TWM594853U - Heat dissipation apparatus - Google Patents

Abstract

This creation relates to a heat dissipation device. The base of the base body has a splint extending outward, and a docking part and at least two sets of heat sinks are provided in sequence on the other side of the splint, and a preset is provided between the two sets of heat sinks. The fan is assembled and positioned in the accommodating groove, and the two sets of fins are adjacent to the side of the accommodating groove to form a plurality of inclined wind guide surfaces, and the angle between the two left and right opposite wind guide surfaces extends between 76 Between °~78°, a cover plate is combined on the clamping plate, and a clamping space for placing the preset memory module is formed between the cover plate and the clamping plate, and one side of the cover plate is provided with a docking portion The joint part can make the accommodating groove for the fan installed through this included angle, which is more in line with the appearance of the fan, so as to reduce the waste of the use space, and when the fan is blowing, the inclined plurality of wind guide surfaces can be used To effectively guide the hot air to the outside, and then improve the heat dissipation effect by the angle between 76°~78°.

Description

Radiator

This creation provides a heat dissipation device, in particular, the accommodating groove opened between two sets of fins of the base body is combined with a fan, and the two sets of fins are adjacent to the side of the accommodating groove to form a plurality of inclined wind guide surfaces. Moreover, the angle between the multiple air guide surfaces is between 76°~78°, so that this angle can be used to reduce the waste of space used, and the hot air can be effectively led to the outside to improve the heat dissipation effect.

According to the press, computer technology is growing at an ever-increasing speed, and the development trend of computers is moving towards the direction of strong computing function and fast speed. With the development of computer-related applications, high-speed and high-frequency development will also directly lead to electronic components inside the computer host. And memory modules generate a lot of heat, but in terms of memory module access bandwidth, from the early bandwidth of 800MB/s to the current DDR 500 bandwidth has reached 4.0GB/s, or even more The channel platform can greatly increase the bandwidth by more than twice, so that whether it is working clock or transmission bandwidth, it is obviously to cooperate with the central processor on the motherboard to maintain high-speed computing.

Furthermore, the high-speed computer processing will inevitably cause the temperature of the memory module to rise sharply, which not only affects the overall performance and reduces the stability of the system, but also the heat will be accumulated on the memory chip. As a result, poor heat dissipation of the memory module, or failure of the function caused by overheating or burning, therefore, how to effectively solve the problem of temperature rise of the memory module is the key point that manufacturers must face and solve.

Therefore, some manufacturers hold a heat sink on both sides of the memory module, which can quickly and evenly transfer the heat generated by the operation of the memory chip to the surface of the heat sink. However, at present, only the heat sink is used to perform The heat dissipation is gradually insufficient, so the industry will directly install a fan on the top surface of the second heat sink to use the fan's air extraction to assist the heat dissipation operation.

However, installing a fan directly on the top surface of the second heat sink will increase the overall height, so that it occupies the space inside the chassis, and the heat energy cannot be effectively removed by the exhaust method, resulting in the memory chip temperature cannot be reliably reduced. Therefore, by directly installing a fan on the top surface of the second heat sink, the heat dissipation effect is limited, and many inconveniences are generated.

Therefore, how to solve the above-mentioned lack of inconvenience and inconvenience is the urgent direction for related companies to study and improve.

Therefore, in view of the above-mentioned deficiencies, the creators collected relevant materials and, after evaluation and consideration from various parties, began to design new patents for such heat dissipation devices.

The main purpose of this creation is that the base of the base body has a splint extending outward, and a docking portion and at least two sets of heat sinks are provided in sequence on the other side of the splint, and a preset wind is provided between the two sets of heat sinks The accommodating grooves are assembled and positioned, and the two sets of fins are adjacent to the side surfaces of the accommodating grooves. A plurality of inclined wind guide surfaces are formed, and the angle between the two opposite wind guide surfaces is between 76 and 76. Between °~78°, a cover plate is combined on the clamping plate, and a clamping space for placing the preset memory module is formed between the cover plate and the clamping plate, and one side of the cover plate is provided with a docking portion The joint part has an angle between 76°~78° due to the left and right opposite wind guide surfaces, so the angle can make the accommodating groove for the fan to fit, which is more in line with the appearance of the fan Type to reduce the waste of use space, and when the fan is blowing, you can use the inclined plurality of wind guide surfaces In order to effectively guide the hot air to the outside, the heat dissipation can be improved by the angle between 76° and 78°.

