TWM459676U - Server device - Google Patents
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- TWM459676U TWM459676U TW102208257U TW102208257U TWM459676U TW M459676 U TWM459676 U TW M459676U TW 102208257 U TW102208257 U TW 102208257U TW 102208257 U TW102208257 U TW 102208257U TW M459676 U TWM459676 U TW M459676U
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 7
- 239000010931 gold Substances 0.000 claims description 7
- 229910052737 gold Inorganic materials 0.000 claims description 7
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 230000004308 accommodation Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
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Abstract
Description
本新型是有關於一種伺服器裝置。The present invention relates to a server device.
隨著電子科技的發展，伺服器已成為業界廣為使用的資訊處理系統。伺服器係為網路系統中服務各電腦之核心電腦，可提供網路使用者需要之磁碟與列印服務等功能，同時也可供各用戶端彼此分享網路環境內之各項資源。With the development of electronic technology, the server has become an information processing system widely used in the industry. The server is the core computer that serves each computer in the network system. It can provide the functions of the disk and printing services required by the network users, and also allows each client to share resources in the network environment with each other.
一般來說，伺服器裝置中通常設有主機板模組及硬碟陣列等構件。為了供應主機板模組及硬碟陣列運作所需的電力，需設置一電源供應模組電性連接主機板模組及硬碟陣列。以目前而言，電源供應模組通常包括一或多個殼體、電源供應器與多塊電路板。透過電路板上的纜線將電能傳輸至上述的主機板模組及硬碟陣列。但目前的電路板皆設置於殼體內，且纜線需由殼體內穿出至殼體外，故在裝配上較為費工費時，且成本耗費較高。因此，目前亟需一種改良的電源供應模組，具有較為簡單的結構，使其易於裝配，以降低成本。Generally, a server device module and a hard disk array are usually provided in the server device. In order to supply the power required for the operation of the motherboard module and the hard disk array, a power supply module is required to be electrically connected to the motherboard module and the hard disk array. At present, a power supply module usually includes one or more housings, a power supply, and a plurality of circuit boards. Power is transmitted to the above-described motherboard module and hard disk array through cables on the circuit board. However, the current circuit boards are all disposed in the casing, and the cables need to be passed out of the casing to the outside of the casing, so that it is time-consuming and time consuming to assemble, and the cost is high. Therefore, there is an urgent need for an improved power supply module that has a relatively simple structure that makes it easy to assemble to reduce costs.
本新型的目的在於提供一種伺服器裝置，使連接模組的結構簡單化，以降低成本。The purpose of the present invention is to provide a server device that simplifies the structure of the connection module to reduce costs.
本新型之一態樣提供一種伺服器裝置，其包含一機殼、一電源供應模組、一連接模組以及一用電模組。機殼具有一側壁。電源供應模組位於機殼內，且毗鄰機殼之側壁。連接模組位於機殼內，且直接連接電源供應模組，且包含第一背板及一第二背板。第一背板位於電源供應模組之一側面上，且垂直於側壁，且包含一第一部件及一第二部件。第一部件設置於第一背板之一表面上，且無線電性連接電源供應模組。第二部件設置於第一背板之一邊緣上。第二背板與機殼之側壁大致平行且直接固定於側壁上。第二背板包含一第三部件及一連接器設置於第二背板之一表面上。第三部件無線電性連接第一背板之第二部件。用電模組通過線纜電性連接第二背板之連接器，以接收來自於電源供應模組之電能。One aspect of the present invention provides a server device including a casing, a power supply module, a connection module, and a power module. The casing has a side wall. The power supply module is located inside the casing and adjacent to the side wall of the casing. The connection module is located in the casing and directly connected to the power supply module, and includes a first backboard and a second backplane. The first backplane is located on one side of the power supply module and perpendicular to the sidewall, and includes a first component and a second component. The first component is disposed on a surface of the first backplane and is electrically connected to the power supply module. The second component is disposed on an edge of one of the first backplanes. The second backing plate is substantially parallel to the side wall of the casing and is directly fixed to the side wall. The second backboard includes a third component and a connector disposed on a surface of the second backplane. The third component is wirelessly coupled to the second component of the first backplane. The power module is electrically connected to the connector of the second backplane through the cable to receive power from the power supply module.
