CN208434172U - A kind of Novel PCB board - Google Patents
A kind of Novel PCB board Download PDFInfo
- Publication number
- CN208434172U CN208434172U CN201821101562.5U CN201821101562U CN208434172U CN 208434172 U CN208434172 U CN 208434172U CN 201821101562 U CN201821101562 U CN 201821101562U CN 208434172 U CN208434172 U CN 208434172U
- Authority
- CN
- China
- Prior art keywords
- pcb board
- radiator fan
- face
- pcb
- locating slot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model belongs to technical field of PCB board, mainly provide a kind of pcb board, including the first pcb board, the second pcb board and third pcb board being cascading from top to down, wherein, first pcb board, the second pcb board and third pcb board pass through locating slot and link block fixed overlay, it is provided with the first radiator fan between first pcb board and the second pcb board, the second radiator fan is provided between the second pcb board and third pcb board.The heat dissipation that the electronic device in pcb board generates is gone out in time by the first radiator fan and the second radiator fan, the heat inside pcb board is allowed to rapidly diffuse into outside, solve the functional diversities with electronic product, the power of electronic product is continuously increased, it is easy to cause heat dissipation difficult in existing pcb board long-time use process, there are problems that security risk.
Description
Technical field
The utility model belongs to technical field of PCB board more particularly to a kind of Novel PCB board.
Background technique
Printed circuit board (Printed Circuit Board, PCB) is one of important component of electronics industry, Ji Huying
In each electronic product, as the carrier of electronic component electrical connection, the development of pcb board is also with electronics industry
Development develops towards directions such as high-precision, high density, small spacing, high reliability.
However, the power of electronic product is continuously increased with the functional diversities of electronic product, when existing pcb board is long
Between be easy to cause in use process heat dissipation difficult, there are security risks.
Utility model content
The purpose of this utility model is to provide a kind of pcb boards, it is intended to solve the functional diversities with electronic product, electricity
The power of sub- product is continuously increased, and is easy to cause heat dissipation difficult in existing pcb board long-time use process, there are security risks
The problem of.
The utility model proposes a kind of Novel PCB board, including be cascading the first pcb board, the second pcb board with
And third pcb board；
It is provided with multiple first locating slots on first face of first pcb board, is set on the second face of first pcb board
It is equipped with and multiple first link blocks；
It is provided with multiple second locating slots on first face of second pcb board, is set on the second face of second pcb board
It is equipped with multiple second link blocks；
It is provided with multiple third locating slots on first face of the third pcb board, is set on the second face of the third pcb board
It is equipped with multiple third link blocks；
Multiple first link blocks are respectively arranged in corresponding multiple second locating slots, and multiple described second connect
Block is connect to be respectively arranged in corresponding multiple third locating slots；
The first radiator fan, second pcb board and institute are provided between first pcb board and second pcb board
It states and is provided with the second radiator fan between third pcb board.
Optionally, first radiator fan is fixed on first pcb board and the 2nd PCB by the first screw group
Between plate, second radiator fan is fixed between second pcb board and the third pcb board by the second screw group.
Optionally, the number of first locating slot and first link block is four.
Optionally, the depth of the first locating slot is less than the thickness of first pcb board, and the depth of second locating slot is small
In the thickness of second pcb board, the depth of the third locating slot is less than the thickness of the third pcb board.
Optionally, the shape adaptation of first link block and second locating slot, second link block with it is described
The shape adaptation of third locating slot.
Optionally, the length of first pcb board, second pcb board and the third pcb board is identical；Described
One pcb board, second pcb board and the 3rd PCB it is of same size.
The utility model provides a kind of Novel PCB board, including be cascading from top to down the first pcb board,
Two pcb boards and third pcb board, wherein it is provided with multiple first locating slots on the first face of first pcb board, described
It is provided on second face of one pcb board and multiple first link blocks；Multiple second are provided on first face of second pcb board
Locating slot is provided with multiple second link blocks on the second face of second pcb board；It is set on first face of the third pcb board
Multiple third locating slots are equipped with, multiple third link blocks are provided on the second face of the third pcb board；Multiple described first connect
It connects block to be respectively arranged in corresponding multiple second locating slots, multiple second link blocks are respectively arranged at corresponding more
In a third locating slot；It is provided with the first radiator fan between first pcb board and second pcb board, described
The second radiator fan is provided between two pcb boards and the third pcb board.By the first radiator fan and the second radiator fan and
When the heat dissipation that the electronic device in pcb board generates is gone out, the heat inside pcb board is rapidly diffused into outer
Portion solves the functional diversities with electronic product, and the number of plies for the pcb board that electronic product uses is more and more, existing more
It is easy to cause heat dissipation difficult in layer pcb board long-time use process, there are problems that security risk.
