CN201465020U - Conduction and heat dissipation device of CPCI module - Google Patents
Conduction and heat dissipation device of CPCI module Download PDFInfo
- Publication number
- CN201465020U CN201465020U CN2009200830469U CN200920083046U CN201465020U CN 201465020 U CN201465020 U CN 201465020U CN 2009200830469 U CN2009200830469 U CN 2009200830469U CN 200920083046 U CN200920083046 U CN 200920083046U CN 201465020 U CN201465020 U CN 201465020U
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Abstract
The utility model discloses a conduction and heat dissipation device of a CPCI module, which mainly comprises a box body provided with a guide groove, a rear panel fixedly connected to the box body and a CPCI module provided with a conduction and heat dissipation mechanism and fixedly inserted in the guide groove of the box body. The conduction and heat dissipation mechanism of the CPCI module consists of a cold plate and trapezoid blocks fixed on the printed circuit block of the CPCI module, wherein radiating blocks integrated with the cold plate as a whole are arranged on the upper and the lower end surfaces of the cold plate, the trapezoid blocks are positioned at two ends of the radiating blocks, and the locked and fixed trapezoid blocks and the radiating blocks are in tight joint with the heat transmission blocks forming the edge of the guide groove respectively. The device has a simple structure, changes traditional air conduction heat dissipation into contact conduction, and utilizes the high conductivity of the contact carriers in the conduction to improve the efficiency of heat conduction and heat dissipation, thereby effectively solving the heat dissipation problem of CPCI embedded-type reinforced computer and the CPCI module inside the computer, ensuring the stability and the reliability of equipment running, and reducing the damage ratio and the failure rate of the equipment.
Description
Technical field
The utility model relates to electronic device field, specifically is a kind of heat loss through conduction device of CPCI module.
Background technology
Compact PCI (Compact Peripheral Component Interconnect) is called for short CPCI, and Chinese claims compact PCI again.CPCI is a kind of reinforcement type high-performance industrial computer framework based on Standard PC I bus specification, its appearance not only allows such as CPU, many original technology and matured products based on PC such as hard disk can continue application, also owing to done significant improvement in places such as interfaces, be applicable to reliability, maintainable, shock resistance, the place that freedom from vibration and cooling power have higher requirements, satisfy military, industry spot and information industry and various severe rugged environment demands of applications, be main flow industrial computer technology of new generation, the feasible server that adopts the CPCI technology, industrial PCs etc. have had high opening, good thermal diffusivity, high stability, high reliability, high density, advantage such as hot-swappable.
Utilize the instrument type of CPCI technology to be used widely gradually, at present the CPCI embedded reinforcement computing machine that comes out is exactly wherein a kind of, in its circuit plugboard inserted casing from computing machine the place ahead, the outlet of I/O data can be the interface on the front panel or the backboard of computer box.
Yet use the embedded reinforcement computing machine of CPCI technology at present, its heat abstractor only be the panel by computer box carry out that heat is transmitted and casing after radiator fan dispel the heat, also having on the CPCI module increases radiating fin and solves that module itself dispels the heat, but the radiating mode of radiating fin remains the mode of air transmitted, and the mode of this air transmitted heat radiation is subjected to the low cause of air transmitted coefficient to cause the rate of heat dissipation of CPCI module low; The cabinet panel of traditional C PCI embedded reinforcement computing machine is that its area of dissipation has limitation, has reduced radiating efficiency too by the slab construction that adopts metal or the high material of other coefficient of heat conductivity to make simultaneously.Therefore, the reduction of radiating efficiency makes the computing machine inner module be in the running environment of high temperature, and aging speed that undoubtedly can the accelerating module components and parts reduces module stability, reliability.
The utility model content
The purpose of this utility model is to address the above problem, provide a kind of simple in structure, effectively solve the heat loss through conduction device of the CPCI module of CPCI embedded reinforcement computing machine and inner CPCI module heat dissipating thereof.