1: seat body

11: base

12: splint

13: Docking Department

131: Keyhole

14: Heat sink

140: channel

141: Grooving

142: Wind guide surface

15: accommodating slot

151: Joint hole

2: Cover

20: clamping space

21: Joint

211: Piercing

22: fixed element

3: Memory module

31: Memory chip

32: Dock

4: Fan

41: Base

411: through hole

42: Locking element

5: slot

[Picture 1] It is a three-dimensional appearance drawing of this creation.

[Figure 2] is a three-dimensional exploded view of this creation.

[Picture 3] This is a side cross-sectional view of this creative assembly.

[Figure 4] This is a side cross-sectional view of this creation after assembly.

[Figure 5] is a perspective view of the preferred embodiment of the creation.

[Figure 6] is a perspective view of another preferred embodiment of the creation.

[Figure 7] This is the view before this creation.

In order to achieve the above-mentioned purposes and effects, the technical means and structure adopted in this creation, the following drawings describe in detail the preferred embodiments of this creation. Its features and functions are as follows, and Poli fully understands it.

Please refer to Figures 1, 2, 3, 4, 5, 6, and 7 for a three-dimensional appearance drawing, three-dimensional exploded view, side sectional view during assembly, side sectional view after assembly, comparison The three-dimensional appearance view of the preferred embodiment, the three-dimensional appearance view and the front view of another preferred embodiment, as can be clearly seen from the figure, this creation includes a base 1 and a cover 2, so the main components and features of this case The details are as follows, in which:

The base 1 has a base portion 11 with a clamping plate 12 extending outward from one side of the base portion 11, and a docking portion 13 and at least two sets of standing-up shapes are provided on the other side of the clamping plate 12 in sequence The fins 14 are provided with recessed accommodating slots 15 between the two groups of fins 14; in addition, a plurality of lock holes 131 are provided on one side of the docking portion 13; in addition, the plurality of fins 14 can be the same height Or different heights in the form of a gradual drop, and a channel 140 for guiding the circulation of cold air is formed laterally between two adjacent fins 14 and the same or different pitches are longitudinally cut on the surface of the fins 14 A plurality of cross-sectional grooves 141, and two sets of fins 14 adjacent to the side of the accommodating groove 15 are formed with inclined plural wind guide surfaces 142, and the angle θ between the left and right opposite wind guide surfaces 142 extends between Between 76°~78°, and the best is 77.32°; furthermore, the bottom of the accommodating groove 15 is provided with an engaging hole 151.

The cover plate 2 is coupled to the seat body 1 to align the position of the clamping plate 12, and a clamping space 20 is formed between the cover plate 2 and the clamping plate 12, and one side of the cover plate 2 is provided with a joint corresponding to the docking portion 13 The portion 21 is provided with a plurality of through holes 211 on one side surface of the joint portion 21, and a fixing element 22 that can be locked in the locking hole 131 and integrated into one body is inserted through the through hole 211.

When this book is created for assembly, the memory module 3 can be accommodated in the clamping space 20 formed between the clamping plate 12 of the base 1 and the cover plate 2 and the joint 21 of the cover plate 2 can be used to The butting portion 13 on the base 1 is in a corresponding butt joint, and at the same time, the plurality of memory chips 31 at the two side surfaces of the memory module 3 are clamped by the clamping force to abut against the inner wall surface of the clamping space 20 A positioning (as shown in Figure 5), and the inner wall surface of the clamping plate 12 and the cover plate 2 may be coated with a heat dissipation paste to fill the small gap generated between the surface of the memory module 3, or may be further attached Covered with thermally conductive film, the memory chip 31 is firmly adhered to the inner wall surface of the clamping plate 12 and the cover plate 2, and then the fixing element 22 is sequentially passed through the perforation 211 on the joint portion 21 and the keyhole corresponding to the butting portion 13 131 The internal locking connection is fixed into one, it can be completed Assembly of this creation.