Detailed description of the invention
Fig. 1 is a kind of cross section structure schematic diagram of the Novel PCB board proposed in the utility model embodiment；
Fig. 2 is the top view of the first pcb board 10 in the utility model embodiment；
Fig. 3 is the top view of the second pcb board 20 in the utility model embodiment.
Specific embodiment
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and implementation
Example, the present invention will be further described in detail.It should be appreciated that specific embodiment described herein is only used to explain
The utility model is not used to limit the utility model.Meanwhile term " first ", " second " in the description of the present invention,
It is described etc. being only used for distinguishing, is not understood to indicate or imply relative importance.
Fig. 1 is a kind of cross section structure schematic diagram of the Novel PCB board proposed in the utility model embodiment, as shown in Figure 1,
Novel PCB board in the present embodiment includes the first pcb board 10 being cascading from top to down, the second pcb board 20 and
Three pcb boards 30, wherein it is provided with multiple first locating slots 101 on the first face of the first pcb board 10, the second of the first pcb board 10
It is provided on face and multiple first link blocks 102；Multiple second locating slots 201 are provided on first face of the second pcb board 20, the
Multiple second link blocks 202 are provided on second face of two pcb boards 20；Multiple are provided on first face of third pcb board 30
Three locating slots 301 are provided with multiple third link blocks 302 on second face of third pcb board 30；Multiple first link blocks 102 divide
It is not set in corresponding multiple second locating slots 201, it is fixed that multiple second link blocks 202 are respectively arranged at corresponding multiple thirds
In the slot 301 of position；The first radiator fan 110, the second pcb board 20 and third are provided between first pcb board 10 and the second pcb board 20
The second radiator fan 210 is provided between pcb board 30.
In the present embodiment, position of multiple first locating slots 101 on the first face of the first pcb board 10 and multiple first
Position of the link block 102 on the second face of the first pcb board 10 corresponds, the position of multiple second locating slots 201 with it is multiple
The position of first link block 102 corresponds, position of multiple second locating slots 201 on the first face of the second pcb board 20 with
Position of multiple second link blocks 202 on the second face of the second pcb board 20 corresponds, the position of multiple third locating slots 301
It sets and is corresponded with the position of multiple second link blocks 202, multiple second locating slots 201 are on the first face of the second pcb board 20
Position on the second face of the second pcb board 20 of position and multiple second link blocks 202 correspond.
In the present embodiment, length of the depth of the second locating slot 201 less than the first link block 102, third locating slot 301
Depth less than the length of the second link block 202, there are prepsetting gaps between the first pcb board 10 and the second pcb board 20, this is pre-
If the thickness in gap be equal to the length of the first link block 102 and subtract the depth of the second locating slot 201, therefore, the first radiation air
Fan 110 is set between the first pcb board 10 and the second pcb board 20, conducive in time the first pcb board 10 and the second pcb board 20 is dissipated
It is dealt into outside the heat dissipation to pcb board in the gap between the first pcb board 10 and the second pcb board 20, likewise, the second radiator fan
210 are set between the second pcb board 20 and third pcb board 30, can in time will be between the second pcb board 20 and third pcb board 30
Gap in heat dissipation go out.
Further, in the present embodiment, the first radiator fan 110 is less than between the first pcb board 10 and the second pcb board 20
Prepsetting gap thickness, the second radiator fan 210 is less than the prepsetting gap between the second pcb board 20 and third pcb board 30
Thickness.The power supply end of the power supply of first radiator fan 10 and the first pcb board 10 or the circuit in the second pcb board 20
Connection, after the first pcb board 10 or the second pcb board 20 entrance working condition, the first radiator fan 10 enters work simultaneously, can
The heat between the first pcb board 10 and the second pcb board 20 to be discharged in time.The power supply of second radiator fan 210 and
The power supply end of the two pcb boards 20 perhaps circuit in third pcb board 30 is connected when the second pcb board 20 or third pcb board 30
Into after working condition, the second radiator fan 210 enters work simultaneously.
