CN210015418U - Static pressure cooling bellows that computer motherboard was used - Google Patents
Static pressure cooling bellows that computer motherboard was used Download PDFInfo
- Publication number
- CN210015418U CN210015418U CN201921171970.2U CN201921171970U CN210015418U CN 210015418 U CN210015418 U CN 210015418U CN 201921171970 U CN201921171970 U CN 201921171970U CN 210015418 U CN210015418 U CN 210015418U
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- Prior art keywords
- splint
- apron
- static pressure
- computer
- main board
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Abstract
The utility model relates to a static pressure cooling bellows for computer motherboard, including fan group, splint and the apron of being connected with fan group, its characterized in that, splint contain first splint and second splint, between first splint and second splint, set up the apron, leave the hole groove that sets up large-scale electronic component in the middle of the apron, the one end of apron connection fan group is the export, the below of the other end of apron is the entry; the utility model discloses have the radiating efficiency of quickening the mainboard, reduce the influence that the functioning speed that the computer caused because mainboard high temperature reduces.
Description
Technical Field
The utility model relates to a computer heat dissipation technology, a static pressure cooling bellows that computer motherboard used.
Background
The computer is a computer with operation function and various electronic components, including PC, server and other devices, usually a main board is installed in the computer for installing most of the electronic components, on the PC host, a case is usually used in the past, a main board is accommodated in the case, and a CPU and other components are installed on the upper door, for the CPU, because the heat dissipation heat quantity is relatively large during the operation, an independent heat sink, usually a combination of a heat dissipation fan and a heat dissipation fin, is usually not provided for other electronic components, and in the case, the temperature is usually relatively high, because all the electronic components can dissipate heat during the operation, especially, on the main board, a plurality of small chips with large and small size are installed above the main board, there are many heat dissipation points and few points, in the past, the free heat dissipation management is usually adopted for these components, with the enhancement of the functions of the electronic elements, the integrated circuits in the single electronic element are more dense, the heat dissipation requirement is high, and large heat is formed inside the case, the temperature inside the case is usually higher, the air in the case is not fast in convection, and the temperature rise is obvious in summer.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a cooling device to the electronic component on the mainboard, strengthens its surface air convection velocity, makes its cooling rate accelerate.
The design idea of the utility model lies in that for the air heat dissipation host, the way of accelerating heat dissipation is usually the following way, firstly, increasing the heat dissipation area, secondly, improving the heat convection velocity, electronic components on the computer motherboard are usually fixed in size, which is inconvenient to change, therefore, it is key to increase the heat convection velocity; if all electronic component are in a passageway, let the air flow velocity of whole passageway accelerate, compare in the space that lets electronic component be in an division, be in a passageway, then its radiating rate is showing and is improving, the utility model discloses utilize this principle design promptly.
The utility model provides a static pressure cooling bellows that computer motherboard was used, includes fan group, splint and the apron of being connected with fan group, splint contain first splint and second splint, between first splint and second splint, set up the apron, leave the hole groove that sets up large-scale electronic component in the middle of the apron, the one end of lap joint fan group is the export, the below of the other one end of apron is the entry.
The hole slot is used for allowing large-scale electronic components to pass through, for example, a CPU is provided with an independent radiator, the whole electronic component is higher in height and therefore is exposed and convenient to manage, and the memory on the mainboard is higher and therefore is exposed, namely, the large-scale independent components such as a display card and the like are arranged on the mainboard through the hole slot, so that space can be reserved for the large-scale components to be independently configured.
Furthermore, a downward baffle is arranged below the hole groove, and a plurality of through holes are formed in the baffle.
The baffle plate has the function of forming a relatively closed channel below the cover plate, and the air flow direction below the cover plate is clear.
The through holes are arranged to allow air to flow outwards at specific positions.
Furthermore, the fan group is composed of one or more fans, the main function of the fan group is the main power of air flow, and the power direction of the fan group can enable air to flow outwards and also enable air to flow inwards.
Further, the width of the inlet position is greater than the width of the outlet position because the fan assembly is located at a higher position, the inlet is higher, the outlet is shorter, and the area of the inlet and the outlet is generally larger, so that the areas of the inlet and the outlet are approximately equal.
The space that apron below and mainboard formed can be regarded as a passageway, and under the certain condition of the amount of wind of fan group, if the passageway is less, the air flow rate of the inside is faster, and like this, its cooling is faster, consequently when setting up, under the condition that does not let the apron contact electronic component, should be close to the mainboard top as far as possible, also need not set up to the narrow way that leads to the jam easily, keeps suitable distance and can let the wind speed appropriate, and the cooling speed reaches better.
Furthermore, the static pressure cooling bellows for the computer mainboard further comprises a bottom plate which is matched with the cover plate and enables the mainboard to be cooled to be in the middle, namely the mainboard is clamped by the bottom plate and the cover plate.
The utility model discloses an implement the step and do: in the mainboard operation process, the fan group also operates, and the fan group is as the exit position, takes out the air of apron below, and cold air gets into from the entry position simultaneously, consequently on the surface of mainboard, the air is at the uniform velocity flow, and the air that flows at the uniform velocity can have certain static pressure to electronic component wherein, takes away the heat on electronic component surface fast.
Drawings
FIG. 1 is a schematic view of a static pressure cooling windbox for a computer main board of an embodiment.
FIG. 2 is a schematic view of a static pressure cooling windbox for a computer main board of an embodiment.
Detailed Description
The present invention will be described in detail with reference to the following embodiments and drawings.
An object of the utility model is to provide a cooling device to the electronic component on the mainboard, strengthens its surface air convection velocity, makes the device that its cooling rate accelerates.
The utility model discloses a design idea lies in, adopt the radiating host computer of air for radiating mode has following approach usually, and is first, increases heat radiating area, and the second, improves hot convection velocity, electronic component all has fixed dimension usually on the computer mainboard, not good change, consequently is the key through improving hot convection velocity, lets all electronic component be in a passageway, lets the air flow speed of whole passageway accelerate, compares in letting electronic component be in a space of opening, is in a passageway, then its radiating rate is showing and is improving, the utility model discloses utilize this principle design promptly.
Referring to fig. 1-2, a static pressure cooling wind box for a computer motherboard comprises a fan set 101, a clamping plate and a cover plate 102 connected with the fan set 101, wherein the clamping plate comprises a first clamping plate 103 and a second clamping plate 104, the cover plate 102 is arranged between the first clamping plate 103 and the second clamping plate 104, a hole groove for arranging large electronic components is reserved in the middle of the cover plate 102, one end of the cover plate 102 connected with the fan set 101 is an outlet 105, and an inlet 106 is arranged below the other end of the cover plate 102.
In fig. 1, electronic components are arranged above a main board 2 to be cooled, and most of the components are not high.
The fan assembly 101 is typically mounted on the chassis with the opening facing outward, as is the inlet 106.
In the present embodiment, the hole slots include a first hole slot 108, a second hole slot 110, and a third hole slot 109.
The hole slot is used for facilitating large-scale electronic components to pass through, for example, a CPU (central processing unit) which is provided with an independent radiator, so that the whole electronic component is higher in height and exposed, a memory vertically inserted into a mainboard is higher, and therefore the mainboard is exposed, and sometimes large-scale independent components such as a display card and the like need to be arranged on the mainboard, so that space can be reserved for the large-scale components to be independently configured.
Specifically, a downward baffle 111 is disposed below the hole groove, and the baffle 111 is provided with a plurality of through holes 112. The baffle 111 encloses the aperture slots.
The baffle 111 functions to form a relatively closed channel under the cover plate 102 so that the air flow direction under the cover plate 102 is well defined.
The through holes 112 are provided at specific positions to allow air to flow in a convection manner, for example, a separate heat dissipation fan is installed above the CPU, and air can flow out of the through holes 112 to the top of the CPU.
Specifically, the fan set 101 includes one or more fans, the main function of the fan set is the main power for air flowing, and the power direction of the fan set 101 may enable air to flow outward or inward.
