CN205194687U - A heat conduction silica gel sheet for cell -phone - Google Patents
A heat conduction silica gel sheet for cell -phone Download PDFInfo
- Publication number
- CN205194687U CN205194687U CN201521000376.9U CN201521000376U CN205194687U CN 205194687 U CN205194687 U CN 205194687U CN 201521000376 U CN201521000376 U CN 201521000376U CN 205194687 U CN205194687 U CN 205194687U
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- heat
- conducting layer
- silica gel
- conducting
- layer
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Abstract
The utility model discloses a heat conduction silica gel sheet for cell -phone, including last heat -conducting layer, graphite membrane and the lower heat -conducting layer who sets gradually, last heat -conducting layer and graphite membrane between and all be provided with adhesive layer between lower heat -conducting layer and the graphite membrane, upper surface and lower heat -conducting layer's the lower surface of last heat -conducting layer all be provided with one deck pressure sensitive adhesive layer, last heat -conducting layer, lower heat -conducting layer constitute by the silica gel matrix material and the solid high heat conductance granule of filling in the silica gel matrix material. The beneficial effects of the utility model are that: the structure that adopts graphite membrane both sides to set up the heat -conducting layer does benefit to thermal diffusion, has avoided the too high phenomenon of the local temperature. Compare current thermal pad piece, can effectively cool down more than 8 DEG C, solved the generate heat heat dissipation problem of chip of high heat generation power well.
Description
Technical field
The utility model relates to electronic element radiating technical field, particularly a kind of heat-conducting silica gel sheet for mobile phone.
Background technology
Heat-conducting pad is a kind of material being commonly used to IC encapsulation and electronic radiation, is mainly used in the microvoid produced when filling up two kinds of hard material contacts, reduces thermal resistance, improve the heat dispersion of device.Along with contemporary electronic terminates to develop rapidly, the degree of integration of electronic devices and components improves constantly, and while improve powerful using function, the facility that result also in its operating power consumption and caloric value increase.High temperature can produce injurious effects to the stability of electronic devices and components, reliability and life-span, such as the node of too high temperature entail dangers to semiconductor, the connection cross section of damage circuit.Heat-conducting pad is the key component of cooling electronic component, and contact effect and thermal conductivity affect two principal elements that large hot pad conducts heat, and contact performance and the thermal conductivity of current heat-conducting pad all exist certain defect.
The profile of current euthermic chip mostly is higher, the highly lower type shape of center height around, and central authorities are about 1 ~ 2mm with the difference of height of surrounding.The housing contacted due to heat conductive pad during assembling has level altitude.If during for pasting heat-conducting pad above euthermic chip, the central authorities of euthermic chip or the around wherein thickness highly selecting heat-conducting pad only can be coordinated.This just causes significantly reducing the heat transfer area of heating new product or makes heat-conducting pad blocked up, produces assembling interference problem.
Summary of the invention
The purpose of this utility model is the shortcoming overcoming prior art, provides a kind of and is beneficial to heat diffusion, avoids the too high heat-conducting silica gel sheet for mobile phone of local temperature.
The purpose of this utility model is achieved through the following technical solutions: a kind of heat-conducting silica gel sheet for mobile phone, comprise the upper heat-conducting layer, graphite film and the lower heat-conducting layer that set gradually, between described upper heat-conducting layer and graphite film and be provided with adhesive layer between heat-conducting layer and graphite film down, the upper surface of described upper heat-conducting layer and the lower surface of lower heat-conducting layer are provided with one deck pressure-sensitive adhesive layer, and described upper heat-conducting layer, lower heat-conducting layer are formed by silica gel basis material and the solid high heat conductance particle be filled in silica gel basis material.
The lower surface of lower heat-conducting layer is provided with the groove matched with heat generating components, is provided with one deck phase change thermal conductive material layer in the groove bottom of groove and on the surface of four groove sidewalls.Phase change thermal conductive material layer adopts commercially available phase-transition material to make, and being heated, Temporal variation thermal conductive material layer carries out phase transformation, softens into semi liquid state by original solid layer.
Described solid high heat conductance particle is silver powder or copper powder.
The outside of described pressure-sensitive adhesive layer is all covered with one deck release liners.
The utility model has the following advantages:
The utility model adopts graphite film both sides to arrange the structure of heat-conducting layer, is beneficial to the diffusion of heat, avoids the phenomenon that local temperature is too high.Compare existing heat-conducting pad, energy effective temperature-reducing more than 8 DEG C, solves the heat dissipation problem of high heating power euthermic chip well.
