CN207460724U

CN207460724U - Heat radiation module

Info

Publication number: CN207460724U
Application number: CN201721605619.0U
Authority: CN
Inventors: 陈涵敦
Original assignee: Ubiqconn Technology Inc
Current assignee: Ubiqconn Technology Inc
Priority date: 2017-02-10
Filing date: 2017-11-27
Publication date: 2018-06-05
Anticipated expiration: 2027-11-27
Also published as: TWM543532U

Abstract

The utility model provides a heat radiation module for a circuit board, this circuit board include a leading truck and one can dismantle the component, and this heat radiation module includes: a frame, which is superposed on the circuit board and is provided with a first opening and a second opening, wherein the first opening corresponds to the main element, and the second opening corresponds to the detachable element; and a radiator, which is arranged on the frame corresponding to the first opening and is contacted with the main element.

Description

Radiating module

Technical field

The utility model is related to a kind of radiating module, espespecially a kind of radiating module for being used for circuit board.

Background technology

With the fast development of electronic industry, the operand for the chip being arranged on circuit board improves, and accelerates at information Function is managed, the chip of right high-speed computation can then generate substantial amounts of thermal energy.If not radiated suitably, the stability of circuit board and Operational paradigm declines, in some instances it may even be possible to overheat and fail, therefore, the heat dissipation of circuit board is quite important.In general, often utilize heat dissipation The temperature that fin or fan carry out holding circuit plate enables the circuit board steadily to operate.

To illustrate existing circuit board and radiating module, radiating module is used to that circuit board 1 to be assisted to radiate Fig. 1.The radiating mould Block includes a substrate 2 ' and a fins group 3, which is arranged on 1 top of circuit board, and the fins group 3 is then arranged at the base 2 ' top of plate.The substrate 2 ' is contacted with the main element 11 (such as central processing unit and chipset) of the circuit board, therefore by main member Thermal energy caused by part 11 can be transferred to the substrate 2 ' and be transferred to the fins group 3 by the substrate 2 ', and then by the fins group 3 Outside is put in heat dissipation.

However, if detachable components 12 (such as memory modules) are installed, if being intended to replace or removing this detachably on circuit board During element 12, then need to remove radiating module, and usually the substrate 2 ' is coated with thermal grease with 11 contact position of main element, once Radiating module is removed, then thermal grease also needs to be coated with again, and the program for replacing detachable components 12 is extremely complex.In addition, circuit On plate in addition to main element 11, other elements (such as memory modules and source element) also need to radiate, therefore for there is fan Radiator for, due to the presence of substrate, air-flow can not be directly blown onto those elements, and influence its heat dissipation.

Therefore, it is badly in need of a kind of novel radiating module at present, radiating module can be assembled according to the type of circuit board, and letter Change the program for replacing detachable components.

Utility model content

To achieve the above object, the utility model provides a kind of radiating module, to solve available circuit plate in group After filling radiating module, it is difficult on replacement circuit plate the problem of detachable components.

Radiating module provided by the utility model is for a circuit board, which includes a main element and one Detachable components, and the radiating module includes：One frame is stacked and placed on the circuit board, the frame have one first opening and One second opening, wherein, which is the corresponding main element and second opening is the corresponding detachable components； And a radiator, corresponding first opening and be arranged at the frame, and contacted with the main element.

In one of the utility model embodiment aspect, which further includes multiple fixed columns, be solid lock in the circuit board Upper corresponding multiple screw holes so that when the frame is stacked and placed on the circuit board, maintained each other with the fixed column one away from From.Wherein, the position of multiple screw holes on the circuit board is depending on the specification of various types of circuit board, and again by circuit The screwhole position of plate and the fixed column on frame is set.Position set by the visual radiator of the length of the fixed column and Fixed, the distance of the frame and the circuit board should cause the radiator to can contact the main element.

In other embodiment aspects of the utility model, the shape of first opening and second opening on the frame And size should regarding the circuit board type and its depending on, be not particularly limited, as long as first opening is the corresponding main member Part, which is the corresponding detachable components, and the detachable components can be appeared by second opening.In addition, in In one of the utility model embodiment aspect, which is to communicate with each other or do not connect with second opening, and this is detachable Element is to appear from second opening, thus can thereby be replaced via second opening and from the circuit board or removal this is detachable Element.

In a preferable embodiment aspect, the radiator for it is corresponding this first be open and be arranged at the frame top or under Side.The radiator preferably includes a thermally conductive sheet and a fins group, and the thermally conductive sheet is contacts with the main element, and the fins group To be connected with the thermally conductive sheet and thermal conductivity is led to each other.If the radiator is the top for being arranged at the frame, this of the radiator is led Backing or the thermally conductive sheet and the fins group should pass through first opening and be contacted with the main element.And the main element Generated thermal energy can be conducted by the thermally conductive sheet to the fins group.In the utility model, the fins group is preferably by copper institute It is made, and the aspect of the fins group is not particularly limited, as long as fins group used in the art.

In another preferable embodiment aspect, which can further include a fan, be arranged at the top of the radiator, and One air-flow is provided, is blowed towards the direction of the fins group and the main element.In addition, the air-flow can flow to its of the circuit board On his element, the detachable components are flowed to including a part, to provide heat radiation function.

In a preferable embodiment aspect, when the radiator is arranged at the lower section of the frame, which is arranged at the heat dissipation Between device and the frame or it is arranged at the top of the frame.And when the radiator is arranged at the lower section of the frame and the fan is set When being placed in the top of the frame, then there is a gap between the radiator and the fan.The gap preferably between 2~5 millimeters it Between, and it is substantially equivalent to a thickness of the frame.Keep the gap that can reduce the radiating mould between the radiator and the fan Wind of block when running cuts sound.

In addition, in one of the utility model embodiment aspect, the main element on the circuit board can be a central processing The element of device, a chip or other high-speed computations, and the detachable components hinder for a memory mould.For example, which can For a COM Express substrates, wherein the main element is a central processing unit, and the detachable components can be insertion slot type memory Module.

To sum up, radiating module provided by the utility model can efficiently radiate, and second be opened by this of the frame Mouthful, be not required to when dismantling or replacing the detachable components will entire radiating module remove after replace again, it is only necessary to by this second Opening directly dismantles the detachable components on circuit board, can solve existing to be difficult to asking for detachable components on replacement circuit plate Topic.

Description of the drawings

Fig. 1 is the circuit board of the prior art and the explosive view of radiating module.

Fig. 2 is the stereogram of the radiating module of the utility model embodiment 1.

Fig. 3 is the explosive view of the radiating module of the utility model embodiment 1.

Fig. 4 is the bottom view of the radiating module of the utility model embodiment 1.

Fig. 5 is the stereogram of the radiating module of the utility model embodiment 2.

Fig. 6 is the stereogram of the radiating module of the utility model embodiment 3.

Wherein reference numeral is：

1000th, 2000,3000 radiating module

1 circuit board

11 main elements

12 detachable components

13 screw holes

2 frames

21 first openings

22 second openings

23 locking parts

24 protrusive boards

2 ' substrates

3 radiators

31 fins groups

32 thermally conductive sheets

4 fans

D gaps

Specific embodiment

The personage of this skill can easily be understood by content disclosed in the present specification other advantages of the utility model with Effect.Only it is noted that figures below is simplified schematic diagram, component number, shape and size in schema can be according to realities Border status of implementation and arbitrarily change, and component placement state can be increasingly complex.The utility model also can be by other different tools Body embodiment is implemented or applied, and the various details in this specification can also be based on different viewpoints and application, is not departing from this Various modifications and change are carried out under the spirit of utility model.

[embodiment 1]

The radiating module 1000 of the present embodiment is installed in a circuit as shown in the stereogram of Fig. 2 and the explosive view of Fig. 3 On plate 1.The radiating module 1000 mainly includes a frame 2, a radiator 3 and a fan 4.Wherein, which includes One main element 11 and a detachable components 12；And the frame 2 is set up in 1 top of circuit board, and with one first opening 21 and one second opening 22, this first opening 21 correspond to the main element 11, and this second opening 22 correspond to the detachable member Part 12；The radiator 3 is arranged at the lower section of the frame 2, refer to the bottom surface of the radiator described in Fig. 4, which wraps Containing a fins group 31 and a thermally conductive sheet 32, the thermally conductive sheet 32 of the radiator 3 with the main element 11 to contact, by heat transfer To the fins group 31 to reach heat dissipation the effect of；Furthermore the fan 4 is arranged at the top of the frame 2, and the fan 4 is by the frame Frame 2 has one 3 millimeters of clearance D with should be spaced apart with the radiator 3.

In this present embodiment, which is a COM Express substrates, therefore its main element 11 sends larger thermal energy Central processing unit, and its detachable components 12 is a memory modules, and right the utility model is not limited to COM Express bases Plate can be circuit board that is any while having main element 11 and detachable components 12.

More specifically, which is locked in the top of the circuit board 1 using four locking parts 23, on the circuit board 1 Tool is there are four the screw hole 13 for corresponding to locking part 23, and the frame 2 is not contacted each other with the circuit board 1.As shown in the figure, those screw holes 13 are configured in a manner of non complete symmetry, position in accordance with COM Express substrates specification, commonly used to lock it is existing dissipate Hot substrate so that the assembling between element has directionality, and is then used for the frame 2 that locks in this present embodiment.On the frame 2 First opening 21 and second opening 22 between be connected with each other it is logical, and first opening 21 on the frame 2 with this The intersection of two openings 22 is arranged at this with more two protrusive boards 24 for the radiator 3 and each free opposite direction of the fan 4 On frame 2, and the thickness of the protrusive board 24 is then equal to the clearance D.

Between the radiator 3 and the fan 4 have a clearance D can efficiently reduce the radiating module 1000 in running when Wind cuts sound, avoids generating noise.

