TWM543532U - Heat dissipation module - Google Patents

Description

Thermal module

The present invention relates to a heat dissipation module, and more particularly to a heat dissipation module for a circuit board.

With the rapid development of the electronics industry, the amount of computation of the wafers disposed on the circuit board is increased, and the information processing function is accelerated. However, the high-speed computing wafer generates a large amount of thermal energy. If the heat is not properly dissipated, the stability and operating efficiency of the board are degraded, and even the overheating may fail. Therefore, the heat dissipation of the board is very important. In general, heat sink fins or fans are often used to maintain the temperature of the board so that the board can operate stably.

The first figure shows a conventional circuit board and a heat dissipation module, and the heat dissipation module is used to assist the circuit board 1 to dissipate heat. The heat dissipation module includes a substrate 2' and a fin set 3, the substrate 2' is disposed above the circuit board 1, and the fin set 3 is disposed above the substrate 2'. The substrate 2' is in contact with the main components 11 of the circuit board (such as a central processing unit and a chipset), so that thermal energy generated by the main component 11 can be transferred to the substrate 2' and transmitted to the substrate 2'. The fin group 3 is further radiated to the outside by the fin group 3.

However, if a detachable component 12 (such as a memory module) is mounted on the circuit board, if the detachable component 12 is to be replaced or removed, the heat dissipation module needs to be removed, and usually the substrate 2' and the main The contact of the component 11 is coated with a thermal grease. Once the thermal module is removed, the thermal grease is also recoated, and the procedure for replacing the detachable component 12 is extremely complicated. In addition, in addition to the main component 11 on the circuit board, other components (such as the memory module and the power supply component) also need to dissipate heat. Therefore, for a fan-mounted heat sink, the airflow cannot be directly blown to the components due to the presence of the substrate. And affect its heat dissipation performance.

Therefore, there is an urgent need for a novel heat dissipation module that can be combined with a heat dissipation module depending on the type of circuit board, and simplifies the process of replacing the detachable component.

In order to achieve the above purpose, the present invention provides a heat dissipation module to solve the problem that the conventional circuit board is difficult to replace the detachable components on the circuit board after assembling the heat dissipation module.

The heat dissipation module provided by the present invention is used for a circuit board, the circuit board includes a main component and a detachable component, and the heat dissipation module includes: a frame stacked on the circuit board, the frame has a a first opening, and a second opening, wherein the first opening corresponds to the main component, and the second opening corresponds to the detachable component; and a heat sink corresponding to the first opening is disposed on the frame And in contact with the main component.

In one embodiment of the present invention, the frame further includes a plurality of fixing posts that are locked to the corresponding plurality of screw holes on the circuit board such that the frames are stacked on the circuit board Maintain a distance with the fixed column. Wherein, the positions of the plurality of screw holes on the circuit board are determined according to the specifications of various types of circuit boards, and the fixing posts on the frame are further disposed by the screw hole positions of the circuit boards. The length of the fixing post may depend on the position at which the heat sink is disposed, and the frame is spaced from the circuit board such that the heat sink can contact the main component.

In other implementations of the present invention, the shape and size of the first opening and the second opening on the frame are determined according to the type of the circuit board and are not particularly limited as long as the first opening Corresponding to the main component, the second opening corresponds to the detachable component, and the detachable component can be exposed by the second opening. In one embodiment of the present invention, the first opening and the second opening are connected or disconnected from each other, and the detachable component is exposed from the second opening, thereby thereby passing through the second opening The detachable component is replaced or removed from the circuit board.

In a preferred embodiment, the heat sink corresponds to the first opening and is disposed above or below the frame. The heat sink preferably includes a heat conducting sheet and a fin set, the heat conducting sheet being in contact with the main element, and the fin set is connected to the heat conducting sheet and thermally conductive to each other. If the heat sink is disposed above the frame, the heat conductive sheet of the heat sink, or the heat conductive sheet and the fin assembly, should pass through the first opening to be in contact with the main component. The thermal energy generated by the main component can be conducted to the fin set by the thermal pad. In the present creation, the fin group is preferably made of copper, and the aspect of the fin group is not particularly limited as long as it is a fin group used in the art.

In another preferred embodiment, the heat dissipation module further includes a fan disposed above the heat sink and providing an air flow for blowing toward the fin set and the main component. In addition, the airflow can flow to other components of the circuit board, including a portion of the flow to the detachable component to provide heat dissipation.

In a preferred embodiment, when the heat sink is disposed under the frame, the fan is disposed between the heat sink and the frame or above the frame. When the heat sink is disposed below the frame and the fan is disposed above the frame, there is a gap between the heat sink and the fan. The gap is preferably between 2 and 5 mm and is substantially equivalent to one of the thicknesses of the frame. The gap between the heat sink and the fan can reduce the wind cut sound of the heat dissipation module during operation.

