CN201805635U - Positioning plate for drilling holes on circuit board - Google Patents

Positioning plate for drilling holes on circuit board Download PDF

Info

Publication number
CN201805635U
CN201805635U CN2010202399333U CN201020239933U CN201805635U CN 201805635 U CN201805635 U CN 201805635U CN 2010202399333 U CN2010202399333 U CN 2010202399333U CN 201020239933 U CN201020239933 U CN 201020239933U CN 201805635 U CN201805635 U CN 201805635U
Authority
CN
China
Prior art keywords
plate
hole
location
wiring board
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010202399333U
Other languages
Chinese (zh)
Inventor
何龙
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DONGGUAN DAOSHENGYI PCB MATERIAL Co Ltd
Original Assignee
DONGGUAN DAOSHENGYI PCB MATERIAL Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DONGGUAN DAOSHENGYI PCB MATERIAL Co Ltd filed Critical DONGGUAN DAOSHENGYI PCB MATERIAL Co Ltd
Priority to CN2010202399333U priority Critical patent/CN201805635U/en
Application granted granted Critical
Publication of CN201805635U publication Critical patent/CN201805635U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Structure Of Printed Boards (AREA)

Abstract

The utility model discloses a positioning plate for drilling holes on a circuit board. The positioning plate comprises a basal plate; more than one through hole is arranged on the basal body; an embedded block is arranged in each through hole; the sizes and the shapes of the embedded blocks are matched with those of the through holes; and the embedded blocks adopt bakelite plates or glass fibre boards. The conventional positioning plate is divided into two parts (namely the basal plate and the embedded blocks); the through holes are arranged on the basal plate; the basal plate and the embedded blocks can be customized and processed, or an abandoned positioning plate with no pin holes or less pin holes is cut into the basal plate and the embedded blocks, of which the shapes and the sizes are as same as those of the through holes on the basal plate; and during use, the embedded blocks are embedded into the through holes, and can be taken down and replaced by another suitable one when the embedded blocks cannot be further used due to the too many pin holes thereon, therefore the production cost is reduced, and the resources are greatly saved by reutilizing the original abandoned positioning plate.

Description

A kind of wiring board boring location-plate
Technical field
The utility model relates to a kind of wiring board boring and uses location-plate, especially relates to reused economical and practical wiring board boring location-plate.
Background technology
In the PCB production process, copper-clad plate must be holed according to the needs of circuit, assign various electronic devices and components afterwards, in boring procedure, need a location-plate is fixed on the board of rig, again lower bolster (being generally MDF or phenolic board), copper-clad plate and cover plate (being generally aluminium sheet) are successively placed on the location-plate, the edge that passes copper-clad plate with several pins is fixed on the location-plate them, after hole drill is good, take off lower bolster, copper-clad plate and cover plate, change another batch virgin material again, redrilling; Like this, the a collection of virgin material of every brill, all need be with the lower bolster that newly is placed on the location-plate, copper-clad plate and cover plate dowel fixes, therefore, use the pin hole of some position on a period of time rear position plate very many, can not continue fixation again, the location-plate that must more renew, and the pin hole of other positions (as the centre position) is less or almost do not have on this moment location-plate, make location-plate not bring into play peak use rate, and because location-plate finished product price is higher, caused bigger waste aborning, also be unfavorable for the policy of advocating at present of building a resource-conserving society.
The utility model content
The utility model is existing to provide a kind of reused economical and practical wiring board boring location-plate to society.
The technical solution of the utility model is: design a kind of economical and practical wiring board boring location-plate, comprise substrate, establish more than one through hole on the described substrate, be provided with in described through hole and the size of described through hole, the embedded block that shape matches, described embedded block is bakelite plate or glass plate.
Described through hole is a wedge hole.
The area of described through hole with the ratio of the area of described substrate is: 1/8 to 2/3.
Described through hole is the through hole of regular geometric shapes.
Described regular geometric shapes is rectangle, circle, ellipse, triangle, prismatic or trapezoidal.
Described through hole is two, and is located at the both sides up and down of described substrate respectively.
Described substrate is bakelite plate or glass plate.
The edge of the described substrate location hole that is used to locate substrate that is provided with separated by a distance.
Described substrate is a metallic plate.
The described substrate side of being plate.
The utility model is owing to be divided into substrate and embedded block two parts with existing location-plate, on substrate, establish through hole, described substrate and embedded block had both customized processing, there are not pin hole or the less position of pin hole from discarded location-plate yet, cut out substrate and with described substrate on the shape and the big or small identical block of through hole, during use, embedded block is embedded in the described through hole, when pin hole on the embedded block is more can not continue to use the time, only need it is unloaded and refill another piece suitable embedded block gets final product, thereby make substrate reach recycling, in addition, because it is lower that discarded location-plate reclaims price, therefore the cost basic and embedded block that cuts out from discarded location-plate is also lower, even the new embedded block of customized production is because its area is little with respect to the monoblock location-plate, therefore price is also lower, thereby reduced production cost, because the original discarded location-plate of recycling has also been saved resource greatly.
Description of drawings
Fig. 1 is the perspective view of a kind of embodiment of the utility model;
Fig. 2 is the perspective view of the another kind of embodiment of the utility model.
Embodiment
See also Fig. 1 to Fig. 2, Fig. 1 to Fig. 2 be a kind of economical and practical wiring board boring location-plate with disclosing, comprise substrate 1, in the present embodiment (as shown in Figure 1), establish through hole 3 in addition on the described substrate 1, described through hole 3 is the through hole 3 of regular geometric shapes, described regular geometric shapes is meant rectangle, circular, oval, triangle, prismatic, the shape that trapezoidal or above-mentioned combination of shapes becomes, in the present embodiment, described through hole 3 is to be combined by the rectangle that varies in size, certainly, described through hole 3 also can be other shape, and through hole 3 is respectively circle and rectangle described in the embodiment as shown in Figure 2.When drawing when described the cutting by discarded location-plate substantially, the described substrate 1 edge location hole 2 that is used to locate substrate that is provided with separated by a distance, 1 side's of the being plate of substrate described in the present embodiment has four location holes 2, is located at four drift angle places respectively; Obviously, also can have only two or three described location holes on the described substrate 1.
As preferred embodiment of the present utility model, described substrate 1 is provided with two described through holes 3, and described through hole 3 is located at the both sides up and down of described substrate 1 respectively; Obviously, according to actual needs, the shape of described through hole 3, size and position all can change.The area of described through hole 3 with the optimum range of the ratio of the area of described substrate 1 is: 1/8 to 2/3.
Be provided with the embedded block 4 with its size, form fit in described through hole 3, described embedded block 4 is bakelite plate or glass plate.Described embedded block 4 both can be directly from the useless plate that reclaims pin hole position less or that do not have a pin hole cut out also customizable processing.
As preferred embodiment of the present utility model, described through hole 3 is wedge hole (as shown in Figure 2), one side opening is bigger, the opposite side opening is less, its edge surface is the inclined-plane, at this moment, the side of described embedded block 4 also is and the supporting inclined-plane of described through hole, during use, described embedded block 4 is embedded and its shape, in the through hole 3 of size correspondence, the side that the opening of through hole 3 is bigger contacts with the mounting table of rig, and inserts pin in location hole, substrate 1 is positioned on the rig, on described substrate 1, place lower bolster successively again, copper-clad plate and cover plate, at edge's insertion pin of described copper-clad plate, and described pin penetrates on the described location-plate always, with the copper-clad plate location, can hole.When pin hole on the embedded block 4 is more can not continue fixation the time, only need it is unloaded and refill the suitable embedded block of another piece 4 and get final product, certain, also a side that can the opening of through hole 3 is less contacts with the mounting table of rig, and described through hole also can be clear opening.
Substrate described in the present embodiment 1 is a bakelite plate, and certainly, described substrate 1 also can be glass plate or metallic plate.

Claims (10)

1. location-plate is used in a wiring board boring, comprises substrate, and it is characterized in that: described substrate is provided with more than one through hole, is provided with in described through hole and the size of described through hole, the embedded block that shape matches, and described embedded block is bakelite plate or glass plate.
2. location-plate is used in wiring board boring according to claim 1, and it is characterized in that: described through hole is a wedge hole.
3. location-plate is used in wiring board boring according to claim 1 and 2, and it is characterized in that: the area of described through hole with the ratio of the area of described substrate is: 1/8 to 2/3.
4. location-plate is used in wiring board boring according to claim 1 and 2, and it is characterized in that: described through hole is the through hole of regular geometric shapes.
5. location-plate is used in wiring board boring according to claim 4, and it is characterized in that: described regular geometric shapes is rectangle, circle, ellipse, triangle, prismatic or trapezoidal.
6. location-plate is used in wiring board boring according to claim 1 and 2, and it is characterized in that: described through hole is two, and is located at the both sides up and down of described substrate respectively.
7. location-plate is used in wiring board boring according to claim 1 and 2, and it is characterized in that: described substrate is bakelite plate or glass plate.
8. location-plate is used in wiring board boring according to claim 1 and 2, it is characterized in that: the edge of the described substrate location hole that is used to locate substrate that is provided with separated by a distance.
9. location-plate is used in wiring board boring according to claim 1 and 2, and it is characterized in that: described substrate is a metallic plate.
10. location-plate is used in wiring board boring according to claim 1 and 2, it is characterized in that: the described substrate side of being plate.
CN2010202399333U 2010-06-25 2010-06-25 Positioning plate for drilling holes on circuit board Expired - Fee Related CN201805635U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010202399333U CN201805635U (en) 2010-06-25 2010-06-25 Positioning plate for drilling holes on circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010202399333U CN201805635U (en) 2010-06-25 2010-06-25 Positioning plate for drilling holes on circuit board

Publications (1)

Publication Number Publication Date
CN201805635U true CN201805635U (en) 2011-04-20

Family

ID=43875132

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010202399333U Expired - Fee Related CN201805635U (en) 2010-06-25 2010-06-25 Positioning plate for drilling holes on circuit board

Country Status (1)

Country Link
CN (1) CN201805635U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102223766A (en) * 2011-05-30 2011-10-19 昆山沪利微电股份有限公司 Printed circuit board (PCB) positioning device and production method thereof
CN109397424A (en) * 2018-09-18 2019-03-01 奥士康精密电路(惠州)有限公司 A kind of method of bakelite plate renewable resource utilization

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102223766A (en) * 2011-05-30 2011-10-19 昆山沪利微电股份有限公司 Printed circuit board (PCB) positioning device and production method thereof
CN109397424A (en) * 2018-09-18 2019-03-01 奥士康精密电路(惠州)有限公司 A kind of method of bakelite plate renewable resource utilization

Similar Documents

Publication Publication Date Title
CN106034380B (en) A kind of production method of printed wiring board
CN103428999B (en) A kind of pcb board method for processing forming and superimposed sheet
US7119286B1 (en) Electromagnetic interference shielding structure
CN201805635U (en) Positioning plate for drilling holes on circuit board
CN103841762B (en) The manufacture method of a kind of pcb board and a kind of pcb board
CN105682363B (en) A kind of production method of the PCB of edges of boards metallization
CN201579816U (en) Automatic waste discharging device for stamped products made of thin insulating material
CN101932198A (en) Manufacturing method for transplanting printed circuit board and structure thereof
CN204577816U (en) Braid inserted sheet
CN110753450A (en) Manufacturing method of rigid-flex board
CN110446355A (en) A kind of LED lamp bead package board filling holes with resin technique
CN203219618U (en) Tool for milling mini-sized printed circuit board
CN201500800U (en) Detachable backing plate
CN216087160U (en) Air guide plate for PCB solder mask and resin hole plugging process
CN101742823B (en) Circuit board bearing device and application method thereof
CN211438657U (en) Laser drilling processing universal jig
CN201774752U (en) Bevel scraper
CN207589283U (en) A kind of device of pcb board side depthkeeping gong plate
CN110650585A (en) Machining method for positioning drill hole
CN203344478U (en) Circuit board printing jig
CN103552132A (en) Board splitting jig
CN103157827A (en) Decomposable backing plate
CN219678761U (en) High-frequency multilayer circuit board
JP2008055587A (en) Press punching method of plate-like substrate and mold for press punching
CN214757081U (en) Multilayer rigid printed circuit board convenient to punch a hole

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110420

Termination date: 20190625