bus interface 4 is fixedly arranged on one side of the board card body 1, the FC control chip 2 is electrically connected with a power control chip 10, the FC control chip 2 board card is connected with a memory interface 8 and a control interface 9 in a communication way, one side of the FC control chip 2 is fixedly provided with a cooling mechanism 3, and the cooling mechanism 3 is respectively attached to one sides of the PCEI interface, the port multiplexing interface 6, the memory interface 8, the control interface 9, the bus interface 4 and the power control chip 10.

The cooling mechanism 3 comprises a heat absorption base 301, wherein threaded fixing seats 302 are fixedly connected to the periphery of the heat absorption base 301, assembling seats 308 are attached to the bottoms of the two threaded fixing seats 302 on the corresponding side, the bottom of each assembling seat 308 is fixedly connected with one side of the board card body 1, a threaded cap 310 is embedded on one side of each assembling seat 308, threaded columns 307 are connected to the threaded fixing seats 302 and the threaded caps 310 in a penetrating manner, a plurality of heat-conducting copper columns 304 are fixedly connected to one side of the heat absorption base 301, heat-radiating fins 303 are embedded on the outer side walls of the heat-conducting copper columns 304, a first heat-absorbing sheet 305 is fixedly connected to one side of the heat absorption base 301 close to the power control chip 10, the first heat-absorbing sheet 305 is attached to one side of the power control chip 10, two second heat-absorbing sheets 306 are fixedly connected to one sides of the heat absorption base 301 close to the memory interface 8 and the control interface 9, the bottom of the heat absorption base 301 is fixedly connected with a third heat absorption sheet 309, the bottom of the third heat absorption sheet 309 is attached to the top of the bus interface 4, the top of the heat absorption base 301 is fixedly connected with two fourth heat absorption sheets 311, the two fourth heat absorption sheets 311 are respectively attached to the bottoms of the PCIE interface 5 and the port multiplexing interface 6, the heat dissipation fins 303 and the heat absorption base 301 are both nickel-plated aluminum members, the memory interface 8 is a DDR3 memory interface, the control interface 9 is a GPIO and I2C interface, the port multiplexing interface 6 is an Aurora interface and a DP video output interface, and the port multiplexing interface 6 is an Aurora interface and a DP video output interface.

As shown in fig. 1 to 5, the embodiment specifically is: the FC control chip 2 is used for processing and converting data information of FC-VE network multiprotocol, realizing serial system bus interaction, FC network AV, RW, ASM, IP and other protocol interaction, the FC control chip 2 adopts a port multiplexing mode on the basis of facing to central processor information interaction, the PCIE interface 5 is expanded with the functions of an Aurora interface and a DP video output interface, the chip realizes the mapping and remote RDMA operation of a FlexRay bus on the FC-ASM protocol, and realizes the mapping and remote RDMA operation of a 1553B bus on the FC-ASM protocol by adopting a mode of sharing a parallel bus interface 4, the chip simultaneously supports control interfaces 9 such as GPIO, I2C and the like and a DDR3 memory interface, thereby effectively improving the expansibility of PCIE signals, improving the adaptation performance of the bus interface 4, and simultaneously the heat of the FC control chip 2 can be led in by being attached to a heat absorption base 301, meanwhile, heat absorbed by the heat absorption base 301 is guided into the plurality of heat dissipation fins 303 through the heat conduction copper columns 304, the contact area between the heat dissipation fins 303 and air is effectively increased, and the heat dissipation efficiency is improved, so that the data adaptability of the PC control chip is improved, the heat dissipation is accelerated, and the connection adaptability is obviously improved.

One side of each of the first heat absorbing sheet 305, the second heat absorbing sheet 306, the third heat absorbing sheet 309 and the fourth heat absorbing sheet 311 is fixedly connected with a heat conducting silica gel pad 7, and the heat conducting silica gel pad 7 is respectively attached to one side of the power control chip 10, one side of the memory interface 8, one side of the control interface 9, one side of the bus interface 4, one side of the PCIE interface 5 and one side of the port multiplexing interface 6.

As shown in fig. 1 to 4, the embodiment specifically is: the heat absorption base 301 is in threaded connection with the board card body 1 through the threaded fixing seat 302 at the four corners, the first heat absorption sheet 305, the second heat absorption sheet 306, the third heat absorption sheet 309 and the fourth heat absorption sheet 311 can enable the chip heat at the corresponding position to be detected into the heat absorption base 301 for heat dissipation, and meanwhile, the heat conduction silica gel pad 7 connected with the first heat absorption sheet 305, the second heat absorption sheet 306, the third heat absorption sheet 309 and the fourth heat absorption sheet 311 can improve the contact and attachment effect with the corresponding chip, so that the conduction and dissipation of accumulated heat are further improved.