In addition, in one embodiment of the present invention, the main component on the circuit board can be a central processing unit, a chip, or other high-speed computing component, and the detachable component is a memory mold. For example, the circuit board can be a COM Express substrate, wherein the main component is a central processing unit, and the detachable component can be a slot memory module.

In summary, the heat dissipation module provided by the present invention can efficiently dissipate heat, and the second opening of the frame can be used to remove or replace the detachable component without removing the entire heat dissipation module. It is only necessary to directly disassemble the detachable component on the circuit board from the second opening, which solves the problem that it is difficult to replace the detachable component on the circuit board.

Those skilled in the art can readily appreciate other advantages and effects of the present disclosure from the disclosure herein. It should be noted that the following drawings are simplified schematic diagrams. The number, shape and size of components in the drawings can be changed arbitrarily according to actual implementation conditions, and the component layout state can be more complicated. The present invention can also be implemented or applied by various other specific embodiments. The details of the present specification can also be modified and changed without departing from the spirit of the present invention.

[Example 1]

The heat dissipation module 1000 of the present embodiment is mounted on a circuit board 1 as shown in the perspective view of the second figure and the exploded view of the third figure. The heat dissipation module 1000 mainly includes a frame 2, a heat sink 3, and a fan 4. The circuit board 1 includes a main component 11 and a detachable component 12; and the frame 2 is mounted on the circuit board 1 and has a first opening 21 and a second opening 22, the first opening 21 is corresponding to the main component 11, and the second opening 22 is corresponding to the detachable component 12; the heat sink 3 is disposed under the frame 2, please refer to the bottom surface of the heat dissipating device described in the fourth figure, The heat sink 3 includes a fin set 31 and a heat conducting sheet 32. The heat conducting sheet 32 of the heat sink 3 is used to contact the main component 11 to transfer heat to the fin set 31 for heat dissipation. The fan 4 is disposed above the frame 2. The fan 4 is spaced apart from the heat sink 3 by the frame 2 and has a gap D of 3 mm.

In this embodiment, the circuit board 1 is a COM Express substrate, so that the main component 11 is a central processor that emits a large amount of thermal energy, and the detachable component 12 is a memory module, but the creation is not Limited to the COM Express substrate, it can be any circuit board having both the main component 11 and the detachable component 12.

In more detail, the frame 2 is locked above the circuit board 1 by means of four locks 23 having four screw holes 13 corresponding to the locks 23, and the frame 2 and the circuit The plates 1 are not in contact with each other. As shown, the screw holes 13 are arranged in an incompletely symmetrical manner, the position of which is in accordance with the specifications of the COM Express substrate, and is generally used to lock a conventional heat dissipation substrate, so that the assembly between the components is directional. In the present embodiment, the frame 2 is locked. The first opening 21 and the second opening 22 of the frame 2 are connected to each other, and the boundary between the first opening 21 and the second opening 22 of the frame 2 has two convex plates 24, The heat sink 3 and the fan 4 are each disposed on the frame 2 in opposite directions, and the thickness of the convex plate 24 is equal to the gap D.

The gap D between the heat sink 3 and the fan 4 can effectively reduce the wind cut sound of the heat dissipation module 1000 during operation and avoid noise.

In addition, in the embodiment, the fin group 31 of the heat sink 3 is arranged in a radial manner as shown in the fourth figure, and the central portion is connected to the heat conducting sheet 32, and the heat conducting sheet 32 protrudes from the fin group. 31. When the heat dissipation module 1000 is disposed on the circuit board 1, the heat conductive sheet 32 is in contact with the main component 11 of the circuit board 1 to conduct thermal energy to the fin group 31. Moreover, the fan 4 further provides an air flow, which is blown toward the heat sink 3 and the main component 11 to assist the heat dissipation of the heat sink 3 to enhance the heat dissipation effect on the main component 11. In addition, the airflow provided by the fan 4 may also partially flow to the detachable component 12 and other components on the circuit board 1 to provide a heat dissipation function of the overall circuit board 1.

If the detachable component 12 on the circuit board is to be replaced, the user only needs to remove the detachable component 12 at the second opening 22 without removing the heat dissipation module 1000 as a whole.

[Embodiment 2]

Referring to the heat dissipation module 2000 shown in FIG. 5 , the heat dissipation module 2000 of the present embodiment is substantially the same as the first embodiment, except that the heat sink 3 and the fan 4 are disposed above the frame 2 . The heat conducting sheet 31 of the heat sink 3 and the fin set 32 protrude downward from the first opening 21 beyond the frame 2 and contact the main element 11 to conduct heat energy generated by the main element 11 . The fan 4 is supplied with airflow from above the heat sink 3, blowing toward the fin set 32 and the main element 11 to effectively dissipate the thermal energy of the fin set 32. The wind flow provided by the fan 4 can also flow to the detachable component 12 and other components on the circuit board 1 to provide the heat dissipation function of the overall circuit board 1.

[Example 3]

The heat dissipation module 3000 of the present embodiment is substantially the same as the first embodiment except that the heat sink 3 and the fan 4 are disposed below the frame 2, The heat conducting sheet 31 of the heat sink 3 contacts the main element 11 and transfers thermal energy generated by the main element 11 to the fin set 32, and the fan 4 faces the fin set 32 and the main element 11 The air flow generated by the fan 4 can flow to the detachable component 12 and other components on the circuit board 1 to provide a heat dissipation function of the overall circuit board 1.

The above-described embodiments are only used to exemplify the embodiments of the present invention, and to explain the technical features of the present invention, and are not intended to limit the scope of protection of the present creation. Any change or equivalence that can be easily accomplished by those skilled in the art is within the scope of this creation. The scope of protection of this creation shall be subject to the scope of the patent application.

1000, 2000, 3000‧‧‧ Thermal Module
1‧‧‧ boards
11‧‧‧ main components
12‧‧‧Removable components
13‧‧‧ screw holes
2‧‧‧Frame
21‧‧‧ first opening
22‧‧‧second opening
23‧‧‧Lock Firmware
24‧‧‧ convex plate
2'‧‧‧Substrate
3‧‧‧heatsink
31‧‧‧Fin group
32‧‧‧thermal sheet
4‧‧‧Fan
D‧‧‧ gap

The first figure is an exploded view of the prior art circuit board and heat sink module. The second figure is a perspective view of the heat dissipation module of the first embodiment of the present invention. The third figure is an exploded view of the heat dissipation module of the creation example 1 of the present invention. The fourth figure is a bottom view of the heat dissipation module of the creation example 1 of the present invention. The fifth figure is a perspective view of the heat dissipation module of the second embodiment of the present invention. The sixth drawing is a perspective view of the heat dissipation module of the third embodiment of the present invention.

1000‧‧‧ Thermal Module

1‧‧‧ boards

12‧‧‧Removable components

2‧‧‧Frame

3‧‧‧heatsink

4‧‧‧Fan

Claims (14)

A heat dissipation module for a circuit board, the circuit board comprising a main component and a detachable component, the heat dissipation module comprising: a frame stacked on the circuit board, the frame having a first opening, and a second opening, wherein the first opening corresponds to the main component, and the second opening corresponds to the detachable component; and a heat sink disposed corresponding to the first opening and the main component contact. The heat dissipation module of claim 1, wherein the frame further comprises a plurality of fixing posts, which are fixed to the corresponding plurality of screw holes on the circuit board, so that the frame is stacked on the circuit board. In the upper direction, a distance is maintained between the fixed columns. The heat dissipation module of claim 1, wherein the first opening and the second opening are connected to each other or not. The heat dissipation module of claim 1, wherein the detachable component is exposed from the second opening, whereby the detachable can be replaced or removed from the circuit board via the second opening element. The heat dissipation module of claim 4, wherein the heat sink corresponds to the first opening and is disposed above or below the frame. The heat dissipation module of claim 5, wherein the heat sink comprises a heat conductive sheet and a fin group, the heat conductive sheet is in contact with the main component, and the fin assembly is connected to the heat conductive sheet. And they are thermally conductive to each other. The heat dissipation module of claim 6, wherein when the heat sink is disposed above the frame, the heat conductive sheet of the heat sink passes through the first opening of the frame, and the main component contact. The heat dissipation module of claim 6, further comprising a fan disposed above the heat sink and providing an air flow for blowing toward the fin set and the main component. The heat dissipation module of claim 8, wherein the airflow portion flows toward the detachable component. The heat dissipation module of claim 8, wherein the fan is disposed between the heat sink and the frame or disposed above the frame when the heat sink is disposed under the frame. The heat dissipation module of claim 8, wherein when the heat sink is disposed under the frame and the fan is disposed above the frame, the heat sink and the fan have a gap therebetween. . The heat dissipation module of claim 11, wherein the gap is between 2 and 5 mm. The heat dissipation module of claim 11, wherein the gap substantially corresponds to a thickness of the frame. The heat dissipation module of claim 1, wherein the main component is a central processing unit or a wafer, and the detachable component is a memory module.