CN212463844U

CN212463844U - Heat dissipation module of 5G base station

Info

Publication number: CN212463844U
Application number: CN202020937007.7U
Authority: CN
Inventors: 刘鉴
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-05-28
Filing date: 2020-05-28
Publication date: 2021-02-02
Anticipated expiration: 2030-05-28

Abstract

The utility model discloses a heat dissipation module of 5G basic station, concretely relates to 5G electronic product technical field, including 5G basic station chip, 5G basic station chip top laminating has the carbon fiber conducting strip, the laminating of carbon fiber conducting strip top has the grip slipper, a plurality of heat absorbing strips of grip slipper top fixedly connected with, and run through between a plurality of heat absorbing strips and inlay and be equipped with a plurality of heat dissipation posts, 5G basic station chip bottom laminating has the base, grip slipper top four corners department all inlays and is equipped with fixed cover, it has the screw thread post to cup joint in the fixed cover, base top four corners department all inlays and is equipped with the screw cap, screw thread post threaded connection is in the screw cap. The utility model discloses a set up grip slipper and carbon fiber conducting strip, compare with prior art and can effectively give off the heat that 5G base station chip produced fast through carbon fiber conducting strip, grip slipper and heat-absorbing sheet, avoid the heat to pile up the data processing ability that influences 5G base station chip, satisfied the use needs.

Description

Heat dissipation module of 5G base station

Technical Field

The utility model relates to a 5G electronic product technical field, more specifically say, the utility model relates to a 5G basic station's heat dissipation module.

Background

The 5G base station adopts shorter signal wavelength and higher frequency, so that the transmission speed is higher than that of the 4G base station, and the large-area laying of the 5G base station can open the era of interconnection of smart cities and everything. In recent years, several base station manufacturers have deployed 5G base stations and 5G mobile phones in a dispute, and the preemption technique is high.

Because the throughput and the processing speed of the 5G base station are dozens of times larger than those of the 4G base station, the heat productivity of the chip is much larger than that of the 4G base station, the traditional heat dissipation scheme can not meet the requirements of the 5G base station, the service life and the working state of the chip of the 5G base station can be influenced by the temperature rise, and the use can not be well met.

SUMMERY OF THE UTILITY MODEL

In order to overcome the above-mentioned defect of prior art, the embodiment of the utility model provides a 5G basic station's heat dissipation module, the utility model aims to solve the technical problem that: the traditional heat dissipation scheme can not meet the requirements of the 5G base station, and the service life and the working state of a 5G base station chip can be influenced by temperature rise.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a heat dissipation module of 5G basic station, includes 5G basic station chip, 5G basic station chip top laminating has the carbon fiber conducting strip, the laminating of carbon fiber conducting strip top has the grip slipper, a plurality of heat-absorbing strips of grip slipper top fixedly connected with, and run through between a plurality of heat-absorbing strips and inlay and be equipped with a plurality of heat dissipation posts, the laminating of 5G basic station chip bottom has the base, grip slipper top four corners department all inlays and is equipped with fixed cover, the threaded post has been cup jointed in the fixed cover, base top four corners department all inlays and is equipped with the screw cap, screw post threaded connection is in the screw cap, a plurality of heat conduction fins of base bottom fixedly connected with, a plurality of ventilation slots have been seted up in grip slipper.

The 5G base station chip is arranged on the top of the base, the clamping seat and the carbon fiber heat conducting sheet are attached to the top of the 5G base station chip, the threaded columns and the gaskets are inserted into the fixed sleeves at the four corners and are fixedly connected with the threaded caps at the four corners of the bottom base in a threaded manner, the clamping seat clamps and fixes the 5G base station chip, when the temperature of the 5G base station chip rises, heat can be introduced into the aluminum clamping seat through the carbon fiber heat conducting sheet, the clamping seat absorbs the heat and then introduces the heat into the heat absorbing sheets at the top, the heat absorbing sheets introduce the heat into the radiating columns, and the heat on the surfaces of the heat absorbing sheets and the radiating columns is dissipated through external air circulation, so that the heat generated by the 5G base station chip can be rapidly dissipated through the carbon fiber heat conducting sheet, the clamping seat and the heat absorbing sheet, the influence of heat accumulation on the data, meets the use requirements

In a preferred embodiment, the heat conductivity of the carbon fiber heat conducting sheet is 35 W.m < -1 >. K < -1 > to 40 W.m < -1 >. K < -1 >, and the thickness of the carbon fiber heat conducting sheet is 0.2mm to 0.5mm, so that the heat conducting effect is improved.

