CN212727806U

CN212727806U - Silica gel sheet for heat dissipation of circuit mainboard

Info

Publication number: CN212727806U
Application number: CN202021256264.0U
Authority: CN
Inventors: 黄志诚; 黄智良; 黄志勇; 王伟阳; 叶辉勇
Original assignee: Shenzhen Deyun Electronic Material Technology Co ltd
Current assignee: Shenzhen Deyun Electronic Material Technology Co ltd
Priority date: 2020-06-30
Filing date: 2020-06-30
Publication date: 2021-03-16
Anticipated expiration: 2030-06-30

Abstract

The utility model discloses a be used for radiating silica gel piece of circuit mainboard, including the silica gel piece body, one side outer wall fixedly connected with connecting block of silica gel piece body, the opening has been seted up to the top outer wall of silica gel piece body, and open-ended inner wall sliding connection has the heat dissipation case, the round mouth that the equidistance distributes is all seted up to the both sides outer wall of heat dissipation case, one side outer wall that the silica gel piece body kept away from the connecting block seted up with connecting block assorted spread groove, the mounting groove has been seted up to silica gel piece body bottom outer wall, and the equal fixedly connected with pinch roller of the both sides inner wall of mounting groove, the equal fixedly connected with equidistance of open-ended bottom inner. The utility model discloses a this internal conducting strip that sets up of silica gel piece, thereby fill the heat conduction efficiency that heat conduction rubber improved the silica gel piece around the conducting strip again, through set up the mounting groove in silica gel piece body bottom, make things convenient for the fixed connection between silica gel piece and the chip.

Description

Silica gel sheet for heat dissipation of circuit mainboard

Technical Field

The utility model relates to a circuit board heat dissipation technical field especially relates to a be used for radiating silica gel piece of circuit board.

Background

A circuit board, also called a motherboard, is installed in a computer main chassis, is one of the most basic and important components of a computer, and plays a role in the whole computer system. The quality of the manufactured motherboard determines the stability of the hardware system. The mainboard is closely related to the CPU, and the major upgrading of the CPU each time inevitably leads to the upgrading of the mainboard. The main board is the core of a computer hardware system and is also a printed circuit board with the largest area in the main case. The main function of the main board is to transmit various electronic signals, and part of the chips are also responsible for primarily processing some peripheral data. All components in the computer host are connected through a mainboard, and the control of the computer on the system memory, the storage device and other I/O devices during normal operation is completed through the mainboard. Whether the performance of the computer is fully developed, whether the hardware functions are sufficient, and how compatible the hardware is, etc., depend on the design of the motherboard. The quality of the motherboard determines to some extent the overall performance, age and functional scalability of a computer.

The heat dissipation of the existing circuit main board is realized by assisting heat conduction and heat dissipation through the silica gel sheet, the existing silica gel sheet has no complex structure and can be only attached to a chip on a circuit board, the heat is led out, but the existing silica gel sheet is bonded to the chip, the time is long, the adhesive glue is aged, and the heat dissipation is easily influenced by the gap between the silica gel sheet and the chip.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the shortcoming that exists among the prior art, and the radiating silica gel piece of circuit mainboard that proposes.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a be used for radiating silica gel piece of circuit motherboard, includes the silica gel piece body, one side outer wall fixedly connected with connecting block of silica gel piece body, the opening has been seted up to the top outer wall of silica gel piece body, and open-ended inner wall sliding connection has the heat dissipation case, the round mouth that the equidistance distributes is all seted up to the both sides outer wall of heat dissipation case, one side outer wall that the silica gel piece body kept away from the connecting block seted up with connecting block assorted spread groove, the mounting groove has been seted up to silica gel piece body bottom outer wall, and the equal fixedly connected with pinch roller of the both sides inner wall of mounting groove, the equal fixedly connected with heat conduction piece that the equidistance distributes of open-ended bottom inner wall, and the one end sliding connection of heat conduction piece is on the inner wall of heat dissipation case.

Preferably, the inner wall of the opening is filled with heat conductive rubber.

Preferably, the connecting mechanism comprises an installation pipe, and the inner walls of two sides of the installation pipe are both connected with the heat conduction pipes in the T-shaped structures in a sliding mode.

Preferably, a first spring is fixedly connected between the two heat conduction pipes.

Preferably, the fixed slot has all been seted up to the both sides outer wall of connecting block, and the equal sliding connection of the inner wall of two fixed slots has the stopper of T shape structure, two the second spring has all been cup jointed to the outer wall of stopper, the both sides inner wall of spread groove all seted up with stopper assorted spacing groove.

Preferably, the fixed slot has all been seted up to the both sides outer wall of connecting block, and the equal swing joint of one side inner wall of two fixed slots has the installation pole, two the equal fixedly connected with latch segment of one side outer wall of installation pole, and all be connected with the third spring between the inner wall of two installation poles and fixed slots.

Preferably, the inner walls of the two sides of the connecting groove are provided with locking grooves matched with the locking blocks.

The utility model has the advantages that:

1. this radiating silica gel piece of circuit mainboard through this internal heat conduction piece that sets up at the silica gel piece, thereby fills heat conduction rubber around the heat conduction piece again and improve the heat conduction efficiency of silica gel piece, through setting up the mounting groove in silica gel piece body bottom, makes things convenient for the fixed connection between silica gel piece and the chip.

2. This radiating silica gel piece of circuit mainboard through this internal coupling mechanism that sets up of silica gel piece, through the cooperation between first spring and the heat pipe in the coupling mechanism, has improved the area of contact between silica gel piece and the radiator, avoids the silica gel piece to lead to the problem that radiating efficiency reduces because of the ageing problem of bonding glue.

3. This radiating silica gel piece of circuit mainboard, through the cooperation between the connecting block of silica gel piece body both sides and the spread groove, the concatenation between convenient each silica gel piece, the chip heat dissipation of the different specifications of being convenient for is used.

Drawings

Fig. 1 is a schematic structural diagram of a silica gel sheet for heat dissipation of a circuit board according to the present invention;

fig. 2 is a schematic cross-sectional structural view of a silica gel sheet for heat dissipation of a circuit board according to the present invention;

fig. 3 is a schematic structural view of a connection mechanism of a silica gel sheet for heat dissipation of a circuit board according to the present invention;

fig. 4 is a schematic structural diagram of a connecting block according to an embodiment of the present invention, wherein the silica gel sheet is used for heat dissipation of the circuit board;

fig. 5 is a schematic diagram of a second connection block according to an embodiment of the present invention.

In the figure: 1 silicon sheet body, 2 connecting blocks, 3 heat dissipation boxes, 4 round mouths, 5 connecting grooves, 6 mounting grooves, 7 heat-conducting rubbers, 8 heat-conducting sheets, 9 connecting mechanisms, 10 pinch rollers, 11 mounting pipes, 12 first springs, 13 heat-conducting pipes, 14 second springs, 15 limiting blocks, 16 third springs, 17 mounting rods and 18 locking blocks.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Example one

Referring to fig. 1-4, a silicon sheet for heat dissipation of a circuit main board comprises a silicon sheet body 1, wherein one side outer wall of the silicon sheet body 1 is fixedly connected with a connecting block 2, the top outer wall of the silicon sheet body 1 is provided with an opening, the inner wall of the opening is slidably connected with a heat dissipation box 3, the two side outer walls of the heat dissipation box 3 are respectively provided with round openings distributed equidistantly, one side outer wall of the silicon sheet body 1, which is far away from the connecting block 2, is provided with a connecting groove 5 matched with the connecting block 2, the bottom outer wall of the silicon sheet body 1 is provided with a mounting groove 6, the two side inner walls of the mounting groove 6 are respectively and fixedly connected with a pressing wheel 10, the bottom inner wall of the opening is respectively and fixedly connected with heat conducting fins 8 distributed equidistantly, one end of each heat conducting fin 8 is slidably connected with the inner wall of the heat, open-ended inner wall packing has heat conduction rubber 7, coupling mechanism 9 is including installation pipe 11, and the equal sliding connection of the both sides inner wall of installation pipe 11 has the heat pipe 13 of T shape structure, the first spring 12 of fixedly connected with between two heat pipes 13, the fixed slot has all been seted up to the both sides outer wall of connecting block 2, and the equal sliding connection of the inner wall of two fixed slots has the stopper 15 of T shape structure, second spring 14 has all been cup jointed to the outer wall of two stoppers 15, the both sides inner wall of spread groove 5 all seted up with stopper 15 assorted spacing groove.

Example two

Referring to fig. 1-3 and 5, a silicone sheet for heat dissipation of a circuit motherboard comprises a silicone sheet body 1, wherein one side outer wall of the silicone sheet body 1 is fixedly connected with a connecting block 2, the top outer wall of the silicone sheet body 1 is provided with an opening, the inner wall of the opening is slidably connected with a heat dissipation box 3, round openings distributed equidistantly are formed in the two side outer walls of the heat dissipation box 3, a connecting groove 5 matched with the connecting block 2 is formed in the side outer wall of the silicone sheet body 1 away from the connecting block 2, a mounting groove 6 is formed in the bottom outer wall of the silicone sheet body 1, pressing wheels 10 are fixedly connected to the inner walls of the two sides of the mounting groove 6, heat conducting fins 8 distributed equidistantly are fixedly connected to the inner wall of the heat dissipation box 3, one end of each heat conducting fin 8 is slidably connected to the inner wall of the heat dissipation box 3, a connecting mechanism 9, open-ended inner wall is filled there is heat conduction rubber 7, coupling mechanism 9 is including installation pipe 11, and the equal sliding connection of the both sides inner wall of installation pipe 11 has the heat pipe 13 of T shape structure, the first spring 12 of fixedly connected with between two heat pipes 13, the fixed slot has all been seted up to the both sides outer wall of connecting block 2, and the equal swing joint of one side inner wall of two fixed slots has installation pole 17, the equal fixedly connected with latch segment 18 of one side outer wall of two installation poles 17, and all be connected with third spring 16 between the inner wall of two installation poles 17 and fixed slots, the both sides inner wall of spread groove 5 all seted up with latch segment 18 assorted locking groove.

The working principle is as follows: during the installation, with chip top joint in mounting groove 6, bond on the chip through glue, pinch roller 10 through in the mounting groove 6 is convenient to fix the chip and is compressing tightly, with 3 top wall connections of heat dissipation case on the radiator, be convenient for tightly laminate heat dissipation case 3 on the radiator through extrusion coupling mechanism 9, the heat conduction efficiency of silica gel piece has been improved through conducting strip 8 and heat conducting rubber 7 in the silica gel piece body 1, the round mouth on the heat dissipation case 3 has improved the area of contact of heat dissipation case 3 and air, further improve the radiating efficiency, through the cooperation between stopper 15 or latch 18 on the connecting block 2 and the spread groove 5, the convenience is to the concatenation between the silica gel piece.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. A silica gel sheet for heat dissipation of a circuit mainboard comprises a silica gel sheet body (1) and is characterized in that a connecting block (2) is fixedly connected to the outer wall of one side of the silica gel sheet body (1), an opening is formed in the outer wall of the top of the silica gel sheet body (1), a heat dissipation box (3) is slidably connected to the inner wall of the opening, round openings distributed at equal intervals are formed in the outer walls of two sides of the heat dissipation box (3), a connecting groove (5) matched with the connecting block (2) is formed in the outer wall of one side, away from the connecting block (2), of the silica gel sheet body (1), a mounting groove (6) is formed in the outer wall of the bottom of the silica gel sheet body (1), pressing wheels (10) are fixedly connected to the inner walls of two sides of the mounting groove (6), heat conducting fins (8) distributed at equal intervals are fixedly connected to the inner wall of the bottom of the opening, the inner wall of the bottom of the opening is fixedly connected with a connecting mechanism (9), and one end of the connecting mechanism (9) is connected to the heat dissipation box (3).

2. The silicon sheet for heat dissipation of circuit main boards according to claim 1, wherein the inner wall of the opening is filled with heat conducting rubber (7).

3. The silicone sheet for heat dissipation of a circuit main board according to claim 2, wherein the connecting mechanism (9) comprises a mounting tube (11), and heat pipes (13) having T-shaped structures are slidably connected to inner walls of two sides of the mounting tube (11).

4. The silicon sheet for heat dissipation of a circuit main board according to claim 3, wherein a first spring (12) is fixedly connected between the two heat pipes (13).

5. The silicon sheet for heat dissipation of circuit main boards according to claim 4, wherein fixing grooves are formed in outer walls of two sides of the connecting block (2), the inner walls of the two fixing grooves are connected with limiting blocks (15) of T-shaped structures in a sliding mode, the outer walls of the two limiting blocks (15) are sleeved with second springs (14), and limiting grooves matched with the limiting blocks (15) are formed in inner walls of two sides of the connecting groove (5).

6. The silicon sheet for heat dissipation of circuit main boards according to claim 4, wherein fixing grooves are formed in outer walls of two sides of the connecting block (2), mounting rods (17) are movably connected to inner walls of one side of the two fixing grooves, locking blocks (18) are fixedly connected to outer walls of one side of the two mounting rods (17), and third springs (16) are connected between the two mounting rods (17) and the inner walls of the fixing grooves.

7. The silicon sheet for heat dissipation of a circuit main board according to claim 6, wherein the inner walls of the two sides of the connecting groove (5) are both provided with locking grooves matched with the locking blocks (18).