TWM602222U - Heat dissipation apparatus - Google Patents

Abstract

This creation is related to a heat dissipation device, which includes a base and a heat sink. The base is formed with a storage space for preset electronic components, and one side of the storage space is provided with a storage space for preset electronic components. A second opening is formed at the other side of the accommodating space for the mating part of the preset electronic component to pass through, and the accommodating space is provided with button holes on the opposite side walls of the accommodating space. The two opposite side walls of the heat sink are respectively provided with buckle pieces for buckling into the buckle holes, and the other side of the heat radiator piece relative to the two buckles is formed with a heat dissipation surface for pressing against and pasting on the heat source of the preset electronic component, Because the heat sink is buckled and positioned in the two buckle holes of the base through the two buckles, the convenience of assembly can be improved.

Description

Heat sink

This creation provides a heat sink, especially the heat sink uses two clasps to press into the second clasp holes of the base, so as to improve the convenience of the overall assembly.

According to, the M.2 specification is a new standard specification tailored for solid state drives (SSD) by a number of electronics companies. It can support both SATA and PCIe interfaces, and the M.2 specification is lightweight, Thin, short, small, power saving and fast transmission speed, and the standard design of different sizes can make the solid state drive application more flexible. Therefore, most of the current electronic devices are equipped with M.2 type connectors. , For the SSD card (Solid State Drive Expansion Card) to plug in, so that the data access method of the electronic device evolves from the traditional hard disk to the smaller and faster solid state drive.

In addition, the current trend of computer development is to move towards powerful computing functions and fast speeds, making the design of solid-state hard disks more and more sophisticated, and the processing speed of execution and operation is getting faster and faster. It is easy to generate heat and generate a heat source. Under high-speed operation, the temperature of the heat source generated by the solid state drive will continue to rise and affect its performance. What is more, it will cause the performance of the solid state drive to fail.

However, in order to solve the shortcoming of the performance failure of the solid state drive due to high temperature, some industry has developed a chip that is wrapped on the solid state drive to assist the heat dissipation of the solid state drive. Since the current M.2 standard solid state drives on the market are plate-shaped, the heat sink that covers the outside also needs to be plate-shaped with the solid state drive, and is fixed to the plate by screw locking. On the solid state hard disk, in order to achieve the effect of assisting the solid state hard disk for heat dissipation.

However, under the current demand for modularized mass production and processing efficiency, the cumbersome manual assembly procedure of screws will seriously affect the progress of the manufacturer’s shipment, and the screws are easy to lose during the process of locking. The size error of the screw causes difficulty in assembly and alignment, which not only consumes man-hours and inconvenience, but also increases the overall production cost and causes losses to the industry. Therefore, how to design a heat sink that can be easily assembled on a solid state drive The above, and the formation of a definitely positioned assembly structure after the combination is the direction that those engaged in this industry are eager to study and improve.

Therefore, in view of the above-mentioned deficiencies, the creators collected relevant information and, after multiple evaluations and considerations, designed the patented new type of heat sink.

The main purpose of this creation is to form an accommodating space for preset electronic components inside the base, and a first opening for the preset electronic components to be placed on one side of the accommodating space, and the accommodating space is relatively A second opening is formed on the other side of the first opening for the mating portion of the preset electronic component to pass through, and then the accommodating space is provided with a button hole on the opposite two sidewall surfaces, and the heat sink is convex on the opposite two sidewall surfaces. It is provided with a buckle for buckling into the buckle hole, and the other side of the heat sink relative to the two buckles is formed with a heat dissipation surface for pressing and sticking to the heat source of the preset electronic component, because the heat sink is through the two buckles The buckle is positioned in the second buckle hole of the base to achieve the purpose of improving the convenience of assembly.