The above-mentioned seat body 1 and the cover plate 2 can be made of copper, aluminum or graphite materials, respectively, and the butt portion 13 on the seat body 1 and the joint portion 21 of the cover plate 2 are provided on the abutment surface to correspond The concave and convex parts or dovetail seats and dovetail grooves are combined and locked together by locking and fixing methods. However, in actual application, it is not limited to this, and it can also be fitted and clamped by snaps For positioning or gluing, it only needs to provide the seat body 1 and the cover plate 2 to be in a separate configuration state. In addition to convenient assembly, alignment, and disassembly, it can also match the thickness of the memory module 3 of different specifications of different brands. Replace it, which can effectively solve the problem that the memory chip 31 on the memory module 3 cannot be completely attached to the inner wall surface of the seat body 1 and the cover plate 2 due to the different thickness, resulting in a slight gap, reduced contact area, and heat dissipation The effect is poor, and at the same time, it can prevent the memory module 3 from easily sliding out and detaching from the opening or gap of the clamping space 20, so as to achieve the effect of repeated replacement and use. The simple modifications and equivalent structural changes should be included in the scope of the patent of this creation in the same way, and be given to Chen Ming.

In actual use, the plug portion 32 on one side of the memory module 3 can be plugged into the slot 5 on the computer motherboard (as shown in Figure 6), and then the two sides of the slot 5 can be used The buckle is fastened in the missing grooves on the two sides of the memory module 3, and the heat generated by the plurality of memory chips 31 during operation is quickly and evenly transferred to the base plate 1 and the clamping plate 12 On the surface of the cover plate 2, in this way, at least one set of plural heat sinks 14 can be increased through the base 11 on the other side of the clamping plate 12 to increase its overall heat dissipation area, and when cold air flows through the plural channels 140 and the slits between the plural heat sinks 14 At 141 hours, the heat accumulated on the surfaces of the base 1 and the cover plate 2 can be quickly dissipated to the periphery, which is used to assist the memory chip 31 to perform larger Area cold air heat exchange action, thereby improving the overall heat dissipation efficiency.

In addition, the above is only the preferred embodiment of this creation, and it is not to limit the scope of the patent of this creation. The creative base 1 is a base 11 that integrally forms a clamping plate 12 and a plurality of heat sinks 14 by drawing, so that After drawing, the surface is relatively flat, and the cross-sectional dimensions remain consistent, thereby increasing dimensional accuracy, manufacturing quality and yield.

In addition, the original heat dissipation device can be increased according to the position of the heat source (such as the memory module 3, the control chip on the circuit board or the central processor, etc.), and the number of heat dissipation fins 14 in the base 1 The accommodating groove 15 can be assembled and replaced according to the overall heat dissipation situation (as shown in FIG. 6), and the plurality of heat sinks 14 can be the same height or different heights and have a gradual drop, that is The locking element 42 can be passed through the through hole 411 on the base 41 of the fan 4 and then locked into at least one engaging hole 151 corresponding to the bottom of the accommodating groove 15, so that the fan 4 is locked and fixed to the base 1 Integral, the fan 4 can also be combined with the seat body 1 by means of snap-fit positioning, and this structural design is not only simple in structure, easy to assemble and disassemble, but also makes the fan 4 less susceptible to external forces when running or Due to the deviation, sway, etc. caused by its own rotation, the external cold air can be sucked into the hottest area of the base body 1 by the fan 4 for heat exchange, and then along the channel formed between the adjacent radiating fins 14 140, and the slit 141 is quickly led out in a specific direction outside, thereby assisting the memory chip 31 to cool and cool the air by convection and heat dissipation, and not to cause excessive load on the fan 4 due to disturbance and turbulence to ensure stability and stability during operation. Reliability, at the same time, it can avoid the problems related to overheating and disturbance of abnormal sound, and has good convection cooling and heat dissipation effects. Therefore, all forms that can achieve the aforementioned effects should be covered by this creation. This simple modification and its equivalent Structural changes should be included in the scope of this creative patent for the same reason, and be given to Chen Ming.

Furthermore, the two groups of fins 14 adjacent to the side of the accommodating groove 15 are formed with inclined plural wind guide surfaces 142, and the angle θ between the left and right opposite wind guide surfaces 142 extends between At 76°~78. Therefore, the angle θ can make the accommodating slot 15 for the fan 4 installed, which is more in line with the appearance of the fan 4 to facilitate the installation of the fan 4 and reduce the waste of use space, and when the fan 4 blows air , The inclined complex wind guide surface 142 can be used to effectively guide the hot air to the outside, and the heat dissipation effect can be improved by the angle θ between 76° and 78°.

The above is only the preferred embodiment of this creation, and it does not limit the scope of the patent of this creation. Therefore, any simple modification and equivalent structural changes caused by the use of this creation description and the content of the drawings should be included in the same reason. Within the scope of this patent, Chen Ming.

To sum up, when the heat dissipation device of this creation is used, it can really achieve its efficacy and purpose, so this creation is a creation with excellent practicability. In order to meet the requirements for the application of new patents, I file an application in accordance with the law and look forward to review The committee will grant this case as soon as possible to protect the creator's hard work. If the Jury Examination Committee has any doubts, please send me a letter and give instructions. The creator will try his best to cooperate and feel virtuous.

1: seat body

11: base

12: splint

14: Heat sink

140: channel

141: Grooving

142: Wind guide surface

15: accommodating slot

151: Joint hole

2: Cover

20: clamping space

21: Joint

Claims (8)

A heat dissipation device includes a seat body and a cover plate, wherein: The seat body has a base, and a clamping plate extends outward from one side of the base, and the other side of the clamping plate is provided with a docking portion and at least two sets of fins in sequence, and a preset fan assembly position is provided between the two sets of fins The two sets of fins are adjacent to the side of the containing groove. A plurality of inclined wind guide surfaces are formed, and the angle between the left and right opposite wind guide surfaces extends from 76° to 78 Between The cover plate is combined with the seat body to align the position of the clamping plate, and a clamping space for inserting the preset memory module is formed between the cover plate and the clamping plate, and a joint portion for docking with the docking portion is provided on one side of the cover plate . The heat dissipation device as described in item 1 of the patent application scope, wherein the docking part on the seat body and the joint part of the cover plate are respectively provided with a docking surface, and the docking surface is provided with a concave that is corresponding to the joint, Convex part or dovetail seat, dovetail groove. The heat dissipation device as described in item 1 of the patent application scope, wherein the docking portion of the seat body and the joint portion of the cover plate are respectively provided with docking surfaces, and the two docking surfaces are provided with a plurality of corresponding locking holes and The perforation is provided with a fixing element which can be locked in the keyhole and locked and fixed. The heat dissipation device as described in item 1 of the patent application scope, wherein the bottom of the accommodating groove on the seat body is provided with one or more joint holes, and the fan has a base that is integrated in the accommodating groove and is provided on the base There is a through hole, and a locking element that can be locked into the engagement hole and fixed correspondingly is inserted through the through hole. The heat dissipation device as described in item 1 of the patent application scope, in which the second on the seat body A channel for guiding the circulation of cold air is formed laterally between adjacent radiating fins, and a plurality of sectional grooves with the same or different spacing sizes are longitudinally cut on the radiating fins. The heat dissipation device as described in item 1 of the patent application range, wherein the plurality of heat sinks on the seat body may be of the same height or different heights and exhibit a gradual drop shape. As in the heat dissipation device described in item 1 of the patent scope, the base and the cover plate can be made of copper, aluminum or graphite, respectively. The heat dissipation device as described in item 1 of the scope of the patent application, wherein the angle between the left and right opposing wind guide surfaces is preferably 77.32°.

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