The utility model discloses the theory of operation:

referring to the attached drawings 1-5 of the specification, the FC control chip 2 is used for realizing FC-VE network multiprotocol data information processing and conversion, the FC control chip 2 adopts a port multiplexing mode on the basis of facing to central processor information interaction, and the Aurora interface and DP video output interface functions are expanded on the PCIE interface 5, so that the expansibility of PCIE signals can be effectively improved, and the adaptation performance of the bus interface 4 is improved, meanwhile, the heat of the FC control chip 2 can be led in through the attachment with the heat absorption base 301, meanwhile, the heat absorbed by the heat absorption base 301 is led into a plurality of heat dissipation fins 303 through the heat conduction copper columns 304, the heat dissipation fins 303 effectively increase the contact area with air, the heat dissipation efficiency is improved, and the heat dissipation is accelerated while the data adaptation of the PC control chip is improved;

referring to the attached drawings 1-4 in the specification, the heat absorption base 301 is in threaded connection with the board card body 1 through the threaded fixing seat 302 at the four corners, the first heat absorption sheet 305, the second heat absorption sheet 306, the third heat absorption sheet 309 and the fourth heat absorption sheet 311 can find the chip heat at the corresponding positions into the heat absorption base 301 for heat dissipation, and meanwhile, the heat conduction silicone rubber pad 7 connected with the first heat absorption sheet 305, the second heat absorption sheet 306, the third heat absorption sheet 309 and the fourth heat absorption sheet 311 can improve the contact and bonding effect with the corresponding chip, so that the conduction and dissipation of accumulated heat are further improved.

The points to be finally explained are: first, in the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounted," "connected," and "connected" should be understood broadly, and may be a mechanical connection or an electrical connection, or a communication between two elements, and may be a direct connection, and "upper," "lower," "left," and "right" are only used to indicate a relative positional relationship, and when the absolute position of the object to be described is changed, the relative positional relationship may be changed;

secondly, the method comprises the following steps: in the drawings of the disclosed embodiments of the present invention, only the structures related to the disclosed embodiments are referred to, and other structures can refer to the common design, and under the condition of no conflict, the same embodiment and different embodiments of the present invention can be combined with each other;

and finally: the above description is only for the preferred embodiment of the present invention and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (8)

1. The utility model provides a high expansibility FC fiber bus, includes integrated circuit board body (1), its characterized in that: one side of the board card body (1) is connected with an FC control chip (2), the FC control chip (2) is in communication connection with a PCIE interface (5) and a port multiplexing interface (6), and the PCIE interface (5) and the port multiplexing interface (6) are both fixedly arranged at one side of the board card body (1), the FC control chip (2) is in communication connection with a bus interface (4), the bus interface (4) is fixedly arranged on one side of the board card body (1), the FC control chip (2) is electrically connected with a power supply control chip (10), the FC control chip (2) board card is in communication connection with a memory interface (8) and a control interface (9), a cooling mechanism (3) is fixedly arranged on one side of the FC control chip (2), and the cooling mechanism (3) is respectively attached to one sides of the PCEI interface, the port multiplexing interface (6), the memory interface (8), the control interface (9), the bus interface (4) and the power control chip (10).

2. The FC fiber bus with high expandability according to claim 1, wherein: the cooling mechanism (3) comprises a heat absorption base (301), wherein threaded fixing seats (302) are fixedly connected to the periphery of the heat absorption base (301), an assembly seat (308) is attached to the bottoms of the two threaded fixing seats (302) on one side, the bottom of the assembly seat (308) is fixedly connected with one side of the board card body (1), a threaded cap (310) is embedded on one side of the assembly seat (308), threaded columns (307) are connected with the threaded fixing seats (302) and the threaded cap (310) in a penetrating manner, a plurality of heat conduction copper columns (304) are fixedly connected to one side of the heat absorption base (301), heat dissipation fins (303) are embedded on the outer side wall of each heat conduction copper column (304), a first heat absorption piece (305) is fixedly connected to one side of the heat absorption base (301) close to a power supply control chip (10), and the first heat absorption piece (305) is attached to one side of, the heat absorption base (301) is close to two second heat absorption sheets (306) on one side of the memory interface (8) and the control interface (9), the two second heat absorption sheets (306) are respectively attached to one sides of the memory interface (8) and the control interface (9), the bottom of the heat absorption base (301) is fixedly connected with a third heat absorption sheet (309), the bottom of the third heat absorption sheet (309) is attached to the top of the bus interface (4), the top of the heat absorption base (301) is fixedly connected with two fourth heat absorption sheets (311), and the two fourth heat absorption sheets (311) are respectively attached to the bottoms of the PCIE interface (5) and the port multiplexing interface (6).

3. The FC fiber bus with high expandability according to claim 2, wherein: and one sides of the first heat absorbing sheet (305), the second heat absorbing sheet (306), the third heat absorbing sheet (309) and the fourth heat absorbing sheet (311) are fixedly connected with a heat-conducting silica gel pad (7), and the heat-conducting silica gel pad (7) is respectively attached to one sides of the power control chip (10), the memory interface (8), the control interface (9), the bus interface (4), the PCIE interface (5) and the port multiplexing interface (6).

4. The FC fiber bus with high expandability according to claim 2, wherein: the heat radiating fins (303) and the heat absorbing base (301) are both nickel-plated aluminum components.

5. The FC fiber bus with high expandability according to claim 1, wherein: the memory interface (8) is a DDR3 memory interface.

6. The FC fiber bus with high expandability according to claim 1, wherein: the control interface (9) is a GPIO and I2C interface.

7. The FC fiber bus with high expandability according to claim 1, wherein: the port multiplexing interface (6) is an Aurora interface and a DP video output interface.

8. The FC fiber bus with high expandability according to claim 1, wherein: the bus interface (4) is an FC-ASM protocol.

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