In a preferred embodiment, the carbon fiber heat conducting sheet is a carbon nanotube array, so that the contact area between the clamping seat and the 5G base station chip is increased, and the heat absorption and heat conduction effects are ensured.

In a preferred embodiment, the holder is a heat-conducting aluminum member, the heat absorbing sheet is a heat-absorbing aluminum sheet member, and the base is a heat-conducting copper member, so as to ensure the heat absorbing effect.

In a preferred embodiment, the heat dissipation column is a heat dissipation copper column, and the heat dissipation column is filled with a cooling liquid, so that a heat absorption effect is ensured.

In a preferred embodiment, the bottom of the base is an arc-shaped groove, and the height of the heat-conducting fins is equal to the radian of the inner cavity of the corresponding base, so that the air circulation of the bottom space is ensured.

In a preferred embodiment, the four corners of the top of the base are provided with assembling holes, so that the assembling by workers is facilitated.

In a preferred embodiment, the width of the clamping seat and the base is equal to that of the 5G base station chip, so that the stability of clamping and fixing the clamping seat and the base relative to the 5G base station chip is improved.

1. The utility model discloses a set up grip slipper and carbon fiber conducting strip, through laminating grip slipper and carbon fiber conducting strip with 5G base station chip top, the screw thread post is fixed with screw cap threaded connection, can lead to the heat in the grip slipper through the carbon fiber conducting strip when 5G base station chip temperature rises, the grip slipper guides the heat into a plurality of heat-absorbing fins in top and heat dissipation post after absorbing the heat, outside circulation of air distributes heat-absorbing fin and heat dissipation post surface heat, can effectively distribute the heat that 5G base station chip produced through carbon fiber conducting strip, grip slipper and heat-absorbing fin fast compared with the prior art, avoid the heat to pile up the data processing ability that influences 5G base station chip, use needs have been satisfied;

2. the utility model discloses a set up the base, the base is heat conduction copper structure, can take away the heat on heat conduction fin surface through the circulation of air in the bottom arc wall simultaneously with the heat absorption simultaneously when the base is at 5G basic station chip heat production to can further improve the radiating effect to 5G basic station chip, and the pilot hole of base four corners department can make things convenient for the staff to the assembly of base chip, satisfy the use needs.

Drawings

Fig. 1 is a schematic perspective view of the present invention.

Fig. 2 is a schematic view of the front view cross-sectional structure of the present invention.

Fig. 3 is an enlarged schematic view of a portion a in fig. 2 according to the present invention.

Fig. 4 is a schematic structural view of the holder of the present invention.

Fig. 5 is a schematic perspective view of the present invention.

The reference signs are: 15G base station chip, 2 carbon fiber conducting strips, 3 clamping bases, 4 ventilation grooves, 5 heat absorbing strips, 6 heat dissipation columns, 7 bases, 8 heat conduction fins, 9 fixing sleeves, 10 threaded columns, 11 gaskets, 12 threaded caps and 13 assembling holes.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Example 1:

the utility model provides a heat dissipation module of 5G basic station, including 5G basic station chip 1, the laminating of 1 top of 5G basic station chip has carbon fiber conducting strip 2, the laminating of 2 tops of carbon fiber conducting strip has grip slipper 3, a plurality of heat absorbing sheets of 3 top fixedly connected with of grip slipper 5, and run through between a plurality of heat absorbing sheets 5 and inlay and be equipped with a plurality of radiator columns 6, the laminating of 1 bottom of 5G basic station chip has

base

7, 3 top four corners departments of grip slipper all inlay and be equipped with fixed cover 9, it has threaded post 10 to cup joint in fixed

cover

9, 7 top four corners departments of base all inlay and be equipped with threaded cap 12, threaded post 10 threaded connection is in threaded cap 12, a plurality of heat conduction fins 8 of fixedly connected with in base 7 bottom, 3 one side of grip slipper runs through and has seted up a plurality of air channels 4.

