CN211786961U - Heat dissipation device for VPX Loongson mainboard - Google Patents

Abstract

The utility model discloses a heat dissipation device for a VPX Loongson mainboard, which comprises a heat radiator and a reinforcing bottom plate; the radiator is of an integral structure, parallel radiating fins are arranged on the outer surface of the radiator along the horizontal direction, vertical notches are arranged on the radiating fins, the depth of each notch is consistent with the height of each radiating fin, and the position of each notch on each radiating fin corresponds to the position of the notch on each adjacent radiating fin, so that an airflow channel perpendicular to the plane where the radiating fins are located is formed by the notches on the adjacent radiating fins; the two sides of the inner surface of the radiator are fixedly connected with wedge-shaped strips which are used for contacting with an external case for heat transfer; the mainboard is clamped in the radiator and the reinforcing bottom plate and fixed with the mainboard together, and the heating part of the mainboard is contacted with the inner surface of the radiator for radiating. The utility model discloses good heat dissipation, anti-vibration impact ability is strong.

Description

Heat dissipation device for VPX Loongson mainboard

Technical Field

The utility model relates to a technical field of electronic equipment thermal design, concretely relates to in a heat abstractor for VPX godson mainboard.

Background

In recent years, with the great investment of China on the domestic autonomous controllable computer, the performance of the domestic CPU processor chip is continuously improved, and in addition, the BIOS component, the domestic operating system, the domestic database, the middleware and the domestic office software which are independently developed by China are continuously improved, so that the progress of the technologies provides a good support for the development of the domestic autonomous controllable computer.

The Loongson CPU is used as a representative of a domestic autonomous CPU, the adaptability and the use reliability of the Loongson CPU are improved to a certain extent after being used by different users for many years, and the Loongson CPU is accepted by more and more users, is used as a representative chip 3A3000 of the Loongson CPU, is a processor configured into a single-node 4 core, is manufactured by adopting a 28nm process, and has the working dominant frequency of 1.2GHz-1.5 GHz. The CPU chip is of a special industrial grade and mainly faces equipment such as a desktop, a server, a Digital Signal Processor (DSP) and a high-performance reinforced computer.

With the increasing density of chips and circuit boards and the increasing speed requirements, the conventional shared parallel bus gradually becomes the main bottleneck for improving the system performance, and the adoption of high-speed serial bus is gradually shifted. The high speed serial bus implements a low voltage differential level serial transmission protocol to increase the copper transmission bandwidth to an unprecedented level, and VPX is a new generation bus standard based on high speed serial buses that uses high speed differential connectors that enable data rates in excess of 6.25Gbps per pair of differential signals.

The specific content of the VPX standard is reflected in the VITA46 series specifications, the used modules still retain the 3U and 6U structural sizes, and for a 6U VPX motherboard, the sizes are as follows: 233.35X 160, and typically has a height of 4HP or 5 HP. An 8-column 7-row RT2 connector and 6-column 16-row 7-row RT2 connectors are used on a typical 6U VPX board, and are respectively defined as P0, P1, P2, P3, P4, P5 and P6, the VPX bus standard inherits the advantages of the original VME standard in terms of mechanical structure and heat conduction and shock resistance, and therefore, the VPX product is widely used as a special reinforced embedded system.

The 6U VPX double-path Loongson 3A3000 CPU mainboard is taken as a domestic autonomous controllable typical embedded mainboard, is widely used in the aspect of special reinforced computers for resisting severe environments, and has the disadvantages of severe use environments, high environment temperature during working and general requirement of 55 ℃; in addition, for the Loongson 3A3000 CPU, because of high integration level, the generated heat is large, two CPU particles are integrated on the limited 6U VPX mainboard, and meanwhile, the mainboard also has other heat power chips to generate certain heat, so that the heat gathered by the whole 6U VPX mainboard is large, if the effective radiator design cannot be carried out, the heat generated by the mainboard is led out in time, the phenomena of system instability such as the mainboard crash, blue screen, restart and the like can be caused, the service life is shortened, and even some parts can be burned out; secondly, a Solid State Disk (SSD) or a battery and the like are integrated on the mainboard, so that the maintenance is convenient, and the radiator of the mainboard cannot influence the maintenance convenience; in addition, the module needs to have certain vibration and impact resistance to meet the severe mechanical destructive requirement in the use environment, and by combining the above conditions, the function of the heat dissipation device of the 6UVPX dual-channel Loongson 3A3000 CPU mainboard is particularly important, and the key point for judging whether the whole reinforced computer (server) can work normally is provided.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model provides a heat abstractor for VPX godson mainboard, good heat dissipation, anti-vibration impact ability is strong.

The utility model adopts the following technical scheme:

a heat sink for VPX Loongson mainboard, the said mainboard heat sink includes heat sink and strengthens the bottom plate;

the radiator is of an integral structure, parallel radiating fins are arranged on the outer surface of the radiator along the horizontal direction, vertical notches are arranged on the radiating fins, the depth of each notch is consistent with the height of each radiating fin, and the position of each notch on each radiating fin corresponds to the position of the notch on each adjacent radiating fin, so that the notches on the adjacent radiating fins form an airflow channel perpendicular to the plane where the radiating fins are located; the two sides of the inner surface of the radiator are fixedly connected with wedge-shaped strips which are used for contacting with an external case for heat transfer;

the mainboard is clamped in the radiator and the reinforcing bottom plate and fixed with the mainboard together, and the heating part of the mainboard is in contact with the inner surface of the radiator to dissipate heat.

Furthermore, two sides of the inner surface of the radiator are fixedly connected with the wedge-shaped strips through screws.

Further, the radiator and the reinforcing bottom plate are fixedly connected through screws.

Furthermore, a maintenance panel is arranged outside the battery and the solid state disk on the radiator.

Has the advantages that:

1. the utility model can ensure that the heat generated by the godson mainboard is transmitted to the radiator in time and then is consumed to other heat sinks through the radiator, thereby ensuring the normal and stable work of the mainboard;

secondly, the radiator is of an integral structure, the front panel is used as a part of the radiator, so that the rigidity of the radiator is high, the first-order natural frequency of the radiator can be increased, the vibration and impact resistance of the radiator is improved, in addition, the heat sink of the radiator can be increased, the temperature difference of different parts of the whole radiator is reduced, and the radiating effect of the radiator is improved; the upper side of the outer surface of the radiator is provided with radiating fins, and the radiating area is larger. The heat dissipation device can meet the requirement of a forced air cooling or conduction heat dissipation single heat dissipation mode, can also be compatible with the two heat dissipation modes, and is more flexible and effective; moreover, the airflow channel on the outer surface of the radiator increases the forced air cooling heat dissipation effect by increasing the air cooling heat dissipation exchange area and changing the cooling airflow from laminar flow to turbulent flow;

finally, an integral radiator is designed on the upper side of the main board, a reinforcing bottom plate is arranged on the lower side of the main board, and all structural components are connected through corresponding screws, so that the first-order natural frequency of the whole main board module can be improved, and the vibration and impact resistance of the main board module is enhanced.

2. Because of the battery of mainboard, SSD dish change maintenance frequency height, the utility model discloses reserved corresponding battery fixing base and maintenance window according to battery, SSD dish position on the radiator to design supporting maintenance apron, conveniently change and the maintenance needs to change the device often, thereby improve its maintainability, ensure the integrality of whole module outward appearance again.

Drawings

Fig. 1 is a top view of the present invention;

FIG. 2(a) is a cross-sectional view taken along line A-A of FIG. 1;

FIG. 2(B) is a cross-sectional view taken along the line of FIGS. 1B-B;

fig. 3 is a bottom view of the present invention;

FIG. 4 is a schematic view of the maintenance of the present invention;

FIG. 5 is a schematic view of the inner surface of a heat sink;

FIG. 6 is a cross-sectional view taken along the line of FIGS. 5C-C;

FIG. 7 is a front view of the heat sink;

FIG. 8 is a schematic exterior representation of a heat sink;

wherein, 1-a radiator; 2, a main board; 3-pulling aid pin; 4-right pulling aid; 5-left pulling aid; 6-SSD repair cover plates; 7-a battery maintenance cover plate; 8-M2.5X 10 countersunk head screw; 9-M2.5X 6 countersunk head screw; 10-wedge shaped strips; 11-a battery; 12-SSD disk; 13-a front panel; 14-M2.5 × 8 combination screw; 15-reinforcing the bottom plate; 16-M2.5 × 12 countersunk head screw; 17-heat dissipation fins; 18-a gas flow channel; 19-a heat sink; 20-SSD disk maintenance window; 21-battery holder.

Detailed Description

The present invention will be described in detail below with reference to the accompanying drawings by way of examples.

The embodiment provides a heat dissipation device for a VPX Loongson motherboard, which is applied to a 6U VPX dual-way Loongson 3a3000 CPU motherboard, and as shown in fig. 1, fig. 2(a), fig. 2(b) and fig. 3, comprises a heat sink and a reinforcing bottom plate 15.

As shown in fig. 5 to 8, the heat sink 1 is an integral structure, that is, the front panel 13 of the heat sink 1 and the heat sink 1 are an integral structure, parallel heat dissipation fins 17 are arranged on the outer surface of the heat sink 1 along the horizontal direction, and vertical notches are arranged on the heat dissipation fins, the depth of the notch is consistent with the height of the heat dissipation fin 17, and the position of the notch on each heat dissipation fin 17 corresponds to that of the notch on the adjacent heat dissipation fin 17, so that an airflow channel 18 perpendicular to the plane where the heat dissipation fin 17 is located is formed by the notches; as shown in fig. 4, a battery fixing seat 21 and an SSD disk maintenance window 20 are reserved on the heat sink 1 according to the positions of the battery 11 and the SSD disk 12, maintenance panels are respectively installed outside the battery 11 and the SSD disk 12, and the SSD maintenance cover plate 6 and the battery maintenance cover plate 7 are respectively fixed at corresponding positions on the outer surface of the heat sink 1 by M2.5 × 6 countersunk head screws 9; both sides of the inner surface of the radiator 1 are fixedly connected with the wedge-shaped strips 10 through M2.5 multiplied by 10 countersunk screws 8 and are used for contacting with an external case for heat transfer, so that both sides of the inner surface of the radiator 1 can directly contact with a case heat dissipation shell through the wedge-shaped strips 10, thereby realizing conduction heat dissipation, avoiding the occurrence of the condition that the thermal resistance of the radiator 1 contacting with the case heat dissipation shell is relatively high during reverse installation, and further improving the conduction heat dissipation effect. The left pulling aid 5 and the right pulling aid 4 are respectively fixed on two sides of the front panel 13 through the pulling aid pin 3, so that the chip module can be conveniently plugged in and pulled out of the case.

The radiator 1 and the reinforcing bottom plate 15 clamp the main board 2 in and are fixed with the main board 2, two sides of the reinforcing bottom plate 15 are fixedly connected with the inner surface of the radiator 1 through M2.5 multiplied by 8 combined screws 14, and the middle raised part is fixedly connected with the inner surface of the radiator 1 through M2.5 multiplied by 12 countersunk head screws 16. The heating part of the main board 2 is contacted with the inner surface of the radiator 1 to radiate heat.

The heat generated by the two-way Loongson 3A3000 CPU mainboard can be timely conducted to the radiator 1, and then the radiator 1 consumes the heat to other heat sinks 19, so that the normal and stable work of the mainboard 2 can be guaranteed.

In summary, the above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (4)

1. A heat dissipation device for a VPX Loongson mainboard is characterized by comprising a heat radiator and a reinforcing bottom plate;

the radiator is of an integral structure, parallel radiating fins are arranged on the outer surface of the radiator along the horizontal direction, vertical notches are arranged on the radiating fins, the depth of each notch is consistent with the height of each radiating fin, and the position of each notch on each radiating fin corresponds to the position of the notch on each adjacent radiating fin, so that the notches on the adjacent radiating fins form an airflow channel perpendicular to the plane where the radiating fins are located; the two sides of the inner surface of the radiator are fixedly connected with wedge-shaped strips which are used for contacting with an external case for heat transfer;

the mainboard is clamped in the radiator and the reinforcing bottom plate and fixed with the mainboard together, and the heating part of the mainboard is in contact with the inner surface of the radiator to dissipate heat.

2. The heat dissipation device for the VPX Loongson main board as claimed in claim 1, wherein two sides of the inner surface of the heat sink are fixedly connected with the wedge-shaped strips through screws.

3. The heat dissipation device for the VPX Loongson main board as claimed in claim 1, wherein the heat sink and the reinforcing bottom plate are fixedly connected by screws.

4. The heat dissipation device for the VPX Loongson motherboard of claim 1, wherein a maintenance panel is mounted outside both the battery and the solid state disk on the heat sink.

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