CN208063665U - A kind of vehicle-mounted DA host computer controls chip cooling structure - Google Patents
A kind of vehicle-mounted DA host computer controls chip cooling structure Download PDFInfo
- Publication number
- CN208063665U CN208063665U CN201820615469.XU CN201820615469U CN208063665U CN 208063665 U CN208063665 U CN 208063665U CN 201820615469 U CN201820615469 U CN 201820615469U CN 208063665 U CN208063665 U CN 208063665U
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- China
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- cooling fin
- bending part
- vehicle
- upper cover
- host computer
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Abstract
The utility model discloses a kind of vehicle-mounted DA host computer controls chip cooling structures in chip cooling field, including pcb board, core sheet is integrated on pcb board, guide rail silica gel is pasted in core sheet, the pcb board is fixedly connected on lower lid, lower cover is mutually fixed with upper cover, cooling fin is provided between upper cover and pcb board, the cooling fin is set as U-shaped, cooling fin includes upper bending part, lower bending part and center vertical portion, the upper bending part fits with upper cover, corresponding upper bending part is equipped with heat emission hole on upper lid, the lower bending part fits with guide rail silica gel, cooling fin is corresponded on the lower lid is equipped with heat emission hole.The utility model can utilize rational space to increase the cooling fin of an aluminium material, by cooling fin and upper cover, lower cover heat emission hole between form stack effect, effectively radiated, enhancing heat dissipation performance.
Description
Technical field
The utility model belongs to chip cooling field, more particularly to a kind of vehicle-mounted DA host computer controls chip cooling structure.
Background technology
Currently, the various host computer control chips in electronic field generally carry out cross-ventilation using the hole on host shell and dissipate
Heat.In the prior art, it includes pcb board to have a kind of radiator structure, structure, and core sheet is provided on pcb board, is pasted in core sheet
There are heat conductive silica gel, the other side and the host shell of heat conductive silica gel to fit.When the radiator structure works, the heat of core sheet passes through
Heat conductive silica gel is transmitted on host shell, and heat is disseminated in air by host shell again.Disadvantage is that：Both the above
Common radiating mode can solve the heat dissipation problem of lower-powered chip substantially, but as customer experience requires increasingly
Height, space accounting demand is smaller and smaller, the demand to heat dissipation performance just constantly increase, how in a limited space in improve chip
Heat dissipation performance, be always a problem.
Utility model content
The purpose of this utility model is to provide a kind of vehicle-mounted DA host computer controls chip cooling structure, can utilize rational empty
Between increase the cooling fin of an aluminium material, by cooling fin and upper cover, lower cover heat emission hole between form stack effect, carry out effective
Heat dissipation, enhance heat dissipation performance.
What the purpose of this utility model was realized in：A kind of vehicle-mounted DA host computer controls chip cooling structure, including PCB
Plate is integrated with core sheet on pcb board, guide rail silica gel is pasted in core sheet, the pcb board is fixedly connected on lower lid, lower cover
It is mutually fixed with upper cover, cooling fin is provided between upper cover and pcb board, the cooling fin is set as U-shaped, and cooling fin includes upper bending
Portion, lower bending part and center vertical portion, the upper bending part and upper cover stake-fastening, corresponding upper bending part is equipped with heat dissipation on upper lid
Hole, the lower bending part fit with guide rail silica gel, and cooling fin is corresponded on the lower lid and is equipped with heat emission hole.
When utility model works, upper bending part is directly contacted with air by upper cover, lower bending part through heat conductive silica gel with
Core sheet contacts, and the heat in core sheet is transmitted to by heat conductive silica gel on cooling fin, heat dissipating by upper cover and lower cover again
Hot hole transmits outward, forms stack effect, is effectively radiated.Compared with prior art, the beneficial effects of the utility model exist
In：Cooling fin is radiated with after host shell riveted by the heat emission hole of shell, and radiating efficiency is high；It ensure that cooling fin passes through
Heat conductive silica gel comes into full contact with core sheet, saves the space between cooling fin and pcb board to greatest extent, allows spaces compact
Pcb board can be with arranging devices as much as possible.This radiator structure can be used in space relative compact, the larger control of radiating requirements
Coremaking piece can be not only used on vehicle-mounted DA, can also be used on the larger chip of other radiating requirements.
