TWI809344B - Integrated heat sink for memory modules - Google Patents

Abstract

The present invention relates to an integrated heat sink applied to memory modules, including: a memory module, which includes a circuit board, and a plurality of memory particles are welded on at least one side surface of the circuit board; a heat dissipation module A set, which has a heat conduction sheet attached to both sides of the memory module, has a connecting portion between the two heat conduction sheets, and has a support for the memory module on the opposite inner side of the two heat conduction sheets and the connecting portion Accommodating an accommodating space, and having at least one glue filling port communicated with the accommodating space in at least one heat conducting sheet, and the glue filling port is used for pouring a heat conducting glue into and leading to at least one side surface of the circuit board , and make the heat conduction paste fill between the memory particles and the heat conduction sheet to conduct heat transfer.

Description

Integrated heat sink for memory modules

The present invention provides an integrated heat sink applied to memory modules, especially an integrated heat sink that only needs to be opened for one set of molds and assembled at one time, which can greatly reduce the demand for start-up work or make it easier to import Automated assembly, and when performing maintenance operations, only need to use heating equipment to melt the heat-conducting adhesive between the heat sink and the memory module, which can reduce the maintenance work if the memory particles will not be disassembled and damaged time and cost purposes.

Press, with the rapid development of electronic technology and network technology, whether it is a personal computer or a computer server has become an indispensable part of people's daily life. At the same time, with the rise of the e-sports industry, the performance of computers used in e-sports must also meet the needs of online games where every second counts. The improvement of computer performance is also accompanied by the increase of the heat generated by the internal components of the computer, which has a serious impact on the performance and service life of the computer. Therefore, it is necessary to provide a good cooling device to cool down the components of the computer in order to ensure Fluency of operation.

Among computer components, dynamic random access memory (DRAM) and solid state disk (SSD) occupy an extremely important position in the history of data storage devices and will become the mainstream in the future, especially dynamic random access memory (DRAM). With the overall evolution of the computer, its transmission speed becomes faster and its size becomes smaller and thinner, which causes the heat generation and heat dissipation capabilities of the memory particles on it to deteriorate. In the working state, the temperature is often higher than at least 60 degrees, and the performance of the dynamic random access memory at high temperature will be greatly reduced. In the worst case, the computer may crash. Therefore, how to dissipate the heat and cool down the memory particles has become an important task. This industry is eager to work hard on the topic.

At present, the structure of memory heat sinks on the market is a two-piece structure. Each heat sink includes an exposed front surface and a rear surface bonded to the memory module. The assembly method of the heat sink and the memory module is nothing more than Use thermally conductive adhesive (PAD) or foam glue (SPONGE) for lamination. As far as the actual assembly work is concerned, when assembling the two heat sinks and the memory module, it is necessary to use manual glue to assemble the two. Since it is a two-piece heat sink, a second glue application and a second Therefore, the assembly time and manpower of memory modules and heat sinks cannot be reduced.

In addition, from the perspective of maintenance, since the thermal adhesive or foam glue is pasted between the heat sink and the memory module, these adhesive substances are extremely viscous and are placed on the memory module during the disassembly process. The memory particles are easy to be disassembled and damaged, which simply increases the cost of maintenance. Based on the above-mentioned conventional two-piece heat sink, there are many shortcomings that need to be overcome when performing maintenance operations.

Therefore, in view of the above-mentioned problems and deficiencies, the inventor collected relevant information, and after various evaluations and considerations, the invention of this integrated heat sink for memory modules was designed.

The main purpose of the present invention is to provide an integrated heat sink for a memory module, comprising: a memory module, which includes a circuit board, and a plurality of memory particles are welded on at least one side surface of the circuit board; A heat dissipation module, which has a heat conduction sheet attached to two sides of the memory module, a connecting portion is provided between the two heat conduction sheets, and the two heat conduction sheets and the The relative inner side of the connecting portion has a storage space for the memory module, and at least one glue filling port communicated with the storage space is provided in at least one heat conduction sheet, and the glue filling hole is used for filling a heat conduction glue. Injecting and leading to at least one side surface of the circuit board, and making the heat conduction paste fill between the memory particles and the heat conduction sheet to conduct heat energy transfer. With the above-mentioned structure, compared with the traditional two-piece memory heat sink, the integrated heat dissipation module of the present invention only needs to open a set of molds and make one-time assembly, which can greatly reduce the need for manual work or make it easier to introduce automated assembly , In addition, when performing maintenance operations, only need to use heating equipment to melt the thermally conductive adhesive between the heat sink and the memory module, and the memory particles will not be disassembled and damaged, which can reduce the time and cost of maintenance operations purpose.