In addition, in this present embodiment, the fins group 31 of the radiator 3 as depicted in Fig. 4 with emanant arrangement, and wherein Centre connects the thermally conductive sheet 32, which protrudes the fins group 31, when the radiating module 1000 is arranged on the circuit board 1 When, which contacts to conduct thermal energy to the fins group 31 with the main element 11 of the circuit board 1.Furthermore the fan 4 One air-flow is more provided, is blowed towards the direction of the radiator 3 and the main element 11, the radiator 3 can be assisted to radiate, to increase The effect to radiate to main element 11 by force.In addition, the fan 4 provided it is distinguished and admirable also can partly flow to the detachable components 12 with And the other elements on the circuit board 1, to provide the heat sinking function of integrated circuit plate 1.

If being intended to replace the detachable components 12 on the circuit board, it is removable that user only need to remove this at second opening 22 Element 12 is unloaded, is not necessary to remove the whole radiating module 1000.

[embodiment 2]

Refer to the radiating module 2000 shown in Fig. 5, the radiating module 2000 of the present embodiment generally with 1 phase of embodiment Together, difference is, the radiator 3 and the fan 4 are all arranged at the top of the frame 2, and the thermally conductive sheet of the radiator 3 31 and the fins group 32 protrude past the frame 2 downwards from first opening 21 and contact the main element 11, with conduction Thermal energy caused by the main element 11, and the fan 4 provides air-flow by 3 top of the radiator, towards the fins group 32 and The direction of the main element 11 blows, with effectively by the thermal energy loss of the fins group 32.What the fan 4 was provided distinguished and admirable also may be used The other elements on the detachable components 12 and the circuit board 1 are flowed to, to provide the heat sinking function of integrated circuit plate 1.

[embodiment 3]

Refer to the radiating module 3000 shown in Fig. 6, the radiating module 3000 of the present embodiment generally with 1 phase of embodiment Together, difference is, the radiator 3 and the fan 4 are all arranged at the lower section of the frame 2, the thermally conductive sheet 31 of the radiator 3 Contact the main element 11, and the thermal energy that the main element 11 is generated is transferred to the fins group 32, and the fan 4 is towards the fin The direction of piece group 32 and main element 11 blows, distinguished and admirable caused by the fan 4 to flow to the detachable components 12 and be somebody's turn to do Other elements on circuit board 1, to provide the heat sinking function of integrated circuit plate 1.

The above embodiments are only used for enumerating the embodiment aspect of the utility model and illustrate the technology spy of the utility model Sign is not used for limiting the protection category of the utility model.Any skilled person can unlabored change or isotropism Arrangement belong to the scope that the utility model is advocated, the rights protection scope of the utility model should using claim as It is accurate.

Claims

1. a kind of radiating module, which is characterized in that for a circuit board, which includes a main element and one detachably Element, the radiating module include：

One frame is stacked and placed on the circuit board, which has one first opening and one second opening, wherein, this first is opened The corresponding main element of mouth and the corresponding detachable components of the second opening；And

One radiator corresponds to first opening and is arranged at the frame, and contacted with the main element.

2. radiating module as described in claim 1, which is characterized in that the frame further includes multiple fixed columns, and solid lock is in this Corresponding multiple screw holes on circuit board when so that the frame is stacked and placed on the circuit board, are maintained with the fixed column each other One distance.

3. radiating module as described in claim 1, which is characterized in that first opening communicates with each other or not with second opening Connection.

4. radiating module as described in claim 1, which is characterized in that the detachable components appear from second opening, thereby, It can be replaced via second opening and from the circuit board or the removal detachable components.

5. radiating module as claimed in claim 4, which is characterized in that the radiator corresponds to first opening and is arranged at the frame Above or below frame.

6. radiating module as claimed in claim 5, which is characterized in that the radiator includes a thermally conductive sheet and a fins group, should Thermally conductive sheet is contacted with the main element, which is connected with the thermally conductive sheet and thermal conductivity is led to each other.

7. radiating module as claimed in claim 6, which is characterized in that, should when the radiator is arranged at the top of the frame The thermally conductive sheet of radiator is contacted through first opening of the frame with the main element.

8. radiating module as claimed in claim 6, which is characterized in that a fan is further included, is arranged at the top of the radiator, And an air-flow is provided, it is blowed towards the direction of the fins group and the main element.

9. radiating module as claimed in claim 8, which is characterized in that the air-flow part flows to the detachable components.

10. radiating module as claimed in claim 8, which is characterized in that, should when the radiator is arranged at the lower section of the frame Fan is arranged between the radiator and the frame or is arranged at the top of the frame.

11. radiating module as claimed in claim 8, which is characterized in that when the radiator is arranged at the lower section of the frame and should When fan is arranged at the top of the frame, there is a gap between the radiator and the fan.

12. radiating module as claimed in claim 11, which is characterized in that the gap is between 2~5 millimeters.

13. radiating module as claimed in claim 11, which is characterized in that gap is substantially equivalent to a thickness of the frame.

14. radiating module as described in claim 1, which is characterized in that the main element be a central processing unit or a chip, The detachable components are a memory modules.