As an embodiment of the present invention, the first radiator fan 110 and the second radiator fan 210 in the present embodiment can
To need to be customized its size according to user.
As an embodiment of the present invention, Fig. 2 is the top view of the first pcb board 10 in the utility model embodiment,
As shown in Fig. 2, the number of the first locating slot 101 and the first link block 102 is four.Specifically, four the first locating slots 101
In quadrangle on the first face of the first pcb board 10, four the first link blocks 102 are in four on the second face of the first pcb board 10
It is angular.
As an embodiment of the present invention, the first radiator fan 110 is fixed on the first pcb board 10 by the first screw group
Between the second pcb board 20, the second radiator fan 210 is fixed on the second pcb board 20 and third pcb board 30 by the second screw group
Between.Fig. 3 is the top view of the second pcb board 20 in the present embodiment, as shown in figure 3, the first screw group includes four screws
111, four screws 111 are located at four angular zones of the first radiator fan 110, and four screws 111 are by the first radiator fan
110 are fixed on the second pcb board 20.
In the present embodiment, the second radiator fan 210 is fixed on the second pcb board 20 and the 3rd PCB by the second screw group
Between plate 30, specifically, the second radiator fan 210 is fixed on third pcb board by the second screw group.
As an embodiment of the present invention, the depth of the first locating slot 101 less than the first pcb board 10 thickness, second
For the depth of locating slot 201 less than the thickness of the second pcb board 20, the depth of third locating slot 301 is less than the thickness of third pcb board 30
Degree.
As an embodiment of the present invention, 201 shape adaptations of the first link block 102 and the second locating slot, second connects
Connect the shape adaptation of block 202 Yu third locating slot 301.
As an embodiment of the present invention, the first locating slot 101, the second locating slot 201 and third locating slot 301 are equal
For circular trough.In the present embodiment, first link block 102 corresponding with the second locating slot 201 also cylinder, wherein the half of cylinder
Diameter is identical as the radius of circular trough.The radius of first locating slot 101, the second locating slot 201 and third locating slot 301 is identical,
Corresponding, the first link block 102, the second link block 202 and third link block 302 are cylinder, the radius of each cylinder with
The radius of circular trough is identical.
As an embodiment of the present invention, the length phase of the first pcb board 10, the second pcb board 20 and third pcb board 30
Together；First pcb board 10, second pcb board 20 and the third pcb board 30 it is of same size.
The utility model provides a kind of Novel PCB board, including be cascading from top to down the first pcb board,
Two pcb boards and third pcb board, wherein it is provided with multiple first locating slots on the first face of first pcb board, described
It is provided on second face of one pcb board and multiple first link blocks；Multiple second are provided on first face of second pcb board
Locating slot is provided with multiple second link blocks on the second face of second pcb board；It is set on first face of the third pcb board
Multiple third locating slots are equipped with, multiple third link blocks are provided on the second face of the third pcb board；Multiple described first connect
It connects block to be respectively arranged in corresponding multiple second locating slots, multiple second link blocks are respectively arranged at corresponding more
In a third locating slot；It is provided with the first radiator fan between first pcb board and second pcb board, described
The second radiator fan is provided between two pcb boards and the third pcb board.By the first radiator fan and the second radiator fan and
When the heat dissipation that the electronic device in pcb board generates is gone out, the heat inside pcb board is rapidly diffused into outer
Portion solves the functional diversities with electronic product, and the power of electronic product is continuously increased, and existing pcb board makes for a long time
With being easy to cause heat dissipation difficult in the process, there are problems that security risk.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this
Made any modifications, equivalent replacements, and improvements etc., should be included in the utility model within the spirit and principle of utility model
Protection scope within.
Claims (6)
1. a kind of Novel PCB board, which is characterized in that including the first pcb board, the second pcb board and third being cascading
Pcb board；
It is provided with multiple first locating slots on first face of first pcb board, is provided on the second face of first pcb board
With multiple first link blocks；
It is provided with multiple second locating slots on first face of second pcb board, is provided on the second face of second pcb board
Multiple second link blocks；
It is provided with multiple third locating slots on first face of the third pcb board, is provided on the second face of the third pcb board
Multiple third link blocks；
Multiple first link blocks are respectively arranged in corresponding multiple second locating slots, multiple second link blocks
It is respectively arranged in corresponding multiple third locating slots；
It is provided with the first radiator fan between first pcb board and second pcb board, second pcb board and described the
The second radiator fan is provided between three pcb boards.