The secondary purpose of the present invention is that the bottom side of the connecting portion of the heat dissipation module is further concavely provided with an engaging groove, and the engaging groove is used for inserting and positioning the edge of an engaging plate formed on the top side of the memory module.

Another object of the present invention is that the top side of the connecting part of the heat dissipation module can be used for a set positioning of a preset lighting module, and the preset lighting module is equipped with a device that can be used for continuous or intermittent lighting. A plurality of preset light-emitting diodes for the lamp.

Another object of the present invention is that the heat dissipation module is a one-piece aluminum extruded U-shaped heat dissipation structure, and the heat conduction fin of the heat dissipation module is arranged on the outside of the glue filling port, and is covered with a shieldable The nameplate of the glue filling port, the outer surface of the nameplate is provided with words or patterns commending the manufacturer, distributor or product, and the glue filling port is an oval opening.

Another object of the present invention is to form a plurality of microstructures on the inner wall of at least one heat conduction sheet of the heat dissipation module to help the heat conduction glue diffuse, and the microstructures are composed of diamond-shaped cones, rectangular cones, triangular pyramids or semicircles. formed by form.

Another object of the present invention is that the composition of the thermally conductive adhesive includes a liquid matrix composed of a polymer and a filler capable of conducting heat. The liquid matrix is selected from a silicone resin, a polyurethane, an acrylic A composition of lipopolymer, a hot-melt adhesive, and an adhesive. The filler refers to a composition selected from the group consisting of alumina, boron nitride, zinc oxide, and aluminum nitride.

1: Memory module

11: Circuit board

111: Clip board edge

12: Memory particles

2: cooling module

20:Accommodating space

200: snap groove

21: Heat conduction sheet

210: glue filling port

211: Adhesive guide channel

212:Microstructure

212a: The first microstructure

212b: second microstructure

212c: The third microstructure

22: Connection Department

23: Nameplate

3: thermal adhesive

[Fig. 1] is a perspective view of the assembled memory module and heat dissipation module of the present invention.

[Fig. 2] is a three-dimensional exploded view of the memory module and heat dissipation module of the present invention before assembly.

[Fig. 3] is another three-dimensional exploded view of the memory module and heat dissipation module of the present invention before assembly.

[Fig. 4] is a side sectional view of the assembled memory module and cooling module of the present invention.

[Fig. 5] is a three-dimensional appearance view of another memory module and heat dissipation module of the present invention after assembly.

[Fig. 6] is a side sectional view of another memory module and heat dissipation module of the present invention assembled.

[Fig. 7A] is a diagram of the first embodiment of the microstructure arranged inside the cooling module according to the present invention.

[Fig. 7B] is a diagram of the second embodiment of the microstructure arranged inside the cooling module according to the present invention.

[Fig. 7C] is a diagram of the third embodiment of the microstructure arranged inside the cooling module according to the present invention.

In order to achieve the above-mentioned purpose and effect, the technical means and the structure adopted by the present invention are hereby illustrated in detail with respect to the preferred embodiments of the present invention. Its features and functions are as follows, so that it can be fully understood.

Please refer to Figures 1 to 4, which are the three-dimensional appearance view after assembly of the memory module and heat dissipation module of the present invention, the three-dimensional exploded view before assembly, another three-dimensional exploded view before assembly, and the side view after assembly Sectional view, can clearly find out from the figure, the object and device bag that the present invention is applied It includes a memory module 1, a heat dissipation module 2, and a heat-conducting adhesive 3. The connection relationship and operation of the aforementioned components are described as follows: the memory module 1 includes a circuit board 11, and at least one side of the circuit board 11 A plurality of memory particles 12 are welded on the surface.

The heat dissipating module 2 has a heat conduction sheet 21 attached to two sides of the memory module 1, and a joint portion 22 is formed between the two heat conduction plates 21, and the two heat conduction plates 21 are opposite to the joint portion 22. There is an accommodating space 20 for the memory module 1 inside, and there is at least one glue filling port 210 communicated with the accommodating space 20 in at least one heat conducting sheet 21, and the glue filling port 210 is for a heat conduction The glue 3 is poured and guided to at least one side surface of the circuit board 11 , and the thermally conductive glue 3 is filled between the memory particles 12 and the thermally conductive sheet 21 to conduct heat transfer.