For reaching the foregoing invention purpose, the technical scheme that is adopted is: a kind of heat loss through conduction device of CPCI module, it mainly is the casing that is provided with gathering sill by inside surface up and down, be fastened on the rear panel on the casing, and the CPCI module that has heat loss through conduction mechanism in the gathering sill that is fixed on casing of pegging graft connects and composes, the heat loss through conduction mechanism of described CPCI module is made of the cold drawing and the trapezoid block that are fixed on the CPCI module printed circuit board, being respectively equipped with cold drawing on the end face of two ends about the described cold drawing is the radiating block of one, trapezoid block places the two ends of radiating block, and the trapezoid block after being locked fits tightly with the heat transfer block that constitutes the gathering sill trough rim respectively mutually with radiating block.Be provided with the through hole that wears screw rod along its axial direction in the radiating block on the described cold drawing, place the trapezoid block at radiating block two ends to be set on this screw rod.Also be provided with radiating fin on the described cold drawing.
Described casing is the frame shape structure that is connected and composed by the four sides panel, and gathering sill and upper and lower surface panel are an one-piece construction, and the outside surface of every faceplate panels is provided with a plurality of heat radiating fin holes that array distribution increases area of dissipation that are.Described each heat radiating fin hole be shaped as square fin hole.The described heat radiating fin hole that is array distribution, each heat radiating fin hole transversely respectively with cabinet wall on position, the groove position relation of gathering sill corresponding one by one.
The corresponding outer surface portions of power module that described rear panel and computer-internal are installed is provided with the heat radiator with the rear panel one.
In sum, the utility model is simple in structure, the mode of traditional air transmitted heat radiation is changed into the mode of contact conduction, utilize the high conductance of the carrier of conduction contact itself, improve the efficient of heat conducting and radiating, solve the heat dissipation problem of the CPCI module of CPCI embedded reinforcement computing machine and inside thereof effectively, ensured operation stability of equipment and reliability, reduced the spoilage and the failure rate of equipment.
Description of drawings
Fig. 1 is the utility model structural representation;
Fig. 2 is Fig. 1 master's apparent direction structural representation;
Fig. 3 is the structural representation of the heat loss through conduction mechanism in the CPCI module;
Fig. 4 is a rear panel and structural representation after casing is connected;
Among the figure: 1-casing, 2-heat radiating fin hole, 3-heat transfer block, 4-radiating fin, 5-cold drawing, 6-radiating block, 7-CPCI module, 8-trapezoid block, 9-screw rod, 10-rear panel, 11-heat radiator.
Embodiment
Below in conjunction with accompanying drawing the utility model is described in further detail:
Shown in Fig. 1～3, a kind of heat loss through conduction device of CPCI module, it mainly is the casing 1 that is provided with gathering sill by inside surface up and down, being fastened on the CPCI module 7 that has heat loss through conduction mechanism in the rear panel 10 on the casing 1 and the gathering sill that is fixed on casing 1 of pegging graft connects and composes, the heat loss through conduction mechanism of described CPCI module 7 is made of the cold drawing 5 and the trapezoid block 8 that are fixed on CPCI module 7 printed circuit boards, described cold drawing is respectively equipped with on the end face of two ends about in the of 5 with cold drawing 5 and is the radiating block 6 of one, trapezoid block 8 places the two ends of radiating block 6, and the trapezoid block 8 after being locked fits tightly with the heat transfer block 3 that constitutes the gathering sill trough rim respectively mutually with radiating block 6.Be provided with the through hole that wears screw rod 6 along its axial direction in the radiating block 6 on the described cold drawing 5, place the trapezoid block 8 at radiating block 6 two ends to be set on this screw rod 6.Also be provided with radiating fin 4 on the described cold drawing 5.
As shown in Figure 1, 2, described casing 1 is the frame shape structure that is connected and composed by the four sides panel, and gathering sill and upper and lower surface panel are an one-piece construction, and the outside surface of every faceplate panels is provided with a plurality of heat radiating fin holes 2 that array distribution increases area of dissipation that are.Described each heat radiating fin hole 2 be shaped as square fin hole.The described heat radiating fin hole 2 that is array distribution, each heat radiating fin hole 2 transversely respectively with casing 1 inwall on position, the groove position relation of gathering sill corresponding one by one.