根據本新型一實施方式，第二部件包含多個金手指，第三部件為連接埠插槽。According to an embodiment of the invention, the second component comprises a plurality of gold fingers and the third component is a connection port.
根據本新型一實施方式，第一背板包含至少一散熱孔設置於第一背板上。According to an embodiment of the present invention, the first backplane includes at least one heat dissipation hole disposed on the first backplane.
根據本新型一實施方式，用電模組包含一主機板，以電性連接主機板。According to an embodiment of the present invention, the power module includes a motherboard for electrically connecting the motherboard.
根據本新型一實施方式，第二背板包含一穿孔設置於第二背板上。According to an embodiment of the present invention, the second backboard includes a through hole disposed on the second backplane.
根據本新型一實施方式，第二背板藉由穿過穿孔之螺釘鎖固於該側壁上。According to an embodiment of the present invention, the second backboard is fixed to the side wall by a screw passing through the through hole.
根據本新型一實施方式，第二背板垂直向電性連接第一背板。According to an embodiment of the present invention, the second backplane is electrically connected to the first backplane vertically.
根據本新型一實施方式，第一背板大致平行電源供應模組之側面。According to an embodiment of the present invention, the first backplane is substantially parallel to the side of the power supply module.
根據本新型一實施方式，第一部件之數量為二個，電源供應模組之數量為二個，此二個第一部件分別對應此二個電源供應模組。According to an embodiment of the present invention, the number of the first components is two, and the number of the power supply modules is two, and the two first components respectively correspond to the two power supply modules.
根據本新型一實施方式，第一部件為連接埠插槽，電源供應模組還包含一殼體及設置於殼體內的一內置電路板，該內置電路板設有複數金手指並插接於該第一部件。According to an embodiment of the present invention, the first component is a connection slot, the power supply module further includes a housing and a built-in circuit board disposed in the housing, the built-in circuit board is provided with a plurality of gold fingers and is inserted into the The first part.
在本新型之上述實施方式中，由於第一背板設置於電源供應模組的側面上，第二背板大致平行且直接固定於機殼的側壁上，故不需設置任何殼體容置第一背板及第二背板。因此連接模組的結構十分簡單且成本低，而可降低組裝的難度及節省組裝的時間。In the above embodiment of the present invention, since the first backplane is disposed on the side of the power supply module, the second backplane is substantially parallel and directly fixed to the sidewall of the casing, so that no housing accommodation is required. A backboard and a second backboard. Therefore, the structure of the connection module is very simple and low in cost, which can reduce the difficulty of assembly and save assembly time.
10‧‧‧伺服器裝置10‧‧‧Server device
110‧‧‧機殼110‧‧‧Shell
110a、110b‧‧‧側壁110a, 110b‧‧‧ side wall
120‧‧‧電源供應模組120‧‧‧Power supply module
120a‧‧‧側面120a‧‧‧ side
122‧‧‧殼體122‧‧‧ housing
124‧‧‧內置電路板124‧‧‧ Built-in board
130‧‧‧連接模組130‧‧‧Connecting module
132‧‧‧第一背板132‧‧‧First backplane
132a‧‧‧表面132a‧‧‧ surface
132e‧‧‧邊緣132e‧‧‧ edge
132h‧‧‧穿孔132h‧‧‧Perforation
132w‧‧‧散熱孔132w‧‧‧ vents
1322‧‧‧第一部件1322‧‧‧ first part
1324‧‧‧第二部件1324‧‧‧ second part
134‧‧‧第二背板134‧‧‧second backplane
134h‧‧‧穿孔134h‧‧‧Perforation
1342‧‧‧第三部件1342‧‧‧ third part
1344‧‧‧連接器1344‧‧‧Connector
1346‧‧‧線纜1346‧‧‧ Cable
140‧‧‧用電模組140‧‧‧Power Module
142‧‧‧主機板142‧‧‧ motherboard
第1圖係繪示依照本新型一實施方式之伺服器裝置的立體圖。1 is a perspective view of a server device in accordance with an embodiment of the present invention.
第2A-2B圖係繪示第1圖之第一背板的側視圖。2A-2B is a side view showing the first back plate of Fig. 1.
第3圖係繪示繪示第1圖之第二背板的側視圖。Figure 3 is a side elevational view showing the second backing plate of Figure 1.
以下將以圖式揭露本新型之複數個實施方式，為明確說明起見，許多實務上的細節將在以下敘述中一併說明。然而，應瞭解到，這些實務上的細節不應用以限制本新型。也就是說，在本新型部分實施方式中，這些實務上的細節是非必要的。此外，為簡化圖式起見，一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。The embodiments of the present invention are disclosed in the following drawings, and for the sake of clarity, the details of the invention are described in the following description. However, it should be understood that these practical details are not intended to limit the novel. That is to say, in some embodiments of the present invention, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings.
第1圖係繪示依照本新型一實施方式之伺服器裝置10的立體圖。伺服器裝置10包含機殼110、電源供應模組120、連接模組130以及用電模組140。1 is a perspective view of a server device 10 in accordance with an embodiment of the present invention. The server device 10 includes a casing 110, a power supply module 120, a connection module 130, and a power module 140.
機殼110可由多塊側板(未繪示)構成，而其中一側板具有側壁110a，另一側板具有另一側壁110b。在伺服器裝置10的機殼110內，可設置一個以上的電源供應模組120。如第1圖所示，在機殼110內設有兩個電源供應模組120。電源供應模組120包含殼體122、電源供應器(未繪示)及內置電路板124。電源供應器及內置電路板124設置於殼體122內，而內置電路板124的一部分顯露於電源供應模組120的側面120a之外。內置電路板124中外露的部分可包含金手指(未繪示)，以無線電性連接連接模組130。另外，電源供應模組120更可包含一電源接頭(未繪示)顯露於側壁110b之外。電源接頭可與外部電源(未繪示)相互連接，以接收外部電源所提供的交流電，再透過電源供應器將交流電轉換為直流電。電源接頭可例如為兩孔或三孔的 母插頭。The casing 110 may be composed of a plurality of side plates (not shown), wherein one side plate has a side wall 110a and the other side plate has another side wall 110b. In the casing 110 of the server device 10, more than one power supply module 120 may be provided. As shown in FIG. 1, two power supply modules 120 are provided in the casing 110. The power supply module 120 includes a housing 122, a power supply (not shown), and a built-in circuit board 124. The power supply and the built-in circuit board 124 are disposed in the housing 122, and a portion of the built-in circuit board 124 is exposed outside the side 120a of the power supply module 120. The exposed portion of the built-in circuit board 124 may include a gold finger (not shown) to connect the module 130 in a radio connection. In addition, the power supply module 120 further includes a power connector (not shown) exposed outside the sidewall 110b. The power connector can be connected to an external power source (not shown) to receive the AC power provided by the external power source, and then convert the AC power to DC power through the power supply. The power connector can be, for example, two or three holes Female plug.
連接模組130位於機殼110內，其係直接連接電源供應模組120。連接模組130包含第一背板132及第二背板134。以下將詳述第一背板132及第二背板134的的技術特徵。The connection module 130 is located in the casing 110 and is directly connected to the power supply module 120. The connection module 130 includes a first back plate 132 and a second back plate 134. The technical features of the first backing plate 132 and the second backing plate 134 will be described in detail below.
