CN206250183U - A kind of radiating enhanced integrated circuit packaging structure - Google Patents
A kind of radiating enhanced integrated circuit packaging structure Download PDFInfo
- Publication number
- CN206250183U CN206250183U CN201621380505.6U CN201621380505U CN206250183U CN 206250183 U CN206250183 U CN 206250183U CN 201621380505 U CN201621380505 U CN 201621380505U CN 206250183 U CN206250183 U CN 206250183U
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- CN
- China
- Prior art keywords
- fixedly connected
- heat
- support plate
- integrated circuit
- chip
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Abstract
The utility model discloses a kind of radiating enhanced integrated circuit packaging structure,Its structure includes shell body,Substrate,Pin,Heat diffuser,Support plate,Chip,Heat-conducting medium,Fin,The shell body is fixedly connected with substrate,The substrate is fixedly connected with pin,The substrate is fixedly connected with heat diffuser,The heat diffuser is fixedly connected with support plate,The support plate is fixedly connected with chip,The chip is fixedly connected with heat diffuser,The heat diffuser is fixedly connected with heat-conducting medium,The heat-conducting medium is fixedly connected with fin,The heat diffuser is by outer shrouding,Inner sealed board,Cavity,Upper diffusing opening,Lower diffusing opening composition,Fixation is equiped with cavity between the outer shrouding and inner sealed board,Inner sealed board top fixation is equiped with diffusing opening,The inner sealed board bottom is fixed and is equiped with lower diffusing opening,The utility model is provided with heat diffuser and heat-conducting medium,Radiating effect is faster and better.
Description
Technical field
The utility model is a kind of radiating enhanced integrated circuit packaging structure, belongs to circuit package equipment technical field.
Background technology
As the application of integrated circuit is increasingly extensive, microelectronics Packaging, the continuous improvement of high-power encapsulation technology, to integrated
Circuit encapsulating structure heat dispersion requirement more and more higher, original conventional package include colloid, chip, connecting wire,
Lead frame pin, chip slide glass, elargol etc., the shortcoming of this encapsulating structure with, after integrated circuit signal power increases, its
Heat dispersion cannot meet increasingly increased power requirement.
Prior art discloses a kind of radiating enhanced integrated circuit packaging structure of Application No. 200920199847.1,
The utility model discloses a kind of radiating enhanced integrated circuit packaging structure, belongs to integrated antenna package technical field, chip
It is adhered on chip support plate by elargol, lead frame pin is connected by connecting wire with chip, it is characterised in that:Carried in chip
Fin is installed immediately below plate.Fin is embedded in the bottom of integrated circuit colloid, and the bottom surface of fin exposes to integrated
Circuit colloid bottom, another face just to chip slide glass but does not contact.The utility model by chip support plate just below
Increase heat sink, make integrated circuit on the premise of appearance and size does not change, enhance heat dissipation characteristics, it is new using this practicality
The integrated circuit of the enhanced encapsulating structure processing of integrated circuit of type, can provide bigger power consumption.But the radiating of the utility model
Effect is not good enough.
Utility model content
In view of the shortcomings of the prior art, the utility model purpose is to provide a kind of integrated circuit enhancing heat radiating type encapsulation
Structure, to solve the imperfect problem of radiating effect.
To achieve these goals, the utility model is to realize by the following technical solutions：A kind of integrated circuit increases
Strongly heat-dissipated encapsulating structure, its structure includes shell body, substrate, pin, heat diffuser, support plate, chip, heat-conducting medium, radiating
Piece, the shell body is fixedly connected with substrate, and the substrate is fixedly connected with pin, and the substrate is fixed with heat diffuser and connected
Connect, the heat diffuser is fixedly connected with support plate, the support plate is fixedly connected with chip, the chip is fixed with heat diffuser and connected
Connect, the heat diffuser is fixedly connected with heat-conducting medium, the heat-conducting medium is fixedly connected with fin, the heat diffuser by
Outer shrouding, inner sealed board, cavity, upper diffusing opening, lower diffusing opening composition, fixed installing is free between the outer shrouding and inner sealed board
Chamber, inner sealed board top fixation is equiped with diffusing opening, and the inner sealed board bottom is fixed and is equiped with lower diffusing opening.
Further, the outer shrouding top is fixedly connected with heat-conducting medium.
Further, the upper diffusing opening is fixedly connected with chip.
Further, the lower diffusing opening is fixedly connected with support plate.
Further, the support plate is made up of support plate body, louvre, copper sheet.
Further, the support plate body is fixed and is equiped with louvre, and the louvre is fixedly connected with copper sheet.
The utility model is provided with heat diffuser and heat-conducting medium, and radiating effect is faster and better, prevents that temperature is too high to cause half
The damage of conductor device, improves electronic reliability and performance, and simple structure is practical, is easy to promote.
Brief description of the drawings
The detailed description made to non-limiting example with reference to the following drawings by reading, other spies of the present utility model
Levy, objects and advantages will become more apparent upon：
Fig. 1 is a kind of structural representation of radiating enhanced integrated circuit packaging structure of the utility model；
Fig. 2 is heat diffuser structural representation of the present utility model；
Fig. 3 is carrying board structure schematic diagram of the present utility model.
In figure：Shell body -1, substrate -2, pin -3, heat diffuser -4, support plate -5, chip -6, heat-conducting medium -7, radiating
Piece -8, outer shrouding -401, inner sealed board -402, cavity -403, upper diffusing opening -404, lower diffusing opening -405, support plate body -501, dissipate
Hot hole -502, copper sheet -503.
Specific embodiment
For technological means, creation characteristic, reached purpose and effect for realizing the utility model are easy to understand, below
With reference to specific embodiment, the utility model is expanded on further.
Fig. 1, Fig. 2 and Fig. 3 are referred to, the utility model provides a kind of technical scheme：A kind of integrated circuit strengthens heat radiating type
Encapsulating structure, its structure includes shell body 1, substrate 2, pin 3, heat diffuser 4, support plate 5, chip 6, heat-conducting medium 7, fin
8, the shell body 1 is fixedly connected with substrate 2, and the substrate 2 is fixedly connected with pin 3, and the substrate 2 is consolidated with heat diffuser 4
Fixed connection, the heat diffuser 4 is fixedly connected with support plate 5, and the support plate 5 is fixedly connected with chip 6, the chip 6 and thermal expansion
Dissipate device 4 to be fixedly connected, the heat diffuser 4 is fixedly connected with heat-conducting medium 7, the heat-conducting medium 7 is fixed with fin 8 and connected
Connect, the heat diffuser 4 is made up of outer shrouding 401, inner sealed board 402, cavity 403, upper diffusing opening 404, lower diffusing opening 405, institute
State fixation between outer shrouding 401 and inner sealed board 402 and be equiped with cavity 403, the fixation of the top of the inner sealed board 402 is equiped with diffusion
Mouth 404, the bottom of the inner sealed board 402 is fixed and is equiped with lower diffusing opening 405, and the top of the outer shrouding 401 is fixed with heat-conducting medium 7
Connection, the upper diffusing opening 404 is fixedly connected with chip 6, and the lower diffusing opening 405 is fixedly connected with support plate 5, the support plate 5
It is made up of support plate body 501, louvre 502, copper sheet 503, the support plate body 501 is fixed and is equiped with louvre 502, described to dissipate
Hot hole 502 is fixedly connected with copper sheet 503, and the utility model is provided with heat diffuser and heat-conducting medium, and radiating effect is faster and better, prevents
Only the too high damage for causing semiconductor devices of temperature, improves electronic reliability and performance, and simple structure is practical, just
In popularization.
When being used, the heat of chip 6 is diffused into heat diffuser 4 or directly straight from upper diffusing opening 404 indirectly from support plate 5
Connect and be diffused into heat diffuser 4, heat absorption is discharged by fin 8 by heat-conducting medium 7.
General principle of the present utility model and principal character and advantage of the present utility model has been shown and described above, for
For those skilled in the art, it is clear that the utility model is not limited to the details of above-mentioned one exemplary embodiment, and without departing substantially from this
In the case of the spirit or essential attributes of utility model, the utility model can be in other specific forms realized.Therefore, no matter
From the point of view of which point, embodiment all should be regarded as exemplary, and be nonrestrictive, scope of the present utility model is by institute
Attached claim is limited rather than described above, it is intended that will fall in the implication and scope of the equivalency of claim
All changes are included in the utility model.Any reference in claim should not be considered as the right involved by limitation
It is required that.
Moreover, it will be appreciated that although the present specification is described in terms of embodiments, not each implementation method is only wrapped
Containing an independent technical scheme, this narrating mode of specification is only that for clarity, those skilled in the art should
Specification an as entirety, the technical scheme in each embodiment can also be formed into those skilled in the art through appropriately combined
May be appreciated other embodiment.
Claims (6)
1. a kind of radiating enhanced integrated circuit packaging structure, it is characterised in that：Its structure include shell body (1), substrate (2),
Pin (3), heat diffuser (4), support plate (5), chip (6), heat-conducting medium (7), fin (8), the shell body (1) and substrate
(2) it is fixedly connected, the substrate (2) is fixedly connected with pin (3), the substrate (2) is fixedly connected with heat diffuser (4), institute
State heat diffuser (4) to be fixedly connected with support plate (5), the support plate (5) is fixedly connected with chip (6), the chip (6) and thermal expansion
Dissipate device (4) to be fixedly connected, the heat diffuser (4) is fixedly connected with heat-conducting medium (7), the heat-conducting medium (7) and fin
(8) be fixedly connected, the heat diffuser (4) by outer shrouding (401), inner sealed board (402), cavity (403), upper diffusing opening (404),
Lower diffusing opening (405) composition, fixation is equiped with cavity (403) between the outer shrouding (401) and inner sealed board (402), described interior
The fixation of shrouding (402) top is equiped with diffusing opening (404), and inner sealed board (402) bottom is fixed and is equiped with lower diffusing opening
(405)。
2. a kind of radiating enhanced integrated circuit packaging structure according to claim 1, it is characterised in that：The outer shrouding
(401) top is fixedly connected with heat-conducting medium (7).
3. a kind of radiating enhanced integrated circuit packaging structure according to claim 1, it is characterised in that：The upper diffusion
Mouth (404) is fixedly connected with chip (6).
4. a kind of radiating enhanced integrated circuit packaging structure according to claim 1, it is characterised in that：The lower diffusion
Mouth (405) is fixedly connected with support plate (5).
5. a kind of radiating enhanced integrated circuit packaging structure according to claim 1, it is characterised in that：The support plate
(5) it is made up of support plate body (501), louvre (502), copper sheet (503).
6. a kind of radiating enhanced integrated circuit packaging structure according to claim 5, it is characterised in that：The support plate sheet
Body (501) fixation is equiped with louvre (502), and the louvre (502) is fixedly connected with copper sheet (503).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621380505.6U CN206250183U (en) | 2016-12-15 | 2016-12-15 | A kind of radiating enhanced integrated circuit packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621380505.6U CN206250183U (en) | 2016-12-15 | 2016-12-15 | A kind of radiating enhanced integrated circuit packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206250183U true CN206250183U (en) | 2017-06-13 |
Family
ID=59007756
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621380505.6U Active CN206250183U (en) | 2016-12-15 | 2016-12-15 | A kind of radiating enhanced integrated circuit packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206250183U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107993994A (en) * | 2017-12-29 | 2018-05-04 | 睿力集成电路有限公司 | Semiconductor package and its manufacture method |
-
2016
- 2016-12-15 CN CN201621380505.6U patent/CN206250183U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107993994A (en) * | 2017-12-29 | 2018-05-04 | 睿力集成电路有限公司 | Semiconductor package and its manufacture method |
| CN107993994B (en) * | 2017-12-29 | 2023-07-25 | 长鑫存储技术有限公司 | Semiconductor packaging structure and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20181108 Address after: 210000 C4 717-718, green window of Jinxiu street, Yuhuatai District, Nanjing, Jiangsu Patentee after: Nanjing Jing Da Micro Electronics Technology Co., Ltd. Address before: 362600 Junducun 252, Penghu Town, Yongchun County, Quanzhou City, Fujian Province Patentee before: Lv Zhiqing |
|
| TR01 | Transfer of patent right |