Specifically, the width of the inlet 106 is greater than the width of the outlet 105 because the fan assembly 101 is located at a higher position, the outlet 105 is located at a higher position, the inlet 106 is located at a lower position, the outlet 105 is located at a higher position, and the inlet 106 is located at a wider position, so that the areas of the inlet 106 and the outlet 105 are approximately equal.
The space that apron 102 below and mainboard 2 formed can be regarded as a passageway, and under the certain condition of the amount of wind of fan group 101, if the passageway is less, the air velocity of the inside is faster, and like this, its cooling is faster, therefore when setting up, under the condition that does not let apron 105 contact electronic component, should be close to mainboard 2 top as far as possible, also need not set up to lead to being close to of jam easily, keeps suitable distance and can lets the wind speed appropriate, and the cooling speed reaches better.
Referring to fig. 2, specifically, the static pressure cooling wind box 1 for computer motherboard further includes a bottom plate 112 matching with the cover plate 102 and having the motherboard to be cooled in the middle, i.e. the bottom plate 112 and the cover plate 102 sandwich the motherboard 2, the bottom plate 112 functions like a guard plate, and the motherboard 2 is mainly in a relatively closed space, so as to accelerate the air circulation, rather than freely dissipate the heat.
It should be noted that the bottom plate 112 may not be provided, since, in general, the main plate 2 is a relatively airtight body.
The fan assembly 101 can be matched with other electronic components of the motherboard to run, for example, when the motherboard is stopped basically, for example, in a standby state, the power saving effect is achieved by reducing the rotation speed of the fan assembly 101.
The utility model discloses an implement the step and do: in the operation process of the motherboard 2, the fan set 101 also operates, the fan set 101 is used as a power source to draw out air below the cover plate 102, and meanwhile, cold air enters from the inlet 106, so that the air flows at a constant speed on the surface of the motherboard 2, the air flowing at the constant speed has a certain static pressure on the electronic components therein, and the air has a significant effect of taking away heat on the surfaces of the electronic components.
The utility model has the advantages that, manufacturing cost is not high, can accelerate the mainboard heat dissipation, and its structure can be installed additional on current computer, is fit for promoting.
The above disclosure is only a preferred embodiment of the present invention, and certainly should not be taken as limiting the scope of the invention, which is defined by the claims and their equivalents.
Claims (5)
1. The utility model provides a static pressure cooling bellows that computer motherboard was used, includes fan group, splint and apron of being connected with fan group, its characterized in that, splint contain first splint and second splint, between first splint and second splint, set up the apron, leave the hole groove that sets up large-scale electronic component in the middle of the apron, the one end of apron connection fan group is the export, the below of the other end of apron is the entry.
2. The cooling air box for a computer main board according to claim 1, wherein a baffle plate is provided downward below the hole groove, and the baffle plate is provided with a plurality of through holes.
3. A static pressure cooling air box for a computer main board according to claim 1, wherein said fan set is composed of one or more fans.
4. A static pressure cooling windbox for a computer motherboard according to claim 1, wherein the width of the inlet position is greater than the width of the outlet position.
5. The cooling air box for a computer main board according to claim 1, further comprising a bottom plate which is fitted to the cover plate and which has the main board to be cooled in the middle, wherein the bottom plate and the cover plate sandwich the main board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201921171970.2U CN210015418U (en) | 2019-07-24 | 2019-07-24 | Static pressure cooling bellows that computer motherboard was used |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201921171970.2U CN210015418U (en) | 2019-07-24 | 2019-07-24 | Static pressure cooling bellows that computer motherboard was used |
Publications (1)
Publication Number | Publication Date |
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CN210015418U true CN210015418U (en) | 2020-02-04 |
Family
ID=69319741
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201921171970.2U Expired - Fee Related CN210015418U (en) | 2019-07-24 | 2019-07-24 | Static pressure cooling bellows that computer motherboard was used |
Country Status (1)
Country | Link |
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CN (1) | CN210015418U (en) |
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2019
- 2019-07-24 CN CN201921171970.2U patent/CN210015418U/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200204 Termination date: 20200724 |