2. Novel PCB board as described in claim 1, first radiator fan is fixed on described first by the first screw group
Between pcb board and second pcb board, second radiator fan by the second screw group be fixed on second pcb board with
Between the third pcb board.
3. Novel PCB board as described in claim 1, which is characterized in that first locating slot and first link block
Number is four.
4. Novel PCB board as described in claim 1, which is characterized in that the depth of the first locating slot is less than first pcb board
Thickness, the depth of second locating slot is less than the thickness of second pcb board, and the depth of the third locating slot is less than institute
State the thickness of third pcb board.
5. Novel PCB board as claimed in claim 2, which is characterized in that first link block and second locating slot
Shape adaptation, the shape adaptation of second link block and the third locating slot.
6. Novel PCB board as described in claim 1, which is characterized in that first pcb board, second pcb board and institute
The length for stating third pcb board is identical；First pcb board, second pcb board and the 3rd PCB it is of same size.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821101562.5U CN208434172U (en) | 2018-07-11 | 2018-07-11 | A kind of Novel PCB board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821101562.5U CN208434172U (en) | 2018-07-11 | 2018-07-11 | A kind of Novel PCB board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208434172U true CN208434172U (en) | 2019-01-25 |
Family
ID=65099833
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821101562.5U Expired - Fee Related CN208434172U (en) | 2018-07-11 | 2018-07-11 | A kind of Novel PCB board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208434172U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110933843A (en) * | 2019-11-04 | 2020-03-27 | 烟台职业学院 | Multilayer substrate with built-in chip electronic component and manufacturing method thereof |
-
2018
- 2018-07-11 CN CN201821101562.5U patent/CN208434172U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110933843A (en) * | 2019-11-04 | 2020-03-27 | 烟台职业学院 | Multilayer substrate with built-in chip electronic component and manufacturing method thereof |
| CN110933843B (en) * | 2019-11-04 | 2021-08-03 | 烟台职业学院 | Multilayer substrate with built-in chip electronic component and manufacturing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2009067558A3 (en) | Apparatus and method for thermal dissipation in a light | |
| US20200196489A1 (en) | Heat dissipation apparatus and server using the same | |
| CN208434172U (en) | A kind of Novel PCB board | |
| EP3346218A1 (en) | An integrated liquid cooling device and a method thereof | |
| CN205071462U (en) | Multilayer circuit board heat conduction radiation structure | |
| CN205946337U (en) | Aluminium base rigid -flex board | |
| CN208385714U (en) | A kind of single layer USB adapter | |
| CN201718148U (en) | Heat radiating device of telecommunication device | |
| CN210807803U (en) | Splicing type back plate | |
| CN204719655U (en) | A kind of heat dissipation equipment of notebook computer | |
| CN203025636U (en) | Display card radiating device | |
| CN207427562U (en) | A kind of USB circuit plate device | |
| CN202455704U (en) | Device for fixing PCB (printed circuit board) | |
| CN213122038U (en) | Electronic transformer electrical property testing arrangement | |
| CN208434177U (en) | A kind of pcb board of multilayered structure | |
| CN204305483U (en) | A kind of novel controllable cabinet apparatus for mobile communication | |
| CN219678761U (en) | High-frequency multilayer circuit board | |
| US20200375067A1 (en) | Cooling surface mount for rack servers allowing modular resource configuration | |
| CN207334333U (en) | A kind of New LED photoelectricity die set | |
| CN207573702U (en) | A kind of two-sided PCB circuit board | |
| CN208047095U (en) | A kind of fixing device of PCB circuit board | |
| CN203775516U (en) | PCB with implantable heat dissipation copper block | |
| CN202177358U (en) | Jig for detecting external form of cooling fin | |
| CN203072251U (en) | Ceramic circuit board provided with blind hole. | |
| CN204761826U (en) | Printed circuit board with heat radiation structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190125 Termination date: 20210711 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |