CN206323726U - Heat abstractor - Google Patents
Heat abstractor Download PDFInfo
- Publication number
- CN206323726U CN206323726U CN201621452152.6U CN201621452152U CN206323726U CN 206323726 U CN206323726 U CN 206323726U CN 201621452152 U CN201621452152 U CN 201621452152U CN 206323726 U CN206323726 U CN 206323726U
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- CN
- China
- Prior art keywords
- noumenon
- heat
- circuit board
- heat abstractor
- conducting medium
- Prior art date
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Abstract
The utility model discloses a kind of heat abstractor, the first noumenon and the second body are included.The first noumenon is detachably arranged in circuit board.The detachably connected the first noumenon of second body, and the opening being connected and accommodation space are collectively forming with the first noumenon.Opening is positioned at the side of the first noumenon and the second body.Therefore, heat abstractor of the present utility model radiated in two groups of electronic building bricks on circuit board to that can be arranged above and below respectively by the first noumenon with the second body.
Description
Technical field
The utility model relates to a kind of heat abstractor.
Background technology
In recent years, to realize the maximization of economic benefit, in the market is pursuing the motherboard of high benefit always.In order in master
The disposal ability of motherboard is improved in limited space as far as possible on machine plate, and the electronic building brick density having led on motherboard is continuous
Increase, radiating burden is constantly aggravated.
For known motherboard, many electronic building bricks can be all plugged thereon, for example, central processing unit (Central
Processing Unit, CPU), north and south bridge chip, display chip, memory modules etc..If these electronic building bricks are not produced in real time
Raw heat is efficiently excluded, the situation for gently shutting down then easily motherboard, and motherboard may be then burnt when serious.
If general motherboard front can be with connector without unnecessary space, the way being currently known all is to put connector
Put the back side of motherboard.However, connector is placed in the design and inconvenient user's dismounting of main frame back, and main frame backboard
Face does not simultaneously have heat abstractor, therefore it is poor to radiate.If being intended to be changed to be placed in by connector the front of motherboard, still need to consider
Board is being plugged to connector, and board may be with the electronic building brick recurring structure interference being disposed below or because distance
Cross near and cause the problems such as radiating is difficult.
Utility model content
The purpose of this utility model is to provide a kind of heat abstractor, its can by the first noumenon with the second body respectively to upper
Under two groups of electronic building bricks being arranged on circuit board radiated.
According to above-mentioned purpose, the utility model provides a kind of heat abstractor and includes the first noumenon and the second body.First
Body is detachably arranged in circuit board.The detachably connected the first noumenon of second body, and it is collectively forming phase with the first noumenon
The opening and accommodation space of connection.Opening is positioned at the side of the first noumenon and the second body.
According to one or more embodiments of the present utility model, heat abstractor also bag heat-conducting medium, wherein the first noumenon tool
There is the outer surface away from the second body, and outer surface offer heat-conducting medium is detachably connected.
According to one or more embodiments of the present utility model, heat abstractor also includes fixation kit, is configured to the
One body is fixed on circuit board so that gap is formed between outer surface and circuit board.
According to one or more embodiments of the present utility model, wherein fixation kit is included：Nut, be configured at outer surface with
To be separated out gap between circuit board；And screw, through circuit board, and sequentially lock with nut and first body phase.
According to one or more embodiments of the present utility model, heat abstractor also includes heat-conducting medium, wherein the first noumenon
Part formed accommodation space inner surface, and inner surface provide heat-conducting medium it is detachably connected.
According to one or more embodiments of the present utility model, heat abstractor also includes heat-conducting medium, wherein the second body
Part formed accommodation space inner surface, and inner surface provide heat-conducting medium it is detachably connected.
According to one or more embodiments of the present utility model, heat abstractor also includes locking part, with the first noumenon that locks
With the second body.
Heat abstractor provided by the utility model after combination comprising can form the opening being connected and accommodation space
The first noumenon and the second body.The first noumenon is removable installed on circuit board, therefore can be contacted via the first heat-conducting medium
The first electronic building brick on circuit board is to be radiated.If circuit board is additionally provided with the second electronic building brick above the first electronic building brick
When, then the second body can be incorporated into the first noumenon again, accommodating sky is arranged in via opening make it that the second electronic building brick is presented
Between in structure configuration, and make it that the second body contacts the second electronic building brick to be radiated via the second heat-conducting medium.
If in addition, only needing to radiate to the second electronic building brick being arranged in accommodation space, user can lead first
Thermal medium is disassembled, and is changed to be arranged on the inner surface of the part of the first noumenon formation accommodation space so that the first noumenon
Also it can contact the second electronic building brick to be radiated via the first heat-conducting medium.
Brief description of the drawings
Figure 1A is the heat abstractor and the three-dimensional combination figure of circuit board according to the embodiment of the utility model one.
Figure 1B is the heat abstractor and the members exploded view of circuit board in Figure 1A.
Fig. 2 is the heat abstractor and profile of the circuit board along line segment 2-2 in Figure 1A.
Fig. 3 is the heat abstractor and the profile of circuit board according to another embodiment of the utility model.
Embodiment
Figure 1A be refer to Fig. 2.Figure 1A is the heat abstractor 100 and circuit board according to the embodiment of the utility model one
200 three-dimensional combination figure.Figure 1B is the heat abstractor 100 and the members exploded view of circuit board 200 in Figure 1A.Fig. 2 is figure
Heat abstractor 100 and profile of the circuit board 200 along line segment 2-2 in 1A.As shown in Figure 1A to Fig. 2, in present embodiment
In, heat abstractor 100 includes the first noumenon 110.
The first noumenon 110 is detachably arranged in circuit board 200.Therefore, the heat abstractor 100 of present embodiment can pass through
The first noumenon 110 radiates to the electronic building brick on circuit board 200.For example, in the present embodiment, circuit board 200
On be provided with South Bridge chip 210, therefore heat abstractor 100 can be radiated by the first noumenon 110 to South Bridge chip 210.
Furthermore, it is understood that in the present embodiment, M.2 connector 220a is additionally provided with circuit board 200, and M.2 connect
Device 220a, which is available for M.2 blocking 220b, to be plugged so that M.2 block 220b it is hanging and positioned at the top of South Bridge chip 210.In an embodiment
In, South Bridge chip 210 is arranged at the same face of circuit board 200, therefore the circuit board of present embodiment with M.2 connector 220a
The motherboard that 200 electronic building brick configuration is suitable for ITX form factor specifications is used.
By taking the motherboard of ITX form factor specifications as an example, because South Bridge chip 210 and M.2 card 220b is in circuit board
It is in be arranged above and below on 200, therefore heat produced during both operations may interact.If both is not produced in real time
Heat efficiently exclude, the situation for gently shutting down then easily circuit board 200 may then burn circuit board when serious
200。
In this regard, the heat abstractor 100 of present embodiment also includes the second body 120.Second body 120 is detachably connected
The first noumenon 110, and the open S 1 being connected and accommodation space S2 are collectively forming with the first noumenon 110.Open S 1 is located at the
The side of one body 110 and the second body 120.Therefore, can be again by the after M.2 card 220b is plugged to M.2 connector 220a
Two bodies 120 are connected to the first noumenon 110 so that M.2 block 220b and the knot being arranged in via open S 1 in accommodation space S2 is presented
Structure is configured.Whereby, the heat abstractor 100 of present embodiment can further by 120 pairs of the second body, M.2 card 220b be dissipated
Heat.In other words, the heat abstractor 100 of present embodiment can be by the body 120 of the first noumenon 110 and second respectively to arranging up and down
The South Bridge chip 210 being listed on circuit board 200 is radiated with M.2 card 220b.
Specifically, as shown in Fig. 2 in the present embodiment, heat abstractor 100 further includes the first heat-conducting medium
130 and second heat-conducting medium 140.The first noumenon 110 has the outer surface 111 away from the second body 120.
The outer surface 111 of the first noumenon 110 is available for the first heat-conducting medium 130 detachably connected.The portion of second body 120
Divide the second inner surface 121 for forming accommodation space S2.Second inner surface 121 of the second body 120 provides the second heat-conducting medium 140
It is detachably connected.Whereby, the heat abstractor 100 of present embodiment is not only situated between using the first noumenon 110 via the first heat conduction
South Bridge chip 210 on the contact circuit board 200 of matter 130, can also be further using the second body 120 via second to be radiated
M.2 heat-conducting medium 140 is contacted block 220b to be radiated.
It should be noted that, if circuit board 200 is in M.2 connector 220a and does not plug the behaviour in service for M.2 blocking 220b, use
The first noumenon 110 of heat abstractor 100 only can be configured on circuit board 200 by family, and the second body 120 is then not required to be incorporated into
On the first noumenon 110.
In addition, the heat abstractor 100 of present embodiment further comprises fixation kit 150.Fixation kit 150 is configured
So that the first noumenon 110 is fixed on into the top of circuit board 200 so that between the outer surface 111 of the first noumenon 110 and circuit board 200
Form clearance G.
Specifically, fixation kit 150 includes nut 151 and screw 152.Nut 151 is configured at the first noumenon 110
To be separated out clearance G between outer surface 111 and circuit board 200.Screw 152 pass through circuit board 200, and sequentially with nut 151 and
The first noumenon 110 mutually locks.However, the construction of fixation kit 150 is not limited with this embodiment.As long as can provide first
Body 110 is fixed on the top of circuit board 200, and to form clearance G between the outer surface 111 of the first noumenon 110 and circuit board 200
Function design, all can as the fixation kit 150 of present embodiment substitute.
The heat abstractor 100 of present embodiment further comprises locking part 160, and it is the first noumenon 110 that locks
With the second body 120.However, the connected mode between the body 120 of the first noumenon 110 and second is not limited thereto.At other
In embodiment, the first noumenon 110 can be also connected with each other with the second body 120 by snap-in structure.In some embodiments
In, locking part 160 is alternatively screw, but the utility model is not limited thereto.
Fig. 3 is refer to, it is to illustrate the heat abstractor 100 and circuit board 200 according to another embodiment of the utility model
Profile.As shown in figure 3, in the present embodiment, heat abstractor 100 equally comprising the first noumenon 110, the second body 120,
First heat-conducting medium 130, the second heat-conducting medium 140, fixation kit 150 and locking part 160, thus these components can refer to
Upper related description, pardons do not repeat herein.
It is noted that being present embodiment in place of present embodiment is compared to the difference of the embodiment shown in Fig. 2
Heat abstractor 100 be applied to be not provided with the circuit board 300 of South Bridge chip 210 shown in Fig. 2 below M.2 card 320b.
Specifically, the first heat-conducting medium 130 of the outer surface 111 that script can be connected to the first noumenon 110 by user is disassembled,
And be changed to be arranged on the part of the first noumenon 110 formation accommodation space S2 the first inner surface 112 so that the first noumenon 110
Also M.2 can be contacted via the first heat-conducting medium 130 block 320b to be radiated.In other words, the heat abstractor of present embodiment
The 100 M.2 card 220b that can be pointed to simultaneously in accommodation space S2 with the second body 120 by the first noumenon 110 are radiated, and are entered
And the radiating efficiency to M.2 blocking 220b can be significantly increased.
In one embodiment, the first heat-conducting medium 130 is for repeated adhesion heat conductive rubber pad, but the utility model is not
As limit.
To the detailed description in this embodiment of the present utility model more than, it is apparent that the utility model
The heat abstractor provided can form the first noumenon and the second body of the opening being connected and accommodation space after including combination.
The first noumenon is removable installed in the first noumenon on circuit board, therefore can be contacted via the first heat-conducting medium on circuit board
First electronic building brick is to be radiated.
If circuit board is additionally provided with the second electronic building brick above the first electronic building brick, the second body can be incorporated into again
The first noumenon, is configured, and cause second with make it that the structure being arranged in via opening in accommodation space is presented in the second electronic building brick
Body contacts the second electronic building brick to be radiated via the second heat-conducting medium.If in addition, only needing to being arranged in accommodation space
The second electronic building brick radiated, then user can disassemble the first heat-conducting medium, and be changed to be arranged at the first noumenon
Part formed accommodation space inner surface on so that the first noumenon also can via the first heat-conducting medium contact the second electronic building brick with
Radiated.
Although the utility model is disclosed as above with embodiment, so it is not limited to the utility model, any affiliated
Those skilled in the art, are not departing from spirit and scope of the present utility model, when can make a little change and retouching, therefore
Protection domain of the present utility model is when depending on being defined that claims are defined.
Claims (7)
1. a kind of heat abstractor, it is characterised in that include：
The first noumenon, is detachably arranged in circuit board；And
Second body, the detachably connected the first noumenon, and with the first noumenon be collectively forming the opening being connected with
And accommodation space, wherein the opening is located at the side of the first noumenon and second body.
2. heat abstractor according to claim 1, it is characterised in that also comprising heat-conducting medium, wherein the first noumenon
With the outer surface away from second body, and the outer surface offer heat-conducting medium is detachably connected.
3. heat abstractor according to claim 2, it is characterised in that also comprising fixation kit, the fixation kit by with
Put the first noumenon being fixed on the circuit board so that between being formed between the outer surface and the circuit board
Gap.
4. heat abstractor according to claim 3, it is characterised in that wherein described fixation kit is included：
Nut, is configured between the outer surface and the circuit board to be separated out the gap；And
Screw, through the circuit board, and sequentially locks with the nut and the first body phase.
5. heat abstractor according to claim 1, it is characterised in that also comprising heat-conducting medium, wherein the first noumenon
Part form the inner surface of the accommodation space, and to provide the heat-conducting medium detachably connected for the inner surface.
6. heat abstractor according to claim 1, it is characterised in that also comprising heat-conducting medium, wherein second body
Part form the inner surface of the accommodation space, and to provide the heat-conducting medium detachably connected for the inner surface.
7. heat abstractor according to claim 1, it is characterised in that also comprising locking part, with the first noumenon that locks
With second body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621452152.6U CN206323726U (en) | 2016-12-27 | 2016-12-27 | Heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621452152.6U CN206323726U (en) | 2016-12-27 | 2016-12-27 | Heat abstractor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206323726U true CN206323726U (en) | 2017-07-11 |
Family
ID=59259741
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621452152.6U Active CN206323726U (en) | 2016-12-27 | 2016-12-27 | Heat abstractor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206323726U (en) |
-
2016
- 2016-12-27 CN CN201621452152.6U patent/CN206323726U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |