CN213880683U - Heat dissipation assembly and case - Google Patents
Heat dissipation assembly and case Download PDFInfo
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- CN213880683U CN213880683U CN202022524265.5U CN202022524265U CN213880683U CN 213880683 U CN213880683 U CN 213880683U CN 202022524265 U CN202022524265 U CN 202022524265U CN 213880683 U CN213880683 U CN 213880683U
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 34
- 239000000758 substrate Substances 0.000 claims description 9
- 210000001503 joint Anatomy 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000003032 molecular docking Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides a radiator unit and quick-witted case, wherein, radiator unit includes: the heat dissipation device comprises a heat dissipation piece, a heat conduction plate, a heat conduction pipe and a first pressing plate; the heat conducting plate is used for absorbing heat generated by a heat source; a first heat conducting groove is formed in one surface of the heat conducting plate, one end of the heat conducting pipe is located in the first heat conducting groove, the first pressing plate is detachably and fixedly connected with the heat conducting plate, and the first pressing plate is used for pressing one end of the heat conducting pipe to be in contact with the heat conducting plate; the other end of the heat conduction pipe is connected with the heat dissipation piece; the heat dissipation piece is used for dissipating heat on the heat conduction plate through the heat conduction pipe. The utility model discloses can improve the radiating efficiency of radiating piece.
Description
Technical Field
The utility model relates to an electronic equipment technical field especially relates to a radiator unit and quick-witted case.
Background
With the rapid development of science and technology, electronic devices are widely used in various industries. Because some electronic devices have high requirements on waterproof and dustproof grades and have extremely high requirements on the tightness of the electronic devices, the waterproof and dustproof protection grade is generally IP 65.
In this way, fins are generally disposed on the chassis of the electronic device to dissipate heat of devices inside the chassis. However, the existing method for installing the fins is simple, and the fins are only fixed on the case, so that the heat dissipation efficiency of the fins is greatly reduced.
SUMMERY OF THE UTILITY MODEL
In order to solve the above problem, the utility model provides a radiator unit and quick-witted case can improve the conduction efficiency on the produced heat conduction of heat source to the heat-dissipating piece through setting up heat pipe and heat-conducting plate, and then can improve the radiating efficiency of heat-dissipating piece to the heat source.
In a first aspect, the present invention provides a heat dissipation assembly, including: the heat dissipation device comprises a heat dissipation piece, a heat conduction plate, a heat conduction pipe and a first pressing plate;
the heat conducting plate is used for absorbing heat generated by a heat source;
a first heat conducting groove is formed in one surface of the heat conducting plate, one end of the heat conducting pipe is located in the first heat conducting groove, the first pressing plate is detachably and fixedly connected with the heat conducting plate, and the first pressing plate is used for pressing one end of the heat conducting pipe to be in contact with the heat conducting plate;
the other end of the heat conduction pipe is connected with the heat dissipation piece;
the heat dissipation piece is used for dissipating heat on the heat conduction plate through the heat conduction pipe.
Optionally, a plurality of bumps are fixedly arranged on one surface of the heat conducting plate;
the plurality of bumps are for making contact with a plurality of heat sources.
Optionally, a heat conducting pad is arranged in the first heat conducting groove;
the heat conduction pad is located between the first pressure plate and the heat conduction pipe.
Optionally, the heat sink comprises: a plurality of fins and a base plate;
the fins are fixedly connected with the base plate, a second heat conduction groove is formed in one surface of the base plate, and the other end of the heat conduction pipe is connected with the base plate through the second heat conduction groove.
Optionally, the fins are arranged on one surface of the substrate along the up-down direction;
the fins are provided with grooves along the vertical direction.
Optionally, the heat dissipation assembly further comprises: a second platen;
the second pressing plate is detachably and fixedly connected with the substrate, and the second pressing plate is used for fixing the other end of the heat conduction pipe between the second pressing plate and the substrate.
Optionally, a pressing groove is formed in one surface, facing the second heat conduction groove, of the second pressing plate;
when the second pressing plate fixes the heat conduction pipe, the cross section of a cavity formed by the pressing groove and the second heat conduction groove is matched with the cross section of the other end of the heat conduction pipe.
In a second aspect, the present invention provides a computer case, including: the box body and the heat dissipation assembly are arranged;
the heat-conducting plate, the heat-conducting pipe and the first pressing plate are all located in the box body, and the fins are fixedly arranged on the outer side of the box body.
Optionally, the box includes: the bottom plate, the top cover, the front panel, the rear panel and the two side plates;
the front panel, the rear panel and the two side plates are fixedly connected in a surrounding manner to form the side wall of the box body, and the two side plates are oppositely arranged;
the top cover and the bottom plate are respectively and fixedly arranged on the upper side and the lower side of the side wall, so that the box body is a closed shell;
wherein, a butt joint port is opened on one side board, the heat dissipation piece is fixed in the position of butt joint port.
Optionally, a side plate far away from the heat dissipation member is provided with a vent hole.
The embodiment of the utility model provides a radiator unit and quick-witted case can make the heat that the heat source produced pass through on heat-conducting plate and the rapid transmission of heat pipe to the radiating piece, can improve the conduction efficiency on the heat conduction to the radiating piece that the heat source produced promptly through setting up heat pipe and heat-conducting plate, and then can improve the radiating efficiency of radiating piece to the heat source. And set up the clamp plate and can guarantee the good contact of heat pipe and heat-conducting plate, and then guaranteed the good heat conduction efficiency of heat pipe and heat-conducting plate.
Drawings
Fig. 1 is a cross-sectional view of a heat dissipation assembly according to an embodiment of the present application in a state of being engaged with a motherboard;
fig. 2 is an internal structural view of a chassis according to an embodiment of the present application;
FIG. 3 is a block diagram of a thermal plate according to one embodiment of the present application;
fig. 4 is a cross-sectional view of a portion of a chassis embodying a mating relationship of heat pipes and heat dissipation elements according to an embodiment of the present application;
FIG. 5 is a structural diagram of a heat pipe according to an embodiment of the present application;
FIG. 6 is a block diagram of a second platen according to an embodiment of the present application;
FIG. 7 is a schematic view of the case of the present application with the top removed;
FIG. 8 is a block diagram of a chassis according to an embodiment of the present application;
fig. 9 is a structural diagram of a motherboard according to an embodiment of the present application.
Reference numerals
1. A heat dissipating component; 11. a heat conducting plate; 111. a first heat conduction groove; 112. a bump; 113. a support stud; 114. avoiding the mouth; 12. a heat sink; 121. a fin; 1211. grooving; 122. a substrate; 1221. a second heat conduction groove; 13. a heat conducting pipe; 14. a first platen; 15. a second platen; 151. pressing a groove; 16. a thermally conductive pad; 2. a box body; 21. a base plate; 22. a top cover; 23. a front panel; 231. mounting holes; 232. an indicator hole; 24. a rear panel; 241. an opening; 25. a side plate; 251. a butt joint port; 252. a vent hole; 3. an interface module; 4. a main board; 41. a core chip; 42. an auxiliary chip; 5. a power supply module; 6. a shield case; 61. And (4) heat dissipation holes.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In a first aspect, the present invention provides a heat dissipation assembly 1, with reference to fig. 1 and 2, the heat dissipation assembly 1 includes: heat sink 12, heat conducting plate 11, heat conducting pipe 13, first platen 14, and second platen 15.
Wherein, the heat conducting plate 11 is used for absorbing the heat generated by the heat source; the upper surface of the heat conducting plate 11 is provided with a first heat conducting groove 111, the first heat conducting groove 111 is matched with the bottom of one end of the heat conducting pipe 13, the bottom of one end of the heat conducting pipe 13 is located in the first heat conducting groove 111, the first pressing plate 14 is detachably and fixedly connected with the heat conducting plate 11 through a screw, and the first pressing plate 14 is used for pressing the side surface of one end of the heat conducting pipe 13 to be in contact with the heat conducting plate 11; the heat sink 12 is used for dissipating heat on the heat conducting plate 11 through the heat conducting pipe 13.
In the present embodiment, a heat conduction pad 16 is disposed in the first heat conduction groove 111; the thermal pad 16 is located between the first presser plate 14 and the heat conductive pipe 13. The force of the pressing of the first pressing plate 14 on the heat conduction pipe 13 can be increased by providing the heat conduction pad 16, so that the stability of the heat conduction pipe 13 in the first heat conduction groove 111 can be improved, and the side wall of the bottom of the heat conduction pipe 13 can be fully contacted with the heat conduction plate 11.
In the present embodiment, referring to fig. 4 and 8, the heat sink 12 is a heat sink, and the heat sink 12 includes: a plurality of fins 121 and a base plate 122. The fins 121 are integrally formed and fixedly connected with the base plate 122; the fins 121 are arranged on one surface of the substrate 122 in the vertical direction, and the fins 121 are provided with the grooves 1211 in the vertical direction, so that the direction of the fins 121 and the grooves 1211 is limited, thereby facilitating natural convection of air and further facilitating dissipation of heat of the fins 121; the surface of the substrate 122 away from the fins 121 is provided with a second heat conduction groove 1221, and the other end of the heat conduction pipe 13 is connected to the substrate 122 through the second heat conduction groove 1221. The second pressing plate 15 is located on one side of the base plate 122 far away from the fins 121, the second pressing plate 15 is detachably and fixedly connected with the base plate 122 through screws, and the second pressing plate 15 is used for fixing the other end of the heat conducting pipe 13 between the second pressing plate 15 and the base plate 122. Further, with reference to fig. 4 and fig. 6, a pressing groove 151 is formed on a surface of the second pressing plate 15 facing the second heat-conducting groove 1221; when the second pressing plate 15 fixes the heat conducting pipe 13, the cross section of the cavity formed by the pressing groove 151 and the second heat conducting groove 1221 is matched with the cross section of the other end of the heat conducting pipe 13.