As shown in Figure 4, described rear panel 10 and the computer-internal corresponding outer surface portions of power module of installing is provided with the heat radiator 11 with rear panel 10 one.During practical application, casing and rear panel all adopt Al-alloy metal to make, and rear panel to casing, reaches the heat radiation of power module with the heat transferred of power module by heat radiator on the rear panel and casing.
Shown in Fig. 1,4, described casing 1 is the frame shape structure that is connected and composed by the four sides panel, and the outside surface of every faceplate panels is provided with a plurality of square heat radiating fin holes 2 that are array distribution, increase area of dissipation.The described heat radiating fin hole 2 that is array distribution, each heat radiating fin hole 2 transversely respectively with casing 1 inwall on the position relation of gathering sill corresponding one by one.Surface area when the utility model does not increase the heat radiating fin hole with cabinet calculates, and is about 175101mm
2, increased square heat radiating fin hole after (fin hole gauge lattice: 30.5 * 30.5 * 7mm), area of dissipation has increased 110505.6mm
2
Claims (7)
1. the heat loss through conduction device of a CPCI module, it is characterized in that: described heat loss through conduction device mainly is the casing (1) that is provided with gathering sill by inside surface up and down, be fastened on the rear panel (10) on the casing (1), and the CPCI module (7) that has heat loss through conduction mechanism in the gathering sill that is fixed on casing (1) of pegging graft connects and composes, the heat loss through conduction mechanism of described CPCI module (7) is made of the cold drawing (5) and the trapezoid block (8) that are fixed on CPCI module (7) printed circuit board, described cold drawing (5) is respectively equipped with on the end face of two ends with cold drawing (5) up and down and is the radiating block of one (6), trapezoid block (8) places the two ends of radiating block (6), and the trapezoid block after being locked (8) fits tightly with the heat transfer block (3) that constitutes the gathering sill trough rim respectively mutually with radiating block (6).
2. according to the heat loss through conduction device of the described CPCI module of claim 1, it is characterized in that: be provided with the through hole that wears screw rod (6) along its axial direction in the radiating block (6) on the described cold drawing (5), place the trapezoid block (8) at radiating block (6) two ends to be set on this screw rod (6).
3. according to the heat loss through conduction device of the described CPCI module of claim 1, it is characterized in that: described casing (1) is the frame shape structure that is connected and composed by the four sides panel, gathering sill and upper and lower surface panel are an one-piece construction, and the outside surface of every faceplate panels is provided with a plurality of heat radiating fin holes (2) that array distribution increases area of dissipation that are.
4. according to the heat loss through conduction device of the described CPCI module of claim 3, it is characterized in that: described each heat radiating fin hole (2) be shaped as square fin hole.
5. according to the heat loss through conduction device of the described CPCI module of claim 3, it is characterized in that: the described heat radiating fin hole (2) that is array distribution, each heat radiating fin hole (2) transversely respectively with casing (1) inwall on position, the groove position relation of gathering sill corresponding one by one.
6. according to the heat loss through conduction device of the described CPCI module of claim 1, it is characterized in that: the corresponding outer surface portions of power module that described rear panel (10) and computer-internal are installed is provided with the heat radiator (11) with rear panel (10) one.
7. according to the heat loss through conduction device of the described CPCI module of claim 1, it is characterized in that: also be provided with radiating fin (4) on the described cold drawing (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009200830469U CN201465020U (en) | 2009-08-03 | 2009-08-03 | Conduction and heat dissipation device of CPCI module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009200830469U CN201465020U (en) | 2009-08-03 | 2009-08-03 | Conduction and heat dissipation device of CPCI module |
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| Publication Number | Publication Date |
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| CN201465020U true CN201465020U (en) | 2010-05-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2009200830469U Expired - Lifetime CN201465020U (en) | 2009-08-03 | 2009-08-03 | Conduction and heat dissipation device of CPCI module |
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| CN (1) | CN201465020U (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102548335A (en) * | 2010-12-09 | 2012-07-04 | 鸿富锦精密工业（深圳）有限公司 | Electronic device |
| CN102984926A (en) * | 2012-11-30 | 2013-03-20 | 西安电子工程研究所 | Analog circuit box type plug-in system structure |
| CN103108522A (en) * | 2011-11-11 | 2013-05-15 | 讯凯国际股份有限公司 | Radiating fins and radiating device and manufacturing method thereof |
| CN104427835A (en) * | 2013-09-11 | 2015-03-18 | 雅特生嵌入式计算有限公司 | Extended heat frame for printed circuit board |
| CN105472935A (en) * | 2015-12-10 | 2016-04-06 | 中国航空工业集团公司西安航空计算技术研究所 | Heat dissipation apparatus with liquid cooling module on side wall |
| TWI576039B (en) * | 2015-02-04 | 2017-03-21 | Wei xiao-wei | Stacked printed circuit board computer cooling module assembly |
| CN107300963A (en) * | 2017-07-27 | 2017-10-27 | 湖南中科信为科技有限公司 | A kind of high power consumption CPCI mainboard heat dissipation cold plates |
| CN109302820A (en) * | 2018-12-27 | 2019-02-01 | 南京丰泰通信技术股份有限公司 | A kind of PCM equipment being conveniently replaceable |
| CN111309126A (en) * | 2020-04-01 | 2020-06-19 | 中国电子科技集团公司第五十四研究所 | CPCI time system case cooling system |
-
2009
- 2009-08-03 CN CN2009200830469U patent/CN201465020U/en not_active Expired - Lifetime
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102548335A (en) * | 2010-12-09 | 2012-07-04 | 鸿富锦精密工业（深圳）有限公司 | Electronic device |
| CN103108522A (en) * | 2011-11-11 | 2013-05-15 | 讯凯国际股份有限公司 | Radiating fins and radiating device and manufacturing method thereof |
| CN102984926A (en) * | 2012-11-30 | 2013-03-20 | 西安电子工程研究所 | Analog circuit box type plug-in system structure |
| CN104427835A (en) * | 2013-09-11 | 2015-03-18 | 雅特生嵌入式计算有限公司 | Extended heat frame for printed circuit board |
| CN104427835B (en) * | 2013-09-11 | 2018-01-19 | 雅特生嵌入式计算有限公司 | Circuit board assemblies and electronic equipment machine shell systems |
| TWI576039B (en) * | 2015-02-04 | 2017-03-21 | Wei xiao-wei | Stacked printed circuit board computer cooling module assembly |
| CN105472935A (en) * | 2015-12-10 | 2016-04-06 | 中国航空工业集团公司西安航空计算技术研究所 | Heat dissipation apparatus with liquid cooling module on side wall |
| CN107300963A (en) * | 2017-07-27 | 2017-10-27 | 湖南中科信为科技有限公司 | A kind of high power consumption CPCI mainboard heat dissipation cold plates |
| CN109302820A (en) * | 2018-12-27 | 2019-02-01 | 南京丰泰通信技术股份有限公司 | A kind of PCM equipment being conveniently replaceable |
| CN111309126A (en) * | 2020-04-01 | 2020-06-19 | 中国电子科技集团公司第五十四研究所 | CPCI time system case cooling system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SICHUAN JOVIAN MEASURING+CONTROL TECHNOLOGY CO.LTD Free format text: FORMER OWNER: CHENGDU JOVIAN SCIENCE + TECHNOLOGY CO., LTD. Effective date: 20100705 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 610041 SCIENCE AND TECHNOLOGY INDUSTRIAL PARK, NO.11, GAOPENG STREET, CHENGDU CITY HIGH-TECH ZONE, SICHUAN PROVINCE TO: 611731 NO.1, TIANHE ROAD, (WEST DISTRICT), CHENGDU HIGH-TECH ZONE, SICHUAN PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20100705 Address after: 611731, 1, Tianhe Road, hi tech Zone (west end, Chengdu, Sichuan) Patentee after: Sichuan Zongheng Measurement Control Technology Co., Ltd. Address before: Science and Technology Industrial Park, No. 11 high tech Zone Gaopeng road in Chengdu city of Sichuan Province in 610041 Patentee before: Chengdu Zongheng Technology Co., Ltd. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20100512 |
|
| CX01 | Expiry of patent term |