第一背板132位於電源供應模組120的側面120a上，且垂直於側壁110a。詳細而言，第一背板132大致平行且靠近電源供應模組120的側面120a，但未接觸側面120a。在一實施方式中，第一背板132包含一穿孔132h。藉由穿過穿孔132h的螺釘(未繪示)，可將第一背板132鎖固於側面120a上。The first backplane 132 is located on the side 120a of the power supply module 120 and perpendicular to the sidewall 110a. In detail, the first backing plate 132 is substantially parallel and close to the side surface 120a of the power supply module 120, but does not contact the side surface 120a. In an embodiment, the first backing plate 132 includes a through hole 132h. The first backing plate 132 can be locked to the side surface 120a by screws (not shown) passing through the through holes 132h.
第2A-2B圖係繪示第1圖之第一背板132的側視圖。第一背板132為電路板，其包含第一部件1322及第二部件1324，如第2A-2B圖所示。第一部件1322設置於第一背板132的表面132a上，且表面132a係朝向第1圖所示的電源供應模組120的側面120a，使第一部件1322能夠無線電性連接電源供應模組120。本申請中的無線電性連接即不是利用線纜進行的電性連接。第一背板132具有兩個第一部件1322，各第一部件1322對應第1圖所示的電源供應模組120的內置電路板124，以無線電性連接內置電路板124。第一部件1322例如為連接埠插槽。內置電路板124的金手指可插接於第一部件1322的連接埠插槽之中。另一方面，第二部件1324設置於第一背板132的邊緣132e上。如第2B圖所示，第二部件1324包含多個金手指。2A-2B is a side view showing the first backing plate 132 of Fig. 1. The first backplane 132 is a circuit board that includes a first component 1322 and a second component 1324, as shown in Figures 2A-2B. The first component 1322 is disposed on the surface 132a of the first backplane 132, and the surface 132a faces the side 120a of the power supply module 120 shown in FIG. 1, so that the first component 1322 can be wirelessly connected to the power supply module 120. . The radio connection in this application is not an electrical connection made by a cable. The first back plate 132 has two first members 1322. Each of the first members 1322 corresponds to the built-in circuit board 124 of the power supply module 120 shown in FIG. 1 to electrically connect the built-in circuit board 124. The first component 1322 is, for example, a port slot. The gold finger of the built-in circuit board 124 can be inserted into the port slot of the first component 1322. On the other hand, the second member 1324 is disposed on the edge 132e of the first backing plate 132. As shown in FIG. 2B, the second component 1324 includes a plurality of gold fingers.
在一實施方式中，第一背板132更包含至少一散熱孔132w設置於第一背板132上。故電源供應模組120運作時所產生的熱能可藉由散熱孔132w散出，以避免電源供應模組120發生過熱情形。In one embodiment, the first back plate 132 further includes at least one heat dissipation hole 132w disposed on the first back plate 132. Therefore, the heat generated by the power supply module 120 can be dissipated through the heat dissipation holes 132w to avoid overheating of the power supply module 120.
接著回到第1圖，第二背板134係垂直向電性連接第一背板132。重要的是，第二背板134與機殼110的側壁110a大致平行，且第二背板134直接固定於側壁110a上，因此不需設置任何殼體容置第二背板134，使連接模組130的結構變得簡單而易於裝配。Returning to FIG. 1 , the second backing plate 134 is electrically connected to the first backing plate 132 in a vertical direction. The second backing plate 134 is substantially parallel to the side wall 110a of the casing 110, and the second backing plate 134 is directly fixed to the side wall 110a. Therefore, it is not necessary to provide any casing for accommodating the second backing plate 134. The structure of the group 130 becomes simple and easy to assemble.