The carbon fiber heat conducting sheet 2 is a carbon nanotube array, the clamping seat 3 is a heat conducting aluminum component, the heat absorbing sheet 5 is a heat absorbing aluminum sheet component, the base 7 is a heat conducting copper component, the heat radiating column 6 is a heat radiating copper column, cooling liquid is filled in the heat radiating column 6, and the width of the clamping seat 3 and the width of the base 7 are equal to the width of the 5G base station chip 1.

The heat conductivity coefficient of the carbon fiber heat conducting fin 2 is 35 W.m < -1 > K < -1 >, and the thickness of the carbon fiber heat conducting fin 2 is 0.2 mm.

As shown in fig. 1 to 5, the embodiment specifically is: the 5G base station chip 1 is arranged on the top of a base 7, a clamping seat 3, a carbon fiber heat conducting strip 2 and the top of the 5G base station chip 1 are attached, a threaded column 10 and a gasket 11 are inserted into a four-corner fixing sleeve 9 and are fixedly connected with a threaded cap 12 at the four corners of a bottom base 7 through threads, the clamping seat 3 clamps and fixes the 5G base station chip 1, when the temperature of the 5G base station chip 1 rises, heat can be led into an aluminum clamping seat 3 through the carbon fiber heat conducting strip 2, the clamping seat 3 leads the heat into a plurality of heat absorbing strips 5 at the top after absorbing the heat, the heat absorbing strips 5 lead the heat into a heat radiating column 6, the heat on the surfaces of the heat absorbing strips 5 and the heat radiating column 6 is radiated by external air circulation, the 5G base station chip 1 is tested to have the temperature of 39 ℃ when the operating power of the 5G base station chip 1 is 2000W, the temperature drops by 26 ℃, thereby effectively dissipating the heat generated by the 5G base station chip 1 through the carbon fiber heat conducting strip 2, the clamping seat 3 and the heat absorbing sheet 5, avoiding the heat accumulation to influence the data processing capacity of the 5G base station chip 1, ensuring the clamping seat 3 to be assembled, fixed and stable through the threaded column 10, and meeting the use requirement.

The base 7 is heat conduction copper component, the base 7 bottom is the arc wall, and heat conduction fin 8's height equals with the inner chamber radian that corresponds base 7, pilot hole 13 has all been seted up to base 7 top four corners department.

As shown in fig. 1 and 5, the embodiment specifically includes: base 7 is heat conduction copper structure, makes things convenient for 1 earth connection winding displacement of 5G basic station chip, can take away the heat on heat conduction fin 8 surfaces through the circulation of air in the bottom arc wall simultaneously with the heat absorption when base 7 is at 1 heat production of 5G basic station chip to can further improve the radiating effect to 5G basic station chip 1, and the pilot hole 13 of base 7 four corners department can make things convenient for the staff to the assembly of base chip, satisfies the user demand.

Example 2:

different from the embodiment 1, the carbon fiber heat conducting sheet 2 of the embodiment is a carbon fiber array with the heat conductivity coefficient of 35 W.m < -1 > K < -1 > and the thickness of 0.5mm

The implementation mode is specifically as follows: the 5G base station chip 1 is tested to have a chip temperature of 42 ℃ under the condition that the operating power is 2000W, and compared with the 5G base station chip 1 which is not managed by a heat dissipation scheme, the temperature is 64 ℃, and the temperature is reduced by 22 ℃.

Example 3:

different from the

embodiments

1 and 2, the carbon fiber heat conducting sheet 2 of the embodiment is a carbon fiber array with the heat conductivity coefficient of 40 W.m < -1 > K < -1 > and the thickness of 0.2mm

The implementation mode is specifically as follows: the 5G base station chip 1 is tested to have a chip temperature of 35 ℃ under the condition that the operating power is 2000W, and compared with the 5G base station chip 1 which is not managed by a heat dissipation scheme, the temperature is 64 ℃ and is reduced by 29 ℃.

From a comparison of examples 1 to 3: the carbon fiber heat conducting fin 2 has a better temperature reduction effect under the conditions that the heat conductivity coefficient is 40 W.m < -1 >. K < -1 > and the thickness is 0.2mm, the thickness is reasonable, the assembly is convenient, and the embodiment 3 is the practical and preferred embodiment.

The utility model discloses the theory of operation:

referring to the attached drawings 1-5 of the specification, a clamping seat 3, a carbon fiber heat conducting sheet 2 and the top of a 5G base station chip 1 are attached, a threaded column 10 is fixedly connected with a threaded cap 12 in a threaded manner, when the temperature of the 5G base station chip 1 rises, heat can be guided into the clamping seat 3 through the carbon fiber heat conducting sheet 2, the clamping seat 3 guides the heat into a plurality of heat absorbing sheets 5 and heat radiating columns 6 at the top after absorbing the heat, the heat on the surfaces of the heat absorbing sheets 5 and the heat radiating columns 6 is radiated through external air circulation, so that the heat generated by the 5G base station chip 1 can be effectively and quickly radiated through the carbon fiber heat conducting sheet 2, the clamping seat 3 and the heat absorbing sheets 5, the influence of heat accumulation on the data processing capacity of the 5G base station chip 1;

referring to description attached

drawing

1 and 5, base 7 is heat conduction copper structure, can take away the heat on heat conduction fin 8 surfaces through the circulation of air in the bottom arc wall simultaneously with the heat absorption when base 7 is at 5G basic station chip 1 heat production to can further improve the radiating effect to 5G basic station chip 1, and the pilot hole 13 of base 7 four corners department can make things convenient for the staff to the assembly of base chip, satisfies the user demand.

The points to be finally explained are: first, in the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounted," "connected," and "connected" should be understood broadly, and may be a mechanical connection or an electrical connection, or a communication between two elements, and may be a direct connection, and "upper," "lower," "left," and "right" are only used to indicate a relative positional relationship, and when the absolute position of the object to be described is changed, the relative positional relationship may be changed;

secondly, the method comprises the following steps: in the drawings of the disclosed embodiments of the present invention, only the structures related to the disclosed embodiments are referred to, and other structures can refer to the common design, and under the condition of no conflict, the same embodiment and different embodiments of the present invention can be combined with each other;

and finally: the above description is only for the preferred embodiment of the present invention and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a heat dissipation module of 5G basic station, includes 5G basic station chip (1), its characterized in that: the utility model discloses a 5G basic station chip (1) top laminating has carbon fiber conducting strip (2), carbon fiber conducting strip (2) top laminating has grip slipper (3), a plurality of heat-absorbing fins of grip slipper (3) top fixedly connected with (5), and run through between a plurality of heat-absorbing fins (5) and inlay and be equipped with a plurality of radiating columns (6), 5G basic station chip (1) bottom laminating has base (7), grip slipper (3) top four corners department all inlays and is equipped with fixed cover (9), cup jointed threaded post (10) in fixed cover (9), base (7) top four corners department all inlays and is equipped with threaded cap (12), threaded post (10) threaded connection is in threaded cap (12), a plurality of heat conduction fins (8) of base (7) bottom fixedly connected with, a plurality of ventilation slots (4) have been run through to grip slipper (3) one side.

2. The heat dissipation module of claim 1, wherein: the heat conductivity coefficient of the carbon fiber heat conducting sheet (2) is 35 W.m < -1 >. K < -1 > to 40 W.m < -1 >. K < -1 >, and the thickness of the carbon fiber heat conducting sheet (2) is 0.2mm-0.5 mm.

3. The heat dissipation module of claim 1, wherein: the carbon fiber heat conducting fin (2) is a carbon nano tube array.

4. The heat dissipation module of claim 1, wherein: the clamping seat (3) is a heat conduction aluminum component, the heat absorbing sheet (5) is a heat absorbing aluminum sheet component, and the base (7) is a heat conduction copper component.

5. The heat dissipation module of claim 1, wherein: the heat dissipation column (6) is a heat dissipation copper column, and cooling liquid is filled in the heat dissipation column (6).

6. The heat dissipation module of claim 1, wherein: the bottom of the base (7) is an arc-shaped groove, and the height of the heat-conducting fins (8) is equal to the radian of the inner cavity of the corresponding base (7).

7. The heat dissipation module of claim 1, wherein: and the four corners of the top of the base (7) are provided with assembling holes (13).

8. The heat dissipation module of claim 1, wherein: the width of the clamping seat (3) and the width of the base (7) are equal to the width of the 5G base station chip (1).