Groove can fit tightly median plane and the peripheral side of euthermic chip, and the phase change thermal conductive material layer in recess sidewall and groove bottom carries out phase transformation when being heated, semi liquid state is softened into by original solid layer, thus from the surface of microcosmic angle contact heating chip more closely, heat conductivility can be improve.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
In figure, the upper heat-conducting layer of 1-, 2-graphite film, heat-conducting layer under 3-, 4-adhesive layer, 5-pressure-sensitive adhesive layer, 6-groove, 7-phase change thermal conductive material layer, 8-release liners.
Embodiment
Below in conjunction with accompanying drawing, the utility model is further described:
As shown in Figure 1, a kind of heat-conducting silica gel sheet for mobile phone, comprise the upper heat-conducting layer 1, graphite film 2 and the lower heat-conducting layer 3 that set gradually, adhesive layer 4 is provided with between described upper heat-conducting layer 1 and graphite film 2 and between lower heat-conducting layer 3 and graphite film 2, the upper surface of described upper heat-conducting layer 1 and the lower surface of lower heat-conducting layer 3 are provided with one deck pressure-sensitive adhesive layer 5, and described upper heat-conducting layer 1, lower heat-conducting layer 3 are formed by silica gel basis material and the solid high heat conductance particle be filled in silica gel basis material.
The lower surface of lower heat-conducting layer 3 is provided with the groove 6 matched with heat generating components, is provided with one deck phase change thermal conductive material layer 7 in the groove bottom of groove 6 and on the surface of four groove sidewalls.Phase change thermal conductive material layer 7 adopts commercially available phase-transition material to make, and being heated, Temporal variation thermal conductive material layer 7 carries out phase transformation, softens into semi liquid state by original solid layer.
Described solid high heat conductance particle is silver powder or copper powder.
The outside of described pressure-sensitive adhesive layer 5 is all covered with one deck release liners 8.
The utility model adopts graphite film 2 both sides to arrange the structure of heat-conducting layer, is beneficial to the diffusion of heat, avoids the phenomenon that local temperature is too high.Compare existing heat-conducting pad, energy effective temperature-reducing more than 8 DEG C, solves the heat dissipation problem of high heating power euthermic chip well.
Groove 6 can fit tightly median plane and the peripheral side of euthermic chip, and the phase change thermal conductive material layer 7 in groove 6 sidewall and groove bottom carries out phase transformation when being heated, semi liquid state is softened into by original solid layer, thus from the surface of microcosmic angle contact heating chip more closely, heat conductivility can be improve.
Claims (4)
1. the heat-conducting silica gel sheet for mobile phone, it is characterized in that: comprise the upper heat-conducting layer (1) set gradually, graphite film (2) and lower heat-conducting layer (3), adhesive layer (4) is provided with between described upper heat-conducting layer (1) and graphite film (2) and between lower heat-conducting layer (3) and graphite film (2), the upper surface of described upper heat-conducting layer (1) and the lower surface of lower heat-conducting layer (3) are provided with one deck pressure-sensitive adhesive layer (5), described upper heat-conducting layer (1), lower heat-conducting layer (3) is formed by silica gel basis material and the solid high heat conductance particle be filled in silica gel basis material.
2. a kind of heat-conducting silica gel sheet for mobile phone according to claim 1, it is characterized in that: the lower surface of described lower heat-conducting layer (3) is provided with the groove (6) matched with heat generating components, in the groove bottom of groove (6) and on the surface of four groove sidewalls, be provided with one deck phase change thermal conductive material layer (7).
3. a kind of heat-conducting silica gel sheet for mobile phone according to claim 1, is characterized in that: described solid high heat conductance particle is silver powder or copper powder.
4. a kind of heat-conducting silica gel sheet for mobile phone according to claim 1, is characterized in that: the outside of described pressure-sensitive adhesive layer (5) is all covered with one deck release liners (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521000376.9U CN205194687U (en) | 2015-12-07 | 2015-12-07 | A heat conduction silica gel sheet for cell -phone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521000376.9U CN205194687U (en) | 2015-12-07 | 2015-12-07 | A heat conduction silica gel sheet for cell -phone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205194687U true CN205194687U (en) | 2016-04-27 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521000376.9U Expired - Fee Related CN205194687U (en) | 2015-12-07 | 2015-12-07 | A heat conduction silica gel sheet for cell -phone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205194687U (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106046798A (en) * | 2016-07-07 | 2016-10-26 | 昆山汉品电子有限公司 | Uniform-temperature heat-conducting silica gel piece |
| CN106793716A (en) * | 2017-02-28 | 2017-05-31 | 北京奇虎科技有限公司 | The heat abstractor and robot of robot control mainboard |
| CN107918471A (en) * | 2017-08-24 | 2018-04-17 | 常州信息职业技术学院 | Computer radiator |
| CN110413087A (en) * | 2019-08-13 | 2019-11-05 | 徐州工业职业技术学院 | A kind of computer motherboard chip cooling silica gel mounting device |
| CN112420792A (en) * | 2020-11-17 | 2021-02-26 | 武汉华星光电半导体显示技术有限公司 | Display panel, binding method thereof and display device |
| CN112778925A (en) * | 2020-12-30 | 2021-05-11 | 深圳市欧普特工业材料有限公司 | Heat-conducting silica gel sheet with composite cross laminated structure and preparation method thereof |
| CN112937065A (en) * | 2021-03-31 | 2021-06-11 | 中国科学院深圳先进技术研究院 | Preparation method of organic silicon/graphene thermal interface material |
| CN114554801A (en) * | 2022-03-07 | 2022-05-27 | 东莞市零度导热材料有限公司 | High-thermal-conductivity, insulating and flexible composite phase-change heat-conducting gasket and preparation method thereof |
| CN115746362A (en) * | 2022-09-09 | 2023-03-07 | 东莞市零度导热材料有限公司 | Wave-absorbing heat-conducting fin and preparation method thereof |
| CN117715393A (en) * | 2024-02-05 | 2024-03-15 | 深圳市池纳光电有限公司 | Mobile phone capable of conducting heat dissipation in Z direction through phase change material and heat dissipation assembly |
-
2015
- 2015-12-07 CN CN201521000376.9U patent/CN205194687U/en not_active Expired - Fee Related
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106046798A (en) * | 2016-07-07 | 2016-10-26 | 昆山汉品电子有限公司 | Uniform-temperature heat-conducting silica gel piece |
| CN106793716A (en) * | 2017-02-28 | 2017-05-31 | 北京奇虎科技有限公司 | The heat abstractor and robot of robot control mainboard |
| CN106793716B (en) * | 2017-02-28 | 2019-05-31 | 北京奇虎科技有限公司 | The radiator and robot of robot control mainboard |
| CN107918471A (en) * | 2017-08-24 | 2018-04-17 | 常州信息职业技术学院 | Computer radiator |
| CN110413087B (en) * | 2019-08-13 | 2022-06-07 | 徐州工业职业技术学院 | Computer motherboard chip heat dissipation silica gel pastes dress device |
| CN110413087A (en) * | 2019-08-13 | 2019-11-05 | 徐州工业职业技术学院 | A kind of computer motherboard chip cooling silica gel mounting device |
| CN112420792A (en) * | 2020-11-17 | 2021-02-26 | 武汉华星光电半导体显示技术有限公司 | Display panel, binding method thereof and display device |
| CN112778925A (en) * | 2020-12-30 | 2021-05-11 | 深圳市欧普特工业材料有限公司 | Heat-conducting silica gel sheet with composite cross laminated structure and preparation method thereof |
| CN112937065A (en) * | 2021-03-31 | 2021-06-11 | 中国科学院深圳先进技术研究院 | Preparation method of organic silicon/graphene thermal interface material |
| CN114554801A (en) * | 2022-03-07 | 2022-05-27 | 东莞市零度导热材料有限公司 | High-thermal-conductivity, insulating and flexible composite phase-change heat-conducting gasket and preparation method thereof |
| CN115746362A (en) * | 2022-09-09 | 2023-03-07 | 东莞市零度导热材料有限公司 | Wave-absorbing heat-conducting fin and preparation method thereof |
| CN117715393A (en) * | 2024-02-05 | 2024-03-15 | 深圳市池纳光电有限公司 | Mobile phone capable of conducting heat dissipation in Z direction through phase change material and heat dissipation assembly |
| CN117715393B (en) * | 2024-02-05 | 2024-04-26 | 深圳市池纳光电有限公司 | Mobile phone capable of conducting heat dissipation in Z direction through phase change material and heat dissipation assembly |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160427 Termination date: 20181207 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |