CN206650897U - A kind of LED power driving IC pad and its encapsulating structure - Google Patents
A kind of LED power driving IC pad and its encapsulating structure Download PDFInfo
- Publication number
- CN206650897U CN206650897U CN201720462329.9U CN201720462329U CN206650897U CN 206650897 U CN206650897 U CN 206650897U CN 201720462329 U CN201720462329 U CN 201720462329U CN 206650897 U CN206650897 U CN 206650897U
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- CN
- China
- Prior art keywords
- pad
- pcb board
- heat
- led power
- power driving
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model belongs to LED power actuation techniques field, discloses a kind of LED power driving IC pad, including：IC body regions (5) and a plurality of IC pins pads (6) are set on pcb board (3).The invention also discloses a kind of packaging mechanism of LED power driving IC pad, IC (2) each pin is respectively welded on the IC pins pad (6) in pcb board (3) one side, clamping sets heat-conducting layer (9) between pcb board (3) and IC bodies, and filling heat-conducting layer (9) in heat emission hole (8), heat emission hole (8) position attachment heat-conducting silica gel sheet (10) of the another side of pcb board (3).The utility model can improve the heat dispersion of whole pad encapsulating structure.
Description
Technical field
The utility model belong to LED power driving technical field, more particularly to a kind of LED power driving IC pad and
Its encapsulating structure.
Background technology
Reformed by LED technology for many years, LED drive power is increasingly mature, develops out various driving topological structures, and IC drives
Dynamic encapsulation is also that diversified development is presented.The PCB encapsulation that conventional supporting IC is used, as shown in figure 1, using such encapsulate
Structure, the method for generally use tradition radiation fin, this method is clumsy and with high costs, is unfavorable for production and cost control
System, specifically as shown in Fig. 2 IC2 is welded on pcb board 3, fin 1 is close on IC2 faces, and fin 1 passes through screw and bolt
4 are fixed on pcb board 3, existing this encapsulation and radiator structure, problems be present：
1.IC has to be mounted on component card face, and can not being mounted in surface mount elements face, (radiator is big, can not be mounted in paster member
Part face).
2. PCB dual platens (being attached to plug-in element face, it is necessary to use double-sided PCB board) must be used.
3. due to filling fin on PCB, screw, labor intensive.
4. other small surface mount elements are easily damaged during fixed screw.
Utility model content
The purpose of the utility model embodiment is to provide a kind of LED power driving IC pad and its encapsulating structure, changed
It has been apt to the heat dispersion of whole pad encapsulating structure.
What the utility model embodiment was realized in：
A kind of LED power driving IC pad, including：IC body regions and the weldering of a plurality of IC pins are set on pcb board
Disk, the IC pins pad are divided into two row, and two row are symmetrically distributed in the both sides of IC body regions, in same row pad, arrangement
Pad in centre is square pad, and be arranged in the pad of head and tail all has the square pads and held in the mouth with square pads respectively
The pad of the triangle connect.
Wherein, IC body pads are provided with IC body regions, the IC bodies pad is oval.
Wherein, the heat emission hole through pcb board is offered in the region of IC body pads.
Wherein, the aperture of the heat emission hole is 1.0-2.0mm.
Using a kind of packaging mechanism of described LED power driving IC pad, each pins of IC are respectively welded at pcb board
On IC pin pads on, between pcb board and IC bodies clamping set heat-conducting layer.
Using a kind of packaging mechanism of described LED power driving IC pad, each pins of IC are respectively welded at pcb board
Clamping, which is set, on IC pin pads on simultaneously, between pcb board and IC bodies fills heat conduction in heat-conducting layer, and the heat emission hole
Layer, the radiating hole site attachment heat-conducting silica gel sheet of the another side of pcb board.
The utility model embodiment is by increasing IC PCB bonding pad areas and/or increasing connecing between pcb board and IC surfaces
Contacting surface is accumulated to realize the contact area of pcb board and IC integral devices, caused heat on IC is transmitted in time on PCB,
So as to improve IC heat dispersion；Further, by adding heat-conducting layer between IC devices and PCB, such as the red glue-line of heat conduction
And conductive and heat-conductive epoxy glue layer, make the temperature conduction between IC devices and pcb board rapider, make caused heat on IC
Acceleration dissipates；Further, heat emission hole can be opened up on pcb board corresponding with IC positions, in hole and contacts of the PCB with IC
Face sets thermal grease layer, and the heat on the radiating hole site attachment heat-conducting silica gel sheet of the another side of pcb board, such IC will
Rapider conduction dissipates in time, so as to improve the integral heat sink performance of pad encapsulating structure.