In the present embodiment, reference to "one end" and "the other end" means both ends of the object in the length direction, not two different ends of the object.
Further, the shape of the heat conductive pipe 13 includes: an L-shape, a U-shape, or a combination thereof. In this embodiment, referring to fig. 2 and 5, the shape of the heat conductive pipes 13 is L-shaped, and the number of the heat conductive pipes 13 is two. One end of each of the two heat pipes 13 is horizontally inserted into the corresponding first heat-conducting groove 111, and is fixed by the first pressing plate 14; referring to fig. 2 and 4, the other ends of the two heat conductive pipes 13 are also horizontally inserted into the second heat conductive groove 1221 and fixed by the second presser plate 15, while the two heat conductive pipes 13 are inserted into the second heat conductive groove 1221 in opposite directions.
Further, in conjunction with fig. 3, the lower surface of the heat conducting plate 11 is provided with a plurality of bumps 112; the plurality of bumps 112 are adapted to be in contact with a plurality of heat sources. In the present embodiment, the plurality of bumps 112 are integrally and fixedly connected with the heat conducting plate 11, and the relative heights of the plurality of bumps 112 are not completely the same, so that the heat conducting plate 11 can be contacted with a plurality of heat sources with different heights through the plurality of bumps 112.
In a second aspect, the present invention provides a case, which is an industrial network machine in this embodiment, with reference to fig. 2. This machine case includes: a case 2 and the heat dissipating module 1 as described above. The heat conducting plate 11, the heat conducting pipe 13 and the first pressing plate 14 are all located in the box body 2, and the fins 121 are fixedly arranged on the outer side of the box body 2.
Further, the size of the box body 2 is 1U. Referring to fig. 7 and 8, the case 2 includes: a bottom panel 21, a top cover 22, a front panel 23, a back panel 24 and two side panels 25. The front panel 23, the rear panel 24 and the two side panels 25 are fixedly connected in a surrounding manner to form a side wall of the box body 2, and the two side panels 25 are oppositely arranged; the top cover 22 and the bottom plate 21 are respectively and fixedly arranged at the upper side and the lower side of the side wall, so that the box body 2 is a closed shell.
Wherein, the left and right ends of the front panel 23 extend outwards respectively to form extension parts; the two extending parts are respectively provided with a mounting hole 231 for fixing the box body 2 on the machine cabinet; the front panel 23 is also fixedly provided with an indicating hole 232 for installing an indicating lamp to mark a working body of a device in the box body 2; a plurality of interface modules 3 are fixedly arranged in the box body 2; the rear panel 24 is provided with a plurality of openings 241, and the plurality of interface modules 3 are respectively located at the corresponding openings 241; the side plate 25 is provided with an interface 251, and the heat sink 12 is fixed at the position of the interface 251. Specifically, the docking port 251 is provided on the side plate 25 on the right side; the base plate 122 is fixedly disposed outside the right side plate 25, and the heat transfer pipe 13 is in contact with the base plate 122 through the docking port 251. By arranging the heat sink 12 at one side of the case 2, the case can be adapted to a cabinet having a small width.
In this embodiment, with reference to fig. 2 and 3, a main board 4 is further disposed in the box body 2. The main board 4 is located below the heat conducting plate 11, and the main board 4 is detachably and fixedly connected with the bottom plate 21 through screws and studs, with reference to fig. 9, the heat source includes: a core chip 41(CPU) and three sets of auxiliary chips 42 fixed on the upper surface of the main board 4. Four corners of the lower surface of the heat conducting plate 11 are fixedly provided with a supporting stud 113, and the heat conducting plate 11 passes through the supporting stud 113 and a screw and the mainboard 4 can be detached and fixedly connected. An avoiding opening 114 is formed in the side of the heat conducting plate 11, so that a device with a higher height and without heat dissipation on the mainboard 4 can be avoided.