The secondary purpose of this creation is that the two fins of the heat sink penetrate into the base The second buckle hole presents a buckle positioning, which can reduce the accommodating space of the base through the structural design of penetration. The wall surface at the second buckle hole is exposed to the thickness of the two buckles, thereby effectively reducing the overall upper and lower sides The height of this product can reduce the overall volume, so as to meet the needs of light, thin, short and small electronic products.

Another purpose of this creation is to assemble the two buckles of the heat sink into the two buckle holes of the base. Each of the buckles can be guided by the guiding surface to improve the smoothness of the assembly to make heat dissipation. The second buckle piece can be easily assembled in the second buckle hole of the base, so as to improve the convenience of assembly.

1: base

10: Housing space

101: first opening

102: second opening

11: Buttonhole

12: Stopper

2: heat sink

21: Clasp

211: Guiding Surface

22: cooling surface

23: cooling channel

231: Convex Rib

232: Diversion fluid

24: Groove

25: groove

26: cooling fins

3: electronic components

31: Thermal film

[Figure 1] is a three-dimensional external view of the first embodiment of this creation.

[Figure 2] is a perspective view of the first embodiment of the creation from another perspective.

[Figure 3] is a three-dimensional exploded view of the first embodiment of this creation.

[Figure 4] is a cross-sectional side view of the first embodiment of this creation.

[Figure 5] is a three-dimensional exploded view of the second embodiment of this creation.

[Figure 6] is a three-dimensional exploded view of the third embodiment of this creation.

[Figure 7] is a three-dimensional exploded view of the fourth embodiment of this creation.

[Figure 8] is a three-dimensional exploded view of the fifth embodiment of this creation.

[Figure 9] is a three-dimensional exploded view of the sixth embodiment of this creation.

In order to achieve the above-mentioned purpose and effect, the technical means and structure used in this creation are described in detail below with regard to the preferred embodiment of this creation. Its features and functions are as follows. To understanding.

Please refer to Figures 1, 2, 3, and 4, which are the three-dimensional external view of the first embodiment of the creation, the three-dimensional external view of the first embodiment from another perspective, the three-dimensional exploded view of the first embodiment, and the first The side sectional view of the embodiment, as can be clearly seen from the figure, the first embodiment of the invention includes a base 1 and a heat sink 2, in which:

An accommodating space 10 is formed inside the base 1, and a first opening 101 is provided on one side of the accommodating space 10, and a second opening 102 is formed on the other side of the accommodating space 10 relative to the first opening 101. The accommodating space 10 is respectively provided with a button hole 11 on the two opposite side walls.

The two opposite side walls of the heat sink 2 are respectively provided with buckles 21 protruding, and arc-shaped guide surfaces 211 are respectively formed at the two opposite side surfaces of the two buckles 21, and the heat sink 2 is opposite to the two buckles 21. A heat dissipating surface 22 is formed on the side surface, and an array of rectangular heat dissipating channels 23 are transversely penetrated inside the heat dissipating element 2, and the heat dissipating surface 22 is transversely cross-sectioned with plural grooves 24 on the side surface, and the heat dissipating surface 22 is opposite to the side surface The plurality of grooves 24 are provided with a plurality of grooves 25 arranged at intervals from upper right to lower left.

When this creation is in actual use, the solid state drive, memory, CPU or other electronic components 3 that generate heat can be covered with heat dissipation films 31 on the opposite sides, and the electronic components 3 can be placed on the base. Inside the accommodating space 10 of 1, at this time, the heat source (not shown in the figure) on one side of the electronic component 3 is facing the first opening 101 of the accommodating space 10, and the butting portion on the other side of the electronic component 3 (Not shown in the figure) is exposed toward the second opening 102 of the accommodating space 10, and then the heat sink 2 is pressed into the direction of the base 1 to assemble. The heat sink 2 is a guide that can pass through the two buckles 21 Face 211 to make the accommodating space 10 the first The opening 101 is slightly opened, so that the two buckles 21 of the heat sink 2 continue to move toward the inside of the accommodating space 10, so that the two buckles 21 of the heat sink 2 are buckled in the buckle holes on the opposite side walls of the accommodating space 10 At the same time, the heat dissipating surface 22 of the heat dissipating element 2 is pressed against the surface of the heat dissipating film 31 on the side of the electronic component 3 to conduct heat generated by the operation of the heat source to the outside. The heat dissipation channel 23, the plurality of grooves 24, and the plurality of grooves 25 increase the area of diversion and heat dissipation, so as to effectively accelerate the discharge of heat energy.

When the electronic component 3 is to be replaced, only the accommodating space 10 of the base 1 needs to be extended outward from the two side walls, so that the first opening 101 of the accommodating space 10 is enlarged, and the second fins of the heat sink 2 21 is separated from the restriction of the two button holes 11 of the base 1, and then the heat sink 2 is separated from the base 1, and the electronic component 3 can be taken out to perform the replacement action. The base 1 uses the two button holes 11 for heat dissipation The second clip 21 of the part 2 is snapped into a position, so the convenience of the overall assembly can be improved, and only two components of the base 1 and the heat sink 2 can be fixed on the electronic component 3, which can reduce the overall manufacturing cost.

Please refer to Figure 5, which is a three-dimensional exploded view of the second embodiment of this creation. It can be clearly seen from the figure that, compared with the first embodiment, the accommodating space of the base 1 in the second embodiment of this creation 10 opposite to the second opening 102 is provided with at least one stopper 12, which can be stopped by the stopper 12 at the opposite side of the electronic component 3 with respect to the mating portion, and the top surface of the heat sink 2 and A plurality of inclined heat dissipation channels 23 penetrate inward from the side surface.

Please refer to Figure 6, which is a three-dimensional exploded view of the third embodiment of this creation. It can be clearly seen from the figure that compared with the first embodiment, the accommodation space of the base 1 is 10 opposite to the second opening 102 is provided with at least one stopper 12, and a heat dissipation channel 23 is transversely penetrated inside the heat dissipation member 2, and is located on the inner wall of the heat dissipation channel 23 The surface is convexly provided with a plurality of ribs 231 arranged at intervals, and the plurality of grooves 25 of the heat sink 2 of the third embodiment are cut from the upper left to the lower right in an inclined shape.

Please refer to Figure 7, which is a three-dimensional exploded view of the fourth embodiment of this creation. It can be clearly seen from the figure that compared with the third embodiment, the heat dissipation channel of the fourth embodiment of this creation Inside 23 and located on the upper, lower and opposite sides of the plurality of ribs 231, there are staggered and T-shaped diversion fluids 232, and the plurality of grooves 25 of the heat sink 2 are upright.

Please refer to Figure 8, which is a three-dimensional exploded view of the fifth embodiment of this creation. It can be clearly seen from the figure that compared with the third embodiment, the heat sink 2 of the fifth embodiment of this creation can be omitted A heat dissipation channel 23 is used, and a plurality of heat dissipation fins 26 are provided on the bottom surface of the heat dissipation member 2.

Please refer to Figure 9, which is a three-dimensional exploded view of the sixth embodiment of this creation. It can be clearly seen from the figure that the sixth embodiment of this creation is compared with the first embodiment. The groove 25 is upright.

This creation has the following advantages:

(1) The second buckle 21 of the heat sink 2 is buckled and positioned in the second buckle hole 11 of the base 1 by pressing in, so as to improve the convenience of the overall assembly, and only the base 1 and heat dissipation are required The two components of the component 2 can be fixed on the electronic component 3, thereby reducing the overall manufacturing cost.

(2) The second buckle 21 of the heat sink 2 penetrates into the second buckle hole 11 of the base 1 to form a buckle position, and the accommodating space of the base 1 can be reduced through the structural design of the penetration. 10 is located in the second buckle The wall surface of the hole 11 is exposed to the thickness of the two clasps 21, thereby effectively reducing The overall height of the upper and lower sides reduces the overall volume to meet the needs of light, thin, short and small electronic products.

(3) During the process of assembling the second buckle 21 of the heat sink 2 into the second buckle hole 11 of the base 1, each of the buckles 21 can be guided by the guide surface 211 to improve the smoothness of the assembly, so that The second buckle 21 of the heat sink 2 can be easily assembled in the second buckle 11 of the base 1, thereby achieving the effect of improving the convenience of assembly.

The above is only the preferred embodiment of this creation, and it does not limit the patent scope of this creation. Therefore, all simple modifications and equivalent structural changes made by using this creation specification and schematic content should be included in the same reasoning Within the scope of the patent of this creation, it is to Chen Ming.

In summary, the heat sink of this creation can indeed achieve its effects and purposes when used, so this creation is a new model with excellent practicability. In order to meet the requirements of a new patent application, an application is filed in accordance with the law, pending review The commission grants this case as soon as possible to protect the creator’s hard work. If the Jun Ju Committee has any doubts, please feel free to write instructions. The creators will do their best to cooperate, and they will feel good.

1: base

10: Housing space

101: first opening

102: second opening

11: Buttonhole

2: heat sink

21: Clasp

211: Guiding Surface

22: cooling surface

23: cooling channel

24: Groove

25: groove

Claims (9)

A heat dissipating device includes a base and a heat dissipating element, wherein: inside the base is an accommodating space for placing preset electronic components, and one side of the accommodating space is provided with a first opening for placing the preset electronic components , And the accommodating space is formed at the other side of the first opening with a second opening for the mating portion of the preset electronic component to pass through, and the accommodating space is provided with button holes on the two opposite side walls; the heat sink is opposite to two The side wall surfaces are respectively convexly provided with buckle pieces for buckling into the buckle holes, and the other side of the heat sink relative to the two buckle pieces is formed with a heat dissipation surface for pressing and sticking on the heating source of the preset electronic component. As for the heat dissipation device described in item 1 of the scope of patent application, wherein the accommodating space of the base is provided with at least one stopper on the side opposite to the second opening. As for the heat dissipating device described in item 1 of the scope of patent application, the two buckles of the heat dissipating element are respectively formed with arc-shaped guide surfaces at the opposite two outer sides. In the heat dissipation device described in item 1 of the scope of patent application, the inside of the heat dissipation element is a plurality of heat dissipation channels in an array that penetrates laterally. In the heat dissipation device described in item 1 of the scope of patent application, the top and side surfaces of the heat dissipation element are inwardly penetrated with a plurality of inclined heat dissipation channels. For the heat dissipation device described in item 1 of the scope of patent application, wherein the inside of the heat dissipation element is a heat dissipation channel penetrating transversely, and a plurality of convex ribs arranged at intervals are protrudingly arranged on the inner wall of the heat dissipation channel, and the heat dissipation surface is laterally cross-sectional It is provided with a plurality of grooves, and the heat dissipation faces the side and is located on the plurality of grooves, and a plurality of grooves arranged at intervals are cut from the upper left to the lower right. The heat sink described in item 6 of the scope of patent application, wherein the inside of the heat sink There is a heat dissipation channel transversely, and the heat dissipation channel is located on the upper, lower and opposite sides of the plurality of ribs with staggered and T-shaped diversion fluids, and the heat dissipation surface is laterally sectioned with a plurality of grooves , And the heat dissipation faces the side and is located on the plurality of grooves, and is provided with a plurality of vertical grooves arranged at intervals. The heat dissipation device described in the first item of the scope of patent application, wherein the heat dissipation face side of the heat dissipation element is transversely sectioned with a plurality of grooves, and the heat dissipation face side is located on the plurality of grooves and is cut from the upper right to the lower left. Plural grooves arranged. In the heat dissipation device described in item 1 of the scope of patent application, the bottom surface of the heat dissipation element is provided with a plurality of heat dissipation fins.

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