Brief description of the drawings
Fig. 1 is the PCB pad schematic diagrames that IC is used in the prior art；
Fig. 2 is the radiator structure schematic diagram of PCB pads encapsulation in the prior art；
Fig. 3 is the PCB pads schematic diagram one that IC is used in the utility model；
Fig. 4 is the PCB pads schematic diagram two that IC is used in the utility model；
Fig. 5 is the PCB pads schematic diagram three that IC is used in the utility model；
The radiator structure schematic diagram one that PCB pads encapsulate in Fig. 6 the utility model；
The radiator structure schematic diagram two that PCB pads encapsulate in Fig. 7 the utility model.
Embodiment
In order that the purpose of this utility model, technical scheme and advantage are more clearly understood, below in conjunction with accompanying drawing and implementation
Example, the utility model is further elaborated.It should be appreciated that specific embodiment described herein is only explaining
The utility model, it is not used to limit the utility model.
The utility model embodiment is by increasing IC PCB bonding pad areas and/or increasing connecing between pcb board and IC surfaces
Contacting surface is accumulated to realize the contact area of pcb board and IC integral devices, caused heat on IC is transmitted in time on PCB,
So as to improve IC heat dispersion；Further, by adding heat-conducting layer between IC devices and PCB, such as the red glue-line of heat conduction
And conductive and heat-conductive epoxy glue layer, make the temperature conduction between IC devices and pcb board rapider, make caused heat on IC
Acceleration dissipates；Further, heat emission hole can be opened up on pcb board corresponding with IC positions, in hole and contacts of the PCB with IC
Face sets thermal grease layer, and the heat on the radiating hole site attachment heat-conducting silica gel sheet of the another side of pcb board, such IC will
Rapider conduction dissipates in time, so as to improve the integral heat sink performance of pad encapsulating structure.
Specific implementation of the present utility model is described in detail below in conjunction with specific embodiment：
As shown in figure 3, a kind of LED power driving IC pad, including：IC body regions 5 are set on pcb board 3 and answered
Several IC pins pads 6, the IC pins pad 6 is divided to arranges the both sides for being symmetrically distributed in IC body regions 5 for two row, two, same
In one row pad, the pad for being arranged in centre is square pad, and the pad for being arranged in head and tail all has the square weldering respectively
The pad of disk and the triangle being connected with square pads.This pad is properly termed as V heads and saves tin radiating reinforcing pad, is arranged in head
Or the area of the pad of tail will increase, IC fixed form is so strengthened, add IC and pcb board is used for high efficiency and heat radiation
Contact area.
In Fig. 4, increase IC bodies pad 7 on the basis of Fig. 3, i.e., IC body pads are provided with IC body regions 5
7, the IC bodies pad 7 is oval.Tin heat dissipation bonding pad is saved in V heads add middle oval pad radiating.
In Fig. 5, heat emission hole 8 is added on the basis of Fig. 4, i.e., is offered in the region of IC bodies pad 7 through pcb board
Heat emission hole 8.Tin heat dissipation bonding pad is saved in V heads add middle oval pad radiating of perforating.
As shown in fig. 6, a kind of packaging mechanism of described LED power driving IC pad, each pins of IC2 are respectively welded
On IC pins pad 6 on pcb board 3, clamping setting heat-conducting layer 9 between pcb board 3 and IC bodies.A kind of implementation is to use
The red glue point of heat conduction is on pcb board 3, then pastes IC and fix (general to be fixed using common red glue), and crossing stove with 60-80 degree temperature can consolidate
Change；Another implementation is with conductive and heat-conductive epoxy resin glue point on pcb board 3, then to paste IC and fix (typically using tin cream
Welding), it is i.e. curable to cross stove with 60-80 degree temperature.
As shown in fig. 7, a kind of packaging mechanism of described LED power driving IC pad, each pins of IC2 are respectively welded
On IC pins pad 6 in the one side of pcb board 3, clamping setting heat-conducting layer 9 between pcb board 3 and IC bodies, and the radiating
Filling heat-conducting layer 9 in hole 8, the position of the heat emission hole 8 attachment heat-conducting silica gel sheet 10 of the another side of pcb board 3.The aperture of heat emission hole 8 is
1.0-2.0mm, encapsulating the scheme of realization is, first normal attachment IC, then pcb board dissipates at the back that IC is mounted with heat-conducting silicone grease afterwards
Injected at hot hole, then self-adhesion heat-conducting silica gel sheet is pasted in the another side of pcb board.
In embodiment of the present utility model, the contact area for high efficiency and heat radiation of IC and pcb board becomes big, on such IC
Heat will be transmitted on pcb board in time, after adding heat-conducting layer so that radiating is rapider, increases heat emission hole and adds and leads
After hot silica gel piece, passage of heat is formd so that radiate much sooner, so as to optimize the heat dispersion of whole encapsulating structure,
Implementation is simple, there is larger cost advantage.
Preferred embodiment of the present utility model is the foregoing is only, is not limited to the utility model, it is all at this
All any modification, equivalent and improvement made within the spirit and principle of utility model etc., should be included in the utility model
Protection domain within.
Claims (6)
- A kind of 1. LED power driving IC pad, it is characterised in that including：IC body regions and a plurality of are set on pcb board IC pin pads, the IC pins pad are divided into two row, and two row are symmetrically distributed in the both sides of IC body regions, in same row pad In, the pad for being arranged in centre is square pad, be arranged in the pad of head and tail all have respectively the square pads and with side The pad of the triangle of shape pad linking.
- A kind of 2. LED power driving IC according to claim 1 pad, it is characterised in that：Set in IC body regions IC body pads are equipped with, the IC bodies pad is oval.
- A kind of 3. LED power driving IC according to claim 2 pad, it is characterised in that：In the area of IC body pads The heat emission hole through pcb board is offered in domain.
- A kind of 4. LED power driving IC according to claim 3 pad, it is characterised in that：The aperture of the heat emission hole For 1.0-2.0mm.
- A kind of 5. application packaging mechanism of LED power driving IC pad as claimed in claim 1 or 2, it is characterised in that：IC Each pin is respectively welded on the IC pin pads on pcb board, clamping setting heat-conducting layer between pcb board and IC bodies.
- A kind of 6. packaging mechanism of LED power driving IC of the application as described in claim 3 or 4 pad, it is characterised in that：IC Each pin is respectively welded on the IC pin pads in pcb board one side, clamping setting heat-conducting layer between pcb board and IC bodies, And filling heat-conducting layer in the heat emission hole, the radiating hole site attachment heat-conducting silica gel sheet of the another side of pcb board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720462329.9U CN206650897U (en) | 2017-04-27 | 2017-04-27 | A kind of LED power driving IC pad and its encapsulating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720462329.9U CN206650897U (en) | 2017-04-27 | 2017-04-27 | A kind of LED power driving IC pad and its encapsulating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206650897U true CN206650897U (en) | 2017-11-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720462329.9U Expired - Fee Related CN206650897U (en) | 2017-04-27 | 2017-04-27 | A kind of LED power driving IC pad and its encapsulating structure |
Country Status (1)
| Country | Link |
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| CN (1) | CN206650897U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110032025A (en) * | 2018-01-11 | 2019-07-19 | 舜宇光学（浙江）研究院有限公司 | Structured light projector and its methods and applications |
-
2017
- 2017-04-27 CN CN201720462329.9U patent/CN206650897U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110032025A (en) * | 2018-01-11 | 2019-07-19 | 舜宇光学（浙江）研究院有限公司 | Structured light projector and its methods and applications |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder | ||
| CP02 | Change in the address of a patent holder |
Address after: 518000 Hualixing Office Building 4F, No. 6 Jinlong Road, Baolong Street, Longgang District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Sea Star Technology Limited by Share Ltd Address before: 518000 Seventh Floor of Shiyida Science Park, Baolong Sixth Road, Baolong Industrial City, Longgang District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Sea Star Technology Limited by Share Ltd |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171117 Termination date: 20200427 |