With reference to fig. 2 and 7, a power module 5 is further disposed in the box body 2, the power module 5 is located on one side of the main board 4 away from the heat dissipation member 12, and the power module 5 is fixedly connected to the bottom plate 21. The peripheral week side of power module 5 is fixed and is provided with shield 6, shield 6 not only can play safety protection's effect to power module 5, can also reduce external electromagnetic interference to power module 5 simultaneously. The surface of the shielding case 6 is provided with a heat radiation hole 61 for radiating the power module 5. A ventilation hole 252 is formed in the side plate 25 away from the heat sink 12. The arrangement of the vent holes 252 enables the outside and the inside of the box body 2 to exchange heat by natural convection, so that the temperature of devices in the box body 2 can be further reduced.
The 1U case is compact in internal structure, the reliability of the whole machine is improved by fanless heat dissipation, and the application environment of the case can be widened, so that the case can adapt to more industrial environments.
The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention should be covered by the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A heat sink assembly, comprising: the heat dissipation device comprises a heat dissipation piece, a heat conduction plate, a heat conduction pipe and a first pressing plate;
the heat conducting plate is used for absorbing heat generated by a heat source;
a first heat conducting groove is formed in one surface of the heat conducting plate, one end of the heat conducting pipe is located in the first heat conducting groove, the first pressing plate is detachably and fixedly connected with the heat conducting plate, and the first pressing plate is used for pressing one end of the heat conducting pipe to be in contact with the heat conducting plate;
the other end of the heat conduction pipe is connected with the heat dissipation piece;
the heat dissipation piece is used for dissipating heat on the heat conduction plate through the heat conduction pipe.
2. The heat dissipating assembly of claim 1, wherein the heat conducting plate has a surface fixedly provided with a plurality of protrusions;
the plurality of bumps are for making contact with a plurality of heat sources.
3. The heat dissipation assembly of claim 1, wherein a thermal pad is disposed within the first thermal channel;
the heat conduction pad is located between the first pressure plate and the heat conduction pipe.
4. The heat dissipation assembly of claim 1, wherein the heat dissipation member comprises: a plurality of fins and a base plate;
the fins are fixedly connected with the base plate, a second heat conduction groove is formed in one surface of the base plate, and the other end of the heat conduction pipe is connected with the base plate through the second heat conduction groove.
5. The heat dissipating assembly of claim 4, wherein the plurality of fins are arranged on a surface of the base plate in an up-down direction;
the fins are provided with grooves along the vertical direction.
6. The heat dissipation assembly of claim 4, further comprising: a second platen;
the second pressing plate is detachably and fixedly connected with the substrate, and the second pressing plate is used for fixing the other end of the heat conduction pipe between the second pressing plate and the substrate.
7. The heat dissipation assembly of claim 6, wherein a surface of the second pressure plate facing the second heat conduction groove is provided with a pressure groove;
when the second pressing plate fixes the heat conduction pipe, the cross section of a cavity formed by the pressing groove and the second heat conduction groove is matched with the cross section of the other end of the heat conduction pipe.
8. A chassis, comprising: a case and the heat dissipating assembly of any one of claims 4 to 7;
the heat-conducting plate, the heat-conducting pipe and the first pressing plate are all located in the box body, and the fins are fixedly arranged on the outer side of the box body.
9. A cabinet according to claim 8, wherein the cabinet includes: the bottom plate, the top cover, the front panel, the rear panel and the two side plates;
the front panel, the rear panel and the two side plates are fixedly connected in a surrounding manner to form the side wall of the box body, and the two side plates are oppositely arranged;
the top cover and the bottom plate are respectively and fixedly arranged on the upper side and the lower side of the side wall, so that the box body is a closed shell;
wherein, a butt joint port is opened on one side board, the heat dissipation piece is fixed in the position of butt joint port.
10. A chassis according to claim 9, wherein a side plate remote from the heat sink is vented.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022524265.5U CN213880683U (en) | 2020-11-04 | 2020-11-04 | Heat dissipation assembly and case |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022524265.5U CN213880683U (en) | 2020-11-04 | 2020-11-04 | Heat dissipation assembly and case |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213880683U true CN213880683U (en) | 2021-08-03 |
Family
ID=77052437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022524265.5U Active CN213880683U (en) | 2020-11-04 | 2020-11-04 | Heat dissipation assembly and case |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213880683U (en) |
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2020
- 2020-11-04 CN CN202022524265.5U patent/CN213880683U/en active Active
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| GR01 | Patent grant | ||
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Effective date of registration: 20240830 Address after: 518057 B1, 20/F, Yanxiang Science and Technology Building, No. 31, High-tech Fourth Road, Maling Community, Yuehai Street, Nanshan District, Shenzhen, Guangdong Province Patentee after: EVOC hi-tech Holdings Group Ltd. Country or region after: China Address before: 541004 third floor, building 8, information incubation building, No. D-12, information industry park, Qixing District, Guilin City, Guangxi Zhuang Autonomous Region Patentee before: Guilin Yanxiang industrial Internet Technology Research Institute Co.,Ltd. Country or region before: China |