第3圖係繪示第1圖之第二背板134的示意圖。如第3圖所示，第二背板134包含第三部件1342及至少一連接器1344設置於第二背板134之表面134a上。如第1圖所示，第三部件1342無線電性連接第一背板132的第二部件1324。第三部件1342例如為對應第二部件1324所設置的連接埠插槽。連接器1344係電性連接第1圖所示的用電模組140，以傳輸電源供應模組120之電能至用電模組140。第二背板134可更包含線纜1346，其一端插在連接器1344上，另一端插在用電模組140上，以將電能傳輸至用電模組140。換言之，用電模組140通過線纜1346電性連接連接器1344，以接收來自於電源供應模組120之電能。3 is a schematic view showing the second backing plate 134 of FIG. 1. As shown in FIG. 3, the second backing plate 134 includes a third component 1342 and at least one connector 1344 disposed on a surface 134a of the second backing plate 134. As shown in FIG. 1, the third component 1342 is wirelessly coupled to the second component 1324 of the first backing plate 132. The third component 1342 is, for example, a port slot corresponding to the second component 1324. The connector 1344 is electrically connected to the power module 140 shown in FIG. 1 to transmit the power of the power supply module 120 to the power module 140. The second backplane 134 can further include a cable 1346, one end of which is inserted into the connector 1344 and the other end of which is inserted into the power module 140 to transmit power to the power module 140. In other words, the power module 140 is electrically connected to the connector 1344 through the cable 1346 to receive power from the power supply module 120.
在一實施方式中，第二背板134更包含至少一穿孔134h設置於第二背板134上。藉由穿過穿孔134h的螺釘(未繪示)，可將第二背板134直接鎖固於側壁110a上。故本新型之實施方式不需設置任何殼體容置第二背板134。In an embodiment, the second backing plate 134 further includes at least one through hole 134h disposed on the second backing plate 134. The second backing plate 134 can be directly locked to the side wall 110a by screws (not shown) passing through the through holes 134h. Therefore, the embodiment of the present invention does not need to provide any housing to accommodate the second backing plate 134.
在一實施方式中，用電模組140包含主機板142，如第1圖所示。當然，用電模組140也可包含硬碟陣列(未繪示)或其他元件，而不限於第1圖所例示者。故第二背板134可包括多個連接器1344及多組線纜1346，以分別供應電能至主機板142、硬碟陣列及其他元件。In one embodiment, the power module 140 includes a motherboard 142, as shown in FIG. Of course, the power module 140 may also include a hard disk array (not shown) or other components, and is not limited to the one illustrated in FIG. Therefore, the second backplane 134 can include a plurality of connectors 1344 and a plurality of sets of cables 1346 to supply power to the motherboard 142, the hard disk array, and other components, respectively.
以下將簡述伺服器裝置10的其中一種組裝方式。首先，將第二背板134固定於機殼110的側壁110a上。然後，將第一背板132的第二部件1324插入到第二背板134的第三部件1342的插槽之中。再將電源供應模組120的內置電路板124對準並插入到第一背板132的第一部件1322的插槽之中。至於用電模組140，只要在第二背板134固定完畢後再進行組裝即可。當然於實際應用中，本新型之伺服器裝置10的組裝方式並不限於此，任何熟習此技藝者可作任何適當的更動。One of the assembly methods of the server device 10 will be briefly described below. First, the second backing plate 134 is fixed to the side wall 110a of the casing 110. The second component 1324 of the first backing plate 132 is then inserted into the slot of the third component 1342 of the second backing plate 134. The built-in circuit board 124 of the power supply module 120 is then aligned and inserted into the slot of the first component 1322 of the first backplane 132. As for the power module 140, it is only necessary to assemble the second backing plate 134 after it has been fixed. Of course, in practical applications, the manner of assembly of the server device 10 of the present invention is not limited thereto, and any person skilled in the art can make any appropriate changes.