As the improvement of the utility model, the cooling fin and upper cover stake-fastening, pcb board are consolidated with lower cover by screw
Fixed, upper cover is connected with lower cover by buckle and screw.
The center vertical portion is equipped with the evagination of several increasing heat radiation areas as a further improvement of the utility model,
It rises.Shutter of the outer lug as cooling fin, forms air disturbance, and increasing heat radiation area adequately and reasonably utilizes space and sky
Aerodynamics carries out corresponding heat transfer.
The center vertical portion is equipped with bending edges as a further improvement of the utility model,.The bending edges of cooling fin
As guide channel, heat is transmitted outward by the heat emission hole of host shell, is formed stack effect, is more effectively radiated,
The side of the upper cover and lower cover is equipped with several heat radiation channels as a further improvement of the utility model,.Heat
Radiation channel can carry out air heat radiation, improve radiating efficiency.
As the preferred of the utility model, the rear side of the upper cover and lower cover is equipped with rear cover, is also set between upper cover and lower cover
There is side plate.
In order to improve radiating efficiency and mitigate weight, the cooling fin is made of aluminum material.
Description of the drawings
Fig. 1 is the explosive view of the utility model.
Fig. 2 is the structural schematic diagram of upper cover and cooling fin.
Fig. 3 is upper cover and the structural schematic diagram after the completion of cooling fin assembly.
Fig. 4 is the structural schematic diagram of cooling fin.
Fig. 5 is pcb board and the structural schematic diagram after the completion of lower cover assembly.
Fig. 6 is the structural schematic diagram after the completion of upper cover and lower cover assembly.
Wherein, 1 upper cover, 2 rear covers, 3 cooling fins, bending part on 301,302 center vertical portions, 303 times bending parts, 3a evaginations
It rises, 3b bending edges, 4 heat conductive silica gels, 5 pcb boards, 5a core sheets, 6 lower covers, 7 side plates, 8 heat emission holes, 9 heat radiation channels.
Specific implementation mode
As shown in figures 1 to 6, it is a kind of vehicle-mounted DA host computer controls chip cooling structure, including pcb board 5, is integrated on pcb board 5
There is core sheet 5a, guide rail silica gel 4 is pasted on core sheet 5a, pcb board 5 is fixedly connected on lower cover 6, and lower cover 6 is solid with 1 phase of upper cover
It is fixed, be provided with cooling fin 3 between upper cover 1 and pcb board 5, cooling fin 3 is set as U-shaped, cooling fin 3 include upper bending part 301, under
Bending part 303 and center vertical portion 302, upper bending part 301 and 1 stake-fastening of upper cover, corresponding upper bending part 301 is set in upper cover 1
There are heat emission hole 8, lower bending part 303 to fit with guide rail silica gel 4, cooling fin 3 is corresponded on lower cover 6 and is equipped with heat emission hole 8.Cooling fin 3
With 1 stake-fastening of upper cover, pcb board 5 is fixed with lower cover 6 by screw, and upper cover 1 is connected with lower cover 6 by buckle and screw.
Center vertical portion 302 is equipped with the outer lug 3a of several increasing heat radiation areas.Center vertical portion 302 is equipped with bending edges 3b.On
The side of lid 1 and lower cover 6 is equipped with several heat radiation channels 9.The rear side of upper cover 1 and lower cover 6 is equipped with rear cover 2, upper cover 1 and lower cover 6
Between be additionally provided with side plate 7.Cooling fin 3 is made of aluminum material.
When this arrangement works, upper bending part 301 is directly contacted with air by upper cover 1, and lower bending part 303 is through heat conductive silica gel
4 contact with core sheet 5a, and the heat on core sheet 5a is transmitted to by heat conductive silica gel 4 on cooling fin 3, and heat passes through upper cover 1 again
It is transmitted outward with the heat emission hole 8 of lower cover 6, heat radiation channel 9；For the bending edges 3b of cooling fin 3 as guide channel, heat passes through master
The heat emission hole 8 of casing body transmits outward, forms stack effect, more effectively radiates.The advantages of this structure, is：Cooling fin 3 with
It is radiated by the heat emission hole of shell 8 after host shell riveted, radiating efficiency is high；It ensure that cooling fin 3 passes through heat conductive silica gel 4
It is come into full contact with core sheet 5a, saves the space between cooling fin 3 and pcb board 5 to greatest extent, allow the pcb board 5 of spaces compact
It can be with arranging devices as much as possible.This radiator structure can be used in space relative compact, the larger control core of radiating requirements
Piece can be not only used on vehicle-mounted DA, can also be used on the larger chip of other radiating requirements.
The utility model is not limited to above-described embodiment, on the basis of technical solution disclosed by the utility model, this
For the technical staff in field according to disclosed technology contents, not needing performing creative labour can be special to some of which technology
Sign makes some and replaces and deform, these are replaced and deformation is within the protection scope of the present utility model.
Claims (7)
1. a kind of vehicle-mounted DA host computer controls chip cooling structure, including pcb board, it is integrated with core sheet on pcb board, is glued in core sheet
Post guide rail silica gel, which is characterized in that the pcb board is fixedly connected on lower lid, and lower cover is mutually fixed with upper cover, upper cover and PCB
Cooling fin is provided between plate, the cooling fin is set as U-shaped, and cooling fin includes upper bending part, lower bending part and center vertical
Portion, the upper bending part and upper cover stake-fastening, corresponding upper bending part is equipped with heat emission hole, the lower bending part and guide rail on upper lid
Silica gel fits, and cooling fin is corresponded on the lower lid and is equipped with heat emission hole.
2. a kind of vehicle-mounted DA host computer controls chip cooling structure according to claim 1, which is characterized in that the cooling fin
With upper cover stake-fastening, pcb board is fixed with lower cover by screw, and upper cover is connected with lower cover by buckle and screw.
3. a kind of vehicle-mounted DA host computer controls chip cooling structure according to claim 1 or 2, which is characterized in that in described
Between vertical portion be equipped with several increasing heat radiation areas outer lug.
4. a kind of vehicle-mounted DA host computer controls chip cooling structure according to claim 1 or 2, which is characterized in that in described
Between vertical portion be equipped with bending edges.
5. a kind of vehicle-mounted DA host computer controls chip cooling structure according to claim 1 or 2, which is characterized in that on described
The side of lid and lower cover is equipped with several heat radiation channels.
6. a kind of vehicle-mounted DA host computer controls chip cooling structure according to claim 1 or 2, which is characterized in that on described
The rear side of lid and lower cover is equipped with rear cover, and side plate is additionally provided between upper cover and lower cover.
7. a kind of vehicle-mounted DA host computer controls chip cooling structure according to claim 1 or 2, which is characterized in that described to dissipate
Backing is made of aluminum material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820615469.XU CN208063665U (en) | 2018-04-27 | 2018-04-27 | A kind of vehicle-mounted DA host computer controls chip cooling structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820615469.XU CN208063665U (en) | 2018-04-27 | 2018-04-27 | A kind of vehicle-mounted DA host computer controls chip cooling structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208063665U true CN208063665U (en) | 2018-11-06 |
Family
ID=63983836
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820615469.XU Active CN208063665U (en) | 2018-04-27 | 2018-04-27 | A kind of vehicle-mounted DA host computer controls chip cooling structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208063665U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110234217A (en) * | 2019-07-18 | 2019-09-13 | 深圳祖师汇科技股份有限公司 | A kind of automobile data recorder with bridging type radiator structure |
| CN113825308A (en) * | 2021-09-03 | 2021-12-21 | 远峰科技股份有限公司 | Heating chip fixing structure, vehicle-mounted navigation host and assembling method thereof |
-
2018
- 2018-04-27 CN CN201820615469.XU patent/CN208063665U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110234217A (en) * | 2019-07-18 | 2019-09-13 | 深圳祖师汇科技股份有限公司 | A kind of automobile data recorder with bridging type radiator structure |
| CN113825308A (en) * | 2021-09-03 | 2021-12-21 | 远峰科技股份有限公司 | Heating chip fixing structure, vehicle-mounted navigation host and assembling method thereof |
| CN113825308B (en) * | 2021-09-03 | 2022-07-15 | 远峰科技股份有限公司 | Heating chip fixing structure, vehicle-mounted navigation host and assembling method thereof |
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