CN219678761U - High-frequency multilayer circuit board - Google Patents
High-frequency multilayer circuit board Download PDFInfo
- Publication number
- CN219678761U CN219678761U CN202223605454.0U CN202223605454U CN219678761U CN 219678761 U CN219678761 U CN 219678761U CN 202223605454 U CN202223605454 U CN 202223605454U CN 219678761 U CN219678761 U CN 219678761U
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- China
- Prior art keywords
- circuit board
- multilayer circuit
- hole
- frequency
- frequency multilayer
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- 238000009423 ventilation Methods 0.000 claims description 3
- 238000001125 extrusion Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model provides a high-frequency multilayer circuit board which comprises a high-frequency multilayer circuit board, wherein a stop block is arranged on one side of the high-frequency multilayer circuit board, a connecting hole is formed in the surface of the stop block, a limiting groove is formed in the connecting hole, a pressing plate is fixedly arranged at one end of the limiting block, a first positioning hole is formed in the connecting block, a pressing block is connected to the surface of a threaded rod in a threaded manner, and a threaded hole is formed in the surface of the pressing block. This high frequency multilayer circuit board establishes the dog through the setting of dog, clamp plate and bottom plate at the surface cover of high frequency multilayer circuit board, then inserts the inside of connecting hole and spacing groove with the clamp plate through connecting block and stopper, inserts the inside of first locating hole with the bottom plate through the threaded rod afterwards, and rotatory briquetting is rotatory and extrusion clamp plate at the surface of threaded rod through the screw hole at last to accomplish the combination of dog, clamp plate and bottom plate, can protect the side of high frequency multilayer circuit board.
Description
Technical Field
The utility model relates to the technical field related to high-frequency circuit boards, in particular to a high-frequency multilayer circuit board.
Background
The high-frequency circuit board is a special circuit board with higher electromagnetic frequency, generally, the high frequency can be defined as the frequency above 1GHz, the requirements on various physical properties, precision and technical parameters are very high, the high-frequency circuit board is commonly used in the fields of automobile anti-collision systems, satellite systems, radio systems and the like, and the multilayer circuit board is a product of the development of electronic technology in the directions of high speed, multifunction, large capacity and small volume, so the high-frequency multilayer circuit board is particularly required.
However, in the use process of the conventional high-frequency multilayer circuit board, the side edge of the high-frequency multilayer circuit board is not provided with a protective structure, so that the side edge of the high-frequency multilayer circuit board is easy to crack after being impacted, and the appearance of a product is affected.
Disclosure of Invention
The utility model aims to provide a high-frequency multilayer circuit board, which solves the problems that the side edge of the high-frequency multilayer circuit board is easy to crack after being impacted and the appearance of a product is affected due to the fact that the side edge of the high-frequency multilayer circuit board is not provided with a protective structure in the use process of the conventional high-frequency multilayer circuit board.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a high frequency multilayer circuit board, includes the high frequency multilayer circuit board, the dog is installed to one side of high frequency multilayer circuit board, the ventilation hole has been seted up on the surface of dog, the connecting hole has been seted up on the surface of dog, the spacing groove has been seted up to the inside of connecting hole, the inside sliding connection of connecting hole has the connecting block, the fixed surface of connecting block has the stopper, the one end fixed mounting of stopper has the clamp plate, first locating hole has been seted up to the inside of connecting block, the inside sliding connection of first locating hole has the threaded rod, the one end fixed mounting of threaded rod has the bottom plate, one side fixed mounting of bottom plate has the gasket, the surface threaded connection of threaded rod has the briquetting, the screw hole has been seted up on the surface of briquetting, the surface fixed mounting of high frequency multilayer circuit board has the fixture block, the draw-in groove has been seted up on one side surface of high frequency multilayer circuit board, the second locating hole has been seted up on the surface of high frequency multilayer circuit board.
Preferably, the limit grooves are symmetrically arranged on the central line of the connecting hole, and the limit grooves are identical to the limit blocks in size.
Preferably, the connecting hole is matched with the connecting block in size, and the first positioning hole is matched with the threaded rod in size.
Preferably, the pressing block is in threaded connection with the threaded rod through a threaded hole, and a plurality of groups of grooves are formed in the surface of the pressing block at equal intervals.
Preferably, the dimensions of the clamping blocks are identical with those of the clamping grooves, and the clamping blocks are symmetrically arranged on the central line of the high-frequency multilayer circuit board.
Preferably, the surface of the baffle is provided with a plurality of groups of vent holes, and the second positioning holes are symmetrically arranged on the central line of the high-frequency multilayer circuit board.
Compared with the prior art, the utility model has the beneficial effects that: this high frequency multilayer circuit board establishes the dog through the setting of dog, clamp plate and bottom plate at the surface cover of high frequency multilayer circuit board, then inserts connecting hole and spacing groove's inside with the clamp plate through connecting block and stopper, makes the clamp plate remove the surface of high frequency multilayer circuit board simultaneously, inserts the inside of first locating hole with the bottom plate through the threaded rod afterwards, and rotatory briquetting passes through the screw hole at the rotatory clamp plate of surface rotation of threaded rod at last, thereby accomplish the combination of dog, clamp plate and bottom plate, and can protect the side of high frequency multilayer circuit board, prevent that the side that high frequency multilayer circuit board received the collision from leading to high frequency multilayer circuit board from appearing cracked.
Drawings
FIG. 1 is a schematic diagram of a side view of the present utility model;
FIG. 2 is a schematic diagram of the structure of the connecting hole and the limiting groove of the present utility model;
FIG. 3 is a schematic diagram of the cooperation structure of the high-frequency multi-layer circuit board and the clamping block according to the utility model;
fig. 4 is an enlarged schematic view of the structure of fig. 3 a according to the present utility model.
In the figure: 1. a high-frequency multilayer wiring board; 2. a stop block; 3. a vent hole; 4. a connection hole; 5. a limit groove; 6. a connecting block; 7. a limiting block; 8. a pressing plate; 9. a first positioning hole; 10. a threaded rod; 11. a bottom plate; 12. a gasket; 13. briquetting; 14. a threaded hole; 15. a groove; 16. a clamping block; 17. a clamping groove; 18. and a second positioning hole.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-4, the present utility model provides a technical solution: the utility model provides a high frequency multilayer circuit board, including high frequency multilayer circuit board 1, dog 2 is installed to one side of high frequency multilayer circuit board 1, ventilation hole 3 has been seted up on the surface of dog 2, connecting hole 4 has been seted up on the surface of dog 2, spacing groove 5 has been seted up to the inside of connecting hole 4, the inside sliding connection of connecting hole 6 has connecting block 6, the fixed surface of connecting block 6 is connected with stopper 7, the one end fixed mounting of stopper 7 has clamp plate 8, first locating hole 9 has been seted up to the inside of connecting block 6, the inside sliding connection of first locating hole 9 has threaded rod 10, the one end fixed mounting of threaded rod 10 has bottom plate 11, one side fixed mounting of bottom plate 11 has gasket 12, the surface threaded connection of threaded rod 10 has briquetting 13, threaded hole 14 has been seted up on the surface of briquetting 13, the surface fixed mounting of high frequency multilayer circuit board 1 has fixture block 16, draw-in groove 17 has been seted up on one side surface of high frequency multilayer circuit board 1, the second locating hole 18 has been seted up on the surface of high frequency multilayer circuit board 1.
Further, the spacing groove 5 sets up with the central line symmetry of connecting hole 4, and the size of spacing groove 5 and stopper 7 coincide, through the setting of spacing groove 5 and stopper 7, and when clamp plate 8 was connected with dog 2, stopper 7 can get into the inside of spacing groove 5, and simultaneously spacing groove 5 can be spacing stopper 7, appears rocking when preventing clamp plate 8 installation.
Further, the sizes of the connecting hole 4 and the connecting block 6 are identical, the size of the first positioning hole 9 is identical to the size of the threaded rod 10, through the size of the first positioning hole 9 and the arrangement of the threaded rod 10, after the bottom plate 11 is inserted into the first positioning hole 9 through the threaded rod 10, the first positioning hole 9 can limit the threaded rod 10, and shaking is prevented when the bottom plate 11 is installed.
Further, the pressing block 13 is in threaded connection with the threaded rod 10 through the threaded hole 14, a plurality of groups of grooves 15 are formed in the surface of the pressing block 13 at equal intervals, and friction between the pressing block 13 and the hands of a user can be increased through the grooves 15 when the pressing block 13 is rotated through the arrangement of the grooves 15.
Further, the dimensions of the clamping block 16 and the dimensions of the clamping groove 17 are matched, the clamping block 16 is symmetrically arranged on the central line of the high-frequency multilayer circuit board 1, and when the high-frequency multilayer circuit board 1 is connected through the arrangement of the clamping block 16 and the clamping groove 17, the clamping block 16 is inserted into the clamping groove 17, so that the position of the high-frequency multilayer circuit board 1 can be prevented from being deviated in the pressing process.
Further, the vent hole 3 has seted up the multiunit on the surface of dog 2, and the second locating hole 18 sets up with the central line symmetry of high frequency multilayer circuit board 1, through the setting of vent hole 3 and second locating hole 18, and vent hole 3 can prevent that high frequency multilayer circuit board 1 can't volatilize when the use temperature, and the second locating hole 18 can fix a position when high frequency multilayer circuit board 1 installs.
Working principle: firstly, the stop block 2 is required to be sleeved on the surface of the high-frequency multilayer circuit board 1, then the pressing plate 8 is inserted into the connecting hole 4 and the limiting groove 5 through the connecting block 6 and the limiting block 7, meanwhile, the pressing plate 8 is moved to the surface of the high-frequency multilayer circuit board 1, then the bottom plate 11 is inserted into the first positioning hole 9 through the threaded rod 10, finally the pressing block 13 is rotated and pressed on the surface of the threaded rod 10 through the threaded hole 14 to press the pressing plate 8, so that the combination of the stop block 2, the pressing plate 8 and the bottom plate 11 is completed, the side edge of the high-frequency multilayer circuit board 1 can be protected, the high-frequency multilayer circuit board 1 is prevented from being broken due to collision, when the high-frequency multilayer circuit board 1 is connected, the clamping block 16 is inserted into the clamping groove 17, the position of the high-frequency multilayer circuit board 1 can be prevented from being deviated in the pressing process, finally the vent hole 3 can prevent the high-frequency multilayer circuit board 1 from being volatilized when the temperature is used, the second positioning hole 18 can be positioned when the high-frequency multilayer circuit board 1 is installed, the gasket 12 can increase the friction surface of the high-frequency multilayer circuit board 1, and the high-frequency multilayer circuit board 1 can be prevented from sliding, and the multilayer circuit board can be used, and a multilayer process.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A high-frequency multilayer wiring board comprising a high-frequency multilayer wiring board (1), characterized in that: the utility model discloses a high-frequency multilayer circuit board, including high-frequency multilayer circuit board (1), dog (2) are installed to one side of dog (1), ventilation hole (3) have been seted up on the surface of dog (2), connecting hole (4) have been seted up on the surface of dog (2), spacing groove (5) have been seted up to the inside of connecting hole (4), the inside sliding connection of connecting hole (4) has connecting block (6), the fixed surface of connecting block (6) has stopper (7), the one end fixed mounting of stopper (7) has clamp plate (8), first locating hole (9) have been seted up to the inside of connecting block (6), the inside sliding connection of first locating hole (9) has threaded rod (10), the one end fixed mounting of threaded rod (10) has bottom plate (11), one side fixed mounting of bottom plate (11) has gasket (12), the surface threaded connection of threaded rod (10) has briquetting (13), threaded hole (14) have been seted up on the surface of briquetting (13), the surface of briquetting (13) has seted up recess (15), the fixed surface of multilayer circuit board (1) has clamp block (16), high-frequency circuit board (17) one side has been seted up on one side of high-frequency circuit board (17), the surface of the high-frequency multilayer circuit board (1) is provided with a second positioning hole (18).
2. The high-frequency multi-layer wiring board according to claim 1, wherein: the limiting grooves (5) are symmetrically arranged on the central line of the connecting hole (4), and the limiting grooves (5) and the limiting blocks (7) are identical in size.
3. The high-frequency multi-layer wiring board according to claim 1, wherein: the connecting hole (4) is matched with the connecting block (6) in size, and the first positioning hole (9) is matched with the threaded rod (10) in size.
4. The high-frequency multi-layer wiring board according to claim 1, wherein: the pressing block (13) is in threaded connection with the threaded rod (10) through the threaded hole (14), and a plurality of groups of grooves (15) are formed in the surface of the pressing block (13) at equal intervals.
5. The high-frequency multi-layer wiring board according to claim 1, wherein: the size of the clamping block (16) is matched with the size of the clamping groove (17), and the clamping block (16) is symmetrically arranged on the central line of the high-frequency multilayer circuit board (1).
6. The high-frequency multi-layer wiring board according to claim 1, wherein: the vent holes (3) are formed in the surface of the stop block (2) in multiple groups, and the second positioning holes (18) are symmetrically formed in the center line of the high-frequency multilayer circuit board (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223605454.0U CN219678761U (en) | 2022-12-30 | 2022-12-30 | High-frequency multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223605454.0U CN219678761U (en) | 2022-12-30 | 2022-12-30 | High-frequency multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219678761U true CN219678761U (en) | 2023-09-12 |
Family
ID=87926999
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223605454.0U Active CN219678761U (en) | 2022-12-30 | 2022-12-30 | High-frequency multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219678761U (en) |
-
2022
- 2022-12-30 CN CN202223605454.0U patent/CN219678761U/en active Active
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| GR01 | Patent grant |