The bottom side of the connecting portion of the above-mentioned heat dissipation module 2 is further concavely provided with an engaging groove 200 , and the engaging groove 200 is used for inserting and positioning the engaging plate edge 111 formed on the top side of the memory module 1 . The top side of the connecting portion 22 of the heat dissipation module 2 can be used for a set positioning of a preset light-emitting module (not shown in the figure). A plurality of preset light-emitting diodes (not shown in the figure) for lighting up, and a preset light-emitting module on the heat dissipation module 2 is a common structure of a memory module for general gaming, so it will not be described here. detail.

In a preferred embodiment, the heat dissipation module 2 is a one-piece aluminum extruded U-shaped heat dissipation structure, and the heat conduction sheet 21 of the heat dissipation module 2 is arranged on the outside of the glue filling port 210. There is a nameplate 23 that can cover the glue filling port 210, and the present invention does not limit the number and size of the nameplates 23, and the two nameplates 23 with smaller sizes can also be used to cover the two glue filling ports 210 respectively. This embodiment Also within the protection scope of the present invention. And the outer surface of the nameplate 23 is further provided with words or patterns commending the manufacturer, distributor or product, and the glue filling port 210 is an oval opening. and The position of the glue filling port 210 is better as it is closer to the memory particle 12 (because the memory particle 12 is the main heat source), so in the second figure, a plurality of memory particles 12 are distributed on two sides of the surface of the circuit board 11. Therefore, the glue pouring port 210 is also arranged on the two sides of the heat conduction plate 21, which can ensure that the heat conduction glue 3 can really cover the outside of the memory particle 12 during glue pouring operation, so as to achieve the best heat dissipation effect.

Please refer to Figures 7A to 7C, each of which is the first, second, and third embodiment diagrams of the microstructure disposed inside the heat dissipation module according to the present invention, wherein the inner wall surface of at least one heat conducting fin 21 of the heat dissipation module 2 is formed There are multiple microstructures 212 that help the heat-conducting adhesive 3 diffuse, and the microstructures 212 are composed of rhombic cones (the first microstructure 212a shown in Figure 7A), rectangular cones (simple modification structures in Figure 7A) ), a triangular pyramid (as the second microstructure 212b shown in FIG. 7B) or a semicircle (as the third microstructure 212c shown in FIG. 7C).

Please refer to Figures 5 and 6 again, which are respectively the three-dimensional appearance diagram and the side view sectional view after another memory module and heat dissipation module of the present invention are assembled, which include: the memory module 1 includes a circuit A board 11, and a plurality of memory particles 12 are welded on at least one side of the circuit board 11.

The heat dissipating module 2 has a heat conduction sheet 21 attached to two sides of the memory module 1, and a joint portion 22 is formed between the two heat conduction plates 21, and the two heat conduction plates 21 are opposite to the joint portion 22. There is an accommodating space 20 inside for the storage of the memory module 1, and a glue guiding channel 211 transversely penetrating through the accommodating space 20 is recessed on the inner wall surface of at least one heat conducting sheet 21, and the glue guiding channel 211 A thermal conductive glue 3 is poured from one side or two sides of the thermal conductive sheet 21 and guided to at least one side surface of the circuit board 11, and the thermal conductive adhesive 3 is filled in the memory particles 12 and the thermal conductive sheet Do a thermal energy transfer between 21.

The composition of the above-mentioned thermally conductive adhesive 3 includes a liquid matrix composed of a polymer, and a filler capable of conducting heat. The liquid matrix refers to a silicone resin, a polyurethane, an acrylate polymer, a thermal Melt glue, a composition of an adhesive, and the filler refers to a composition selected from the group consisting of alumina, boron nitride, zinc oxide, and aluminum nitride.

Comparing the above-mentioned structures disclosed in Figures 1 to 4 with those disclosed in Figures 5 to 6, the only difference between the two is that the former is provided with a glue filling port 210 on the left and right sides of the heat conducting sheet 21, while the latter is on the heat conducting sheet 21. The inner wall of the sheet 21 is concavely provided with a glue-conducting channel 211 transversely penetrating the accommodating space 20. Except for the aforementioned differences, the rest of the structures are identical, so repeated descriptions of these structures will not be repeated.

When assembling the memory module and the heat dissipation module of the present invention, it is only necessary to fix the memory module 1 with a preset fixing fixture, and then cover the heat dissipation module 2 on the memory module from top to bottom 1 outside, and then use the preset alignment fixture to perform the alignment operation, so that the glue filling port 210 or the glue guide channel 211 of the heat conduction sheet 21 is correctly positioned at the position of the plurality of memory particles 12, and then use a preset glue filling fixture The heated thermal conductive adhesive 3 is poured into the glue filling port 210 or the adhesive channel 211, and at this time, the thermal conductive adhesive 3 helps the thermal conductive adhesive 3 to diffuse and strengthen the adsorption through the complex microstructures 212 arranged on the inner wall of the thermal conductive sheet 21, In order to reduce the thermal conductive glue 3 from overflowing from the gap between the heat dissipation module 2 and the memory module 1, the thermal conductive glue 3 flows into the accommodation space 20 between the plurality of memory particles 12 and the heat conduction sheet 21 through guidance, and utilizes the preset The detection instrument checks whether there are air bubbles in the thermally conductive adhesive 3 that affect the bonding, and then uses the preset glue filling jig to continue pouring the thermally conductive adhesive 3 or uses the preset bubble removal tool to remove the air bubbles. After the thermally conductive adhesive 3 is completely filled in the multiple memories After the accommodating space 20 between the particles 12 and the heat conduction sheet 21 is free of any abnormal conditions, the temperature is lowered using natural cooling or a preset cooling fixture, and the cooled heat conduction adhesive 3 forms an object that fixes the two, and the memory is completed. Assembly structure of body module 1 and heat dissipation module 2 .

For the glue filling operation of the above-mentioned manufacturing process, as the memory module 1 is provided with multiple memory particles 12 on one or both sides, it will also be determined whether to use thermally conductive glue 3 or a preset hot-melt fixing glue (which does not have the function of heat conduction ), when the memory module 1 is provided with a plurality of memory particles 12 on one side, the thermally conductive adhesive 3 is filled on the side where the memory particles 12 are set; A hot-melt fixing glue is provided, and the purchase cost of the preset hot-melt fixing glue is lower than that of the heat-conducting glue 3 , the above-mentioned method can reduce the overall production cost. If the memory module 1 is provided with a plurality of memory particles 12 on both sides, both sides must be filled with thermal conductive adhesive 3 to form an assembly structure of the memory module 1 and the heat dissipation module 2 with excellent heat dissipation.

From the above-mentioned disclosure of Figures 1 to 7C, it can be understood that the present invention is an integrated heat sink applied to a memory module, including: a memory module, which includes a circuit board, and on the circuit board at least One side surface is welded with a plurality of memory particles; a heat dissipation module has a heat conduction sheet attached to two sides of the memory module, and there is a joint between the two heat conduction sheets, and between the two heat conduction sheets and the The relative inner side of the connecting part has a storage space for the storage of the memory module, and at least one glue filling port communicated with the storage space is provided in at least one heat conducting sheet, and the glue filling port is used for a heat conduction glue pouring and leading to at least one side surface of the circuit board, and making the heat conduction paste fill between the memory particles and the heat conduction plate to conduct heat energy transfer. With the above-mentioned structure, compared with the traditional two-piece memory heat sink, the integrated heat dissipation module of the present invention only needs to open a set of molds and make one-time assembly, which can greatly reduce the need for manual work or make it easier to introduce automated assembly , In addition, when performing maintenance operations, only need to use heating equipment to melt the thermally conductive adhesive between the heat sink and the memory module, and the memory particles will not be disassembled and damaged, which can reduce the time and cost of maintenance operations purpose. The integrated heat sink of the present invention is applied to e-sports industry memory In the phantom module manufacturing industry, it has good practicability, so a patent application is filed to seek patent protection.

The above is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Therefore, all simple modifications and equivalent structural changes made by using the description and drawings of the present invention should be included in the same way. Within the scope of the patent of the present invention, I agree with Chen Ming.

To sum up, the above-mentioned integrated heat sink applied to the memory module of the present invention can really achieve its effect and purpose when used, so the present invention is an invention with excellent practicability, which is in line with the application for the invention patent The essential requirement is to file an application in accordance with the law. I hope that the trial committee will approve this case as soon as possible to protect the hard work of the inventor. If the Junju trial committee has any doubts, please feel free to send a letter to instruct the inventor. I will do my best to cooperate, and I really appreciate it.

1: Memory module

11: Circuit board

111: Clip board edge

12: Memory particles

2: cooling module

20:Accommodating space

21: Heat conduction sheet

210: glue filling port

22: Connection Department

23: Nameplate

Claims (10)

An integrated heat sink applied to a memory module, comprising: a memory module, which includes a circuit board, and a plurality of memory particles are welded on at least one side surface of the circuit board; and a heat dissipation module, which There are heat conduction sheets attached to both sides of the memory module, there is a joint between the two heat conduction sheets, and the heat dissipation module is an integral U-shaped heat dissipation structure formed by aluminum extrusion, and on the There is an accommodating space for the memory module on the opposite inner side of the two heat-conducting sheets and the connecting portion, and at least one glue-filling port communicated with the accommodating space is provided in at least one heat-conducting sheet, and the glue-filling port is A heat-conducting glue is poured into and guided to at least one side surface of the circuit board, and the heat-conducting glue is filled between the memory particles and the heat-conducting sheet to conduct heat energy transfer. The integrated heat sink applied to the memory module as described in claim 1, wherein the bottom side of the connecting part of the heat dissipation module is further concavely provided with a locking groove, and the locking groove is used for the top of the memory module One of the sides is formed as a side of the snap plate for insertion and positioning. The integrated heat sink applied to the memory module as described in claim 1, wherein the top side of the connecting part of the heat dissipation module can be used for a set positioning of a preset light emitting module, and the preset light emitting module There are multiple preset light-emitting diodes inside the module that can be used for continuous or intermittent lighting. The integrated heat sink applied to the memory module as described in claim 1, wherein the heat conduction sheet of the heat dissipation module is placed on the outside of the glue filling port, and is covered with a nameplate that can cover the glue filling port , the outer surface of the nameplate is further provided with words or patterns commending the manufacturer, distributor or product, and the glue filling port is an oval opening. An integrated heat sink applied to a memory module as described in claim 1, wherein the inner wall of at least one heat conduction plate of the heat dissipation module is formed with a plurality of microstructures that help the heat conduction glue to diffuse, and the microstructures are composed of Rhombus cones, rectangular cones, triangular pyramids or semicircular bodies. An integrated heat sink applied to a memory module, comprising: a memory module, which includes a circuit board, and a plurality of memory particles are welded on at least one side surface of the circuit board; and a heat dissipation module, which There are heat conduction sheets pasted on both sides of the memory module, there is a connecting portion between the two heat conduction sheets, and there is one for the memory module to be accommodated on the opposite inner side of the two heat conduction sheets and the connecting portion The accommodating space, and at least one heat conducting sheet inner wall surface is concavely provided with a glue conducting channel transversely penetrating the accommodating space, and the glue conducting channel is used for pouring a heat conducting glue from one or both sides of the heat conducting sheet And guide the flow to at least one side surface of the circuit board, and make the heat conduction paste fill between the memory particles and the heat conduction sheet to conduct heat energy transfer. The integrated heat sink applied to the memory module as described in claim 6, wherein the bottom side of the connecting part of the heat dissipation module is further concavely provided with an engaging groove, and the engaging groove is used for the top of the memory module One of the sides is formed as a side of the snap plate for insertion and positioning. The integrated heat sink applied to the memory module as described in claim 6, wherein the top side of the connecting part of the heat dissipation module can be used for a set positioning of a preset light-emitting module, and the preset light-emitting module There are multiple preset light-emitting diodes inside the module that can be used for continuous or intermittent lighting. An integrated heat sink applied to a memory module as described in claim 6, wherein The heat dissipation module is an integral heat dissipation structure extruded from aluminum, and the inner wall surface of at least one heat conduction sheet of the heat dissipation module is formed with a plurality of microstructures that help the heat conduction glue to diffuse, and the microstructures are composed of rhombic cones, Consists of rectangular cones, triangular pyramids or semicircles. The integrated heat sink applied to memory modules as described in claim 6, wherein the composition of the thermally conductive adhesive includes a liquid matrix composed of a polymer, and a filler capable of conducting heat, and the liquid matrix is selected From the composition of a silicone resin, a polyurethane, an acrylate polymer, a hot melt adhesive, and an adhesive, the filler is selected from the group consisting of aluminum oxide, boron nitride, zinc oxide, nitrogen Composition of aluminum oxide.

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