由上述可瞭解，本新型之伺服器裝置中的連接模組係直接連接電源供應模組。連接模組包括第一背板與第二背板，但不包括殼體。由於第一背板設置於電源供應模組的側面上，第二背板大致平行且直接固定於機殼的側壁上，故不需設置任何殼體容置第一背板及第二背板。因此連接模組的結構十分簡單且成本低，可降低組裝的難度及節省組裝的時間，以解決習知技術所面臨的問題。It can be understood from the above that the connection module in the server device of the present invention is directly connected to the power supply module. The connection module includes a first backboard and a second backplane, but does not include a housing. Since the first backplane is disposed on the side of the power supply module, the second backplane is substantially parallel and directly fixed to the sidewall of the casing, so that no casing is required to accommodate the first backboard and the second backplane. Therefore, the structure of the connection module is very simple and low in cost, which can reduce the difficulty of assembly and save assembly time, so as to solve the problems faced by the prior art.
雖然本新型已以實施方式揭露如上，然其並非用以限定本新型，任何熟習此技藝者，在不脫離本新型之精神和範圍內，當可作各種之更動與潤飾，因此本新型之保護 範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Any one skilled in the art can make various changes and retouchings without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.
10‧‧‧伺服器裝置10‧‧‧Server device
110‧‧‧機殼110‧‧‧Shell
110a、110b‧‧‧側壁110a, 110b‧‧‧ side wall
120‧‧‧電源供應模組120‧‧‧Power supply module
120a‧‧‧側面120a‧‧‧ side
122‧‧‧殼體122‧‧‧ housing
124‧‧‧電路板124‧‧‧Circuit board
130‧‧‧連接模組130‧‧‧Connecting module
132‧‧‧第一背板132‧‧‧First backplane
132h‧‧‧穿孔132h‧‧‧Perforation
132w‧‧‧散熱孔132w‧‧‧ vents
1322‧‧‧第一部件1322‧‧‧ first part
1324‧‧‧第二部件1324‧‧‧ second part
134‧‧‧第二背板134‧‧‧second backplane
134h‧‧‧穿孔134h‧‧‧Perforation
1342‧‧‧第三部件1342‧‧‧ third part
1344‧‧‧連接器1344‧‧‧Connector
1346‧‧‧線纜1346‧‧‧ Cable
140‧‧‧用電模組140‧‧‧Power Module
142‧‧‧主機板142‧‧‧ motherboard
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102208257U TWM459676U (en) | 2013-05-03 | 2013-05-03 | Server device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102208257U TWM459676U (en) | 2013-05-03 | 2013-05-03 | Server device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM459676U true TWM459676U (en) | 2013-08-11 |
Family
ID=49481232
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102208257U TWM459676U (en) | 2013-05-03 | 2013-05-03 | Server device |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWM459676U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI508654B (en) * | 2014-10-15 | 2015-11-11 | Lanner Electronic Inc | Industrial server system |
| US9451721B1 (en) | 2015-04-27 | 2016-09-20 | Zippy Technology Corp. | Modular redundant power supply |
| CN114138073A (en) * | 2020-09-04 | 2022-03-04 | 英业达科技有限公司 | server device |
| US11456549B2 (en) | 2019-02-22 | 2022-09-27 | Fsp Technology Inc. | Power backplane assembly and power supply module |
-
2013
- 2013-05-03 TW TW102208257U patent/TWM459676U/en not_active IP Right Cessation
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI508654B (en) * | 2014-10-15 | 2015-11-11 | Lanner Electronic Inc | Industrial server system |
| US9451721B1 (en) | 2015-04-27 | 2016-09-20 | Zippy Technology Corp. | Modular redundant power supply |
| US11456549B2 (en) | 2019-02-22 | 2022-09-27 | Fsp Technology Inc. | Power backplane assembly and power supply module |
| CN114138073A (en) * | 2020-09-04 | 2022-03-04 | 英业达科技有限公司 | server device |
| CN114138073B (en) * | 2020-09-04 | 2024-04-23 | 英业达科技有限公司 | Server device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4K | Annulment or lapse of a utility model due to non-payment of fees |